DE102019133745A1 - Manufacturing system for the laser processing of a workpiece as well as a method for the production of a laser processed workpiece - Google Patents

Abstract

The present invention relates to a manufacturing system for the laser-machining production of an, in particular flat, workpiece (24) and a method for manufacturing a laser-machined workpiece (24) with such a manufacturing system. The production system comprises a laser processing device (5), a transfer system (7) for transporting the workpiece (24) along a production line or for positioning the workpiece (24) relative to the laser processing device, a measuring device (6) which is set up to be an actual - To measure the feature of the workpiece (24), an evaluation unit (200) which is set up to compare the actual feature with a target feature, to determine a feature deviation in this regard, and to carry out an evaluation with regard to the laser processing on the basis of an evaluation scheme, and a control unit (205) which is set up to adapt a production system-related process feature on the basis of the evaluation and / or a computer-aided optimization, and / or to initiate a workpiece-related process sequence. With a production system or method according to the invention, a high processing speed, a reliable control the edit quality as well as a linked optimization of the manufacturing process.

Description

The present invention relates to a manufacturing system for the laser-machining production of an, in particular flat, workpiece with a laser machining device. In addition to the laser processing device, the production system also includes further functional units, the meaning of which is explained in more detail in the context of the description of the invention below. The present invention also relates to a method for manufacturing a laser-machined workpiece with a manufacturing system designed according to the invention.

Due to the continuously advancing development of laser technology, it has been known for many years to use laser processing devices for processing a wide variety of materials or workpieces, for example in the production of electronic components, display elements, or the production of components in the automotive industry.

A wide variety of laser processing methods are used in such laser processing, for example laser ablation, laser cutting, laser welding, laser soldering, laser cleaning, laser drilling, laser sintering or laser melting . The present invention is directed in particular to the laser structuring (this also includes microstructuring) of workpieces, with the term “laser structuring” also being able to subsume some of the aforementioned laser processing methods (e.g. laser ablation or laser drilling) ). The laser processing methods mentioned can, for example, also be carried out by a laser processing device associated with the production system proposed by the invention.

The laser processing devices known from the prior art, in particular those laser processing devices optimized for the microstructuring of workpieces, are generally designed for processing individual workpieces, with laser processing often under the premise of the highest possible processing quality and precise workpiece processing for often complex processing tasks (e.g. complex structuring patterns). The laser processing devices used for this purpose are correspondingly optimized to meet these requirements.

However, there is an increasing need to use highly specialized laser structuring in the series production of workpieces, e.g. in the automotive industry, in the production of electronic components or in the production of display elements. This means that the laser processing devices used for this purpose must ensure a higher workpiece throughput compared to the laser processing devices designed for individual processing, but at the same time also provide a high processing quality. Furthermore, there is an increasing need in this context to integrate laser processing devices into existing production lines of certain components, i.e. the laser processing device must be incorporated into a workpiece flow or a workpiece flow direction of a production line. So far only inadequate solutions are known in this regard. In particular, the previous solutions lack sufficient processing-related feedback or other options for optimizing laser processing.

On the basis of this, the proposed invention is based on the object of providing a production system for the laser-processing production of a workpiece which enables a high processing speed, a reliable control of the processing quality and a coupled optimization of the production process. At the same time, it is the object of the present invention to provide a method for manufacturing a laser-machined workpiece with a manufacturing system designed according to the invention, which simultaneously enables a high machining speed, a reliable control of the machining quality and an optimization of the manufacturing process coupled thereto.

This object is achieved by a production system with the features of claim 1 and by a method with the features of claim 53.

1. a. eine Laserbearbeitungsvorrichtung, die dazu eingerichtet ist, das Werkstück zu bearbeiten;
2. b. ein Transfersystem, das dazu eingerichtet ist,
   • - das Werkstück entlang einer von einem Fertigungssystem-Startpunkt in Richtung eines Fertigungssystem-Endpunktes verlaufenden Fertigungsstrecke zu transportieren, wobei die Laserbearbeitungsvorrichtung zwischen dem Fertigungssystem-Startpunkt und dem Fertigungssystem-Endpunkt angeordnet ist, und/oder
   • - zumindest die Laserbearbeitungsvorrichtung relativ zu dem Werkstück zu positionieren,
3. c. eine Messvorrichtung, die dazu eingerichtet ist, ein Ist-Merkmal, insbesondere ein optisches oder akustisches Ist-Merkmal, des Werkstücks während und/oder nach der Bearbeitung zu messen;
4. d. eine Auswerteeinheit, die dazu eingerichtet ist, das Ist-Merkmal mit einem Soll-Merkmal abzugleichen, eine diesbezügliche Merkmalsabweichung festzustellen, und eine Bewertung bezüglich der Laserbearbeitung auf Basis eines Bewertungsschemas vorzunehmen;
5. e. eine Steuereinheit, die dazu eingerichtet ist, auf Basis der Bewertung und/oder einer rechnergestützten Optimierung
   • - ein fertigungssystembezogenes Prozessmerkmal anzupassen, und/oder
   • - eine werkstückbezogene Prozessfolge zu veranlassen.

The production system according to the invention is a production system for the laser-processing production of an, in particular flat, workpiece, comprising:

1. a. a laser processing device which is configured to process the workpiece;
2. b. a transfer system that is set up to
   • to transport the workpiece along a production line running from a production system start point in the direction of a production system end point, the laser processing device being arranged between the production system start point and the production system end point, and / or
   • - to position at least the laser processing device relative to the workpiece,
3. c. a measuring device which is set up to measure an actual feature, in particular an optical or acoustic actual feature, of the To measure the workpiece during and / or after machining;
4. d. an evaluation unit which is set up to compare the actual feature with a target feature, to determine a feature deviation in this regard, and to carry out an evaluation with regard to the laser processing on the basis of an evaluation scheme;
5. e. a control unit which is set up for this purpose on the basis of the evaluation and / or a computer-aided optimization
   • - to adapt a production system-related process feature, and / or
   • - to initiate a workpiece-related process sequence.

It should be expressly pointed out at this point that the production system is not limited to the laser-processing production of a single workpiece, rather a plurality of workpieces can be processed one after the other, for example in the sense of continuous series processing. Semi-continuous or discontinuous operation of the manufacturing system is also possible. Continuous operation is the continuous processing of workpieces over a defined period of time. The time interval between the production of individual workpieces can be constant or irregular. Semicontinuous machining is to be understood as an operation of the manufacturing system in which a plurality of workpieces are machined at irregular times, the machining of the workpieces being carried out continuously during the machining times. A discontinuous operation means that the production system can also experience longer (in particular uneven) downtimes between the production of workpieces, during which the production system is not operated.

A workpiece is not only to be understood as a materially coherent individual product; for example, a workpiece can also be understood as a substrate (e.g. flat substrate) which is laser processed in the laser processing device at different processing points and then divided into a plurality of different workpieces, for example by a subsequent punching or cutting process. An initially coherent workpiece can also be divided into a plurality of individual workpieces directly in the laser processing device by means of laser processing, for example by laser cutting.

The production system according to the invention enables the laser-processing production of a workpiece with - based on a feed or positioning between the workpiece to be processed and the laser processing device - different approaches or variants.

Like the aforementioned feature b. As can be seen, the manufacturing system in a first variant can be designed in such a way that the workpiece is transported along a manufacturing line running from a manufacturing system starting point in the direction of a manufacturing system end point. The “production line” is to be understood as the abstract transport path that the workpiece experiences from the production system start point to the production system end point. The manufacturing system starting point can be equated with a workpiece supply or a workpiece reservoir or can coincide spatially. The manufacturing system can also have several manufacturing system starting points or manufacturing system end points.

The production line does not necessarily have to be linear. In the context of the invention, a “production line” can be understood to be any transport path or transport path that the workpiece covers in the course of its transport from the production system start point in the direction of the production system end point in the direction of a workpiece flow direction, regardless of whether it is the path is a linear, curved or otherwise composed path. Pivoting or rotating movements can also represent part of the transport route or define it as a whole. For example, the production line can also be understood to be a transport path that a workpiece experiences by means of a robot-mediated rotary or pivoting movement. The production line can easily be composed of one or more linear and / or curved path sections in connection with rotary or pivoting movements, i.e. it can be a transport path of the workpiece realized by several units (e.g. robots), which consists of several partial transport routes composed. The partial transport routes can also be implemented by different units, for example a rotating disk on which the workpiece is positioned, a robot and / or a conveyor belt (or some other linear transport unit). The transport of the workpiece along the production line can therefore be provided via different units of the transfer system.

The mentioned laser processing device can be arranged between the manufacturing system starting point and the manufacturing system end point, for example stationary or movable, wherein the laser processing device passes or is traversed by the workpiece to be processed during transport. For processing, the workpiece can be positioned in the area of the laser processing device or in the laser processing device (for example in a workpiece holder provided there that can interact with a movement unit) or (at least temporarily) stopped. The transport of the workpiece, and thus the delivery between the workpiece and the laser processing device, is provided by the transfer system. Furthermore, it should already be mentioned in this connection that further functional units of the manufacturing system, for example the measuring device, can also be arranged in a stationary manner. However, the stationary arrangement of the laser processing device or the measuring device does not preclude the laser processing device or the measuring device from being able to experience a movement during delivery. The “stationary” arrangement rather means that, according to the first variant of the transfer system mentioned above, the workpiece experiences a proportionally larger feed movement or a longer feed path than the laser processing device or the measuring device. For example, it can be provided that the workpiece is initially positioned in a rough positioning relative to the laser processing device, and then fine positioning is carried out by means of a movement of the laser processing device relative to the workpiece. The laser processing device is then positioned (at least to a certain extent) relative to the workpiece.

In a second variant according to the aforementioned feature b. the workpiece can be positioned stationary, e.g. B. in a suitable workpiece holder, while the laser processing device is positioned or delivered relative to the workpiece prior to the actual processing. Correspondingly, the positioning or delivery between the workpiece and the laser processing device is realized in this variant in that the laser processing device is moved relative to a workpiece which is arranged in a fixed position. In addition to the laser processing device, other functional units of the manufacturing system can also be moved relative to a workpiece arranged in a fixed position, for example the measuring device. The transfer system can have one or more transfer units that execute the movement of the laser processing device or, if necessary, further functional units, e.g. the measuring device. The laser processing device can be positioned in the most varied of ways. It is conceivable to attach the laser processing device to one or more robot arms, to arrange the laser processing device on a movable platform (e.g. a roller-bound or rail-bound platform), or to arrange the laser processing device in a lifting-lowering device (this can be operated hydraulically, for example.

As already mentioned in the margin, it is possible to design the production system from a combination of the mentioned first and second variants - based on the design of the transfer system. For example, it can be provided that the transfer system both transports and / or positions the workpiece along the production line and that the laser processing device is positioned relative to the workpiece via the transfer system or a unit belonging to the transfer system. For example, it can be provided that the transfer system carries out a first rough positioning of the workpiece in a processing area or a workpiece holder, whereupon the laser processing device can be further positioned relative to the workpiece, which is then arranged in a fixed position. The positioning can take place simultaneously or sequentially. “Positioning” can also be understood to mean a feed between the workpiece and the laser processing device, namely a feed of the workpiece relative to the laser processing device and / or a feed of the laser processing device relative to the workpiece.

True to a variant preferred according to the invention, the laser-processing production of a workpiece with the production system according to the invention can be carried out in such a way that the workpiece to be processed is transported starting from a starting point of the production system via a transfer system along a production line or a workpiece flow direction in the direction of an end point of the production system Workpiece can pass through different functional units of the manufacturing system (for example the laser processing device and the measuring device). At the same time, however, functional units of the manufacturing system, in particular the laser processing device and the measuring device, can be moved, in particular positioned, relative to a workpiece arranged in a fixed position (cf. the above-mentioned second variant). Combined positioning can also take place for the other functional units such as the measuring device, so here too both the (machined) workpiece can be positioned relative to the measuring device and the measuring device can be positioned relative to the (machined) workpiece.

During or after the laser processing of the workpiece - this can include any of the types of processing mentioned at the outset - with the production system according to the invention, in particular using the measuring device and the Evaluation unit, the processing quality of the laser processing are checked, namely by the mentioned measurement of an actual feature of the machined workpiece, in particular an optical or acoustic actual feature, in combination with a subsequent comparison of the measured actual feature with a target feature, a related one Determination of a feature deviation including an evaluation of the laser processing carried out on the basis of an evaluation scheme. The last-mentioned actions are carried out in particular by an evaluation unit.

