DE102021002293A1 - Substrate carrier with centering function - Google Patents

Abstract

The present invention relates to a substrate carrier for receiving and transporting a substrate, a changing station with such a substrate carrier and a method for treating a substrate.

Description

The present invention relates to a substrate carrier for receiving and transporting a substrate, a changing station with such a substrate carrier, and a method for treating a substrate.

In a wide variety of industrial processes, substrates such as glass plates, wafers, etc. are treated in a wide variety of ways, for example coated. In order to move the substrates to different process stations, substrate carriers (so-called “carriers”) are generally used for receiving and transporting a substrate (or several substrates). In some processes, such as coating, it can be crucial that the orientation of the substrate in relation to the substrate carrier is clearly defined and precisely maintained. On the one hand, possible tolerances of the substrates can be problematic, or problems with heating during a certain process step when the substrate carrier and substrate expand to different extents.

Various devices for centering a substrate in a substrate carrier have therefore already been described in the prior art, see for example US 2014/0077431 A1 and JP 2010-103226 A . However, the centering devices described there have certain disadvantages. That's how she beats US 2014/0077431 A1 suggest clamping the substrate between spring-loaded projections and alignment pins, which means that expansion of the substrate (e.g. during heating) is only possible asymmetrically, namely exclusively in the direction of the springs. while the JP 2010-103226 A allows a process that is symmetrical in this respect, the force made available for centering is based on the weight of the substrate, which has various disadvantages. On the one hand, the exact vertical position depends on the substrate width, which leads to imprecise positioning if the tolerances are appropriate. On the other hand, a certain lateral frictional force will always be effective when the substrates are lifted, which is not desired.

It is therefore an object of the present invention to provide a substrate carrier which is improved in this regard for receiving and transporting a substrate. This object is achieved by a substrate carrier according to claim 1.

The substrate carrier according to the invention has a centering device which is suitable for centering the substrate along a first axis, the centering device having two opposite springs which are prestressed inwards. The provision of two opposing springs enables symmetrical centering, which ensures centering of the substrate with respect to the substrate carrier even at different temperatures and different expansion properties of substrate carrier and substrate. Furthermore, the inwardly prestressed springs enable a defined centering force that is independent of the weight of the substrate.

The substrate carrier according to the invention is suitable for receiving and transporting any substrates. However, large-area glass substrates with an area of at least 1 m ² and a thickness of preferably less than 5 mm and particularly preferably less than 3 mm are particularly preferred.

The substrate carrier according to the invention is not limited to the centering of an individual substrate in a substrate carrier. A substrate carrier can be suitable for accommodating a plurality of substrates and then has a plurality of the centering devices and/or closure devices described.

With regard to the symmetrical effect of the force, the two opposing, inwardly pretensioned springs are preferably arranged on a straight line which runs parallel to the first axis. The first axis is in turn preferably aligned parallel to a side edge of a substrate accommodated in the substrate carrier and preferably essentially horizontally.

In principle, any springs can be used for the centering device, with the two springs that are opposite one another preferably having the same spring stiffness. The springs preferably have a contact area which is intended to come into contact with the substrate, the contact area having a radius of curvature of at least 5 mm, preferably at least 10 mm and particularly preferably at least 20 mm. It goes without saying that due to this curvature of the contact area, the entire contact area cannot come into contact with the substrate. Rather, depending on the size of the substrate and the spring position of the spring, only a very small part of the contact area (for example a contact point or a contact line) will come into contact with the substrate. The contact area therefore designates that part of the spring which could realistically come into contact with a substrate given different substrate sizes and different spring positions.

During a corresponding process step, the substrate is clamped in the substrate carrier with the help of the opposite springs and is held in place by the spring forces of the two springs in held in a centered position. However, in order to be able to insert the substrate into the substrate carrier, the contact areas of the springs should be moved outwards relative to the contact situation, in order to leave sufficient leeway for inserting the substrate. For this purpose it is particularly preferred that each of the springs has a receiving area for a first movement element and that the springs can be moved outwards with the aid of the first movement elements. The moving elements can be part of a changing station, described in detail below, by means of which the springs can be opened and closed, preferably automatically.

