DE102019220629A1 - MOLD DETECTOR WITH ELECTROMAGNETIC SHAFTS - Google Patents

Abstract

A mold sensor is configured with a closed chamber in which a nutrient-treated substrate is positioned. The mold sensor includes an optical sensor that is configured to measure optical properties in the closed chamber. A controller operates the optical sensor and is programmed such that it detects the presence of mold growing in the chamber on the basis of the optical properties measured by the optical sensor.

Description

TECHNICAL AREA

This application generally relates to an integrated sensor for detecting mold in an environment.

BACKGROUND

Mold or mold can be a serious problem in many environments. Prolonged contact with mold can lead to health problems. Excessive mold growth can lead to staining or deterioration of the surface of a structure. In addition, the presence of mold can indicate a moisture problem in the structure. Often there can be a problem with mold for some time without being detected. In some cases, the growth of mold is clearly visible and can be detected by a visual inspection. In many cases the mold is present, but not easily visible to an observer. Ideally, it would be desirable to detect mold before it can cause health or structural problems.

Mold spreads through the release of spores in the air. The mold spores can grow if they land on a medium where the conditions are suitable for growth. Suitable conditions for growth include an appropriate level of nutrients, water, and a balanced pH. Mold spores that do not land on such a medium can remain inactive and be transported by air. In most cases, mold spores can be found in the air in a certain concentration. Problem areas can have a higher concentration of mold spores.

A typical method for detecting mold is to take a surface or air sample from an affected area. The particles can collect or be placed on a slide. An expert can view the slide through a microscope to identify mold and can determine the mold concentration and the types of mold present. These procedures usually require taking the sample and sending it back to a laboratory that has expertise in mold detection. Such procedures tend to be labor intensive and rather expensive. It may also take some time for the results to be available. The previous methods do not allow continuous sampling or scanning of an area or an area.

SUMMARY

A mold detection device may include a detection device that detects mold using electromagnetic waves. In some configurations, the electromagnetic waves can be light waves (optical). In some configurations, the detector includes an integrated source and a receiver. In some configurations, the detector includes a separate source and receiver. In some configurations, the detector is configured to detect electromagnetic waves that are reflected from a growth surface. In some configurations, the detector is configured to detect electromagnetic waves that are transmitted through the growth surface. The detector can be configured to measure a vertical growth distance from mold growing on the growth surface.

A mold sensor includes a housing that defines a chamber and a substrate that treats mold growth and is exposed within the chamber. The mold sensor includes an optical source located in the chamber and configured to direct light onto the substrate and an optical sensor located within the chamber and configured to receive light from the optical source from the substrate is reflected, and provides optical data indicating one or more optical properties. The mold sensor includes a controller that is programmed to drive the optical sensor, receive the optical data from the optical sensor, and output a signal that indicates mold growth on the substrate based on the optical data.

The optical source and the optical sensor can be integrated as one unit. The optical source and the optical sensor can be attached to opposite side walls of the housing. The optical source and optical sensor can be mounted on a top cover of the housing that is generally parallel to the substrate. The optical data can contain color information. The substrate can be treated with a pH indicator that changes color when a pH value that is characteristic of the substrate changes due to mold formation, ie growth. The controller may be further programmed to identify a color of the mold growing on the substrate and to generate the signal indicating mold growth based on the color. The optical sensor can consist of an arrangement (an array) of photodiodes. The optical source can be a laser and the optical sensor can be a or multiple photodiodes, and the controller may further be programmed to estimate out-of-plane growth on the substrate by detecting a time shift between a drive signal provided at the optical source and corresponding optical data from the optical sensor measures. The controller may also be programmed to generate the signal based on changes in intensity observed in the optical data from the optical sensor. The controller may also be programmed to generate the signal by comparing baseline feedback measured prior to mold growth with the optical data received during mold growth. The optical source may consist of one or more monochromatic optical lasers, and the optical sensor may be an optical spectrometer configured to provide optical data including a signature of fluorescence spectra, and the controller may also be programmed to do so Signal generated based on the signature of fluorescence spectra.

A mold sensor includes a housing that defines a chamber and a substrate that treats mold growth and is exposed within the chamber. The mold sensor contains an optical source that is coupled in the chamber and configured to direct light onto the substrate. The mold sensor includes an optical sensor attached to a frame below the substrate and configured to receive light from the optical source that passes through the substrate and to provide optical data indicative of one or more optical properties. The mold sensor includes a controller that is programmed to drive the optical sensor, receive the optical data from the optical sensor, and output a signal that indicates mold growth on the substrate based on the optical data.

The optical sensor may be configured to identify a wavelength of light passing through the substrate, and the controller may be further programmed to generate the signal based on a change in wavelength. The optical sensor can include a plurality of photodetectors, each of the photodetectors being tuned to a predetermined wavelength range. The controller may also be programmed to generate the signal by comparing pre-mold optical baseline data to optical data measured during a mold detection cycle.

One method includes driving, by a controller, an optical source coupled into a housing defining a chamber and directed onto a nutrient-treated substrate to project light waves onto the nutrient-treated substrate. The method includes receiving, by the controller, optical data from an optical sensor that indicates one or more optical properties that represent an interaction of the light waves with the nutrient-treated substrate. The method includes outputting, by the controller, a signal based on the optical data indicating mold growth on the nutrient-treated substrate.

The interaction may consist of one or more reflections of the light waves from the nutrient-treated substrate, absorption of the light waves by the nutrient-treated substrate, and scattering of the light waves from the nutrient-treated substrate. The interaction i.e. Interaction can be a transmission of the light waves that pass through the nutrient-treated substrate. The method may further include estimating out-of-plane growth on the nutrient-treated substrate by measuring a time shift between a signal that drives the optical source and the corresponding optical data.

Figure list

• 1 shows a single-chamber mold sensor configuration with an integrated sensor module.
• 2nd shows a single-chamber mold sensor configuration with a multi-part sensor.
• 3rd shows an alternative configuration of a single-chamber mold sensor with an integrated sensor.
• 4th shows an alternative configuration of a single-chamber mold sensor with a multi-part sensor.
• 5 shows an example of a multi-chamber mold sensor configuration.
• 6 Figure 12 shows an example of a single chamber mold sensor configured to expose a surface to airflow outside the single chamber.
• 7 Figure 10 shows a second example of a single chamber mold sensor configured to expose a surface to the airflow outside the single chamber.
• 8th shows a growth area with strips of various nutrient treatments.
• 9 shows a growing area with alternating sections of surface types.
• 10th shows a growth area with areas of different nutrient treatment.
• 11 shows an example of a tape-based surface exchange mechanism.
• 12A and 12B show different views of a drum-based surface accumulation mechanism.
• 13A shows an example of a disk-based surface accumulation mechanism.
• 13B shows an example of a disk configuration for the disk-based surface exchange mechanism.
• 14 shows a possible configuration for a capacitive type sensor for detecting mold on a growth surface.
• 15 shows a possible configuration for a growth surface with integrated electrical contacts.
• 16 shows an example of a growth area with conductive strips.
• 17th shows an example of a role-based electrical contact for interaction with conductive strips of a growth surface.
• FID. 18A and 18B show different views of an electrode-based electrical contact for interacting with conductive strips of a growth surface.
• 19th shows an example of a growth surface configured to measure and control the pH of the growth surface.
• 20 shows a mold sensor system with mold sensors and a communication network.
• 21 shows a flowchart for a possible sequence of operations for the operation of the mold sensor.

DETAILED DESCRIPTION

Embodiments of the present disclosure are described here. However, it should be noted that the disclosed embodiments are merely examples and other embodiments may take various and alternative forms. The illustrations or illustrations are not necessarily to scale; some features may be exaggerated or minimized to show details of certain components. Therefore, the specific structural and functional details disclosed here should not be interpreted as a limitation, but merely as a representative basis for the instruction of an average person skilled in the art to use the embodiments in different ways. As those of ordinary skill in the art will appreciate, various features illustrated and described with reference to one of the figures can be combined with features illustrated in one or more other figures to produce embodiments that are not explicitly illustrated or are described. The combinations of the features depicted provide representative embodiments for typical applications. However, various combinations and modifications of the features consistent with the teachings of this disclosure may be desired for certain applications or implementations.

An improved way of detecting mold can be an integrated detection device that can detect the presence of mold without the need to send a sample to a laboratory. Another advantage of an integrated sensor is that the mold sensor can be attached to one location in order to continuously monitor the location. This can raise an alarm if mold growth becomes a problem. Here, a mold sensor is disclosed that is configured to take an air sample and detect a mold concentration in the air. The mold sensor can be configured to create a small, enclosed environment that encourages mold growth. Mold growth can be detected in different ways.

In this application, general configurations and structural elements for a mold detection device are first disclosed. Subsequently, specific technologies and strategies for mold detection are disclosed that are applicable to the general configurations. Various operating modes and strategies are then disclosed. A mold detection system can include a variety of mold sensors. The mold sensor can have a common construction with communication capability. The mold detection system may include a reference mold sensor and a target area mold sensor. The reference mold sensor can provide information about the mold concentration that is expected in the environment (e.g. outdoors). The target area mold sensor can provide information about the mold concentration in a certain area (e.g. basement, living room). The mold sensor system can include results from multiple sensors to accurately determine mold concentrations in the target area.

1 shows a diagram of a configuration for a first mold sensor configuration 100 . The first mold sensor configuration 100 can be a housing 102 contain that one chamber 103 Are defined. The housing 102 can define a bottom opening to a surface within the chamber 103 to expose (e.g. the case 102 no floor on). The housing 102 can be made from plastic, metal and / or other suitable materials that do not outgas or otherwise do not promote the growth of mold / bacteria. The surfaces of the case 102 that are inside the chamber 103 can be coated with a layer to prevent or inhibit mold growth (eg alkaline coating with pH> 7). The shape of the case 102 is shown as a cube, but can also be shaped differently. The specific shape of the case 102 may depend on other mechanisms attached to the case 102 are coupled.

The first mold sensor configuration 100 can be an air entry portal 104 contain. The air intake portal 104 can be configured to have an airflow path 106 into the chamber 103 is defined in it. In some configurations, the case 102 define an opening that acts as an air entry portal 104 acts. In some configurations, the air entry portal 104 be configured so that it opens and closes selectively. For example, a movable grille or door can be placed over an opening made through the housing 102 is defined. The movable grille or door can be electrically moved to an open or closed position by a solenoid valve. A spring mechanism can hold the movable grille in a normally closed position. The solenoid valve can be controlled by a control device 116 be operated. The movable grille or the door can be operated electrically, magnetically or mechanically. Some configurations can have an airflow sensor 119 to determine the air flow into the chamber 103 included in it. The airflow sensor 119 can be electrically connected to the control device 116 be coupled. The airflow sensor 119 is not shown in all configurations, but can be installed in the other configurations described here.

The tax direction 116 may be a controller that includes a processing unit and non-volatile and volatile memory. The controller can be programmed to perform various operations related to the operation of the mold sensor. The control device 116 can also contain all electrical interfaces for the interaction, ie interaction with the actuators and sensors belonging to the mold sensor. In addition, the control device 116 include a network interface for accessing networks. The network interface can be wired and / or wireless. The network interface can provide a communication path for access to the Internet / World Wide Web. The control device 116 can on the housing 102 be attached.

The first mold sensor configuration 100 can also be a growing area 112 contain. The growth surface 112 can be a surface inside the chamber 103 exposed and suitable for mold formation. In some configurations, the growing area 112 the air outside the chamber 103 be exposed. For example, the growing area 112 the environment outside the chamber 103 suspended for air sampling, followed by movement of the growing area 112 into the chamber 103 for mold formation. The air intake portal 104 can be configured so that the air flow path 106 is defined so that the air on the growing area 112 is directed. The growth area 112 can be configured as a surface that favors the capture of mold spores from the air. The growth area 112 can be configured as a medium suitable for promoting mold growth. The growth area 112 can be treated with nutrients that promote mold growth. The nutrients can include, for example, organic materials, salt, agar and / or sugar. The growth area 112 can also be configured to provide sufficient moisture to promote mold growth, or can be packaged to maintain moisture until use. The growth area 112 may contain antibacterial chemicals or treatments that prevent bacteria from growing. The growth surface 112 can be a band, a membrane or a filter. The tape, membrane or filter can be treated with various substances to promote mold growth. The tape, membrane or filter can be air permeable or non-air permeable. One or more temperature and humidity / moisture sensors can be placed in the growing area 112 be integrated to enable the monitoring of the mold growth environment.

The specific conditions for promoting mold growth may depend on the type of mold that is to be grown, that is, grown on. Different molds may prefer a different nutrient environment. The growth area 112 may also include areas (eg, strips) that are required for growth different types of mold are configured. For example, any area of the growth surface 112 treated with a different nutrient mixture that promotes the growth of another type of mold. An advantage of this configuration is that the existing mold types can be identified by monitoring mold growth in each of the areas.

