DE102019115770A1 - Carrier plate for additive manufacturing, corresponding device and process - Google Patents

Abstract

The invention relates to a carrier plate (8) for additive manufacturing, which is suitable for carrying at least one additively manufactured body (14), the carrier plate (8) comprising a first cooperation section (20) and a base section (18), the first cooperation section (20) forms a first free surface (26) of the carrier plate (8), the first free surface (26) being suitable for supporting the additively manufactured body (14). The material of the first cooperation section (20) is the same as the material that is used in the additive manufacturing process, fusible and the material of the base section (18) is less noble than the material of the first cooperation section.

Description

Carrier plate for additive manufacturing, corresponding device and method The present invention relates to a carrier plate for additive manufacturing which is suitable for carrying at least one additively manufactured body, the carrier plate comprising a first cooperation section and a base section, the first cooperation section being a first open area of the carrier plate forms, wherein the first open area is suitable to carry the additively manufactured body.

The present invention relates to plates that hold additively manufactured bodies during manufacture. The invention particularly relates to a carrier plate which can be used in selective laser melting.

Some additive manufacturing processes, also sometimes called "3D printing", require carrier plates to hold the bodies to be manufactured during production. Such carrier plates carry, for example, a metal powder layer from which a section of the body is made. During selective laser melting, the metal powder layer is locally melted in a defined manner by a laser in order to manufacture the body. The first molten and re-solidified metal powder layer must be held on the carrier plate in order to achieve a satisfactory production result.

At the beginning of the additive manufacturing process, the first layer is melted onto a carrier plate. The carrier plate is moved downwards during the production process after the generation of each layer in order to bring the already produced part of the body out of the production zone. At the end of the process, the finished body is detached from the carrier plate, for example by spark erosion.

In order to ensure that the connection between the carrier plate and the manufactured body is sufficient, it is known to use a carrier plate which is made from a material which is similar to the material of the metal powder. Such carrier plates must be sufficiently thick so that the manufactured body does not deform beyond nominal tolerances during the selective laser melting process. An appropriate thickness is also necessary to dissipate enough heat.

However, the known carrier plates are not completely satisfactory because their material is expensive and the carrier plates are disposed of at the end of production.

Accordingly, it is an object of the present invention to make the manufacturing process of additive manufacturing more economical, in particular to lower the costs of the carrier plates without giving up the advantages described above. The advantages include melt compatibility between powder and carrier plate, adequate dimensional stability of the plate and the finished body, and sufficient heat dissipation capacity of the carrier plate.

• - das Material des ersten Kooperationsabschnitts mit dem Material, das in dem additiven Fertigungsprozess benutzt wird, verschmelzbar ist; und
• - das Material des Basisabschnitts weniger edel als das Material des ersten Kooperationsabschnitts ist.

According to the invention, this object is achieved by a carrier plate according to the preamble of claim 1, characterized in that:

• the material of the first cooperation section can be fused with the material that is used in the additive manufacturing process; and
• the material of the base section is less noble than the material of the first cooperation section.

• - die Trägerplatte umfasst einen zweiten Kooperationsabschnitt, der eine zweite Freifläche der Trägerplatte bildet, wobei der zweite Kooperationsabschnitt sich auf einer Seite der Trägerplatte gegenüber der des ersten Kooperationsabschnitts befindet, und wobei das Material des Basisabschnitts weniger edel als das Material des zweiten Kooperationsabschnitts ist;
• - das Material des ersten Kooperationsabschnitts, und gegebenenfalls des zweiten Kooperationsabschnitts, umfasst Kupfer und/oder Titan ;
• - das Material des ersten Kooperationsabschnitts , und gegebenenfalls des zweiten Kooperationsabschnitts , ist eine Kupfer- oder Titan-Legierung, wobei jeweils Kupfer oder Titan der Hauptbestandteil des Materials des ersten Kooperationsabschnitts, und gegebenenfalls des zweiten Kooperationsabschnitts, ausmachen ;
• - die Dicke des ersten Kooperationsabschnitts, und gegebenenfalls des zweiten Kooperationsabschnitts, beträgt zwischen 1mm und 3mm ;
• - der Basisabschnitt besteht aus Baustahl oder Gusseisen ; und
• - das Material des ersten Kooperationsabschnitts, und gegebenenfalls des zweiten Kooperationsabschnitts, ist mit dem Material, das in dem additiven Fertigungsprozess benutzt wird, verschmelzbar.

