DE102019114148B4 - Method for producing a planar electronic arrangement, electronic arrangement and aircraft with a planar electronic arrangement - Google Patents

Abstract

Method for producing a planar electronic arrangement, comprising the steps:
Providing a carrier strip (10) whose longitudinal direction L extends in a first direction X;
Equipping the carrier strip (10) with electrical components (11);
Folding the carrier strip (10) along fold lines (12a, 12b),
characterized in that
the folding lines (12a, 12b) are arranged in one or more folding areas (13) of the carrier strip (10) such that by folding the carrier strip (10) along the folding lines (12a, 12b), sections (14a, 14b, 14c) of the carrier strip (10) originally arranged one after the other are positioned next to one another in a second direction Y which is perpendicular to the first direction X,

Description

The invention relates to a method for producing a planar electronic arrangement. The invention also relates to an electronic arrangement which is designed to be planar, and to an aircraft with such an electronic arrangement.

In various areas of technology, it is necessary for a large number of electrical and electronic components to be arranged in a flat design on a support structure. The electrical or electronic components form one or more electronic units. It is often necessary to design the support structure with the electronic unit or the entire electronic arrangement over a very large area.

The electrical components or devices mounted on the carrier structure may be, for example, antennas, antenna units, chips with electronic or microelectronic circuits, sensors, electrical connections, conductor structures, etc., as well as other electrical or electronic components

When manufacturing flexible circuit boards and printed circuits, such electronic units are often printed on a film. For example, the R2R or roll-to-roll process is used. In this technology, the film serves as a substrate for the electrical and electronic components that are arranged on or in the film, for example by printing on the film and/or embedding it in the film. An electrical connection between the components can also be included on or in the film, so that, for example, no cables are required.

The film can be very long, ranging from a few meters to a kilometer or more. The width of the film, on the other hand, is very limited, as only a small film width can be handled during production, which is a maximum of around 30cm to 60cm. The film is unrolled from a roll, for example.

Such a film can be placed on a structure. However, for certain applications, the width of the film may be required to be greater than the width of the film strip provided for further processing. For example, the maximum width of the film provided may be 30 cm, while for a certain application a width of 90 cm is required.

A known solution to this problem is to produce a long sheet of film with a number of different segments and then cut the sheet into corresponding strips. The individual sheet strips are then arranged side by side strip-to-strip on a structure to achieve a larger area with a larger width.

The 2a and 2 B show this well-known procedure. In 2a a relatively long and narrow film 60 is shown, which is available for the further process. The film 60 is divided into different segments 60a, 60b, 60c.

The 2 B shows the film 60 after it has been cut. The individual separated segments 60a, 60b, 60c are now arranged next to each other on a structure 65.

In many cases it is necessary to establish electrical connections between the individual strips or segments 60a, 60b, 60c, which is done, for example, by arranging additional bridging foils. However, this has the disadvantage that such an arrangement is very complex and difficult to produce. Other disadvantages can also arise, for example if high-frequency signals are to be transmitted.

In addition to the well-known roll-to-roll or R2R process, another technology is known in which films are processed on the basis of a film sheet. Such film sheets can have a size of, for example, approx. 40 cm x 40 cm. However, certain applications require a longer film strip. In this case, the film sheet is cut and folded into a long strip.

The 3a , 3b and 3c show this further known procedure. 3a shows a rectangular foil 70, which is made available for further processing.

3b shows the film 70 after cuts 71 have been made in the film 70 on two opposite sides. This creates adjacent strip elements 72a, 72b on both sides of each cut 71, which can be folded in opposite directions.

3c shows a section of the film 70 in the cut and folded state. By folding at the end of each cut 71, the strip elements 72a, 72b are lined up lengthwise.

The publication EN 10 2015 113 928 A1 shows an object having an electronic unit and conductor structures on a carrier structure. The carrier structure has a carrier layer which is a plastic film.

EN 10 2016 209 495 A1 describes an electrical arrangement with a carrier for electrical components and a method for producing the same. A strip-shaped carrier is provided with a gap along its length so that a section of the strip-shaped carrier is located on both sides of the gap. The sections are then folded so that they extend in opposite directions or form an angle to one another.