The first mold sensor configuration 100 can be a detection device 110 included that is configured to detect mold growth on the growth surface. The placement of the registration device 110 can depend on the type of measurement performed. In addition, the orientation of the detection device 110 relative to the housing 102 on the type of detection device 110 depend. For example, shows 1 the detection device 110 that are at an angle relative to the housing 102 is appropriate. Some detector configurations may work better when on or through the growing area 112 are directed. For the detection device 110 a variety of technologies are available. The detection device 110 can be electrical with the control device 116 be connected. The detection device 110 can be contained in a single module that comes with the housing 102 connected is. Some sensor configurations (e.g. optical or audio) can use a source module and a receiver module. The detection device 110 can integrate the sources and receiver modules in a single unit. In some configurations, the detector 110 Multiple sensing devices of the same or different technology are included in different locations within the housing 102 are arranged. Different configurations of the detection device 110 are disclosed here.

The first mold sensor configuration 100 can be a mold suppressant 108 included that is configured to destroy the mold. The mold suppressant 108 can on one side of the case 102 be attached. The mold suppressant 108 can be, for example, one or more UV light sources. The mold suppressant 108 can be, for example, a single UV light source or a series of UV light sources. The UV light source can be a source that illuminates a divergent beam that covers the entire growing area 112 that in the chamber 103 is exposed, can illuminate. The UV light source can be a UV source with a beam divergence component that enlarges the UV beam so that the entire growth area 112 that in the chamber 103 is exposed, can be illuminated. The mold suppressant 108 can be a uv light source with a driver to drive the uv light source over the growing area 112 that is exposed in the chamber to strip. In addition, the mold suppressor 108 Configured to have mold on other chamber surfaces 103 (e.g. the inside walls) and the air inlet opening 104 destroyed. The mold suppressant 108 can by the control device 116 be operated electrically. The mold suppressant 108 can be operated for a predetermined period of time to destroy grown mold. The control device 116 can the mold suppressor after completing a measurement cycle 108 Activate to destroy the mold that has grown during the measuring cycle. The mold suppressant 108 can destroy mold in the chamber 103 are pressed to define an initial state (baseline state) before the start of a measuring cycle.

The first mold sensor configuration 100 can also have a surface exchange mechanism 114 included that is configured to cover the growth surface 112 supports or holds and the exchange of the growth surface 112 facilitated. In some configurations, the growing area 112 on the surface exchange mechanism 114 be attached. The surface exchange mechanism 114 can be configured to selectively attach to the chassis 102 can be coupled. After completing a measurement cycle, the growth surface 112 be exchanged to enable a further measuring cycle. The surface exchange mechanism 114 can on the housing 102 attached and detached from this to the growing area 112 to switch if desired. The housing 102 can define an opening on a floor area to the growth area 112 the chamber 103 exposed when the surface exchange mechanism 114 to the housing 102 is coupled. In some configurations, the case 102 be constructed without floor space.

In some configurations, the growing area 112 be agile and the surface exchange mechanism 114 can be configured so that the growing area 112 is moved to a different position. The surface exchange mechanism 114 can be configured to include sections of the growing area 112 stores that are not currently in the housing 102 exposed. The stored sections may include an unused section and a used section. The surface exchange mechanism 114 can be configured to operate electrically / mechanically and electrically with the control device 116 can be coupled. Different configurations of the surface exchange mechanism 114 are discussed in more detail in the following sections. In some configurations, the surface exchange mechanism 114 the Ability to include the growth surface 112 electrostatically charged to improve the ability to attract mold spores.

The first mold sensor configuration 100 can have one or more thermal controls 120 included that are configured to match the temperature in the chamber 103 change to promote mold growth. Additional thermal controls can be on, in, or under the growth surface 112 be embedded. The thermal control 120 can be electrically connected to the control device 116 be coupled. The thermal control 120 can contain a thermoelectric cooling element. The thermal control 120 can be, for example, a thermoelectric heat pump (e.g. Peltier device or heat pump). The thermal control 120 can contain a heating element, for example a resistance element. The thermal control 120 can contain an infrared (IR) source. The thermal control 120 can be a single element or consist of a variety of thermal controls located at different locations in the chamber 103 are positioned to the temperature in different areas of the chamber 103 to control independently. In some configurations, the mold sensor may have a mechanism for adjusting the humidity in the chamber 103 contain. Different environmental conditions (e.g. temperature) within the same nutrient zone can be used to differentiate between different types of mold. For example, a particular nutrient zone that is exposed to different environmental conditions can create multiple zones that promote the growth of different types of mold. The thermal control 120 can be configured to be in different areas of the growth surface 112 creates different temperature conditions. If the thermal control 120 for example on one side of the chamber 103 is placed, the temperatures can increase with distance from the thermal control 120 increase or decrease. This can result in different environmental conditions for different parts of the growing area 112 create.

The first mold sensor configuration 100 can be a chamber environment sensor 118 included to measure the environmental conditions inside the chamber 103 is configured. The chamber environment sensor 118 can be electrically connected to the control device 116 be connected. The chamber environment sensor 118 can contain one or more temperature sensors, a humidity sensor, a pressure sensor and / or a gas sensor. A temperature sensor can be in a path of airflow that enters the chamber 103 occurs, are positioned. The chamber environment sensor 118 can be monitored periodically to check the status of conditions in the chamber 103 to determine.

An external environment detection module 122 may be present to provide information about the area outside the chamber 103 to deliver. The environmental sensor module 122 may include a temperature sensor, a humidity sensor, a pressure sensor and / or a gas sensor. The environment detection module 122 can be electrically connected to the control device 116 be coupled. The module 122 to detect the external environment can be in the housing 102 be integrated or be a separate module that with the control device 116 communicates. Communication between the control device 116 and the external environmental assessment module 122 can be done via a wireless communication protocol (e.g. Bluetooth, Bluetooth LE, WiFi, optical). The environment detection module 122 can provide information about conditions in the area or near the first mold sensor configuration 100 deliver that can affect mold growth. The control device 116 can also be configured to receive information from an external network (such as the Internet) to provide additional context for mold detection. The presence and / or concentration of mold spores can vary depending on the time of day, season and environmental parameters. The control device 116 can collect this additional information and use the information for the mold detection process. The tax direction 116 can use the information to determine the conditions for initiating a measurement cycle. For example, the control device 116 initiate measurement cycles more often at times of the year when mold spores are present in higher concentrations.

2nd shows a second mold sensor configuration 200 . The second mold sensor configuration 200 can be configured for sensors in which the source and receiver modules are not integrated. The second mold sensor configuration 200 can be a sensor source module 210 and a sensor receiving module 212 contain. The sensor source module, for example, can be used in an optical detection system 210 a light source and the sensor receiver module 212 be a light sensor. The transmit and receive modules can work cooperatively to mold inside the chamber 103 to detect. The sensor source module 210 and the sensor receiving module 212 can be electrically connected to the control device 116 be coupled. In operation, the control device 116 the sensor source module 210 activate and signals from the sensor receiver module 212 receive.

In the configuration shown is the sensor source module 210 on a side wall of the housing 102 coupled. The sensor receiver module 212 is under the growing area 112 coupled. The sensor receiver module 212 can be attached to a frame or platform that is under the growing area 112 located. The sensor source module 210 and the sensor receiving module 212 can be aligned so that the sensor receiving module 212 Signals from the sensor source module 210 can receive. In other configurations, the positions of the sensor receiver module 212 and the sensor source module 210 be exchanged.

The first mold sensor configuration 100 can be described as having an integrated mold detection device. That is, the detection device 110 is a single module that comes with the housing 102 is coupled. The second mold sensor configuration 200 can be described as having a two-part detection device. The second mold sensor configuration 200 can be useful for capturing configurations that measure a property by growing area 112 is transmitted.

The air inlet opening 104 , the mold suppressant 108 , the detection device (s), the thermal control element 120 and the chamber environment sensor 118 can be attached in different configurations. The selected position may depend on the housing restrictions and / or operational considerations of mold detection. The position of the detection device (s) can be selected depending on the type of detection device used. For example, a detector that uses optical sensors can be positioned differently than a detector configured to measure electrical properties.

3rd shows a third mold sensor configuration 300 . The third mold sensor configuration 300 can be a housing 302 contain that one chamber 303 Are defined. The third mold sensor configuration 300 can have a side air intake portal 304 contain. The side air intake portal 304 can be configured to have an air flow path 306 into the chamber 303 arises into it. In some configurations, the side air intake portal 304 redirect the airflow to the airflow towards the growing area 112 redirect. For example, the side air intake portal 304 angled slats or strips included to redirect airflow. In some configurations, the case 302 define an opening that acts as a side air entry portal 304 serves. In some configurations, the side air intake portal 304 be configured so that it opens and closes selectively. For example, a movable grille or door can be attached over an opening made through the housing 302 is defined. The movable grille or door can be moved electrically to an open or closed position by a solenoid valve. A spring mechanism can hold the movable grille in a normally closed position. The solenoid valve can be controlled by the control device 116 be operated. The movable grille or the door can be operated electrically, magnetically or mechanically.

The third mold sensor configuration 300 can use a mold suppressor on top 308 contain. The mold suppressor attached above 308 can as described above with respect to the mold suppressant 108 out 1 function. The third mold sensor configuration 300 can be a detection device mounted on top 310 contain. The detection device attached above 310 can as before with reference to the detection device 110 out 1 described work. The mold suppressor attached above 308 and the detection device 310 can be integrated into a single unit (e.g. a sensor / silencer module). An integrated device can facilitate the installation of the mold sensor.

The third mold sensor configuration 300 describes a configuration with different air inlet openings and sensor positions. The components can generally function as previously described.

4th shows a fourth mold sensor configuration 400 . The fourth mold sensor configuration 400 can be configured for sensors in which the source and receiver modules are not integrated. The fourth mold sensor configuration 400 can have a sensor source module attached at the top 410 and a sensor receiving module 412 contain. In an optical sensor system, for example, the sensor source module attached above 410 a light source and the sensor receiver module 412 be a light sensor. The transmitter and receiver modules can work cooperatively to detect the mold. The sensor source module attached above 410 and the sensor receiving module 412 can be electrical with the control device 116 be coupled. In operation, the control device 116 the sensor source module attached above 410 activate and signals from the sensor receiving module 412 receive.

In the configuration shown is the sensor source module attached above 410 on an upper wall or ceiling of the housing 302 coupled. The sensor receiver module 412 becomes under the growing area 112 coupled. The sensor source module attached above 410 and the sensor receiving module 412 can be aligned so that the sensor receiving module 412 Signals from the sensor source module attached above 410 can receive. The mold suppressor attached above 308 and the sensor source attached above 410 can be integrated into a single unit (e.g. a sensor source / mold suppression module). An integrated device can facilitate the attachment of the mold sensor. In other configurations, the positions of the sensor source module 410 and the sensor receiver module 412 be exchanged.

5 shows a two-chamber mold sensor configuration 500 . The two-chamber mold sensor configuration 500 can be a two chamber housing 502 with a partition 507 contain a first chamber 503 and a second chamber 505 Are defined. The first chamber 503 can for the growth of mold on part of the growth area 512 used within the first chamber 503 exposed.

The two-chamber mold sensor configuration 500 can be an air entry portal 504 contain. The air intake portal 504 can be configured to have an airflow path 506 in the first chamber 503 is defined in it. The dual chamber housing can be used in some configurations 502 define an opening that acts as an air entry portal 504 acts. In some configurations, the air entry portal 504 be configured so that it opens and closes selectively. For example, a movable grille or door can be attached over an opening through the two-chamber housing 502 is defined. The movable grille or door can be moved electrically to an open or closed position by a solenoid valve. A spring mechanism can hold the movable grille in a normally closed position. The solenoid valve can be controlled by a control device 116 be operated. The movable grille or the door can be operated electrically, magnetically or mechanically.

The two-chamber mold sensor configuration 500 can have one or more mold sensors 510 included that are configured to allow the growth of mold on the growth surface 512 capture. The placement of the registration device 510 can depend on the type of measurement performed. For the detection device 510 a variety of technologies are available. The detection device 510 can be electrical with the control device 116 get connected. The detection device 510 can be contained in a single module that comes with the housing 502 is coupled. Different configurations of the detection device 510 are disclosed here.

The two-chamber mold sensor configuration 500 can have one or more sensor receiving modules 511 contain. The sensor receiver modules 511 may exist in configurations in which the sensing device 510 acts as a source. The two-chamber mold sensor configuration 500 can be configured to be a single mold detection device 510A contains, which is configured so that the mold growth in the first chamber 503 detected. The two-chamber mold sensor configuration 500 can be configured to be a single mold detection device 510A and a single sensor receiver module 511A which are configured to have mold growth in the first chamber 503 detect. The two-chamber mold sensor configuration 500 can be configured to be a single mold detection device 510B that is configured to have mold growth in the second chamber 505 detected. The two-chamber mold sensor configuration 500 can be configured to be a single mold detection device 510B and a single sensor receiver module 511B that are configured to have mold growth in the second chamber 505 detect. The two-chamber mold sensor configuration 500 can also be configured to be both in the first chamber 503 as well as in the second chamber 505 with the mold sensors 510A / 511A , 510B / 511B Is provided.

The two-chamber mold sensor configuration 500 can be a mold suppressant 508 included that is configured to destroy mold. The mold suppressant 508 can be on the side or top of the housing 502 be attached. The mold suppressant 508 can be configured to have the mold in the second chamber 505 destroyed. The mold suppressant 508 can work as described above. In addition, the mold suppressant 508 into the mold detection device 510 be integrated as previously described here.