According to the invention, the substrate carrier can also have a substrate which is accommodated in the substrate carrier. The springs in the contact area preferably have an extension in the direction of the substrate thickness (i.e. perpendicular to the substrate surface) which is greater than the thickness of the substrate. In this way, for example, deformations of the substrate in the event of temperature variations can be compensated for by the contact area of the respective spring also being able to come into contact with a substrate that is bent upwards or downwards, thus ensuring centering. The ratio between the extension of the contact area and the thickness of the substrate is preferably at least 1.5 and particularly preferably at least 2. The extension of the spring in the contact area in the direction of the substrate thickness is preferably at least 2 mm, preferably at least 3 mm.

Depending on the process, the substrates in the substrate carrier according to the invention can be oriented differently. According to a first variant, the substrate is oriented substantially vertically in the substrate carrier, with the substrate resting on the substrate carrier at its lower edge, which extends parallel to the first axis. In this case, an essentially vertical alignment not only includes a directly vertical arrangement, but also an alignment that is slightly tilted, i.e. by up to +/- 10°, compared to the perfectly vertical arrangement. In other words, the substrate accommodated in the substrate carrier (or its surface) can assume an angle of between 80° and 100° with the horizontal. Due to the fact that the substrate rests on the substrate carrier at its lower edge, there is a static friction force between the lower edge of the substrate and the substrate carrier. It is preferred that a decentering of the substrate along the first axis by 2 mm, preferably by 1 mm and particularly preferably by 0.5 mm, generates a resultant force of the two springs on the substrate that is greater than this static friction force. If the substrate is shifted by a corresponding offset from the central position with regard to the substrate carrier (e.g. because the different expansion of substrate carrier and substrate during heating results in an asymmetrical positioning of the substrate in the substrate carrier), the spring forces of the two springs result a resultant force large enough to overcome the stiction force between the substrate and substrate support and accordingly to move the substrate back to its central position. It is preferred that the coefficient of static friction is less than 0.2, preferably less than 0.15 and particularly preferably less than 0.1.

If the substrate carrier according to the invention is to be used, for example, as part of a coating process, it is also preferred that the substrate carrier has a mask to partially cover the substrate, the mask preferably being an integral part of the substrate carrier. If such a masking is present, the centering of the substrate with regard to the substrate carrier (and then also with regard to the masking) is particularly important, since otherwise the masking may cover edges that are too large or too small in the edge areas of the substrate.

Furthermore, several locking devices can be provided on the substrate carrier, which are suitable for holding the substrate in the substrate carrier in a form-fitting and force-free manner. At least one such closure device is preferably provided on each edge of the substrate.

In order to center the substrate not only along a first axis but in relation to two axes, preferably arranged perpendicular to one another, the substrate carrier preferably has a further centering device which is suitable for centering the substrate along a second axis, the further centering device two pairs of opposed inwardly biased springs. The further centering device and its springs preferably have the same features discussed above with regard to the first centering device and its springs. It is preferred, however, that the further centering device, in contrast to the first centering device, has two pairs of opposite springs that are prestressed inwards, ie a total of four springs. This is to prevent the substrate from twisting or tilting relative to the substrate carrier. The provision of two centering devices with a total of six springs is particularly advantageous if the substrate is aligned essentially horizontally in the substrate carrier, with the substrate resting on the substrate carrier at its lateral edges. Again, perfect horizontal alignment is not required, but rather tolerates a deviation of up to 20° from the horizontal alignment.

Analogously to the vertical alignment discussed above, in the horizontal alignment there is a static friction force between the lateral edges of the substrate and the substrate support, with the substrate preferably being decentered along the first axis or the second axis by 2 mm, preferably by 1 mm and particularly preferably around 0.5 mm, a resultant force of the corresponding springs generated on the substrate, which is greater than the static friction force. Here too, the coefficient of static friction is preferably less than 0.2, more preferably less than 0.15 and particularly preferably less than 0.1.

