DE102019208841A1 - Solderable, in particular one-piece optical light guide module for scattered light smoke detection and smoke detection block, smoke detection module and scattered light smoke detector - Google Patents

Abstract

An optical light guide module (10) is provided for mounting on a circuit carrier (6) of a scattered light smoke detector, on which at least two optoelectronic components (31, 32), in particular an LED and a photosensor, are provided for the optical scattered light smoke detection. The light-conducting module comprises at least one first and second light guide body (11, 12) and at least one intermediate body (2) which firmly connects the latter to one another. The light guide bodies each have a first and a second light entry / exit surface (F1, F2). The respective first light entry / exit surface is aligned with a common scattered light volume (SZ). The respective second light entry / exit surface faces one of the optoelectronic components provided for scattered light smoke detection. The light guide bodies have such radiation-optical properties that the common scattered light volume can be imaged onto the respective optoelectronic component. The invention also relates to a smoke detection block (20), a smoke detection module (30) with such an optical component and a scattered light smoke detector. The inventive devices can be applied directly to the circuit board and soldered to the other components, such as by means of a reflow soldering.

Description

The invention relates to an optical component for scattered light smoke detection and for (SMD) mounting on a circuit carrier of a scattered light smoke detector. The optical component comprises a first and a second light entry / exit surface. The first light entry / exit surface is aligned with a stray light volume provided for scattered light smoke detection. The second light entry / exit surface is located opposite an optoelectronic component provided on the circuit carrier for the scattered light smoke detection. The optical component has such radiation-optical properties that the scattered light volume can be imaged in a beam-optical manner onto the optoelectronic component.

Such an optical component is known from the French published patent application FR 2 964 743 A1 , from the publication of the US patent application US 2017/370835 A1 and from the international publication WO 2009/036988 A1 known. For the construction of a scattered light arrangement, two such optical components designed as light guide bodies are required which, after being aligned on a printed circuit board, define a common scattered light volume relative to one another. The two light guide bodies have a scattered light angle in the plan view of the printed circuit board β to each other.

An optical component is understood to be a component which interacts with light, that is to say in particular light-shaping, light-conducting and / or light-converting. Examples of optical components are e.g. optical lenses that can focus the light and reflectors that reflect the light. The optoelectronic component is, on the one hand, a light transmitter, in particular a light-emitting diode (LED), and, on the other hand, a photosensor, in particular a photodiode. The light-emitting diode is typically designed as a surface radiator, in which the emitted light is radiated from a flat surface with a Lambertian light distribution.

The scattered light volume is defined as a geometrical intersection volume of a light beam emitted by a light emitter for illuminating particles to be detected with an optical receiving sector of a photosensor.

By "optical radiation imageable" is meant here that part of the scattered light from the scattered light volume to which the optical waveguide is optically aligned is directed or focussed further via the first light in / out surface to the second light in / out surface. This second Lichtein- / exit surface is opposite to a photosensor, so that a large part of the coupled into the light guide scattered light passes to the photosensor. In a reverse way, the light emitted by a light emitting diode is coupled via the second light in / out surface in the light guide, then further directed or focused to the first light entry / exit surface and then coupled out in the direction of the scattered light volume. The optically active surface of the light-emitting diode is in this case opposite the second light input / output surface. The respective light guidance or focusing is achieved by refractive and / or light-reflecting properties of the light guide body.

The optical scattered light smoke detection is extremely demanding with regard to the positioning of the optoelectronic components such as light-emitting diodes and photodiodes on a circuit carrier. Even the slightest mechanical offsets and tiltings between the LED chip of a light-emitting diode and its chip holder in the associated LED housing and between the LED housing and the circuit carrier are sufficient here. By "offset" is meant a lateral deviation from a standard position in the plane of the circuit carrier. By "tilting" is meant an angular deviation from the normal of the circuit carrier. Especially with light emitting diodes with a small opening angle, which are particularly energy efficient for smoke detection by concentrating the optical energy, the required dynamic range in smoke detection can not be achieved otherwise.

Particularly sensitive are in relation to the cited publication of the international patent application WO 2009/036988 A1 mechanical offsets and tilting of the respective optoelectronic components with respect to the enclosing associated light guide body. Even here, even the slightest mechanical deviations lead to a change in the overall radiation-optical image. Added to this are further mechanical offsets, tilting and alignment errors of the respective other optoelectronic components, ie at least one photodiode and optionally a further light-emitting diode, on the circuit carrier. The aforementioned arrangement errors can disadvantageously add up and lead in total to extremely large metrological inaccuracies in the optical smoke detection, up to a no longer possible smoke detection. Also to be considered are unavoidable component tolerances per se.

Accordingly high are the associated manufacturing and manufacturing costs for such an optical smoke detector. Added to this are the not inconsiderable expenses for optical calibration, such as for testing the smoke detector in a smoke duct. Such final tests can only be carried out on almost completed equipment.

Starting from the aforementioned prior art, it is an object of the present invention to provide an improved optical component for scattered light smoke detection in a scattered light smoke detector.

The object is achieved with the objects of the main claim. Advantageous embodiments of the present invention are indicated in the dependent claims.

According to the invention, an optical light guide module for mounting on a circuit carrier of a scattered light smoke detector is proposed, wherein at least two optoelectronic components for scattered light smoke detection are provided on the circuit carrier. The light-conducting module comprises at least one first and second light-guiding body and at least one intermediate body which firmly connects them to one another. The light guide bodies each have a first and second light input / output surface. The respective first light entry / exit surface is aligned with a common scattered light volume provided for the optical scattered light smoke detection. The respective second light entry / exit surface lies opposite one of the optoelectronic components provided for the optical scattered light smoke detection. The light guide bodies have such radiation-optical properties that the common scattered light volume can be imaged onto the respective optoelectronic component.

The light guide module forms a structural unit, in particular a one-piece, one-piece structural unit, which is then provided as a whole for direct surface mounting (SMD) on a circuit carrier. The particular advantage of the one-piece optical fiber is the elimination of the otherwise possible mechanical offsets or tilting in comparison to the prior art, in which two separate light guide are to be applied to the circuit substrate.

According to a preferred embodiment, the two light guide body and the at least one intermediate body made of a transparent material such as glass or made of a plastic. In the case of glass, the material is a quartz, silicate or flint glass. In the case of plastic, the material is a thermoset or a thermoplastic. By "transparent" is meant here that the material for the light used for the optical scattered light detection is transparent and in particular clear. The light wavelength of the light used is in a range of 400 nm to 1000 nm. By "clear" is meant that the material has no turbidity and thus no appreciable optical losses. As suitable plastic or thermoplastic is e.g. Polyamide, polyamide 6, polyamide 6,6, polyamide 6,12, polybutylene terephthalate, polyethylene terephthalate, polycarbonate, polyphenylene oxide, polyoxymethylene, acrylonitrile-butadiene-styrene copolymer, polymethylmethacrylate, modified polypropylene, ultrahigh molecular weight polyethylene, ethylene-styrene interpolymers, copolyester elastomers , thermoplastic urethane, polymethylmethacrylimide, cycloolefin copolymers, cycloolefin polymers, polystyrene and styrene-acrylonitrile copolymer.

