DE102020110070A1 - Electrical connection for connecting a thermocouple - Google Patents

Abstract

The invention relates to a connector device for electrically connecting a thermocouple, comprising two thermal contacts for connecting two thermocouple lines and only one additional transmission contact, in particular a spring contact, for transmitting data from and / or to an electronic storage device assigned to the thermocouple, in particular of a TEDS chip.

Description

The invention relates to a connector device for electrically connecting a thermocouple, an electrical connecting device for electrically connecting a thermocouple, an electrical system, a method for reading and / or writing to an electronic memory device assigned to a thermocouple, and a vehicle.

Thermocouples with two thermocouple lines (hereinafter also thermocouple lines) are known in principle.

The two thermal lines of a thermocouple can have different material pairings. Common metal combinations for detecting differential thermal voltages can be, for example, copper and constantan, iron and constantan, nickel and chromium-nickel, etc. When determining temperatures by means of thermocouples, the Seebeck effect is used. When connecting two different metals, a contact voltage is created at their contact points, which is temperature-dependent. A physical thermocouple consists of two of these points of contact. If there is no temperature difference between them, the two contact voltages cancel each other out. If the two connection points, mostly soldered or welded, have different temperatures, a thermal current flows as a result of a thermal voltage. This is what is known as the thermoelectric effect.

Usually, the thermocouple is connected directly to one another at its measuring point by connecting the relevant thermal line pair, while the ends of the thermal lines are connected to the so-called reference junction. A measuring device is connected to the reference junction via measuring lines, e.g. B. connected from copper. In order to be able to measure the temperature correctly, the temperature of the reference junction must be known. In addition, both measuring lines from the reference junction to the measuring device must be made of the same material in order to prevent the development of further thermal voltages.

A thermoelectric voltage arises when the connection point between the two different metals is at a higher or lower temperature than the ambient temperature. This creates a charge separation through the Seebeck effect, which is essentially a DC voltage source. The measuring thermal voltage is passed on with the same material as the respective thermal line to avoid new thermal voltages.

Thermocouples for measuring and recording temperature data are also known for motor vehicles. To simplify the acquisition and evaluation of the measurement data, it is also known to use TEDS chips (TEDS for: Transducer Electronic Data Sheet), which contain, for example, sensor information (s) such as installation location, installation date, measurement accuracy, calibration, etc. of the thermocouple, into the (or to be integrated close to the) thermocouples (for example in built-in plugs or cable plugs or sockets of the same). The sensor information stored in the TEDS chips then no longer have to be laboriously transferred to data sheets, but can be automatically taken into account when reading out the measurement data.

In DE 20 2018 102 895 U1 For this purpose, a plug of a thermocouple for temperature measurement is proposed, which has two transmission contacts for the thermal voltage and two spring contact pins with corresponding contact tips for data exchange with a TEDS chip.

By means of an adapter concept, a comparatively simple and compact temperature measurement should be made possible. In the DE 20 2018 102 895 U1 However, the proposed solution is viewed as comparatively complex and, in particular, prone to malfunctions (or failures).

It is therefore the object of the invention to propose a plug connection device for electrically connecting a thermocouple, which is comparatively simple and yet works reliably. A further object of the invention is to propose a corresponding electrical connection device for electrically connecting a thermocouple, an electrical system comprising an electrical connection device for connecting a thermocouple, a method for reading and / or writing to an electronic memory device assigned to a thermocouple, and a corresponding vehicle .

This object is achieved in particular by the features of claim 1.

In particular, the object is achieved by a connector device for electrically connecting a thermocouple, comprising two thermal contacts for connecting two thermocouple lines and only one (additional) transmission contact, in particular a spring contact for transmitting data from an electronic storage device, in particular a TEDS chip .

A first aspect of the invention is therefore to provide only one (additional) contact (transmission contact) for the connector device in order to transmit data to and / or from an electronic storage device (in particular TEDS chip) (assigned to the thermocouple).

With only one (single) contact (in particular spring contact) for data transmission, the overall space requirement for contacting can be reduced. If a single contact (spring contact), for example (protected), is placed in the middle of a socket between the two thermal contacts, the socket housing does not need to be enlarged and the socket is (fully) compatible with previous connection structures (or . Devices) can stay. Two (close) adjacent contacts (spring contacts), as described in the prior art, can also be short-circuited comparatively easily, for example by conductive liquids and / or metal chips. With two contacts (or spring contacts) the risk is also twice as great that one of the contacts (spring contacts) does not make proper contact or fails.