The present invention also relates to a changing station with a substrate carrier as described above. The changing station is set up to exchange the substrates in the substrate carrier, i.e. to insert substrates into the substrate carrier and to remove them from the substrate carrier after the respective process. As already discussed above, each of the springs preferably has a receiving area for a first movement element. Correspondingly, the changing station has two or more first movement elements that are suitable for moving the springs outwards. This preferably takes place automatically, for example with the aid of an actuator in the changing station.

Furthermore, the changing station can have a number of locking devices which are suitable for holding the substrate in the substrate carrier in a form-fitting and force-free manner. These closure devices can also be moved, preferably automatically, for example with the aid of an actuator.

The present invention is also directed to a method of treating a substrate. According to the invention, a substrate is first introduced into a substrate carrier as described above, preferably with the aid of the changing station discussed above. The substrate is then treated while it is in the substrate carrier, for example heated, cleaned, polished, coated, populated, etc.

Before the substrate is introduced into the substrate carrier, the springs of the centering device are moved outwards, preferably automatically. If the substrate carrier has the closure devices discussed above, which are suitable for holding the substrate in the substrate carrier in a form-fitting and force-free manner, the closure devices are preferably also opened, preferably automatically, before the substrate is introduced into the substrate carrier. In this state, i.e. with the closure devices open and the springs moved outwards, the substrate can be introduced into the substrate carrier without any problems. After the substrate has been introduced, the springs of the centering device are then moved inwards, preferably automatically, and the closure devices are optionally closed, preferably automatically. The substrate is then held positively and force-free in the substrate carrier and positioned in a central position by the springs of the centering device. The substrate can then be treated in this state.

After the process step (or optionally several process steps), the substrate is removed from the substrate carrier again. Both the introduction and the removal of the substrate are preferably carried out using the changing station discussed above.

Analogously to the insertion process, before the substrate is removed, the springs of the centering device are moved outwards, preferably automatically, and the optional closure devices are opened, preferably automatically, before the substrate is removed.

As already mentioned above, the invention is particularly advantageous if the substrate carrier and the substrate behave differently when heated or cooled. It is therefore preferred that the substrate carrier and/or the substrate is/are heated from a first temperature to a second temperature between the introduction of the substrate and the treatment of the substrate and/or during the treatment of the substrate. The first temperature is preferably in a range below 100°C, more preferably below 80°C and particularly preferably below 70°C and the second temperature is preferably in a range above 120°C, more preferably above 150°C and particularly preferably above 180°C.

Between the introduction of the substrate into the substrate carrier and the treatment of the substrate and/or during the treatment of the substrate, the substrate is preferably held in the substrate carrier, preferably automatically, with a plurality of locking devices in a form-fitting and force-free manner.

According to a first variant, the substrate can be oriented essentially vertically during the treatment step and preferably also when the substrate is introduced into the substrate carrier and/or when the substrate is removed from the substrate carrier. In this case, the centering device is preferably located in the lower half and particularly preferably in the lower third of the substrate. It is also preferred that then at which Step of introducing the substrate into the substrate carrier and / or in the step of removing the substrate from the substrate carrier essentially no frictional forces act between the substrate and the substrate carrier. This can be achieved, for example, in that when the substrate is introduced into the substrate carrier, it is introduced into the substrate carrier inclined in relation to a plane defined by the substrate carrier in such a way that the lower edge of the substrate first rests on a lower side of the substrate carrier and then the substrate, preferably without friction, is tilted into the plane of the substrate carrier. This is preferably done using a robot. A relatively small inclination of the substrate in relation to the plane defined by the substrate carrier can be sufficient, for example an angle of at least 1°, preferably at least 5° or particularly preferably at least 15°. Analogously, it is preferred that when the substrate is removed from the substrate carrier, the substrate is first tilted out of the plane defined by the substrate carrier, so that only the lower edge of the substrate rests on a lower side of the substrate carrier, and then the substrate is preferably in the inclined state frictionless, is removed. This is also preferably done by means of a robot.

