DE102020104648A1 - Process seal with integrated thermoelectric temperature measuring points and procedures for temperature determination and self-diagnosis - Google Patents

Abstract

The invention relates to a process seal for connections of pipe elements with integrated thermoelectric measuring points and a method for temperature determination and self-diagnosis. The object of the invention is to improve a process seal and a method for temperature determination and self-diagnosis. The object is achieved with regard to the process seal according to the invention by a process seal solved, which has a sealing ring (1), which has thermoelectric structures in a plane, which are formed several times asymmetrically circular or part-circular and consist of a first thermal material (a) and a second thermal material (b), which at least three thermocouples (T1 ... T5, Ti, Tu) with a known temperature-voltage dependency, the first thermal material (a) and the second thermal material (b) forming several thermal nodes (4) which are arranged in the circumferential direction of the sealing ring (1), and where electr cal connection lines (6) from the thermal node (4) parallel to the sealing ring (1) to a connection component (S) on the outer edge of the sealing ring (1) and from this to the outside and are electrically connected in parallel, series and / or differential circuits are, and there result combined thermoelectric voltage signals that are used for temperature measurement and / or error correction and / or self-diagnosis. With regard to the method, the object is achieved in that the sealing ring (1) has several thermal nodes (4.1 to 4.5) with which a mean temperature value on the inner pipe wall and / or a temperature difference between the upper side of the inner pipe and the lower side of the inner pipe and to the outer wall is determined.

Description

The invention relates to a process seal for connections of pipeline elements with integrated thermoelectric measuring points and a method for temperature determination and self-diagnosis.

There are numerous thermoelectric temperature measuring points in or on pipelines in the chemical industry, in mechanical engineering as well as in the food and pharmaceutical sectors.

With regard to the attachment or installation of the temperature sensors, a distinction is made between invasive and non-invasive sensors.

The invasive sensors protrude directly into the medium so that the sensor tip is touched directly by the gaseous or liquid medium. These sensors are called touch thermometers.

In general, these sensors have a so-called protective tube, which is inserted through a process connection into the pipeline and thus into the free flow cross-section of the pipeline. The temperature sensor of the temperature sensor is flowed around by the medium located within the pipeline. Therefore, a precise measurement of the media temperature can be made. However, the measuring sensor protruding into the free flow cross-section can negatively influence the flow behavior of the pipeline. The design and implementation of this type of measuring point is moreover very complex and extremely cost-intensive, especially when it is retrofitted.

For example, in DE 102 36 036 A1 describes a high-temperature sensor which has a protective tube and a process connection, a protective tube part containing the measuring element protruding into the medium and an outer protective tube part receiving the external connection lines. The medium, the temperature of which is to be determined, is located in a pipeline, for example. An electrical connection is the coupling point between the internal lines running in the housing and the external connection lines.

One of the many areas of application is exhaust gas temperature measurement, in which there are temperature measuring points with increased mechanical and thermal loads that occur, for example, in the exhaust ducts of internal combustion engines. The disadvantage here is that these temperature sensors cannot be used in narrow pipelines and, in particular, require a special process connection that penetrates the pipeline, such as a flange connection, etc. It is usually very disadvantageous if the temperature sensor protruding into the medium influences the flow.

In contrast to the invasive measuring arrangements, the non-invasive measuring points are easy to retrofit. They are implemented using so-called contact temperature sensors. They are used in particular when using pig cleaning technology and for measurements on narrow pipes. But they cause a higher temperature measurement error. To reduce the measurement error with clip-on sensors is off DE 102 27 454 A1 a temperature sensor is known in which a temperature sensor is arranged in a special contact part. The sensor has a contact part with a heat conducting foil.

In DE 10 2015 110 977 A1 a device is described in which a sensor is integrated in a sealing part. The sealing part can in particular be a sieve seal. In particular, it is disadvantageous that the sensor in the seal does not completely enclose the fluid line or the pipe and so measures very incorrectly in the case of asymmetrical flow profiles.

In DE 10 2007 006 521 A1 a flat gasket is presented in which a thin-film sensor is applied to a layer of material. The sensors are far away from the pipe opening and do not enclose it. Therefore, there is at least one measurement error that is noteworthy for the temperature measurement.

A seal with integrated temperature sensors is off WO 2015/147949 A1 known. The sensors inserted in the flat seal measure selectively and only record the temperature correctly if the flow is ideal, the measuring time is long and the measuring point is ideally isolated from the outside. Otherwise there will be measurement errors.

