DE102020208322A1 - Arrangement with electrode layers and sensitive layer - Google Patents

Abstract

An arrangement with electrode layers (101; 308 and 102; 306) and a sensitive layer (103; 307) is described. The arrangement comprises a first electrode layer (101; 308) and a second electrode layer (102; 306) and a sensitive layer (103; 307). The sensitive layer (103; 307) is arranged between the first electrode layer (101; 308) and the second electrode layer (102; 306) and encloses an interior of the arrangement by at least 80 percent. A method for monitoring an object (202;301;302;303,304,310) is also described.

Description

Technical area

Examples according to the present disclosure relate to arrangements with electrode layers and a sensitive layer, and in particular to corresponding methods and devices or arrangements in the field of implant encapsulation with a three-dimensionally integrated sensor structure for moisture monitoring.

Embodiments of the invention relate to an implant encapsulation with a three-dimensionally integrated sensor structure for moisture monitoring.

Revelation background

In the following, some technical problems are described which are based on examples according to the present disclosure and which are solved by some examples according to the present disclosure.

Active, electronic implants require a biocompatible, hermetically sealed encapsulation, on the one hand to protect the body from the electronic components or materials and on the other hand to protect the implant from the aggressive environment.
A tried and tested method is encapsulation with ceramics or precious metals, which meet the requirements mentioned, but are at the same time rigid and limiting the size of the implant (e.g. titanium housing).
With the constant miniaturization of electronic components, the encapsulation should also adapt to this trend. Metal and ceramic housings reach their limits here.
There is also an increasing desire for flexible implants such. B. with retinal implants or implants that are placed in the brain.
For these applications, new types of encapsulation materials such as silicones or polymers are being developed, which are flexible and meet the high demands on miniaturization, but do not have suitable hermetic properties. Another approach is the implementation of multi-layer stacks, in which thin layers of materials with very low water vapor permeability are applied in combination with shaping silicones as encapsulation. The disadvantage of this method is that in the implanted state it cannot be recognized whether the encapsulation has been damaged by corrosion or mechanical influences.

Some common approaches are described below.

Monitoring of the implant encapsulation by means of various moisture sensors has already been researched by some research groups [references 1, 2] or used to evaluate specific encapsulation materials [references 3 - 7].

The main content of the 1st reference is the hermetic, flexible sensor encapsulation, for which polymer layers and inorganic layers (here titanium) are used. A polyimide-based humidity sensor was developed to test this encapsulation. In contrast to exemplary embodiments of the present disclosure, however, this is separate from the encapsulation.

Reference 2 describes an oscillator circuit based on an interdigital structure and a coil. The interdigital structure is sensitive to moisture and reacts to capacitive and resistive changes caused by moisture. Epoxy (UHU Endfest 300) and silicone (Dow Corning) were used as the sensitive layer. The structures were exposed directly to moisture. At most, the penetration of moisture into a polymer encapsulation such as epoxy and silicone can be detected, but only locally at the point where the interdigital structures are arranged in the implant.

Both references 3 and 5 are almost identical in content and describe a capacitive interdigital structure. This was realized on a silicon substrate. This sensor is located in a volume under a glass encapsulation. In contrast to examples according to the present disclosure, the sensor is not part of an encapsulation.

The 4th and 6th references are very similar and describe a capacitive humidity sensor based on a polyimide that is built into a miniature housing. In contrast to examples according to the present disclosure, the sensor is not part of the housing.

The 7th reference describes long-term tests with a humidity sensor in a glass encapsulation. The arrangement is comparable to the arrangement shown in the 3rd and 5th references.

The work described above uses ohmic or capacitive changes in the moisture-sensitive layers, which are caused by penetrated water molecules. The sensitive layer can also be the encapsulation silicone itself.

It was recognized that the presented encapsulation monitoring systems have the disadvantage that either the encapsulation becomes completely unusable as soon as there is degradation (e.g. [3]), or the penetrated moisture can only be detected at specific positions on the implant board (eg [2]).

• Das Patent [8] beschreibt einen Korrosionssensor zur Detektion von Korrosion von Metallen. Der Sensor besteht aus planaren Metallwindungen zwischen zwei Kontakten. Der Sensor wird in unmittelbarer Nähe zu dem zu untersuchenden Metall angebracht. Korrosion wird durch die Änderung des elektrischen Widerstands bei Korrosion der Windungen detektiert.

Furthermore, the following patents [8-13] deal with the topic described:

• The patent [8] describes a corrosion sensor for detecting corrosion of metals. The sensor consists of planar metal windings between two contacts. The sensor is attached in close proximity to the metal to be examined. Corrosion is detected by the change in electrical resistance when the windings corrode.

The patent [9] describes an arrangement for measuring the corrosion under a paint layer (claim 1). It is about the corrosion of metals such as iron, magnesium, aluminum or their alloys. The sensor structure is planar and made of a comparable material. According to [9], the sensor structure is always below the coating. In contrast to examples according to the present disclosure, the coating is not part of the sensor structure.

The patent application [10] describes a corrosion sensor specifically for use in aircraft. The sensor consists of a thin film or wire made of the same material as the component of the aircraft to be observed. The change in electrical properties (resistance or capacitance) due to corrosion is observed. Claim 1 of the patent describes two electrical lines which are connected to one another with a corrosion-sensitive element. The difference in the electrical conductivity of the connecting element with and without corrosion is measured. The further claims describe a capacitor, one electrode of which is an electrical line and the second electrode of which is the second electrical line.

The patent application [11] describes a humidity sensor that consists of two plate capacitors. The moisture-sensitive layer is a polymer. The top electrode of the sensitive capacitor is perforated so that moisture can reach the polymer. This basic structure is described in the first claim.

The patent application [12] describes a humidity sensor which is made up of interdigital electrodes with which the change in the capacitance of a polymer in the presence of humidity is measured. With the help of nanowires that have grown on a polymer and then etched away, a second polymer is structured with nanopores, so that the response time of the sensor is increased. Claim 1 of the patent describes the production of the nanoporous polymer.

The patent application [13] deals with a flexible capacitive humidity sensor. For this purpose, the sensor comprises a flexible substrate.

In view of the above, there is a need to create a concept which makes it possible to achieve an improved compromise between the complexity of an arrangement, a manufacturing outlay and the scope of the sensor-based monitoring of the arrangement.

Summary of the revelation

An example according to the present disclosure comprises an arrangement, for example with a monitoring function, with a first electrode layer, for example an outer electrode layer, which can be continuous or structured, for example, and a second electrode layer, for example an inner electrode layer, which is for example continuous or also can be structured, as well as a sensitive layer. The arrangement can be, for example, an encapsulation arrangement.

The sensitive layer can, for example, be a moisture-sensitive layer or a gas-sensitive layer and / or a layer that is sensitive to a substance that undesirably passes through an encapsulation. The sensitive layer can, for example, have a property which can be detected by the electrode layers and which changes in response to a substance that penetrates the encapsulation, for example in an undesirable manner.

The sensitive layer is arranged between the first electrode layer and the second electrode layer and encloses or envelops an interior of the arrangement to at least 80 percent, preferably at least 90 percent, for example with regard to the area. The sensitive layer can, for example, also enclose the arrangement completely or on all sides, e.g. in the sense of a closed cover.