The evaluation unit can be a data processing unit which, for example in combination with the control unit, can form a common computing unit. Likewise, the control unit can have a plurality of sub-control units which are in signal connection with one another or with a central control unit. The sub-control units can be assigned to individual functional units of the manufacturing system, e.g. the laser processing device, the transfer system or the measuring device. With the sub-control units and / or the control unit, the handling of the workpiece and the functionality of the production system as a whole or individual functional units of the production system can be monitored, controlled and regulated. The control unit or the sub-control units can easily be understood as a regulating unit, ultimately as a control and regulating unit. Based on the evaluation carried out by the evaluation unit and the forwarding of the evaluation results to the control unit, the control unit can, for example, generate control signals using a computation routine or an algorithm (e.g. an algorithm based on artificial intelligence, see the explanations below) that certain functional units of the manufacturing system can be passed on in order to adapt a manufacturing system-related process feature there, for example, and / or to initiate a workpiece-related process sequence. The control unit and / or evaluation unit can also adapt a production system-related process feature and / or a workpiece-related process sequence on the basis of computer-aided optimization. This means that after a computer-aided optimization (e.g. one or more boundary conditions or optimization criteria) has been carried out, a control signal is generated which is then passed on to certain functional units of the manufacturing system (e.g. the transfer system, the laser processing device, the measuring device, etc.). The computer-aided optimization can take place detached from the evaluation based on the comparison of features or use the evaluation determined there and / or the actual features measured with the measuring device (or a further measuring device) and / or the target features stored in a database.

Depending on the result of the evaluation, a production system-related process feature can be adapted via the control unit, in particular the central control unit. The production system-related process feature can be, for example, a measuring device-related process feature, that is to say, for example, any measurement parameters on which the measuring device is based. Examples include the resolution, the assignment of the measurement range, the number of measurements, the number of scans, measurement frequency, etc.

The production system-related process feature can also be processing parameters of the laser processing device, for example a pulse power or pulse duration of a laser beam generated by a laser radiation source, parameters that relate to the beam shaping of the laser beam, or also those parameters that relate to the alignment or focus of the laser radiation. Manufacturing system-related features can also relate to the throughput rate of the workpieces to be processed (e.g. the number of workpieces processed per unit of time), processing parameters associated with the processing precision, or calibration parameters. Based on the measurement results reflecting the quality or precision of the laser processing or the associated evaluation, the production system according to the invention can be used to directly convert a feedback into a modification of a production system-related process feature, for example to correct or avoid quality losses in the laser processing.

Alternatively or additionally, a workpiece-related process sequence can be initiated on the basis of the evaluation via the control unit. A workpiece-related process sequence can be, for example, the release of a laser-machined workpiece, i.e. the workpiece can be released for further processing or for delivery to a customer. Furthermore, a workpiece-related process sequence can relate to a declaration of a laser-machined workpiece as scrap, in which case the machined workpiece can be discarded.

For further details on the adaptation of production system-related process features and workpiece-related process sequences, reference is made to the further description.

Due to the above-described possibility of adapting production system-related process features as well as workpiece-related process sequences, a dynamic adaptation of process features relating to the manufacturing system on the one hand, and the execution of process sequences relating to a specifically machined workpiece on the other hand, are made possible. In this way, fluctuations in precision, system errors or other manufacturing system-related fluctuations that have a direct effect on the quality of the laser processing can be recognized and eliminated. Furthermore, such a production system prevents inadequately machined workpieces from being unjustifiably released and possibly further processed without, however, meeting sufficient quality requirements.

The manufacturing system according to the invention also enables computer-aided, for example algorithmic, optimization of manufacturing system-related process features and / or workpiece-related process sequences, taking into account, for example, the specification of boundary conditions or boundary criteria to be optimized that can be specified by a user. With regard to advantageous configurations in this regard, reference is made to the following description of advantageous configurations of the present invention.

The manufacturing system according to the invention thus enables automated detection of manufacturing system-related fluctuations, system errors or precision fluctuations during the operation of the manufacturing system, which is an online error detection or online optimization. A particular advantage can result if online error detection or online feedback is enabled via the measuring device already during laser processing (that is, at the same time as laser processing). Certain processing parameters can then be adjusted during the laser processing. At the same time, with the production system according to the invention, a workpiece-related process sequence can be made for a specific machined workpiece during the operation of the production system.

The advantages of the manufacturing system according to the invention described above enable fast processing of workpieces with a high workpiece throughput, but also ensure high processing quality, both in relation to the processing quality of individual workpieces and in relation to the permanent provision of a reliable process quality of workpieces manufactured with the manufacturing system.

The production system starting point can be, for example, a workpiece store or a workpiece magazine in which unprocessed workpieces are stored or held before they are introduced into the production system via the transfer system. The introduction into the production system can take place via a removal unit, which can be part of the transfer system or provided separately for it. The removal from such a workpiece store or workpiece magazine can also take place directly via a workpiece positioning unit belonging to the transfer system, which can also be set up to position the workpiece in a processing area of the laser processing device or a workpiece holder. The workpiece holder can be arranged directly in the processing area of the laser processing device or in the area of a component belonging to the transfer system, for example on a conveyor belt. Furthermore, provision can be made for the workpiece to be processed in each case to be arranged in a suitable workpiece holder in the workpiece store or workpiece magazine. Alternatively, it can be provided that the workpiece is only positioned in a workpiece holder using the workpiece positioning unit or removal unit. For example, the workpiece positioning unit or the removal unit can be designed as a robotically operated gripping arm. The workpiece holder can be arranged directly in a processing area of the laser processing device, or in the area of a conveyor belt as part of the transfer system. In contrast to the removal unit, a workpiece positioning unit is to be understood as meaning, in particular, a unit that is not only set up to remove a workpiece from a workpiece store or a workpiece magazine, but also to position it in a predetermined area (for example a workpiece holder). Furthermore, in a particularly simple embodiment, the removal unit can also be a flap arrangement including a feed unit connected to it, which is connected to the transfer system (for example a conveyor belt). When the flap arrangement is opened, a workpiece can slide, based on the weight force, along a feed unit (e.g. a smooth and / or inclined metal surface underlaid with compressed air) in the direction of the transfer system. Such a feed unit can also be directly connected to a workpiece holder (e.g. a stationary workpiece holder).

As already mentioned, it can be provided that a workpiece to be processed is transported via a conveyor belt, a roller arrangement or a conveyor device as part of the transfer system in the direction of the workpiece holder, the Laser machining device or a workpiece holder arranged in a machining area of the laser machining device is conveyed. The workpiece holder can also be arranged directly on the conveyor belt, the roller arrangement or the conveyor device. In such a configuration, the workpiece or the workpiece together with the workpiece holder can be fed from the transfer system to the laser processing device. In particular, the workpiece can be positioned in a predetermined area of the laser processing device. Correspondingly, the said conveyor belt, the roller arrangement or the conveying device can form a component of the transfer system or, as it were, a workpiece positioning unit. Provision can also be made to position the workpiece with the removal unit (this can be designed as a robotic gripping arm, for example) on the conveyor belt, the roller arrangement or the conveyor device or a workpiece holder arranged thereon. be. At the same time, the workpiece positioning unit can be an additional unit, for example a unit designed in the manner of a robot, in particular a gripping robot, which removes a workpiece to be processed from a workpiece storage or workpiece magazine or from a conveyor belt, a roller arrangement or a conveyor device Can feed laser processing device. The workpiece holder can in particular be provided within the laser machining device, for example in an area provided for machining the workpiece, so that a workpiece fed from the workpiece positioning unit to the laser machining device can be positioned in the workpiece holder by means of the workpiece positioning unit.

The workpiece holder - regardless of whether it is a direct part of the transfer system (e.g. a conveyor belt, a conveyor or a transport roller arrangement) or the laser processing device, can be designed to enable a workpiece to be arranged in a fixed position. As can already be seen from the term “workpiece holder” as such, this primarily serves to hold the workpiece to be machined. Since the manufacturing system according to the invention is not restricted to the machining of certain workpieces (for example, the workpiece can be a rigid and plate-like flat substrate or a flexible substrate such as a film), the workpiece holder can be set up to hold various types of workpieces in a fixed position to arrange. Correspondingly, the workpiece holder for positioning the workpiece can have clamping elements, clamping elements, suction elements or suction cups based on negative pressure, sliding elements, latching elements, stop elements or a cavity. A magnetically or electrostatically mediated fastening can also be used within the scope of the invention. In the simplest case, the workpiece can be arranged in the workpiece holder purely based on the force of weight, i.e. the workpiece is placed on the workpiece holder, which is, for example, plate-shaped and remains in a certain position due to its own weight. Furthermore, the workpiece holder can be provided with optical markings in order to facilitate a precisely positioned arrangement of the workpiece.

Another essential component of the manufacturing system according to the invention is the aforementioned laser processing device, which is set up to process the workpiece. As mentioned at the beginning, “processing” in this context can be understood to mean a wide variety of laser processing methods, for example laser ablation, laser cutting, laser welding, laser soldering, laser cleaning, laser drilling, the Laser sintering or laser melting. A combination of the aforementioned laser processing methods can also be understood as “processing” in the context of the invention. In particular, in this context, “processing” can be understood to mean structuring laser processing of a workpiece, that is to say structuring of a workpiece by means of laser processing. In particular, this can also mean a microstructuring of a workpiece, that is to say the formation of microstructures in a workpiece or a workpiece surface. The structuring or microstructuring can involve the formation of a predetermined structure or microstructure (for example in the form of a pattern) in the workpiece or on a workpiece surface. The laser processing, in particular the structuring or microstructuring, can take place at one or more processing points on the workpiece.

1. a. eine Laserstrahlungsquelle, die dazu eingerichtet ist, einen Laserstrahl zu erzeugen und zur Bearbeitung des Werkstücks in Richtung des Werkstücks auszusenden;
2. b. eine der Laserstrahlungsquelle in Strahlrichtung nachgeordnete Strahlformungseinheit, die dazu eingerichtet ist, aus dem Laserstrahl einen modulierten Laserstrahl zu formen;
3. c. eine der Strahlformungseinheit in Strahlrichtung nachgeordnete Bewegungseinheit, die dazu eingerichtet ist,
   • - eine Bewegung des modulierten Laserstrahls auszuführen, bei welcher der modulierte Laserstrahl relativ zu dem Werkstück bewegt wird, insbesondere zur Ausrichtung auf verschiedene Bearbeitungsstellen, und/oder
   • - eine Bewegung des Werkstücks auszuführen, bei welcher das Werkstück relativ zu dem modulierten Laserstrahl bewegt wird.

The laser processing device associated with the production system preferably comprises:

1. a. a laser radiation source which is set up to generate a laser beam and to emit it in the direction of the workpiece for processing the workpiece;
2. b. a beam-shaping unit which is arranged downstream of the laser radiation source in the beam direction and is configured to shape a modulated laser beam from the laser beam;
3. c. a movement unit which is arranged downstream of the beam shaping unit in the beam direction and is set up to
   • - execute a movement of the modulated laser beam, in which the modulated laser beam is moved relative to the workpiece, in particular for alignment with different processing points, and / or
   • to carry out a movement of the workpiece in which the workpiece is moved relative to the modulated laser beam.

At this point, those advantageous refinements of the invention will first be described which relate directly to the laser processing device, before further advantageous refinements of the invention are subsequently described which refer to further components of the manufacturing system according to the invention.

As mentioned, the laser radiation source, as a component of the laser processing device associated with the production system according to the invention, can be set up to generate a laser beam and to emit it in the direction of the workpiece for processing the workpiece. The laser radiation associated with the laser beam propagates along an optical path until it hits a working plane or the workpiece to be machined. Between the laser radiation source and the working plane, the laser radiation can pass through optical functional elements, reflecting, refracting, dividing or deflecting them. In the present case, the laser radiation generated and emitted can be understood to mean continuous, but in particular pulsed laser radiation. The at least one laser radiation source can therefore be set up to generate a continuous or a pulsed laser beam.

The at least one laser radiation source is particularly preferably set up to generate a pulsed laser beam with pulse lengths in the femto, picosecond or nanosecond range.

Typical pulse repetition rates are in the range between a few Hertz and a few Megahertz. For effective material processing, it has proven to be advantageous if the pulse duration is less than 100 ns, preferably less than 10 ns and in particular less than 1 ns. In this pulse duration range, thermally induced effects predominate in material processing.

If pulsed laser radiation with a shorter pulse duration is used, effects that are associated with the deposition of very high amounts of energy in a very short time, i.e. with high peak powers, gain influence. These effects can in particular be sublimation effects in which the material of the workpiece suddenly evaporates locally, i.e. effects in which material is removed instead of material redistribution. The use of pulsed laser radiation with a pulse duration of less than 100 ps, in particular less than 10 ps and particularly preferably less than 1 ps has proven advantageous here. In particular, pulse durations in the range of a few hundred femtoseconds up to around 10 ps allow targeted material removal by sublimation. The pulse repetition rates occurring with the laser radiation sources customary at the time of registration are typically between 50 and about 2,000 kHz.

Laser radiation sources with even shorter pulse durations that will be available in the future can also be used advantageously in connection with the laser processing device used within the scope of the invention.

Depending on the processing task to be solved, however, the use of pulsed laser radiation with pulse durations even longer than the above 100 ns can be useful, for example if certain wavelengths are required for the processing task or a slower energy deposition is advantageous, for example for targeted local heating Initiation of a local processing reaction, which can also be of a chemical nature, such as triggering a polymerization reaction, and at the same time avoiding premature material removal.

