DE102020127036A1 - Connector assembly and method of manufacturing a connector assembly - Google Patents

Abstract

The invention relates to a connection arrangement with a first electrical or electronic component (10) with a first busbar (ST1) and a second busbar (ST2), the first busbar (ST1) and the second busbar (ST2) having a first insulation layer (ISO1 ) lie flat on top of each other, and a second electrical or electronic component (20) with a third busbar (ST3) and a fourth busbar (ST4), wherein the third busbar (ST3) and the fourth busbar (ST4) have a second insulation layer (IS02 ) lie flat on top of each other, with a first contacting area (KB1) of the first busbar (ST1) being electrically conductively connected to a fourth contacting area (KB4) of the fourth busbar (ST4) and a second contacting area (KB2) of the second busbar (ST2) being electrically conductively connected is connected to a third contact area (KB3) of the third busbar (ST3), wherein the first Kontakti The contacting area (KB1) projects beyond the second contacting area (KB2) and overlaps with the fourth contacting area (KB4) and is connected to it by means of a first joining seam (L1), and wherein the third contacting area (KB3) projects beyond the fourth contacting area (KB4). and overlaps with the second contact area (KB2) and is connected to it by means of a second seam (L2). Furthermore, a method for producing a connection arrangement is specified.

Description

The invention relates to a connection arrangement and a method for producing a connection arrangement for use in power electronics control devices, in particular converters or converters, e.g. for rail vehicles, wind power or solar systems or for passenger car electromobility.

In electric or hybrid vehicles, power electronics are used in connection with the traction batteries. In these, electrical or electronic components are connected to one another by current-carrying elements that have to conduct high electrical currents. In order to reduce inductances in the current-carrying elements and to keep power losses low, current-carrying elements are usually used, which enable a planar and parallel current flow. It is known here, for example, to use so-called busbars as current-carrying elements. In this case, for example, two busbars with opposite current directions are routed directly one above the other and parallel to one another at a small distance. An insulating layer in the form of a plastic film, for example, is arranged between the busbars as a spacer element and for electrical insulation.

If various electrical and/or electronic components are to be connected to one another in an electrically conductive manner, this parallel and closely stacked arrangement has hitherto been interrupted. For example, the busbars of a first component are led apart in order to enable screwing or clamping with the busbars of a second component. The spatial separation leads to locally higher inductance, which causes losses and thus impairs the efficiency of the system. Increased inductance can also cause electromagnetic interference, e.g. low-voltage signals in the vehicle can be disrupted. Furthermore, mechanical screwing or clamping of two busbars of the same pole also means a point of contact resistance and heating, which is also disadvantageous with regard to the thermal behavior and the efficiency of the system.

From the pamphlet DE 10 2016 209 271 A1 a connection arrangement is known in which the busbars are bent at right angles in the contacting areas and guided towards one another, so that the contacting areas of two busbars to be connected come to lie flat on top of each other.

Against this background, it is the object of the invention to specify a further possibility of how a low-impedance connection arrangement can be implemented. In a further aspect, the connection arrangement should also have a small installation space requirement and in particular should be designed and manufacturable for large-scale production.

The object is achieved by a connection arrangement according to patent claim 1 and a method according to patent claim 8. Further advantageous refinements result from the dependent claims and the following description.

A connection arrangement is specified with a first electrical or electronic component with a first busbar and a second busbar, the first busbar and the second busbar lying flat on top of one another via a first insulation layer. Furthermore, the connection arrangement has a second electrical or electronic component with a third busbar and a fourth busbar, the third busbar and the fourth busbar lying flat on top of one another via a second insulation layer. The first or second insulation layer consequently lies between the two respective busbars and electrically insulates them from one another. The insulation layer can be a plastic film, for example. A first contacting area of the first busbar is electrically conductively connected to a fourth contacting area of the fourth busbar and a second contacting area of the second busbar is electrically conductively connected to a third contacting area of the third busbar. The first contacting area protrudes in relation to the second contacting area and overlaps with the fourth contacting area and is connected to it by means of a first seam. The third contacting area protrudes in relation to the fourth contacting area and overlaps with the second contacting area and is connected to it by means of a second seam. A section of the busbar in which the busbar has an electrically conductive connection to a further busbar is referred to as a contacting region.