The sensitive layer can be designed, for example, to enable a large part of an area located within the first electrode layer and the second electrode layer, or even the entire area located within the first electrode layer and the second electrode layer, to be monitored, or to enable monitoring whether a substance, for example undesired, has penetrated the sensitive layer or has penetrated an encapsulation layer, for example a hermetic shell or a barrier layer or the first, for example, outer electrode layer.

This example according to the present disclosure is based on the knowledge that with the aid of a three-dimensional sensor structure consisting of a first electrode layer, a second electrode layer and a sensitive layer located between the two electrode layers, an arrangement can be created with which an interior space the arrangement, for example, can be monitored almost completely or even completely, for example three-dimensionally, for example with regard to all spatial directions.

For this, the sensitive layer is designed in such a way that it encloses the interior of the arrangement to at least 80 percent, preferably at least 90 percent, or, for example, encloses the entire interior, or for example completely encloses, so that, for example, the entire interior is enclosed or is wrapped. Thus, by monitoring at least one property of the sensitive layer, the interior of the arrangement can be monitored, for example everywhere, or almost everywhere, e.g. with regard to the area. For example, the entire surface of the interior can be monitored so that penetration of a substance, for example a liquid, from all directions can be detected at an early stage. In this case, the two electrode layers are designed, for example, to enable detection of the change in at least one property, and thus, for example, monitoring, of the sensitive layer.

By detecting the change in properties of the sensitive layer, for example, conclusions can be drawn about the presence of, for example, an undesired substance in the arrangement.

The spatial enclosure of an interior space by the sensitive layer, as well as by the two electrode layers, enables three-dimensional monitoring which, in particular, not only monitors an interior space through punctual measurements at discrete measuring points, as is the case with conventional methods. This enables, for example, a significantly better quality of monitoring and improved reliability.

Furthermore, through the layer sequence of the first electrode layer, sensitive layer and second electrode layer, it is possible, for example, to greatly miniaturize the arrangement while at the same time providing extensive monitoring functionality. For a complete monitoring of the interior, for example, the interior can be enclosed without defects or gaps by the electrode layers and the sensitive layer and thus monitored without the use of a large number of discrete sensors. In addition, through the layering according to the present disclosure, for example, very thin layer thicknesses of the arrangement can be realized, for example through deposition processes, which in turn enables the arrangement to take up little space.

In other words, compared to monitoring by means of a large number of conventional sensors that are located at discrete locations in an arrangement, very much smaller structures are possible, while at the same time, for example, significantly better spatial sensory coverage.

In addition, the layered arrangement of the electrode layers and the sensitive layer allows a vertical measuring principle. Because the electrode layers and the sensitive layer envelop an interior space of the arrangement, the measurement takes place, for example, “vertically” with respect to the interior space or perpendicular to a surface of the interior space. This type of measurement can bring metrological advantages, for example compared to concepts with one-sided interdigital structures.

Another aspect of the present disclosure consists in the fact that, for example with regard to an application as an encapsulation arrangement, the sensor structure, consisting of the two electrode layers and the sensitive layer, can be part of the encapsulation itself. Such an integrated sensor structure is, for example, advantageous with regard to miniaturization and / or also to the encapsulation property, as well as its monitoring. The interior space is enclosed by the sensor structure, for example, so that, for example, the sensor structure itself can already form the encapsulation property, e.g. in the sense of a spatial separation or barrier, or can contribute to the encapsulation. Because the sensor structure can be part of the encapsulation arrangement, concepts according to the present disclosure make it possible to monitor the encapsulation or encapsulation arrangement directly, for example in the sense of a self-monitored encapsulation arrangement.

This makes it possible, for example, to detect any damage to the encapsulation or changes within the arrangements, in particular in contrast to approaches in which, for example, the sensor structure is not part of the encapsulation and thus the state of an encapsulation can only be inferred indirectly. As a result of the integration of the sensor structure, such an encapsulation arrangement can moreover be implemented with little space requirement.

It was also recognized that both the electrode layers and the sensitive layer in between can in many cases be produced very efficiently and inexpensively. This is especially true if there is a structuring of the individual layers are entirely or at least largely (for example in most areas) disregarded. The electrode layers and the sensitive layer can thus be applied cost-effectively to an object (for example an implant circuit) and then completely or almost completely enclose the object (for example in the case of isotropic application or deposition). In this respect, in examples, the layers (electrode layers and sensitive layer) can also “nestle” or adapt well to the shape of the object during the production process, which enables very efficient production with good monitoring functionality.

In other words, the idea of an example of the present disclosure is to create a three-dimensional sensor structure consisting of two electrode layers and a sensitive layer in between for monitoring an interior space. The enveloping arrangement of the sensor structure enables, for example, a large-area, e.g. all-encompassing, and metrologically favorable monitoring of the interior of the arrangement or of an encapsulation arrangement of which the sensor structure can be a component. In addition, the three-dimensional layer structure of the sensor structure enables miniaturization and efficient production of such an arrangement.

Thus, in examples according to the present disclosure, a good compromise can be achieved between complexity, manufacturing effort and monitoring functionality.

Examples according to the present disclosure have a layer, for example a polymer layer, within the interior space enclosed by the electrode layers and the sensitive layer, which is designed for homogenization and / or electrical insulation of the interior space enclosed by the electrode layers and the sensitive layer.

In particular with regard to miniaturization and a monitoring function of the arrangement, it is e.g. Minimum radii of curvature and without cavities that are difficult to coat) can be created on which, for example, the electrode layers and the sensitive layer, for example with a very small number of imperfections with, for example, simultaneously small layer thicknesses and / or, for example, can be applied particularly uniformly.

In examples, a layer is designed to electrically isolate the interior, or for example, in particular an enclosed object, in order to prevent undesired electrical influences (for example one or both electrode layers or also an external environment) on the interior of the arrangement or, for example, an enclosed object or to make it more difficult.

In examples according to the present disclosure, the layer, which is designed to isolate the interior of the arrangement or an enclosed object against undesired electrical influences, has elements which, for example, for reading out a monitoring result or for evaluating a measurement at least one Property of the sensitive layer, so for desired electrical interactions, are designed. The elements can, for example, be designed in the form of an electrical line. Accordingly, in examples, the layer that is designed for electrical insulation is not to be understood as a hermetic insulation layer, but merely as an insulation layer that is designed to prevent or make more difficult undesired electrical influences.

Examples according to the present disclosure have a barrier layer which, for example, encloses an exterior of the electrode layers and / or encloses the sensitive layer. For example, this layer could also be an exterior of the electrode layers at the same time. The barrier layer, for example a hermetic layer or hermetically sealed layer, is designed, for example, to make it more difficult or to prevent the penetration of at least one, for example undesired, substance into an interior space of the arrangement. The barrier layer can, for example, also be designed to electrically isolate the arrangement and the surroundings of the arrangement from one another. The barrier layer can be built up in particular with a view to miniaturization, for example by deposition processes of, for example, metals, ceramics or layer sequences of these materials.

Furthermore, examples of the present disclosure include a sensor structure, for example an all-encompassing sensor structure, for example for moisture detection, which is located within a barrier layer, for example an encapsulation. As a result, such an arrangement can, for example, immediately detect a failure of such a barrier layer.