According to the invention, it was also recognized that it is possible to enable the necessary transmission of data from the electronic storage device with only one (independent or additional) transmission contact (spring contact). In a preferred embodiment, the electronic memory device can be connected to the (separate) transmission contact via one of the thermocouple lines, in particular the negative thermocouple line, or set (or grounded) accordingly to reference potential. The thermal contact, which is assigned to the corresponding thermocouple line (in particular the negative thermocouple line), preferably has a double function, namely on the one hand to connect the (negative) thermocouple line and on the other hand for data transmission in relation to the electronic storage device (especially TEDS chip). Furthermore, it is preferably possible to connect a thermal cable jacket screen to the one (separate) transmission contact and to use it for data transmission.

The above-mentioned object is also achieved (as an independent concept of the invention, but preferably as a further development of the first aspect) by a plug connection device for electrically connecting a thermocouple (preferably according to the first aspect), comprising two thermal contacts for connecting two thermocouple lines and at least one (or exactly one, additional) transmission contact, in particular a spring contact, for transmitting data from an electronic storage device (assigned to the thermocouple), the transmission contact being arranged between the thermal contacts.

According to a second aspect of the invention, it is proposed to arrange a (possibly the only independent) transmission contact, in particular a spring contact, between (and not next to) the thermal contacts. As a result, the (individual) transmission contact (spring contact) is protected between the thermal contacts and can, for example, be placed in the middle of a socket. Furthermore, due to such a (central) position of the transmission contact (TEDS spring pin contact), the transmission contact, for example when inserted into an assigned socket (as an example of a complementary plug-in device), is guided precisely to the mating contact located there on the socket and also comparatively reliably held (since no or comparatively low leverage forces occur). Contacts that are not in the center can lie at an angle, especially when spring forces push the plug out of the socket again.

An arrangement between the thermal contacts is preferably to be understood as meaning that the transmission contact is arranged in an area that lies between two parallels that (each) intersect the thermal contacts and perpendicular to a connecting line between the two thermal contacts stand (whereby the connecting line preferably represents a straight connection between the centroids of the thermal contacts in a plan view or in a view in the plugging direction). In a specific embodiment, the transmission contact can be on a / the connecting line between the thermal contacts or at least less far from this connecting line than the thermal contacts are from one another, preferably less than half as far from the connecting line how the thermal contacts are spaced from one another, even more preferably less than a quarter as far from the connecting line as the thermal contacts are spaced from one another.

The electronic storage device (in particular the TEDS chip) is preferably assigned to the thermocouple and can in particular be integrated into the thermocouple or be arranged within a corresponding assembly defining (or at least co-defining) the thermocouple, for example within a corresponding housing . According to the embodiment, the electronic storage device (the TEDS chip) can be in a thermocouple-side connection device (such as, for example Connection socket and / or connection plug or built-in plug or cable plug).

The electronic storage device (in particular the TEDS chip) can contain, for example, sensor information such as the installation location, installation date, measurement accuracy, calibration, etc. of the thermocouple.

The TEDS chip can comprise an EEPROM.

According to the embodiment, the connector device comprises exactly three electrical contacts, one contact (in particular the, preferably positive, thermal contact) being configured only to connect the corresponding thermocouple line, and another contact (in particular the additional transmission contact, in particular spring contact) only for Transferring data of an electronic storage device (in particular the TEDS chip) is configured and yet another contact (in particular the other of the two thermal contacts) is configured both for connecting a corresponding (in particular the negative) thermocouple line and (in particular as a connection to a reference potential) for data transmission in relation to the electronic storage device (in particular TEDS chip) is configured or can be used or is used.

If the electronic storage device (the TEDS chip) is integrated in a plug, it can in particular be a cable plug (as part of a thermocouple assembly).

Insofar as a plug is mentioned here and below, this should be understood as an abbreviation for a plug at one end of the cable or a (thermal) cable plug or a built-in plug (unless the context indicates something different). Insofar as a socket is mentioned, this is to be understood as an abbreviation for a coupling at one end of the cable (cable socket) or a socket that is permanently installed (again as long as nothing different emerges from the context).

