DE102018222746A1 - Semiflex PCB arrangement for a mechatronic system - Google Patents

Abstract

The invention relates to a 3D semiflex PCB arrangement (1) for a mechatronic system (8), in particular a drive with an electric motor (9) and control electronics directly mechanically coupled thereto, comprising: - a semiflex PCB (2) with electronic ones Control component which has two rigid PCB sections (3, 4) which extend essentially parallel to one another and at least one semi-flexible PCB section (5, 6) connecting them, which is separated by two successive semiflex bends by approximately 90 ° (5b, 5c; 6b, 6c) and a flat connecting section (5a, 6a) which is located between these 90 ° semiflex bends (5b, 5c; 6b, 6c) and is essentially perpendicular to both rigid PCB sections (3, 4) ; and - a spacer (7) arranged between the two rigid PCB sections (3, 4), which has a plurality of flat support surfaces (7a) for mechanical fixing thereof at a predetermined distance from one another, each of which has corresponding flat contact surfaces (3a, 4a ) of the two rigid PCB sections (3, 4) and on the flat connecting section (5a, 6a) of the at least one semi-flexible PCB section (5, 6).

Description

Technical field

The invention relates to a Semiflex printed circuit board arrangement (in short: Semiflex PCB arrangement) for a mechatronic system, in particular a drive with an electric motor and associated control electronics directly mechanically coupled thereto. The invention is also directed to a corresponding mechatronic system and methods for its production and operation.

State of the art

Semiflexible printed circuit boards (in short: Semiflex-PCB; semiflexible printed circuit board) are an alternative to rigid-flexible printed circuit boards, which in addition to rigid PCB sections made of fiber-reinforced plastic, flexible sections e.g. B. from polyimide films, known if the circuit board needs to be bent only once at certain points during assembly. For this purpose, a layer stack of a printed circuit board, typically made up of several layers of fiber-reinforced plastic, is tapered to a few layers by milling or by pre-punched layers with recessed sections during their manufacture. The section so tapered can then be bent a few times (semi-flexible PCB section).

The Semiflex technology is used by several manufacturers on the market, mostly for PCB arrangements bent by 90 °. However, there is a need for further miniaturization, in particular of highly integrated mechatronic systems, which are intended to combine mechanical subsystems such as electric motors with their control electronics in a highly precise and at the same time robust construction.

Disclosure of the invention

According to the invention, a 3D Semiflex PCB arrangement for a mechatronic system according to claim 1 and a corresponding mechatronic system and associated manufacturing and operating methods are provided according to the independent claims. Further embodiments are specified in the dependent claims. All further features and effects mentioned in the claims and the description for the 3D Semiflex PCB arrangement also apply in relation to the mechatronic system and the methods, and vice versa.

• - eine Semiflex-PCB (kurz für: semiflexible printed circuit board; semiflexible Leiterplatte) mit elektronischen Steuerungskomponenten, die zwei sich übereinander im Wesentlichen parallel zueinander erstreckende starre PCB-Abschnitte und mindestens einen diese mechanisch und elektrisch verbindenden semiflexiblen PCB-Abschnitt aufweist, der durch zwei aufeinanderfolgende Semiflex-Biegungen um etwa 90° sowie einen dazwischen liegenden ebenen, zu beiden starren PCB-Abschnitten im Wesentlichen senkrechten Verbindungsabschnitt gebildet ist; sowie
• - einen zwischen den zwei starren PCB-Abschnitten angeordneten Abstandshalter, der zur mechanischer Fixierung der zwei starren PCB-Abschnitte in einem vorbestimmten Abstand zueinander mehrere ebene Abstützflächen aufweist, welche jeweils an hierzu korrespondierenden ebenen Anlageflächen der zwei starren PCB-Abschnitte und am ebenen Verbindungsabschnitt des mindestens einen semiflexiblen PCB-Abschnitts anliegen.