By combining a barrier layer and the sensor structure, in examples according to the present disclosure, an encapsulation arrangement can be created which, in addition to the encapsulation and barrier properties, is designed to include the encapsulation or the barrier monitor shift. An arrangement according to the present disclosure enables the barrier layer to be monitored, for example, in such a way that a failure of the barrier layer can be detected over almost the entire or, for example, the entire surface of the barrier layer. The barrier layer can in particular be applied directly, for example with a small number of imperfections or without gaps, to an underlying layer or, for example, the sensor structure. In other words, examples according to the present disclosure include encapsulation arrangements with barrier layers that monitor themselves through the sensor structure.

Examples in accordance with the present disclosure include at least one layer that is used to make the arrangement compatible with its application environment. This layer can be shaping, for example, so that the arrangement has, for example, an external shape that is favorable for a specific application or, for example, for a specific application site. The layer can consist, for example, of silicone or polymer and in particular, for example, be made of a material which, for example, can produce biocompatibility with regard to a medical application. The layer can, for example, be arranged in an outer region of the arrangement, e.g., surrounding the outer electrode layers or surrounding one or more barrier layers.

Such a layer enables the implant to be well tolerated, for example with regard to implant applications, and reduces the risk of complications, for example.

In examples according to the present disclosure, the arrangement encloses an object, the object is encapsulated by the arrangement, for example. In examples, the arrangement is also designed to monitor a spatial area around the enclosed object in at least 3 spatial directions that are orthogonal to one another in pairs. The monitoring can for example be in three or six spatial directions, for example in an x direction, a y direction and a z direction, or for example in an orthogonal to a substrate surface of an integrated circuit, for example an enclosed object Spatial direction and 2 spatial directions parallel to the substrate surface, or, for example, even take place in all spatial directions.

Examples according to the present disclosure also relate to a system consisting of the arrangement and an object. In examples, the object can be monitored by monitoring the sensitive layer that encloses the object. The spatial monitoring of the object can take place by monitoring at least one property of the sensitive layer, so that a three-dimensional spatial area around the object, for example the spatial area that contains the sensitive layer, by detecting a property change, for example with the help of the electrode layers , for example with regard to an undesired substance that causes a change in the properties of the sensitive layer, can be monitored.

The enclosed object can be monitored, for example, in such a way that the object is monitored to at least 80 percent, preferably at least 90 percent, for example also 100 percent, for example with regard to the area (or surface) of an interior of the arrangement or, for example with respect to the surface of the enclosed object.

By monitoring, for example, penetration of an undesired substance towards the enclosed object can be detected from all spatial directions or at least from three spatial directions orthogonal in pairs.

This enables, for example, a large-area or all-encompassing monitoring of an object which, for example, is encapsulated in all spatial directions by the arrangement.

The structure makes it possible, for example, through the encasing of the interior space and, for example, the layered structure of the sensor structure, e.g. around an object to be monitored, to detect the penetration of an undesired substance at an early stage in order to be able to take countermeasures in good time, e.g. . To switch off a monitored object in good time, or, for example, in the case of an implant, to remove it before damage can occur.

In examples, the arrangement encloses the object, following the contours of the object, directly, for example adapted to the contours of the object. As a result, for example, the object can be monitored completely, for example 100 percent with regard to a spatial area around the object, for example completely only with the exception of areas that are necessary for elements for signal transmission. By immediately enclosing the object, for example, monitoring can also take place directly on the object itself, in contrast to approaches in which the monitoring device is arranged separately from the object. Furthermore, there are, for example, manufacturing-related advantages in that, for example, layers of the arrangement can be applied to the object by deposition processes. In addition, for example, by immediately enclosing an object with the arrangement, a very small space requirement for For example, the entire system of arrangement and object can be made possible.

In examples, the enclosed object is designed to read out a monitoring result as a function of at least one property of a sensitive layer (or the above-mentioned sensitive layer) and to transmit it telemetrically. In this way, for example, the penetration of an undesired substance into the arrangement that envelops or encloses the object can be communicated, so that, for example, the object can be switched off or the object can be removed before, for example, damage to the object due to a penetrated substance can arise. As a result, the present disclosure offers a concept which enables an early response to a monitoring event. In addition, for example, the integration of a circuit for reading out and transmitting a monitoring result in the enclosed object offers the possibility of realizing the arrangement with very little installation space requirement, since, for example, no additional circuit is necessary outside the object, since the monitoring functionality is, for example, on can also be integrated into a chip of the object.

In examples, the object to be monitored is an implant which is encapsulated by the arrangement. With the aid of the arrangement in the sense of an implant encapsulation, medical implants, for example, can be comprehensively monitored, e.g. with regard to the ingress of moisture into the encapsulation. Such an arrangement can increase the safety of implants. In particular, for example, an explantation or, for example, an exchange with a new implant can be planned at an early stage, since, for example, unwanted moisture in a sensitive layer can be detected, for example in all spatial directions around the implant, i.e. for example all-encompassing or completely around the object and, for example, especially before the implant itself is already exposed to moisture and may be damaged. In examples, a miniaturization of the implant encapsulation is possible, since the disclosed layer structure enables, for example, comprehensive monitoring of an implant with small layer thicknesses of the arrangement, for example from deposition processes, so that fields of application for implants could be opened up in accordance with the concepts of the present disclosure for the previous approaches take up too much space and / or monitoring is insufficient.

In examples, at least one of the layers of the arrangement is applied isotropically, for example by an (isotropic) deposition process on an object or on another layer of the arrangement. Isotropic layers can be used, for example, to enable favorable measurement conditions, e.g. in particular for measurements in all spatial directions. With a homogeneous spatial structure of the layers, for example, a meaningful measurement can be carried out in all directions around the object, for example through the homogeneity of the properties of the layers and the corresponding, for example, easier evaluable measurement, which, for example, does not have large variances or a directional dependence of the material properties is impaired. Furthermore, an even layer thickness can be achieved by isotropic application of the layers.

In examples, at least one of the layers of the arrangement is a layer deposited on an object or on a layer of the arrangement by a deposition process, for example by chemical vapor deposition (CVD) or atomic layer deposition (ALD). In this way, for example, very small layer thicknesses can be achieved, as a result of which the arrangement can be greatly miniaturized, which can lead to less invasive interventions and, for example, better compatibility, in particular with regard to implants. In addition, very well-defined layer thicknesses are also possible, for example, in order to generate, for example, optimal and, for example, above all as precisely known layer thicknesses as possible for a measurement, for example, of the capacitive or resistive properties of the sensitive layer with the aid of the electrode layers.

In examples, the electrode layers of the arrangement have a thickness of less than 10 μm. In examples, the sensitive layer of the arrangement has a thickness of less than 25 μm. Examples of the present disclosure enable a high degree of miniaturization of the arrangement through small layer thicknesses, so that, for example, new fields of application can be opened up, e.g. implants which, for example, have to be comprehensively monitored, but their monitoring and encapsulation have so far led to large dimensions for their area of application.

In examples, the sensitive layer is a moisture-sensitive layer. A moisture-sensitive layer can, for example, particularly in the case of implants, detect a failure of a barrier layer or, for example, a hermetic (or, in the undamaged state, hermetically sealed) layer of the implant, so that countermeasures can be initiated in good time, for example.

In examples, the arrangement is for the encapsulation of electronics, for example microelectrics or nanoelectrics ronics, e.g. integrated circuits or e.g. sensors, in a harsh environment, e.g. in corrosive media.