According to preferred embodiments, the carrier plate according to the invention comprises one, several or all of the following features, in all technically possible combinations:

• the carrier plate comprises a second cooperation section which forms a second free surface of the carrier plate, the second cooperation section being on a side of the carrier plate opposite that of the first cooperation section, and wherein the material of the base section is less noble than the material of the second cooperation section;
• - The material of the first cooperation section, and optionally of the second cooperation section, comprises copper and / or titanium;
• the material of the first cooperation section, and optionally the second cooperation section, is a copper or titanium alloy, copper or titanium being the main constituent of the material of the first cooperation section and optionally the second cooperation section;
• - the thickness of the first cooperation section, and optionally the second cooperation section, is between 1mm and 3mm;
• - the base section is made of structural steel or cast iron; and
• - The material of the first cooperation section, and optionally the second cooperation section, can be fused with the material that is used in the additive manufacturing process.

• - bereitstellen des Basisabschnitts;
• - bereitstellen einer Reibschweißvorrichtung, insbesondere einer Reibrührauftragsvorrichtung ;
• - bereitstellen einer Reibschweißspindel, umfassend das Material, das mit dem Material, das in dem additiven Fertigungsprozess benutzt wird, verschmelzbar ist; und
• - Reibschweißen der Spindel auf einer ersten Schmelzfläche des Basisabschnitts, wodurch aus dem Spindelmaterial der erste Kooperationsabschnitt gebildet wird.

The invention also relates to a manufacturing method of a carrier plate according to the above definition, comprising the following steps:

• - providing the base section;
• - providing a friction welding device, in particular a friction stir application device;
• - providing a friction welding spindle comprising the material which is fusible with the material which is used in the additive manufacturing process; and
• - Friction welding of the spindle on a first melting surface of the base section, whereby the first cooperation section is formed from the spindle material.

According to preferred embodiments, the manufacturing method according to the invention comprises the friction welding of the spindle on a second melting surface which is located on a side of the base section opposite that of the first cooperation section, whereby the second cooperation section is formed from the spindle material.

• - einen Fertigungstisch ;
• - ein Fertigungsbehälter in dem der Fertigungstisch angeordnet ist;
• - ein Laserscansystem ; und
• - eine Trägerplatte ;

wobei die Trägerplatte eine Trägerplatte wie oben geschrieben ist;
wobei die Trägerplatte an die Abmessungen des Fertigungsbehälters angepasst ist, und dazu ausgebildet ist, so vom Fertigungstisch getragen zu werden, dass einer der Kooperationsabschnitte dem Laserscansystem zugewandt ist.The invention also relates to a device for selective laser melting, comprising:

• - a manufacturing table;
• - A production container in which the production table is arranged;
• - a laser scanning system; and
• - a carrier plate;

wherein the carrier plate is a carrier plate as written above;
wherein the carrier plate is adapted to the dimensions of the production container and is designed to be carried by the production table in such a way that one of the cooperation sections faces the laser scanning system.

The single figure shows part of a device for selective laser melting 1 , which is a manufacturing table 2 , a manufacturing tank 4th , a laser scanning system 6th and a carrier plate 8th having.

The manufacturing table 2 carries the carrier plate 8th and can through a movement system 10 , are moved perpendicular to the plane of the production table.

The carrier plate 8th is located in the manufacturing container 4th and is suitable to metal powder 12 to wear.