According to a first aspect, a 3D semiflex PCB arrangement is provided for a mechatronic system, in particular a drive with an electric motor and associated control electronics directly mechanically coupled thereto, the 3D semiflex PCB arrangement comprising:

• - A semiflex PCB (short for: semiflexible printed circuit board; semiflexible printed circuit board) with electronic control components, which has two rigid PCB sections which extend essentially parallel to one another and at least one semiflexible PCB section which mechanically and electrically connects them and which has two consecutive semiflex bends of approximately 90 ° as well as an intermediate planar connecting section which is essentially perpendicular to both rigid PCB sections is formed; such as
• - A spacer arranged between the two rigid PCB sections, which has a plurality of flat supporting surfaces for mechanically fixing the two rigid PCB sections at a predetermined distance from one another, each of which on corresponding flat contact surfaces of the two rigid PCB sections and on the flat connecting section of the at least one semi-flexible PCB section.

The semi-flexible PCB section is bent by a total of 180 ° by two successive 90 ° Semiflex bends, which ensures the space-saving parallel arrangement of the two rigid PCB sections one above the other. Its planar connecting section, which is arranged between the successive 90 ° semiflex bends and is essentially perpendicular to both rigid PCB sections, makes it possible, for example, to reliably prevent undesired kinking of the semi-flexible PCB section during the bending process and / or to ensure a high degree of mutual alignment and to achieve and control positioning of the two rigid PCB sections and the semi-flexible PCB section in the manufacture of the 3D semiflex PCB assembly. In particular, z. B. the local stress on the base material and the conductor tracks in the semi-flexible PCB section in the area of the 90 ° semiflex bends can be minimized and homogenized, which increases the robustness and performance of the entire Semiflex PCB. (In this context, “essentially” means in particular a manufacturing or construction-related possible deviation of up to about 10% from the relevant dimensions or spatial directions.)

All of this is supported and facilitated by the spacer described, which not only in the finished 3D Semiflex PCB arrangement, but also in its manufacture as an assembly and positioning aid or tool and also not only in the operation of the mechatronic system, but also can also serve as mechanical stiffening or stabilization when transporting the finished 3D Semiflex PCB arrangement.

The described 180 ° bend of the semi-flexible PCB section enables a considerable miniaturization of the 3D semi-flexible PCB arrangement, i. H. of the electronic subsystem of the mechatronic system, for example in the applications in which the available space is limited in the lateral direction of the rigid PCB sections.

Furthermore, the 3D Semiflex PCB arrangement is fundamentally scalable as a result of its three-dimensional construction with simultaneous mechanical precision and stability due to the construction described here, which further expands the possible uses.

The spacer may be made of any material suitable for the functionality set forth herein, such as. B. made of plastic and / or metal, and in particular, but not necessarily monolithic. The specific choice of material can depend heavily on the dimensions and / or application-specific requirements of the mechatronic system. In principle, the spacer should be electrically insulating, at least in its support surfaces which bear against the printed circuit board. Furthermore, depending on the vibration requirements with regard to the direct mechanical coupling to a mechanical subsystem, such as an electric motor, natural resonances of the mechanical vibrations of the spacer can be avoided, which can be achieved, for example, by materials with a suitable modulus of elasticity. Depending on the operating temperatures in the mechatronic system, temperature resistance and maintenance of the required mechanical properties at these temperatures may also be required for the material of the spacer. Suitable materials and material combinations are known per se to the person skilled in the art.

In a specific embodiment, the flat connecting section of the at least one semi-flexible PCB section is formed as a reinforcement area by a thickness that is increased in steps, for example, in a step-wise manner relative to the adjacent areas of the at least one semi-flexible PCB section. In particular, such a reinforcement area can extend essentially centrally between the two 90 ° Semiflex bends. The reinforcement area can serve, among other things, as a positioning and fixing aid during the bending process. In particular, it can be designed in the form of a rectangular PCB laminate web.

In a specific embodiment, the spacer furthermore has fastening elements for a direct, in particular rigid, mechanical coupling of the 3D Semiflex PCB arrangement to a mechanical subsystem of the mechatronic system, in particular to an electric motor of a mechatronic system mentioned above as a drive. In particular, this enables precise and robust positioning and fixing of the control electronics to the mechanical subsystem, which in turn enables highly precise adjustments of the mechanical subsystem during operation of the mechatronic system.

