DE102020124011A1 - OPTOELECTRONIC DEVICE HAVING A THREE-DIMENSIONAL BODY AND A SUPPORT ATTACHED TO THE BODY - Google Patents

Abstract

An optoelectronic device (10) comprises a body (11) with a three-dimensional surface (14), a carrier (12) with conductor tracks which is bendable in at least one area and also stretchable and/or compressible and which is attached to the three-dimensional surface ( 14) is attached, and a plurality of optoelectronic components (13) which are designed to generate light and which are arranged on the carrier (12).

Description

The present invention relates to an optoelectronic device with a three-dimensional body and a carrier for optoelectronic components attached to the body. Furthermore, the invention relates to a method for producing such an optoelectronic device.

In conventional lighting applications, arrays of optoelectronic components can be placed on printed circuit boards with equal spacing from one another. From a certain distance, such light sources appear to an observer to produce homogeneous light. If a specific light distribution is desired, this can be achieved by different distances between the optoelectronic components. For example, the light-emitting level can have areas with high brightness and areas with lower brightness.

However, there are also applications, for example in the automotive sector, in which optoelectronic components are to be applied to curved surfaces.

The present invention is therefore based, inter alia, on the object of creating an optoelectronic device which has a body with a three-dimensional surface, optoelectronic components being arranged on the three-dimensional surface and the optoelectronic components generating a predetermined light distribution from the perspective of an observer. Furthermore, a vehicle or a consumer product is to be created with such an optoelectronic device. In addition, a method for producing the optoelectronic device is to be specified.

An object of the invention is solved by an optoelectronic device having the features of claim 1. Further objects of the invention are solved by a vehicle having the features of claim 6 and a consumer product having the features of claim 7. Finally, an object of the invention is achieved by a method for producing an optoelectronic device having the features of independent claim 8 . Preferred embodiments and developments of the invention are specified in the dependent claims.

An optoelectronic device according to one aspect of the present application comprises a body, a carrier and a plurality of optoelectronic components.

The body has a surface that is three-dimensional and thus extends in three-dimensional space. The surface is at least partially not level or planar. In particular, the surface is at least partially curved. Distributed over the surface, it can have different curvatures, in particular different radii of curvature, with in particular different dimensions. The body can be made of any suitable material, for example a plastic, a metal or any other suitable material.

Electrically conductive conductor tracks are applied to the carrier. The carrier with the conductor tracks is bendable or flexible at least in one area. In an unloaded condition, where no force is applied to the beam, the beam, or a major surface of the beam, may be planar. The carrier with the conductor tracks can be at least partially stretchable and/or compressible in a direction parallel to the main surface. This means that when a force is exerted on the carrier in this direction, the dimension or expansion of the carrier increases or decreases.

The optoelectronic components, which are designed to generate light, are arranged on the carrier. The ability of the carrier to be bent and stretched or compressed makes it possible to attach the carrier together with the optoelectronic components to the three-dimensional surface of the body. The optoelectronic components can be placed on the carrier in such a way that, after being attached to the body, they produce a desired or specified light distribution, for example a homogeneous light distribution.

The carrier with the conductor tracks attached to it can be, for example, a printed circuit board, also known as a circuit card, circuit board or PCB (English: printed circuit board). The printed circuit board serves both as a carrier for the optoelectronic components and for the electrical connection and control of the optoelectronic components. The printed circuit board can consist of an electrically insulating base body as a carrier with conductor tracks adhering to it. The electrically insulating base body can be made from a material that has the desired flexibility and flexibility to stretch and/or compress. For example, this material can have a thermoplastic polyurethane (TPU for short) or consist entirely of this. The carrier can also be a plastic film or a film made of another suitable material, for example, to which the conductor tracks are applied.

The conductor tracks can be made of a metal or a metal alloy or another suitable electrically conductive material. So that they can also be stretched when the carrier or base body is stretched, the conductor tracks can have a course that allows stretching at least in a predetermined direction. For example, the conductor tracks can have a meandering course, at least in sections. The optoelectronic components mounted on the carrier can be controlled either individually or in groups with the aid of the conductor tracks.

Furthermore, contact elements can be attached to the carrier or base body, on which the optoelectronic components are mounted. The contact elements are connected to the conductor tracks in a desired manner. The contact elements can be soldering surfaces or soldering pads, for example, and can be made of a metal or a metal alloy or another suitable electrically conductive material. The optoelectronic components can be soldered onto the contact elements, for example. The contact elements can be designed in such a way that they prevent the carrier or base body from stretching in the region in which they are attached to the carrier or base body. This prevents the carrier or base body from stretching in the areas in which the optoelectronic components are mounted on the carrier or base body.