This arrangement makes it possible to dispense with a spatial separation of the busbars of a component and still achieve reliable electrical contacting between the two components. The arrangement is based on the idea that the busbars of a component always remain overlapping and remain electrically isolated from one another. For example, two busbars of the first component come horizontally from one direction and two busbars of the second component run out horizontally a second direction towards the two busbars of the first component. Here, the busbars are arranged in three conductor levels, so that one busbar of the first component and one busbar of the second component overlap in the contacting areas. In each case one busbar of a pair of busbars protrudes along a longitudinal direction of the busbar in relation to the other busbar. In this arrangement, the busbars can be pushed into one another in a quasi-interlocking manner, so that busbars of the same polarity come to lie on top of one another in an overlapping manner. It is not necessary for the busbars of a component to be spaced apart from one another—apart from the electrical insulation provided by the insulating layer. Rather, the busbars in the respective contacting area remain in the same plane in which they are brought up to the contacting area. In particular, the busbars are not folded in the contacting area or routed to another level. Preferably, the contacting areas of the second busbar and the third busbar are in the same plane. This overlapping arrangement makes it possible to create large contacting areas in which the busbars make electrical contact with one another. In addition, such an arrangement enables particularly low inductances, since the areal and parallel current conduction is maintained throughout.

The first and second busbars of the first electrical or electronic component have different polarities, e.g., the first busbar can be a (+) conductor and the second busbar can be a (-) conductor or vice versa. The polarity of the third and fourth busbars is correspondingly chosen such that the third busbar has the same polarity as the second busbar, e.g. (-) and the fourth busbar has the same polarity as the first busbar, e.g. (+).

In order to implement a low-impedance electrical connection and to avoid transfer resistances, the first and fourth busbars are connected in their contacting areas by means of a first seam, and the second and third busbars are also connected by means of a second seam. The joining seams are preferably themselves electrically conductive or preferably have the same internal structure as the unprocessed material.

For the production of high volumes, it is particularly preferred in one embodiment if the joining seams are in the form of weld seams. The welding can take place in particular by means of laser radiation.

With regard to the ability to manufacture the connection arrangement in large series, it is particularly preferred in one configuration if the first busbar has a through-opening which is formed in the direction of the second contacting region of the second busbar. In the area of the through-opening, the second busbar is thus open and freely accessible from the side of the first busbar. This enables both electrically conductive connections (the connection between the second bus bar and the third bus bar and the connection between the first and fourth bus bars) to be formed from the same side. As a result, only one-sided accessibility during assembly is necessary to form the joint seam. In particular, both welds can be carried out using the same laser beam system without any significant repositioning, which reduces production time and costs.

The use of a laser beam to form the electrically conductive connection also makes it possible, in one configuration, for the through-opening in the first busbar to be formed as a slot-shaped opening. In the context of this invention, a slit-like opening is understood to mean an opening whose width is many times smaller than its length, e.g. smaller by a factor of at least 3 or smaller by a factor of at least 5. The slot-shaped through-opening reduces the reduction in cross-section in the first busbar to a minimum and thus has only a very small or no significant negative influence on the current flow and thus on the efficiency of the overall system.

In one configuration, it is provided that the end faces of the first busbar pointing towards the through-opening are covered by an insert insulation part. This can be a plastic component, for example, which is arranged in the through-opening on the peripheral side and possibly protrudes beyond the first busbar. A through opening up to the second busbar remains inside the insulation insert. The insulating insert is used to electrically insulate the first busbar from the second busbar and forms a barrier against leakage currents. In addition, the insulating insert acts as a splash and dust protection during the laser welding process.

In order to reduce the overall length of the connection arrangement, it is particularly advantageous if, in one embodiment, an insulating element is arranged between the second contacting area of the second busbar and the fourth contacting area of the fourth busbar. The insulating element is preferably made of art fabric element formed. The insulating element is preferably positioned between the end faces of the second and fourth busbars, which converge in one plane. The insulating element can have a cross section, for example, which essentially corresponds to the cross section of the second or fourth busbar. If necessary, the insulating element can have an additional sealing element, such as a rubber seal, through which the insulating element is clamped between the busbars and thereby fixed. The insulation element reduces the creepage distance to be taken into account, so that the overall length of the connection arrangement can be minimized. As an alternative or in addition to the insulating element, an insulating layer, for example the second insulating layer arranged between the third and fourth busbars, can also protrude in the direction of the third contacting region with respect to the fourth busbar.