In particular, the two light guide bodies and the at least one intermediate body are produced by means of a shaping method, in particular by means of a casting method or an injection molding method. The two light guide and this firmly interconnecting intermediate body thus form a one-piece solid optical component. Such a component is inexpensive to produce in high quantities with minimal manufacturing tolerances. Such an optical fiber-optic module may additionally be used e.g. be attached to the circuit board by means of one or more fastening clips. Alternatively or additionally, the optical light guide module can be glued to the circuit carrier after its attachment.

According to a particular embodiment, the transparent glass or plastic material is temperature-resistant such that it is solder-stable for a soldering process after a surface mounting together with further electrical, electronic and optoelectronic components on the printed circuit board. The soldering process is preferably a so-called reflow soldering process.

As plastic materials are, for example, in the international publication WO 2006/114082 A2 said thermoplastic materials. These have an increased temperature dimensional stability, but are still easy, cheap moldable and solder resistant before the additional crosslinking due to their thermoplastic properties.

According to one embodiment, at least one light-absorbing barrier is incorporated in at least one of the intermediate bodies of an optical light-guiding module and / or at least one notch is formed. As a result, an optical crosstalk of LED light, which is coupled into an adjacent light guide body, largely suppressed in the adjacent intermediate body and on to the adjacent further light guide body with a photosensor adjacent thereto.

In the first case, the light-absorbing barrier may be a colored light-absorbing glass (black glass) or a colored light-absorbing plastic (black plastic). In the case of the latter materials, for example, in Injection molding in an area of the intermediate body as a further material to be injected. In the second case, the casting mold for the production of the light-guiding module in the region of the intermediate body may have ribs or webs which leave notches on the outside of the intermediate body after the casting material has hardened.

According to a further embodiment, the at least two light guide bodies are at least partially provided with a coating, with the recess of the respective first and second light entry / exit surfaces. The coating is a light-absorbing and / or light-reflecting spread. Preferably, the coating is a clear, transparent coating which has an optical refractive index which is less than the optical refractive index of the glass or plastic material of the light guide body. This results in a virtually lossless reflection of light at the interface from the outside of the light guide to the coating in the sense of an optical waveguide. The coating may e.g. be spread or applied by a dip. Additionally, after its application, the transparent coating may be coated with a light-absorbing further "black" spread, at least for the light used in optical smoke detection.

According to a further embodiment, the at least two optical waveguides and the at least one intermediate body can be joined via at least one positive connection to the permanently connected optical waveguide module. The respective bodies may e.g. be glued together and / or stuck together in terms of a spring / groove connection.

According to an advantageous embodiment, the optical light guide module on a mounting side, which is opposite to the mounting of the optical fiber on the circuit carrier this. The circuit carrier is typically a (planar) printed circuit board. There are in the light guide on the mounting side at least two wegstehende or wegzeigende fitting elements, in particular pins, bolts or webs, formed, which are designed to correspond to corresponding openings in the circuit board for fitting the fitting elements in these openings. After fitting, the light guide module is fixed without play on the circuit board.

According to a further embodiment, the optical light guide module on a mounting side, which faces this circuit carrier after mounting the optical light guide on the circuit substrate. The respective light guide body has a depression on the mounting side with the respective second light inlet / outlet surface, so that the respective light guide body with its depression comprises the respective optoelectronic component on the circuit carrier. The object of the invention is further achieved with a smoke detection block which has an optical light-conducting module according to the invention. The optical light guide module has a mounting side for surface mounting of the optical light guide module on a circuit carrier. The respective light guide body has a depression on the mounting side for receiving a respective optoelectronic component designed for surface mounting. For mechanical fixation of the optoelectronic component, a first potting compound is introduced in the respective recess outside the optical path between the optoelectronic component to be fixed and an associated opposite light input / output surface. The respective optoelectronic components are accommodated in such a way that their electrical connection contacts are (substantially) aligned flush with the mounting side. The electrical connection contacts are also referred to as SMD pads. In other words, the respective planar connection contacts lie substantially in the plane of the mounting side of the light guide module. The optoelectronic components such as LEDs and photodiodes are SMD components.

By "optical path" is the gap between the respective Lichtein- / exit surface in the recess and the opposite SMD LED or SMD photodiode designated by the emitted light from the SMD LED toward the opposite light on / the exit surface extends or passes through the light to be detected by the SMD photodiode from the light inlet / outlet surface in the direction of the SMD photodiode. In this "lateral" fixation of the optoelectronic components outside the optical path, the light emission by means of the SMD LED and the light detection by means of the SMD photodiode by the first potting compound is not affected.

According to one embodiment, the first potting compound is a fast-curing adhesive, in particular a light-curing, preferably a UV-light-curing adhesive, or a fast-curing adhesive from the class of cyanoacrylate adhesives. The latter adhesives are colloquially referred to as superglue. By "fast-curing" it is meant that the adhesive at least hand-hardens within 10 seconds, preferably within three seconds, after introduction or light irradiation.

After curing of the fast-curing adhesive, the optoelectronic components are then fixed in the recesses. The fast-curing adhesive has such thermal properties, that the strength of the adhesive changes only insignificantly during the soldering process, in particular during the reflow soldering process.

According to a further embodiment, a second potting compound is introduced in the optical path between the optoelectronic component to be fixed and the associated opposite light input / output surface. The second potting compound is a transparent, in particular clear potting compound. The transparent second potting compound is at least in the light wavelength ranges used in the optical smoke detection light-conducting and clear. The potting compound thus has a low optical loss.

The second potting compound preferably has a refractive index which differs in absolute value by a maximum of 10%, preferably by a maximum of 5%, from the refractive index of the light-conducting body or of the light-conducting body material with the respective depression. In particular, the refractive index of the second potting compound and the light guide material are the same, so that ideally there is optical adaptation.

Preferably, the second potting compound is a highly transparent silicone elastomer for optical applications. Such silicone elastomers are also referred to as liquid silicones or LSR (English for Liquid Silicone Rubber).

According to a particularly advantageous embodiment, the first and second potting compound are one and the same potting compound. The one and the same potting compound is preferably a fast-curing adhesive, in particular a light-curing, preferably a UV-light-curing adhesive, or a fast-curing adhesive from the class of cyanoacrylate adhesives. In the case of a UV light-curing adhesive, the light source is a UV light source.

As a result, the optoelectronic components can first be mechanically adjusted in the respective depressions as part of an optical calibration process and only then fixed after calibration. The fixation is done by either the calibration is still within the liquid phase of the "superglue" or by the light-curing adhesive is illuminated with light for light curing preferably after completion of the calibration.