In the case of the encapsulation of electronics, an arrangement according to the present disclosure enables, for example, the shared hardware to be used in order, for example, to enable telemetric transmission of the monitoring result. Due to the three-dimensional layer structure of the arrangement, the arrangement offers, for example, advantages for the encapsulation and monitoring of an object in a harsh environment, especially since such an object is three-dimensionally encapsulated and thus protected, for example by the sensor structure consisting of the electrode layers and the sensitive layer is.

In the presence of a harsh environment, a failure of a barrier layer which, for example, envelops the sensor structure, could not be prevented, so that monitoring with regard to the point in time of failure can be indispensable. Due to the arrangement, such a barrier layer can be monitored completely, e.g. with regard to the area inside the barrier layer, which is particularly advantageous, for example, in highly corrosive environments, since a failure of a barrier layer can be possible at any location on the barrier layer.

In examples, the arrangement is designed as a sealing layer or as a sealing layer stack for protecting an object from unauthorized access. The arrangement enables an object to be encapsulated, for example, so that, for example, any penetration into the measurement area of the arrangement, that is to say, for example, into the sensitive layer that envelops the object, can be detected. Thus, for example, safety-critical elements can also be protected with an arrangement constructed in accordance with the disclosure.

Examples of the present disclosure relate to a method for monitoring an object, for example for monitoring an implant, for example for all-encompassing moisture monitoring within an implant encapsulation, or for example for monitoring an encapsulation of an electrical component, or for example for monitoring an object with restricted access. The monitoring can take place, for example, with regard to moisture or with regard to access.

The method includes evaluating a monitoring result as a function of at least one property, for example a resistive or a capacitive property, of a sensitive layer. The sensitive layer can, for example, be designed to change its electrical properties in the presence of an undesired substance, for example. The sensitive layer is arranged between a first electrode layer and a second electrode layer. The sensitive layer encloses an interior space of the arrangement to at least 80 percent, preferably to at least 90 percent, or for example completely or on all sides, for example in the sense of a closed shell, for example with regard to the surface.

Examples of the present disclosure thus create a method with which, for example, by evaluating at least one property of a sensitive layer, an object or a space surrounding the object that is filled by a sensitive layer is monitored, for example three-dimensionally and / or area-wide can. Such a method can, for example, be designed to enable all-encompassing monitoring, for example in all spatial directions around the object, or for example at least the area around the object in which the sensitive layer is located can surround the entire object holistically in three dimensions and with no or only a small number of imperfections. Such a method thus offers clear advantages, for example over other methods which are dependent on an evaluation of a large number of point sensors, in particular, for example, with regard to the circuitry and technological complexity and the quality of the monitoring.

In examples according to the present disclosure, the method comprises a telemetric transmission of a signal so that a transmission of a monitoring result, e.g. of raw data from a measurement or an interpreted signal such as, for example, “leaky” or an alarm, is enabled. The signal can consist, for example, of data from the measurement of at least one property of the sensitive layer. The signal transmission can, for example, also be a continuous transmission of the measurement data or, for example, only the transmission of data when a significant change in at least one property of the sensitive layer occurs, or, for example, the transmission of an alarm signal, e.g. on the basis of an access, e.g. an intrusion into an interior space enclosed by the sensitive layer.

By means of telemetric transmission, such a method enables, for example, an early response to a monitoring event, for example the detection of moisture in an implant encapsulation. In this way, for example, countermeasures can be initiated, e.g. explantation of an implant, before damage occurs in the monitored object, e.g. an implant.

In examples according to the present disclosure, the method comprises switching off a monitored object and / or the monitoring based on a monitoring result, for example a significant change in the resistivity or capacitance of the sensitive layer.

Such a method can be used, for example, to switch off particularly safety-critical implants, which in the event of a defect pose a risk to the wearer, for example immediately on the basis of the monitoring, e.g. when an undesired substance is detected, for example.

In very general terms, examples according to the present disclosure are based on the idea of damage to an implant encapsulation (for example a biocompatible, hermetically sealed encapsulation, or a flexible encapsulation, for example made of silicone or polymer, or, for example, an encapsulation made of multi-layer stacks in which thin layers of materials are applied with very low water vapor permeability in combination with shaping silicones) to be detected in good time by monitoring. In other words, it was recognized that monitoring of the implant encapsulation is advantageous (or in some cases even necessary) in order to be able to detect damage (e.g. damage to the encapsulation due to corrosion or mechanical influences) in good time. According to one aspect of the disclosure, a sensor integrated in the encapsulation can be used to detect moisture that has penetrated through a defect within the encapsulation. Thus, e.g. by telemetric signal transmission, the state of the encapsulation can be recorded and, if necessary, the time for an explantation can be determined before further serious encapsulation damage and thus impairment of the implant functionality or endangerment of the patient can occur.

Examples according to the present disclosure include the idea of a hermetic implant encapsulation for active, medical implants, which, for example, can (or can) be permanently monitored with regard to the hermeticity.

A sensor structure can enclose the entire implant surface, for example. The hermetic encapsulation can be achieved, for example, by an additional layer which, for example, in turn encloses the complete sensor structure.

In the event of a defect in the hermetic encapsulation, for example penetrating water molecules can be detected with the aid of the sensor structure, for example before moisture-related damage occurs in the implant electronics.

It should be possible, for example, to apply the individual layers of the encapsulation and sensor structure to the surface of an active implant in a highly isotropic manner. For this, deposition processes in the gas phase such as CVD and ALD can be used.

For homogenization and electrical insulation of the implant surface, (for example on the arrangement or on the substrate) optionally first (for example before the inner electrode layer, the sensitive layer and the outer electrode layer are applied) a polymer layer z. B. can be applied from parylene (so that, for example, the polymer layer surrounds the implant and so that, for example, the inner of the electrode layers is applied or arranged on the polymer layer).

This can for example be followed by layers, for example coatings, whereby a lower electrode, for example an electrode layer, a sensitive, for example moisture-sensitive layer, an upper electrode, for example an electrode layer and, for example, an additional hermetic encapsulation (or the hermetic encapsulation) are deposited one after the other .

According to one aspect of the disclosure, the electrode layers together with the enclosed e.g. moisture-sensitive layer form the sensor structure. This three-dimensional sensor structure, which can enclose the entire implant, for example, enables or ensures full-area detection of, for example, water molecules without local delimitation (in contrast to the examples from the prior art).

The electrodes can consist of metal layers, for example. For example, inorganic materials such as ZnO or SnO ₂ or materials such as epoxy (eg UHU Endfest 300) and / or silicone (eg Dow Corning) can be used as moisture-sensitive layers. These can, for example, also be _{mixed with non-moisture-sensitive materials such as Al 2} O _{3 in} order to adjust the sensitivity to moisture. The use of polymers as a moisture-sensitive layer is also possible.

A final hermetic seal (for example the above-mentioned final hermetic seal or encapsulation) can be produced or be produced by the deposition of metals or ceramics or layer sequences of these materials.

According to one aspect of the invention, the high isotropy of the ALD process (e.g. the atomic layer deposition or the atomic layer deposition process) can achieve a complete, defect-free enclosure of the implant surface with encapsulation layers (or with the above-mentioned encapsulation layers) according to the present disclosure will.

Application examples for arrangements according to the present disclosure include active medical implants. In other words, examples according to the present disclosure can be used in all medical implants or in all active medical implants.