WO 2006 / 077 164 A2 describes a method for producing a bendable circuit board structure from at least two circuit board sections, with the steps: a) producing a flat circuit board with at least one conductor wire embedded in the circuit board, which extends between two areas of the circuit board provided as connection points and is electrically connected to these, wherein the two areas provided as connection points are located on different circuit board sections; b) providing at least one area provided for bending between the circuit board sections, wherein the circuit board sections can be bent against each other while maintaining the connection of the areas provided as connection points by the conductor wire and by bending the conductor wire. To produce a spatial circuit board structure, for example in the form of a closed housing, various circuit board sections are bent at defined bending edges.

The document US 2009 / 0 059 586 A1 describes a light-emitting diode light source with mirrored surfaces formed on a planar substrate that, when folded, forms both a light return cavity and an optical taper at the end of the light return cavity.

The publication EN 10 2009 018 447 A1 discloses a circuit board with an insulating carrier layer and a layer of conductive material applied thereto. In order to increase the flexibility of the circuit board, material of the carrier layer is removed at at least one point on the circuit board on a side of the carrier layer opposite the layer of conductive material to form a straight groove which extends from one side of the board, so that the circuit board can be bent along the groove.

The patent US 6 350 969 B1 shows a self-regulating heater for heating a surface. Two or more heating modules can be connected along and between two bus conductors, each module having at least one electrode connected to a ceramic heating element, to create a heating strip assembly with a larger heat transfer area than a strip constructed from the heating elements without electrodes.

The invention has for its object to provide a planar electronic arrangement which can be designed in larger dimensions and allows electrical connections between its electrical and/or electronic components and can be produced in a simple and cost-effective manner.

To achieve this object, the invention provides a method for producing a planar electronic arrangement, comprising the steps of: providing a carrier strip whose longitudinal direction L extends in a first direction X; equipping the carrier strip with electrical components; and folding the carrier strip along fold lines which are arranged in one or more fold regions of the carrier strip such that by folding the carrier strip along the fold lines, sections of the carrier strip which were originally arranged one after the other are arranged next to one another in a second direction Y which runs perpendicular to the first direction X.

Preferably, the fold lines in the carrier strip are formed obliquely to its longitudinal direction L.

Advantageously, the folding area is arranged between two sections of the carrier strip in order to place the two sections next to each other by folding.

In particular, two fold lines can run essentially perpendicular to each other.

For example, two fold lines border each other at one end.

Advantageously, the carrier strip is folded in the Y direction by a first fold. Preferably, the carrier strip is folded back in the X direction by a second fold with an offset in the Y direction. For example, a reversal of direction takes place in the X direction, so that the sections of the carrier strip located on both sides of the folds are positioned next to one another.

Advantageously, the folded carrier strip has a larger dimension in the direction of the width of the unfolded carrier strip than the width of the carrier strip.

Preferably, the dimension of the folded carrier strip in the direction of the length of the unfolded carrier strip is determined by the choice of the distance between two folding areas.

In particular, by folding along a fold line, the fold area is folded together. For example, the folded carrier strip becomes multi-layered in the fold area.

Advantageously, an electrical connection element is arranged in the unfolded carrier strip such that it extends through or over the fold lines or at least one fold line in the longitudinal direction L or X direction of the unfolded carrier strip.

This allows the connecting element in the folded carrier strip to be electrically contacted at various points in the Y-direction.

According to one aspect of the invention, an electronic arrangement is provided which is designed to be flat, comprising: an elongated, folded carrier strip with electrical components, wherein the longitudinal direction of the carrier strip extends in a first direction X, and the carrier strip is folded at fold lines such that two or more sections of the carrier strip which were originally arranged one after the other are arranged next to one another in a second direction Y which runs perpendicular to the first direction X.

Advantageously, two adjacent sections of the carrier strip are connected by a folding region in which at least two layers of the carrier strip lie one above the other.

Preferably, the carrier strip is thinner in the folding region than one or more adjacent regions.

In particular, two adjacent sections of the carrier strip are aligned substantially parallel to each other.

For example, two adjacent sections of the carrier strip are arranged laterally adjacent to one another.