The carrier plate 8th is also suitable for a body made from the metal powder 14th to wear. The laser scanning system 6th is located opposite the production tank 4th and emits laser beams 16 .

The laser beams 16 are suitable around the metal powder 12 to melt selectively in order to create layers of the body 14th to manufacture.

The carrier plate 8th includes a base portion 18th , a first stage of cooperation 20th and a second cooperation section 22nd . The base section 18th lies between the first stage of cooperation 20th and the second cooperation section 22nd .

The carrier plate 8th is to the dimensions of the manufacturing container 4th adapted so that the carrier plate can be moved with play in the production container without metal powder between the carrier plate 8th and production container can escape. For example, if the manufacturing container has dimensions of 350 mm x 350 mm x 350 mm, the carrier plate can 8th Have dimensions of 349 mm x 349 mm x 30 mm.

The carrier plate 8th forms a floor area 24 in the production tank 4th . The carrier plate 8th is plate-shaped and is, for example, a cuboid. The carrier plate 8th includes a first open space 26th and a second open space 28 . The first open space 26th and the second open space 28 are main surfaces of the carrier plate 8th , ie the largest areas of the carrier plate. The first open space 26th forms the floor area 24 in the production tank 4th . The second open space 28 is located on one side of the carrier plate 8th opposite the first open space 26th . The second open space 28 lies on the production table 2 on. The secondary surfaces 30th , ie the smaller areas, of the carrier plate 8th cooperate with the manufacturing tank 4th .

The base section 18th lies between the first open space 26th and the second open space 28 .

The base section 18th essentially forms the secondary surfaces 30th the carrier plate 8th .

The base section 18th is plate-shaped and is, for example, a cuboid.

The base section 18th comprises a first melting surface 32 and a second melting surface 34 . The first melting surface 32 and the second melting surface 34 are the major surfaces, ie the largest surfaces, of the base section 18th . The distance between the first melt surface 32 and the second free melt surface 34 defines the thickness D of the base portion 18th . The distance between the first melt surface 32 and the second free melt surface 34 is for example between 28 mm and 24 mm. The distance between the first melt surface 32 and the second free melt surface 34 is for example 26mm.

The base section 18th is made of a material that is less noble than the material of the first cooperation section 20th and the second cooperation section 22nd .

From the perspective of the present invention, a more noble material is generally more expensive than a less noble material. For the purposes of the present invention, the ranking of the metals from noble metals to less noble metals is listed in Table 1 below. Table 1 Gold (Au) Platinum (Pt) Silver (Ag) Chromium (Cr) Nickel (Ni) Titanium (Ti) Palladium (Pd) Copper (Cu) Tin (Sn) Tungsten (W) Lead (Pb) Tin (Sn) Molybdenum (Mo) Cobalt (Co) Thallium (Tl) Indium (In) Cadmium (Cd) Aluminum (Al) Iron (Fe) Zinc (Zn) Boron (B) Niobium (Nb) Vanadium (V) Manganese (Mn) Beryllium (Be) Magnesium (Mg) Cerium (Ce) Lanthanum (La) Sodium (Na) Barium (Ba) Lithium (Li)