According to one aspect, examples according to the disclosure can be used wherever a hermetic encapsulation with a monitoring function is desired or even required (e.g. as encapsulation of electronics in harsh environments or as a sealing layer for protection against unauthorized access). In other words, further examples include, for example, hermetic encapsulation with a monitoring function, e.g. encapsulation of electronics in harsh environments or sealing layers for protection against unauthorized access.

It should also be noted that all of the examples described above can optionally be supplemented by the features, functionalities and details described below, both individually and in combination.

Figure list

Examples according to the present disclosure are explained in more detail below with reference to the accompanying figures. With regard to the illustrated schematic figures, it is pointed out that the illustrated functional blocks are to be understood both as elements or features of the device according to the disclosure and as corresponding method steps of the method according to the disclosure, and that corresponding method steps of the method according to the disclosure can also be derived therefrom.

• 1 einen schematischen Querschnitt einer Anordnung gemäß einem Beispiel der vorliegenden Offenbarung;
• 2 einen schematischen Querschnitt einer Anordnung gemäß einem Beispiel der vorliegenden Offenbarung mit einem umschlossenen Objekt; und
• 3 einen schematischen Querschnitt einer Anordnung gemäß einem Beispiel der vorliegenden Offenbarung mit einem aktiven, elektronischen Implantat.

Show it:

• 1 a schematic cross section of an arrangement according to an example of the present disclosure;
• 2 a schematic cross section of an arrangement according to an example of the present disclosure with an enclosed object; and
• 3 a schematic cross section of an arrangement according to an example of the present disclosure with an active electronic implant.

Detailed description of the exemplary embodiments according to the figures

Before examples according to the present disclosure are explained in more detail below with reference to the drawings, it is pointed out that identical, functionally identical or identically acting elements, objects and / or structures in the different figures are provided with the same or similar reference symbols, so that the in Description of these elements shown in different exemplary embodiments is interchangeable or can be applied to one another.

1. Arrangement according to FIG. 1

1 FIG. 10 shows a schematic cross section of an arrangement according to an example of the present disclosure.

1 FIG. 10 shows an arrangement 100 according to an example of the present disclosure, the arrangement having a first, outer electrode layer 101, a second, inner electrode layer 102, and a sensitive layer 103, which is located between the first, outer electrode layer 101 and the second, inner electrode layer 102 , includes. In this example, the sensitive layer 103 completely encloses an interior space of the arrangement. In other examples, however, it is also sufficient if the sensitive layer encloses at least 80 percent or at least 90 percent of the interior space.

The sensitive layer 103 is designed, for example, to change a, for example, resistive or capacitive property in the presence of a substance that has penetrated into the arrangement, for example an undesired substance. The change in properties of the sensitive layer 103 and thus the detection of a penetrated substance can be detected, for example, by the two electrode layers 101, 102. For example, the electrode layers 101, 102 can be designed to enable a measurement of the capacitive or resistive property of the sensitive layer 103, for example, and thus, for example, to enable the arrangement or an interior of the arrangement to be monitored. For example, because the sensitive layer completely or at least almost completely encloses the interior, the penetration of an (undesired) substance can be detected very early, for example before the penetrated substance reaches a system located inside (or in the interior) of the arrangement (eg an electronic circuit) reached and / or impaired in function.

In the following, further optional details and aspects of the arrangement 100 are described, which can optionally also be used in other arrangements described herein.

For example, the sensitive layer 103 encloses the second, inner electrode layer 102, which in turn completely encloses an interior of the arrangement, for example, likewise completely. The first, outer electrode layer 101 in turn completely encloses the sensitive layer 103, for example. For example, there are no gaps or gaps between the electrode layers 101, 102 and the sensitive layer 103; the layers follow one another, for example, directly.

The two electrode layers 101, 102 and the sensitive layer 103 arranged between them form, for example, a three-dimensional sensor structure. The sensor structure encapsulates, for example, the entire interior of the arrangement. In other words, the interior of the arrangement is, for example, enclosed in all spatial directions by the sensor structure. As a result, such an arrangement enables the interior of the arrangement to be monitored. If, for example, an undesired substance penetrates the arrangement, the presence of the substance can be detected by a change in the properties of the sensitive layer 103. A change in properties can be of a capacitive or resistive nature, for example. The electrode layers 101, 102 enable such a change in properties to be detected. The three-dimensional sensor structure, which encloses an interior of the arrangement in all spatial directions, for example without any gaps, enables an entire-area monitoring of an interior of the arrangement to be made possible. Penetration of a substance can thus be detected not only selectively but over an area or even from all directions or in the area of the entire surface of the interior or in the area of a large part (for example at least 80%) of the surface of the interior, compared to (conventional) concepts in which sensors are placed in discrete locations in an arrangement.

For example, an arrangement according to the present disclosure enables an early detection of a penetrated substance before it can penetrate into an interior space enclosed by the sensitive layer 103, for example.

In examples, the sensitive layer can enclose an interior space of the arrangement, for example at least 80 percent, or preferably at least 90 percent, for example with regard to the area or surface of the interior space. In examples, the sensor structure can be penetrated by elements that are necessary to evaluate a monitoring result of the sensor structure (e.g. by one or more antenna elements, or by one or more electrical or fluidic feedthroughs or coupling elements).

In examples, the electrode layers 101, 102 have a thickness of less than 10 μm. In examples, the sensitive layer 103 has a thickness of less than 25 μm.

In examples, the sensitive layer 103 is a moisture-sensitive layer.

The electrode layers 101, 102 can, for example, be made of metal, the sensitive layer 103, for example, of polymers, or of inorganic materials, or, for example, of ZnO, SnO ₂ , Al ₂ O ₃ , or mixtures of these materials.

It should be noted that all features, functionalities and details with regard to the arrangement 100 according to 1 have been described, can optionally be included in all of the examples disclosed herein, both individually and in combination. Furthermore, the example according to 1 can optionally be supplemented by all features, functionalities and details described herein also with regard to other examples, both individually and in combination.

2. Arrangement according to FIG. 2

2 FIG. 10 shows a schematic cross section of an arrangement according to an example of the present disclosure with an enclosed object.

The arrangement 200 in 2 comprises a first, outer electrode layer 101, a second, inner electrode layer 102 and a sensitive layer 103, which is arranged between the two electrode layers 101, 102. The sensitive layer 103 completely encloses an interior space of the arrangement. An intermediate layer 201 is arranged within the second, inner electrode layer 102. The intermediate layer 201 in turn encloses an object 202. The layer 201 completely and directly encloses the object 202. The first, outer electrode layer 101 is completely enclosed by a barrier layer 203. The barrier layer 203 is in turn completely enclosed by a further layer 204 (for example an adaptation layer). All layers of the arrangement follow one another directly. There are no gaps or gaps between each layer. Each layer points in the direction of below The underlying layer has a shape that corresponds to the shape of the respective underlying layer. The arrangement immediately surrounds the object, following the contours of the object.

In examples, the arrangement is designed to monitor the enclosed object 202 (for example with regard to an external influence on the object).

The object 202 is enclosed by a layer or intermediate layer 201 which is designed to homogenize and / or electrically isolate the surface of the object 202. The layer or intermediate layer 201 can be used to create a defined surface (or a surface with defined properties, such as a certain surface quality or smoothness, certain adhesive properties and / or certain radii of curvature) around the object, onto which the further layers , for example. By deposition processes, can be applied. Such a surface can, for example, enable the subsequent layers to be applied in a defined manner that is free of defects or at least with few defects. The layer or intermediate layer 201 can consist, for example, of polymer, for example of parylene.