As mentioned, it is basically also conceivable to use a laser radiation source that generates continuous laser radiation, i.e. the laser radiation source is a continuous wave laser. This is particularly advantageous in processes in which the material is not to be sublimated, but only to be melted, e.g. in generative or joining processes. The laser radiation source can therefore be set up to generate a continuous continuous-wave laser beam.

Regardless of whether the laser radiation source generates pulsed or continuous laser radiation, the invention is not restricted to specific wavelengths. Rather, laser radiation sources can be used that generate laser radiation whose wavelength lies in the spectrum between the deep UV and the far infrared. The wavelength of the laser radiation used is preferably in the visible spectral range up to the near infrared.

The laser radiation source is preferably set up to generate monochromatic laser radiation. Depending on the processing task, broadband laser radiation sources can also be advantageous.

Furthermore, the laser radiation source is preferably set up to generate mode-pure laser radiation (single mode laser), in particular laser radiation with a Gaussian intensity distribution. The laser radiation source particularly preferably generates laser radiation with a round intensity profile.

Depending on the area of application or processing task, it can be advantageous to use laser radiation with an intensity distribution that differs from a Gaussian intensity distribution for laser processing. Therefore, optimizations of the laser process by changing the intensity distribution in the processing plane are increasingly being investigated. In order to adapt the intensity distribution, it is known to subject the laser radiation generated by a laser radiation source to beam shaping, which offers considerable optimization potential for the development of the laser process. The resulting advantages of beam shaping are, for example, higher process speeds or better processing results.

For the technical implementation, the laser processing device can have a beam-shaping unit which is arranged downstream of the laser radiation source in the beam direction and which is set up to shape a modulated laser beam from the laser beam. In this context, the term “beam direction” refers to the course of the laser beam. The specification of the “downstream” beam shaping unit in relation to the laser radiation source means that the beam shaping unit is arranged along the optical path behind the laser radiation source. The laser beam is thus initially generated and only then enters or strikes the beam-shaping unit.

As already mentioned, the laser radiation generated by a laser radiation source typically has a Gaussian intensity distribution or a Gaussian beam profile in relation to its beam cross section. Using suitable beam shaping techniques, however, laser beams can be shaped while changing the intensity distribution. To form an intensity distribution of a laser beam, either its phase, its amplitude or both quantities can be modulated together. Phase modulators, amplitude modulators or phase and amplitude modulators are used accordingly, for example in the form of diffractive beam shapers. Diffractive beam formers (Diffractive Optical Elements, DOE for short) for setting far-field intensities can be produced as phase elements in glass or other transparent materials. Such beam shapers can provide the aforementioned beam shaping unit.

Furthermore, the form of an intensity distribution can take place through refraction and reflection on optical elements. Correspondingly shaped refractive or reflective elements such as, for example, deformed or deformable mirrors or transmissive elements with a geometrical deformation of the surface or shape are used. Such elements can also form a beam shaping unit within the meaning of the invention. The individual partial beams of a laser beam incident on the refractive or reflective optical element fall on differently curved surfaces and are reflected or refracted on them. The totality of the partial beams forms a new intensity distribution after being formed by the element. An example of such a beam shaping is the reshaping of a Gaussian laser beam into a top hat shaped laser beam, also called a Gauss to top hat beam shaper. The geometrical deformation of the surface necessary for beam shaping can be calculated using analytical, numerical or iterative methods (e.g. superposition of Zernike polynomials).

Also known are the so-called “programmable” or “variable” modulation units with which the spatial and temporal intensity distribution of laser radiation emitted by a laser radiation source can be flexibly adjusted. Such programmable modulation units are also referred to as “spatial light modulators (SLM)”, which is why this terminology is used in the following. Such a unit or an SLM can also be viewed as a beam-shaping unit within the meaning of the invention.

In particular, spatial light modulators based on liquid crystals (e.g. Liquid Crystal on Silicon (LCoS) phase modulator chip array) or in the form of "digital micromirror devices" are known. The latter indicate a one- or two-dimensional arrangement of movable micromirrors. The individually controllable micromirrors allow specific spatial areas to be "faded out" from the cross-section of a laser beam. A diffraction image is then obtained by diffraction of the incident laser radiation on a “grating” in a reflection arrangement.

Transmitting variable spatial light modulators are also known; these are sold, for example, by the Jenoptik company under the name “Liquid crystal light modulators Spatial Light Modulator-S”.

The types of variable spatial light modulators mentioned allow the generation of intensity distributions that can be freely specified within wide limits in the working plane or on the workpiece by diffraction of laser radiation. From the scope of the The invention therefore includes the use of any of the named types of variable spatial light modulators as a beam shaping unit in a laser processing device. It is a particular advantage of using a variable spatial light modulator that a large number of different intensity distributions can be generated on the workpiece by means of a single variable spatial light modulator.

In summary, it can be stated that with a spatial light modulator (regardless of its nature) local phase changes can be brought about by changing the optical path length or refractive indices. If the properties of the input beam are known, they can be used to set a desired shape of a wave front of a laser beam by fading in a suitable phase distribution. With such an SLM, a desired intensity distribution of the laser beam and thus a desired beam shape can also be set in a working plane, that is to say on a workpiece to be processed.

The above-mentioned options for adapting the beam shape can be used in a laser processing device associated with the production system according to the invention, in particular in a beam-forming unit, or the laser processing device can include the components required for this.

As already mentioned, the laser processing device can comprise a movement unit arranged downstream of the beam shaping unit in the beam direction. This can be set up to execute a movement of the modulated laser beam in which the modulated laser beam is moved relative to the workpiece, in particular for alignment with different processing points. The movement unit can, for example, comprise at least one galvanometer scanner, possibly also a focus shifter. With the focus shifter, the focus of the modulated laser beam can be adjusted in relation to a z-spatial direction relative to the workpiece. A galvanometer scanner (several of these can also be connected in series or in parallel) can have one or more mirrors, each of which can be rotated around a rotation axis by a defined angle. As a result, the laser beam reflected by the mirrors can be directed as a laser spot within the accessible scan field to a desired location on the workpiece. In particular, a galvanometer scanner can also be described as a two-axis galvanometric mirror scanner. By means of such a mirror scanner, the modulated laser beam can be moved along two mutually independent axes X and Y, which lie in the plane of the surface of the workpiece to be machined. In a further variant, provision can also be made for a plurality of galvanometer scanners to be provided to form the movement unit or a part thereof. The galvanometer scanners can, for example, be arranged in a series or parallel connection or a combination thereof.

According to a further advantageous embodiment of the invention, the movement unit can comprise a one- or multi-dimensional linear unit, a rotatable axis unit, a lifting table or a combination of the aforementioned components.

As mentioned, the workpiece can be arranged in a fixed position during processing (in this case the processing points are only set by the movement of the laser beam), or it can also be subjected to a movement (relative to the workpiece). In the latter case, provision can be made for the modulated laser beam to be oriented statically, i.e. fixed in position, and only to execute a movement of the workpiece in which it is moved relative to the (static) modulated laser beam. Different processing points of the workpiece can also be processed with modulated laser radiation via such a relative movement. It can also be provided, in addition to moving the modulated laser beam relative to the workpiece, to execute a movement of the workpiece in which the latter is moved relative to the modulated laser beam. A simultaneous (simultaneous) or superimposed movement of both the laser beam and the workpiece can therefore take place. The movement can be carried out at different movement speeds. It can also be provided that only the workpiece is sequentially moved relative to a fixed-position laser beam or the modulated laser beam relative to a fixed-position workpiece. The design or control of the movement unit can vary depending on the processing task. The movement control can be optimized with respect to a high processing speed, in particular by calculating optimized movement paths of the workpiece and / or the modulated laser beam.

To provide a relative movement of the workpiece to a modulated laser beam (regardless of whether this is statically positioned or is also moved), the movement unit can be set up to move the workpiece within a plane spanned by two horizontal spatial axes. During the movement, a one-dimensional linear movement in the plane as well as a two-dimensional movement in the plane (for example in the sense of cornering) can be carried out. The movement of the workpiece (along a specified movement path) can be carried out continuously (ie without standstill). In principle, standstill situations in the movement of the workpiece (as in the movement of the modulated laser beam) are also possible. Correspondingly, as mentioned, the movement unit can comprise a one-dimensional or multi-dimensional linear unit, a rotatable axis unit, a lifting table or a combination of the aforementioned components.

As already mentioned, the movement unit can be formed solely by a unit designed to move the modulated laser beam, or solely by a unit designed to move the workpiece. Furthermore, the movement unit can also comprise two components or be configured in two parts, namely a unit configured to move the modulated laser beam and a unit configured to move the workpiece. In the case of a two-part design of the movement unit, however, it can be provided to control only one part for positioning the modulated laser beam at different processing points. Of course, it is also possible to control both parts.

A two-axis or multi-axis linear unit, for example, which can move the workpiece holder, a workpiece as such or a workpiece holder including the workpiece arranged therein via suitable linear drives, comes into consideration as the movement unit designed to move the workpiece. Linear units can also be referred to synonymously as linear axes.

Usually, a linear axis has a guide rail, a traveling member that can be moved along the guide rail (for example a transport slide which can be designed as a workpiece holder) and a drive device for optionally moving and positioning the traveling member along the guide rail. In the following, the movable travel element is referred to as the workpiece holder. In order to position the movable workpiece holder at a predetermined point, it is necessary that the drive device can both accelerate and decelerate (i.e. brake) the workpiece holder along the guide rail. A drive device used within the scope of the present invention as part of the movement unit is thus designed both for accelerating and braking the movable workpiece holder in a straight-line movement along the guide rail. As a rule, such a drive device is set up to move the workpiece holder uniformly (i.e. at a constant speed) or at an alternating speed along the guide rail. The drive device can be a mechanical, electrical, pneumatic or hydraulic drive. In the case of laser processing devices, electrical drives are generally used. In the context of the present invention, the movement unit can in particular be understood to mean an arrangement of one or more linear axes including drive device (s).

The workpiece holder can be connected to the movement unit (or a part thereof) designed to move the workpiece via a suitable mounting. When using two linear axes, they can be arranged perpendicular to one another in a horizontal plane. Additional linear axes arranged at an angle with respect to the aforementioned axes, for example diagonal axes, can also be provided. As already mentioned, the workpiece holder can be designed as a traveling element, for example as a transport slide.

In addition, the movement unit designed to move the workpiece (or a part thereof) can be designed to move the workpiece or the workpiece holder (including the workpiece) along only one spatial axis in a horizontal plane, or along two spatial axes that are perpendicular to one another within the horizontal plane. The design variants of the conveyor belt, the roller-bound conveyor device or the conveyor device as components of the transfer system mentioned at the beginning can also form the movement unit.

Furthermore, the movement unit designed to move the workpiece (or a part thereof) can be designed to enable flexible positioning of the workpiece within the horizontal plane. It is conceivable, for example, to design the movement unit (or a part thereof) designed to move the workpiece as a robot-controlled positioning arm which can flexibly position the workpiece holder or the workpiece within the aforementioned horizontal plane. It can also be provided that such a robot arm is set up to position the workpiece holder together with the workpiece that has been picked up in relation to a vertical axis. Alternatively, it can be provided that the movement unit is also designed in the sense of a lifting table, which can likewise enable a vertical movement of the workpiece or of a workpiece arranged in a workpiece holder.

Further advantageous embodiments of the present invention are specified in the subclaims and the following description of the features mentioned in the subclaims and further features.

According to a first advantageous embodiment of the present invention, a workpiece positioning unit can be provided in the manufacturing system, which is set up to position the workpiece in a workpiece holder, the workpiece holder preferably being arranged in a machining area of the laser machining device. The workpiece positioning unit can be part of the transfer system or be arranged separately from it. The workpiece positioning unit can be designed as a robotic gripper arm, which can be configured to remove a workpiece from a workpiece magazine or workpiece reservoir arranged in the area of a manufacturing system starting point and to position it in the workpiece holder, the workpiece holder being in the area of the Transfer system (for example on a conveyor belt or a conveyor) can be arranged or in the area of the laser processing device.

According to a further advantageous embodiment of the invention - as already mentioned - it can be provided that the workpiece positioning unit is part of the transfer system. Accordingly, the workpiece positioning unit can be controlled together with other components of the transfer system, for example by the control unit.

Furthermore, it can be advantageous that the workpiece positioning unit is arranged between the production system starting point and the laser processing device. In such a configuration, the workpiece positioning unit can be set up to remove a workpiece to be processed from a location assigned to the production system starting point, e.g. a workpiece magazine or workpiece reservoir, and to position it in the area of the laser processing device, alternatively on a transport device of the transfer system to position. Furthermore, the workpiece can also initially be transported via a transport device from the manufacturing system starting point in the direction of the laser processing device, but the positioning (i.e. removal from the transport device and arrangement in a processing area of the laser processing device) can be carried out with the workpiece positioning unit.