Depending on requirements, two adjacent sections of the carrier strip can also be arranged at a distance from each other.

For certain requirements, two adjacent sections of the carrier strip can also be arranged so as to overlap laterally.

Advantageously, an electrical connection element is provided which is formed in the carrier strip and extends continuously in its longitudinal direction L over and/or through one or more fold lines.

The electrical connection element in the folded carrier strip can be designed to be electrically contactable at different locations in the Y-direction.

Preferably, the carrier strip is flexible.

In particular, the carrier strip comprises a film or is designed as a film.

Advantageously, the carrier strip comprises one or more electrical components from the group consisting of antennas, antenna elements, electronic chips, electrical connecting lines, and metallization layers.

For example, the carrier strip can have a length between 10 cm and 2000 meters.

In particular, the electronic arrangement is designed as an antenna unit or it comprises an antenna unit.

Preferably, the electronic arrangement is positioned on an auxiliary carrier.

Advantageously, the electronic arrangement is designed for attachment to a structure which can in particular be part of an aircraft and/or its outer skin.

Preferably, the electronic arrangement is manufactured using a method according to the invention.

According to a further aspect of the invention, an aircraft is provided which has an electronic arrangement according to the invention.

• 1 eine schematische skizzenhafte Darstellung einer Elektronikanordnung gemäß einer bevorzugten Ausführungsform der Erfindung in einer schematischen Ansicht von oben;
• 2a und 2b die Herstellung eines bekannten Folienelements gemäß dem Stand der Technik, wobei 2a einen Folienstreifen und 2b den geschnittenen Folienstreifen jeweils in einer Ansicht von oben schematisch als eine Skizze darstellen;
• 3a, 3b und 3c die Herstellung eines weiteren bekannten Folienelement gemäß dem Stand der Technik, jeweils in einer schematischen skizzenartigen Ansicht von oben, wobei 3a ein Folienblatt als Ausgangsmaterial zeigt, 3b das geschnittene Folienblatt zeigt, und 3c einen Teilbereich des nach dem Schneiden gefalteten Folienblatts zeigt; und
• 4 ein Ausführungsbeispiel eines gemäß der Erfindung bearbeiteten Trägerstreifens vor dem Falten in einer schematischen Skizze als Ansicht von oben.

In the following, embodiments are explained in more detail using the attached drawings. They show:

• 1 a schematic sketchy representation of an electronic arrangement according to a preferred embodiment of the invention in a schematic view from above;
• 2a and 2 B the production of a known film element according to the prior art, wherein 2a a foil strip and 2 B show the cut film strip schematically as a sketch in a view from above;
• 3a , 3b and 3c the production of another known film element according to the State of the art, each in a schematic sketch-like view from above, where 3a shows a sheet of foil as source material, 3b showing the cut foil sheet, and 3c shows a portion of the foil sheet folded after cutting; and
• 4 an embodiment of a carrier strip processed according to the invention before folding in a schematic sketch as a view from above.

1 shows an electronic arrangement 20 according to a preferred embodiment of the invention. The electronic arrangement 20 is formed from a film and comprises electrical components 11 which form an electronic unit.

The electronic arrangement 20 is formed by an elongated, relatively narrow carrier strip 10f, which holds the electrical components 11 as a substrate in the form of a film or plastic film and is folded along fold lines 12a, 12b. The longitudinal direction L of the carrier strip 10f extends in the X direction.

By folding the carrier strip 10f along the fold lines 12a, 12b, sections 14a, 14b, 14c of the carrier strip 10f that were originally arranged one after the other are arranged next to one another in the electronic arrangement 20. The arrangement of the adjacent sections 14a, 14b, 14c of the carrier strip 10f extends in the Y direction, i.e. perpendicular to the longitudinal direction L of the carrier strip 10f or in the direction of the width B of the carrier strip 10f.

The electronic arrangement 20 is flat. It extends in the X-Y plane. It therefore forms a circuit board that is flat. Since it is flexible, it can be curved depending on the application or applied to a curved or uneven structure.