The two-chamber mold sensor configuration 500 can also have a surface exchange mechanism 514 included, which is configured so that the growth area 512 is moved to a different position. For example, the surface exchange mechanism 514 contain one or more roles that are configured to cover the growing area 512 move. The growth area 512 that in the first chamber 503 exposed, can be called an active growth area. The active growth surface can be the surface on which mold should grow or grow. The section of the growing area 512 who is in the second chamber 505 exposed, can be referred to as used area. The surface used can be the surface on which mold has already grown. The surface exchange mechanism 514 can be configured so that the growing area 512 is advanced to a new active growth area within the first chamber 503 to accomplish. The surface exchange mechanism 514 is described in more detail here. Another configuration can be the growth surface 512 in the first chamber 503 exposed to air and then to the growth, measurement and destruction phase in the second chamber 505 is moved (e.g. similar to single-chamber configurations).

The two-chamber mold sensor configuration 500 can be a thermal control 520 included, which is configured to have the temperature in the first chamber 503 changes to promote mold growth. Additional thermal control elements can be on, in or under the growth surface 512 be embedded. The thermal control 520 can be a thermoelectric element generated by the control device 116 is electrically powered. The two-chamber mold sensor configuration 500 can also have a similar thermal control in the second chamber 505 contain. The thermal control 520 can work as described above for the similar element of the other configurations.

The two-chamber mold sensor configuration 500 can be a chamber environment sensor 518 included for measuring the environmental conditions in the first chamber 503 is configured. The chamber environment sensor 518 can be electrically connected to the control device 116 be connected. The chamber environment sensor 518 may include a temperature sensor, a humidity sensor, a pressure sensor and / or a gas sensor. The chamber environment sensor 518 can be periodically monitored to check the status of the conditions in the first chamber 503 to determine. The two-chamber mold sensor configuration 500 can also have a similar environmental sensor in the second chamber 505 contain.

The two-chamber mold sensor configuration 500 provides separate chambers for mold growth and destruction. An advantage of the two-chamber mold sensor configuration 500 is that the sensor can be used continuously for mold detection. The single-chamber configurations grow and destroy mold in the same chamber so that no new sample can be initiated during the mold destruction phase. In some configurations, the mold sensor can use more than two chambers. A multi-chamber mold sensor configuration can also be used. For example, different chambers can be configured to operate for different environmental parameters to create a growth environment for different types of mold.

The general functioning of the two-chamber mold sensor configuration 500 can be part of the growing area 512 in the first chamber 503 to expose. The air intake portal 504 can be opened and then closed at a specified time for a specified period of time. The control device 116 can the thermal control 520 actuate and the chamber environment sensors 518 monitor to create an environment that encourages mold growth. The control device 116 can receive signals from the detector 510/511 monitor to see if mold is present. After completing the measurement cycle, the control device can 116 the surface exchange mechanism 514 activate to the growing area 512 move so that the exposed section is in the first chamber 503 to the second chamber 505 emotional. A new active growth surface can be placed in the first chamber 503 be moved to enable a new measuring cycle.

The control device 116 can then use the mold suppressant 508 press to the mold on the growing area 512 to destroy. In configurations with a mold sensor device (e.g. 510B / 511B ) in the second chamber 505 can the control device 116 monitor the appropriate signals for signs of mold destruction.

6 shows a first single chamber with a configuration 600 with external exposure or suspension. The single chamber / exterior exposure configuration 600 can contain a single chamber that is configured to allow mold growth and destruction. The single chamber / exterior exposure configuration 600 can be a housing 602 contain that one chamber 603 Are defined. The single chamber / exterior exposure configuration 600 also contains a growing area 612 . The growth area 612 can be configured to match the airflow 606 outside the chamber 603 is exposed.

The single chamber / exterior exposure configuration 600 also includes a surface exchange mechanism 614 that is configured so that the growth surface 612 in different Positions can be moved. An exposed or exposed section 630 the growing area 612 can the air flow 606 outside the chamber 603 get abandoned. The exposed section 630 can the air flow 606 exposed for a predetermined period of time to collect mold spores, the air flow 606 available. The surface exchange mechanism 614 can be operated to the exposed part 630 into the chamber 603 to move. In this way, an additional, previously unexposed or exposed portion of the growth area can be 612 than the exposed section 630 be positioned. The surface exchange mechanism 614 is also described in detail here.

The single chamber / exterior exposure configuration 600 can be a mold detection device 610 included, which is configured to allow mold growth on the growth surface 612 detected. The placement of the registration device 610 can depend on the type of measurement performed. For the detection device 610 different technologies are available. The detection device 610 can be electrical with the control device 116 get connected. The detection device 610 can be contained in a single module that comes with the housing 602 is coupled. Different configurations of the detection device 610 are disclosed here. The single chamber / exterior exposure configuration 600 can be a sensor receiving module 611 contain. The sensor receiver module 611 may exist in configurations where the detector 610 configured as a source. The sensor receiver module 611 can under the part of the growing area 612 be positioned within the chamber 603 located.

The single chamber / exterior exposure configuration 600 can be a mold suppressant 608 included, which is configured so that the mold in the chamber 603 destroyed. The mold suppressant 608 can be on the side or top of the housing 602 (shown above). The mold suppressant 608 can work as described above. In addition, the mold suppressant 608 be integrated into at least a portion of the mold detection device 610, as previously described herein.

The first single chamber / exterior exposure configuration 600 can be a thermal control 620 included, which is configured so that it is the temperature in the chamber 603 changes to promote mold growth. Additional thermal controls can also be on, in or under the growth surface 612 be embedded. The thermal control 620 can be a thermoelectric element generated by the control device 116 is controlled electrically. The single chamber / outside exposure configuration 600 can be a chamber environment sensor 618 included, which is configured to measure the environmental conditions within the chamber. The thermal control 620 can work as described here.

The first single chamber with the outside exposure configuration 600 is partly due to the path of the growing area 612 featured. As shown, the growing area is 612 inside the chamber 603 at an angle of ninety degrees to the exposed growth area 630 aligned. The angle is not limited to ninety degrees. The first single chamber with the outside exposure configuration 600 Allows a mold measurement while another air sample checks the airflow 606 exposed.

7 shows a second single chamber with an external exposure configuration 700 . The single chamber / outside exposure configuration 700 can contain a single chamber that is configured to allow mold growth and destruction. The single chamber / outside exposure configuration 700 can be a housing 702 contain that one chamber 703 Are defined. The single chamber / outside exposure configuration 700 also contains a movable growth area 712 . The flexible growth area 712 can be configured to match the airflow 706 outside the chamber 703 is exposed.

The single chamber / outside exposure configuration 700 also includes a surface exchange mechanism 714 that is configured so that the growth surface 712 can be moved to different positions. An exposed section 730 the growth surface 712 can the air flow 706 get abandoned. The exposed, ie exposed, section 730 can the air flow 706 exposed for a predetermined period of time to collect mold spores in the air stream 706 available. The surface exchange mechanism 714 can be operated to the exposed part 730 into the chamber 703 to move. This can be another part of the growing area 712 be positioned so that it has the exposed part 730 forms. The surface exchange mechanism 714 is described here with additional details.

The single chamber / outside exposure configuration 700 can be a mold detection device 710 included, which is configured to allow mold growth on the growth surface 712 detected. The placement of the registration device 710 can depend on the type of measurement performed. For the detection device 710 a variety of technologies are available. The detection device 710 can be electrically connected to the control device 116 be connected. The detection device 710 can be contained in a single module that comes with the housing 702 is coupled. Different configurations of the detection device 710 are disclosed here. The single chamber / outside exposure configuration 700 can be a sensor receiving module 711 contain. The sensor receiver module 711 may exist in configurations where the sensor device 710 acts as a source. The sensor receiver module 711 can under the growing area 712 that are inside the chamber 703 is positioned.

The single chamber / outside exposure configuration 700 can be a mold suppressant 708 included, which is configured to destroy molds. The mold suppressant 708 can be on the side or top of the housing 702 (shown above). The mold suppressant 708 can be configured to have the mold in the chamber 703 destroyed. The mold suppressant 708 can work as described above. In addition, the mold suppressant 708 can be integrated with at least a portion of the mold detection device 710, as previously described here.

The first single chamber / outdoor exposure configuration 700 can be a thermal control 720 included, which is configured so that it is the temperature in the chamber 703 changes to promote mold growth. Additional thermal controls can be on, in, or under the growth surface 712 be embedded. The thermal control 720 can be a thermoelectric element generated by the control device 117 is controlled electrically. The single chamber / outside exposure configuration 700 can be a chamber environment sensor 718 included, which is configured to measure the environmental conditions within the chamber.

The second single chamber with the external exposure configuration 700 can partially through the path of the growth surface 712 be characterized. As shown, the growing area is 712 inside the chamber 703 on the same level with respect to the exposed, ie exposed, growth area 730 oriented. The second single chamber with external exposure configuration 700 can be at any angle relative to the air flow 706 be attached. The sensor can be attached so that the air is at a predetermined angle on the exposed, ie exposed, growth surface 730 meets.

The mold sensor configurations presented here can use a surface exchange mechanism that is configured to exchange a portion of the growth surface that is within the detection chamber. In addition, the surface exchange mechanism can be configured to move an exposed growth surface into the detection chamber. The growth surface or medium can be configured in various ways. The growth medium can be a film or tape that is coated to create a sticky or sticky surface. The sticky surface helps attract particles such as mold spores. In addition, the surface of the film or tape can be coated with nutrients for mold growth. The surface of the film or tape can be given an antibacterial coating to prevent the growth of bacteria.

Different types of mold can promote different nutrients for growth. The growth medium can be configured to stimulate different types of mold to grow. 8th shows a possible configuration of a growth medium 800 . The growth medium 800 can be a substrate material 812 contain. The substrate material 812 can be, for example, a film, a membrane or a tape. The substrate material 812 can be made of plastic, fabric or other material. The substrate material can be in different configurations 812 be designed as a strip, drum or disc. On the substrate material 812 can do a variety of test sections 802 To be defined. The test section 802 can be as an area or surface of the growth medium 800 can be defined, which can be exposed within the chamber of the mold sensor. The test sections 802 can by a width 816 and a length 814 be characterized. The width 816 and the length 814 can be the dimensions of the chamber or the dimensions of an opening for suspending the test section 802 correspond within the chamber. The test section 802 can continuously on the substrate material 812 be repeated. During the operation of the mold sensor, the test section 802 exposed to air and processed through a measurement cycle. The remaining test sections that are on the substrate material 812 can be included by the surface exchange mechanism.

The test section 802 can be segmented into a variety of strips. For example, a first stripe 804 , a second strip 806 , a third stripe 808 and a fourth stripe 810 on the test section 802 To be defined. Each of the strips can have a coating that favors the growth of a different type of mold. The first strip 804 can for example be a first Have nutrient coating that favors the growth of a first type of mold. The second strip 806 may contain a second nutrient coating that favors the growth of a second type of mold. The third strip 808 may contain a third nutrient coating that favors the growth of a third type of mold. The fourth strip 810 can contain a fourth nutrient coating that is favorable for the growth of a fourth type of mold. Different environmental conditions (eg temperature) can be applied within each strip during a measurement cycle by operating the thermal control element. Within each strip, various environmental sensors (e.g. temperature, humidity, pH) can be embedded on, in or under the strip to monitor the conditions that promote mold growth. The sensor information can be used to recalculate the mold spore concentration in the air.

The segmentation of the test section 802 enables the mold sensor to efficiently detect the presence of different types of mold. In addition, different combinations of strips can be made depending on what types of mold are expected in the area at a time of testing. Test sections with a single nutrient coating may not be able to effectively detect all types of mold. Another advantage of the strips is that the mold sensor can provide a more detailed report of the existing types of mold. A more detailed report can be made by detecting the presence and / or concentration of mold in each of the strips.

9 shows another possible configuration for a growth medium 900 . The growth medium 900 can consist of alternating growth areas defined on a substrate. The growth medium 900 can be a first growth area 902 include. In addition to the first growth area 902 can become a non-growth area 904 are located. A second growth area 906 can next to the non-growth area 904 To be defined. The pattern of growth areas and non-growth areas can span the entire length of the growth medium 900 to repeat. The non-growth area 904 can be an area configured to prevent mold formation (eg not coated or with a high pH coating). The non-growth area 904 can be an area that is not sticky or sticky. The non-growth area 904 can be configured to have a buffer between the first growth area 902 and the second growth area 906 forms. Each of the areas can be defined by a width 910 and a length 908 be characterized. The width 910 and the length 908 can be the dimensions of the chamber or the dimensions of an opening to expose the growth area 902 correspond within the chamber. The dimensions of each alternating area can be defined in a similar manner.

The configuration 900 alternating growth medium can be useful in configurations where the exposed or exposed area is outside the chamber. In such configurations, continuous mold detection may not be desirable. The non-growth area 904 can be positioned in the area exposed to air without the risk of mold spores sticking to the surface. If the growth medium 900 is ready for the implementation of a measuring cycle, the growth medium 900 be advanced through the surface exchange mechanism to the second growth area 906 to expose to air, ie to expose it before it enters the chamber. During the second growth area 906 Exposed to the air, the non-growth area can change 904 are inside the chamber. It should be noted that the first growing area 902 and the second growing area 906 Strips can contain, as related to 8th described.