In principle, the respective plug connection device (the plug connector) can only comprise female contacts, only male contacts or both (as long as nothing else results from the context).

Preferably, at least one of the (in particular both) thermal contacts comprises a (in particular stationary and / or flattened or rectangular or round, possibly circular or elliptical or oval in a cross section perpendicular to the plugging direction) pin or is formed by such a pin.

In particular, as part of a thermal socket, the respective thermal contact can be designed as a conductor strip (possibly arranged on a circuit board).

The transmission contact or at least one of the transmission contacts (if several should be provided) can comprise at least one spring contact pin or be formed by such a pin.

The plug connection device is preferably a plug connector. In specific embodiments, the plug connection device (the plug connector) can be a thermal plug or a thermal socket (in particular thus have exclusively male or exclusively female contacts). However, the plug connection device (the plug connector) can also have both male and female contacts. Preferably, under a plug connection device there is generally a device which is connected or can be connected to a complementary device by means of a plug connection.

The plug connection device preferably comprises the (electronic) memory device, in particular the TEDS chip. The plug connection device is then preferably designed as a cable plug or built-in plug or (built-in) socket or cable socket.

The above-mentioned object is also achieved by an electrical connection device for electrically connecting a thermocouple, comprising the plug-in connection device described above (and below) (according to the first and / or second aspect and possibly further aspects).

The above-mentioned object is also achieved in particular by an electrical connection device for electrically connecting a thermocouple, preferably comprising the above plug connection device (according to the first and / or second aspect and possibly further aspects), comprising two thermocouple lines and one (the two thermocouple Lines surrounding) thermal cable jacket shield, the thermal cable jacket shield being configured and connected in such a way that data between an electronic storage device, in particular a TEDS chip, and a data reading and / or data writing unit is unidirectional or bidirectional via the thermal cable jacket shield are communicable.

According to a third aspect of the invention, the thermal cable jacket screen is used to transfer data between electronic storage devices (or TEDS chip) and a data reading and / or data writing unit. As a result, the electrical connection structure can be implemented in a particularly simple manner. In particular, only three connections (contacts) are then required to connect a thermocouple equipped with a TEDS interface. Furthermore, a connecting line between the sensor (or the thermocouple) and a measurement system (or a measurement data processing unit) can be saved, which means a corresponding saving in costs. In particular, it is sufficient to use conventional thermocouples that are already shielded. The shield can then be used to connect the TEDS interface.

Overall, an electrical connection for a thermocouple (with an associated electronic storage device) can be established comparatively quickly or a corresponding electrical connection can be extended comparatively easily and quickly, since at least one line (possibly two lines if one of the thermocouple lines is used for data transmission or is used as a corresponding reference potential) less need to be connected / attached - especially if the shielding is contacted via a strain relief device - compared to a (conventional) use of two thermocouple lines and two data lines. In particular, there is no need to use a special cable with two thermocouple lines and two data lines, but an inexpensive (standard) cable with a screen or shield can be used. Furthermore, it was recognized according to the invention that an accuracy is not (decisively) influenced in the measuring operation. In particular, it is accepted according to the invention that a simultaneous reading out of TEDS data and a measurement by the thermocouple may not be possible.

In particular in combination with the first aspect, the third aspect offers a number of advantages or possibilities (or allows certain further developments). In principle, data (such as a measuring point name and / or a thermocouple type) can be stored in a TEDS chip, for example in the first plug-in connection device (as seen from the thermocouple itself). Data, such as a measuring point name and / or a thermocouple type, can be read from the TEDS chip by a measurement data acquisition system for the (fully automatic) configuration of the same. These advantages are particularly effective when a large number of measuring points have to be recorded and compared with a measurement data recording system. In the case of measurement tasks in vehicles in particular, this may involve a few tens to a few hundred (in numbers: 10 - 1000) measuring points.

Basically, the use of TEDS chips through a measurement data acquisition system for fully automatic configuration is the general state of the art. Due to the availability of only two lines, which virtually form a short circuit when measuring a thermocouple, this has so far only been achieved with additional data lines. The solution according to the invention offers the possibility of using shielded standard thermocouple cables, which require a significantly lower amount of work when wiring the measurement setup, which leads to lower costs and greater acceptance by the users. The general (and already known) advantages in the preparation and implementation of measurement tasks are still used, even in difficult environments.