According to a further advantageous embodiment of the invention, it can be provided that the measuring device is arranged downstream of the laser processing device in relation to the production line. Such an arrangement is particularly advantageous for the initially described first variant of the manufacturing system according to the invention, in which the workpiece is moved along a production line relative to functional units that are essentially fixed in position (in particular a laser processing device arranged in a fixed position and a measuring device arranged in a fixed position). Correspondingly, with such a design it is possible that a workpiece processed in the laser processing device is fed to the measuring device after processing (via the transfer system) so that the measurement of the mentioned optical and / or acoustic actual feature takes place after the laser processing. A downstream arrangement is not necessarily to be understood as an arrangement of the measuring device at a distance from the laser processing device. This can also mean that the laser processing device and the measuring device are arranged within a common housing.

According to a further advantageous embodiment of the present invention, it can be provided that the workpiece positioning unit is set up to position the machined workpiece in a measuring range of the measuring device. This system variant is particularly suitable if the actual feature is only to be examined after processing. It is also advantageous if the workpiece positioning unit is set up to remove the workpiece from the laser processing device and to position it in the measuring range of the measuring device. In this case, it can be advantageous to design the workpiece positioning unit in the manner of a robotic gripper arm. Robotic gripping arms that can be moved in three-dimensional space are particularly suitable. It should be pointed out that a conveyor belt, roller device or conveyor device can also function as a workpiece positioning unit, which on the one hand removes (in the sense of transporting it away) the workpiece from the laser processing device (after processing) and, on the other hand, positions the workpiece in a measuring area of a measuring device can provide. For example, the workpiece positioning unit can be designed as a linear transport unit (e.g. conveyor belt, roller device or conveyor device) which is guided through the laser processing device and the measuring device. A rotating disk on which a workpiece is arranged (for example on a workpiece holder arranged on the disk) can also be viewed as a workpiece positioning unit, that is to say as a component of the transfer system.

According to a further embodiment of the invention, it can be provided that the workpiece positioning unit is designed as a multi-axis robot, Scara robot or delta robot. Multi-axis robots, especially robotic arms (these can comprise one arm link or several arm links) are suitable for the flexible removal and positioning of workpieces. At its end, the arm of a multi-axis robot can have a gripping device. This can be a mechanical gripping device or a magnetically mediated gripping device. A gripping device based on suction cups is also conceivable. During the removal or positioning movement, a multi-axis robot can perform swivel and linear movements. A Scara robot is to be understood as an industrial robot whose structure is similar to a human arm. Scara (Selective Compliance Assembly Robot Arm) robots are often referred to as horizontal articulated arm robots. A Scara robot usually has four axes and four degrees of freedom. A delta robot, however, is to be understood as a parallel-arm robot with rod kinetics. Such a robot has at least three arms which are connected to a base via universal joints.

According to a further advantageous embodiment of the invention, it can be provided that the measuring device is integrated into the laser processing device or arranged on it. Such a configuration means that a measuring area accessible via the measuring device (this can for example be referred to as a “field of view”) coincides with the processing area of the laser processing device or is arranged in the immediate vicinity of it. This reduces the effort involved in aligning the measuring area in relation to the machining area. The measuring area can also be designed in such a way that it only covers part of the machining area; it is equally possible to design the measuring device in such a way that the dimensions of the measuring area extend beyond the machining area of the laser machining device. The above can also apply to at least one further measuring device.

The integration of the measuring device into the laser processing device or the arrangement of the measuring device (or further measuring devices) on the laser processing device enables, among other things, the measurement of one or more actual features (e.g. actual optical or acoustic features) of the workpiece during laser processing, In such a case, it is an online measurement. However, the integration of the measuring device into the laser processing device or the arrangement of the measuring device on the laser processing device does not preclude the measurement from being carried out only after the laser processing. This is because the laser processing and measurement of the actual optical or acoustic feature can easily be operated sequentially in terms of control technology. The integrated design of the measuring device and laser processing device can - in contrast to a separate design - be advantageous because no removal of the workpiece from the laser processing device and subsequent repositioning of the workpiece in relation to the measuring device is required. In this way, the precision in the alignment of the definition and setting of the measuring range can be inherently increased. Furthermore, an integrated training reduces the space requirements and the costs of the manufacturing system. It is also conceivable that the laser processing device as such forms the measuring device, but in this case at least suitable detection elements or measuring elements are to be provided in the laser processing device. For example, detection elements can be provided for detecting the optical emission (e.g. for detecting plasma luminescence or X-rays).

According to a further advantageous embodiment of the invention, it can be provided that the transfer system is set up to position the laser processing device or the laser processing device together with the measuring device integrated in it or arranged on it, relative to the workpiece, namely in such a way that the workpiece is in a processing area of the Laser processing device is arranged. This feature is directed to the previously described second embodiment of the transfer system. In this case, the transfer system is set up to position or move the laser processing device or the laser processing device together with the measuring device integrated into it or arranged on it relative to a workpiece, which is preferably arranged in a fixed position (this can e.g. be arranged in a workpiece holder). At the same time, however, according to this variant, the workpiece can also experience a positioning movement, preferably in coordination with a positioning movement relating to the laser processing device, whereby, true to this variant, the laser processing device experiences a larger positioning path (or feed path) than the workpiece. The variant mentioned also does not exclude that the workpiece (e.g. with a workpiece positioning unit) is initially positioned in a workpiece holder and, after laser processing with the laser processing device or measurement with the measuring device, is removed from the workpiece holder. For positioning the laser processing device, the transfer system can for example comprise a robot guide for the laser processing device. Positioning via a hydraulic device (e.g. a hydraulic lifting and lowering device) can also be an advantageous variant.

According to a further embodiment of the present invention, it can be provided that the transfer system is set up to position the measuring device relative to the workpiece. The measuring device can therefore also be moved or positioned in a detached or self-sufficient manner relative to the laser processing device. This is particularly advantageous for an embodiment in which the measuring device is arranged separately, in particular downstream, from the laser processing device. The positioning can for example be carried out robot-guided, for example via a robot arm or a robot arrangement, the robot guidance preferably enabling a movement or positioning of the measuring device in three-dimensional space. Rail-guided or roller-guided positioning as well as hydraulic positioning of the measuring device appear possible. The same can also apply to the laser processing device or a laser processing device with a measuring device integrated in this. Furthermore, the aforementioned positioning variants can also be used for further measuring devices as components of the manufacturing system according to the invention. The positioning of the measuring device or measuring devices can take place directly via the control unit, or via individual sub-control units which are in signal connection with the control unit. The same applies to the laser processing device or a laser processing device with an integrated measuring device or a measuring device arranged on it. The control unit controls the interaction of the components of the transfer system.

According to a further embodiment of the present invention, it can be provided that the transfer system is designed as a conveyor belt running from the production system starting point to the production system end point. The conveyor belt can be designed entirely as a conveyor belt, which runs from the production system starting point to the production system end point. It is also possible for only sections of the transfer system to be designed in the form of a conveyor belt. In the context of the invention, a conveyor belt can be understood to mean not only a coherent, linearly moving belt, but also other conveying devices that can convey a workpiece along the production line via a moving conveying means. A conveyor belt can also be understood to mean, in particular, a roller-bound or rail-bound conveyor device. Said conveyor belt or said conveying device (be it roller-bound or rail-bound) preferably runs continuously from the production system starting point to the production system end point. The conveyor belt or the conveying device can be designed in such a way that it is passed through the laser processing device and / or the measuring device or further measuring devices. The conveyor belt or the conveyor device can also be guided past the named components of the transfer system. A transfer system based on such a conveyor belt or conveyor device can be assembled and controlled in a relatively simple manner. It is also ideally suited for continuous operation of the manufacturing system.

According to a further advantageous embodiment of the invention, it can be provided that the transfer system comprises a robot system which has one or more robots, in particular one or more multi-axis robots, SCARA robots or delta robots. In this context, it should also be mentioned that according to a further advantageous embodiment of the invention it can be provided that the laser processing device and / or the measuring device can be assigned a robot, the laser processing device and / or the measuring device using the respective robot relative to the workpiece is positionable. It is therefore possible to position the workpiece using one or more robots in relation to one or more functional unit (s) of the manufacturing system (this includes both the removal of the workpiece from a stationary or moving position and the repositioning of the workpiece). It is also possible to position components of the manufacturing system (e.g. the laser processing device and / or the measuring device) relative to the workpiece in a robot-mediated manner (i.e. using robots). However, the transfer system can also comprise a combination of a linear transport means such as the aforementioned transport belt or the conveyor device and a positioning device based on a robot. At the same time, the transfer system can also comprise a combination of a rotating disk as transport means (this can move a workpiece positioned thereon by executing a rotational movement into different positions of a circumference) and a robot-based positioning device for the workpiece.

In addition to the laser processing device and / or the measuring device, further functional units of the manufacturing system can also be positioned or delivered by means of a robot-controlled device. For example, it can be provided that a workpiece is transported starting from a production system starting point via a conveyor belt or a conveyor along the production line to the production system end point, but at certain positions on the production line a rest position of the workpiece by stopping the transport belt is realized so that a delivery or positioning of a functional unit of the manufacturing system, for example the laser processing device and / or measuring device, can take place. In the same way, however, a workpiece can also be arranged on a rotating disk, which can be stopped at certain times or positions so that the laser processing device and / or measuring device can be delivered or positioned separately. The workpiece can also be gripped by a robot (arm) in the stated rest positions of the conveyor belt, the conveyor device or the rotating disk and positioned at a desired point.

According to a further advantageous embodiment of the present invention, it can be provided that the laser processing device is set up to process the workpiece sequentially or simultaneously at one processing point or several processing points. This can take place, for example, in that, in the case of a workpiece arranged in a fixed position relative to the laser processing device, one or more modulated laser beams are mapped onto one or more processing points on the workpiece. The movement unit of the laser processing device (e.g. a galvanometer scanner) can be used to move the modulated laser radiation (be it a single beam or a plurality of beams) relative to the workpiece, so that the processing points accessible via the movement unit in a given scan field can be addressed. Different processing points can be processed one after the other or in parallel. The latter is particularly the case in which a plurality of modulated laser beams are directed onto the workpiece. Furthermore, it is possible to carry out a combined parallel and sequential processing, for example by processing a pattern or pattern of modulated laser beams or modulated laser beams directed onto the workpiece in parallel to several processing points, and after the processing points have been processed, they are jointly aligned to other processing points . The simultaneous processing of processing points leads to an increased processing and thus process speed of the manufacturing system.

Sequential processing can also take place in that a stationary, modulated laser beam remains in a fixed position while the workpiece is moved relative to this laser beam. The same applies to a plurality of stationary modulated laser beams.

Furthermore, it can be provided both to carry out a movement of the modulated laser beam or a plurality of modulated laser beams via the movement unit associated with the laser processing device and to move the workpiece. Depending on the processing task, the processing or movement path associated with the movement unit or the laser beam (s), as well as the movement path on which the workpiece is based, can be divided into individual movement paths of an overall movement, with the overall movement taking into account an optimized processing speed or other Criteria can be calculated.

According to a further advantageous embodiment of the present invention, it can be provided that the workpiece positioning unit is set up to position a batch of a plurality of workpieces, in particular a batch of a plurality of workpieces arranged on a workpiece carrier, relative to the laser processing device. As a result, the processing speed or throughput speed of the manufacturing system can be increased with regard to the number of workpieces to be processed. This is because the batchwise positioning of workpieces relative to the laser processing device avoids the need for separate positioning of individual workpieces. Simultaneous positioning (at least a rough positioning) of a plurality of workpieces (of the batch) in relation to the laser processing device is therefore ensured. For this purpose, a rotating disk can be arranged in the area of the laser processing device, for example, which rotates a workpiece carrier that accommodates the plurality of workpieces in order to position another workpiece relative to the laser processing device or a processing area after a certain workpiece has been processed by means of a rotation. Other positioning devices can also be used (e.g. robots, linear axes, etc.).

In this context, it should be mentioned that, according to a further advantageous embodiment of the invention, the procedure can be that the laser processing device is set up to process the batch of the plurality of workpieces sequentially or simultaneously. This means that the workpieces belonging to the batch, after being positioned relative to the laser processing device, are either positioned one after the other in a specific processing area (e.g. by rotation or another corresponding positioning) or that a plurality of modulated laser beams are simultaneously directed onto several or all of the workpieces belonging to the batch become. With batch processing, the processing speed and the throughput of the manufacturing system can be increased significantly.

According to a further advantageous embodiment of the invention, it can be provided that a further measuring device is assigned to the production system, which is preferably arranged downstream of the laser processing device in relation to the production line. An arrangement is particularly preferred in which the further measuring device is arranged downstream of the measuring device which is already associated with the production system. It can also be provided that the further measuring device is integrated into the laser processing device in addition to the measuring device that is provided anyway. The at least one further measuring device (a plurality of further measuring devices can also be provided) can preferably be arranged in a stationary manner. In this context, a stationary arrangement is to be understood as meaning that the at least one further measuring device is arranged essentially stationary in relation to the total length of the production line (ie compared to the movement of the workpiece along the production line), which does not preclude a certain positioning or adjustment of the measuring device can take place.