In one configuration, the electrical or electronic components can be a capacitor module and a power module. For example, the first component can be a capacitor module and the second component can be a power module or vice versa. The capacitor module is in particular an intermediate circuit capacitor. The power module is in particular an inverter module or rectifier module. The intermediate circuit capacitor is then connected to a DC voltage connection of the power module by means of the busbars. The connection arrangement described above is characterized by a small space requirement. A connection of this type can therefore also be integrated into existing concepts without the need for changes in the installation space. It is therefore particularly suitable for use in motor vehicles, such as electric vehicles or hybrid vehicles.

• - Bereitstellen eines ersten elektrischen oder elektronischen Bauteils mit einer ersten Stromschiene und einer zweiten Stromschiene, die über einer ersten Isolationsschicht flächig übereinander liegen, wobei ein erster Kontaktierungsbereich der ersten Stromschiene gegenüber einem zweiten Kontaktierungsbereich der zweiten Stromschiene vorsteht,
• - Bereitstellen eines zweiten elektrischen oder elektronischen Bauteils mit einer dritten Stromschiene und einer vierten Stromschiene, die über einer zweiten Isolationsschicht flächig übereinander liegen, wobei ein dritter Kontaktierungsbereich der dritten Stromschiene gegenüber einem vierten Kontaktierungsbereich der vierten Stromschiene vorsteht,
• - Positionieren und Fixieren von erstem elektrischen oder elektronischen Bauteil und zweitem elektrischen oder elektronischen Bauteil derart, dass sich der erste Kontaktierungsbereich der ersten Stromschiene und der vierte Kontaktierungsbereich der vierten Stromschiene überlappend kontaktieren und dass sich der zweite Kontaktierungsbereich der zweiten Stromschiene und der dritte Kontaktierungsbereich der dritten Stromschiene überlappend kontaktieren,
• - Ausbilden einer ersten Fügenaht, welche den ersten Kontaktierungsbereich mit dem vierten Kontaktierungsbereich verbindet und
• - Ausbilden einer zweiten Fügenaht, welche den zweiten Kontaktierungsbereich mit dem dritten Kontaktierungsbereich verbindet.

Furthermore, a method for producing a connection arrangement is specified, in particular for producing the connection arrangement described above. The procedure has the steps:

• - providing a first electrical or electronic component with a first busbar and a second busbar, which lie flat on top of one another over a first insulation layer, with a first contacting area of the first busbar protruding in relation to a second contacting area of the second busbar,
• - Providing a second electrical or electronic component with a third busbar and a fourth busbar, which lie flat on top of one another over a second insulating layer, with a third contacting area of the third busbar protruding in relation to a fourth contacting area of the fourth busbar,
• - Positioning and fixing the first electrical or electronic component and the second electrical or electronic component in such a way that the first contacting area of the first busbar and the fourth contacting area of the fourth busbar contact overlapping and that the second contacting area of the second busbar and the third contacting area of the third contact busbar overlapping,
• - Forming a first joining seam which connects the first contacting area to the fourth contacting area and
• - Forming a second joining seam which connects the second contacting area to the third contacting area.

The joining seam is preferably formed by a welding process. In order to form the connection arrangement economically, it is advantageous if the joining seam can only be formed from one side. For this purpose, in one configuration, the first joining seam, which connects the second contacting area to the third contacting area, is formed through a through-opening in the first busbar.

The joining seam is preferably formed by a laser beam welding process. Only a very narrow, slit-shaped passage opening is required for this welding process. In this method, the laser beam is directed through the through opening in the first busbar onto the second busbar and forms a joint seam which connects the second busbar to the third busbar. The laser beam welding process generates only a small amount of heat and the structural changes are minor compared to other welding processes. The laser beam welding process is fast and requires only a one-time investment for equipment procurement, and is therefore well suited for mass production.

A clamping device that presses the rails together can be used to fix the pre-positioned busbars in place. This ensures that the rails make contact during thermal joining. In addition, the clamping device acts as a dust and splash guard during the joining process. The clamping device can, for example, be braced against a support plate which supports the components carries. After thermal joining of the busbars, the clamping device can be removed.