The base section 18th consists for example of cast iron or structural steel. In particular, the material of the base portion is one of the materials described in Table 2 below. Table 2 Steels with a specified minimum yield strength ReH ≤ 460 N / mm2 and an analysis in%: C ≤ 0.25; Si ≤ 0.60; Mn ≤ 1.8; Mo ≤ 0.70; S ≤ 0.045; P ≤ 0.045; Cu ≤ 0.40; Ni ≤ 0.5; Cr ≤ 0.3 (0.4 for cast materials); Nb ≤ 0.06; V ≤ 0.1; Ti ≤ 0.05 Steels as above but with 0.25% <C ≤ 0.85% Low vanadium alloyed Cr-Mo (Ni) steels with Mo ≤ 0.7% and V ≤ 0.1% Steels with Cr ≤ 0.3% and Ni ≤ 0.7% Steels with Cr ≤ 0.7% and Ni ≤ 1.5% Vanadium-free Cr-Mo steels with C ≤ 0.35% Steels with 0.75% ≤ Cr ≤ 1.5% and Mo ≤ 0.7% Steels with 1.5% <Cr ≤ 3.5% and 0.7% <Mo ≤ 1.2% Steels with 3.5% <Cr ≤ 7.0% and 0.4% <Mo ≤ 0.7% Steels with 7.0% <Cr ≤ 10.0% and 0.7% <Mo ≤ 1.2% Highly vanadium alloyed Cr-Mo (Ni) steels Steels with 0.3% ≤ Cr ≤ 0.75%, Mo ≤ 0.7% and V ≤ 0.35% Steels with 0.75% <Cr ≤ 3.5%, 0.7% <Mo ≤ 1.2% and V ≤ 0.35% Steels with 3.5% <Cr ≤ 7.0%, Mo ≤ 0.7% and 0.45% ≤ V ≤ 0.55% Steels with 7.0% <Cr ≤ 12.5%, 0.7% <Mo ≤ 1.2% and V ≤ 0.35% Ferritic, martensitic or precipitation hardening stainless steels with C ≤ 0.35% and 10.5% ≤ Cr ≤ 30% Austenitic stainless steels with Cr ≤ 19% and Ni ≤ 31% Austenitic stainless steels with Cr> 19% and Ni ≤ 31% Manganese-containing 31% austenitic stainless steels with 4% <Mn ≤ 12% and Ni ≤ Nickel alloy steels with Ni ≤ 10.0% Austenitic ferritic stainless steels (duplex) with Cr ≤ 24% Austenitic ferritic stainless steels (duplex) with Cr> 24%

The first stage of cooperation 20th lies between the first enamel surface 32 and the first open space 26th . The first stage of cooperation 20th forms part of the secondary surface 30th . The first stage of cooperation 20th extends over the first enamel surface 32 and forms the first open space 26th the carrier plate 8th .

The distance A1 between the first enamel surface 32 and the first open space 26th defines the thickness of the first cooperation section 20th . The distance A1 between the first enamel surface 32 and the first open space 26th is for example between 1mm and 3mm. The distance A1 between the first enamel surface 32 and the first open space 26th is for example 2 mm.

The first stage of cooperation 20th is made of a more noble material than the material of the base section 18th , ie the first stage of cooperation 20th consists of a more noble material than the base section 18th .

The first stage of cooperation 20th consists of a material that can be fused with the material used in the additive manufacturing process. In particular, is the material of the first cooperation section 20th with the metal powder 12 fusible. The material of the first part of the cooperation 20th is for example with the metal powder 12 through the laser beams 16 of the laser scanning system 6th fusible.

The first stage of cooperation 20th , especially near the first open space 26th , is made of copper and / or titanium, for example. In particular, the material of the first cooperation section 20th be one of the materials described in Table 3 below. Table 3 Copper with up to 6% Ag and 3% Fe Copper-zinc alloys as two-component alloys or as multi-component alloys Copper-tin alloys Copper-nickel alloys Copper-aluminum alloys Copper-nickel-zinc alloys Copper alloys with greater than / equal to 95% copper Copper alloys with less than 95% copper Pure titanium Titanium with O ₂ <0.20% Titanium with 0.20% <O ₂ ≤ 0.40% So-called alpha alloys: Ti-0.2Pd; Ti-2.5Cu; Ti-5Al-2.5Sn; Ti-8AI-1Mo-1V; Ti-6Al-2Sn-4Zr-2Mo; Ti-6Al-2Nb-1Ta-0.8Mo. So-called alpha-beta alloys: Ti-3AI-2.5V; Ti-6AI-4V; Ti-6AI-6V-2Sn; Ti-7Al-4Mo. Alloys that are similar to the so-called alpha-beta alloys: Ti-10V-2Fe-3AI; Ti-13V-11Cr-3AI; Ti-11.5Mo-6Zr-4.5Sn; Ti-3AI-8V-6Cr-4Zr-4Mo.