Folding areas 13 are formed on the carrier strip 10f, in which two layers of the carrier strip 10f lie one above the other. The folding areas 13 are located on opposite sides of the electronic arrangement 20, in the figure at the top and bottom, and each connect two of the adjacent sections 14a, 14b, 14c of the carrier strip 10f. In the folding areas 13, the carrier strip 10f or the film from which the carrier strip 10f is formed is thinner than in the other areas or in the adjacent sections 14a, 14b, 14c of the carrier strip 10f.

In the film or electronic arrangement 20, which forms a circuit board, two adjacent sections 14a, 14b or 14b, 14c of the carrier strip 10f are aligned parallel to one another. The sections 14a, 14b, 14c of the carrier strip 10f are adjacent to one another with their lateral edges or longitudinal edges. The sections 14a, 14b, 14c can thus be positively adjacent to one another, so that they form a continuous or uninterrupted surface.

For better illustration, possible distances or inaccuracies between the sections 14a, 14b, 14c are shown enlarged in the figure. The figure is a schematic, sketchy representation that shows in principle the essentially parallel course of the sections 14a, 14b, 14c and their side edges as well as the shape of the electronic arrangement and its parts as described here and should also be understood as such.

Depending on the application, the carrier strip 10f can also be folded in such a way that the individual sections 14a, 14b, 14c are arranged laterally spaced apart from one another. It is also possible for the adjacent sections 14a, 14b, 14c to be arranged laterally overlapping or partially overlapping.

The hatched areas in the figure show the course of an underlying portion of the carrier strip 10f, which is covered by the fold at the fold line 12b.

The folding directions F1 and F2 on the folding lines 12a and 12b are indicated in the figure by curved arrows. The first folding line 12a runs obliquely at an angle α of 45° to the longitudinal direction L of the carrier strip 10f. After the first folding in the folding direction F1, the underside of the carrier strip 10f is arranged on top in the folding area 13.

The second fold line 12b also runs obliquely at an angle of 45° to the longitudinal direction L of the carrier strip 10f. Due to the second folding of the carrier strip in the folding direction F2, the upper side of the carrier strip 10f, marked with numbers 1 to 6, is again arranged on top in the folding area 13. In this way, all adjacent sections 14a, 14b, 14c are arranged such that the same side of the carrier strip 10f is on top in all sections.

Each fold F1, F2 is made at 180 degrees, i.e. the carrier strip is folded along the fold lines 12a, 12b in the directions F1, F2.

The individual sections 14a, 14b, 14c of the carrier strip 10f are arranged with a lateral offset V to each other, which corresponds to the width B of the carrier strip 10f. The sections 14a, 14b, 14c are adjacent to each other.

The fold lines 12a, 12b adjoin each other at one of their two ends and form an angle β of 90° to each other.

The longitudinal direction L of the carrier strip 10f runs in opposite directions in the adjacent sections 14a, 14b and 14b, 14c. As a result, the areas 1-2, 4-3, 5-6 arranged one after the other in the longitudinal direction L of the carrier strip 10f are arranged next to one another by folding. The identification of the successive areas of the carrier element by numbers is selected such that after folding, the odd-numbered areas 1, 3, 5 and the even-numbered areas 2, 4, 6 are next to one another in the Y direction.

The electronic arrangement 20 formed from the folded carrier strip 10f can extend in any direction in the Y direction depending on the number of folding areas 13 by placing any number of sections 14a, 14b, 14c of the carrier strip 10f next to one another. This means that the dimension of the electronic arrangement 20 in the direction of the width B of the relatively narrow carrier strip 10f can be designed in any size. In other words, the originally relatively narrow electronic arrangement in the form of the originally unfolded carrier strip 10 is widened by folding along the fold lines 12a, 12b.

Furthermore, the dimensions of the electronic arrangement 20 in the X direction or in the longitudinal direction L of the original carrier strip can be designed as desired by selecting the length of the sections 14a, 14b, 14c. The electronic arrangement 20 can thus extend in very great length and width at the same time.

An electrical connection element 15 is arranged in the printed circuit board or electronic arrangement 20 designed as a film, which extends through and/or over the entire electronic arrangement 20 and can be electrically contacted at various points. The electrical connection element 15 connects the electrical components 11, which are distributed over the entire, large-area and flexible electronic arrangement 20.