Features and details that are described in connection with the connection arrangement also apply in connection with the method according to the invention and vice versa, so that the disclosure of the individual aspects of the invention is or can always be referred to reciprocally. Further advantages, features and details of the invention result from the following description, in which exemplary embodiments of the invention are described in detail with reference to the drawings. The features mentioned in the claims and in the description can each be essential to the invention individually or in any combination. If the term "can" is used in this application, it is both the technical possibility and the actual technical implementation.

• 1 eine schematische Schnittansicht A-A einer beispielhaften Verbindungsanordnung und
• 2 eine schematische Draufsicht der in 1 dargestellten Verbindungsanordnung.

Exemplary embodiments are explained below with reference to the accompanying drawings. Show in it:

• 1 a schematic sectional view AA of an exemplary connection arrangement and
• 2 a schematic plan view of in 1 illustrated connection arrangement.

1 shows an exemplary connection arrangement 1, in which a first electrical or electronic component 10 with a first busbar ST1 and a second busbar ST2 and a second electrical or electronic component 20 with a third busbar ST3 and a fourth busbar ST4 are electrically conductively connected to one another. The first component 10 is, for example, a capacitor module, in particular an intermediate circuit capacitor, and the second component 20 is, for example, a power module or vice versa.

The first busbar ST1 and the second busbar ST2 lie flat on top of one another over a first insulating layer ISO1. The first insulating layer ISO1 spaces the first and second busbars ST1 and ST2 from one another and electrically insulates them from one another. The end of the upper, first busbar ST1 is extended and protrudes in the longitudinal direction beyond the second busbar ST2.

The third busbar ST3 and the fourth busbar ST4 lie flat on top of one another via a second insulating layer ISO2. The second insulating layer ISO2 separates the third and fourth busbars ST3 and ST4 from one another and electrically insulates them from one another. The third busbar ST3 lying below is extended at its end and protrudes in the longitudinal direction beyond the fourth busbar ST4.

The first and second insulating layers ISO1 and ISO2 can be in the form of a thin plastic film, for example. The first and second insulation layers ISO1 and ISO2 can have an overhang at the edge of the busbars corresponding to the electrical clearance and creepage distance.

The busbars ST1 to ST4 are fed to one another, with one pair of conductors (ST1 and ST2) overlapping the second pair of conductors (ST3 and ST4), so that the busbars are arranged in three conductor levels. The busbars of the same polarity, ie the first busbar ST1 and the fourth busbar ST4, as well as the second busbar ST2 and the third busbar ST3, come into planar contact with one another in contacting areas. More precisely, a first contacting area KB1 of the first busbar ST1 overlaps with a fourth contacting area KB4 of the fourth busbar ST4 and makes contact with it. Likewise, a second contacting area KB2 of the second busbar overlaps with a third contacting area KB3 of the third busbar ST3 and makes contact with it. This arrangement means that the two middle busbars ST2 and ST4 are on the same line level. Between them is an insulating element 30, here in the form of a plastic element 32 with an additional rubber seal 34, which electrically insulates the two busbars ST2 and ST4, which have different polarities, from one another. The overall length of the concept is reduced by using the insulation element.

The busbars ST1 and ST4 as well as the busbars ST2 and ST3 are permanently connected in their respective contact areas by means of a laser welding process with a respective laser seam L1 and L2. The welding by means of a laser beam L is preferably carried out for both laser seams L1, L2 from the same side of the connection arrangement. For this purpose, the busbars are braced against the carrier plate 50 by means of a clamping device 40, which also carries the components 10 and 20, for example. This ensures that the busbars make contact during welding. The busbars can be electrically insulated from the carrier plate 50 by a third insulation layer ISO3.

The clamping device 40 has two passage openings 42, 44 through which the laser beam L is directed onto the busbars. In the first through hole 42 is the surface of the first th busbar ST1 free. This can - as in 1 shown - have a local depression. The laser beam is used to weld in, which permanently connects the first busbar ST1 to the fourth busbar ST4 lying underneath, and forms the first laser seam L1.

The surface of the second busbar ST2 is exposed in the second passage opening 44 of the clamping device 40 . This is achieved by a through opening 60 being formed in the first busbar ST1, which is arranged above the second busbar ST2. The through-opening 60 is preferably designed in the form of a slit. The end faces of the first busbar ST1 pointing towards the through-opening 60 are electrically insulated by an insulating insert part 70 which lines the through-opening 60 on the peripheral side. To form the second laser seam L2, the laser beam L is directed through the second through-opening 44 and the through-opening 60 onto the surface of the second busbar ST2 and produces a weld into the second and third busbar. During the welding process, the jig 40 can also act as a blast and dust shield. After the laser seams L1 and L2 have been formed, the jig 40 is removed.