Thus, as part of the production of such a smoke detection block, the introduced light-emitting diodes and photodiodes are aligned and calibrated online. In the first case, this is still done in the liquid phase of the fast-curing adhesive based on cyanoacrylate adhesives. In the second case, after alignment and online calibration, the photocuring adhesive in the wells is irradiated with light to cure the adhesive. In both cases, thus advantageously results in a complete optoelectronic device that is already calibrated, SMD-capable and suitable for the automated reflow process. By "calibrated online" it is meant herein that the smoke detection block is used for calibration purposes e.g. is introduced into a smoke channel or that a test scattering body is introduced for calibration purposes in the scattered light volume of the smoke detection block. It is then continuously detected and evaluated during the calibration process, a sensor signal from the respective photosensor. The optoelectronic components are mechanically adjusted in the respective well until the calibration result is optimal. The online calibration is typically completed in a few seconds and is automated.

According to a further embodiment, the one and the same potting compound has a refractive index, the amount by a maximum of 10%, preferably at most 5%, of the refractive index of the light guide, i. differs from the material of the light guide, with the respective recess. Ideally, the refractive index of one and the same potting compound corresponds to the refractive index of the material of the light-guiding body of the light-guiding module. As a result, the potting compound and the material of the light guide are optically matched. Thus, possible optical refractions of a part of the light emitted by the light emitting diode during the transition from the light emitting diode into the light guide module via the second light in / out surface are minimized. Likewise, possible optical refractions are minimized in the transition of a portion of the outgoing light from the second Lichtein- / exit surface of the light guide of the Lichtleitmoduls scattered light in the opposite photosensor.

The complete smoke detection block has defined and already calibrated optical and electrical properties. By integrating the optoelectronic SMD components already in the optical light guide module, there are no more mechanical offsets. The complete smoke detection block is merely applied to the circuit board and soldered to it. Mechanical tolerances of the detector housing no longer affect the scattered light detection.

The object of the invention is further achieved with a smoke detection module which comprises an optical light-conducting module according to the invention and a module circuit carrier. The optical light guide module has a mounting side for the particular non-detachable (non-detachable) attachment of the optical light guide module on the Module circuit carrier of the smoke detection module. The light guide bodies have a respective depression on the mounting side with the respective second light entry / exit surface. The respective optoelectronic components for the scattered light smoke detection are arranged on the module circuit carrier in such a way that they are encompassed by the respective recess after the attachment of the optical light guide module to the module circuit carrier. The optoelectronic components have electrical connection contacts, which are electrically connected to externally accessible contacting surfaces on the outside of the module circuit carrier.

The optical light-conducting module can then be glued to the module circuit carrier to the smoke detection module according to the invention, be screwed to the module circuit carrier or snapped over latching webs or locking bolts with the module circuit carrier. The entire smoke detection module can be advantageously applied to a circuit carrier of a smoke detector, in which case the module circuit carrier is soldered to the circuit carrier of the smoke detector.

The object of the invention is finally achieved with a scattered light smoke detector which comprises a detector housing with at least one smoke inlet opening, an optical measuring chamber accommodated in the detector housing, which is permeable to smoke to be detected, and a circuit carrier.

The optical measuring chamber has an optical light guide module according to the invention, which is mounted on the circuit carrier of the scattered light smoke detector with the respective optoelectronic components opposite the optical light guide module.

Alternatively, the optical measuring chamber may comprise a smoke detection block according to the invention, which is mounted on the circuit carrier of the scattered light smoke detector. In this case, the electrical connection contacts of the respective optoelectronic components of the smoke detection block contact contacting surfaces on the circuit carrier.

As a further alternative, the optical measuring chamber can have a smoke detection module, which is mounted on the circuit carrier of the scattered light smoke detector. The module circuit carrier of the smoke detection module is electrically connected via its contacting surfaces with corresponding contacting surfaces on the circuit carrier.

In all three aforementioned alternatives, at least one of the optoelectronic components is a light-emitting component, in particular a light-emitting diode, and at least one further optoelectronic component is a photosensor. The scattered light smoke detector in this case has a control unit which is set up to trigger the at least one light-emitting diode in a pulsed manner, to detect a photosignal output by the respective photosensor, to detect a fire and to issue a warning or alarm message in the event of a detected fire.

Such a scattered light smoke detector is typically set up as a point detector for operation on a detector line with a plurality of other connected smoke detectors or for battery-powered stand-alone operation. Instead of the detector line, a fieldbus can also be used.

The output of the warning or alarm message can be made visually and / or acoustically on the scattered light smoke detector itself. Alternatively or additionally, the control unit may be configured to output the warning or alarm message via the detector line to a higher-level, connected to the detector line fire panel. The control unit may also be configured alternatively or additionally to output the warning or alarm message at least indirectly and wirelessly to a higher-level radio-controlled fire panel.

In all the devices according to the invention, the light-emitting diode can also be a two-color light-emitting diode. Such a two-color light-emitting diode is designed to emit light in a first wavelength range and light in a different second wavelength range in accordance with its electrical activation. The two-color light-emitting diode preferably has a first LED chip for emitting light of the first wavelength range and a second LED chip for emitting light of the second wavelength range. In this case, the photosensor is designed to detect at least light in this first and second wavelength range. For emitting red or infrared light of the first wavelength range, the use of a red-emitting LED or an infrared LED chip is known. To emit blue or violet light of the second wavelength range, the use of a blue or violet-emitting LED chip is known. By suitable evaluation of the respective colored scattered light received from the photosensor, e.g. by ratio formation, then an evaluation of the particle size of the detected smoke particles is possible. By suitable evaluation of the determined particle size is e.g. a distinction of smoke, dust and water vapor possible. The output of a possible false alarm is thereby avoided.