According to a further advantageous embodiment of the invention, it can be provided that the at least one further measuring device is assigned a robot, wherein the at least one further measuring device can be positioned relative to the workpiece using the respective robot. The respective robots can be, for example, a three-dimensionally movable robot (e.g. in the form of one or more robot arms). With such robot arms, flexible positioning of the at least one further measuring device is made possible. The other robot variants mentioned in the context of the invention can also be used for positioning the at least one further measuring device.

According to a further advantageous embodiment of the invention, it can be provided that the at least one further measuring device is set up to measure the actual feature or a further actual feature under a measuring criterion that deviates from the first measuring device, a different measuring principle, a different precision or to carry out a different measurement scope. Correspondingly, a measurement that differs or differs from that of the first measuring device can be carried out by means of the further measuring device. For example, in a case in which it is determined (by the evaluation unit) that an actual feature measured with the measuring device goes beyond a certain level from a specified target feature or on the basis of the evaluation carried out, it can be arranged, for example, that a new measurement is carried out taking into account a different measurement criterion, a different measurement principle, a different precision or a different measurement scope (e.g. an increased number of measurement scans) in order to check the results of the measurement with the first measuring device or on the basis of the results of a comparative measurement to be able to evaluate.

According to a further advantageous embodiment of the invention, it can be provided that the measuring device and / or the at least one further measuring device is an optical or an acoustic measuring device. Furthermore, any other types of measuring devices that enable an analysis of the locations of the workpiece machined with the laser machining device, in particular a surface examination of the workpiece, come into consideration. Optical or acoustic measurements are advantageous because they can be carried out without contact, which can be advantageous, for example, when examining workpieces that have heated up during laser processing. An acoustic measurement can take place in that acoustic pulses are emitted in the direction of the workpiece and those acoustic signals reflected or scattered by the workpiece are detected and evaluated. For example, echo evaluation techniques can be used here. With optical and acoustic measuring devices, examination areas can be defined flexibly and adjusted if necessary.

According to a further advantageous embodiment of the invention, it can be provided that the measuring device and / or the at least one further measuring device comprises a camera system with one or more cameras, for example 3D camera (s). The use of camera systems can therefore be advantageous because any image sections or observation points of the workpiece can be flexibly selected and examined. In this way, different processing areas can be flexibly defined as the examination area, and the size and position of the examination area can be flexibly adjusted. The entire workpiece being machined or in the machining process can also be recorded by means of a camera system or one or more camera (s), for example one or more 3D camera (s). A 3-D camera is a camera that allows a pictorial representation of a spatial situation, for example a surface topography. On the basis of the data, images or recordings generated with such a 3D camera, certain structures of a surface can also be measured. A three-dimensional image of the workpiece can be made with stereo cameras, a triangulation system, TOF (Time of Flight) cameras and an interferometric system or record light field cameras. A combination of the aforementioned units is also possible. In this context, it is possible for individual cameras of the camera system to be aimed at specific sections of the machined workpiece, it being possible for the sections to overlap. It is also possible for a single camera to optically capture the entire workpiece. As mentioned, an acoustic measurement is to be understood as a measurement in which an acoustic output signal, for example an acoustic pulse, is emitted in the direction of the workpiece, and a reflected or re-radiated acoustic pulse or an acoustic signal is received. Here, too, the entire workpiece or certain areas of the workpiece can be selected for examination.

According to a further advantageous embodiment of the invention, it can be provided that the measuring device and / or the at least one further measuring device comprises a lighting system that interacts with the camera system and consists of one or more lighting elements. For example, one lighting element can be assigned to each camera, and multiple lighting elements can also be assigned to each camera. An overall lighting system can also be provided in relation to one or more cameras. The lighting system can be controlled independently of the camera system, so that, according to an advantageous embodiment of the invention, adapted lighting can be set as a function of the lighting conditions. Those lighting elements assigned to the lighting system can in principle be any light sources suitable for lighting. For example, such a light source can be a halogen lamp, a fluorescent light source, a light source based on a gas discharge, an LED, or a flash light source.

According to a further advantageous embodiment of the invention, it can be provided that the measuring device and / or the at least one further measuring device comprises at least one laser confocal sensor. A laser confocal sensor can be a sensor designed in the manner of a confocal laser scanning microscope. Such a sensor is a confocal point sensor in which the scanning takes place in the focal plane with movable deflecting mirrors. The measuring point can thus be moved relatively quickly over the object. The scanning in the direction of the optical axis is typically done by moving the lens or the object (here the workpiece). The targeted guidance of a confocal observation point over the workpiece allows flexible adaptation of the scanning density to the actual optical resolution.

According to a further advantageous embodiment of the invention, it can be provided that the measuring device and / or the at least one further measuring device comprises at least one white light interferometer or a photodiode. A white light interferometer is an optical measuring device by means of which a non-contact optical measurement is realized, which uses the interference of broadband light (white light) and thus allows 3D profile measurements of surfaces. A photodiode is a semiconductor diode that converts light in the visible, IR or UV range, or, if scintillators are used, also X-rays - to a pn junction or pin junction through the internal photo effect into an electrical current or - depending on Wiring - this offers a lighting-dependent resistance. It is used, among other things, to convert light into an electrical voltage or an electrical current or to receive information transmitted by light.

According to a likewise advantageous embodiment, it can be provided that the measuring device and / or the at least one further measuring device comprises a sensor for detecting X-rays. As mentioned, this can be a photodiode, for example. However, other types of measuring devices can also be used to detect X-rays.

According to a further advantageous embodiment of the invention, it can be provided that the measuring device and / or the at least one further measuring device is designed for online process control, in particular during laser processing. According to the invention, it can be provided in this regard that a detection and examination of the machined locations of the workpiece is carried out even while the laser machining is in progress. This enables feedback regarding the machining quality during the machining process. Even during processing, based on the determined results, conclusions can be drawn about the functioning of certain components or functional units belonging to the production system and, if necessary, corrections can be made.

According to a further advantageous embodiment of the invention, it can be provided that the measuring device and / or the at least one further measuring device is / are set up to include the actual feature, in particular the optical actual feature, in relation to the entire machined workpiece, one or more to measure several section (s) of the machined workpiece, one or more lines of the machined workpiece and / or pixel by pixel. In many cases, it is not necessary to cover the entire workpiece; it is sufficient to to examine only individual points with the measuring device and / or further measuring device. It can also be the case that the workpiece is not processed at all points or at homogeneously distributed points, but only individual points or positions of the workpiece are processed by laser processing, so that only a section, pixel or area examination of the workpiece is included the measuring device and / or the further measuring device is required. In the case of a section-by-section measurement, the sections can have different geometries, for example a polygonally enclosed area, a circular area, etc. A line-by-line measurement can involve scanning the workpiece surface line by line, with the lines being arranged parallel or perpendicular to one another. Selected lines, including lines running diagonally or at different angles to one another, can also be measured. A strip-shaped measurement can also be understood as a linear measurement in the context of the invention.

According to a further embodiment of the invention, it can be provided that the measuring device and / or the at least one further measuring device are set up to measure the topography and / or the profile section and / or the lateral dimension as an actual optical feature. Topographic information generally relates to surface features of the workpiece; in this respect, topographic features can also mean morphological or topological features. In many cases, laser processing has an effect on the surface structure, i.e. the topography, of a workpiece, so that recording the topography is an essential criterion or measurement criterion in the performance analysis of laser processing. The same essentially applies to parameters such as the profile section. Further actual features are extracted from the topographical or profile section data, for example height or depth values, the length and width of machined areas, etc. The size or lateral size of the entire workpiece can serve as a reference value.

According to a further advantageous embodiment of the invention, it can be provided that the transfer system comprises a first transport switch arranged between the laser processing device and the preferably stationary measuring device, which is set up to feed the workpiece to the measuring device or to guide the workpiece past it. A passing by the measuring device can in particular be provided if only random samples are to be examined with the measuring device. This can be coordinated via the control unit and passed on to the first transport switch as an actuating command. The first transport switch can be integrated into the production line, for example in the form of a fork at which a conveyor belt or a conveyor device splits into two separate paths, one of these paths leading past the measuring device and the other leading to the measuring device. The transport switch can comprise a closing flap which allows the workpiece to be transported along only one of the aforementioned paths. Alternatively, the transport switch can be designed as a robot gripper arm that removes the workpiece from the laser processing device or a workpiece holder provided there and positions it either relative to the measuring device or at a location provided downstream of the measuring device.

According to a further advantageous embodiment of the invention, it can be provided that the transfer system comprises a second transport switch, which is arranged downstream of the preferably stationary measuring device in relation to the production line and which is set up to feed the workpiece to the measuring device again, and / or to one of the measuring device in relation to to feed further measuring devices downstream of the production line, and / or to forward it along the production line in the direction of the production system end point, and / or to channel the workpiece out of the transfer system.

A renewed feeding of the processed and measured workpiece into the measuring device can be advantageous if it is to be expected that measuring device-based errors have occurred during the measurement, which thus make a new measurement necessary. At the same time, a repeated measurement can increase the measurement accuracy or reduce the susceptibility to errors on which such measurements are based. If it is established that the actual features recorded with the measuring device correspond to expectations (for example on the basis of the evaluation scheme mentioned), it can be provided that the processed and measured workpiece is forwarded in the direction of the manufacturing system end point, for example for further processing. Provision can also be made to channel the workpiece out of the transfer system, for example in the event that the actual features determined do not correspond to expectations or indicate inadequate processing quality. The second transport switch can also be designed in the form of a fork, in particular an intersection, with a crossing path with a return path for returning the workpiece to the measuring device being provided in relation to a main transport path running between the measuring device and the manufacturing system end point. Another crossing path is connected to a discharge path for discharging the workpiece from the transfer system. The second transport switch can also be provided by a robot, in particular a gripping arm of a robot.

According to a further embodiment of the invention it can be provided that the evaluation unit is set up to carry out the comparison of the actual feature with the target feature with access to a database, the database comprising metadata, reference data or compressed data of the target feature. The database can be integrated directly into the evaluation unit, for example in the form of a memory unit. The database can easily be based on the cloud. In this case, however, a signal connection to the evaluation unit must be provided, for example via a wireless or wired connection of the evaluation unit to a server or computer that can be connected to the Internet. The evaluation unit can also have a wireless or wired connection to the Internet, which enables access to the aforementioned cloud-based database. It is also possible to arrange the database on an external server, as long as sufficient data exchange with the evaluation unit is guaranteed. The data stored in the database, which are used to compare the actual and target characteristics, can be based on empirical values, reference measurements or the like. Metadata is structured data that contains information about characteristics of other data.

According to a further embodiment of the invention, it can be provided that the evaluation unit is set up to carry out the evaluation based on a hierarchical evaluation scheme, the evaluation scheme comprising a warning limit, an action limit above the warning limit and a tolerance limit with respect to the feature deviation above the action limit. In the case of a feature deviation lying between the warning limit and the action limit, the control unit can cause a process feature relating to the measuring device to be adapted as a process feature relating to the production system. For example, as a result of such a deviation, a measurement parameter (e.g. the resolution, the alignment, the number of scans, etc.) of the measurement device can be adapted. Likewise, if there is a feature deviation between the action limit and the tolerance limit, the control unit can initiate the adaptation of a manufacturing system-related process feature, for example machining parameters of the laser machining device can be adapted. Furthermore, if a feature deviation exceeds the tolerance limit, a workpiece-related process sequence can be initiated, for example the arrangement of a repeated or alternative measurement (with a further measuring device) or even a discharge from the production system. The warning limit, action limit or the tolerance limit can be specified externally. It is also conceivable that the warning limit, action limit and / or tolerance limit are updated periodically or aperiodically or adapted to changing system features. This can easily be done automatically.

According to a further embodiment of the invention, it can be provided that the evaluation unit is set up to carry out the comparison and / or the evaluation using an algorithm, in particular an algorithm based on artificial intelligence. Accordingly, an automated analysis relating to the comparison and / or the evaluation is made possible. In this context, the use of artificial intelligence enables dynamic and automated changes to specified target characteristics. In addition, this enables target characteristics to be learned or derived (for the first time) (e.g. on the basis of other target characteristics that have already been specified, adapted or learned). New target characteristics can also be defined on the basis of artificial intelligence and added to the evaluation or comparison. For this purpose, existing data or data sets of target characteristics can be checked for relationships. When using artificial intelligence, there are no steps involved in complex and often error-prone programming or parameterization of new relationships.

Basically, it is the task of the "artificial intelligence" to correlate recorded data (of whatever nature, e.g. the mentioned actual feature data) with each other, to identify deviations from expected values (e.g. target feature data) and, if necessary, to independently initiate further consequences. A correlation of the data with one another is made possible, for example, via a time stamp of the processed workpiece, an order or workpiece number (this can be known on the basis of operator inputs). The assignment of data to specific workpieces is possible in particular via suitable tracking of the workpieces through the ongoing manufacturing, machining and / or measuring process. For this purpose, the workpieces can be provided with appropriate labels (these can be printed, lasered, etc., for example) that allow the workpiece to be assigned. Artificial intelligence can be trained particularly advantageously if, as part of the setting of the machine parameters associated with the manufacturing system, about manufactured good parts that (up to) the time of manufacture available data - without a specific further analysis - can be retrospectively assessed as "OK" (i.e. below the warning limit in relation to the assessment scheme mentioned). The data recorded in this way can be used as a reference, fingerprint of the manufacturing or machining process or as a data image to compare subsequently determined data, which enables the evaluation of ongoing data streams, a key feature for the optimization of series machining processes. At the same time, workpieces defined as bad parts (eg with a feature deviation above the tolerance limit) can be classified as "not in order" in the same process. Furthermore, the warning limits, intervention limits and / or tolerance limits mentioned can be trained on this basis and, if necessary, adapted.