The reference potential of the electronic memory device, in particular of the TEDS chip, is preferably connected to one (the) (in particular the negative) thermocouple line (s). In specific embodiments, the data line required for combination with the electronic storage device is implemented by the thermal cable jacket shield and the corresponding reference potential (the “earth”) is formed (or connected) by the negative thermocouple line. As a result, an electrical connection between the thermocouple and a measurement data processing unit and / or control unit can be implemented in a simple manner.

An electrical connection to the thermal cable jacket shield is preferably implemented via a strain relief device.

The above-mentioned object is further achieved by an electrical system comprising an electrical connection device of the above type (or with the above features) and an electronic storage device, in particular a TEDS chip, and / or a thermocouple and / or a data reading and / or data writing unit, preferably for reading out and / or writing data from or into the TEDS chip (generally electronic storage device), and / or a measurement data processing unit or measurement data evaluation unit.

The above-mentioned object is also achieved through the use of a thermal cable jacket screen and / or a negative thermocouple line for data transmission to and / or from an electronic storage device, in particular to and / or from a TEDS chip. The thermal cable jacket shield is preferably used as a data line and the negative thermocouple line as a reference potential line (grounding).

The above-mentioned object is also achieved by a method, preferably using the above connector device and / or the above electrical connection device and / or the above electrical system, for reading out and / or writing to an electronic memory device assigned to a thermocouple, in particular a TEDS assigned to a thermocouple Chips, whereby data is transmitted via a thermal cable jacket shield.

The above-mentioned object is also achieved by a vehicle, a test stand, an aircraft or another measuring point that can be measured with thermocouples, comprising the above plug-in connection device and / or the above electrical connection device and / or the above electrical system.

The vehicle preferably comprises at least 10, more preferably at least 100 measuring points (or thermocouples).

Further embodiments emerge from the subclaims.

In the following, the invention is also described with regard to further features and advantages using exemplary embodiments, which are explained in more detail using the figures.

• 1 eine schematische Darstellung eines Abschnitts einer elektrischen Verbindung zwischen einer Thermo-Messstelle und einer (nicht dargestellten) Messdatenverarbeitungs-Einheit;
• 2 eine vergrößerte Darstellung eines Steckers aus 1;
• 3 eine Draufsicht des Steckers aus 2;
• 4 eine Seitenansicht einer dem Stecker aus 2 zugeordneten Buchse in einer Messdatenverarbeitungs-Einheit;
• 5 eine Draufsicht der Buchse aus 4;
• 6 ein Blockschaltbild einer konventionellen elektrischen Verbindung zwischen Thermoelement bzw. TEDS-Chip und einer Messdatenverarbeitungs-Einheit;
• 7 ein erfindungsgemäßes Blockschaltbild analog 6;
• 8 ein Blockschaltbild einer TEDS-Schnittstelle; und
• 9 ein Schaltplan einer TEDS-Schnittstelle.

Here show:

• 1 a schematic representation of a section of an electrical connection between a thermal measuring point and a (not shown) measurement data processing unit;
• 2 an enlarged view of a connector 1 ;
• 3 a top view of the connector 2 ;
• 4th a side view of the connector 2 assigned socket in a measurement data processing unit;
• 5 a top view of the socket 4th ;
• 6th a block diagram of a conventional electrical connection between thermocouple or TEDS chip and a measurement data processing unit;
• 7th an analogous block diagram according to the invention 6th ;
• 8th a block diagram of a TEDS interface; and
• 9 a circuit diagram of a TEDS interface.

In the following description, the same reference numerals are used for parts that are the same and have the same effect.

1 shows a schematic representation of a thermocouple 10 and an electrical connector 12th to a socket 11 (in 1 only shown schematically, see 4th ), which can be arranged, for example, on or in a measurement data processing unit (not shown).

Via the thermocouple 10 can measure the temperature at a thermal measuring point 13th be measured.

The thermocouple 10 assigned (for example integrated into this) is a thermal plug 14th with a TEDS chip 15th . The thermal plug 14th can be designed as a (thermal) cable connector.

Furthermore, the thermal plug 14th two thermal contacts, namely a first thermal contact 16 and a second thermal contact 17th , on. The thermal contacts 16 , 17th are preferably designed as (fixed) contact pins. Also includes the thermal connector 14th a transmission contact 18th (which is preferably designed as a spring contact pin).