In examples, the layer or intermediate layer 201 is designed to isolate the surface of the object 202 from undesired electrical interactions, wherein the layer 201 and the sensor structure 101-103 can furthermore have elements that, for example, for reading out a monitoring result, or for evaluating a measurement of at least one property of the sensitive layer 103, for example with the aid of the electrode layers 101, 102.

The electrode layers 101, 102 following layer 201 and the sensitive layer 103 in between are for monitoring the object or for monitoring a spatial area around the object, for example a spatial area around the enclosed object in at least 3 pairs of orthogonal spatial directions , designed. If, for example, an undesired substance (for example water or a body fluid or another fluid) penetrates the arrangement, this can be detected by a change in properties, for example of a capacitive or resistive nature, of the sensitive layer 103 with the aid of the two electrode layers 101, 102 .

For example, the structure of the layers according to the present disclosure enables an early detection of a penetrated substance before the object 202 itself is reached by the substance. As a result, for example, countermeasures can be initiated in good time, for example switching off the object 202, or in the case of an implant encapsulated by the arrangement, an explantation. In examples, the electrode layers 101, 102 and the sensitive layer 103 can be produced by deposition processes, so that miniaturization of the arrangement is possible.

The barrier layer 203, which encloses the first, outer electrode layer 101, is designed to prevent or at least make it more difficult for an undesired substance, for example, to penetrate. In examples, the first, outer electrode layer 101 can at the same time be the barrier layer 203. As a result of the arrangement, not only the object 202 but in particular, for example, also the barrier layer 203 (or the integrity of the barrier layer) can be monitored. If there is a change in the properties of the sensitive layer 103, which is detected by the electrode layers 101, 102, conclusions can be drawn from this, for example, that there is a defect in the barrier layer 203 (at least under the assumption that a defect in the barrier layer occurs within a reasonable period of time detectable penetration of a detectable substance or fluid into the sensitive layer).

For example, with regard to an encapsulation arrangement, the arrangement enables the encapsulation to be monitored by the electrode layers 101, 102, as well as the sensitive layer 103 lying therebetween as part of the encapsulation, e.g. in the sense of a self-monitored encapsulation arrangement. Such monitoring also has the advantage that the measurement (or detection of a penetrating substance) is locally adjacent both to the object 202 to be monitored and to its encapsulation and, for example, in particular the barrier layer 203, which, for example, are primarily designed for this purpose can protect the object 202 takes place. In this way, two important components of an encapsulation arrangement can be monitored in examples, namely (at least indirectly or “preventively” - by detecting a substance entering the sensitive layer) the encapsulated object 202, the function of which is to be maintained, for example, and the encapsulation itself (at least indirectly - in that a substance that passes through the encapsulation is then detected in the sensitive layer), for example in particular the barrier layer 203 of the encapsulation, which serve to protect the object 202 and / or, for example, to protect the area of application from the object 202 can. The monitoring of these two components takes place in examples through the construction of the sensor structure according to the disclosure through the monitoring of the sensitive layer.

In examples, the barrier layer 203 can also be designed to electrically isolate the arrangement from the environment in which it is used. In examples, the barrier layer 203 can also be, for example, a hermetic layer that is, for example, hermetically sealed. In examples, the barrier layer emerges from deposition processes, for example from metals or ceramics or layer sequences of these materials. In other words, the barrier layer can have one or more deposited metal layers and / or one or more deposited ceramic layers.

The barrier layer 203 is in turn enclosed by a layer or adaptation layer 204. The layer 204 is designed, for example, to establish compatibility of the arrangement with the application environment. In the case of implants, this can be, for example, compatibility in the sense of biocompatibility, so that an implant can be well absorbed or accepted by the body. This layer 204 can be advantageous in examples because it allows, for example, barrier layers 203 to be used which do not have to be compatible with the environment at the same time, that is, for example, biocompatible, and for this can have better barrier properties, for example. In the case of examples, the compatibility can also be achieved in terms of a shape. In examples, with the aid of an additional, for example also flexible, layer 204, the arrangement can be brought into a specific shape that is favorable for the area of application. In the case of implants, the arrangement could, for example, by the layer 204 have a shape such that the implant fits well into a specific part of the body. Such a layer 204 can consist of silicone or polymer, for example.

In examples, the object 202 is designed to read out a monitoring result as a function of at least one property of the sensitive layer 103 and to transmit it telemetrically. In particular in the case of active, electronic objects, a corresponding circuit can thereby be integrated in a space-saving manner, for example on a chip, so that the arrangement can be implemented with very little space requirement.

In examples, at least one of the layers of the arrangement is applied isotropically to the object 202, or to another layer of the arrangement. With isotropic layers, for example, defined and homogeneous material properties are possible, by means of which an exact and, for example, reliable measurement can be made possible. Furthermore, the production can take place in a cost-effective method, even if the object 202 or the intermediate layer 201 have a complex geometric shape.

In examples, at least one of the layers of the arrangement is a layer deposited by a deposition process, for example by chemical vapor deposition (CVD) or by atomic layer deposition (ALD), on the object 202, or on a layer of the arrangement. In examples, due to the high isotropy of the deposition processes, a complete, defect-free enclosure of the surface of the object to be monitored 202 can be achieved with the layers of the arrangement. Furthermore, a homogeneous layer thickness can be achieved, which makes it easier to monitor the properties of the sensitive layer.

In examples, the monitored object 202 can be electronics, e.g., microelectronics or nanoelectronics, the monitored object 202 being encapsulated by the arrangement, e.g., for protection and / or for monitoring in harsh environments, such as for example corrosive media.

In examples, the arrangement can be designed to protect and / or monitor an enclosed object 202 from unauthorized access as a sealing layer or sealing layer stack.

3. Arrangement according to FIG. 3

3 FIG. 11 shows a schematic cross section of an arrangement according to an example of the present disclosure with an active electronic implant.

The simplified conceptual sketch according to the 3 shows the cross section of a built-up implant with chips 302, 303 and material or materials for assembly and connection technology (AVT) 304. 3 shows in particular the three-dimensionally applied layers (for example layers of the arrangement) (for example parylene or parylene base 305, for example as a layer for homogenization and / or electrical insulation, lower electrode 306, for example also referred to herein as the second electrode layer, sensitive layer 307, for example moisture-sensitive layer, upper electrode 308, for example also referred to herein as first electrode layer, and a hermetic seal, for example a hermetic layer 309 or generally a barrier layer).