• - die Anordnung ist bruch- und abrasionsempfindlich, insbesondere bei Medien mit Feststoffanteilen,
• - die Anordnung ist nicht drucksicher,
• - die Anordnung besitzt keinen ausreichenden oder nur sehr kostenintensiven Isolationsschutz,
• - die Temperatur wird sehr ungenau gemessen und
• - Strömungs- bzw. Füllgradverhältnisse im Rohr werden nur unzureichend beachtet oder diagnostiziert.

In principle, the above-mentioned arrangements have one or more of the disadvantages listed below:

• - the arrangement is sensitive to breakage and abrasion, especially in the case of media with solids,
• - the arrangement is not pressure-proof,
• - the arrangement does not have adequate or only very costly insulation protection,
• - the temperature is measured very inaccurately and
• - The flow or degree of filling conditions in the pipe are only insufficiently observed or diagnosed.

The present invention is based on the object of improving a process seal of the type mentioned at the beginning and a method for determining temperature and self-diagnosis.

In particular, it should be possible to install the process seal in such a way that there is no reduction in the sealing property. In addition, it should be possible to monitor the temperature load on the seal and to correct the static thermal measurement error and / or check the pipe filling.

There should only be minor error influences due to pressure from both the medium and the fastening status (e.g. the flange fastening) and ultimately the assembly technology should be cost-effective.

The object is achieved by a process seal which has the features specified in claim 1. With regard to the method, the object is achieved with a method which has the features specified in claim 20.

Advantageous refinements are the subject of the subclaims.

The thermoelectric process seal according to the invention is installed at a connection point between two pipe elements, preferably between two flange halves.

The process seal has a sealing ring which is located between a connection between two pipeline elements of a pipeline, has electrically conductive structures which are circular or part-circular and made of a first thermal material a and a second thermal material b consists. The electrically conductive structures form at least three thermocouples with a known temperature-voltage dependency. The first thermal material a and the second thermal material b form several thermal nodes which are arranged in the circumferential direction on the sealing ring, with electrical connection lines of the thermal nodes being led to the outside in a connection component and electrically connected in parallel, series and / or differential circuits. The sealing ring can be surrounded by an insulating layer. The process seal can be used for flange seals and screw connections, such as B. connections with union nut can be used.

The process seal can be installed in a connection point in such a way that the sealing properties are not impaired. It is also possible to monitor the temperature load on the seal and to correct the static thermal measurement error and / or check the pipe filling. There are only minor errors caused by pressure, both from the medium and from the fastening status (e.g. the flange fastening). In addition, a cost-effective assembly technology is made possible.

In an advantageous embodiment, the sealing ring has electrically conductive structures, with a thermal material a or b in the inner pane area and the other thermal material b or a is arranged in the outer disk area of the sealing ring.

Versions are possible in which the inner pane area with the thermal material b is closed, as well as designs in which the inner pane area is divided.

An advantageous embodiment provides that three connections of the outer pane area of three thermal nodes, which are distributed at almost the same distance on a first half of the circumference, and from these material-specific connections to a connection element in the connection component, are guided.

Two further thermal nodes are arranged in a second half of the sealing ring, one thermal node being located in the upper part and the other thermal node being located in the lower part of the half-ring, and these thermal nodes also being connected to connection points in the connection component.

In a further advantageous embodiment, the conductor is divided on the inner disk area. In this case, three thermal nodes, which are connected to connection points in the connection component, are distributed almost equally spaced around the circumference on one half of the inner pane area. On the opposite half of the inner pane area, another thermal node is arranged at the bottom inside the pane. The thermal materials of the lower thermal nodes are connected to connection points in the connection component.

In a further advantageous embodiment, the connection lines from the connection point to the outer and inner pane area, on which thermal nodes, which are used for averaging, are designed with different widths, the length-to-width ratio being the same for the three thermal nodes, or for the Lines from connection points to the associated thermal nodes, the ratios of the average cross-section of the individual lines to their length are proportional.

It is also possible that the inner disk area and the outer disk area each consist of two half-rings which overlap in the area of the connecting component. in the In this connection component, the two thermoelectric half-rings are electrically connected, so that thermal nodes on one side of the pane area are electrically parallel to thermal nodes arranged on the other side of the pane area ( 4.4 , 4.5 ) are interconnected.

Another embodiment provides that the sealing ring consists of an elastic ring and a carrier disk inserted into it, the electrically conductive structures being arranged on the carrier disk. The elastic ring is located between two flange parts of a pipeline which are provided with flutes which correspond to the surface of the elastic ring. The elastic ring is made of silicone or Viton, for example. It can be sprayed onto the carrier disk.

Flange seals with elastic rings are preferably used in the food industry.