The thermal contacts 16 , 17th as well as the transmission contact 18th are with appropriate contacts 19th , 20th and 21 a thermal socket 22nd connected or connectable. The (transfer) contact 21 of the thermal socket 22nd for the data transmission of the TEDS chip is with a thermal cable jacket shield 23 (only indicated or shown schematically in 1 ) of a thermal cable 24 connected so that data of the TEDS chip 15th can be transferred. The thermal cable 24 further comprises a first thermocouple lead 25th and a second thermocouple lead 26th on to appropriately set the thermocouple 10 to be connected electrically. At the end of the thermal cable 24 there is a (further) thermal plug 27 , which has contacts, which preferably correspond to the thermal contacts 16 , 17th as well as the transmission contact 18th of the thermal plug 14th are trained.

In contrast to the thermal connector 14th however, the thermal plug 27 does not have a TEDS chip (which, however, could possibly be the case, e.g. if the thermal plug 14th does not have a TEDS chip).

The thermal plug 27 is in turn in the thermal socket 11 inserted or insertable. The thermal socket 11 is preferably, at least in terms of its contacts, corresponding to the thermal socket 22nd educated. Furthermore, the thermal Rifle 22nd if necessary, be arranged permanently integrated in a measurement data processing unit (not shown). A connection in the direction of the measurement data processing unit can be via a printed circuit board 28 (please refer 4th ) take place.

3 shows a front view of the thermal connector 27 (or the thermal plug 14th ). As can be seen, this is the transmission contact 18th between the thermal contacts 16 , 17th arranged and lies on a connecting line between the two thermal contacts 16 , 17th .

6th shows a block diagram of a conventional electrical connection device between thermocouples 10 and a measurement data processing unit 30th , comprising a data reading and / or data writing unit 31 as well as an AD converter 32 . A corresponding block diagram, but according to the invention, is shown in FIG 7th shown.

With the Thermo-TEDS measuring channel according to 6th four connections are used, two for the thermocouple connection (TC +/-) and two for the TEDS chip connection (GND and TEDS).

With the Thermo-TEDS measuring channel according to 7th only three connections are used, two for the TC connection (TC +/-) and only one for the TEDS connection. The TEDS reference ground is connected to the TC connection.

How to compare the 6th and 7th recognizes is the TEDS chip 15th in the conventional solution according to 6th via two separate connecting lines 40 , 41 connected (where the connecting line 40 a data line with the data reading and / or data writing unit 31 represents).

In contrast to this, according to the solution according to the invention 7th the TEDS chip 15th on the one hand via the thermal cable jacket shield 23 with the data reading and / or data writing unit 31 tied together. The reference potential, in turn, is with the first (negative) thermocouple line 25th tied together. At the in 1 and 7th The solution shown is preferably the negative thermocouple lead 25th (i.e. the negative branch of the entire thermocouple line) for the reference potential (earth) of the TEDS chip 15th utilized. The thermal cable jacket shield 23 is used for the data line of the TEDS chip 15th used, especially without affecting the thermocouple accuracy.

The AD converter 32 is an input filter 33 assigned.

The mode of operation of the concept according to the invention is illustrated below with the aid of examples (with corresponding numerical values). The individual numerical values are only exemplary in themselves.

An exemplary thermocouple 10 can supply voltages in the range from -10 mV to a maximum of 75 mV (depending on the thermocouple type).

To read in the thermocouple voltage, the analog-digital converter 32 (= ADC) can be used. This ADC has an absolute measuring range ((V_IN +) - (V_IN-)) between 0 V and its reference voltage V_REF.

$$\left(\text{V\_IN}+\right)-\left(\text{V\_IN}-\right)<\text{V\_REF/2}=\text{>V\_TC}<\text{0}$$

The 0 point of the ADC is at half the reference voltage V_REF / 2: $$\left(\text{V\_IN}+\right)-\left(\text{V\_IN}-\right)>\text{V\_REF / 2}=\text{> V\_TC}>\text{0}$$

$$\left(\text{V\_IN}+\right)-\left(\text{V\_IN}-\right)<\text{V\_REF / 2}=\text{> V\_TC}<\text{0}$$

In order to also measure the negative voltage from the thermocouple, a thermocouple input is then connected to V_REF / 2. This V_REF / 2 voltage can also be referred to as the common mode voltage V_CM.