Basically, it makes sense to provide an artificial intelligence with a series of limit values for the examination variables or measured variables (e.g. actual characteristics), to load them from a database, to initiate an automated search process in this regard and a corresponding update. For this purpose it can be provided that the already mentioned limits of the evaluation scheme are subdivided even more finely. The warning limit can be divided into an upper and lower warning limit, the action limit accordingly into an upper and lower action limit and the tolerance limit into an upper and lower tolerance limit. As a result, manufacturing system-related process features can be adapted and workpiece-related process sequences can be initiated. For example, messages, adjustments to the (laser) processing parameters, handling parameters, measurement parameters, workpiece ejection or workpiece releases may be mentioned.

Artificial intelligence is essentially based on a set of mathematical relationships, the input variables of which are parameterized or assumed with starting values. For this purpose, statistical methods, heuristics, multi-dimensional data comparisons or event analysis can be used, for example to control production system-related process features and workpiece-related process sequences.

As already described from the above description of the mode of operation of the artificial intelligence (optionally) used within the scope of the present invention, according to a further advantageous embodiment of the invention it can be provided that the control unit is set up to adapt the process feature related to the measuring device, and / or the adaptation of the production system-related process feature and / or the initiation of the workpiece-related process sequence to be carried out using an algorithm based on artificial intelligence. Thus, the aforementioned adaptations or causes of the process features or process sequences can be implemented in an automated manner, and can take place on the basis of bases that constantly adapt to the conditions of the workpieces or the performance of the production system. On the one hand, this reduces the control effort for operating the production system, and on the other hand, the performance of the production system is continuously improved, taking online quality control into account, namely in adaptation to the currently existing system and workpiece conditions.

According to an advantageous embodiment of the invention, it can be provided that the control unit is set up to carry out the adaptation of the production system-related process feature in a random, quota-based, product-type-based or logic-based manner, in particular using an algorithm based on artificial intelligence. Random-based adaptation can mean, in particular, a random sample-like variation of production system-related process features that are adjusted randomly or randomly as a result of a feature deviation that goes beyond the warning limit or action limit mentioned, for example. This can easily include repeated adaptation, for example until an improvement in the measured actual features can be determined. The same process can be based on quotas, i.e. a certain proportion of production system-related process features is adjusted as a result of a certain evaluation result, for example as a result of a feature deviation that exceeds the mentioned warning limit or intervention limit. In addition, the adaptation can also take into account that the machined workpiece or workpieces is a specific product type. A product type can refer, for example, to the type, material or other properties of the workpiece to be examined. A logic-based adaptation means the use of logical system relationships that can arise in the event of a certain feature deviation. It is particularly advantageous if the aforementioned relationships are taken into account using artificial intelligence. This can access corresponding reference data, old data, etc. for this purpose. The algorithm based on the artificial intelligence can be implemented and executed in the evaluation unit and / or the control unit.

1. a) Freigeben des bearbeiteten Werkstücks;
2. b) Deklarieren des bearbeiteten Werkstücks als Ausschuss;
3. c) Vornehmen einer wiederholten Messung des bearbeiteten Werkstücks mit der Messvorrichtung oder der weiteren Messvorrichtung.

According to a further embodiment of the invention, it can be provided that the control unit is set up to initiate one of the following workpiece-related process sequences:

1. a) releasing the machined workpiece;
2. b) Declaring the machined workpiece as scrap;
3. c) Carrying out a repeated measurement of the machined workpiece with the measuring device or the further measuring device.

The control unit has access or is in signal exchange with the evaluation unit. The evaluation unit can forward the results based on the feature comparison or the evaluation to the control unit. There, the information can be converted into a corresponding command with regard to the workpiece-related process sequence (see letters a) to c)) above.

According to a further advantageous embodiment of the invention, it can be provided that the control unit is set up to release the machined workpiece in the event of a feature deviation lying below the warning limit. In this case, the feature deviation, deviation between the actual and target features, lies in an area that meets the quality requirements for the workpiece, so that a release for further processing of the workpiece or delivery to the customer can be initiated.

According to a further embodiment of the invention, it can be provided that the control unit is set up to declare the machined workpiece as scrap in the event of a feature deviation that exceeds the tolerance limit. In the event that the machined workpiece does not meet the quality requirements with regard to certain actual features, it cannot be delivered to customers or passed on for further processing. As already mentioned, the control unit can initiate a change in measurement parameters of the at least one measurement device in the event of a feature deviation lying above a warning limit but below the action limit. In the case of a feature deviation that is above the control limit but below the tolerance limit, changes to other manufacturing system-related process features (e.g. laser processing parameters) can also be initiated. Correspondingly, according to a further embodiment of the invention, it can be provided that the control unit is set up to adapt an operating parameter of the laser processing device as a production system-related process feature. Operating parameters can mean any parameter of the laser processing device, for example the pulse duration, pulse power, alignment of the modulated laser beam on the workpiece, etc.

According to a further embodiment of the invention, it can be provided that the control unit is set up to control one or more functional units of the manufacturing system, in particular the transfer system, the laser processing device, the measuring device and / or the at least one further measuring device, the first transport switch and / or the second To control the transport switch and / or the evaluation unit with computer support, in particular using an algorithm, for example an algorithm based on artificial intelligence, which is aimed at a kind of optimization of one or more boundary conditions. In this way, the functional units of the production system can also be adapted independently of the results or the quality of the laser preparation actually carried out. This is because it may not only be necessary to adapt laser processing parameters to match the results or processing quality of laser processing, but also to take into account, for example, business parameters when controlling functional units of the production system.

Thus, according to an advantageous embodiment of the invention, it can be provided that the one or more boundary conditions relate to one or more of the following criteria: cost minimization, quality optimization, throughput maximization, optimization of the test accuracy, minimization of statistical fluctuations, guarantee of process capability. Related parameters can also be taken into account in the form of artificial intelligence access to known data (old data) or currently determined data. A self-learning process in this regard can also take place accordingly. Such an optimization, for example with regard to an optimization of the processing throughput, can therefore lead to a trade-off between a sufficient, but possibly not optimal processing quality, and a high processing speed (the latter is associated with an increase in throughput).

According to a further advantageous embodiment of the invention, it can be provided that the manufacturing system has a reservoir of workpieces to be processed. A reservoir can be understood to mean, for example, a workpiece magazine or a workpiece store. The workpieces can be arranged, for example, stacked in such a reservoir. A reservoir can also be understood to be a roll (coil) of rolled-up sheet metal, which is unrolled in the direction of the laser processing device. Other substrates (e.g. plastic films) can also be provided in the form of coils.

According to a further advantageous embodiment of the invention it can be provided that the Manufacturing system for series processing of workpieces is designed and set up. This means that workpieces are gradually machined in continuous operation by means of the production system. Series production can be carried out continuously or discontinuously.

According to a further advantageous embodiment of the invention, it can be provided that the production system can be integrated into a higher-level production line. This is to be understood as meaning that the production system is a part of a larger production system, for example a production line for motor vehicles.

As mentioned at the beginning, the object according to the invention is also achieved by a method for manufacturing a laser-machined workpiece with a manufacturing system described above.

The production system comprises at least one laser processing device, a transfer system for transporting the workpiece along a production line running from a production system starting point in the direction of a production system end point and / or for positioning the laser processing device relative to the workpiece, a measuring device, an evaluation unit and a control unit

• - unter Einsatz des Transfersystems: Positionieren des Werkstücks relativ zur Laserbearbeitungsvorrichtung oder Positionieren der Laserbearbeitungsvorrichtung relativ zu dem Werkstück;
• - unter Einsatz der Laserbearbeitungsvorrichtung: Bearbeiten des Werkstücks;
• - unter Einsatz der Messvorrichtung: Messen eines Ist-Merkmals, insbesondere eines optischen oder akustischen Ist-Merkmals, des Werkstücks während und/oder nach der Bearbeitung;
• - unter Einsatz der Auswerteeinheit: Abgleichen des Ist-Merkmals mit einem Soll-Merkmal, Feststellen einer diesbezüglichen Merkmalsabweichung sowie Bewerten der Laserbearbeitung auf Basis eines Bewertungsschemas;
• - unter Einsatz der Steuereinheit und auf Basis der Bewertung und/oder einer rechnergestützten Optimierung: Anpassen eines fertigungssystembezogenen Prozessmerkmals und/oder Veranlassen einer werkstückbezogenen Prozessfolge.

The method according to the invention comprises the following steps:

• using the transfer system: positioning the workpiece relative to the laser processing device or positioning the laser processing device relative to the workpiece;
• - Using the laser processing device: processing of the workpiece;
• using the measuring device: measuring an actual feature, in particular an optical or acoustic actual feature, of the workpiece during and / or after machining;
• - Using the evaluation unit: comparing the actual feature with a target feature, determining a related feature deviation and evaluating the laser processing on the basis of an evaluation scheme;
• - using the control unit and on the basis of the evaluation and / or computer-aided optimization: adapting a production system-related process feature and / or initiating a workpiece-related process sequence.

According to a further embodiment of the method proposed by the invention, it can be provided that the evaluation is based on a hierarchical evaluation structure that includes a warning limit, an action limit above the warning limit and a tolerance limit with respect to the feature deviation above the action limit.

• - einer zwischen Warngrenze und Eingriffsgrenze liegenden Merkmalsabweichung, die Steuereinheit die Anpassung eines auf die Messvorrichtung bezogenen Prozessmerkmals veranlasst,
• - einer zwischen Eingriffsgrenze und Toleranzgrenze liegenden Merkmalsabweichung, die Steuereinheit die Anpassung eines fertigungssystembezogenen Prozessmerkmals veranlasst,
• - einer über die Toleranzgrenze hinausgehenden Merkmalsabweichung, die Auswerteeinheit eine negative Gütebewertung vornimmt und die Steuereinheit eine werkstückbezogene Prozessfolge veranlasst.

According to a further embodiment of the method proposed by the invention, it can be provided that in the case

• - a feature deviation lying between the warning limit and the action limit, the control unit initiates the adaptation of a process feature related to the measuring device,
• - a feature deviation lying between the action limit and the tolerance limit, the control unit initiates the adaptation of a production system-related process feature,
• a feature deviation that exceeds the tolerance limit, the evaluation unit carries out a negative quality assessment and the control unit initiates a workpiece-related process sequence.

According to a further embodiment of the method proposed by the invention, it can be provided that the evaluation unit carries out the comparison and / or the evaluation, preferably using an algorithm, for example an algorithm based on artificial intelligence.

According to a further embodiment of the method proposed by the invention, it can be provided that the control unit adjusts the process feature related to the measuring device and / or adjusts the production system-related process feature and / or initiates the workpiece-related process sequence using an artificial intelligence-based one Algorithm executes.

1. a. das bearbeitete Werkstück wird freigegeben;
2. b. das bearbeitete Werkstück wird als Ausschuss deklariert;
3. c. es wird eine wiederholte Messung des bearbeiteten Werkstücks mit der Messvorrichtung oder zumindest einer weiteren Messvorrichtung vorgenommen.

According to a further embodiment of the method proposed by the invention, it can be provided that the control unit initiates one or more of the following workpiece-related process sequence (s) as a function of the assessment:

1. a. the machined workpiece is released;
2. b. the machined workpiece is declared as scrap;
3. c. a repeated measurement of the machined workpiece is carried out with the measuring device or at least one further measuring device.

According to a further embodiment of the method proposed by the invention, it can be provided that the machined workpiece is released in the case of a feature deviation lying below the warning limit.

According to a further embodiment of the method proposed by the invention, it can be provided that the machined workpiece is declared as scrap in the event of a feature deviation that exceeds the tolerance limit.

According to a further embodiment of the method proposed by the invention, it can be provided that the control unit has one or more functional units of the manufacturing system, in particular the transfer system, the laser processing device, the measuring device and / or the at least one further measuring device, a first transport switch and / or a second transport switch, as well as the evaluation unit controlled by computer, in particular using an algorithm, for example an algorithm based on artificial intelligence, which is aimed at optimizing one or more boundary conditions.

According to a further embodiment of the method proposed by the invention, it can be provided that the control unit controls one or more functional units with regard to an optimization of the following boundary conditions: cost minimization, quality optimization, throughput maximization, optimization of the test accuracy, minimization of statistical fluctuations, guarantee of process capability.

According to a further embodiment of the method proposed by the invention, it can be provided that it is used for series machining of workpieces.

According to a further embodiment of the method proposed by the invention, it can be provided that a manufacturing system designed according to the invention is used to manufacture the laser-machined workpiece.