In an advantageous embodiment, the carrier disk consists of the second thermal material b and in the elastic ring there is a crimped ring made of the first thermal material a into which the carrier disk protrudes.

It is also possible for a disk material made of the first thermal material to be in the elastic ring a is located, which is in contact with the carrier disk.

In further advantageous embodiments, there is at least one insulated wire ring made of the first thermal material in the elastic ring a that is in contact with the carrier disk at the thermal node.

Designs are also possible in which there are several insulated wires made of the two thermal materials in the elastic ring a and b which are in contact with the carrier disk at offset thermal nodes.

In a further advantageous embodiment, the carrier disk consists of the first thermal material a and has a trough within the elastic ring in which at least one thermal conductor made of the second thermal material b runs and at one point a thermal knot with the material a forms.

In a further advantageous embodiment, the carrier disk is encapsulated with an electrically insulating material. The encapsulation has a bead-like thickening in the inner area, which forms the elastic sealing ring. The thermal wires form thermal nodes at several points, the connections of which are led to the outside.

It is also possible for the sealing ring to be designed in the form of a metallic hollow disk, which consists of an upper partial disk and a lower partial disk, which are connected by a web. In the hollow disk, thermoelectric structures are arranged, which consist of jacket thermocouples, the jacket thermocouples being attached to the hollow disk at discrete, spaced-apart locations.

In a further advantageous embodiment, the sealing ring consists of an outer carrier ring made of material with a low thermal conductivity and an inner carrier ring arranged concentrically therewith. Thermoelectric lines from thermocouples, the ends of which form thermal nodes, run between the carrier rings. The thermal nodes in the inner support ring are located in knobs that protrude into the inside of the pipe. The thermoelectric lines of the thermocouples are routed to the outside together at one point on the circumference of the sealing ring. The thermoelectric lines of the thermocouples are advantageously designed as sheathed thermocouples.

Metallic pins can be inserted into the knobs, one end of which protrudes into the interior of the tube and the other end is in contact with a thermal node.

In the method according to the invention, the disk has several thermal nodes with which an average temperature value on the inner pipe wall and / or a temperature difference between the upper side of the inner pipe and the underside of the inner pipe and to the outer wall is determined.

In an advantageous embodiment of the method, the mean temperature value on the inner pipe wall is determined with a parallel connection of the thermal voltages of three thermocouples with three thermal nodes, the mean temperature value at the connection points A. and B. , which are arranged in the connection component, is tapped.

Another embodiment provides that the thermal voltages of opposing thermal nodes are compared in order to determine a temperature difference on the upper and lower sides of the ring. Furthermore, thermoelectric conductor ends lying on the sealing ring at the electrical connection points can be linked in parallel and / or differential circuits, from which information on parameters inside the pipe can be obtained. This results in a parallel connection of the connection points B. and C. with the connection points B. and D. one on the tube half with two thermal nodes related voltage signal circuit, while the terminal pair A. and B. results in a voltage signal circuit related to the other pipe half with three thermal nodes and, overall, a comparison of the two voltage signal averages for the two pipe halves is made possible, with the connection pair continuing C. and D. forms a voltage difference and this represents a measure of the difference between the temperatures on the outer surface of the pipe and inside the pipe.

Furthermore, the connection lines of the differential-connected thermocouples can be attached to a sealing ring Ti and Do that go to the thermal node 4.i and 4.u belong to the connection points M. and N lead in the connection component and lead from these to the outside to an electronic component with correction electronics, the correction electronics both at the connection points A. and B. applied averaged voltage signals as well as that at the connection points M. and N pending differential voltage signal is detected and a correction signal is determined therefrom. Instead of the thermoelectric differential circuit of the thermocouples Ti and Do a signal difference can also be determined if Ti the inner thermocouple forms and instead of the thermocouple Do a resistance temperature sensor is used and the signals from Ti and the resistance temperature sensor can be evaluated as a differential signal.

Embodiments of the invention are explained in more detail below with reference to drawings.

• 1 eine Ausführung, bei der die innere Materialanordnung einen geschlossenen Ring bildet,
• 2 eine Ausführung mit geteilter inneren Materialanordnung,
• 3 eine Ausführung mit sich im Anschlussbereich überlappenden Scheibenthermoelementen,
• 4A bis 4E eine Ausführung mit einem elastischen Ring als Dichtung,
• 5 eine Ausführung mit umspritzter Trägerscheibe,
• 6 eine Ausführung mit elastischem Ring und Trägerscheibe mit vernetzten Thermodrähten,
• 7 ein Schaltungsbeispiel der elektrischen Leiterstrukturen,
• 8 eine Ausführung mit elastischem Ring und gelaserten Leiterstrukturen auf der Trägerscheibe,
• 9 eine Ausführung, bei der der Dichtungsring als metallische Hohlscheibe ausgebildet ist,
• 10 eine Ausführung mit konzentrisch angeordneten Trägerringen in einer Hohlscheibe und
• 11 eine Ausführung mit Noppen am inneren Trägerring, in denen metallische Stifte angebracht sind.