The arrangement 300 in 3 also comprises an implant board 301 (or, generally speaking, a carrier material or substrate) on which the chips 302, 303 (generally speaking, one or more chips) are attached. For example, the one or more chips 302 are connected to the implant board with bonding wires 310. The bonding wires 310 can optionally be covered, for example, with a sealing material, which is shown in FIG For example, neighboring bond wires are isolated from one another. The implant board 301, the chips 302, 303, and the AVT materials 304 are enclosed by the parylene base 305, which acts, for example, as an intermediate layer. The parylene base 305 directly follows the shape of the underlying elements of the structure 301-303 and follows, for example, the contour of the circuit board 301, the chips 302,303 and the connection structures (for example the bonding wires 310 or the sealing material surrounding the bonding wires). The thickness of the parylene base is in the 3 shown as uniform, however, the thickness of the parylene base can vary locally, since the parylene base preferentially smooths edges of the chips or the board. If necessary, the parylene base can also fill cavities in the board 301 or between components or chips or between the implant board and components or chips. The parylene base 305 is enclosed, for example, by the lower electrode 306 (or the inner electrode) (for example at least 80 percent, or even completely), the lower electrode, for example, being applied directly to the parylene base or the outer contour of the parylene. Basis (which typically does not completely compensate for unevenness caused by the chips 302,303 arranged on the implant board and therefore has both convex and concave areas on its outer surface). The lower electrode 306 is in turn enclosed by the moisture-sensitive layer 307, which in turn is enclosed by the upper electrode 308. The individual layers follow one another directly and follow (at least essentially) the shape of the respective underlying layer. The upper electrode 308 is enclosed by a hermetic layer 309.

The functioning of the device according to the simplified conceptual sketch of FIG 3 explained.

The mode of operation is as follows: If moisture penetrates through the hermetic seal 309 and the upper electrode 308, it can diffuse into the moisture-sensitive layer 307 and significantly change its electrical properties. These changes can, for example, be of a resistive or capacitive nature and can be detected by a suitable readout circuit in the implant so that they can be transmitted telemetrically as a measurement signal. Thus, for example, an implant with a defective encapsulation can be switched off and explanted.

Finally (for example after the production of the hermetic layer 309), a shaping silicone can be applied to the encapsulated implant, which at the same time also ensures biocompatibility. This silicone does not have to have any barrier properties, e.g. against water, since the disclosed encapsulation is designed to ensure hermeticity and its monitoring.

The very small thicknesses of the encapsulation layers (which can be used in examples according to the present disclosure) enable the encapsulation volume of active implants to be greatly miniaturized.

All lists of materials, environmental influences, electrical properties and optical properties listed here are to be regarded as exemplary and not as conclusive.

4. Conclusions and further comments

According to one aspect of the present disclosure, the sensor (e.g. a humidity sensor) - unlike in conventional concepts - is not separate from the encapsulation, but rather, for example, part of the encapsulation or an encapsulation arrangement, e.g. an implant encapsulation. In examples, one or more layers used for the encapsulation are part of the sensor, or - in other words - one or more layers of the sensor are part of the encapsulation or contribute to the encapsulation.

In general, some examples according to the disclosure provide an all-encompassing sensor structure, e.g. for moisture detection, which is located within an encapsulation, or generally within a barrier layer.

Examples in accordance with the present disclosure generally create concepts for all-encompassing moisture monitoring within an implant encapsulation.

Examples according to the present disclosure create an all-encompassing sensor structure for moisture detection within an encapsulation (for example an implant encapsulation or encapsulation layers or the previously explained encapsulations or encapsulation arrangements).

According to one aspect of the disclosure, for example, the electrode layers and the sensitive layer can be used to form a layer stack with flat, essentially parallel electrodes spaced apart by the sensitive layer, which, for example, locally essentially has the effect and the field profile of a plate capacitor. Thus, for example, a change in a capacitive and / or resistive characteristic Shank of the sensitive layer can be detected by the penetration of a substance (e.g. water or body fluid).

According to one aspect, the inventive concept comprises a (for example three-dimensionally shaped or “deformed”) “plate” capacitor which, for example, encloses the interior to a large extent (for example at least 80 percent) sensitive layer is formed. The (moisture-) sensitive layer can be a polymer. Optionally - depending on the application and depending on the type of encapsulation - the upper electrode can be perforated so that moisture gets to the polymer.

5. Implementation alternatives

Although some aspects have been described in connection with a device, it goes without saying that these aspects also represent a description of the corresponding method, so that a block or a component of a device is also to be understood as a corresponding method step or as a feature of a method step. Analogously to this, aspects that have been described in connection with or as a method step also represent a description of a corresponding block or details or features of a corresponding device. Some or all of the method steps can be carried out by a hardware apparatus (or using a hardware Apparatus), such as a microprocessor, a programmable computer or an electronic circuit. In some embodiments, some or more of the most important process steps can be performed by such an apparatus.

The examples described above are merely illustrative of the principles of the present invention. It is to be understood that modifications and variations of the arrangements and details described herein will become apparent to other skilled artisans. It is therefore intended that the invention be limited only by the scope of protection of the following patent claims and not by the specific details presented herein on the basis of the description and the explanation of the exemplary embodiments.

6. Advantages of Examples of the Disclosure

The following describes advantages that can be achieved in examples according to the present disclosure. It should be noted, however, that not all possible implementations have the advantages described below.

The greatest advantage of an all-enclosing and self-monitoring encapsulation arrangement or implant encapsulation, for example, is the early detection of the encapsulation degradation before the functionality of the enclosed object or implant is restricted. Thus, if degradation occurs, for example due to moisture in the implant encapsulation, regardless of the location of the defect, the implant can be switched off and explanted in good time. The present concept and the present invention enables a more advanced monitoring of encapsulations (for example the encapsulations described above), whereby the dwell time of encapsulated objects at their application sites, as well as their safe operation, for example the implantation duration and safety in the case of implant applications, can be maximized.

Another advantage is the (possible) great miniaturization of the encapsulation, as a result of which encapsulated arrangements, for example implants, become smaller overall. In the case of implant applications, this simplifies the implantation process (e.g. less invasive interventions), increases the likelihood that the implant will be better accepted by the body and enables further applications that currently fail because of implants that are too large.

The present disclosure has great advantages in particular in comparison to approaches from the prior art, e.g. the placement of many individual local humidity sensors on an implant board. The monitoring quality of an arrangement according to the present disclosure is not comparable with previous approaches, since with these no comparable scope of monitoring, for example area-wide moisture detection, is implemented. In addition, the solution according to the present disclosure leads to a significantly lower technological and circuit-related expenditure.

In other words, examples according to the present disclosure enable area-wide moisture detection, which cannot be achieved with conventional concepts.