The company CONTAG AG from 13581 Berlin, Germany manufactures flexible and stretchable or compressible printed circuit boards that can be used for the application described in the present application. The document "Product information - Stretchable printed circuit boards", in which the properties of the flexible and stretchable or compressible printed circuit boards manufactured by CONTAG AG are described, can be found on the Internet at the following address: http://www.contag .eu/uploads/pi ti/stretchable printed _circuitboards.pdf. The disclosure content of this document is hereby incorporated into the disclosure content of the present application.

The optoelectronic components can be semiconductor elements, in particular semiconductor chips. The optoelectronic components can be embodied, for example, as light-emitting diodes (LED), as organic light-emitting diodes (OLED), as light-emitting transistors or as organic light-emitting transistors.

Furthermore, the optoelectronic components as a CSP (chip scale package; German: Housing in the order of the Die) or as pLEDs, i. H. Micro-LEDs, be running. A µLED has only a very thin substrate or no substrate at all, which makes it possible to produce the µLED with small lateral dimensions, especially in the µm range.

The optoelectronic components are designed to emit light. In the present application, the term “light” is understood not only as light in the visible range, but also as electromagnetic radiation in adjacent wavelength ranges, in particular in the ultraviolet and infrared range. Provision can therefore also be made for the optoelectronic components to also emit ultraviolet (UV) light and/or infrared (IR) light in addition or as an alternative to visible light.

The optoelectronic device can be configured in such a way that the optoelectronic components are arranged on the carrier at predetermined distances from one another.

At least some of the optoelectronic components or also all of the optoelectronic components can have a defined distance, in particular the same distance, from the respectively adjacent optoelectronic components.

The carrier may be attached to the three-dimensional surface by means of an adhesive or a mechanical attachment means such as a clamp.

Furthermore, the optoelectronic components can be soldered or glued onto the carrier.

The optoelectronic device can be used in particular in lighting units or displays, i. H. Display devices that are used, for example, to display information, or other suitable applications can be integrated. This is particularly advantageous when the application, for example the lighting unit or the display, has an at least partially bent or curved shape. In the case of an embodiment as a display, this can have a low, medium or high resolution depending on the distance between the optoelectronic components.

The optoelectronic device can also be used as accent lighting, in particular as instrument lighting. The three-dimensional light distribution can be chosen in such a way that a lower brightness is used in the vicinity of the instrument to achieve a contrast prevails and the brightness is higher away from the instrument.

A vehicle according to a further aspect of the application includes an optoelectronic device as described above. The optoelectronic device can be arranged inside the vehicle. For example, the optoelectronic device can serve as ambient lighting. This makes it possible to produce the ambient lighting in a desired three-dimensional shape and still achieve a predetermined, for example homogeneous, light distribution. Furthermore, the optoelectronic device can be used in a display integrated into the vehicle.

According to yet another aspect of the application, there is provided a consumer product comprising the optoelectronic device described in this application. In the consumer product, the optoelectronic device can serve, for example, for lighting or as a display or for another purpose.

Furthermore, it is also conceivable to integrate the optoelectronic device into an industrial application.

A method according to a further aspect of the present application serves to produce an optoelectronic device, for example an optoelectronic device as is described in this application.

According to the method, a body with a three-dimensional surface is provided. Furthermore, a plurality of optoelectronic components, which are designed to generate light, are arranged on a carrier with conductor tracks applied to the carrier. The carrier can be bent at least in one area and can also be stretched and/or compressed in this area. After the assembly of the optoelectronic components, the carrier is applied to the three-dimensional surface of the body and, in particular, attached or fastened there. In particular, the carrier is applied to the surface of the body in such a way that it adapts to the shape of the surface or is in close contact with it.

The carrier can be stretched and in particular bent when the carrier is applied to the three-dimensional surface of the body. The stretching of the backing can occur immediately during application to the body or just before.

Due to the stretching of the carrier when it is applied to the body, at least some of the distances between the individual optoelectronic components after the application differ from the corresponding distances before the application. In particular, some of the distances between the individual optoelectronic components can be larger after the application than before the application.

If the optoelectronic components are mounted on the carrier, the carrier can be in a non-stretched or compressed and non-bent, ie. H. are essentially in a planar state. When placing the optoelectronic components on the carrier, the subsequent expansion or compression and in particular the bending of the carrier can be taken into account. Consequently, the optoelectronic components can be mounted on the carrier in a grid that does not correspond to the actually desired grid. The desired grid and the desired light distribution are only achieved by stretching or compressing the carrier when it is applied to the body.