2 Figure 12 shows a plan view of the connection arrangement 1 . The same reference symbols designate the same features.

Reference List

1

connection arrangement

10, 20

electrical or electronic component

30

isolation element

32

plastic element

34

rubber seal

40

clamping device

42, 44

passage openings

50

backing plate

60

passage opening

70

Insulation insert

ISO1 - ISO3

insulation layers

KB1 - KB4

contacting areas

L

laser beam

L1, L2

laser seams

ST1 - ST4

power rails

QUOTES INCLUDED IN DESCRIPTION

This list of documents cited by the applicant was generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Patent Literature Cited

• DE 102016209271 A1 [0004]

Claims (10)

Connection arrangement with a first electrical or electronic component (10) with a first busbar (ST1) and a second busbar (ST2), the first busbar (ST1) and the second busbar (ST2) lying flat on top of one another via a first insulation layer (ISO1), and a second electrical or electronic component (20) with a third busbar (ST3) and a fourth busbar (ST4), the third busbar (ST3) and the fourth busbar (ST4) lying flat on top of one another via a second insulating layer (ISO2), wherein a first contacting area (KB1) of the first busbar (ST1) is electrically conductively connected to a fourth contacting area (KB4) of the fourth busbar (ST4) and a second contact area (KB2) of the second busbar (ST2) is electrically conductively connected to a third contact area (KB3) of the third busbar (ST3), wherein the first contacting area (KB1) projects in relation to the second contacting area (KB2) and overlaps with the fourth contacting area (KB4) and is connected to it by means of a first joining seam (L1), and wherein the third contacting area (KB3) projects in relation to the fourth contacting area (KB4) and overlaps with the second contacting area (KB2) and is connected to it by means of a second joining seam (L2). connection arrangement Claim 1 , In which the first and the second seam (L1, L2) are designed as welds and in particular as laser welds. connection arrangement Claim 1 or 2 , In which the first busbar (ST1) has a through-opening (60) which is formed in the direction of the second contacting region (KB2) of the second busbar (ST2). connection arrangement patent claim 3 , In which the through-opening (60) in the first busbar (ST1) is designed as a slit-shaped opening. connection arrangement patent claim 3 or 4 , in which the end faces of the first busbar (ST1) pointing to the through-opening (60) are covered by an insert insulation part (70). Connection arrangement according to one of the preceding claims, in which an insulating element (30) is arranged between the second contacting area (KB2) of the second busbar (ST2) and the fourth contacting area (KB4) of the fourth busbar (ST4). Connection arrangement according to one of the preceding patent claims, in which the components (10, 20) are a capacitor module and a power module. Method for producing a connection arrangement with the steps: Providing a first electrical or electronic component (10) with a first busbar (ST1) and a second busbar (ST2), which lie flat on top of one another over a first insulating layer (ISO1), a first contacting area (KB1) of the first busbar (ST1) protrudes from a second contact area (KB2) of the second busbar (ST2), Providing a second electrical or electronic component (20) with a third busbar (ST3) and a fourth busbar (ST4), which lie flat on top of one another over a second insulating layer (ISO2), with a third contacting area (KB3) of the third busbar (ST3) protrudes from a fourth contacting area (KB4) of the fourth busbar (ST4), Positioning and fixing the first electrical or electronic component (10) and the second electrical or electronic component (20) in such a way that the first contacting area (KB1) of the first busbar (ST1) contacts the fourth contacting area (KB4) of the fourth busbar (ST4) and the second contacting area (KB2) of the second busbar (ST2) makes contact with the third contacting area (KB3) of the third busbar (ST3) and forming a first joining seam (L1) which connects the first contacting area (KB1) to the fourth contacting area (KB4), and forming a second joining seam (L2) which connects the second contacting area (KB2) to the third contacting area (KB3). procedure after patent claim 8 , in which the joining seam (L1, L2) is formed by means of a welding process, in particular by means of a laser beam welding process. procedure after patent claim 8 or 9 , in which the formation of the first joint seam (L1), which connects the second contacting area (KB2) to the third contacting area (KB3), takes place through a through-opening (60) in the first busbar (ST1).

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