The material of the first part of the cooperation 20th can also be a different material that is more noble than the material of the base section 18th is.

The first stage of cooperation 20th carries the manufactured body 14th . The manufactured body 14th is at the first stage of cooperation 20th melted.

The second stage of cooperation 22nd is located on a side of the carrier plate opposite that of the first cooperation section 20th . The second stage of cooperation 22nd lies between the second melting surface 34 and the second open space 28 . The second stage of cooperation 22nd forms part of the secondary surface 30th . The second stage of cooperation 22nd extends over the second enamel surface 34 and forms the second open space 28 the carrier plate 8th .

The distance A2 between the second melt surface 34 and the second open space 28 defines the thickness of the second cooperation section 22nd . The distance A2 between the second melt surface 34 and the second open space 28 is for example between 1mm and 3mm. The distance between the second melt surface 34 and the second open space 28 is for example 2 mm.

The second stage of cooperation 22nd is made of a more noble material than the material of the base section 18th , ie the second part of cooperation 22nd consists of a more noble material than the base section 18th .

The second stage of cooperation 22nd consists of a material that can be fused with the material used in the additive manufacturing process.

In particular, is the material of the second cooperation section 22nd with the metal powder 12 fusible. The material of the second section of cooperation 22nd is for example with the metal powder 12 through the laser beams 16 of the laser scanning system 6th fusible.

The second stage of cooperation 22nd , especially near the second open space 28 , is made of copper and / or titanium, for example. In particular, the material of the second cooperation section 22nd be one of the materials described in Table 3.

The material of the second section of cooperation 22nd can also be a different material that is more noble than the material of the base section 18th is.

The second stage of cooperation 22nd lies on the production table 2 on, and is suitable around the finished body 14th to wear.

The carrier plate described 8th allows the manufacturing cost of the body 14th kept relatively low by means of selective laser melting without negatively affecting the melt compatibility between metal powder and carrier plate. The carrier plate 8th also has a satisfactory structural stability and sufficient thermal conductivity to keep the distortion of the body low during manufacture.

The following is an advantageous manufacturing method for manufacturing the carrier plate 8th described.

First up is the base section 18th provided. A friction welding device is provided, in particular a friction stir application device.

A friction welding spindle is installed on the friction welding device. The friction welding spindle consists of the material from which the first and second cooperation sections are made 20th , 22nd consist of the material that can be fused with the material used in the additive manufacturing process. The material of which the friction welding spindle is made is also compatible to be fused with the material of the base section. Examples of possible combinations of base section material and friction welding spindle material are listed in Table 4. Table 4 Friction welding spindle material Base section material Stainless steel (X25CrNi18-10) Structural steel (S235JR) or ferrous materials according to table 2 Nickel or nickel alloys, (e.g. Inconel718) Ferrous materials according to Table 2 Maraging steels (e.g. 18Ni300), Ferrous materials according to Table 2 Cold work steel Structural steel (S235JR) or ferrous materials according to table 2 Metal with silicon carbide Structural steel (S235JR) or ferrous materials according to table 2 Metals in general Chromium cobalt hard alloy Structural steel (S235JR) or ferrous materials according to table 2 Brass and bronze Structural steel (S235JR) or ferrous materials according to table 2 Pure titanium Structural steel (S235JR) or ferrous materials according to table 2 Pure silver Electro copper Pure tin Electro copper Silver alloys Copper or copper alloys according to Table 3 Ferrous materials according to Table 2 Titanium or titanium alloys according to Table 3 Ferrous materials according to Table 2

The base section 18th is installed on a melting table of the friction welding device.

The friction welding spindle is then on the first melting surface 32 melted and the first melting surface 32 covered with the friction welding spindle material to the first cooperation section 20th to build.