• 1 eine Schnittdarstellung durch ein beispielhaftes Lichtleitmodul bzw. durch einen beispielhaften Rauchdetektionsblock gemäss der Erfindung mit zwei Lichtleitkörpern entlang der in 2 eingezeichneten Schnittlinie I-I,
• 2 eine Draufsicht auf das Lichtleitmodul bzw. auf den Rauchdetektionsblock gemäss 1,
• 3 eine erste Ausführungsform des Lichtleitmoduls bzw. des Rauchdetektionsblocks mit einem im Vergleich zu 1 kleineren Höhenwinkel und mit einem grösseren Streulichtwinkel,
• 4 eine Schnittdarstellung durch ein beispielhaftes Lichtleitmodul bzw. durch einen beispielhaften Rauchdetektionsblock gemäss einer zweiten Ausführungsform mit einer Vorwärts- und Rückwärtsstreulichtanordnung,
• 5 eine Schnittdarstellung durch ein beispielhaftes Lichtleitmodul bzw. durch einen beispielhaften Rauchdetektionsblock gemäss einer dritten Ausführungsform entlang der in 6 eingezeichneten Schnittlinie V-V mit einer gewinkelten Anordnung zweier Lichtleitkörper mit einem Achsenwinkel,
• 6 eine Draufsicht auf das Lichtleitmodul bzw. auf den Rauchdetektionsblock gemäss 5,
• 7 eine Schnittdarstellung durch ein beispielhaftes Lichtleitmodul bzw. durch einen beispielhaften Rauchdetektionsblock gemäss einer vierten Ausführungsform mit einer Vorwärts- und Rückwärtsstreulichtanordnung mit einer „Sidelooker“-Leuchtdiode" und mit einer „Sidelooker“-Photodiode,
• 8 eine Draufsicht auf das Lichtleitmodul bzw. auf den Rauchdetektionsblock gemäss 7,
• 9 eine Schnittdarstellung im Bereich einer Vertiefung eines beispielhaften Rauchdetektionsblocks mit einer ersten Vergussmasse zur «seitlichen» Fixierung eines optoelektronischen Bauelements ausserhalb des optischen Pfads gemäss der Erfindung,
• 10 eine Schnittdarstellung im Bereich einer Vertiefung eines beispielhaften Rauchdetektionsblocks mit ein und derselben Vergussmasse zur mechanischen Fixierung sowie zur vorzugsweise indexgleichen optischen Anpassung eines optoelektronischen Bauelements in der Vertiefung gemäss der Erfindung,
• 11 eine Schnittdarstellung durch ein erfindungsgemässes Rauchdetektionsmodul mit einem Modulschaltungsträger und mit einer Kunststoffabdeckung,
• 12 eine Schnittdarstellung durch die Kunststoffabdeckung gemäss 11 als einstückiges Bauteil,
• 13 eine Schnittdarstellung durch eine Ausführungsform des erfindungsgemässen Rauchdetektionsmoduls mit einer „Sidelooker“-LED.

The invention and advantageous embodiments of the present invention will be explained using the example of the following figures. Showing:

• 1 a sectional view through an exemplary Lichtleitmodul or by an exemplary smoke detection block according to the invention with two light guide along the in 2 drawn section line II,
• 2 a plan view of the Lichtleitmodul or on the smoke detection block according to 1 .
• 3 a first embodiment of the Lichtleitmoduls or the smoke detection block with a comparison with 1 smaller elevation angle and with a larger scattered light angle,
• 4 3 is a sectional view through an exemplary light guide module or through an exemplary smoke detection block according to a second embodiment with a forward and backward scattered light arrangement,
• 5 a sectional view through an exemplary Lichtleitmodul or by an exemplary smoke detection block according to a third embodiment along in 6 drawn cutting line VV with an angled arrangement of two light guide bodies with an axis angle,
• 6 a plan view of the Lichtleitmodul or on the smoke detection block according to 5 .
• 7 3 is a sectional view through an exemplary light guide module or through an exemplary smoke detection block according to a fourth embodiment with a forward and backward scattering light arrangement with a "sidelooker" light-emitting diode "and with a" sidelooker "photodiode,
• 8th a plan view of the Lichtleitmodul or on the smoke detection block according to 7 .
• 9 3 is a sectional view in the region of a depression of an exemplary smoke detection block with a first potting compound for "lateral" fixation of an optoelectronic component outside the optical path according to the invention,
• 10 a sectional view in the region of a recess of an exemplary smoke detection block with one and the same potting compound for mechanical fixation and for preferably index-like optical adjustment of an optoelectronic device in the recess according to the invention,
• 11 a sectional view through a smoke detection module according to the invention with a module circuit carrier and with a plastic cover,
• 12 a sectional view through the plastic cover according to 11 as a one-piece component,
• 13 a sectional view through an embodiment of the inventive smoke detection module with a "sidelooker" LED.

1 shows a sectional view through an exemplary Lichtleitmodul 10 or by an exemplary smoke detection block 20 according to the invention with two Lichtleitkörpern 1 along the in 2 drawn cutting line II ,

The smoke detection block according to the invention 20 differs from the inventive Lichtleitmodul 10 in that the in the 1 shown and provided for the optical scattered light smoke optoelectronic components 3 ie the LED 31 and photodiode 32 , already in a transparent potting compound 5 in an associated recess V in the respective light guide body 1 preferably already calibrated recorded. By integrating the here as SMD components 3 trained optoelectronic components 3 in the optical fiber module 10 advantageously results in a structural unit that like an SMD component on a circuit board 6 can be applied and then soldered with this. By contrast, in the other case, the two optoelectronic components 31 . 32 already on the circuit board 6 soldered. These are then from the inventive Lichtleitmodul 10 after its mounting on the circuit board 6 in the respective recess V includes.

The optical fiber module 10 and the smoke detection block 20 are for mounting on a circuit carrier 6 a scattered light smoke detector provided. The circuit carrier 6 is preferably a (plane) circuit board. With OS is the top of the circuit board 6 and with MS a mounting side of the light guide module 10 or the smoke detection block 20 designated. The mounting side MS is - apart from possible wegzeigenden fixing 4 for PCB mounting, of possible recesses V for receiving the optoelectronic components 3 as well as possible notches K designed as a light barrier - plan. After surface mounting of the optical fiber module 10 or the smoke detection block 20 then lies the mounting side MS directly to the top OS the circuit board 6 opposite or is due to this.

With the reference number 11 is a transmitting-side light guide body and with the reference numeral 12 denotes a receiver-side light-conducting body. Both light guide 11 . 12 are through one of these mechanically firmly interconnecting intermediate body 2 connected. Both light guide 11 . 12 each have a first and second Lichtein- / exit surface F1 . F2 on. The respective first light entry / exit surface F1 is due to a common scattered light volume provided for the optical scattered light smoke detection SZ aligned. Next according to the invention, the light guide 11 . 12 Such optical radiation properties on that the common scattered light volume SZ to the respective optoelectronic component 31 . 32 ie on the LED 31 and on the photodiode 32 , is depicted.

The respective second light entry / exit surface F2 lies one of the optoelectronic components 31 . 32 opposite, ie the light emitting diode 31 and the photodiode 32 , The second light entry / exit surface F2 is preferably flat in or on the respective light guide body 11 . 12 formed or formed. In particular, the respective second light entrance / exit surface F2 such that it is orthogonal to the main emission direction of the light-emitting diode 31 or to the main receiving direction of the photodiode 32 runs (see the arrowed, from the LED 31 emitted light beam and the swept, from the photodiode 32 Reception light beam).