In a specific embodiment, materials and / or dimensions and / or the relative arrangement of the Semiflex-PCB and the spacer to one another and / or the arrangement of electronic control components on the Semiflex-PCB are such that the 3D-Semiflex-PCB arrangement is also possible at high Operating temperatures from or (from room temperature) up to about 120 ° C, 130 ° C, 140 ° C, 150 ° C or 160 ° C, and in particular permanently, can be used without impairing functionality. As a result, the 3D Semiflex PCB arrangement can in particular also be used for mechatronic systems in a motor vehicle, such as, for. B. for engine coolers or other rotary machines or actuators in the engine compartment. In particular, this can be achieved by choosing a spacer material with a suitable temperature resistance and maintaining the required mechanical properties at these temperatures. Furthermore, less heat-emitting and / or less heat-sensitive electronic control components and / or also with a lower component density than the other, for example on that of the two rigid PCB sections which is coupled directly to the mechanical subsystem in the assembled state of the mechatronic system, Rigid PCB section facing away from the mechanical subsystem, for which, due to this positioning difference, more cooling possibilities can be realized by surrounding air or a cooler arranged close to it.

In a specific embodiment, materials and / or dimensions and / or the relative arrangement of the Semiflex-PCB and the spacer to one another and / or the arrangement of electronic control components on the Semiflex-PCB are such that the 3D-Semiflex-PCB arrangement is also possible at high Vibrations of or up to about 25 times, 30 times or 35 times the acceleration due to gravity (short: 25g, 30g, 35g), and in particular can be used permanently without impairing functionality. As a result, the 3D Semiflex PCB arrangement can in particular also be used for mechatronic systems in a motor vehicle, such as, for. B. for engine coolers or other rotary machines or actuators in the engine compartment. Such High vibrations can be caused, for example, by a firm (ie direct) mechanical connection (ie coupling) of the 3D Semiflex PCB arrangement to an electric motor due to its operating vibrations. In particular, the aforementioned vibration tolerance can be achieved by choosing a spacer material with suitable dimensions and a suitable modulus of elasticity, in which there are no inherent resonances of the mechanical vibrations of the spacer in the case of said vibrations.

According to one embodiment, the at least one semi-flexible PCB section comprises two semi-flexible PCB sections, each of which extends at a predetermined distance from one another from a lateral edge region of sides of the two rigid PCB sections connected to one another (cf. 1 , 2nd and 5 ). In other words, the two semi-flexible PCB sections extend between lateral edge regions of interconnected sides of the two rigid PCB sections at a predetermined distance from one another, which is measured along such a side. This arrangement of the semi-flexible PCB sections in each case in the outer edge region of the sides of the rigid PCB sections which are connected to one another, both in the manufacture of the 3D Semiflex PCB arrangement and in the later operation of the composite mechatronic system in comparison to areas located further inward is more easily accessible and visible, for example, precise positioning of the semi-flexible PCB sections during the bending process and their subsequent monitoring for correct position and condition can be supported and simplified. In addition, an approximately uniform division of conductor tracks of each rigid PCB section towards its two lateral edge regions is possible in particular.

In this embodiment, the two semi-flexible PCB sections e.g. B. in the form of relatively narrow semiflex strips with a scalable width depending on the application of, for example, less than a fifth, quarter or third of a total width of the relevant side of a rigid PCB section. In addition to the two mentioned, other semiflex strips of this type arranged in between can also be provided.

According to one embodiment, the spacer is designed as a support frame which has recesses and / or empty spaces between its several flat support surfaces, for example to save weight and material. To ensure the best possible support and mechanical robustness of the 3D Semiflex PCB arrangement, the flat support surfaces of the spacer and the corresponding flat contact surfaces extend at least one of the two rigid PCB sections along at least a fifth, a quarter, a third or a half of it Perimeters. In particular, at least one of the two rigid PCB sections can be of essentially rectangular design and its flat contact surfaces which bear against the associated support surfaces of the spacer extend along a large part of a respective total length of two, three or all four of its side edges.

According to a further aspect, a mechatronic system with a 3D Semiflex PCB arrangement of the type set out here is provided, which is designed in particular as a drive with a rotary electrical machine, on one end face of which the 3D Semiflex PCB arrangement with an associated one Control electronics is attached by means of the spacer. In particular, the mechatronic system can include at least one sensor for monitoring it and the Semiflex PCB can also have at least one electronic sensor module for controlling and / or reading out the at least one sensor.