• - 1 eine Draufsicht auf einen erfindungsgemäßen Substratträger gemäß einer bevorzugten Ausführungsform;
• - 2 die Feder einer erfindungsgemäßen Zentriervorrichtung gemäß einer bevorzugten Ausführungsform in der offenen Stellung;
• - 3 die Feder gemäß 2 in der geschlossenen Stellung;
• - 4 eine Querschnittsansicht eines erfindungsgemäßen Substratträgers gemäß einer bevorzugten Ausführungsform;
• - 5 eine Detailansicht zu 4;
• - 6 eine Ansicht analog zur 5, jedoch mit versetztem Substrat;
• - 7 eine Draufsicht auf einen erfindungsgemäßen Substratträger gemäß einer weiteren bevorzugten Ausführungsform;
• - 8 eine perspektivische Ansicht der Bewegungselemente für eine Zentriervorrichtung einer erfindungsgemäßen Wechselstation gemäß einer bevorzugten Ausführungsform;
• - 9 eine perspektivische Ansicht der Bewegungselemente für eine Verschlussvorrichtung einer Wechselstation gemäß einer bevorzugten Ausführungsform;
• - 10 einen vertikalen Querschnitt durch ein Substrat im Substratträger gemäß einer bevorzugten Ausführungsform; und
• - 11 einen vertikalen Querschnitt durch das Substrat gemäß 10 während der Entnahme.

The present invention is explained in more detail below with reference to the figures. These show:

• - 1 a plan view of a substrate carrier according to the invention according to a preferred embodiment;
• - 2 the spring of a centering device according to the invention according to a preferred embodiment in the open position;
• - 3 the pen according to 2 in the closed position;
• - 4 a cross-sectional view of a substrate carrier according to the invention according to a preferred embodiment;
• - 5 a detailed view 4 ;
• - 6 a view analogous to 5 , but with offset substrate;
• - 7 a plan view of a substrate carrier according to the invention according to a further preferred embodiment;
• - 8th a perspective view of the moving elements for a centering device of a changing station according to the invention according to a preferred embodiment;
• - 9 a perspective view of the movement elements for a locking device of a changing station according to a preferred embodiment;
• - 10 a vertical cross section through a substrate in the substrate carrier according to a preferred embodiment; and
• - 11 according to a vertical cross-section through the substrate 10 during the extraction.

1 shows a preferred embodiment of a substrate carrier 1 according to the invention in plan view. A substrate 2 is already accommodated in the substrate carrier 1 here, which is held in the substrate carrier 1 in a form-fitting and force-free manner by means of a plurality of closure devices 4 . Even though ten closure elements 4 are shown in the illustrated embodiment, it should be understood that fewer or more closure elements can also be provided in other symmetrical or asymmetrical arrangements. The substrate carrier 1 also has a centering device which is suitable for centering the substrate along a first axis, the centering device having two opposite springs 3 which are biased inwards.

In the preferred embodiment shown, the substrate 2 is aligned essentially vertically in the substrate carrier 1 so that the substrate 2 rests on the substrate carrier 1 at its lower edge, which extends parallel to the first axis between the two springs 3 . In such an arrangement, the vertical orientation of the substrate 2 in relation to the substrate carrier 1 is precisely defined in that the substrate 2 rests on the substrate carrier at its lower edge. Centering takes place only in the horizontal direction, ie along the first axis running between the two springs 3 . This requires at least two mutually opposite springs 3 on the respective vertical side edges of the substrate 2, which are preferably arranged at the same height in relation to the lower edge of the substrate 2. The springs 3 of the centering device are preferably located near the lower edge, as in FIG 1 shown. As a result, the forces for centering the substrate 2 can act in its lower area. However, the springs can also be provided further up. Furthermore, two or more pairs of opposite springs can also be provided.