In the present example, the light-emitting diode 31 a not further shown LED chip with a (planar) luminous surface (see in detail the following 9 ). The light-emitting diode 31 is in this case a surface radiator. The illuminated area of the LED 31 thus runs parallel to the top OS of the circuit board 6 and also parallel to the second light entry / exit surface F2 , The main emission direction of the LED 31 thus runs orthogonal to the illuminated area. With LB is one of the light emitting diode 31 emitted light beam called. The directional beam of the light-emitting diode runs here 31 emitted light beam LB along the optical axis OA of the light guide body 11 , Preferably, the gap between this luminous surface and the opposite second light inlet / outlet surface F2 completely with the transparent potting compound 5 filled. The potting compound 5 preferably has the same optical refractive index as the material of the light guide module 10 or the associated Lichtleitkörpers 11 ,

Furthermore, in the present example, the photodiode 32 a not shown photosensitive (planar) layer (see in detail the following 9 ) for the detection of stray light SL from the stray light volume SZ on. Also, this photosensitive layer is parallel to the top OS of the circuit board 6 and parallel to the second light entry / exit surface F2 , In other words, the main receiving direction of the photodiode runs 32 orthogonal to the photosensitive layer and along the optical axis OA of the light guide body 12 , Preferably, the gap is between the photosensitive layer and the opposite second light input / output surface F2 completely with the transparent potting compound 5 filled. The potting compound 5 preferably has the same optical refractive index as the material of the light guide module 10 or the associated Lichtleitkörpers 12 ,

The two light guide bodies 11 . 12 as well as the intermediate body 2 are made in the present example of a transparent material such as glass or a plastic. In particular, the plastic material is a thermoplastic. Preferably, all light guide 11 . 12 as well as all intermediate bodies 2 produced by a (plastic) injection molding process. It is particularly advantageous if the entire optical waveguide module according to the invention 10 itself by means of a (plastic) injection molding process as a one-piece optical (solid) component is produced.

Alternatively, the light guide 11 . 12 as well as the intermediate body 2 , as indicated by dashed lines, via positive and / or non-positive connections FV to the permanently interconnected Lichtleitmodul 10 be joined together.

The in 1 used material is solder resistant. By this is meant that the inventive optical fiber module 10 or the smoke detection block according to the invention 20 after surface mounting together with other electrical, electronic and optoelectronic components 31 . 32 on the circuit carrier 6 a subsequent soldering process, in particular a reflow soldering process, survives unscathed. By "undamaged" it is meant that the optical properties of the optical light guide module change only insignificantly and thus have no significant influence on the optical smoke detection.

As the 1 further shows is in the intermediate body 2 an example of a light-absorbing barrier B brought in. In the simplest case, this barrier becomes B as opaque, eg black plastic, injected during the plastic injection molding process. Notches can also be used to reduce optical crosstalk K as optical barriers in the intermediate body 2 be formed.

Furthermore, the two light guide 11 . 12 already with the recess of the respective first and second light entry / exit surface F1 . F2 with a light-reflecting coating C Provided. Although the light from the LED 31 emitted light rays with few optical losses at a reflector layer RF on the outer contour of the light guide body 11 reflected. Nevertheless, for example, an applied reflective, light-reflecting layer can Minimize optical losses further. Because the reflector layer RF as a boundary layer for a total reflection of the emitted light beams, formed between light guide body 11 and ambient air, reflecting only lossy. The reflective layer may be a metal layer, such as an aluminum layer. The metal layer may be vapor-deposited, for example. In addition, the reflective coating serves C to avoid the optical coupling of stray light from the outside into the light guide body 11 . 12 , In a corresponding manner, the receiving-side optical fiber 12 such a coating C respectively.

Further, on the mounting side MS of the light guide module shown 10 fixing 4 shaped in the form of dowel pins, from the mounting side MS point away. The fixing elements 4 serve a play-free fixation of the light guide 10 on the circuit carrier 6 by means of fit. The fixing elements 4 engage in geometrically corresponding fixing holes PO in the circuit carrier 6 , The fixation openings PO can eg holes in the circuit board 6 his. The corresponding fixing elements 4 are in this case cylindrical dowel pins in the form of bolts.

In the example of the present 1 indicates the particular depression V a circumferential aperture BL on. This couples one of the light emitting diode 31 emitted, sharply limited light beam through the second Lichtein- / exit surface F2 through into the light guide body 11 on. At the same time, there is a sharp limitation of the optical reception range for the photodiode 32 in the depression V of the light guide body 12 possible. In sum, a visually more precise imaging of the scattered light volume advantageously results SZ and thus an improved optical smoke detection possible.

In the shown 1 the directional beam of the light-emitting diode runs 31 emitted light beam LB along the optical axis OA of the light guide body 11 and at an elevation angle β (Elevation) of about 25 ° with respect to the mounting side MS of the light guide module 10 , This transmitter-side optical axis OA also runs orthogonal to the (flat) luminous surface of the LED 31 and preferably passes through the geometric center of the luminous surface. The receiver-side optical axis OA as an optical lens LI trained light guide body 12 is orthogonal to the (plane) photosensitive layer of the photodiode 32 and preferably passes through the geometric center of the photosensitive layer. Both optical axes OA ideally, but not necessarily, intersect at the geometric center of the scattered light volume SZ , For the present case, that both optical axes OA spanning a plane that is orthogonal to the mounting side MS of the light guide module 10 runs, is the elevation angle β in a range of 0 ° to 45 °, preferably in the range of 10 ° to 30 °. With the reference oak α is the scattering angle of the shown scattered light arrangement for optical smoke detection. This is in the present example at 90 °. Generally this scattering angle is α in the range of 30 ° to 120 °. 2 shows a plan view of the Lichtleitmodul 10 or on the smoke detection block 20 according to 1 , This illustration is particularly clear how the two optical axes OA the two light guide 11 . 12 through the common scattered light volume SZ run. In the projection shown, the optical axes are aligned OA even so that they span a plane orthogonal to the image plane shown.

3 shows a first embodiment of the light guide module 10 or the smoke detection block 20 with one compared to 1 smaller elevation angle β and with a larger stray light angle α , The elevation angle β here has an exemplary angle value of about 10 ° and an exemplary angle value for the scattered light angle α of about 100 °.

4 shows a sectional view through an exemplary Lichtleitmodul 10 or by an exemplary smoke detection block 20 according to a second embodiment with a forward and backward stray light arrangement. In the present example, the forward scattered light arrangement is represented by the light guide body shown on the left 11 with adjoining LED 31 and the Lichtleitköper shown on the right 13 with adjoining photodiode 32 educated. One between the associated optical axes OA measured forward scattering angle α _F has an exemplary angle value of about 45 °. With FW is in the forward direction to smoke particles in the scattered light volume SZ called scattered light.