According to one configuration, a light distribution is specified which the optoelectronic components are intended to generate after the carrier has been applied to the three-dimensional surface of the body. The positions of the optoelectronic components on the three-dimensional surface are determined, in particular calculated, on the basis of the desired light distribution. The optoelectronic components are positioned on the three-dimensional surface in such a way that they produce the specified light distribution after mounting the carrier. Subsequently, the positions of the optoelectronic components on the flat carrier, i. That is, the positions of the optoelectronic components before the carrier is applied to the body are determined, in particular calculated, in such a way that the optoelectronic components assume the previously determined positions after the carrier is applied to the three-dimensional surface and accordingly generate the desired light distribution. In the last step, the stretching or compression of the carrier when it is applied to the body is taken into account.

According to one configuration, at least some of the optoelectronic components or also all of the optoelectronic components can be mounted on the carrier in such a way that they have an at least partially different distance from one another before the carrier is applied to the three-dimensional surface and after the application a defined distance, in particular the same distance from each other. In particular, the optoelectronics Mechanical components are mounted on the carrier in a non-constant or irregular grid and after the carrier has been applied to the three-dimensional surface of the body, the optoelectronic components can be mounted in a constant or regular grid with defined distances due to the expansion or compression of the carrier , In particular the same distances, be arranged to the respectively adjacent optoelectronic components, so that they produce, for example, a homogeneous light distribution.

Furthermore, the carrier can have at least one area in which the carrier is not stretched or compressed when it is applied to the three-dimensional surface of the body and in particular is not bent because, for example, the surface of the body is flat in this area. In this case, the grid in which the optoelectronic components are mounted on the carrier in this area can correspond to the desired grid that is required for the desired light distribution.

According to a further configuration, the optoelectronic components arranged in a first region of the carrier can have a higher density than the optoelectronic components arranged in a second region of the carrier before the carrier is applied to the three-dimensional surface. A higher density means that there is a larger number of optoelectronic components within a unit area. Furthermore, after the carrier has been applied to the three-dimensional surface, the first region of the carrier can be stretched more than the second region of the carrier. As a result, the densities of the optoelectronic components in the first and second regions can balance out, so that after the carrier has been applied to the body, the densities in both regions can be the same, for example.

The optoelectronic components can be soldered or glued onto the carrier. For example, a low-melting solder can be used, in particular a solder as described in the above-mentioned document “Product information—Stretchable printed circuit boards” from CONTAQ AG. In particular, the optoelectronic components can be assembled by means of standard SMD (surface-mounted device) processes.

SMD components do not have any connection wires that have to be routed through holes in the carrier or the printed circuit board. Rather, SMD components are placed on a main surface of the carrier or the printed circuit board and then soldered to this main surface.

After the optoelectronic components have been mounted on one main surface of the carrier, the carrier is applied with its other main surface to the three-dimensional surface of the body and then attached to the body. The carrier is applied to the body and stretched and/or compressed in certain areas such that each optoelectronic component is then in a predetermined position, so that all optoelectronic components together can achieve the desired light distribution on the body. The carrier can, for example, be glued to the three-dimensional surface or mechanically fastened there, for example by means of a clamping means.

The manufacturing method described for the optoelectronic device makes it possible to generate any light distribution on the three-dimensional surface of the body. The initial arrangement of the optoelectronic components on the carrier in the planar or flat, i. H. two-dimensional state can be calculated so that the optoelectronic components produce the desired light distribution after the attachment of the carrier to the body and the associated stretching of the carrier. Furthermore, the shape and/or the course of the conductor tracks on the carrier can be calculated in such a way that they contact the optoelectronic components in the desired manner and also allow the carrier to be stretched and/or compressed.

A maximum value can be specified for the stretching and/or compression of the carrier. For example, it can be specified that the carrier must not be stretched more than 10% or 20% or 30%. Furthermore, it can be stipulated that the carrier may not be compressed more than 10% or 20% or 30%. If it is determined that the carrier would have to be stretched and/or compressed more than the maximum stretching value or the maximum compression value allows for a certain light distribution, additional optoelectronic components or fewer optoelectronic components can be planned on the carrier in order to achieve the maximum stretching value or the maximum compression value .not to exceed the maximum compression value.