In the 2 and 3 is the right of the two centering springs 3 of 1 shown in detail, once in the open position (cf. 2 ) and once in the closed position (cf. 3 ). The spring 3 has a curved spring element 6 which is mounted on two brackets 7 . This spring element 6 has a contact area 6a which is intended to come into contact with the substrate 2 at the side edge thereof. This contact area has, as in 2 can be seen, a curvature whose radius of curvature is preferably at least 5 mm. In the preferred embodiment shown, the moving end of the spring element 6 ends in the area of the contact area 6a in a loop or a hook, which has or forms a receiving area for a first moving element 9a. This first movement element 9a can be part of a changing station, which will be explained below. In the embodiment shown, the first movement element 9a is essentially a pin that can dip into the loop or curve or the hook of the spring element 6 . in the in 2 In the open spring position shown, the spring element 6 is held against its pretension by means of this pin 9a in the position deflected outwards or to the right, so that the contact area 6a does not touch the side edge of the substrate 2. In this position of the spring 3, the substrate 2 can be introduced into the substrate carrier or removed from it in a simple manner and without interaction with the spring 3.

As soon as the substrate 2 has been placed in the substrate carrier 1, the pin 9a is moved to the left along the elongated hole 8 on a circular path (cf. 3 ), so that the spring element 6 springs inwards or to the left due to its pretension and the contact area 6a comes into contact with a side edge of the substrate 2. In order to ensure that the spring element 6 does not get caught or jammed, a second movement element 9b can be provided, which is moved together with the first movement element 9a along the curved elongated hole 8 and, in the preferred embodiment shown, is applied to the loop or loop from the outside. presses the hook of the spring element 6 to move the spring element 6 into the in 3 move position shown. The two pins 9a and 9b can then be removed from the corresponding receiving areas of the spring 3, since the spring element 6 now acts on the side edge of the substrate 2 solely because of its pretension.

where is in 3 a situation is shown in which the contact area 6a of the spring element 6 of the spring 3 just comes into contact with a side edge of the substrate 2 without exerting a substantial force on the substrate 2, since the movable end of the spring element 6 is in the position shown in 3 shown position on the stop 14 is present. However, if it were now based on the in 3 If the substrate 2 expands in the position shown along the first axis, i.e. in the horizontal direction here (or the substrate carrier 1 contracts accordingly), the right side edge of the substrate 2 would press the contact area 6a of the spring element 6 outwards or to the right, so that the spring element 6 no longer rests against the stop 14. The spring force then exerted by the spring element 6 on the side edge of the substrate 2 (and the corresponding force of the opposite spring element) would then ensure a symmetrical or centered arrangement of the substrate 2 in the substrate carrier 1 .

In 8th a corresponding actuator 11 of a not shown and known changing station for opening and closing the springs can be seen in a perspective view. The actuator 11 is provided with two movement elements, of which the first movement element 10a can be clearly seen. This protrudes through the curved elongated hole 8 and into the loop formed by the spring element 6 in the area of the contact area 6a, as previously with reference to FIG 2 and 3 was discussed. The actuator 11 causes the two movement elements or pins to move along the elongated hole 8 as described above. Another actuator, not shown, can withdraw the two movement elements from the corresponding receiving areas 9a and 9b of the spring.

A corresponding actuator 13 and corresponding engagement elements or pins 12a and 12b can be provided for opening and closing the closure devices 4 (cf. 9 ). For opening and closing, the actuator 13 moves the in 9 shown locking loop 4a, which secures the substrate, for example, against tipping out of the substrate carrier.

4 shows a sectional view of the substrate carrier according to FIG 1 according to the first axis. As can be clearly seen there, the substrate 2 rests against the substrate carrier 1 at its lateral edges and the two opposite (here vertical) lateral edges of the substrate 2 are in contact with the contact areas 6a of the spring element 6 of the two springs 3.

5 shows an enlarged detail for the left spring 3, where it is easy to see that the left side edge of the substrate 2 rests directly on the contact area 6a of the spring 3. It is preferred that the extension or thickness D1 of the spring 3 in the contact area 6a perpendicular to the substrate surface is significantly greater than the thickness D2 of the substrate. As already explained, the ratio between D1 and D2 is preferably at least 1.5 and particularly preferably at least 2.

The advantage of this feature is shown in 6 evident, the analogous to 5 is, where however the substrate 2 is offset downwards here by an offset V, which can be caused, for example, by a curvature of the substrate. Since the thickness D1 is greater, ie the thickness D2, the outer edge of the substrate 2 is still in contact area 6a of the spring 3 in this situation, so that centering by the spring 3 can continue to be ensured.