In the example of this figure, the right photodiode is 13 on one of the top OS of the circuit board 6 opposite side of the circuit board 6 arranged. The photodiode 32 "Looks" in this case by a as aperture BL acting passage opening DO in the circuit carrier 6 through to the second light entry / exit surface F2 of the right light guide body 13 , In this case, forms the associated light guide 13 no recess V out. He just shows the in the mounting side MS extending second Lichtein- / exit surface F2 on. In other words, the second light entry / exit surface runs F2 in the flat surface of the mounting surface MS ,

In the same way and not shown, a light emitting diode 31 also on one of the top OS of the circuit board 6 opposite side of the circuit board 6 be arranged. The light-emitting diode 31 shines through as a diaphragm BL acting passage opening DO in the circuit carrier 6 through to an opposite second Light entry / exit surface F2 , There is no need for deepening here V in the light guide body 11 ,

The backward scattering light arrangement is represented by the light guide body shown on the left 11 with adjoining LED 31 and the Lichtleitköper shown centrally 12 with adjoining photodiode 32 educated. The central light guide body 12 is here as a circular optical lens LI formed with a circumferential annular groove N , The latter serves as in the following 10 shown as a light barrier and for fixing a plastic cover FROM with light-absorbing structures. One between the associated optical axes OA measured backward spread angle α _R has an exemplary angle value of about 115 °. With BW is in the reverse direction to smoke particles in the scattered light volume SZ called scattered light. By combined metrological evaluation of the two photodiodes 32 output photodiode signals is then a determination of the particle size of the scattered light volume SZ Detected smoke particles possible. The exemplary light guide module 10 or the exemplary smoke detection block 20 here has three light guide 11 - 13 and two these firmly interconnecting intermediate body 2 on. Together they form a one-piece optical unit.

5 shows a sectional view through an exemplary Lichtleitmodul 10 or by an exemplary smoke detection block 20 according to a third embodiment along the in 6 drawn cutting line V - V with an angled arrangement of two light guide bodies 11 . 12 with an axis angle δ , In this laterally projected representation, the two optical axes are aligned OA the two light guide 11 . 12 , Both optical axes OA have an angle value of 0 ° for the elevation angle β on. As in this example, the geometrically formed scattered light volume SZ at the height of the first two light entry / exit surfaces F1 is, results in a particularly low overall height of the inventive Lichtleitmoduls 10 or the smoke detection block according to the invention 20 ,

6 shows a plan view of the Lichtleitmodul 10 or on the smoke detection block 20 according to 5 , In this illustration, the angled arrangement is particularly easy to see. The two light guide bodies 11 . 12 are in relation to their optical axes OA under an axis angle δ arranged with an exemplary angle value of 60 °. The two optical axes OA create a plane that is parallel to the mounting side MS of the light guide module 10 or the smoke detection block 20 runs. The axis angle δ corresponds to the scattered light angle with respect to the optical scattered light smoke detection α in the previous figures. Also in this case form the two light guide 11 . 12 with the angled formed intermediate body 2 a one-piece optical assembly.

In addition, it is noted that for the non-angled case where the axis angle δ an angle value 0 °, instead of a scattered light arrangement, a transmitted light arrangement or an extinction arrangement results. In this case, the presence of smoke particles to be detected in the area between the then directly opposite light guide bodies 11 . 12 in a decrease of that of the photodiode 32 recorded transmitted light.

7 shows a sectional view through an exemplary Lichtleitmodul 10 or by an exemplary smoke detection block 20 according to a fourth embodiment with a forward and backward scattering light arrangement and with a "sidelooker" light-emitting diode 31 and with a "sidelooker" photodiode 32 , In this case, the main emission direction of the light-emitting diode runs 31 as well as the main reception direction in the right part of the 7 shown photodiode 32 parallel to the mounting side MS , The wells V in the two outer light-conducting bodies 11 . 13 preferably form a plane second Lichtein- / exit surface F2 which are orthogonal to the mounting side MS is aligned. Both second light entry / exit surfaces F2 also run parallel to each other. The second light entry / exit surface F2 of the left light guide body 11 lies a lateral (flat) luminous surface of the LED 31 across from. The second light entry / exit surface F2 of the right light guide body 13 is a lateral (planar) photosensitive layer of the photodiode 32 across from. In the respective wells V is again a transparent potting compound 5 , as described in the previous figures introduced.

In the example of the present 7 is the forward scattered light arrangement by the light guide body shown on the left 11 with adjoining LED 31 and the Lichtleitköper shown on the right 13 with adjoining photodiode 32 educated. The backward scattering light arrangement is represented by the light guide body shown on the left 11 with adjoining LED 31 and the Lichtleitköper shown centrally 12 with adjoining photodiode 32 educated. The central light guide body 12 is here as a circular optical lens LI educated. The optical lens LI is also of two adjacent barriers B surrounded, allowing crosstalk of emitted light from the light emitting diode 31 is prevented. Furthermore, in the circuit carrier 6 one recess each ON present, in which a part of the left and right Lichtleitkörpers 11 . 13 intervenes. As a result, a particularly good coupling of emitted light of the light emitting diode 31 in the left light guide 11 and a particularly good coupling of scattered light into the right photodiode 32 possible. In this case, too form all three light guide 11 - 13 together with the two these firmly interconnecting intermediate bodies 2 a one-piece optical assembly.

8th shows a plan view of the Lichtleitmodul 10 or on the smoke detection block 20 according to 7 , This illustration is particularly clear how the two optical axes OA the two light guide 11 . 13 through the common scattered light volume SZ run. In the projection shown, the optical axes are aligned OA even so that they span a plane orthogonal to the image plane shown.

9 shows a sectional view in the region of a depression V an exemplary smoke detection block 20 with a first potting compound 51 for the mechanical "lateral" fixation of an optoelectronic component 31 . 32 outside the optical path according to the invention.

In the left part of the 9 is a section of an optical fiber 11 to see in its deepening V a light emitting diode 31 annular from the first potting compound 51 is surrounded. The LED shown 31 is designed as an SMD component and has one in the housing 7 trained reflector 8th for an LED chip arranged therein 9 on. With A are the connection contacts or SMD pads of the SMD photodiode 31 denotes the electric with LED chip 9 are connected. The first potting compound 51 is doing so in the depression V introduced that optical path from the SMD LED 31 to the opposite Lichtein- / exit surface F2 not impaired. The depression V thus remains free in this area of the first potting compound 51 ,

With CAL are the multi-dimensionally possible linear and / or rotational adjustment movement directions of the SMD light emitting diode 31 during a calibration process of a smoke detection block 20 designated. Is the SMD LED 31 now optimal in the depression V aligned and placed, the SMD LED remains 31 after a curing time of the first potting compound 51 in this position. Is the first potting compound 51 a UV light-curing adhesive, so can the adhesive 51 be irradiated with UV light. After a few seconds, the SMD LED will remain 31 invariably in the calibrated position.

In the right part of the 9 is a section of an optical fiber 12 to see in its deepening V a photodiode 32 again from the first potting compound 51 surrounded by a ring. The photodiode shown 32 is designed as an SMD component and has one on the SMD housing 7 trained level photosensitive layer PS on. With A are connection contacts or SMD pads of the SMD photodiode 32 denotes the electrical with the photosensitive layer PS are connected.