With regard to the mentioned advantageous refinements of the method according to the invention, reference is made to the preceding statements on the manufacturing system according to the invention.

• 1 eine schematische Darstellung einer Laserbearbeitungsvorrichtung als Bestandteil des erfindungsgemäßen Fertigungssystems, und
• 2 eine den Werkstückfluss in dem erfindungsgemäßen Fertigungssystem schematisch wiedergebende Darstellung.

Further advantages, refinements and developments related to the device according to the invention or the method according to the invention are explained in more detail with the aid of the exemplary embodiments described below. These are intended to clarify the invention to the person skilled in the art and enable him to carry out the invention without, however, restricting the invention. The features described on the basis of the exemplary embodiments can also be used to develop the device according to the invention as well as the method according to the invention. The exemplary embodiments are explained in more detail with reference to the figures. There shows:

• 1 a schematic representation of a laser processing device as part of the manufacturing system according to the invention, and
• 2 a representation schematically reproducing the workpiece flow in the manufacturing system according to the invention.

In the 1 the basic structure of a laser processing device is shown, as it can be used as part of the production system or method proposed by the invention.

This initially includes a table 18th holding a workpiece holder 22nd for holding a workpiece to be machined 24 trains. The machining area of the workpiece to be machined 24 forms a working level 3rd in which the laser machining of the workpiece 24 he follows. Without further ado, the table can 18th including workpiece holder 22nd but also be formed separately from the laser processing device.

Furthermore, the laser processing device comprises a beam shaping unit 4th in the form of a spatial light modulator placed between a laser radiation source 1 and the working level 3rd in the optical path 2 that from the laser radiation source 1 generated laser radiation 10 , 20th is inserted. The spatial light modulator is set up to do this through local modulation of the laser beam 10 a predefinable intensity distribution of the modulated laser beam 20th on the workpiece 24 or in the working level 3rd to create. In particular, a variable spatial light modulator can be considered for this purpose. The spatial light modulator used is an active optical component that controls the phase of the laser radiation source 1 generated and incident on the spatial light modulator laser beam 10 varies locally depending on the location. The local phase delay can be actively controlled pixel by pixel. For this purpose, the spatial light modulator is equipped with a control unit 40 connected, which is set up to electronically adjust the locally varying phase delay applied by the spatial light modulator pixel by pixel. The spatial light modulator is preferably used in a reflective configuration.

The one in the beam forming unit 4th or the spatial light modulator performed modulation of the laser beam 10 is based on a reflection of the incident laser beam 10 on a silicon surface, in front of which a liquid crystal layer is arranged. It is also conceivable to use other surface materials. The birefringent properties of the liquid crystal layer can be set locally in a targeted manner by applying an electric field via microstructured electrodes. Corresponding spatial light modulators 4th are sold by Holoeye and Hamamatsu under the name LCOS (“Liquid Crystal on Silicon”) - Spatial Light Modulator.

The spatial light modulator used allows the generation of intensity distributions on the workpiece that can be freely specified within wide limits 24 by diffraction of laser radiation on a phase modulating grating. Spatial light modulators constructed in this way can cope with very high laser powers, both when using continuous and pulsed laser radiation.

In the optical path 2 of the laser beam 10 , 20th is a plurality of dielectric mirrors 150 arranged for beam deflection. The dielectric mirrors have a reflection of less than 100 percent and are designed in such a way that the transmitted laser radiation is optically only minimally distorted. The laser radiation source used 1 preferably generates pulsed laser radiation with a pulse duration between 100 ns and a few fs. Typical pulse repetition rates are in the range from a few hundred hertz to a few megahertz. The optical power of the laser radiation source 1 is around 100 W. The laser radiation source 1 generates monomodal laser radiation in TEMoo mode. This has a circular cross section with a Gaussian intensity distribution.

Furthermore, is between the laser radiation source 1 and the spatial light modulator, a lens-based device for beam expansion 60 arranged. The beam expansion generated is the same in both spatial directions perpendicular to the steel direction. In relation to the beam diameter, the incident laser beam is expanded by an expansion factor of 2, ie the beam cross-section increases by the factor 4th .

The device for beam expansion 60 is designed so that that of the laser radiation source 1 generated, quasi-parallel beam 10 is converted into a beam with a significantly larger cross-section, but which still has only a slight divergence, so that it is to be regarded as quasi parallel.

Furthermore, in the beam path of the device shown is between the laser radiation source 1 and the spatial light modulator 4th a half-wave delay element designed as a half-wave plate 70 arranged. This delay element 70 allows the direction of polarization of the laser beam incident on the spatial light modulator to be adjusted 10 .

Furthermore, upstream of the device for beam expansion 60 a beam shaping element 19th intended. In the 1 are two possible arrangements of the beam shaping element 19th indicated (dashed component).

In terms of the optical path 2 or the beam path are arranged downstream of the beam shaping unit 4th two relay optics 90 , 92 arranged, between which the modulated laser radiation 20th forms a pronounced beam waist. The relay optics 90, 92 form the spatial light modulator in one point 51 from.

By means of an optical mask arranged at the location of this beam waist 100 A structured sheet of metal is transformed into undesirable orders from the modulated laser radiation 20th , ie the diffraction pattern generated by the spatial light modulator, is filtered out. In particular, the beam components that are not diffracted by the spatial light modulator, which practically represent the zeroth diffraction order of the spatial light modulator, and the so-called higher orders are undesirable.

Furthermore, it is related to the optical path 2 behind the spatial light modulator, but in front of the working plane 3rd or the workpiece 24 an F-theta lens composed of several lenses 80 (also referred to as “flat field lens”), arranged, which is set up by the second relay optics 92 incident, essentially parallel laser radiation 20th to that of the workpiece holder 22nd on the table 20th located workpiece 24 to focus.

There is also a movement unit in the form of a scanning unit 50 provided, which is set up to move the laser beam 20th on one in the workpiece holder 22nd arranged workpiece 24 to effect. In the exemplary embodiment shown, this movement is brought about by active control of the beam path of the laser radiation.

The scanning unit 50 is designed as a two-axis galvanometric mirror scanner. Using this mirror scanner, the laser beam 20th along two independent axes X and Y, which are in the plane of the surface of the table 18th lie on the surface of the workpiece 24 or in the working level 3rd be moved.

Furthermore, the in 1 illustrated laser processing device a central computing and control unit 110 on into which the control unit 40 of the spatial light modulator is integrated and the both the scanning unit 50 , the laser radiation source 1 as well as the spatial light modulator. The central control unit 110 be set up to use the modulated laser radiation 20th for machining a workpiece 24 , which is in the working level 3rd or the workpiece holder 22nd located above the surface of the workpiece 24 to move.

As already mentioned at the beginning, the spatial light modulator is set up to generate the laser beam 10 to apply an adjustable phase distribution to a modulated laser beam 20th to generate that in the far field (i.e. in the working plane 2 ) has a predetermined intensity distribution. The specific functionality of the spatial light modulator, as well as the associated design variants, have already been described in detail at the beginning. The beam shaping enables the intensity distribution of a on the workpiece 24 depicted laser spots of the modulated laser beam 20th to adapt to the requirements of the respective processing task.

That in the 2 Production system according to the invention, shown in a highly schematic manner, according to one embodiment of the invention, comprises a laser processing device 5 which, for example, is true to the 1 can be designed structure shown. The manufacturing system also includes a transfer system 7th (shown schematically with arrows), with which a workpiece to be machined 24 from a manufacturing system starting point S. towards a manufacturing system end point E. can be transported. The workpiece can be moved along this production line or transport line 24 run through different functional units of the manufacturing system or be guided past them.

First of all, the workpiece 24 starting from a workpiece reservoir (this can be linked to the manufacturing system starting point S. coincide) in the direction of the laser processing device 5 be transported. This can be done, for example, via a robot arm (not shown) or a conveyor belt (also not shown), but is not limited to these variants. In the area of the laser processing device 5 becomes the workpiece 24 in one on a table 18th arranged workpiece holder 22nd positioned, namely by one of the transfer system 7th associated workpiece positioning unit. In the laser processing device 5 becomes the workpiece 24 by means of one or more modulated laser beams 20th processed.

Then the machined workpiece 24 Via the transfer system (e.g. a robot arm or a conveyor belt) in the direction of a measuring device 6th transported and positioned there. The workpiece 24 or the laser-machined areas of the workpiece 24 are by means of the measuring device 6th examined with regard to an actual feature, in particular an optical or acoustic actual feature, illustrated figuratively by the acquisition of a measurement signal 8th .

After the actual feature has been recorded, an evaluation unit 200 a comparison of the actual feature with a target feature is carried out and a related feature deviation is determined. On this basis, an assessment with regard to the laser processing is carried out, but in particular taking into account a predefined assessment scheme. Is by way of the measurement of the actual feature and the subsequent evaluation with the evaluation unit 200 found that the laser machining of the workpiece 24 corresponds to the quality requirements, the workpiece can 24 by means of the transfer system 7th in the direction of the manufacturing system end point E. be transported. Meets the workpiece 24 however, not the quality requirements, so it can be done via a material switch 12th be channeled out of the transfer system and as scrap A. be declared. The material switch 12th can one with the measuring device 6th measured workpiece 24 after the measurement, however, the measuring device 6th feed again.

Furthermore, between the laser processing device 5 and the measuring device 6th a material switch 11 be arranged. About this first material switch 11 can be a machined workpiece 24 on the measuring device 6th be escorted by.

As shown, the evaluation unit 200 with a control unit 205 of the manufacturing system interact. Both units can form a common unit and be in connection with sub-control units of individual functional units of the manufacturing system. For example, is the control unit 205 signaling with the laser processing device 5 , in particular the computing and control unit provided there 110 connected. The computing and control unit 110 thus forms a sub-control unit of the control unit 205 . Also is the control unit 205 with the measuring device 6th connected in terms of signal technology, and also with the transfer system 7th (not shown) or with components of the transfer system 7th .

Alternatively, the transfer system 7th also be designed and set up in such a way that functional units (for example the laser processing device 5 and the measuring device 6th ) of the manufacturing system relative to the workpiece 24 moved or positioned. For further information in this regard, reference is made to the preceding description of advantageous configurations of the manufacturing system according to the invention.

List of reference symbols

1

Laser radiation source

2

optical path

3

Working level

4th

Beam shaping unit

5

Laser processing device

6th

Measuring device

7th

Transfer system

8th

Measurement signal

10

laser beam

11

first transport switch

12th

second transport switch

15th

Mirror arrangement

18th

table

19th

Beam shaping element

20th

modulated laser beam

22nd

Workpiece holder

24

workpiece

40

Control unit

50

Scanning unit

51

Point

60

Device for beam expansion

70

Half-wave delay element

80

F-theta lens

90

Relay optics

92

Relay optics

100

mask

110

Computing and control unit

150

dielectric mirror

200

Evaluation unit

205

Control unit

A.

Committee

E.

Manufacturing system end point

S.

Manufacturing system starting point

Claims (64)