For example, the 3D Semiflex PCB arrangement in the mechatronic system can represent its electronic subsystem for providing a required electrical voltage for its mechanical subsystem, such as an electromotive actuator or rotary machine, so that it can generate a requested torque. Due to the highly integrated design with a direct mechanical coupling of the 3D Semiflex PCB arrangement to the mechanical subsystem, highly precise adjustments of the mechanical subsystem, in particular highly dynamic and with high positioning accuracy, can be realized. In particular, it is therefore also ideal for applications in the automotive sector, such as. B. for various actuators and control systems, especially in the engine compartment, or a steering system or an engine cooling system in a motor vehicle.

• - Bereitstellen einer sich im Wesentlichen in einer Ebene erstreckenden Semiflex-PCB, die zwei starre PCB-Abschnitte und mindestens einen diese verbindenden, dazwischen liegenden semiflexiblen PCB-Abschnitt umfasst;
• - Bestücken der bereitgestellten Semiflex-PCB mit elektronischen Steuerungskomponenten für das mechatronische System;
• - Bereitstellen eines Abstandshalters, der mehrere nach außen weisende ebene Abstützflächen aufweist;
• - Biegen des mindestens einen semiflexiblen PCB-Abschnitts in seinen zwischen den zwei starren PCB-Abschnitten aufeinanderfolgenden Bereichen jeweils um etwa 90° mithilfe des Abstandshalters, indem jeweils zu den ebenen Abstützflächen des Abstandshalters korrespondierende ebene Anlageflächen der zwei starren PCB-Abschnitte und ein ebener Verbindungsabschnitt des semiflexiblen PCB-Abschnitts zum Anliegen an den zugehörigen Abstützflächen des Abstandshalters gebracht und dadurch relativ zu diesem positioniert und mechanisch stabilisiert werden; und
• - insbesondere ein dauerhaftes Befestigen der so um den Abstandshalter gebogenen Semiflex-PCB an dem Abstandshalter.

According to a further aspect, a method for producing a 3D Semiflex PCB arrangement of the type set out here for a mechatronic system, in particular of the type set out here, with the steps:

• Provision of a semiflex PCB which extends essentially in one plane and which comprises two rigid PCB sections and at least one intermediate semi-flexible PCB section connecting them;
• - equipping the provided Semiflex PCB with electronic control components for the mechatronic system;
• - Providing a spacer having a plurality of outward planar support surfaces;
• - Bending of the at least one semi-flexible PCB section in its areas that follow each other between the two rigid PCB sections by approximately 90 ° with the aid of the spacer, in each case by corresponding flat contact surfaces of the two rigid PCB sections corresponding to the flat supporting surfaces of the spacer and a flat connecting section the semi-flexible PCB section is brought to bear on the associated support surfaces of the spacer and thereby positioned relative to this and mechanically stabilized; and
• - In particular a permanent fastening of the semiflex PCB bent around the spacer to the spacer.

In particular, by placing a flat connecting section of a semi-flexible PCB section on an associated support surface of the spacer, it can be ensured that the semi-flexible PCB section in question does not slip during the bending process and in particular also when the Semiflex PCB is attached to the spacer, but always exactly that assumed intended position and orientation. As a result, the manufacturing process can be simplified, for example, the mechanical stress on the Semiflex PCB can be minimized and any damage can be reliably avoided.

• - Bereitstellen einer 3D-Semiflex-PCB-Anordnung der hierin dargelegten Art durch ein Verfahren der hierin dargelegten Art, wobei der Abstandshalter ferner Befestigungselemente zur Befestigung der 3D-Semiflex-PCB-Anordnung an der rotatorischen elektrischen Maschine aufweist, und
• - Befestigen der bereitgestellten 3D-Semiflex-PCB-Anordnung an einer vorbestimmten Position an einer Stirnseite der rotatorischen elektrischen Maschine mittels der Befestigungselemente des Abstandshalters, wodurch die 3D-Semiflex-PCB-Anordnung an diese Stirnseite direkt mechanisch angekoppelt wird.