With CAL in turn are the multi-dimensional possible adjustment movement directions of the SMD photodiode 32 during a calibration process of a smoke detection block 20 designated. Is the SMD photodiode 32 now optimal in the depression V aligned and placed, the SMD photodiode remains 32 after a curing time of the first potting compound 51 in this position. Is the first potting compound 51 a UV light-curing adhesive, so can the adhesive 51 be irradiated with UV light. After a few seconds, the SMD photodiode will remain 32 invariably in the calibrated position.

In the example of 9 is also a second potting compound 52 in the optical path between the SMD photodiode to be fixed 32 and the associated opposite Lichtein- / exit surface F2 brought in. The second potting compound 52 is a transparent, in particular clear potting compound. In the example of 9 is the second potting compound 52 a highly transparent silicone elastomer for optical applications. The second potting compound 52 fills the space or gap between the photosensitive layer PS the SMD photodiode 32 and the opposite light entrance / exit surface F2 completely and without blisters and streaks.

10 shows a sectional view in the region of a depression V an exemplary smoke detection block 20 with one and the same casting compound 5 for mechanical fixation and for preferably index-like optical adaptation of an optoelectronic component 31 . 32 in the depression V according to the invention. In the respective recess V is a fast-curing transparent, clear potting compound 5 brought in. The potting compound can be a cyanoacrylate adhesive, ie a superglue, which cures quickly within a few seconds, in particular within 10 seconds, preferably within three seconds.

Alternatively, instead of a cyanoacrylate adhesives based potting compound 5 a light-curing potting compound 5 be used. Such a light-curing potting compound 5 is preferably a UV-curing adhesive which cures rapidly after irradiation with light, in particular with UV light, preferably in the wavelength range from 365 nm to 460 nm, within a few seconds, in particular within 10 seconds, preferably within three seconds.

By "transparent" is again meant that the material is transparent to the light used for the optical scattered light detection. The light wavelength of the light used is in a range of 400 nm to 1000 nm. By "clear" is meant that the material has no turbidity and thus no appreciable optical losses.

It is particularly advantageous if the one and the same potting compound 5 having a refractive index substantially equal to the refractive index of the material of the optical fiber body 11 . 12 equivalent. In this case prevails between the respective optoelectronic component 31 . 32 and the light guide body 11 . 12 with the respective recess V optical adjustment.

11 shows a sectional view through a smoke detection module according to the invention 30 with a module circuit carrier 6 ' and with a plastic cover FROM , The entire smoke detection module 30 can velvet plastic cover FROM on a circuit carrier 6 a scattered light smoke detector applied and then soldered to this. The circuit carrier is adjacent to an optical measuring chamber of the scattered light smoke detector. The smoke detection module 30 with plastic cover FROM thus forms part of a Messkammerbodens the optical measuring chamber.

The smoke detection module 30 comprises according to a first alternative, an optical light-guiding module 10 as well as the module circuit carrier 6` with the optoelectronic components already applied thereto 3 , The light guide module 10 is preferably fixed to the module circuit carrier 6` connected to a unit.

According to a second alternative, the smoke detection module comprises 30 a smoke detection block 20 with already recorded therein optoelectronic components 3 as well as the module circuit carrier 6 ' , The smoke detection block 20 is fixed to the module circuit carrier 6 ' connected to a unit. In this case, the connection contacts of the optoelectronic components with solder pads on the top OS the module circuit carrier 6 ' soldered, such as by means of a reflow soldering process.

In both alternatives, the optoelectronic devices 3 preferably via not shown further printed conductors with contacting surfaces P on one of the top OS the module circuit carrier 6 ' opposite bottom or with contact surfaces P on the front side of the module circuit carrier 6 ' electrically connected. For all optoelectronic components shown 3 these are preferably SMD components for surface mounting.

In the example of 11 is also the smoke detection module 30 with a particular black plastic cover FROM provided with light-absorbing and / or light-reflecting structures as a light absorber. Preferably, the plastic cover FROM formed such that the entire smoke detection module 30 in the hood-shaped plastic cover FROM can be inserted. The first light entry / exit surfaces remain F1 spared. The smoke detection module 30 is thus down to these recessed areas F1 and a receiving opening AO the plastic cover FROM completely covered.

12 shows a sectional view through the plastic cover FROM according to 11 as a one-piece component. The component shown is preferably produced by means of a plastic injection molding process. As the 12 further shows forms the plastic cover FROM in the circumferential area of the recessed Lichtein- / exit surfaces F1 one aperture each BL to improve the optical smoke detection. In addition, the plastic cover shapes FROM a circumferential bridge as a barrier B out, which in the in 11 shown annular groove N intervenes. Finally, in the right part of the 12 another bridge as another barrier B shown, which in one of the connecting body 2 of the light guide module 10 molded notch K intervenes.

13 shows a sectional view through an embodiment of the inventive smoke detection module 30 with a "sidelooker" LED 31 and with a plastic cover FROM analogous to the example of 11 and 12 ,

LIST OF REFERENCE NUMBERS

1, 11-13

fiber-optic element,

2

Intermediate body, connecting body

3

opto-electronic component, SMD component

31

LED, SMD LED, side emitter LED

32

Photosensor, photodiode, sidelooker photodiode

4

Fitting element, bridge, pin, fixing element

5

transparent potting compound, adhesive

6

circuit board

6`

Module board

7

Housing, component housing

8th

reflector

9

LED chip

10

optical light-guiding module

20

Smoke detection block

30

Smoke detection module with printed circuit board

51

first potting compound, fast-curing adhesive

52

second potting compound, transparent adhesive

A

connection contact

AO

receiving opening

FROM

(Plastic) cover, light absorber

ON

recess

B

Light barrier, light-absorbing injection

BL

cover

BW

backscattered light

C

Coating, plating, application

CAL

possible directions of displacement for calibration

DO

Through hole, hole

F1, F2

Light entry / exit surface, window

FV

positive-locking connection

FW

light scattered in the forward direction

K

Notch, light barrier

LB

emitted light beam

LI

optical element, lens

MS

Mounting side of the light guide module, mounting side of the smoke detection block

N

Groove, ring groove

OA

optical axis

OS

Top of the circuit board

P

Contact surface, solder pad

PO

Fixing opening, fitting opening, drilling, punching

PS

photosensitive layer

RF

Reflector layer, totally reflective layer

SL

scattered light

SZ

Stray light volume, measuring volume

V

Recess, recess

α

Flare angle

α _ρ

Forward scattering angle

α _R

Backscatter angle

β

Elevation, elevation angle

δ

axis angle

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• FR 2964743 A1 [0002]
• US 2017/370835 A1 [0002]
• WO 2009/036988 A1 [0002, 0007]
• WO 2006/114082 A2 [0016]

Claims (18)