Show in it:

• 1 an embodiment in which the inner material arrangement forms a closed ring,
• 2 a version with a split inner material arrangement,
• 3rd a version with overlapping disc thermocouples in the connection area,
• 4A to 4E a version with an elastic ring as a seal,
• 5 a version with an overmolded support disc,
• 6th a version with an elastic ring and carrier disc with cross-linked thermal wires,
• 7th a circuit example of the electrical conductor structures,
• 8th a version with an elastic ring and lasered conductor structures on the carrier disk,
• 9 a version in which the sealing ring is designed as a metallic hollow disk,
• 10 a version with concentrically arranged carrier rings in a hollow disk and
• 11 a design with knobs on the inner support ring, in which metallic pins are attached.

Corresponding parts are provided with the same reference symbols in all figures.

According to 1 the flange seal has an outer disk area 2 with the thermal material a and an inner disk area 3rd with the thermal material b which thermocouples form with a known temperature-voltage dependence. The inner disc area 3rd with the thermal material b forms a completely closed ring in the embodiment shown here. The outer disc area 2 with the thermal material a consists of ring-shaped strips of different lengths, which are in different places with the thermal material b are connected. These connections form the thermal nodes 4th to 4.5 . There are three thermal nodes on the left 4th , 4.2 and 4.3 Almost equally distributed around the circumference. There are two thermal nodes on the right 4th and 4.5 above and below in the pipe wall or inside the pane. The internal resistances of the thermoelectric sensor sources are designed to be the same size in order to achieve an exact mean value formation. For this, the widths of the pane areas are 2 , 3rd , which each share one of the three thermocouples to be averaged T1 , T2 and T3 form, differently broad. The length-width ratio should be for the three partial thermocouples T1 , T2 , T3 be the same, so that the same resistances are set in the partial thermal circuits.

The disk assembly is covered with an insulating layer 5 Mistake. In the connection component S. the electrical connection cables 6th electrically passed on to evaluation electronics or to a transmitter arrangement. After isolating the pane assembly with one as an insulating layer 5 executed layer coating, this can be installed in a metallic seal holder. Such a design is particularly suitable for high-pressure systems.

In principle, there is also an increase in the number of thermal nodes 4th , 4.2 , 4.3 possible in the left-hand thermocouple arrangement.

The electrical connections of three thermal nodes 4th , 4.2 , 4.3 are in the connection component S. electrically brought together in such a way that a parallel connection is created. In this case the thermal voltage of the parallel connection represents the mean value of the three thermal nodes 4th , 4.2 , 4.3 determined temperatures.

How out 2 can be seen, the one-piece conductor arrangement according to 1 can also be made in two parts. In this case, the closed pane area on the inside is lost, but a two-part arrangement is more economical to install in a metallic seal holder. The division is made by separating electrical structures on the pane at the connection component S. opposite side reached.

On the left-hand side, the pane arrangement has a thermoelectric arrangement according to the one in FIG 1 execution shown. The right-hand arrangement has a thermoelectric differential arrangement, with a thermal node 4.i (eg on the underside of the pane) is arranged close to the inside of the pane and the second thermal node 4.u in the connection area that shows the ambient temperature T _u has, is located. The differential arrangement measures the temperature difference between the two thermal nodes 4.i and 4.u , ie the temperature difference T _i - T _u (Temperature difference between indoor temperature T _i and ambient temperature T _u ). Instead of the thermal knot 4.u of the thermocouple T _u a resistance temperature sensor can also be used and the signal difference of 4.i and the resistance temperature sensor.

This temperature difference is the cause of the static-thermal measurement error that occurs with disc thermocouples. Via a correction factor to be determined separately K this static-thermal measurement error can be approximately corrected. Provides T _K represents the corrected measured value, this is obtained on the basis of the existing measured values T ₁ , T ₂ and T ₃ from the relationship T _M = (T ₁ + T ₂ + T ₃ ) / 3 and (T _i - T _U ) according to T _K = T _M + K (T _i - T _U ), e.g. with K = 0.1.

This in 3rd The disk thermocouple shown consists of two parts, which are located in the area of the connection component S. overlap. In the connection component S. the two thermoelectric half-rings are electrically connected so that the thermocouple circuit on the left is electrically parallel to the thermocouple circuit on the right.