A TEDS-EEPROM, such as B. the DS2431-A1 module from maxim integrated, has z. B. a nominal supply voltage at 5 V (between 4.5 V_MIN and 5.25 V_MAX).

• - Die Bezugsmasse des TEDS-Bausteins geht auf das TC--Potential („Draht 1“).
• - Das TC-Plus-Signal („Draht 2“) geht auf den TC+-Eingang (an einem Messkanal).
• - Der Schirm („Draht 3“) geht an den TEDS-Eingang/Ausgang am Messkanal.

If only three connections are available to connect the thermocouple and the TEDS chip together, it is proposed according to the implementation:

• - The reference ground of the TEDS module goes to the TC potential ("wire 1").
• - The TC plus signal ("wire 2") goes to the TC + input (on a measuring channel).
• - The screen ("wire 3") goes to the TEDS input / output on the measuring channel.

It can be problematic that the reference ground of the TEDS chip is set to TC- or V_CM (see 7th ) lies.

The nominal voltage on the TEDS chip is 5 V_NOM. An offset shift (level adjustment) of V_CM is preferably implemented on the TEDS signal in order to ensure that the TEDS chip functions. The level adjustment is preferably carried out in both directions: when reading (READ) and when writing (WRITE).

The TEDS chip or a corresponding TEDS interface should not have any additional noise cause on the TC measurement signal, so that the accuracy on the TC channel is independent of the TEDS chip.

The inputs TC + / TC- and / or TEDS are preferably permanently protected against overvoltages and against ESD.

• - einem ersten Level-Shifter in die Ausgangsrichtung vom TX-Signal zum TEDS-Signal: die Logikpegel werden von 0-3,3 V nach 1,25 V - 6,25 V angepasst.
• - einem zweiten Level-Shifter am TEDS-Eingang zum RX-Signal (mit Low-Pass-Filter): die Logikpegel werden von 1,25 V - 6,25 V nach 0 - 3,3 V angepasst.

The TEDS interface circuit (see 8th ) consists of two parts:

• - a first level shifter in the output direction from the TX signal to the TEDS signal: the logic levels are adjusted from 0-3.3 V to 1.25 V - 6.25 V.
• - a second level shifter at the TEDS input to the RX signal (with low-pass filter): the logic levels are adjusted from 1.25 V - 6.25 V to 0 - 3.3 V.

In 9 the circuit diagram of the TEDS interface is shown. The output resistor R _OUT preferably also protects the output circuit against overvoltages of up to 60 V on a permanent basis. At 60 V, 6.6 mA will flow through R _OUT = 9k1 ohms, and the resistor will see an output of 396 mW.

_{According to the design} , R OUT is a high power, anti-surge resistor from the RCS series by Vishay. In a 0805 housing, the component has an output of 400 mW.

With a high level, a maximum current flows (at the TEDS signal) of: $${\text{I.}}_{\text{OUT}}=5\text{V / 9k1}=\text{0}\text{, 55 mA}$$

A TEDS master preferably supplies at least 4 mA, with eight inverter stages preferably being used in parallel to then supply a total of 4.4 mA.

so dass: R_PULL-UP < 2,2k Ohm max für TEDSDuring a read cycle, the output is HIGH: the pull-up resistance is then: $${\text{R.}}_{{}^{\text{PULL-UP}}}={\text{R.}}_{\text{OUT}}/\mathrm{8th}=9\text{k1 / 8}=\text{1k14 ohms}\text{,}$$

so that: R _PULL-UP <2.2k Ohm max for TEDS

The input stage is preferably also permanently protected against 60V overvoltage.

With RIN = R _OUT = 9k1 Ohm, a maximum of 6.0 mA flows, which corresponds to a power of 329 mW.

Here, too, the same resistor is preferably used as for R _OUT (RCS series from Vishay).

For an input filter cut-off frequency, for example: $$\text{f}-\text{3dB}=\text{1/}\left(2\text{PI}\times \text{RC}\right)=175\text{kHz}$$

This frequency is preferably (far) above the TEDS bandwidth.

For the voltage supply, the following preferably applies on the TEDS side: Supply between 1.25 V and 6.25 V (with pseudo-ground at 1.25 V, based on the measurement channel ground)

The following applies for the power supply on the Rx / Tx side: supply between 0 V and 3.3 V.

A level shifter is preferably implemented from TX to TEDS via a first transistor circuit and from TEDS to RX via a second transistor circuit.