This means that the connecting element 15 extends in the longitudinal direction L through the entire folded carrier strip 10f over and/or through its sections 14a, 14b, 14c and the fold lines 12a, 12b. It can be contacted at any point of the electronic arrangement 20 and electrically connect all electrical elements 11 in the adjacent sections 14a, 14b, 14c to one another.

The connecting element 15 is, for example, a conductor structure with one or more conductor tracks or metallizations.

The film or electronic arrangement 20 is arranged on a structure 31, which in this example is an auxiliary material that is also designed as a film.

The alignment of the electronic arrangement 20 or its sub-areas can be carried out during positioning on the structure 31 or the auxiliary material. This can result in advantages in terms of accuracy and manufacturing or installation costs. The auxiliary material 31 can be, for example, an adhesive layer or glue layer.

The electronics assembly arranged on the structure can be mounted on a surface.

The structure 31 can also be, for example, an outer surface or the outer skin of an aircraft. In this case, the alignment of the electronic arrangement 20 and/or its sub-areas or sections 14a, 14b, 14c takes place during attachment to the structure 31 or to the aircraft.

The electronic arrangement 20 with its electronic unit 11a, which is formed by the electrical elements 11, can be attached to the structure 31, for example by gluing.

Markings on the film or electronic assembly 20, which are not shown in the figure, allow the exact alignment of the electronic assembly 20 and/or its sections 14a, 14b, 14c when it is arranged on the structure 31.

The electrical elements or components 11 that are embedded in the electronic arrangement and/or arranged on the electronic arrangement 20 are, in the particularly preferred embodiment described here, antennas and antenna elements with different functions and designs. They are integrated in the electronic arrangement 20 and together form, for example, a single flat antenna or antenna unit. For example, 30 to 40 or more different antennas can be arranged on or in the electronic arrangement 20. The antenna or antenna arrangement formed by the electronic arrangement 20 can operate in different frequency ranges.

Furthermore, a very large number of electronic chips and other electronic components, which include, for example, antenna elements, are arranged as electrical components 11 on the large-area film or the electronic arrangement 20 and/or embedded in the film or electronic arrangement 20.

The electronic arrangement or film 20 is nevertheless very thin. In this embodiment, its thickness is only a few millimeters.

Depending on the embodiment, the thickness of the film or electronic arrangement 20 is preferably less than 20mm, particularly preferably less than 10mm, especially preferably less than 5mm and in certain cases a maximum of 2mm.

All components or electrical components 11 are electrically connected to one another by the electrical connecting element 15. For this purpose, various metallization layers are contained in the film or electronic arrangement 20 as connecting elements 15, which enable the mutual connection of the electrical components 11.

The electronic arrangement 20, which in this example forms an antenna device, has a diameter or a length or width in the range of, for example, one to three meters.

The following is based on the 1 and 4 An example of a method for manufacturing an electronic assembly 20 according to the invention is described.

First, a carrier strip 10 is provided which comprises the electrical components 11. The carrier strip 10 has a relatively large length and a relatively small width. It is flat, preferably as a film. Its longitudinal direction L extends in a first direction X (see 4 ).

The components 11 are designed as described above and are embedded in the carrier strip 10 and/or attached to the carrier strip 10. Furthermore, the connecting element 15 described above is arranged in and/or on the carrier strip in such a way that it extends through the carrier strip 10 in its longitudinal direction L,

A folding area 13 is arranged between each two sections 14a, 14b or 14b, 14c of the carrier strip 10. Each folding area 13 is in 4 represented by a hatched area.

The connecting element 15 runs through the sections 14a, 14b, 14c of the carrier strip 10 and through the folding areas 13 located therebetween.

As from 1 As can be seen, in a next step the ready carrier strip 10 is folded twice along the fold lines 12a, 12b. For this purpose the fold lines 12a, 12b are arranged in several fold areas 13 of the carrier strip 10 so that when folding several sections 14a, 14b, 14c of the carrier strip 10 are positioned next to each other in a second direction Y. The second direction or Y direction runs perpendicular to the first direction or X direction.