The substrate carrier according to the invention enables, among other things, a friction-free removal of a substrate from the substrate carrier, which can be seen from the schematic cross-sectional views of FIG 10 and 11 should be explained. 10 shows a vertical cross section through a substrate 2 in the substrate carrier 1 according to a preferred embodiment, the substrate 2 resting on the substrate carrier 1 at its lower edge 2a. In the preferred embodiment shown, the substrate carrier has a strip 15 made of a material with a low coefficient of static friction in the area of the contact surface, in order to minimize the static friction force between the substrate and the substrate carrier. in the in 10 In the situation shown, the substrate is secured by means of the locking loop 4a (cf. also 9 ) of the closure device 4 is secured against tipping out of the substrate carrier. the inside 9 The actuator 13 shown now moves the locking loop 4a downwards to open the closure device 4 (cf. 11 ). In this state, the substrate can now first be tilted out of the (here: vertical) plane defined by the substrate carrier, preferably by means of a robot, so that only the lower edge 2a of the substrate 2 rests on a lower side 15 of the substrate carrier, like this in 11 is shown. The substrate can then be removed in the inclined state, preferably without friction. The substrate can be introduced into the substrate carrier without friction in an analogous manner.

Instead of a vertical alignment of the substrate, the substrate can also be aligned essentially horizontally in the substrate carrier, as is the case in 7 is shown. In this case, however, it is preferred that, in addition to the two springs 3 of the first centering device, a further centering device with two pairs of opposing, inwardly biased springs 23 is provided, which is suitable for centering the substrate along a second axis, the perpendicular to the first axis. The arrangement of the springs 3 and 23 in 7 is exemplary, but the symmetrical arrangement is preferred.

In the preferred embodiments shown, the springs are designed as leaf springs. However, other types of springs can also be used in the context of the present invention. However, it is preferred that the spring can be easily assembled and disassembled by simply plugging it on.

QUOTES INCLUDED IN DESCRIPTION

This list of documents cited by the applicant was generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Patent Literature Cited

• US 2014/0077431 A1 [0003]
• JP 2010103226 A [0003]

Claims (33)