The base section 18th and the first part of cooperation 20th from the solidified friction welding spindle material are then turned over so that the friction welding spindle is on one side of the base section 18th compared to the first phase of cooperation 20th is located.

This is then applied to the first enamel surface 32 melted to the first cooperation section 20th to build. The friction welding spindle is then on the second melting surface 34 melted, and the second melt surface 34 covered with the friction welding spindle material around the second cooperation section 22nd to build.

Such a manufacturing process allows a carrier plate, for example 8th manufacture, the base section 18th between the first stage of cooperation 20th and the second cooperation section 22nd lies, the material of the first cooperation section 20th is fusible with the material used in the additive manufacturing process and the material of the base portion 18th less noble than the material of the first part of the cooperation 20th is. Such a carrier plate 8th allows high quality selective laser melting at low cost.

Alternatively, the carrier plate 8th only a single section of cooperation 20th on, the base section 18th no cooperation section on the second page 22nd and the second melting surface 34 forms a free surface that rests on the production table.

Claims (10)

Carrier plate (8) for additive manufacturing, which is suitable to carry at least one additively manufactured body (14), wherein the carrier plate (8) comprises a first cooperation section (20) and a base section (18), the first cooperation section (20) being a forms the first free surface (26) of the carrier plate (8), the first free surface (26) being suitable for supporting the additively manufactured body (14), characterized in that: - the material of the first cooperation section (20) with the material, that is used in the additive manufacturing process is fusible; and - the material of the base section (18) is less noble than the material of the first cooperation section (20). Carrier plate for additive manufacturing Claim 1 , comprising a second cooperation section (22) which forms a second free surface (28) of the carrier plate (8), the second cooperation section (22) being on a side of the carrier plate (8) opposite that of the first cooperation section (20), and wherein the material of the base section (18) is less noble than the material of the second cooperation section (22). Carrier plate for additive manufacturing Claim 1 or 2 , wherein the material of the first cooperation section (20), and optionally of the second cooperation section (22), comprises copper and / or titanium. Carrier plate for additive manufacturing Claim 3 , wherein the material of the first cooperation section (20), and optionally the second cooperation section (22), is a copper or titanium alloy, copper or titanium being the main component of the material of the first cooperation section (20), and optionally of the second cooperation section (22), make up. Carrier plate for additive manufacturing according to one of the Claims 1 to 4th , the thickness (A1, A2) of the first cooperation section (20), and optionally of the second cooperation section (22), being between 1 mm and 3 mm. Carrier plate for additive manufacturing according to one of the Claims 1 to 5 wherein the base portion (18) is made of structural steel or cast iron. Carrier plate for additive manufacturing according to one of the Claims 1 to 6th , wherein the material of the first cooperation section (20), and optionally of the second cooperation section (22), can be fused with the material that is used in the additive manufacturing process. Manufacturing method of a carrier plate according to one of the Claims 1 to 7th comprising the following steps: - providing the base section (18); - providing a friction welding device, in particular a friction stir application device; - providing a friction welding spindle comprising the material which is fusible with the material which is used in the additive manufacturing process; and - friction welding the spindle on a first melting surface (32) of the base section (18), whereby the first cooperation section (20) is formed from the spindle material. Procedure according to Claim 8 comprising friction welding the spindle on a second melt surface (34) which is on a side of the base section (18) opposite that of the first cooperation section (20), whereby the second cooperation section (22) is formed from the spindle material. Apparatus for selective laser melting, comprising: - a manufacturing table (2); - A production container (4) in which the production table (2) is arranged; - a laser scanning system (6); and - a carrier plate (8), wherein the carrier plate (8) is a carrier plate according to one of the Claims 1 to 7th is; wherein the carrier plate (8) is adapted to the dimensions of the production container (4) and is designed to be carried by the production table (2) in such a way that one of the cooperation sections (20, 22) faces the laser scanning system.

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