10th shows an alternative configuration for a growth medium 1000 . The growth medium 1000 can be a substrate material 1004 contain. The substrate material 1004 can be, for example, a film, a membrane or a tape. The substrate material 1004 can be made of plastic, fabric or other material. The substrate material 1004 can be configured in various configurations as a strip, drum or disc. On the substrate material 1004 can do multiple test sections 1002 be defined. The test section 1002 can be as an area or surface of the growth medium 1000 be defined, which can be exposed within the chamber of the mold sensor, ie exposed. The test sections 1002 can by a width 1018 and a length 1016 be characterized. The width 1018 and the length 1016 can be the dimensions of the chamber or the dimensions of an opening for exposing or exposing the test section 1002 correspond within the chamber. The test section 1002 can on the substrate material 1004 be repeated continuously. During the operation of the mold sensor, the test section 1002 exposed to air and processed through a measurement cycle. The remaining test sections that are on the substrate material 1004 can be included by the surface exchange mechanism.

The test section 1002 can define one or more growth areas. For example, a first growth area 1006 , a second growth area 1008 , a third growth area 1010 and a fourth growth area 1012 To be defined. Each of the growth areas can have a coating or treatment that favors the growth of a different type of mold. For example, the first growth area 1006 be treated with a first nutrient coating that favors the growth of a first type of mold. The second growth area 1008 can be treated with a second nutrient coating that favors the growth of a second type of mold. The third growth area 1010 can be treated with a third nutrient coating that is favorable for the growth of a third type of mold. The fourth growth area 1012 can be treated with a fourth nutrient coating that is favorable for the growth of a fourth type of mold. The test section 1002 can also be a non-growth area 1014 include. The non-growth area 1014 can be as the area within the test section 1002 defined, which lies between the growth regions. The non-growth area 1014 can be a region of the substrate material 1004 that is not treated to promote mold growth. The growth areas are shown as squares, but can have different shapes. For example, the growth areas can be circular or rectangular. In addition, although the pattern is generally represented as symmetrical, the pattern can also be asymmetrical. The test section 1002 can continuously on the substrate material 1004 be repeated. During the operation of the mold sensor, the test section 1002 exposed to air and processed through a measurement cycle. The remaining test sections that are on the substrate material 1004 can be included by the surface exchange mechanism.

The test section 1002 can define a pattern that is on the substrate material 1004 repeated. The pattern can repeat at a distance approximately the length 1016 of the test section 1002 corresponds. Each of the growth areas can promote the growth of a particular type of mold. The division of the test section 1002 enables the sensor to efficiently detect the presence of different types of mold. In addition, different combinations of growth areas can be made depending on the types of mold that are expected in the area at the time of the test. Another advantage of the different growth areas is that the mold sensor can provide a more detailed report of the existing types of mold. A more detailed report can be made by detecting the presence and / or concentration of mold in each of the growth areas. The non-growth area 1014 can be useful for sensor calibration. Because mold is not expected to be on the non-growth area 1014 grows up, the mold sensor can use this area to calibrate the detection device.

The features of each of the growing area configurations can be combined to define additional growing areas. For example, the configurations of 8th and 10th contain alternating areas that allow mold growth and prevent mold growth. The particular features selected for the growth surface may depend on the configuration of the mold sensor. The growth area configurations are shown as strips, but can also be formed in a corresponding manner on a surface of a drum or a disk.

The mold sensor configurations can include a surface exchange mechanism. In some configurations, the surface exchange mechanism can be configured as a disposable cartridge that can be inserted into or removed from the mold sensor. The disposable surface exchange mechanism may include a solid growth area exposed in the chamber when the mechanism is attached to the mold sensor housing.

The surface exchange mechanism can also be configured to advance the growth surface relative to the chamber. The surface exchange mechanism can be electrically controlled by the controller 116 being controlled. The surface exchange mechanism can be configured to store a predefined amount of growth surface that can be introduced into the chamber for one measurement cycle. The surface exchange mechanism can also be configured to store a used growth surface that has been processed in one measurement cycle.

11 shows a side view of a possible configuration of a tape-based surface exchange mechanism 1100 configured to feed a tape, membrane, or film. The tape-based surface exchange mechanism 1100 can be a tape case 1104 contain. The tape housing 1104 can be a chamber for used tape 1114 and a chamber for unused tape 1116 define. The housing 1104 can be a partition 1118 between the used tape chamber 1114 and the chamber for unused tape 1116 contain. The tape housing 1104 can be configured to attach to a growth chamber case 1102 can be coupled, which is a growth chamber 1103 Are defined.

The tape-based surface exchange mechanism 1100 can be a reel or spool 1108 include that rotates about an axis. The tape-based surface exchange mechanism 1100 can be a driven reel or spool 1106 comprise, which is driven by an electric drive unit. The electric drive unit can be an electric motor, the shaft of which has an axis of the driven coil 1106 connected is. In some configurations, the electric drive unit may include an electric motor connected to the driven coil via one or more gears 1106 connected is. In some configurations, a manual crank assembly can be attached to the driven spool 1106 be attached to enable manual tape feed. The tape-based surface can be packaged in such a way that the initial parameters (eg moisture content) of the tape are retained until use. The exchange mechanism 1100 For example, may include a liner or encapsulation that prevents moisture from evaporating from the tape-based surface before use. The encapsulation can also prevent contamination of the tape-based surface before use.

A piece of unused tape 1110 or foil can around the spool 1108 be wrapped. The unused tape / film 1110 can be configured as a growth area as previously described here. The unused tape 1110 can be defined as the section of the band that is not to the growth chamber 1103 was advanced. An end of the unused ribbon 1110 can on the coil 1108 be attached. The tape can also be an active test area 1122 included, which is defined as that portion of the band that is within the growth chamber 1103 located. The tape can also be a length of used tape 1112 or film that can be defined as the portion of the tape that is passed through a measurement cycle in the growth chamber 1103 was processed. One end of the used tape 1112 can on the driven coil 1106 be attached.

The tape housing 1104 can be an interface 1120 define that is configured to use the unused tape 1110 and the tape used 1112 from the growth chamber 1103 separates. The interface 1120 can define slots or openings through which the tape can pass. The tape-based surface exchange mechanism 1100 can also have a first leadership role 1124 included that is configured to use unused tape 1110 from the unused tape chamber 1116 to the growth chamber 1103 directs. The tape-based surface exchange mechanism 1100 can also take a second leadership role 1126 included, which is configured so that the tape (the active test area 1122 ) in the chamber for used tapes 1114 directs. The first leadership role 1124 and the second leadership role 1126 can with the interface 1120 be coupled by a bracket. In some configurations, the bracket may include a compliant member configured to apply pressure to the rollers against a lower surface of the mold sensor housing 1102 to press the chamber 1103 to seal off the outside air and / or the electrical contact between the belt and the control device 116 to improve. A length of the first leader 1124 and the second leadership role 1126 can be defined by a width of the band.

Unused tape (as in 8-10 described) can on the coil 1108 wound or wound up. The tape can have the first leadership role 1124 and the second leadership role 1126 out, leaving one end on the driven spool 1106 can be attached. The mold measurement cycle can be performed using the active test area 1122 to be carried out in the growth chamber 1103 exposed. After completing a measuring cycle, the driven coil can 1108 can be rotated by the electric drive mechanism. The driven coil 1108 can be driven to the section of the tape that is the active test area 1122 represents in the chamber for used tapes 1114 to transport. By turning the driven coil 1108 the tape is moved forward, that is, and around the driven reel 1106 wrapped. The rotation causes the unused tape 1110 from the coil 1108 developed and as a new active test area 1122 to the growth chamber 1103 is advanced. The total length of the tape can be configured so that a predetermined number of measurements can be performed.

In some configurations, the chamber 1114 encapsulation and / or chemicals to prevent mold formation for used tapes. This can cause mold to grow in the chamber 1116 Prevent unused tapes and ensure that mold that has grown during the measurement is further destroyed. In some configurations, the chamber 1116 For unused tapes, capsules and / or chemicals are included around the unused tape 1110 to get for later use. For example, the encapsulations and / or chemicals can be configured to prevent that unused tape 1110 becomes dry or non-sticky, which could negatively affect the effectiveness of the measurement.

The tape-based surface exchange mechanism 1100 can be implemented as a cassette or cartridge containing a predetermined length of tape or film. The cartridge can be exchangeable by the user. The cartridge can be disposed of after use. In some configurations, the tape or film within the cartridge can be interchangeable.

In some configurations, the tape or growth surface may have notches along one or both sides of the tape. For example, a notch can be made to identify each test section of the tape. An optical sensor can be positioned to provide a signal when the notch appears between the source and the receiver. The control device 116 can use the signal to properly position the tape so that a test section in the chamber is properly exposed. The sensor can also be used to measure the amount of tape used. For example, the optical sensor can be used to count the notches. If the control device 116 knows the distance between the notches and / or the total number of notches on the tape, it can calculate the amount of tape used and / or the amount of tape remaining and transmit the values to the user. The control device 116 can calculate the number of measuring cycles remaining based on the remaining amount of tape.

12A and 12B show different views of a drum-based surface exchange mechanism 1200 . The drum-based surface exchange mechanism 1200 can a drum 1204 contain. The drum 1204 can have a cylindrical shape. In some configurations, the drum 1204 be massive. In some configurations, the drum 1204 be hollow, with structural elements at each end to keep the drum rotating 1204 to support and facilitate. The drum 1204 can by an electric motor 1206 be rotated, its shaft with the central axis of the drum 1204 connected is. The drum 1204 can be a growing area 1208 included, which can be defined as the area within a growth chamber of a mold sensor housing 1202 exposed. The drum 1204 can be a non-exposed, ie not exposed surface 1203 included that as the surface of the drum 1204 can be defined in the growth chamber of the mold sensor housing 1202 not exposed, ie exposed. The drum-based surface exchange mechanism 1200 may include a housing (not shown) configured to attach to the mold sensor housing 1202 can be attached and the electric motor 1206 wearing. The housing can also prevent the drum surface from being exposed to the outside air.

The drum 1204 can be divided into a number of surface segments 1210 be divided. The surface segments 1210 can be configured to go into the growth chamber of the mold sensor housing 1202 fit. A number of surface segments 1210 can define the number of measurement cycles that can be carried out. The surface segments 1210 can be striped or subdivided as previously described in relation to the belt configurations.

The drum 1204 can be a replaceable element, so if all surface segments 1210 a new drum was used 1204 can be installed. The old drum can be disposed of or recycled. In some configurations, the drum surface can be a replaceable sheet or substrate. The used drum surface sheet can be replaced by a new drum surface sheet.

The drum-based surface exchange mechanism 1200 can be caused by the operation of the electric motor 1206 rotate. A measurement can be made with the growth area 1208 be carried out in the chamber of the mold sensor housing 1202 exposed. After the measurement cycle is complete, the electric motor can 1206 be operated to the drum 1204 move forward to a next surface segment 1210 in through the sensor housing 1202 to place the defined growth chamber. For example, in 12B the current segment that is in the mold sensor housing 1202 the growing area is exposed 1208 . Assuming a clockwise rotation, the surface segment can 1210A into the mold sensor housing 1202 advance. The control device 116 can be configured to use the electric motor 1206 actuated for a predetermined duration, which is calibrated so that the drum 1204 is rotated by an amount corresponding to one of the surface segments 1210 corresponds. In other configurations, a sensor, such as a potentiometer or an encoder, can be used as a feedback signal to measure the amount of rotation and the electric motor 1206 to drive accordingly. In some configurations, a manual crank assembly can be on the axis of the drum 1204 be attached to the manual feed of the drum 1204 to enable.

13A shows a disk-based surface exchange mechanism 1300 for the Feeding a disc 1308 for positioning a growth area 1304 within one through the sensor housing 1302 formed chamber. The disc-based surface exchange mechanism 1300 can be a disc housing 1306 included that is configured to be the disc 1308 encloses. The disc 1308 can be configured to rotate around a central axis. An electric motor 1310 can on the disc housing 1306 be coupled. A shaft of the electric motor 1310 can with the disc 1308 be coupled to the rotation of the disc 1308 to facilitate.

In some configurations, the entire surface of the disk 1308 treated to promote mold growth. The disc 1308 can also like in can be configured as shown. The disc 1308 can growth areas 1312 define that are treated to promote mold growth, as previously described here. The disc 1308 can be a non-growth area 1314 included the growth areas 1312 separates. The non-growth area 1314 can prevent mold growth outside the sensor housing 1302 spreads. The growth areas 1312 can be divided into differently treated areas to promote the growth of different types of mold, as previously described here.

The disc-based surface exchange mechanism 1300 can the disc 1308 by operating the electric motor 1310 position. A measurement can be made with the growth area 1304 be carried out in the growth housing 1302 is exposed. After the measurement cycle is complete, the electric motor can 1310 be operated to the disc 1308 to the next growing area 1312 to turn. The control device 116 can be configured so that the electric motor 1310 is operated for a predetermined duration, which is calibrated so that the disc 1308 is rotated by an amount corresponding to one of the growth areas 1312 corresponds. In other configurations, a sensor, such as a potentiometer or an encoder, can be used as a feedback signal to measure the amount of rotation and the electric motor 1310 Appropriate accordingly.