Optical light-conducting module (10) for mounting on a circuit carrier (6) of a scattered light smoke detector, on which at least two optoelectronic components (31, 32) are provided for scattered light smoke detection, wherein the light-conducting module (10) comprises at least first and second light-guiding bodies (11, 12) and at least one intermediate body (2) which firmly connects them to one another, wherein the light guide bodies (11, 12) each have a first and second light entry / exit surface (F1, F2), the respective first light entry / exit surface (F1) facing towards one is aligned for the optical scattered light smoke detection common scattered light volume (SZ) and wherein the respective second light inlet / outlet surface (F2) one of the provided for the optical scattered light smoke optoelectronic components (31, 32) opposite, and wherein the light guide (11, 12) such have radiopaque properties that the common scattered light volume En (SZ) on the respective optoelectronic component (31, 32) can be imaged. Optical light guide module (10) according to Claim 1 , wherein the two light guide (11-13) and the at least one intermediate body (2) are made of a transparent material such as glass or of a plastic, in particular of a quartz, silicate or flint glass or of a thermoset or thermoplastic. Optical light guide module (10) according to Claim 1 or 2 wherein the two light guide bodies (11, 12) and the at least one intermediate body (2) are produced by means of a shaping method, in particular by means of a casting method or an injection molding method. Optical light guide module (10) according to Claim 2 or 3 in which the transparent glass or plastic material is solder-stable, so that after a surface mounting of the light-conducting module (10) together with further electrical, electronic and optoelectronic components (31, 32) on the circuit carrier (6) a subsequent soldering process, in particular a reflow Soldering process, unscathed survives. Optical light-conducting module (10) according to one of the preceding claims, wherein at least one of the intermediate bodies (2) of an optical light-conducting module (10) has at least one light-absorbing barrier (B) introduced and / or at least one notch (K) is formed. Optical light guide module (10) according to one of the preceding claims, wherein the at least two light guide bodies (11, 12) are at least partially provided with a coating (C) with the recessing of the respective first and second light entry / exit surfaces (F1, F2), wherein the Coating (C) is a light-absorbing and / or a light-reflecting coating (C). Optical light guide module (10) according to one of the preceding Claims 1 to 6 , wherein the at least two light-guiding bodies (11-13) as well as the at least one intermediate body (2) which firmly connects these together form a one-piece optical component. Optical light guide module (10) according to one of the preceding Claims 1 to 6 , wherein the at least two light guide (11-13) and the at least one intermediate body (2) via at least one positive connection (FV) to the permanently interconnected Lichtleitmodul (10) are available. Optical light-conducting module (10) according to one of the preceding claims, wherein the optical light-conducting module (10) has a mounting side (MS) which, after assembly of the optical light-guiding module (10) on the circuit carrier (6), is opposite thereto, and wherein on the mounting side ( MS) at least two wegstehende fitting elements (4), in particular pins, bolts or webs, are formed, which are constructively matched to corresponding openings (PO) in the circuit carrier (6) for fitting the fitting elements (4) in these openings (PO). Optical light-conducting module (10) according to one of the preceding claims, wherein the optical light-conducting module (10) has a mounting side (MS) which, after assembly of the optical light-guiding module (10) on the circuit carrier (6), is opposite thereto, the respective light-guiding body (11 13) has a recess (V) on the mounting side (MS) with the respective second light entry / exit surface (F2), so that the respective light guide body (11-13) with its depression (V) the respective optoelectronic component (31, 32 ) on the circuit carrier (6). Smoke detection block (20) with an optical light guide module (10) according to one of Claims 1 to 9 wherein the optical light guide module (10) has a mounting side (MS) for a surface mounting of the optical light guide module (10) on a circuit carrier (6), wherein the respective light guide body (11-13) has a recess (V) on the mounting side (MS) for receiving a respective optoelectronic component (31, 32) designed for a surface mounting, wherein for the mechanical fixing of the optoelectronic component (31, 32) a first potting compound (5, 51) in the respective recess (V) outside the optical path between the optoelectronic component to be fixed (31, 32) and an associated opposite Lichtein- / exit surface (F2) introduced is and wherein the respective optoelectronic components (31, 32) are received such that their electrical connection contacts (A) are aligned substantially flush with the mounting side (MS). Smoke detection block (20) after Claim 11 wherein the first potting compound (5, 51) is a fast-setting adhesive, in particular a light-curing, preferably a UV-light-curing adhesive, or a fast-curing adhesive from the class of cyanoacrylate adhesives. Smoke detection block (20) after Claim 11 or 12 in which a second potting compound (5, 52) is introduced in the optical path between the optoelectronic component (31, 32) to be fixed and the associated opposite light input / output surface (F2), and wherein the second potting compound (5, 52) has a transparent, especially clear potting compound. Smoke detection block (20) after Claim 13 wherein the second potting compound (5, 52) is a highly transparent silicone elastomer for optical applications. Smoke detection block (20) after Claim 11 and 13 , wherein the first and second potting compound (51, 52) one and the same potting compound (5) and wherein the one and the same potting compound (5) is a fast-curing adhesive, in particular a light-curing, preferably a UV-light-curing adhesive, or a fast-curing adhesive the class of cyanoacrylate adhesives. Smoke detection block (20) after Claim 15 , wherein the one and the same potting compound (5) has a refractive index, the amount by a maximum of 10%, preferably by a maximum of 5%, differs from the refractive index of the light guide (11-13) of the light guide module (1) with the respective recess (V). Smoke detection module (30) with an optical light guide module (10) according to one of Claims 1 to 9 and with a module circuit carrier (6 '), wherein the optical light guide module (10) has a mounting side (MS) for attaching in particular insoluble optical fiber module (10) on the module circuit carrier (6') of the smoke detection module (30), wherein the light guide (11 13) each having a recess (V) on the mounting side (MS) with the respective second Lichtein- / exit surface (F2), wherein arranged on the module circuit carrier (6 ') the respective optoelectronic components (31, 32) for the scattered light smoke detection are that after the attachment of the optical light guide module (10) on the module circuit carrier (6 ') of the respective recess (V) are included, and wherein the optoelectronic components (31, 32) electrical connection contacts (A) having, with externally accessible contacting surfaces (P) on the outside of the module circuit carrier (6 ') are electrically connected. Scattered-light smoke detector, comprising a detector housing with at least one smoke inlet opening, an optical measuring chamber accommodated in the detector housing for smoke to be detected, and a circuit carrier (6), the optical measuring chamber having a smoke detection block (20) according to one of the Claims 11 to 16 wherein the smoke detection block (20) is mounted on the circuit carrier (6) of the scattered light smoke detector, and wherein the electrical connection contacts (A) of the respective optoelectronic components (31, 32) of the smoke detection block (20) with contacting surfaces (P) on the circuit carrier ( 6), - wherein at least one of the optoelectronic components (31, 32) is a light-emitting diode (31) and wherein at least one further optoelectronic component (31, 32) is a photosensor (32), and - wherein the scattered light smoke detector has a control unit, which is set up to trigger the at least one light-emitting diode (31) in a pulsed manner, to detect a photosignal emitted by the respective photosensor (32), to detect a fire and to issue a warning or alarm message in the event of a detected fire.

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