Since the thermocouple connections of the respective thermocouples also take place in parallel, i.e. three parallel left thermocouples and two parallel right thermocouples, a parallel overall connection is created and the temperature is averaged around the inner diameter.

However, it is also possible to evaluate the left and right thermocouple arrangements separately so that any horizontal or lateral temperature gradients in the pipe can be recognized.

In 4th an embodiment is shown in which an elastic sealing ring is used as the sealing element 7th is used. The elastic sealing ring 7th has a round cross-section. The flange parts, not shown here, between which the elastic sealing ring is located 7th are here provided with fillets that have the shape of the elastic ring 7th are adjusted. Such designs are common, for example, in the food industry.

When executing according to 4A is in the elastic sealing ring 7th an annular carrier disk 8th appropriate. The carrier disk 8th consists of the thermoelectric material a and is slotted several times. In discreet places it is in contact with a closed, flanged ring 9 from the thermal material b , with thermal nodes not shown here at these points 4th are formed. The crimped ring 9 is located inside the elastic ring 7th and the carrier disk 8th protrudes with its inner part into the elastic ring 7th into it. The carrier disk 8th is of an insulating layer 5 surround.

When executing according to 4B is located inside the elastic ring 7th the inner ring 3rd holding the carrier disk 8th from the material a touched in several places. The inner ring 3rd and the carrier disk 8th are connected by means of spot welds, the connection points being thermal nodes 4th form.

When executing according to 4C are located in the elastic ring 7th multiple thermal wires 10 from the first thermoelectric material a that came with a backing disk 8th from the thermoelectric material b be in contact at different points. It is also possible on the carrier disk 8th Sheathed thermal cables with internal thermal wires 10 from the thermal material a and thermal wires 11 from the thermal material b to attach, the ends of which are welded and thermal nodes not shown here 4th form.

When executing according to 4D are as with the execution after 4C on the carrier disk 8th Thermal wires 10 from the first thermal material a arranged. In addition, there are still on the underside of the carrier disk 8th more thermal wires 10 from the first thermal material a arranged and in several places on the carrier disk 8th spotted. Here too, on the carrier disk 8th Sheathed thermal cables with internal thermal wires made from the thermal materials a and b to be appropriate.

When executing according to 4E are inside the elastic ring 7th on the carrier disk 8th several thermal wires 10 from the first thermal material a arranged. In addition, there are still on one side of the carrier disc 8th Thermal wires 11 from the second thermal material b arranged. The thermal wires 10 are with thermal wires 11 connected in several places and form thermal nodes 4th .

5 explains an embodiment in which the carrier disk 8th an overmolding 5.1 made of an elastic, electrically insulating material. An elastopolymer is preferably used for this purpose. On the carrier disk 8th are fixed thermo wires, which on the carrier disk 8th run away. In the inner area of the disc 8th forms the encapsulation 5.1 a bead-like thickening that forms the elastic sealing ring 7th forms. The thermal wires form thermal nodes in several places 4th , their connections as sheathed thermocouples 12th in a radial slot 8.2 to be led to the outside.

In 6th an embodiment is shown in which the carrier disk 8th through the elastic sealing ring 7th is passed through and protrudes on both sides. The carrier disk 8th has an area with an annular depression embossing 8.1 on, which is inside the elastic ring 7th is located. In the hollow embossing 8.1 run thermal conductors made of the first thermal material a and the second thermal material b which thermal knot 4th form. The thermal conductors can be fixed with a good heat-conducting potting and adhesive compound. The carrier disk 8th has a radial slot at one point 8.2 through which the embedded thermal conductors are led to the outside.

7th shows one on the carrier disk 8th arranged electrical conductor structure made of cross-linked thermal wires.

The interconnection of the electrical conductors can be seen from the top view shown in the top view. The one on the carrier disk 8th attached conductors are made by means of electrical connection cables 6th to the connection component S. guided. From the connection point 6th leads a line to the inner ring area of the carrier disk 8th . This line consists of the thermal material a and is at four points with lines made of the thermal material b connected. These four lines are attached to the connection points 6.1 , 6.2 , 6.4 and 6.5 in the connection component S. guided. At the connection points 6th and 6.5 can be the temperature difference at the thermal node 4th and 4.5 which corresponds to the temperature difference between the upper and lower area of the process seal.

In the lower view the arrangement is shown in section.

In 8th is a version with an elastic sealing ring 7th and flat conductor structures on the carrier disk 8th shown.

The upper view shows the arrangement in section, the lower view is a plan view of the planar conductor structures on the carrier disk 8th shown.