The mold sensor configurations include a detector that is configured to detect mold. The sensor can be electrical with the control device 116 be coupled. Various sensor technologies can be used to detect mold growth within the housing. The types of sensors that can be used include optical sensors, chemical sensors, biosensors, mechanical sensors, audio sensors, and electrical sensors. The sensors can be configured to measure visual, mechanical, electrical, biological, and / or chemical properties associated with mold growth. The mold sensor configurations can contain various types of sensors for the detection of mold. Some sensor technologies may be more suitable for the detection of mold concentration, while others are more suitable for the detection of mold growth.

On the example of 1 can the sensor device 110 can be implemented in different ways. Different configurations can be based on different sensor technologies. The types of detection devices can be a chemical / gas sensor, an electrical sensor, a biological sensor, an optical sensor, a mechanical sensor or an audio sensor. The type of detection device may depend on the type of properties associated with the presence and / or concentration of mold that is to be detected. The detection device 110 can be configured to detect mold by measuring optical, electrical, biological, mechanical and / or chemical properties. The different properties can be detected by different types of sensors. For example, some chemical properties, such as pH, can be detected by optical and / or electrical sensors. Mechanical properties can be detected by electrical and / or optical sensors. The detector can be characterized by the physical property it is trying to measure and how it measures the physical property.

Mold spores release microbial volatile organic compounds (mVOCs) as a by-product during their metabolism. Mold spores can also release mycotoxins as a final product during a second metabolism. Mold growth can be detected by detecting these chemicals during the mold life cycle. The detection device 110 can be a chemical sensor configured to detect changes in mVOCs or other chemicals associated with mold growth.

Mold can release alcohol, aldehyde, hydrocarbons, acids, ethers, esters, ketones, terpenoids, sulfur, nitrogen and other compounds. The type of chemicals released can depend on the type of mold that is growing. The detection device 110 can be any type of chemical sensor that can detect these compounds. The detection device 110 can be, for example, an electrochemical gas sensor or a metal oxide gas sensor that is configured for the detection of these connections. In some configurations, the detector 110 contain a variety of chemical sensors, each configured to measure a particular chemical compound.

The detection device 110 can be, for example, a solid-state chemical resistance sensor that changes its resistance in response to the action of certain chemical compounds. The control device 116 can be programmed to estimate a gas concentration by measuring the resistance of the chemical resistance sensor. The control device 116 may include a voltage divider network and an analog-to-digital converter (A2D) for measuring a voltage across the chemical resistance sensor. The control device 116 can store one or more tables that map voltage and / or resistance values to gas concentrations. The control device 116 can be configured to generate a warning or alarm in response to the gas sensor signal, which indicates mold levels above a threshold. The warning can be generated, for example, if the mold concentration exceeds a reference concentration by more than a predetermined amount.

The control device 116 can store data that relates chemical sensor measurements to mold growth. The data can be derived experimentally from tests. The stored data can indicate gas types and quantities during various phases of mold growth. The stored data can also contain a gas profile for different types of mold. The control device 116 can scan the chemical / gas sensor over time and compare the results with the stored data to further identify a mold type, mold concentration or growth phase of the mold. In addition, the initial concentration of mold before mold growth can be determined by recalculating and estimating the amount of growth based on data that can be experimentally derived from the tests.

Mold growth can also change the properties of the growth medium as the mold grows. Common mold types such as the Aspergillus and Penicillium families shift the pH of the growth surface 112 towards acid. The detection device 110 can be configured to detect a change in pH caused by mold. A first technique for the detection of the pH of the growth surface 112 involves the addition of a universal pH indicator solution to the growth surface 112 . The universal pH indicator can change color when the pH of the growth surface changes 112 changes. The nutrient treatment for the growth surface 112 can include the universal pH indicator solution. The detection device 110 can be configured to change color of the growth surface 112 detected that are associated with the pH changes. In some configurations, the measuring device 110 be a camera that has a color image of the growth surface 112 provides. For example, the camera may be a charge coupled device (CCD) configured to take a digital image of the growth surface 112 delivers. The control device 116 can be configured to use image processing algorithms to determine color changes in the growth surface 112 implemented. The detection device 110 can be an optical detection device configured to emit an electromagnetic wave (eg light) and one from the growth surface 112 reflected wave receives.

The color change caused by pH changes can be detected by changes in the optical properties such as adsorption, reflection, scattering, color and / or fluorescence. The properties can be detected with an optical sensor system, an imaging system or a camera system. For example, the optical sensor system can be configured to provide data about the color of the mold growing on the surface. The control device 116 can be programmed to process the optical data, including color information, to identify a color of the mold growth or substrate. The color information can indicate the growth of mold on the substrate. For example, a change in the pH of the substrate can be identified by changing from a basic color to a given color. The given colors, which indicate the growth of mold, can be derived from experiments.

Like for example in 2nd shown, the sensor system can be a sensor source module 210 and the sensor receiving module 212 contain. While 2nd shows that the sensor receiving module 212 on the opposite side of the growing area 112 in relation to the sensor source module 210 the sensor receiver module 212 on the same side of the growing area 112 like the sensor source module 210 to be placed.

The sensor source module 210 can be a light source (or a source of electromagnetic waves) and the sensor receiving module 212 can be a photo detector. The photo detector can, for example, under the growth surface 112 to be placed. The light source can be activated to emit an electromagnetic wave in the chamber 103 to generate the growing area 112 to illuminate / to irradiate. Electromagnetic waves covering the growth surface 112 pass through, the wavelength depending on the color of the growth surface 112 to change. The photodetector (sensor receiver module 212 ) can receive the electromagnetic waves and generate an electrical signal. The photodetector can be configured to detect different wavelengths of the electromagnetic waves so that different colors can be detected. In some configurations, multiple photodetectors (eg, a photodetector array) can be implemented, with each photodetector tuned to a specific wavelength range.

The optical sensor systems, imaging systems or camera systems can both the sensor source module 210 (e.g. optical source, LED, laser) as well as the sensor receiving module 212 (eg optical sensor, photodiode, photodetector, imager, camera). In some configurations, the optical source can be a source that illuminates a divergent beam that is configured to cover a large area or the entire area of the growth area 112 inside the chamber 103 illuminated. The optical source can be a light source combined with a beam divergence component that diverges the beam by a large area or all of the area of the growth area 112 inside the chamber 103 to illuminate. The optical sensor can be an array of photodiodes or a camera configured to receive electromagnetic waves from the growing area 112 reflected or scattered and / or through the growth area 112 be transmitted. In this configuration, the changes in the optical properties of the entire growth area 112 can be recorded simultaneously. The sensor source module 210 can be through one or more input signals from the controller 116 generated, controlled. The sensor receiver module 212 may send optical data indicating one or more optical properties to the controller 116 deliver. The optical data can be provided as one or more electrical signals. In some examples, the optical data may include digital data such as image or pixel data / patterns. The specific optical data from the sensor receiver module 212 can depend on the type of sensor used.

In another configuration, the optical source can be a high directivity, small divergence angle laser beam, and the optical sensor can be either a single photodiode or an array of photodiodes or optical sensors. The optical source can be driven by a driver or an electric motor to cover all or a large part of the growth area 112 to sweep, and the single photodiode can also be driven by the same or a separate driver or electric motor to move with the source accordingly. This configuration can be useful for configurations where different areas of mold growth are defined. Each area can be scanned for the presence of mold. The area in which mold is detected can be saved and the existing mold type can be displayed. The array of photodiodes or optical sensors may or may not have to move.

The optical source can be either a single wavelength source or a multi-wavelength source (e.g. a broadband source) and the optical sensor can accordingly have either a narrow or a wide bandwidth. Changes in the optical properties of the growth surface 112 can be detected in the ultraviolet (UV) wavelength range, in the visible wavelength range or in the infrared (IR) wavelength range, depending on the specific growth surface 112 and the mycelium that is in the chamber 103 grows. If the optical source is a multi-wavelength or broadband source, an optical spectrometer can also be used as the optical sensor in order to detect the changes in the optical properties in a spectral range. The spectra information can also contain mVOC or other information, and both changes in the optical properties of the growth area 112 mVOC or other information changes can be detected in this way.

The optical source can also be an array of individual monochromatic optical lasers. For example, ultraviolet lasers can induce fluorescence when illuminating the mold spores. The fluorescence of the mold spores can be detected with two or more ultraviolet lasers as the optical source and an optical spectrometer as the optical sensor. Mold spores can be detected by signatures of fluorescence spectra.

The change in absorption, reflection and / or scatter induced by mold growth can be directly detected by the light intensity received by the photodetector become. The color change induced by mold growth can be determined with a filter with a photodiode (or an array) and RGB pixels (or an RGB pixel array). The control device 116 may include algorithms to detect changes in intensity and / or color.

In addition to growth in the area of the growth area 112 the mold can also grow out of the plain. The vertical depth of the mold can increase with increasing growth time. The optical sensor can be configured as a laser distance finder (e.g. based on runtime, frequency-modulated continuous wave or structural light technology) in order to detect the depth of the growing mold outside the plane (out-of-plane depth). The control device 116 can be configured to periodically measure the range finder to monitor the vertical growth of the mold. The control device 116 can calculate a rate of change in vertical growth.

The optical properties of the growth surface can be calibrated with a reference prior to exposure to mold or mold growth and stored for comparison with the optical properties observed after exposure and growth. Mold growth affects the optical properties within the chamber. The control device can compare the measurement results with the baseline results 116 determine the presence of mold and the initial concentration of mold.

Another technique for detecting the pH of the growth medium can be using a pH meter, for example a potentiometric pH meter. The growth medium can contain pre-printed electrodes for the potentiometric sensor. The surface above the electrodes can be coated with nutrients to promote mold growth. If the pH changes, the resistance measured between the electrodes may change. The pH can be determined by measuring the resistance between the electrodes. The control device 116 can be configured to receive the electrical signal and estimate the resistance. The electrical detection is described here with additional details.

Another technique for detecting pH may be to implement a system that controls the pH of a small area of the growth medium. 19th shows a configuration for controlling the pH of a surface. An active area of the growth surface 1902 can be covered with a hydrogel or similar coating that allows diffusion and promotes mold growth. The pH sensor can be a detection electrode 1908 included that in the growth surface 1902 is integrated. The detection electrode 1908 can have a proportional electrical potential behavior to the pH with respect to a reference electrode 1912 exhibit. A current source can have one or more working electrodes (eg first working electrode 1904 and second working electrode 1906 ) supply with current, which is then through one or more counter electrodes 1910 flows. The control device 116 can control the current so that the measuring electrode 1908 is maintained at a reference pH 1916, which can be a constant pH. This can be used to create a given pH environment to promote the growth of certain types of mold. This also provides a feedback signal to provide a measure of the amount of feedback that must be used to keep the pH at a constant level. An amplifier 1914 can have inputs from the sensing electrode 1908 and the reference electrode 1912 receive. The output of the amplifier 1914 can be electrical with the control unit 116 be coupled. When the pH of the growth surface 1902 due to mold formation, the amount of electricity that the working electrodes can change 1904 , 1906 is fed, change. As a result, that on the detection electrodes changes 1908 measured voltage.

The configuration of 19th can be used to create a specific pH environment that promotes the growth of certain types of mold. The feedback signal from the detection electrode 1908 is proportional to the amount of electricity that must be applied to keep the pH constant. If, for example, no mold grows, the pH should remain constant without changing the current. When mold grows on the surface, the pH changes, causing the control device 116 supplies more current to bring the pH back into balance. The growth of mold can be detected for changes by monitoring the feedback signal. If the feedback signal exceeds a predetermined threshold, mold may be present. The growth surface can be configured with several areas, as in 19th are configured. Each of the areas can be used to create a different pH environment for mold growth. In addition, different areas can be configured to be in a different temperature zone (e.g. by operating thermal controls associated with each of the areas). This way the environment can be configured different types of mold can grow efficiently.

Mold on the growth surface 112 grow, can change the electrical properties of the surface. For example, impedance, capacitance, frequency response and / or other electrical properties of the growth surface 112 be changed by mold growth. The properties of the growth surface 112 can change due to mold formation, as the mold from the nutrients in the growth surface 112 nourished and its roots (mycelium) spread to reach more nutrients. The changes in both the growth surface 112 as well as the penetration of the mycelium lead to changes in impedance, capacitance, frequency response and other electrical properties.

14 shows a detection device that is configured to measure the electrical properties. The electrical detection configuration 1400 can make a first electrical contact 1404 and a second electrical contact 1406 contain that to a growing area 1408 are coupled. The first electrical contact 1404 and the second electrical contact 1406 can on the growing area 1408 be glued or deposited. In some configurations, a substrate can be the growth surface 1408 be a film and the contacts can be deposited on the substrate, ie deposited or etched.

A voltage can be applied through the first electrical contact 1404 and the second electrical contact 1406 be created. The voltage can be electrical fields 1412 inside the case 1402 and the growing area 1408 produce. The first electrical contact 1404 and the second electrical contact 1406 can work as a capacitance sensor. A dielectric between the first electrical contact 1404 and the second electrical contact 1406 can through the growing area 1408 , form 1410 and air with the case 1402 To be defined. If the mold 1410 on the growing area 1408 and in through the case 1402 defined chamber grows in, the dielectric properties can change. By measuring the dielectric change over time, the system can detect mold growth, mold concentration and / or mold types. The first electrical contact 1404 and the second electrical contact 1406 can be electrical with the control device 116 be coupled. The control device 116 can be configured to apply voltage across the first electrical contact 1404 and the second electrical contact 1406 delivers. The detection device can be a current sensor for measuring the between the first electrical contact 1404 and the second electrical contact 1406 flowing current included. The control device 116 can be configured to generate an AC waveform with a range of frequencies and orders of magnitude. By applying a known voltage waveform and measuring the resulting current, the controller can 116 determine the capacitance using basic electrical relationships. If the mold 1410 grows and the dielectric changes, the capacitance value can change. The control device 116 can be configured to tune the frequency dg sweept to get a frequency response of the dielectric properties.