In order to arrange the sections 14a, 14b, 14c of the carrier strip 10 next to each other by folding them twice, the folding lines 12a, 12b are arranged or formed to run obliquely to the longitudinal direction L of the carrier strip 10. In order to arrange the various sections 14a, 14b, 14c parallel to each other, the two folding lines 12a, 12b run at an angle β of 90° to each other.

In order to place the sections 14a, 14b and 14b, 14c adjacent to each other in the longitudinal direction L on both sides of the folding area 13 adjacent to each other or edge-to-edge by folding them twice, the two folding lines 12a, 12b each adjoin one another at one end.

In other embodiments, depending on the intended application, it is also possible to arrange the fold lines 12a, 12b such that their two ends are spaced apart from one another. This results in a distance between the sections 14a, 14b or 14b, 14c when they are arranged next to one another by folding.

• Ausgehend von dem sich in einer Ebene in Längsrichtung L erstreckenden Trägerstreifen 10 erfolgt zunächst das erste Falten an der Faltlinie 12a. Dabei wird der an den Abschnitt 14a angrenzende Faltbereich 13 einmal in Richtung F1 gefaltet, sodass seine Unterseite oben liegt und der restliche Trägerstreifen sich in die y-Richtung erstreckt. Anschließend erfolgt das zweite Falten in Richtung F2 an der Faltlinie 12b, wobei der sich an die Faltlinie 12b anschließende Faltbereich 13 wieder in die X-Richtung, d.h. in die Längsrichtung L des ursprünglichen Trägerstreifens 10 erstreckt. Durch das Umklappen des Trägerstreifens 10 an beiden Faltabschnitten 12a, 12b ist die Oberseite des Trägerstreifens 10 in dem nächsten Abschnitt 12b wieder oben gelegen.

The double folding in the different folding areas 13 is carried out as follows:

• Starting from the carrier strip 10 extending in a plane in the longitudinal direction L, the first fold is made at the fold line 12a. The fold area 13 adjacent to the section 14a is folded once in the direction F1 so that its underside is at the top and the rest of the carrier strip extends in the y-direction. The second fold is then made in the direction F2 at the fold line 12b, with the fold area 13 adjoining the fold line 12b extending again in the X-direction, i.e. in the longitudinal direction L of the original carrier strip 10. By folding the carrier strip 10 over at both fold sections 12a, 12b, the top side of the carrier strip 10 is again at the top in the next section 12b.

Any number of further folds F1, F2 are carried out in a similar manner, so that a multitude number of adjacent sections 14a, 14b, 14c, etc., which form the electronic assembly 20 as described above (see 1 ).

According to the invention, a long film is manufactured or provided, which is then folded so that a greater width is achieved. The limitation of the width of carrier strips and in particular of films with electrical elements, which is for example in the range of 30 to 60 cm, is thereby overcome. The invention enables a large-area structure with a very large area covered with a large-area film, whereby electrical connections are made possible between all components or electrical and electronic components on and/or in the film.

The invention enables in particular very large and very thin antenna arrangements in which the various antenna elements are connected to one another with high-frequency connections and/or connections with high data rates. As described above, the flat and flexible electronic or antenna arrangement 20 can be positively attached to curved surfaces. This creates a structure-integrated or structure-conforming antenna or antenna arrangement that is particularly suitable for attachment to aircraft.

The invention makes the production of flat electronic arrangements and their attachment to surfaces of structures, such as in particular on the outer skin of an aircraft, easier and more cost-effective, since subsequently no connections have to be made between the electrical elements in different areas of the film and different areas of the film no longer have to be bridged.