The sealing ring 1 consists of an elastic sealing ring 7th attached carrier disk 8th , on which electrically conductive layers are applied. At the outer edge of the carrier disk 8th is the outer disc area 2 from the thermal material a . From this disc area 2 leads a connecting cable 6th to a connection point 6.11 in the connection component S. . The one to the connection point 6.11 leading line is on the outer edge of the carrier disk 8th with a piece of conductor made of the thermal material b connected to the connection point 6.12 leads. The connection point forms a thermocouple with which the outside of the carrier disk 8th existing temperature can be recorded. On the inner edge of the carrier disc 8th is the inner disc area 3rd from the thermal material b . The inner disc area 3rd is connected to a piece of conductor leading to a connection point 6.10 leads. The outer disc area 2 is at four points with the inner disc area 3rd connected, which are evenly distributed around the circumference. The connection points become the connection points with conductor pieces that are electrically insulated from one another 6th , 6.8 , 6.9 and 6.11 guided. These connection points each form thermocouples Ti . To reduce the heat transport, on the carrier disk 8th Drilling 8.3 to be appropriate. At the electrical connection points 6.11 and 6.12 the temperature at the connection area can be determined. From the value at the parallel connection of the connection points 6th , 6.8 , 6.9 , 6.11 compared to the value at the junction 6.10 the average temperature can be determined.

In 9 an embodiment is shown in which the sealing ring 1 as a metallic hollow disk 1.1 is trained. The hollow disk 1.1 consists of an upper dividing disk 1.1.1 and a lower graduated disk 1.1.2 by an annular ridge 1.1.3 are connected. The thermoelectric connection lines here consist of sheathed thermocouples 12th . They contain thermo wires in an insulating powder inside. The thermal wires are welded at their ends and form thermal nodes 4th to 4.4 , which are arranged isolated on a circular line at approximately equal intervals.

10 shows an embodiment in which the sealing ring 1 from a metallic hollow disk 1.1 consists in which there is an outer carrier ring 1.2 made of low thermal conductivity material and an inner support ring arranged concentrically to it 1.3 are located. Between the two carrier rings 1.2 and 1.3 run in an inner cavity Thermocouples T1 to T4 , the ends of which are thermal knots 4th to 4.4 form. The thermocouples T1 to T4 are as sheathed thermocouples 12th executed. The thermal knots 4th to 4.4 are inside the hollow disk 1.1 in knobs 1.3.1 arranged, which protrude into the pipe interior or they are arranged in blind bores. The thermocouples T1 to T4 are at one point on the circumference of the sealing ring 1 outwards together.

In 11 is a variant of the in 10 Shown embodiment shown. Here are located in the knobs 1.3.1 metallic pins 13th that protrude with one end into the pipe interior or into blind holes. The other end is with the thermal knot 4th electrically connected. The metallic pins 13th are preferably made of a good heat conducting steel, while the metallic hollow disk 1.1 consists of a poorly thermally conductive material.

List of reference symbols

1

Sealing ring

1.1

metallic hollow disk

1.1.1

upper dividing disk

1.1.2

lower dividing disk

1.1.3

web

1.2

outer carrier ring

1.3

inner carrier ring

1.3.1

Knobs

2

outer pane area

3

inner pane area

4, 4.1 ... 4.5, 4.i, 4.u

Thermal knot

5

Insulating layer

5.1

Encapsulation

6th

electrical connection cables

6.1 ... 6.12

electrical connection points

7th

elastic sealing ring

8th

Carrier disk

8.1

Embossing

8.2

radial slot

8.3

Drilling

9

crimped ring

10

Thermal wire ring made of the first thermal material a

11

Thermal wire ring made of a second thermal material b

12th

Sheathed thermocouple

13th

metallic pen

a

first thermal material

b

second thermal material

A, B

electrical connection point for average temperature value

C, D

electrical connection point for temperature differential values on the right

M, N

electrical connection point for temperature difference measurement (T _i - T _u ) = T _D

T1 ... T5, Ti, Tu

Thermocouples

TM

Medium temperature averaged

Ti

Internal temperature

Do

Ambient temperature

TK

corrected measuring temperature

TD

Difference temperature between T _u and T _i

K

Correction factor

S.