15 shows a capacitive sensor 1500 that have a variety of electrical contacts 1504 contains that to a growing area 1502 coupled or integrated with this. The electrical contacts 1504 can be arranged as a grid or in another pattern. Each of the electrical contacts 1504 can be electrical with the control device 116 be coupled (e.g. by a suitable electrode grid). The control device 116 can be configured to have the capacity across each pair of electrical contacts 1504 measures as described above. The arrangement of the capacitive sensor 1500 allows mold growth on different areas of the growing area 1502 to be detected. By dividing the growth area 1502 in smaller areas, mold growth can be determined in a shorter time. The capacitive sensor 1500 can also be the specific area on the growing area 1502 identify where mold growth occurs. This can be particularly useful when the growing area 1502 configured with different nutrient treatments in different regions (e.g. 8th and 10th ). The control device 116 can be configured so that a voltage between any pair of contacts 1504 applied and a corresponding current is measured. The control device 116 can detect mold formation between the contact pair when the capacity changes by a predetermined amount.

16 shows a possible configuration for a growth medium 1600 for electrical detection to detect electrical properties of a growth surface 1602 . The growth area 1602 can contain conductive strips that can be electrically excited to measure electrical properties. A first conductive strip 1604 and a second conductive strip 1606 can on the growth surface 1602 be attached. Between the first conductive strip 1604 and the second conductive strip 1606 can a Mold growth area 1608 lie. The mold growth area 1608 can be treated with nutrients to promote mold growth. Mold growth in the growth area 1608 can change the electrical properties between the conductive strips. The conductive strips can also be configured to be perpendicular to the representation in FIG 16 stand. Other configurations of the conductor tracks are possible (e.g. circular, arc). The first conductive strip 1604 and the second conductive strip 1606 can periodic gaps 1605 or contain openings so that a measurement only through the growth area 1602 that is inside the growth chamber.

17th shows a first electrical detection configuration, in which the electrical contact with the conductor tracks via rollers of the surface exchange mechanism. The electrical sensing configurations can use a sensing device located on the underside of the growth area 1602 is installed. The surface exchange mechanism can be a first roller 1702 and a second roller 1704 include that with the electrically sensing growth medium 1600 be in contact while the growing area 1602 in the chamber 103 located. One or more of the first roller 1702 and the second roller 1704 can contain conductive contacts over the circumference of the corresponding roller. The conductive contacts may extend around the rollers so that the conductive contacts are the electrically sensing growth medium 1600 can contact the rollers in any rotational position. For example, the first roller 1702 a high-sided contact 1706A included, the electrical with the control device 116 is coupled. The first roller 1702 can make a low-side contact 1708A included, the electrical with the control device 116 is coupled. The second roller 1704 can make high-sided contact 1706B included, the electrical with the control device 116 is coupled. The second roller 1704 can make a low-side contact 1708B included, the electrical with the control device 116 is coupled. The high-side contacts 1706 on the reels can be configured to match the first conductive strip 1604 of the electrically sensing growth medium 1600 be aligned. The low-side contacts 1708 The rolls can be configured to match the second conductive strip 1606 of the electrically sensing growth medium 1600 be aligned. The electrical connection of the contacts 1706 , 1708 with the control device 116 can be done via a slip ring or a similar device.

If the growing area 1602 of the electrically sensing growth medium 1600 as the conductive strips advance, they can maintain contact with the contacts of the rollers. The gaps 1605 can limit the measurement to the surface that is inside the chamber. In this way, the areas of the tape outside the chamber have no influence on the measurement. The control device 116 can change the electrical properties of the electrically sensing growth medium 1600 measure by excitation of the conductive strips. For example, the control device 116 be programmed so that a voltage or a potential via the high-side contact 1706 and the low-side contact 1708 is created. The voltage can cause a current to flow that is proportional to the impedance of the mold growth area 1608 is. The control device 116 can measure the current flowing and determine the resistance using Ohm's law. The control device 116 can supply an alternating voltage and sweep the frequency through a predetermined range to the impedance and / or the frequency response of the growth area 1608 further characterize.

In configurations where the conductive strips are perpendicular to the images, the rollers can be made of a conductive material and electrically connected to the controller 116 be connected. The conductive strips of the electrically sensing growth medium can be spaced a distance that corresponds to the distance between the rollers. In this configuration, one roller can contact a high-side conductive strip and the other roller can contact the low-side conductive strip. The conductive strips can also have gaps, and the conductive surface of the rollers can have corresponding gaps.

18A shows a second electrical detection configuration 1800 , which relies on electrodes to interface with the conductive strips in the electrically sensing growth medium 1600 to build. The second electrical detection configuration 1800 can be a first electrode 1806 and a second electrode 1808 include. The first electrode 1806 and the second electrode 1808 can consist of a conductive material and electrically with the control device 116 be connected. The first electrode 1806 can with the second conductive strip 1606 of the electrically sensing growth medium 1600 be aligned. The second electrode 1808 can on the first conductive strip 1604 of the electrically sensing growth medium 1600 be aligned. The electrically sensing growth medium 1600 can with a first roller 1802 and a second roller 1804 associated with the surface exchange mechanism come into contact.

18B shows a side view of the second electrical detection configuration 1800 that have more details regarding the second electrode 1808 shows. The second electrode 1808 can be in an electrode housing 1809 to be built in. The electrode housing 1809 can be dimensioned so that it is the second electrode 1808 partially contains and movement of the second electrode 1808 on the growth medium 1600 to and from this. A spring mechanism 1810 (or another compliant element) can be in the electrode housing 1809 and under the second electrode 1808 be positioned. The spring mechanism 1810 exerts a force on the second electrode 1808 out of contact with the surface of the electrically sensing growth medium 1600 maintain. The electrode housing 1809 can with a mounting surface 1812 be coupled, which can be part of the structure of the surface exchange mechanism. Other electrodes can be configured similarly. The first roller 1802 and the second roller 1804 can use the electrically sensing growth medium 1600 Touch to enable or facilitate movement. The first roller 1802 and the second roller 1804 can also put enough pressure on the electrical scanning tape 1600 exercise to ensure that the chamber is sealed. The first roller 1802 and the second roller 1804 can be attached to the mounting surface using brackets 1812 be coupled.

The control device 116 can be configured to measure baseline impedance characteristics before mold grows on the growth surface. The control device 116 can then monitor for changes in impedance characteristics that indicate mold. The control device 116 can store data related to impedance characteristics for different types and concentrations of mold. The control device 116 can compare the measured impedance characteristics with the stored characteristics (e.g. characteristic curves) in order to identify a mold type and / or a mold concentration in the chamber.

The electrical sensing configurations may also include features to improve electrical contact between the conductive strips of the growth surface and the sensor elements. For example, the electrical sensing configurations may include one or more magnets or electromagnets that are arranged to magnetically attract the growth surface. The conductive strips can be made of nickel, for example. An electromagnet can be positioned under the conductive strips near the electrode or roller (e.g. near the location where the electrical contact takes place) and is energized when electrical contact is desired. The electromagnet can attract the conductive tape and ensure contact with the electrode or the roller contact. This feature is useful when the growing area can be moved because the electrical contact can be broken during the movement process. The mechanism for restoring an electrical connection between the growth surface and the detection device ensures reliable operation behavior.

In some configurations, mold can be detected using biological or chemical elements as binders or reactants for the purpose of detection. The biological or chemical elements can be configured to bind to or react with mold spores. For example, certain antibodies or enzymes bind to certain types of mold, and binding events can be detected using various detection methods (e.g. change in electrical properties). In addition, the reaction between the mold spores and the biological or chemical elements can cause the release of chemical compounds. The released connections can be connected to sensors, e.g. chemical, optical and electrical sensors can be detected. The binding or reaction event can be used to determine the presence of different types of mold. The binder or reactant can also be used to capture mold spores before the growth stage. Various biological or chemical elements can also be used to promote or retard mold growth.

In some configurations, mold can be detected with an audio-based detector. The growing mold can affect the way the sound propagates in the chamber. Due to the mechanical nature of the molecular structure, the growing mold absorbs and reflects sound waves of certain frequencies. In some configurations, the detector may include a source configured to emit a sound wave and a receiver configured to convert the sound signals to electrical signals. The configuration can depend on the type of sound to be measured. In a configuration in which the reflection of the sound waves is measured, a source module 210 and a receiving module 212 be installed inside the chamber (e.g. on the same side of the growth area). The receiving module 212 receives sound waves from the growing area 112 be reflected. In some configurations, the detector may be an ultrasound transmitter / receiver that is the source module and receiver module contains. In a configuration in which the transmission of sound waves through the growing area 112 the source module can be measured 210 and the receiving module 212 on opposite sides of the growing area 112 be attached (e.g. in 2nd shown). The sensor source module 210 can be, for example, an ultrasound loudspeaker and the sensor receiving module 212 can be a microphone configured to convert sound signals into an electrical signal. The sensor source module 210 can from the tax establishment 116 can be controlled. The control device 116 can the sensor source module 210 Operate so that it outputs a frequency sweep in a predetermined frequency range. The control device 116 can receive the electrical signals from the sensor receiver module 212 received and measure the size of the received sound signal. The control device 116 can be configured to estimate the molecular resonance frequency of the mold to determine the specific type of mold growing.

The control device 116 can save previously created sound profiles that represent different mold types and concentration levels. The control device 116 can be configured to compare a measured sound profile with the stored sound profiles to determine the type and / or degree of concentration in the chamber 103 to identify growing mold. In some configurations, the controller 116 detect mold growth by changing the sound profile compared to a basic sound profile. Additional sensors can be installed (e.g. for measuring volume or weight) to enable a better estimate.

An ultrasonic sensor can also be used to measure the growth of the mold out of the plane by emitting a sound pulse and measuring the response time (e.g. the time in which the sound reaches the receiver). A larger vertical growth can lead to a shorter pulse return time. The detection device can comprise an ultrasound transmitter and an ultrasound receiver for measuring the reaction time. The control device 116 may include circuitry for generating the ultrasound signal and receiving the reflected ultrasound signal. The control device 116 may include circuitry and / or control logic to detect the delay between sending the ultrasound signal and receiving the reflected signal. The control device 116 can be programmed to measure the amount of mold growth off the plane. The altitude can be monitored and saved over time. The control device 116 can store data on mold growth patterns for different types of mold. Mold growth patterns can be derived experimentally, for example, by experiment. The mold type can be determined by comparing the measured growth pattern with the historical patterns.

In configurations with an audio-based sensing device, the enclosed volume or chamber may be sound / audio isolated from the outside. For example, the chamber can be coated with a material to minimize sound echo. It also prevents outside noise / sound from affecting the measurement process inside the chamber 103 to disturb. The housing 102 can also be configured so that the audio / sound properties within the chamber 103 can be optimized to minimize unwanted echoes or reflections. An additional microphone can be placed outside the chamber 103 be attached and used to subtract external noise from the measurement signal in order to improve the accuracy of the measurement (eg difference measurement).

The growth surface can also have certain mechanical properties (e.g. inertia, mass). The surface can vibrate or vibrate when excited by a sound wave. The vibration can be characterized by a certain damping. The damping can be characterized by how quickly the size of the oscillation or oscillation subsides after the end of the excitation. A thicker layer of mold growth can result in more dampening of the growth surface. That means that the vibrations of the growth surface will subside in a shorter time. The audio sensor source can be used to excite the growth surface with sound waves to generate vibrations that can lead to changes in response times from the transmitter to the receiver. A first baseline can be created before the growth surface is exposed to the outside air, and a second baseline can be created before the mold grows. For example, the audio signal can cause vibration or deflections in the growth surface that can be measured. After exposure and mold growth, the measurements can be repeated and compared to the second baseline. An increase in damping may indicate mold on the surface. The magnitude of the damping increase can be an indication of the extent of mold growth that has occurred. Multiple ultrasound speakers can be used to create a stereo effect for the measurements.

Experimental tests can be performed to determine the damping properties of mold growth in the chamber. Mold growth can occur under controlled conditions and damping properties can be measured at various stages of growth. The data can be saved for different types of mold. The control device 116 can save the data for later comparison. The control device can compare a damping reaction with historical damping reactions 116 may determine the stage of growth, concentration and / or the type of mold that is spreading.

Mold can be detected by measuring the mechanical properties of the growth surface, which are changed by mold formation. The mechanical properties can be measured by applying actuation pulses and measuring the resulting frequency and / or amplitude responses. In some configurations, the mold sensor may include a mechanism to excite the growth surface. For example, a piezoelectric substrate can be built in to enable excitation of the growth surface. The growth surface and the electrical contact system can be similar to that in 16 to 18th can be configured. For example, the growth surface may include a pair of conductive strips with a piezoelectric material in between. The piezoelectric substrate can be electrically connected to the control device 116 be coupled. As previously discussed, the electrical contact can be made using electrodes or contacts on the rollers. The control device 116 can actuate, ie agitate (eg by applying a voltage or a current at a predetermined height or profile) to cause the growth surface to move or deform at a particular frequency or amplitude defined by the excitation. The control device 116 can stop actuating the piezoelectric substrate and measure the vibration and / or damping. The measurement can take place via an optical or electrical detection device. In some configurations, the measurement can be performed with signals from the piezoelectric substrate. For example, the vibrations can create a voltage across the piezoelectric substrate.