Manufacturing system for the laser-processing manufacture of an, in particular flat, workpiece (24) comprising: a. a laser processing device (5) which is set up to process the workpiece (24); b. a transfer system (7) which is set up to - To transport the workpiece (24) along a production line running from a production system starting point (S) in the direction of a production system end point (E), the laser processing device (5) between the production system starting point (S) and the production system end point ( E) is arranged, and / or - to position at least the laser processing device (5) relative to the workpiece (24), c. a measuring device (6) which is set up to measure an actual feature, in particular an optical and / or acoustic actual feature, of the workpiece (24) during and / or after machining; d. an evaluation unit (200) which is set up to compare the actual feature with a target feature, to determine a feature deviation in this regard, and to carry out an evaluation with regard to the laser processing based on an evaluation scheme; e. a control unit (205) which is set up to do so on the basis of the assessment and / or a computer-aided optimization - to adapt a production system-related process feature, and / or - to initiate a workpiece-related process sequence. Manufacturing system according to Claim 1 , characterized by a workpiece positioning unit which is set up to position the workpiece (24) in a workpiece holder (22), the workpiece holder (22) preferably being arranged in a machining area of the laser machining device (5). Manufacturing system according to Claim 2 , characterized in that the workpiece positioning unit is part of the transfer system (7). Manufacturing system according to Claim 2 or 3rd , characterized in that the workpiece positioning unit is arranged between the production system starting point (S) and the laser processing device (5). Manufacturing system according to one of the preceding claims, characterized in that the measuring device (6) is arranged downstream of the laser processing device (5) in relation to the manufacturing line. Manufacturing system according to one of the preceding claims, characterized in that the workpiece positioning unit is set up to position the machined workpiece (24) in a measuring range of the measuring device (6). Manufacturing system according to one of the preceding claims, characterized in that the workpiece positioning unit is designed as a multi-axis robot, Scara robot or delta robot. Manufacturing system according to one of the preceding claims, characterized in that the measuring device (6) is integrated into the laser processing device (5) or is arranged on it. Manufacturing system according to one of the preceding claims, characterized in that the transfer system (7) is set up to transfer the laser processing device (5) or the laser processing device (5) together with the measuring device (6) integrated in them or arranged on them, relative to the workpiece (24 ), namely in such a way that the workpiece (24) is arranged in a processing area of the laser processing device (5). Manufacturing system according to one of the preceding claims, that the transfer system (7) is set up to position the measuring device (6) relative to the workpiece (24). Manufacturing system according to one of the preceding claims, characterized in that the transfer system (7) is designed as a conveyor belt running from the manufacturing system starting point (S) to the manufacturing system end point (E). Manufacturing system according to one of the Claims 1 to 10 , characterized in that the transfer system (7) comprises a robot system which has one or more robots, in particular one or more multi-axis robots, Scara robots or delta robots. Manufacturing system according to Claim 12 , characterized in that the laser processing device (5) and / or the measuring device (6) is assigned a robot, the laser processing device (5) and / or the measuring device (6) being positionable relative to the workpiece (24) using respective robots . Manufacturing system according to one of the preceding claims, characterized in that the laser processing device (5) is set up to process the workpiece (24) sequentially or simultaneously at one processing point or several processing points. Manufacturing system according to one of the preceding claims, characterized in that the workpiece positioning unit is set up to process a batch of a plurality of workpieces (24), in particular a batch of a plurality of workpieces (24) arranged on a workpiece carrier, relative to the laser processing device (5 ) to position. Manufacturing system according to Claim 15 , characterized in that the laser processing device (5) is set up to process the batch of the plurality of workpieces (24) sequentially or simultaneously. Manufacturing system according to Claim 1 , characterized in that the laser processing device (5) comprises: a. at least one laser radiation source (1) which is set up to generate a laser beam (10) and to emit it in the direction of the workpiece (24) for processing the workpiece (24); b. a beam-shaping unit (4) arranged downstream of the laser radiation source (1) in the beam direction, which is set up to shape a modulated laser beam (20) from the laser beam (10); c. a movement unit arranged downstream of the beam shaping unit (4) in the beam direction, which is set up to - execute a movement of the modulated laser beam (20) in which the modulated laser beam (20) is moved relative to the workpiece (24), in particular for alignment with different ones Processing points, and / or - to carry out a movement of the workpiece (24) in which the workpiece (24) is moved relative to the modulated laser beam (20). Manufacturing system according to Claim 17 , characterized in that the at least one laser radiation source (1) is set up to generate a continuous or a pulsed laser beam (10). Manufacturing system according to Claim 18 , characterized in that the at least one laser radiation source (1) is set up to generate a pulsed laser beam (10) with pulse lengths in the femto, picosecond or nanosecond range. Manufacturing system according to Claim 17 , characterized in that the at least one laser radiation source (1) is set up to generate a continuous continuous-wave laser beam (10). Manufacturing system according to Claim 17 , characterized in that the movement unit comprises at least one galvanometer scanner and optionally a focus shifter. Manufacturing system according to Claim 17 , characterized in that the movement unit is a one- or multi-dimensional linear unit, a comprises rotatable axis unit, a lifting table or a combination of the aforementioned components. Manufacturing system according to one of the preceding claims, characterized by at least one further measuring device which, in relation to the manufacturing line, is preferably arranged downstream of the laser processing device (5). Manufacturing system according to Claim 23 , characterized in that the at least one further measuring device is arranged in a stationary manner. Manufacturing system according to Claim 23 , characterized in that the at least one further measuring device is assigned a robot, wherein the at least one further measuring device can be positioned relative to the workpiece (24) using a respective robot. Manufacturing system according to one of the preceding claims, characterized in that the at least one further measuring device is set up to measure the actual feature or a further actual feature under a measuring criterion that differs from the first measuring device (6), a different measuring principle, a different Precision or a deviating measurement range. Manufacturing system according to one of the preceding claims, characterized in that the measuring device (6) and / or the at least one further measuring device is an optical or an acoustic measuring device. Manufacturing system according to one or more of the preceding claims, characterized in that the measuring device (6) and / or the at least one further measuring device comprises a camera system with one or more camera (s), for example 3D camera (s). Manufacturing system according to Claim 28 , characterized in that the measuring device (6) and / or the at least one further measuring device comprises a lighting system that interacts with the camera system and consists of one or more lighting element (s). Manufacturing system according to one of the Claims 1 to 27 , characterized in that the measuring device (6) and / or the at least one further measuring device comprises at least one laser confocal sensor. Manufacturing system according to one of the Claims 1 to 27 , characterized in that the measuring device (6) and / or the at least one further measuring device comprises at least one white light interferometer or a photodiode. Manufacturing system according to one of the Claims 1 to 27 , characterized in that the measuring device (6) and / or the at least one further measuring device comprises a sensor for detecting X-rays. Manufacturing system according to one of the Claims 27 to 32 , characterized in that the measuring device (6) and / or the at least one further measuring device is designed for online process control, in particular during laser processing. Manufacturing system according to one of the preceding claims, characterized in that the measuring device (6) and / or the at least one further measuring device is / are set up to measure the actual feature, in particular the optical actual feature, in relation to the entire machined workpiece ( 24), one or more section (s) of the machined workpiece (24), one or more lines of the machined workpiece (24), and / or to measure pixel by pixel. Manufacturing system according to one of the preceding claims, characterized in that the measuring device (6) and / or the at least one further measuring device are set up to measure the topography and / or the profile section and / or the lateral size expansion as an actual optical feature. Manufacturing system according to one of the preceding claims, characterized in that the transfer system (7) comprises a first transport switch (11) which is arranged between the laser processing device (5) and the preferably stationary measuring device (6) and is set up to transport the workpiece (24) Feed the measuring device (6) or guide the workpiece (24) past it. Manufacturing system according to one of the preceding claims, characterized in that the transfer system (7) comprises a second transport switch (12) which is arranged downstream of the preferably stationary measuring device (6) in relation to the production line and which is set up to transport the workpiece (24) - the measuring device (6) to supply again, and / or - to supply a further measuring device downstream of the measuring device (6) in relation to the production line, and / or - to forward along the production line in the direction of the production system end point (E), and / or - the workpiece (24) out of the transfer system. Manufacturing system according to one of the preceding claims, characterized in that the evaluation unit (200) is set up to carry out the comparison of the actual feature with the target feature with access to a database, the database being metadata, reference data or compressed data of the target Feature includes. Manufacturing system according to one of the preceding claims, characterized in that the evaluation unit (200) is set up to carry out the evaluation based on a hierarchical evaluation scheme, the evaluation scheme including a warning limit, an action limit above the warning limit and a tolerance limit above the action limit with respect to the Feature deviation includes. Manufacturing system according to Claim 39 , characterized in that the control unit (205) is set up to initiate the adjustment of a process feature related to the measuring device (6) in the event of a feature deviation lying between the warning limit and the action limit, - a feature deviation lying between the action limit and the tolerance limit, the adaptation of a manufacturing system-related process feature, - a feature deviation that exceeds the tolerance limit, to cause a workpiece-related process sequence. Manufacturing system according to Claim 39 and / or 40, characterized in that the evaluation unit (200) is set up to carry out the comparison and / or the evaluation using an algorithm, in particular an algorithm based on artificial intelligence. Manufacturing system according to one of the preceding claims, characterized in that the control unit (205) is set up to - the adaptation of the process feature related to the measuring device (6), and / or - the adaptation of the production system-related process feature, and / or - the initiation of the to execute workpiece-related process sequences using an algorithm based on artificial intelligence. Manufacturing system according to one of the preceding claims, characterized in that the control unit (205) is set up to carry out the adaptation of the manufacturing system-related process feature in a random, quota-based, product-type-based or logic-based manner, in particular using an algorithm based on artificial intelligence. Manufacturing system according to one of the preceding claims, characterized in that the control unit (205) is set up to initiate one of the following workpiece-related process sequences: a. Releasing the machined workpiece (24); b. Declaring the machined workpiece (24) as scrap (A); c. Carrying out a repeated measurement of the machined workpiece (24) with the measuring device (6) or the further measuring device. Manufacturing system according to Claim 44 , characterized in that the control unit (205) is set up to release the processed workpiece (24) in the event of a feature deviation lying below the warning limit. Manufacturing system according to Claim 44 , characterized in that the control unit is set up to declare the machined workpiece (24) as scrap (A) in the event of a feature deviation exceeding the tolerance limit. Manufacturing system according to one of the preceding claims, characterized in that the control unit (205) is set up to adapt an operating parameter of the laser machining device (5) as a manufacturing system-related process feature. that the control unit (205) is set up to control one or more functional units of the manufacturing system, in particular the transfer system (7), the laser processing device (5), the measuring device (6) and / or the at least one further measuring device, the first transport switch (11) and / or the second transport switch (12) to control the evaluation unit (200) with computer support, in particular using an algorithm, for example an algorithm based on artificial intelligence, which is aimed at optimizing one or more boundary conditions. Manufacturing system according to Claim 32 , characterized in that the one or more boundary condition (s) relates to one or more of the following criteria: cost minimization, quality optimization, throughput maximization, optimization of the test accuracy, minimization of statistical fluctuations, guarantee of process capability. Manufacturing system according to one of the preceding claims, characterized in that the manufacturing system has a reservoir of workpieces (24) to be machined. Manufacturing system according to one of the preceding claims, characterized in that the Production system for the series processing of workpieces (24) is designed and set up. Manufacturing system according to one of the preceding claims, characterized in that the manufacturing system can be integrated into a higher-level manufacturing line. A method for manufacturing a laser-machined workpiece (24) with one of the Claims 1 to 52 trained manufacturing system, the manufacturing system comprising a laser processing device (5), a transfer system (7) for transporting the workpiece (24) along a manufacturing line running from a manufacturing system starting point (S) in the direction of a manufacturing system end point (E) and / or for positioning the laser processing device (5) relative to the workpiece (24), a measuring device (6), an evaluation unit (200) and a control unit (205), the method comprising the following steps: - using the transfer system (7): positioning the workpiece (24) relative to the laser processing device (5) or positioning the laser processing device (5) relative to the workpiece (24); - Using the laser processing device (5): processing of the workpiece (24); - Using the measuring device (6): measuring an actual feature, in particular an optical or acoustic actual feature, of the workpiece (24) during and / or after machining; - Using the evaluation unit (200): comparing the actual feature with a target feature, determining a related feature deviation and evaluating the laser processing on the basis of an evaluation scheme; - Using the control unit (205) and on the basis of the assessment and / or computer-aided optimization: adapting a production system-related process feature and / or initiating a workpiece-related process sequence. Procedure according to Claim 53 , characterized in that the evaluation is based on a hierarchical evaluation structure which comprises a warning limit, an action limit above the warning limit and a tolerance limit above the action limit with regard to the feature deviation. Procedure according to Claim 54 , characterized in that in the case of - a feature deviation lying between the warning limit and the action limit, the control unit (205) initiates the adaptation of a process feature related to the measuring device (6), - a feature deviation lying between the action limit and the tolerance limit, the control unit (205) initiates the adaptation a manufacturing system-related process feature, - a feature deviation that exceeds the tolerance limit, the control unit (205) triggers a workpiece-related process sequence. Procedure according to Claim 53 to 55 , characterized in that the evaluation unit (200) carries out the comparison and / or the evaluation preferably using an algorithm, for example an algorithm based on artificial intelligence. Method according to one of the Claims 53 to 56 , characterized in that the control unit (205) carries out the adaptation of the process feature related to the measuring device (6) and / or the adaptation of the production system-related process feature and / or the initiation of the workpiece-related process sequence using an algorithm based on artificial intelligence. Method according to one of the Claims 53 to 57 , characterized in that the control unit (205) initiates one or more of the following workpiece-related process sequence (s) as a function of the assessment: a. the machined workpiece (24) is released; b. the machined workpiece (24) is declared as scrap (A); c. a repeated measurement of the machined workpiece (24) is carried out with the measuring device (6) or at least one further measuring device. Procedure according to Claim 58 , characterized in that the machined workpiece (24) is released in the case of a feature deviation lying below the warning limit. Procedure according to Claim 58 , characterized in that the machined workpiece (24) is declared as scrap (A) in the event of a feature deviation exceeding the tolerance limit. Method according to one of the Claims 53 to 60 , characterized in that the control unit (205) has one or more functional units of the manufacturing system, in particular the transfer system (7), the laser processing device (5), the measuring device (6) and / or the at least one further measuring device, a first transport switch (11) and / or a second transport switch (12), as well as the evaluation unit (200) controlled by computer, in particular using an algorithm, for example an algorithm based on artificial intelligence, which is aimed at optimizing one or more boundary conditions. Procedure according to Claim 61 , characterized in that the control unit (205) controls one or more functional units with regard to an optimization of the following boundary conditions: cost minimization, quality optimization, throughput maximization, optimization of the test accuracy, minimization of statistical fluctuations, guarantee of process capability. Method according to one of the Claims 50 to 62 , characterized in that it is used for series machining of workpieces (24). Procedure according to Claim 63 , characterized in that one according to one of the Claims 1 to 52 trained manufacturing system for manufacturing the laser-machined workpiece (24) is used.

Images