Connection component

QUOTES INCLUDED IN THE DESCRIPTION

This list of the documents listed by the applicant was generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Patent literature cited

• DE 10236036 A1 [0006]
• DE 10227454 A1 [0008]
• DE 102015110977 A1 [0009]
• DE 102007006521 A1 [0010]
• WO 2015/147949 A1 [0011]

Claims (24)

Process seal on pipeline elements with integrated thermal nodes (4.1 to 4.5) for temperature determination and self-diagnosis, characterized in that a sealing ring (1), which is located between a connection between two pipeline elements of a pipeline, has thermoelectric structures in a plane that are multiple asymmetrically circular or part-circular are formed and consist of a first thermal material (a) and a second thermal material (b), which form at least three thermocouples (T1 ... T5, Ti, Tu) with a known temperature-voltage dependency, wherein - the first thermal material (a ) and the second thermal material (b) form several thermal nodes (4) which are arranged in the circumferential direction of the sealing ring (1), wherein - electrical connection lines (6) from the thermal nodes (4) parallel to the sealing ring (1) to a connection component (S ) on the outer edge of the sealing ring (1) and outwards from it and in parallel, rows and / or differential circuits are electrically connected, and there result combined thermoelectric voltage signals that are used for temperature measurement and / or error correction and / or self-diagnosis. Process seal after Claim 1 , characterized in that the electrically conductive structures are formed by slot-shaped incisions on the sealing ring (1) to connecting lines (6), one thermal material (a or b) in the inner pane area (3) and the other thermal material (b or a) in the outer Disc area (2) of the sealing ring (1) are arranged. Process seal after Claim 2 , characterized in that from the outer pane area (2) connections from the thermal nodes (4.1, 4.2, 4.3), which are distributed at almost the same distance on a first half of the circumference of the inner pane area (3), to a connection point (A) in the Connection component (S) are guided, the inner pane area (3) with the thermal material (b) as a common thermoelectric conductor is connected to a connection point (B) in the connection component (S), from further thermal nodes (4.4) a conductor piece made of the second thermal material ( a) is guided to a connection point (C) in the connection component (S) and in a second half of the circumference part of the outer pane area (2) has a thermal node (4.5) diametrically opposite the thermal node (4.4) with a connection point (D) is connected in the connection component (S). Process seal after Claim 1 , characterized in that the inner disk area (3) is divided, with three thermal nodes (4.1, 4.2, 4.3) being distributed at almost the same distance on one half of the inner disk area (3) and with connection points (A, B) in the Connection component (S) are connected and in the opposite half of the inner pane area (3) a further thermal node (4.i) at the bottom inside the pane and in the connection component (S) a further thermal node (4.u) or a temperature measuring resistor are arranged, the Lead connection lines (6) of the associated thermocouples (Ti, Tu) or the temperature measuring resistor to connection points (M, N) in the connection component (S) and the connection points (A; B; M; N) are connected to an electronic component arranged outside the process seal. Process seal according to one of the preceding claims, characterized in that the pane areas (2, 3), on which three thermal nodes (4.1, 4.2, 4.3) are arranged for averaging close to the outer wall, are of different widths, the length-to-width ratio is the same for the three thermal nodes (4.1, 4.2, 4.3). Process seal according to one of the preceding claims, characterized in that the inner pane area (3) and the outer pane area (2) each consist of two half-rings which overlap in the area of the connection component (S), with a thermoelectric circuit in the connection component (S) of the two thermoelectric half-rings, so that thermal nodes (4.1, 4.2, 4.3) on one side of the pane area (2, 3) are electrically connected in parallel to the thermal nodes (4.4, 4.5) arranged on the other side of the pane area (3, 2). Process seal after Claim 1 , characterized in that the process seal consists of an elastic ring (7) and a carrier disk (8) inserted therein, with thermoelectric structures being arranged on the carrier disk (8) which are located above or within the elastic ring (7) and the elastic ring (7) is located between two pipe elements which are provided with flutes which correspond to the surface of the elastic ring (7). Process seal after Claim 7 , characterized in that the carrier disk (8) consists of the thermoelectric material (a), is slotted several times and is connected at discrete points in the form of thermal nodes (4) with a closed, crimped ring (9) made of the thermal material (b), wherein the crimped ring (9) is located inside the elastic ring (7) and the inner part of the carrier disk (8) protrudes into the elastic ring (7). Process seal after Claim 7 , characterized in that the carrier disk (8) from the second thermal material (b) and in the elastic ring (7) a ring (9) made of the first thermal material (a) is arranged, into which the carrier disk (8) protrudes. Process seal according to one of the Claims 1 to 9 , characterized in that the electrical connection lines (6), which lead from thermal nodes (4) to connection points (A, B), each have an approximately equal ratio of cross-sectional area to line