In order to avoid wrinkling when the support is applied to the body, the support should have, in its unstretched state, dimensions smaller than the surface to which the support is to be applied.

If the three-dimensional surface of the body is concave, ie inwardly curved, a tool can be used to press the wearer against the surface to avoid wrinkling.

CAD (computer-aided design) software or ray tracing software can be used to calculate the placement of the optoelectronic components and the shape and/or course of the conductor tracks on the carrier be used.

The manufacturing method described for the optoelectronic device is inexpensive, since the carrier or the printed circuit board is in the flat state during the assembly of the optoelectronic components and standard methods for the printed circuit board production and assembly can therefore be used.

Furthermore, the carrier can adapt perfectly to the curved surface of the body, as a result of which good alignment and thermal coupling of the optoelectronic components is achieved.

In the event of incorrect assembly, the carrier with the optoelectronic components can be separated from the body again and replaced by another carrier.

The optoelectronic device has a high level of energy efficiency since it does not require any additional light absorbers in order to achieve the desired light distribution.

• 1 eine Darstellung einer optoelektronischen Vorrichtung gemäß einem Ausführungsbeispiel;
• 2A bis 2D Darstellungen eines Verfahrens zur Herstellung einer optoelektronischen Vorrichtung gemäß einem Ausführungsbeispiel;
• 3A eine Darstellung der Positionen von optoelektronischen Bauelementen auf einem ebenen Träger; und
• 3B eine Darstellung der Positionen der optoelektronischen Bauelemente nach dem Aufbringen des Trägers auf eine gekrümmte Oberfläche.

Exemplary embodiments of the invention are explained in more detail below with reference to the attached drawings. In these show schematically:

• 1 a representation of an optoelectronic device according to an embodiment;
• 2A until 2D Representations of a method for producing an optoelectronic device according to an embodiment;
• 3A a representation of the positions of optoelectronic components on a flat carrier; and
• 3B a representation of the positions of the optoelectronic components after the application of the carrier to a curved surface.

In the following detailed description, reference is made to the accompanying drawings which form a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. Because components of example embodiments can be positioned in a number of different orientations, the directional terminology is used for purposes of illustration and is in no way limiting. It is understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope. It is understood that the features of the various exemplary embodiments described herein can be combined with one another unless specifically stated otherwise. The following detailed description is, therefore, not to be taken in a limiting sense. In the figures, identical or similar elements are provided with identical reference symbols, insofar as this is appropriate.

1 shows a schematic cross-sectional view of an optoelectronic device 10, which has a body 11, a carrier with conductor tracks in the form of a printed circuit board 12, and a plurality of LEDs 13 designed as optoelectronic components.

The body 11 has a curved, three-dimensional surface 14 at its top, on which the circuit board 12 is fixed.

In order for the circuit board 12 to be mounted on the curved surface 14, the circuit board 12 is flexible and can be stretched and/or compressed at least in a direction parallel to its major surface. The elongation of the printed circuit board 12 is in 1 represented by arrows 15.

The LEDs 13 are mounted on the main surface of the circuit board 12 facing away from the body 11 .

2A until 2D show schematically a process for the production of in 1 illustrated optoelectronic device 10.

First, the circuit board 12 is provided, which in 2A shown in cross section. In this method step, the printed circuit board 12 is flat and, in particular, not bent and not stretched or compressed.

In an enlarged view, in 2A a section 20 of the printed circuit board 12 is shown in cross section. Furthermore, a section 21 of the printed circuit board 12 is shown enlarged in a plan view of the upper main surface of the printed circuit board 12 .

The circuit board 12 includes an electrically insulating base body 22 having adhesive thereon electrically conductive conductor tracks 23 and contact elements 24. The conductor tracks 23 and in particular the contact elements 24 can be mounted on both main surfaces of the printed circuit board 12 or only on one of the main surfaces.

The electrically insulating base body 22 is made from a material, for example TPU, which has the desired ability to be bent and stretched or compressed.

The conductor tracks 23 have a profile or a shape that allows for stretching and/or compression at least in a predetermined direction. As in the enlarged detail 21 in 2A is shown, the conductor tracks 23 can run in a meandering manner, at least in sections.

In 2 B the LEDs 13 are mounted on the circuit board 12, in particular soldered. During assembly, the printed circuit board 12 is flat and, in particular, not bent and not stretched or compressed. The LEDs 13 are arranged on the printed circuit board 12 in an irregular grid with different distances.