At this point it should be pointed out that all parts described above each individually - even without features additionally described in the respective context, even if these have not been explicitly identified individually as optional features in the respective context, e.g. By using: in particular, preferably, for example, e.g. B., possibly, round brackets, etc. - or in combination or any sub-combination are to be regarded as independent embodiments or further developments of the invention, as defined in particular in the introduction to the description and the claims. Deviations from this are possible. Specifically, it should be noted that the word in particular or round brackets does not identify any features that are mandatory in the respective context.

List of reference symbols

10

Thermocouple

11

Rifle

12th

Connecting device

13th

Thermal measuring point

14th

Thermo plug

15th

TEDS chip

16, 17

Thermal contacts

18th

Contact pin / transmission contact

19, 20, 21

contacts

22nd

Thermo socket

23

Thermal cable jacket shield

24

Thermal cable

25th

first thermocouple lead

26th

second thermocouple lead

27

Thermo plug

28

Thermo socket

30th

Measurement data processing unit

31

Data reading and / or data writing unit

32

amplifier

32

Analog-to-digital converter

33

Input filter

40

Connecting line

41

Connecting line

QUOTES INCLUDED IN THE DESCRIPTION

This list of the documents listed by the applicant was generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Patent literature cited

• DE 202018102895 U1 [0007, 0008]

Claims (13)

Plug connection device for electrically connecting a thermocouple, comprising two thermal contacts (16, 17) for connecting two thermocouple lines (25, 26) and only one additional transmission contact (18), in particular a spring contact, for transmitting data from one and / or the other or to an electronic memory device assigned to the thermocouple, in particular a TEDS chip (15). Plug connection device for electrically connecting a thermocouple, in particular according to Claim 1 , comprising two thermal contacts (16, 17) for connecting two thermocouple lines (25, 26) and at least one transmission contact (18), in particular spring contact, for transmitting data from an electronic storage device between the thermal contacts (16, 17) is arranged. Connector device according to Claim 1 or 2 , characterized in that at least one of the thermal contacts (16, 17) comprises an, in particular stationary, pin or is formed by such a pin. Plug connection device according to one of the preceding claims, characterized in that the transmission contact (18) or at least one of the transmission contacts (18) comprises a spring contact pin or is formed by such a pin. Plug connection device according to one of the preceding claims, characterized in that the plug connection device is a thermal plug or a thermal socket. Plug connection device according to one of the preceding claims, characterized in that the plug connection device comprises the memory device, in particular the TEDS chip (15). Electrical connection device for electrically connecting a thermocouple, preferably comprising a plug connection device according to one of the preceding claims, comprising two thermocouple lines (25, 26) and a thermal cable jacket screen (23), the thermal cable jacket screen (23) being configured and connected in this way that via the thermal cable jacket screen (23) data can be communicated unidirectionally or bidirectionally between an electronic storage device, in particular a TEDS chip (15), and a data reading and / or data writing device. Electrical connection device according to Claim 7 , characterized in that the reference potential of the electronic storage device, in particular of the TEDS chip (15), is connected to the negative thermocouple line (25, 26). Electrical connection device according to Claim 7 or 8th , characterized in that an electrical connection to the thermal cable jacket screen (23) is established via a strain relief device. An electrical system comprising an electrical connection device according to any one of Claims 7 until 9 and an electronic storage device, in particular a TEDS chip (15), and / or a thermocouple and / or a data reading and / or data writing device, preferably for reading and / or writing data from or into the electronic storage device, in particular from the or in the TEDS chip (15), and / or a measurement data processing and / or measurement data evaluation unit. Use of a thermal cable jacket screen (23) and / or a negative thermocouple line (25, 26) for data transmission to and / or from an electronic storage device, in particular to and / or from a TEDS chip (15). Method, preferably using a connector device according to one of the Claims 1 until 6th and / or an electrical connection device according to one of the Claims 7 until 9 and / or an electrical system Claim 10 for reading out and / or writing to an electronic memory device assigned to a thermocouple, in particular a TEDS chip (15) assigned to a thermocouple, with data being transmitted via a thermal cable jacket (23). Vehicle, preferably motor vehicle, comprising a connector device according to one of the Claims 1 until 6th and / or an electrical connection device according to one of the Claims 7 until 9 and / or an electrical system Claim 10 .

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