length. Process seal after Claim 7 , characterized in that there are multiple thermo wires (10) made of the first thermoelectric material (a) in the elastic ring (7), which are in contact with a disk made of the second thermoelectric material (b). Process seal after Claim 7 , characterized in that in the elastic ring (7) there are several wires made of the two thermoelectric materials (a, b) which are mechanically fixed on the carrier disk (8). Process seal after Claim 7 , characterized in that the carrier disk (8) consists of the second thermoelectric material (b) and has a trough in the elastic ring (7) in which the thermoconductors from the first thermal material (a) run and at intervals with the carrier disk (8 ) are connected by thermal nodes (4). Process seal after Claim 9 characterized in that the carrier disk (8) has an encapsulation (5.1) made of an electrically insulating material, which has a bead-shaped thickening in the inner area, which forms the elastic sealing ring (7), the thermal wires (10, 11) at several points Form thermal nodes (4), the connections of which are led to the outside. Process seal after Claim 7 , characterized in that the sealing ring (1) is designed as a metallic hollow disk (1.1) which consists of an upper partial disk (1.1.1) and a lower partial disk (1.1.2) which are connected by a web (1.1.3) are arranged in the thermoelectric structures which consist of jacket thermocouples (12), the jacket thermocouples (12) being attached to the hollow disk (1.1) at discrete, spaced-apart locations. Process seal after Claim 15 , characterized in that the ratios of conductor cross-section to conductor length of the inner conductors of the sheathed thermocouples (12), which lead from the connection points (6.7 ... 6.12) to the respective thermal nodes (4), are almost the same. Process seal after Claim 16 , characterized in that an outer carrier ring (1.2) made of material with low thermal conductivity and an inner carrier ring (1.3) arranged concentrically therewith are arranged in the hollow disk (1.1), between which thermocouples (T1 ... T4) run, the ends of which are thermocouples ( 4.1 ... 4.4), the thermal nodes (4.1 ... 4.4) being arranged in the web (1.1.3) in knobs (1.3.1) which protrude into the inside of the pipe and the thermocouples (T1 ... T4 ) are guided outwards together at one point on the circumference of the sealing ring (1). Process seal after Claim 16 or 17th , characterized in that the thermocouples (T1 ... T4) are designed as jacket thermocouples (12). Process seal after Claim 17 or 18th , characterized in that metallic pins (13) with good thermal conductivity are inserted into the knobs (1.3.1), one end of which protrudes into the interior of the tube and the other end in contact with a thermal node (4.1 ... 4.4) or blind bores are arranged in the knobs (1.3.1) into which the jacket thermocouples (12) and / or the metallic pins (13) protrude. A method for determining the temperature and self-diagnosis on a seal in pipelines with a sealing ring (1) with integrated thermal nodes (4.1 to 4.5), characterized in that the sealing ring (1) has several thermal nodes (4.1 to 4.5) with which an average temperature value at the inner pipe wall and / or a temperature difference between the upper side of the inner pipe and the underside of the inner pipe and to the outer wall is determined. Procedure according to Claim 20 , characterized in that the average temperature value on the inner pipe wall is determined with a parallel connection of the thermal voltages of at least three thermocouples (T) with the thermal nodes (4.1, 4.2, 4.3), the average temperature value being taken at connection points (A, B) which are arranged in a connection component (S). Procedure according to Claim 20 , characterized in that the thermal voltages from opposite thermal nodes (4.1 and 4.4) or the signal of a thermocouple (Ti) are compared with the signal of a temperature measuring resistor to determine a temperature difference on the upper and lower side of the sealing ring (1). Procedure according to Claim 20 , characterized in that on a sealing ring (1) according to Claim 6 to the electrical Connection points (A, B, C, D) adjacent thermoelectric conductor ends are linked in parallel and / or differential circuits, from which information on parameters inside the pipe is obtained, whereby a parallel connection of the connection points (B, C) with the connection points (B, D ) results in a voltage signal circuit related to the pipe half with the thermal nodes (4.4 and 4.5), while the connection pair (A, B) results in a voltage signal circuit related to the pipe half with the thermal node (4.1, 4.2, 4.3) and, overall, a comparison of the two voltage signal averages is made possible for the two pipe halves, the connection pair (C, D) also forming a voltage difference and this represents a measure of the difference between the temperatures on the outer surface of the pipe and inside the pipe. Procedure according to Claim 20 , characterized in that on the sealing ring (1) according to Claim 4 the connection lines of the differential thermocouples (Ti and Tu), which belong to the thermal nodes (4.i and 4.u), lead to the connection points (M and N) in the connection component (S) and from these to the outside to an electronic component with correction electronics, the correction electronics detecting both the averaged voltage signals present at the connection points (A and B) and the differential voltage signal present at the connection points (M and N) and determining a correction signal therefrom.

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