The piezoelectric substrate can be used as a sensor for other configurations, e.g. the audio-based sensor configurations. The piezoelectric substrate can generate an electrical signal when the pressure of the sound waves interacts with the piezoelectric substrate. The piezoelectric substrate can serve as a microphone and can be used to measure the deflection or movement of the growth surface caused by sound waves. The piezoelectric material can be arranged on the substrate / the growth surface between at least two conductive regions. The piezoelectric material can be configured such that an electrical signal is generated at the conductive areas on the basis of a deflection or deflection of the substrate or the growth surface. The piezoelectric material can be configured such that it causes a deflection of the substrate or the growth surface in response to a voltage applied across the conductive regions.

The substrate can be used as a cantilever i.e. Support beams, an array of cantilevers, bridges, an array of bridges, a membrane or an array of membranes and a plate can be structured. In some configurations, independent mechanical structures can be configured to promote the growth of different molds. Measuring the mechanical properties of each independent structure can help identify the types of mold that are growing.

The excitation of the growth surface can also be achieved by an electromagnet interacting with the growth surface. For example, a conductive strip of nickel or ferromagnetic material can be attracted to the electromagnet. The control device 116 can be configured to pulsate the electromagnet to cause vibrations on the growth surface. An optical sensor can then be used to measure the vibrations and / or the damping of the growth surface. Mold growth can be determined by comparing the first and second baseline responses recorded during the initial stages of the measurement cycle. Electrostatic actuation can also be used to stimulate the growth surface. For example, a comb drive or an electrostatic motor can be used to excite the growth surface.

The mold sensors can be configured for extended use to continuously detect mold in an environment. Such configurations can use the surface exchange mechanism to continuously advance the growth surface so that multiple measurement cycles can be performed. In some configurations, the surface exchange mechanism can be a replaceable cartridge or cartridge into which a new one is inserted Growth medium can be used to continue the tests. Some sensor configurations may work well for an interchangeable configuration. For example, configurations in which the sensing device is built into the housing may be well suited for these applications. Configurations that include a portion of the detector beneath the growth surface may require additional costs for each replacement cartridge.

The surface feed mechanism can be configured to detect a lack of availability of a new growth surface. For example, the band-based surface exchange mechanism of 11 may not be able to continue moving the growth surface if there is no unused ribbon. This can be due to an increase in torque or the inability to control the speed of the driven coil 1106 to be changed. The control device 116 can be configured to detect this and notify the user that additional measurements are not possible. In other configurations, the last growth area that can be moved into the chamber can have other properties. For example, the last growth area can be given another property that can be detected by the detection device. For example, the last growth surface can be transparent or reflective in order to change the intensity of the light detected by an optical sensor. The control device 116 can be configured to detect the change during a baseline measurement and identify the condition.

The mold sensor can also be configured as a single use device to detect mold once. The mold sensor can be configured with a replaceable cartridge that does not advance the growth surface i.e. moved on. Single use can be used for some sensor configurations such as Variants for measuring the mechanical properties, may be more suitable. For example, the mold sensor can define a slot into which a growth surface (e.g. a slide or a strip) can be manually inserted. After the measurement cycle has been completed, the growth surface can be manually removed and discarded. In some configurations, the growth surface can be cleaned and treated with nutrients and reused.

In some configurations, a continuous measurement configuration can be configured to clean and treat the growth surface again. For example, a tape-based configuration may include an electromechanical wipe / wiper mechanism that scrubs or wipes the growth surface after the mold destruction phase. The surface exchange mechanism can be configured with a removable waste bin that collects the waste. The surface exchange mechanism can be configured to reapply nutrients to the growth surface. For example, the growth surface can be moved through a nutrient reservoir or a nutrient solution can be sprayed or dripped onto the growth surface.

The configurations of the detection device described here can be combined in a specific application. The mold sensor can use more than one of the sensor technologies described to better measure mold growth or various properties that indicate mold growth.

The growth of mold and the speed of mold growth can be affected by temperature. Different types of mold can react differently to a certain temperature. As in 1 shown, the thermal control 120 by the control device 116 being controlled. The thermal control 120 can be operated to keep mold growth inside the chamber 103 to influence. The control device 116 can have a closed temperature control inside the chamber 103 implement by using the thermal control 120 with temperature feedback from the chamber environment sensor 118 controls. The control device 116 can be configured to choose a temperature setpoint to help mold grow inside the chamber 103 optimize for a particular mold type. The control device 116 can be configured so that the temperature setpoint is set so that the presence of different types of mold is detected. An open loop strategy can also be implemented in which the control device 116 is programmed to be the thermal control 120 activated with a given profile.

The control device 116 can be configured to be the mold suppressant 108 actuated to affect mold growth. The control device 116 can the mold suppressant 108 press to determine the thickness of the mold. The control device 116 can the mold suppressant 108 operate in short bursts configured to kill weaker mold spores. The control device 116 can the mold suppressant 108 press to modulate the growth rate of the mold. The control device 116 can also use the mold suppressant 108 operate to saturate the chamber 103 by destroying part of the mold. The control device 116 can be configured to take sensor measurements before and after using the mold suppressant 108 is carried out in order to detect any differences in the mold concentration that may have occurred. The control device 116 can be configured to have a rate of mold destruction during the mold suppressor activation 108 detected. The mold destruction rate can be used to identify the growing type of mold.

The mold suppressant 108 can be configured to output different UV wavelengths to measure the impact of different UV wavelengths on mold destruction. The mold suppressant 108 can be configured so that the intensity of the light can be varied. The control device 116 can control or select the intensity of light and the UV wavelength during the mold destruction phase. The control device 116 can operate different light sources that provide different light wavelengths or filter elements with one or more broadband light sources. If the control device 116 has determined that a certain type of mold is present, the control device 116 configured to select a UV wavelength that is effective in destroying the particular mold type present. The control device 116 can provide data regarding the preferred parameters for the mold suppressant 108 save to destroy different types of mold.

The mold sensors described can be operated automatically. The control device 116 can, for example, be configured so that it plans a measuring cycle at specified time intervals. The control device 116 can be configured to determine trigger conditions for initiating a measurement cycle. The control device 116 For example, can monitor weather information from the external sensors or the network to determine if conditions for mold formation exist. So the control device 116 For example, initiate a measurement cycle after an increase in air humidity or a drop in temperature has been detected. The control device 116 can also be configured to detect local conditions that lead to increased mold growth. The control device 116 can save measurement results and the associated conditions during the measurement cycle. Over time, the control device 116 learn that certain conditions are associated with mold formation. If the conditions are detected, the control device can 116 shorten the time between measuring cycles.

20 shows a possible configuration of the mold sensor system. A mold sensor 2000 can the control device 116 contain. The control device 116 can be a processing unit 2002 and volatile and non-volatile memory 2004 contain. The mold sensor 2000 can a human-machine interface (HMI) 2008 included to interact with the user. The HMI 2008 can consist of a combination of hardware and software elements. The mold sensor 2000 can be operated at the request of the user. The control device 116 can the HMI 2008 implement (e.g. button / light) that allows the user to initiate a measurement cycle. The user can initiate a measurement cycle by pressing a button and a light can indicate that a measurement cycle is in progress. The mold sensor 2000 can also trigger an alarm 2014 included, which provides feedback when a mold growth threshold is detected. The alarm 2014 can be a visual alarm such as a light emitting diode (LED) or a display panel. In some configurations, the alarm 2014 be an audible alarm. The control device 116 can be programmed so that the alarm 2014 via the HMI 2008 in response to the detection of mold concentrations that exceed a threshold during a measurement cycle. The control device 116 can detect a stronger than normal mold growth if an estimated mold concentration exceeds a predetermined concentration. The alarm can be an acoustic alarm and / or a virtual alarm that is communicated to the user.

The control device 116 can be a communication interface 2006 included, which enables a user to use the control unit 116 via a cloud or a network 2010 to communicate (e.g. Ethernet, Bluetooth). The control device 116 can be programmed with a web interface, which allows access to the parameters of the mold sensor via a web browser on a user device 2018 , such as a computer or other device. The HMI 2008 may include an application running on the user device 2018 running, for example a cell phone or a tablet. The HMI 2008 can be configured so that the user can initiate and / or plan a measurement cycle. The HMI 2008 can be configured to transmit measurement results to the user. The HMI 2008 can be configured to inform the user of the current status of the mold sensor. This is how the HMI 2008 for example, the remaining battery life, the remaining growth surface or the remaining measuring cycles and warnings regarding mold detection. The mold sensor 2000 can contain a display module that is configured by the HMI 2008 is controlled.

The mold sensor 2000 can be an energy interface 2016 for the power supply of the mold sensor components included. The energy interface 2016 may contain a battery. The battery can be rechargeable. In some configurations, the power interface 2016 connect to an external source. For example, the energy can be provided via a power supply unit that is connected to a household socket.

The system can use a variety of mold sensors 2000 that work cooperatively to determine mold growth and concentrations. In some configurations, the mold sensor system can have a first mold sensor (e.g. 2000A ) and a second mold sensor (e.g. 2000B ) include. The first mold sensor 2000A may be in an area where excessive mold growth should be monitored. The second mold sensor 2000B can be in a reference range. The reference range can be outdoors, for example. The reference area can be an area in which excessive mold growth is not suspected. The second mold sensor 2000B can provide information about mold concentrations that are normally present in the area. For example, the second mold sensor 2000B Provide information about mold growth for a normal amount of mold spores that are naturally present in the area. The first mold sensor 2000A can provide information about mold concentrations that may differ from the reference area because they are in an area with active mold growth. The first sensor 2000A can be in a damp basement, for example, where mold has been growing for some time. The presence of mold in a closed area can lead to an increased concentration of mold spores in the air compared to the reference area. By using multiple mold sensors, the system can determine whether the mold concentration is abnormal compared to the reference range.

Using multiple mold sensors can prevent inaccurate evaluations. For example, mold spore concentrations can typically vary throughout the year. By including a reference mold sensor, the normal fluctuations can be subtracted from the mold assessments of interest. This provides more accurate concentration data for the area of interest and can prevent false warnings due to seasonal fluctuations in mold spore concentrations. The mold sensor system can, for example, prevent a warning if a ratio of the measured mold concentration to the ratio of the reference mold concentration is below a threshold value. A warning can be an indication that there are more mold spores of certain types on an indoor area compared to an outdoor area.

In some configurations, the system can evaluate mold growth for different types of mold. For example, different types of mold can grow on a growth surface with differently treated areas and / or on a growth surface with areas that are exposed to different environmental conditions. The sensor can be configured to measure the mold concentration for each region or type of mold. The concentrations of each mold type can be compared with corresponding reference values of a mold sensor that is placed in a reference area.

The mold sensors 2000 can via the communication interface 2006 communicate with each other. One of the mold sensors 2000 can be configured as a master device. The master device can be configured to manage and coordinate the operation of the other mold sensors. The master device can receive mold growth and concentration data from the other mold sensors. The master device can measure the mold sensors 2000 synchronize. For example, the master device can send a start measurement cycle signal to the mold sensors in order to initiate a measurement cycle. The master device may also be configured to determine the mold growth concentration threshold based on data from a reference mold sensor.

The control device 116 can be configured to perform data analysis. The control device 116 can also be configured to collect measurement data and the data for processing to a server 2012 or sends a cloud computer. The control device 116 can be configured to send measurement data to the user direction 2018 sends. An advantage over external processing is that the algorithms can be changed at a central point without anyone individual mold sensor must be reprogrammed. The algorithms can be improved over time. In addition, data from many mold sensors can be analyzed to develop improved mold sensing strategies, and to better characterize mold growth.

The user device 2018 can be programmed to operate multiple mold sensors 2000 coordinates. For example, on the user device 2018 run a program that allows the user to communicate with the mold sensors 2000 enables. The program can allow the user to use the mold sensors 2000 to identify. For example, the program can enable the identification of one of the mold sensors as a reference mold sensor. The program can determine mold alarm thresholds based on the data received from the reference mold sensor. The control device 116 can send the results over the internet to the user device 2018 to transfer. This enables the mold sensors to be placed 2000 with the possibility of remote monitoring. In addition, the program can allow any number of mold sensors to be added to a mold detection system.

The mold sensors 2000 may contain self-test skills. The control device 116 can be programmed to operate the components to confirm proper operation. The control device 116 can be configured, for example, so that it detects that the air inlet portal 104 works properly. Some configurations may include an electrical switch or contact that closes when the air entry portal is closed 104 is in a predetermined position. The control device 116 can the air inlet portal 104 press and monitor the switch or contact to verify proper operation.

The control device 116 can be configured to be the mold suppressant 108 actuated to confirm proper operation. For example, the control device 116 the mold suppressor in a configuration with an optical detection device 108 Activate and confirm the operation by scanning the optical detection device.