List of reference symbols:

10

Carrier strip

10f

folded carrier strip

11

electrical components

12a, 12b

Fold lines

13

Folding area

14a, 14b, 14c

Sections of the support element

15

Electrical connecting element

20

Electronic arrangement

60

foil

60a, 60b, 60c

Foil segments

65

structure

70

foil

71

Incisions

72a, 72b

Strip elements

B

Width of the film strip

F1 and F2

Folding directions

L

Longitudinal direction of the film strip

V

Offset

X

Direction parallel to the longitudinal direction

Y

Direction perpendicular to the X direction

Claims (15)

Method for producing a planar electronic arrangement, comprising the steps of: providing a carrier strip (10) whose longitudinal direction L extends in a first direction X; equipping the carrier strip (10) with electrical components (11); folding the carrier strip (10) along fold lines (12a, 12b), characterized in that the fold lines (12a, 12b) are arranged in one or more fold areas (13) of the carrier strip (10) such that by folding the carrier strip (10) at the fold lines (12a, 12b), sections (14a, 14b, 14c) of the carrier strip (10) that were originally arranged one after the other are positioned next to one another in a second direction Y that runs perpendicular to the first direction X, Procedure according to Claim 1 , characterized in that 2.1. the folding lines (12a, 12b) in the carrier strip (10) are formed obliquely to its longitudinal direction L; and/or 2.2. the folding region (13) is arranged between two sections (14a, 14b; 14b, 14c) of the carrier strip (10) in order to place the two sections (14a, 14b; 14b, 14c) next to one another by folding; Procedure according to Claim 1 or 2 , characterized in that 3.1. two fold lines (12a, 12b) run essentially perpendicular to each other; and/or 3.2. two fold lines (12a, 12b) adjoin each other at one end. Method according to one of the preceding claims, characterized in that the carrier strip (10) is folded into the Y- direction, and is folded into the X direction by a second fold with an offset in the Y direction, wherein a reversal of direction takes place in the X direction, so that the sections (14a, 14b; 14b, 14c) of the carrier strip (10) located on both sides of the folds are positioned next to one another. Method according to one of the preceding claims, characterized in that 5.1. the folded carrier strip (10f) has a larger dimension in the direction of the width of the unfolded carrier strip (10) than the width of the carrier strip (10); and/or 5.2. the dimension of the folded carrier strip (10f) in the direction of the length of the unfolded carrier strip (10) is determined by the selection of the distance between two folding regions (13); and/or 5.3. by folding along a folding line, the folding region (13) is folded together so that the folded carrier strip (10f) becomes multi-layered in the folding region (13). Method according to one of the preceding claims, characterized in that an electrical connection element (15) is arranged in the unfolded carrier strip (10) such that it extends in its longitudinal direction L over and/or through one or more fold lines (12a, 12b). Electronic arrangement which is of flat design, comprising: an elongated folded carrier strip (10f), and electrical components (11) which are held by the carrier strip (10f), wherein the longitudinal direction L of the carrier strip (10f) extends in a first direction X, characterized in that the carrier strip (10f) is folded at fold lines (12a, 12b) such that two or more sections (14a, 14b, 14c) of the carrier strip (10f) which were originally arranged one after the other are arranged next to one another in a second direction Y which runs perpendicular to the first direction X. Electronic arrangement according to Claim 7 , characterized in that two adjacent sections (14a, 14b; 14b, 14c) of the carrier strip (10f) are connected by a folding region (13) in which at least two layers of the carrier strip (10f) lie one above the other. Electronic arrangement according to Claim 8 , characterized in that the carrier strip (10f) is thinner in the folding region (13) than adjacent regions of the carrier strip (10f). Electronic arrangement according to one of the Claims 7 until 9 , characterized in that two adjacent sections (14a, 14b; 14b, 14c) of the carrier strip (10f) are aligned substantially parallel to one another. Electronic arrangement according to one of the Claims 7 until 10 , characterized in that two adjacent sections (14a, 14b; 14b, 14c) of the carrier strip (10f) are arranged laterally adjacent to one another. Electronic arrangement according to one of the Claims 7 until 11 , characterized by an electrical connection element (15) which is formed in the carrier strip (10f) and extends in its longitudinal direction L continuously through and/or over one or more fold lines (12a, 12b). Electronic arrangement according to one of the Claims 7 until 12 , characterized in that the carrier strip (10f) comprises a film or is designed as a film. Electronic arrangement according to one of the Claims 7 until 13 , characterized in that it comprises an antenna unit and/or is designed as an antenna unit. Aircraft, characterized by an electronic arrangement according to one of the Claims 7 until 14 .

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