In 2C the printed circuit board 12 with the LEDs 13 mounted thereon is applied to the curved surface 14 of the body 11 and the shape of the surface 14 is adapted. Furthermore, the circuit board 12 is connected to the surface 14, for example by means of an adhesive. This becomes the in 2D optoelectronic device 10 shown obtained.

During the application of the printed circuit board 12 to the three-dimensional surface 14 of the body 11, the printed circuit board 12 is bent and stretched (see arrows 15), as a result of which the distances between the LEDs 13 change. The LEDs 13 can, for example, be mounted on the circuit board 12 in such a way that, after the circuit board 12 has been attached to the body 11, they have the same distances from the respective adjacent LEDs 13, so that a homogeneous light distribution is generated.

3A shows an example of the irregular positions of the LEDs 13 when mounted on a flat printed circuit board. The positions of the LEDs 13 are selected in such a way that the LEDs 13 are evenly distributed after the printed circuit board has been applied to the curved body and the printed circuit board 13 has been stretched, as shown in FIG 3B is shown.

Reference List

10

contraption

11

body

12

circuit board

13

LEDs

14

surface

15

arrow

20

cutout

21

cutout

22

base body

23

trace

24

contact element

Claims (16)

Optoelectronic device (10) comprising: a body (11) with a three-dimensional surface (14), a carrier (12) with conductor tracks, which can be bent at least in one area and can also be stretched and/or compressed and which is attached to the three-dimensional surface (14), and a plurality of optoelectronic components (13) which are designed to generate light and which are arranged on the carrier (12). Optoelectronic device (10) according to claim 1 , wherein the optoelectronic components (13) are arranged at predetermined distances from one another on the carrier (12). Optoelectronic device (10) according to claim 1 or 2 , wherein at least some of the optoelectronic components (13) have a defined distance from each other. An optoelectronic device (10) according to any one of the preceding claims, wherein the support (12) is attached to the three-dimensional surface (14) by means of an adhesive or a mechanical fastener. Optoelectronic device (10) according to one of the preceding claims, wherein the optoelectronic components (13) are soldered or glued to the carrier (12). Vehicle having an optoelectronic device (10) according to any one of the preceding claims. A consumer product comprising an optoelectronic device (10) according to any one of the preceding claims. Method for producing an optoelectronic device (10), wherein a body (11) with a three-dimensional surface che (14) is provided, a plurality of optoelectronic components (13), which are designed to generate light, arranged on a carrier (12) with conductor tracks, which is bendable in at least one area and also stretchable and/or compressible are, and the carrier (12) is applied to the three-dimensional surface (14). procedure after claim 8 , wherein the carrier (12) is stretched and/or compressed when the carrier (12) is applied to the three-dimensional surface (14). procedure after claim 9 , wherein a light distribution, which the optoelectronic components (13) are to generate after the application of the carrier (12) to the three-dimensional surface (14), is specified, the positions of the optoelectronic components (13) on the three-dimensional surface (14) being determined in order to generate the specified light distribution, and the positions of the optoelectronic components (13) on the flat carrier (12) then being determined in such a way that the optoelectronic components after the carrier (12) has been applied to the three-dimensional surface (14) assume the previously determined positions. Procedure according to one of Claims 8 until 10 , wherein the distance between adjacent optoelectronic components (13) of at least some of the optoelectronic components (13) before the application of the carrier (12) on the three-dimensional surface (14) and after the application is different. Procedure according to one of Claims 8 until 11 , wherein the distance between adjacent optoelectronic components (13) of at least some of the optoelectronic components (13) after the application of the carrier (12) to the three-dimensional surface (14) is greater than before the application. Procedure according to one of Claims 8 until 12 , wherein at least some of the optoelectronic components (13) are at a different distance from the respectively adjacent optoelectronic components (13) before the carrier (12) is applied to the three-dimensional surface (14) and after the application is at a defined distance from the respectively adjacent ones have optoelectronic components (13). Procedure according to one of Claims 8 until 13 , wherein the optoelectronic components (13) arranged in a first region of the carrier (12) have a higher density before the carrier (12) is applied to the three-dimensional surface (14) than the optoelectronic components arranged in a second region of the carrier (12). Components (13), and wherein the first area of the carrier (12) after the application of the carrier (12) to the three-dimensional surface (14) is stretched more than the second area of the carrier (12). Procedure according to one of Claims 8 until 14 wherein the carrier (12) is attached to the three-dimensional surface (14) by means of an adhesive or a mechanical fastener. Procedure according to one of Claims 8 until 15 , wherein the optoelectronic components (13) are soldered or glued to the carrier (12).

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