The control device 116 can be further configured to calibrate the sensor system. The control device 116 can be configured to check the sensor status under conditions under which no mold grows to establish a baseline condition. The control device 116 may check the detector before exposing the growth surface to the air and / or immediately after exposing the growth surface to the air. The resulting signal should indicate no mold growth. If the detector provides signals that indicate mold, the mold sensor may need to be serviced or cleaned.

The mold sensor can be used to estimate the mold spore concentration. If the mold sensor is configured with predefined fixed parameters (e.g. temperature, humidity, pressure, measurement period), the concentration of mold spores detected in the volume can be correlated with the mold spore concentration from the reference range. For example, mold growth data can be determined in order to correlate the measured parameter with the mold concentration. Such a function can be useful in the design of multi-chamber mold sensors to detect certain types of mold.

By implementing algorithms for adapting the mold growth curve and / or for pattern recognition, the measurement time can be reduced and the detection accuracy can be improved. Molds grow differently in different environments. Curve fitting or pattern acquisition can be achieved by changing one of the parameters (e.g. temperature, humidity, pressure) during the measurement. The detector can be monitored to determine how the measured properties change in response to the change in the parameter. For example, if the sensor output changes faster in higher humidity than in lower humidity, there may be mold spores. This enables mold detection without having to wait for the mold spores to grow to large concentrations.

21 shows a flow chart 2100 for a possible sequence of operations to operate the mold sensor configurations. During the operation 2102 can be checked whether a measurement trigger condition exists. The measurement can, for example, be triggered manually by a button or a switch, commanded via the network and / or planned. In some configurations, the controller 116 determine a trigger condition based on the environmental conditions. The trigger conditions can include a check to determine if there is sufficient growth area available for measurement (e.g. if the remaining band is the one for measurement quantity required). If there is no trigger condition, the operation can 2102 be repeated.

If the measurement trigger condition is met, the operation can 2104 be performed to position the growth surface. A measurement cycle can begin by first positioning an unused part of the growth surface at a location where it can receive the air flow. In configurations with a movable growth surface, the controller can 116 operate the surface exchange mechanism to bring the growth surface into a predetermined position. For example, an unused portion of the growth surface can be advanced into the growth chamber. In some configurations (e.g. 6 and 7 ) the growth surface can be positioned in an exposed area outside the growth chamber.

During the operation 2106 the growth surface can be exposed to the air. The control device 116 can, for example, open the air inlet portal to allow air to flow into the growth chamber. The air entry portal can be opened for a predetermined period of time and then closed. The predetermined period of time can be detected on the basis of the environmental conditions detected by the environmental sensors. In some configurations, an airflow sensor or pressure sensor can be monitored to determine when to close the air entry portal.

During the operation 2108 a baseline measurement of the particles that accumulate on the growth surface can be carried out. The air inlet portal can be closed before the baseline measurement. The baseline measurement can depend on the type of sensor technology used. In a configuration with a gas sensor or chemical sensor, for example, mVOCs can be recorded and recorded in the closed chamber. In the case of an optical sensor, the properties of light / electromagnetic waves that are reflected from or transmitted through the growth surface can be measured.

When mold spores stick to the nutrient-rich growth surface, the mold starts to grow. During the operation 2110 the chamber environment can be controlled to predetermined parameters. The control device 116 can be configured to improve the growth environment by operating thermal control element (s) 120. The control device 116 can the thermal control 120 operate to increase the rate of mold growth. In addition, any additional system to promote mold growth can be activated (eg moisture control).

During the operation 2112 sensor measurements can be carried out. The control device 116 can take measurements with one or more sensors during the growing season and compare the results with the baseline measurement. For example, the control device 116 monitor the change in mVOCs during the growing season. The properties of reflected or transmitted light can be monitored with an optical sensor.

In operation 2114 a check can be made to see if the measurement cycle is complete. For example, a measurement cycle can be completed after a predetermined period. In some configurations, the sensor data can be monitored and the measurement cycle can be terminated if mold is detected. If the measurement cycle is not completed, the operation can begin 2112 and the operation 2114 be repeated.

When the measurement cycle is complete, the operation can begin 2116 be carried out to process the sensor data. The presence of mold can be determined by comparing the sensor data with stored data that indicate mold formation. The extent of mold growth can be calculated back to determine the concentration of mold spores using algorithms such as the Quantitative Polymerase Chain Reaction (QPCR). The processed measurements can contain the mold detection data from other mold sensors that are coupled within the same communication network. A mold concentration from a reference sensor can be compared with the other measured mold concentrations. The control device 116 can be programmed to change a signal indicating mold growth based on the changes detected in the sensor measurements. The control device 116 can, for example, take periodic measurements and compare the results with the baseline measurements.

In operation 2118 a check can be made to see if mold is detected as described above. For example, if the ratio of the measured mold concentration to a reference mold concentration exceeds a threshold, the system can indicate that mold is present. If mold is detected, the operating process can 2120 be performed to generate an alarm or warning signal. A signal can be generated and output that indicates mold formation. The alarm or warning can be sent to the user device 2018 sent and displayed on this. After the warning or display has been generated, the operating process can begin 2122 be performed. If no mold is detected, the operating process can 2122 be performed. The signal indicating mold formation can be an indicator that mold formation has been detected in a sample. In some configurations, the signal indicating mold formation may be an indicator that an amount or ratio of mold in the air exceeds a predetermined threshold. In some configurations, the signal indicating mold formation can be a measure of the amount of mold present in the sample or in the air.

In operation 2122 can the control device 116 use the mold suppressor to destroy any mold that may have grown. The control device 116 can scan the detection device during the destruction phase to detect any changes and thus ensure that the mold is destroyed. The whole process can then be repeated.

The mold sensor configurations provide this ability to monitor mold growth in an environment over time. The enclosed volume provides a controlled environment for mold growth that enables mold to be detected more quickly. In addition, the enclosed volume enables mold to grow without the mold spreading to other areas. In addition, the mold suppressor can be activated after the measurement cycle in order to destroy the mold that has grown. The surface exchange mechanism enables the growth surface to be exchanged for additional measurement cycles. The mold sensor enables the continuous monitoring of an area over a certain period of time.

Some configurations of the growth surface can allow identification of the type of mold that is growing. The detector can be configured to measure mold growth in a particular area of the growth surface. In this way, the mold sensor can determine the type of mold that is growing. The mold detection device is configured so that mold grows from mold spores that are present in the air at the time of sampling. The device is configured to derive or calculate the concentration of mold spores in the air that has been removed.

The mold detection device can be used in various ways. In some applications, the mold detection device can be used to determine an absolute measurement of the mold concentration. In other applications, the mold detection device can be used to indicate whether the mold concentration exceeds a threshold value that indicates a mold problem (e.g. mold sensor with a threshold value). In some applications, the mold detection device can be configured to provide a no-go indicator for the presence of mold. The mold growth rate on the growth surface depends on the amount of mold spores that are inoculated on the growth surface. Inoculation is correlated with the concentration of mold spores in the air. The mold detection device can be placed in an environment for a predetermined period of time. The mold detection device can be configured so that the detection of the mold growth at the end of the time period indicates that the concentration of the mold spores in the sampled air is above a threshold value. The threshold value can be selected so that it indicates a mold problem in the environment in which the mold detection device is installed. If no mold growth is detected at the end of the period, the concentration of mold spores in the sample air is below the threshold and is an indication of the absence of a mold problem.

The threshold mold sensor can be configured to target a given type of mold. For example, the nutrient platform can be configured to allow the growth of the predetermined type of mold. Nutrients that promote the growth of the predetermined type of mold can be added to the growth surface.

In other examples, the mold sensor can be configured to target a variety of types of mold. In these configurations, the growth relationships between the different types of mold can be examined and understood. For example, the growth or presence of one type of mold can inhibit the growth of a second type of mold. Understanding the relationship enables the mold sensor to be designed to minimize such conditions. In addition, environmental parameters such as temperature and humidity can be controlled to promote mold growth.

The processes, methods or algorithms disclosed here can be delivered to or implemented by a processing device, a controller or a computer, which can include any existing programmable electronic control unit or a special electronic control device. Similarly, the processes, methods, or algorithms can be stored as data and instructions that can be executed by a controller / computer or computer in many forms, including but not limited to information that is permanently stored on non-writable storage media such as ROM Devices are stored, and information that is changeably stored on writable storage media such as floppy disks, magnetic tapes, CDs, RAM devices and other magnetic and optical media. The processes, procedures or algorithms can also be implemented in an executable software object. Alternatively, the processes, methods or algorithms can be wholly or partly by suitable hardware components, such as application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), state machines, controllers or other hardware components or devices or a combination of hardware, software and firmware components.

While exemplary embodiments are described above, it is not intended that these embodiments describe all possible configurations that are encompassed by the claims. The words used in the description, drawings, and claims are descriptive rather than restrictive, and it is believed that various changes can be made without departing from the spirit and scope of the disclosure. As previously described, the features of various embodiments may be combined to form further embodiments of the invention that may not be expressly described or illustrated. While various embodiments may be described in terms of one or more desired features as being advantageous or preferred over other prior art embodiments or implementations, those of ordinary skill in the art will recognize that one or more features or characteristics can be deferred to desired overall system attributes to achieve that depend on the specific application and implementation. These properties may include, but are not limited to, costs, strength, durability, life cycle costs, marketability, appearance, packaging, size, suitability for use, weight, manufacturability, ease of installation, etc. In so far as embodiments are described as less desirable in relation to one or more features than other prior art embodiments or implementations, these embodiments are not outside the scope of the disclosure and may be desirable for certain applications.

Claims (20)

Mold sensor, comprising: a housing defining a chamber; a substrate treated to promote mold growth and exposed in the chamber; an optical source disposed in the chamber and configured to direct light onto the substrate; and an optical sensor disposed in the chamber and configured to receive light from the optical source reflected from the substrate and provide optical data indicative of one or more optical properties; and a controller that is programmed to drive the optical sensor, receive the optical data from the optical sensor, and output a signal indicating mold growth on the substrate based on the optical data. Mold sensor after Claim 1 , wherein the optical source and the optical sensor are integrated as one unit. Mold sensor after Claim 1 , wherein the optical source and the optical sensor are mounted on opposite side walls of the housing. Mold sensor after Claim 1 , wherein the optical source and the optical sensor are mounted on an upper cover of the housing, which is generally parallel to the substrate. Mold sensor after Claim 1 , the optical data containing color information. Mold sensor after Claim 5 , wherein the substrate is treated with a pH indicator that changes color when a pH property of the substrate changes due to mold growth. Mold sensor after Claim 6 wherein the controller is further programmed to have a color of the mold growing on the substrate identified and the signal indicating mold growth generated based on the color. Mold sensor after Claim 1 , wherein the optical sensor is an array of photodiodes. Mold sensor after Claim 1 , wherein the optical source is a laser and the optical sensor is one or more photodiodes, and the controller is further programmed to estimate out-of-plane growth on the substrate by detecting a time shift between a drive signal provided at the optical source and corresponding optical data from the optical sensor. Mold sensor after Claim 1 wherein the controller is further programmed to generate the signal based on changes in intensity observed in the optical data of the optical sensor. Mold sensor after Claim 1 wherein the controller is further programmed to generate the signal by comparing baseline feedback measured prior to mold growth with the optical data received during mold growth. Mold sensor after Claim 1 , wherein the optical source is one or more monochromatic optical lasers and the optical sensor is an optical spectrometer configured to provide optical data including a signature of fluorescence spectra, and the controller is further programmed to receive the signal based on the signature of fluorescence spectra. Mold sensor, comprising: a housing defining a chamber; a substrate treated to promote mold growth and exposed in the chamber; an optical source coupled in the chamber and configured to direct light onto the substrate; and an optical sensor mounted on a frame below the substrate and configured to receive light from the optical source that passes through the substrate and to provide optical data indicative of one or more optical properties; and a controller that is programmed to drive the optical sensor, receive the optical data from the optical sensor, and output a signal indicating the growth of mold on the substrate based on the optical data. Mold sensor after Claim 13 wherein the optical sensor is configured to identify a wavelength of light that passes through the substrate, and the controller is further programmed to generate the signal based on a change in wavelength. Mold sensor after Claim 13 wherein the optical sensor includes a plurality of photodetectors, each of the photodetectors being tuned to a predetermined wavelength range. Mold sensor after Claim 13 wherein the controller is further programmed to generate the signal by comparing pre-mold optical baseline data measured against the optical data measured during a mold detection cycle. Process comprising: Driving, by a controller, an optical source coupled into a housing defining a chamber and directed onto a nutrient-treated substrate to project light waves onto the nutrient-treated substrate; Receiving, by the controller, optical data indicating one or more optical properties from an optical sensor representing an interaction of the light waves with the nutrient-treated substrate; and Output, by the controller, a signal based on the optical data indicating mold growth on the nutrient-treated substrate. Procedure according to Claim 17 wherein the interaction is one or more of: reflection of the light waves from the nutrient-treated substrate, absorption of the light waves by the nutrient-treated substrate, and scattering of light waves from the nutrient-treated substrate. Procedure according to Claim 17 , the interaction being a transmission of the light waves that pass through the nutrient-treated substrate. Procedure according to Claim 17 , further comprising estimating out-of-plane growth on the nutrient-treated substrate by measuring a time shift between a signal that drives the optical source and corresponding optical data.

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