references

• [1] Weinmann M., Nisch W., Stett. A., Urban G., Bucher V .; Long-term stable encapsulation layers with integrated moisture sensor for active micro-implants; WO-Tech Technical Media, 2012
• [2] of Metzen, R. & Stieglitz, T .; A Wireless System for Monitoring Polymer Encapsulations; Engineering in Medicine and Biology Society, 2007. EMBS 2007. 29th Annual International Conference of the IEEE, 2007 , 6600-6603
• [3] Dokmeci, M. & Najafi, K .; A high-sensitivity polyimide humidity sensor for monitoring her-metic micropackages; Micro Electro Mechanical Systems, 1999. MEMS '99. Twelfth IEEE International Conference on, 1999 , 279-284
• [4] Hauvespre, S .; Dokmeci, M. & Najafi, K .; Wireless humidity monitoring in hermetic biomedical micropackages; [Engineering in Medicine and Biology, 1999. 21st Annual Conference and the 1999 Annual Fall Meetring of the Biomedical Engineering Society] BMES / EMBS Conference, 1999. Proceedings of the First Joint, 1999 , 2, 847 vol. 2
• [5] Dokmeci, M. & Najafi, K .; A high-sensitivity polyimide capacitive relative humidity sensor for monitoring anodically bonded hermetic micropackages; Microelectromechanical Systems, Journal of, 2001 , 10, 197-204
• [6] Harpster, T .; Hauvespre, S .; Dokmeci, MR & Najafi, K .; A passive humidity monitoring system for in situ remote wireless testing of micropackages; Microelectromechanical Systems, Journal of, 2002 , 11, 61-67
• [7] Harpster, T .; Nikles, S .; Dokmeci, MR & Najafi, K .; Long-term hermeticity and biological performance of anodically bonded glass-silicon implantable packages Device and Materials Reliability, IEEE Transactions on, 2005 , 5, 458-466
• [8th] EP 1546679 B1 CORROSION SENSING MICROSENSORS
• [9] US 8623185 B1 PLANAR MULTI-ELECTRODE ARRAY SENSOR FOR LOCALIZED ELECTROCHEMICAL CORROSION DETECTION
• [10] CN 105067682 A FLEXIBLE CAPACITIVE HUMIDITY SENSOR AND PREPARATION METHOD THEREOF
• [11] US 2015047430 A1 INTEGRATED HUMDITY SENSOR AND MATHOD FOR THE MANUFACTURE THEREOF
• [12] WO 2016056887 A1 HUMIDITY SENSOR WITH NANOPOROUS POLYIMIDE MEMBRANES AND A METHOD OF FAB-RICATION THEREOF
• [13] US 20130069676 A1 CORROSION DETECTION APPARATUS FOR MONITORING A STATE OF CORROSION

QUOTES INCLUDED IN THE DESCRIPTION

This list of the documents listed by the applicant was generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Patent literature cited

• EP 1546679 B1 [0135]
• US 8623185 B1 [0135]
• CN 105067682 A [0135]
• US 2015047430 A1 [0135]
• WO 2016056887 A1 [0135]
• US 20130069676 A1 [0135]

Non-patent literature cited

• Metzen, R. & Stieglitz, T .; A Wireless System for Monitoring Polymer Encapsulations; Engineering in Medicine and Biology Society, 2007. EMBS 2007. 29th Annual International Conference of the IEEE, 2007 [0135]
• Dokmeci, M. & Najafi, K .; A high-sensitivity polyimide humidity sensor for monitoring her-metic micropackages; Micro Electro Mechanical Systems, 1999. MEMS '99. Twelfth IEEE International Conference on, 1999 [0135]
• Hauvespre, S .; Dokmeci, M. & Najafi, K .; Wireless humidity monitoring in hermetic biomedical micropackages; [Engineering in Medicine and Biology, 1999. 21st Annual Conference and the 1999 Annual Fall Meetring of the Biomedical Engineering Society] BMES / EMBS Conference, 1999. Proceedings of the First Joint, 1999 [0135]
• Dokmeci, M. & Najafi, K .; A high-sensitivity polyimide capacitive relative humidity sensor for monitoring anodically bonded hermetic micropackages; Microelectromechanical Systems, Journal of, 2001 [0135]
• Harpster, T .; Hauvespre, S .; Dokmeci, M. R. & Najafi, K .; A passive humidity monitoring system for in situ remote wireless testing of micropackages; Microelectromechanical Systems, Journal of, 2002 [0135]
• Harpster, T .; Nikles, S .; Dokmeci, M. R. & Najafi, K .; Long-term hermeticity and biological performance of anodically bonded glass-silicon implantable packages Device and Materials Reliability, IEEE Transactions on, 2005 [0135]

Claims (19)

Arrangement (100; 200; 300) with the following features: a first electrode layer (101; 308); and a second electrode layer (102; 306); and a sensitive layer (103; 307), wherein the sensitive layer (103; 307) is arranged between the first electrode layer (101; 308) and the second electrode layer (102; 306); and wherein the sensitive layer (103; 307) encloses an interior of the arrangement to at least 80 percent. Arrangement (100; 200; 300) according to Claim 1 , wherein the sensitive layer (103; 307) encloses the interior of the arrangement to at least 90 percent. Arrangement (100; 200; 300) according to Claim 1 or 2 , the sensitive layer (103; 307) completely enclosing the interior of the arrangement. Arrangement (100; 200; 300) according to one of the preceding claims, wherein the arrangement has a layer (201; 305) within the interior space enclosed by the electrode layers (101; 308 and 102; 306) and the sensitive layer (103; 307) , which is designed for homogenization and / or electrical insulation of the interior space enclosed by the electrode layers (101; 308 and 102; 306) and the sensitive layer (103; 307). Arrangement (100; 200; 300) according to one of the preceding claims, wherein the arrangement has a barrier layer (203; 309). Arrangement (100; 200; 300) according to one of the preceding claims, wherein the arrangement has at least one layer (204) which is used for compatibility of the arrangement with its application environment. Arrangement (100; 200; 300) according to one of the preceding claims, wherein the arrangement encloses an object (202; 301,302,303,304,310) and is designed to monitor a spatial area around the enclosed object in at least 3 spatial directions orthogonal to one another in pairs. Arrangement (100; 200; 300) according to Claim 7 , the arrangement (100; 200; 300) immediately enclosing the object (202; 301,302,303,304,310) following the contours of the object. Arrangement (100; 200; 300) according to one of the Claims 7 - 8th , wherein the enclosed object (202; 301; 302; 303,304,310) is designed to read out a monitoring result as a function of at least one property of the sensitive layer (103; 307) and to transmit it telemetrically. Arrangement (100; 200; 300) according to one of the Claims 7 - 9 , the object to be monitored (202; 301; 302; 303,304,310) being an implant which is encapsulated by the arrangement. Arrangement (100; 200; 300) according to one of the preceding claims, wherein at least one of the layers of the arrangement is applied isotropically to an object (202; 301; 302; 303,304,310), or to another layer of the arrangement. Arrangement (100; 200; 300) according to one of the preceding claims, wherein at least one of the layers (101; 102; 103; 201; 203; 204; 305,306; 307; 308; 309) of the arrangement is applied to an object ( 202; 301; 302; 303,304,310), or a layer deposited on a layer of the arrangement. Arrangement (100; 200; 300) according to one of the preceding claims, wherein the electrode layers (101; 308 and 102; 306) have a thickness of less than 10 µm. Arrangement (100; 200; 300) according to one of the preceding claims, wherein the sensitive layer (103; 307) has a thickness of less than 25 µm. Arrangement (100; 200; 300) according to one of the preceding claims, wherein the sensitive layer (103; 307) is a moisture-sensitive layer. Arrangement (100; 200; 300) according to one of the preceding claims, wherein the arrangement for encapsulating electronics (202; 301; 302; 303,304,310) in a harsh environment or as a sealing layer for the protection of an object (202; 301; 302; 303,304,310) is designed to protect against unauthorized access. A method for monitoring an object (202; 301; 302; 303,304,310), the method being a Evaluating a monitoring result as a function of at least one property of a sensitive layer (103; 307), the sensitive layer (103; 307) being arranged between a first electrode layer (101; 308) and a second electrode layer (102; 306); and wherein the sensitive layer (103; 307) encloses an interior space to at least 80 percent, preferably to at least 90 percent. Procedure according to Claim 17 , wherein the method comprises a telemetric transmission of a signal, so that a transmission of a monitoring result is made possible. Procedure according to Claim 17 or 18th , wherein the method comprises switching off the object (202; 301; 302; 303,304,310) and / or the monitoring on the basis of a monitoring result.

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