Substrate carrier for receiving and transporting a substrate, the substrate carrier having a centering device which is suitable for centering the substrate along a first axis, the centering device having two opposite, inwardly biased springs. substrate carrier claim 1 , where the two springs have the same spring stiffness. Substrate support according to one of the preceding claims, wherein each of the springs has a contact area which is intended to come into contact with the substrate, the contact area having a radius of curvature of at least 5 mm, preferably at least 10 mm and particularly preferably at least 20 mm. Substrate support according to one of the preceding claims, wherein each of the springs has a receiving area for a first moving element and wherein the springs can be moved outwards with the aid of the first moving elements. A substrate carrier according to any one of the preceding claims, further comprising a substrate received in the substrate carrier. substrate carrier claim 5 , wherein each of the springs has a contact area which is intended to come into contact with the substrate, wherein the spring in the contact area has an extent in the direction of the substrate thickness which is greater than the thickness of the substrate, preferably by a factor of at least 1 , 5 and particularly preferably by a factor of at least 2. substrate carrier claim 5 or 6 , wherein the substrate is oriented substantially vertically in the substrate carrier and wherein the substrate rests on the substrate carrier at its lower edge, which extends parallel to the first axis. substrate carrier claim 7 , wherein there is a static friction force between the lower edge of the substrate and the substrate carrier and a decentering of the substrate along the first axis by 2 mm, preferably by 1 mm and particularly preferably by 0.5 mm, a resultant force of the two springs on the substrate generated, which is greater than the static friction force. Substrate carrier according to one of the preceding claims, further comprising a mask for partially covering the substrate, the mask preferably being an integral part of the substrate carrier. Substrate carrier according to one of the preceding claims, further having a plurality of locking devices which are suitable for holding the substrate in the substrate carrier in a form-fitting and force-free manner. A substrate support according to any one of the preceding claims, further comprising a further centering device adapted to center the substrate along a second axis, the further centering device comprising two pairs of opposed inwardly biased springs. substrate carrier claim 11 , further comprising a substrate received in the substrate carrier, the substrate being oriented substantially horizontally in the substrate carrier, the substrate resting on the substrate carrier at its lateral edges. substrate carrier claim 12 wherein there is a static friction force between the lateral edges of the substrate and the substrate carrier and wherein a decentering of the substrate along the first or second axis by 2 mm, preferably by 1 mm and particularly preferably by 0.5 mm, a resultant force of the respective springs on the Generates substrate that is greater than the static friction force. substrate carrier claim 8 or 13 , wherein the coefficient of static friction is less than 0.2, preferably less than 0.15 and particularly preferably less than 0.1. Changing station with a substrate carrier according to one of the preceding claims. exchange station after claim 15 wherein each of the springs has a receiving area for a first moving element and wherein the changing station has two or more first moving elements which are suitable for moving the springs outwards. exchange station after Claim 16 , wherein the first movement elements automatically move the springs outwards, preferably with the aid of an actuator. Exchange station after one of the Claims 15 until 17 , Furthermore, with a plurality of closure devices which are suitable for holding the substrate in the substrate carrier in a form-fitting and force-free manner. exchange station after Claim 18 , The closure devices being able to be moved automatically, preferably with the aid of an actuator. A method for treating a substrate, comprising the following steps: a) introducing a substrate into a substrate carrier according to one of Claims 1 until 14 ; and b) treating the substrate. procedure after claim 20 , wherein the springs of the centering device are moved outwards, preferably automatically, before the substrate is introduced, the substrate carrier optionally having a plurality of closure devices which are suitable for holding the substrate in the substrate carrier in a form-fitting and force-free manner, and wherein the closure devices before the Introduction of the substrate, preferably automatically, are opened. procedure after claim 20 or 21 , wherein the springs of the centering device are moved inward, preferably automatically, after the substrate has been introduced, the substrate carrier optionally having a plurality of closure devices which are suitable for holding the substrate in the substrate carrier in a form-fitting and force-free manner, and wherein the closure devices according to Introduction of the substrate, preferably automatically, are closed. Procedure according to one of claims 20 until 22 , further comprising the step: c) removing the substrate from the substrate carrier. procedure after Claim 23 , wherein the springs of the centering device are moved outwards, preferably automatically, before the substrate is removed, the substrate carrier optionally having a plurality of locking devices which are suitable for holding the substrate in the substrate carrier in a form-fitting and force-free manner, and wherein the locking devices before the Removing the substrate, preferably automatically, are opened. Procedure according to one of claims 20 until 24 , wherein the substrate carrier and/or the substrate are heated from a first temperature to a second temperature between steps a) and b). procedure after Claim 25 , wherein the first temperature is in a range below 100 °C, preferably below 80 °C and particularly preferably below 70 °C. procedure after Claim 25 or 26 , wherein the second temperature is in a range above 120 °C, preferably above 150 °C and particularly preferably above 180 °C. Procedure according to one of claims 20 until 27 , wherein the substrate between steps a) and b) is held positively and force-free in the substrate carrier, preferably automatically, with a plurality of closure devices. Procedure according to one of claims 20 until 28 , wherein the substrate is oriented substantially vertically in step b), preferably also in steps a) and/or c). procedure after claim 29 , The centering device being in the lower half, preferably in the lower third of the substrate. procedure after claim 29 or 30 , wherein in steps a) and / or c) no frictional forces act between the substrate and the substrate carrier. procedure after Claim 31 , wherein the substrate in step a) is introduced into the substrate carrier inclined in relation to a plane defined by the substrate carrier, preferably by means of a robot, such that first the lower edge of the substrate rests on a lower side of the substrate carrier and then the substrate, preferably friction-free, is tilted into the plane of the substrate carrier. procedure after Claim 31 or 32 , wherein the substrate in step c) is first tilted out of the plane defined by the substrate carrier, preferably by means of a robot, so that only the lower edge of the substrate rests on a lower side of the substrate carrier, and then the substrate is preferably in the inclined state frictionless, is removed.

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