According to a further aspect, a method for producing a mechatronic system of the type set out herein in the form of a drive with a rotary electrical machine is provided, with the steps:

• Providing a 3D Semiflex PCB assembly of the type set forth herein by a method of the type set forth herein, the spacer further comprising fasteners for attaching the 3D Semiflex PCB assembly to the rotary electrical machine, and
• - Fixing the provided 3D Semiflex PCB arrangement at a predetermined position on an end face of the rotary electrical machine by means of the fastening elements of the spacer, whereby the 3D Semiflex PCB arrangement is mechanically coupled directly to this end face.

• - in einem von der 3D-Semiflex-PCB-Anordnung, insbesondere von deren Semiflex-PCB, eingenommenen Raumbereich in einem Betriebszustand des mechatronischen Systems hohe Temperaturen von oder (von Raumtemperatur) bis zu etwa 120 °C, 130 °C, 140 °C, 150 °C oder 160 °C, insbesondere dauerhaft, herrschen; und/oder
• - die 3D-Semiflex-PCB-Anordnung in einem Betriebszustand des mechatronischen Systems hohen Vibrationen von oder bis zu etwa der 25-fachen, 30-fachen oder 35-fachen Erdbeschleunigung, insbesondere dauerhaft, ausgesetzt ist.

According to a further aspect, a method for operating a mechatronic system of the type set out herein is provided, wherein

• - In a room area occupied by the 3D Semiflex PCB arrangement, in particular by its Semiflex PCB, in an operating state of the mechatronic system, high temperatures of or (from room temperature) up to approximately 120 ° C, 130 ° C, 140 ° C , 150 ° C or 160 ° C, especially permanent, prevail; and or
• - The 3D Semiflex PCB arrangement in an operating state of the mechatronic system is exposed to high vibrations of or up to approximately 25 times, 30 times or 35 times gravitational acceleration, in particular permanently.

Figure list

• 1 eine perspektivische Ansicht einer 3D-Semiflex-PCB-Anordnung der hierin dargelegten Art für ein mechatronisches System;
• 2 eine perspektivische Seitenansicht der 3D-Semiflex-PCB-Anordnung der 1, aus Darstellungsgründen ohne den zugehörigen Abstandshalter;
• 3 eine perspektivische Ansicht des Abstandshalters der 3D-Semiflex-PCB-Anordnung der 1;
• 4 eine perspektivische Ansicht eines mechatronischen Systems in Form eines Antriebs mit einer rotatorischen elektrischen Maschine, an deren Stirnseite die 3D-Semiflex-PCB-Anordnung der 1 befestigt ist; und
• 5 einen axialen Querschnitt des mechatronischen Systems der 4.

The above aspects and their embodiments and specific configurations are explained in more detail below with reference to the examples shown in the attached drawings. The drawings are purely schematic, in particular they should not be read to scale. Show it:

• 1 a perspective view of a 3D Semiflex PCB assembly of the type set forth herein for a mechatronic system;
• 2nd a side perspective view of the 3D Semiflex PCB assembly of FIG 1 , for illustration purposes without the associated spacer;
• 3rd a perspective view of the spacer of the 3D Semiflex PCB arrangement of the 1 ;
• 4th a perspective view of a mechatronic system in the form of a drive with a rotary electrical machine, on the front side of the 3D Semiflex PCB arrangement of the 1 is attached; and
• 5 an axial cross section of the mechatronic system of 4th .

Description of embodiments

All of the various embodiments, variants and specific design features of the 3D Semiflex PCB arrangement according to the first aspect, as well as the mechatronic system and the corresponding manufacturing and operating methods according to the other aspects, mentioned above in the description and in the claims below, can be analogously applied to the in 1 to 5 Examples shown can be implemented individually or in combinations mentioned above. They are therefore not all repeated again below. The same applies accordingly to the definition of terms and effects already mentioned above with regard to individual features that are described in the 1 to 5 are shown.

1 shows a perspective view of a 3D Semiflex PCB arrangement 1 of the type set out herein for a mechatronic system, which is designed in particular as a drive with an electric motor and the 3D Semiflex PCB arrangement 1 with mechanical control directly connected thereto can, such as in 4th and 5 is shown. The control electronics can be used in particular to provide the required electrical voltage in the mechatronic system so that the electric motor can generate the requested torque, in a highly dynamic manner and with high positioning accuracy.

For this purpose, the 3D semiflex PCB arrangement 1 of FIG 1 a Semiflex PCB (semiflexible printed circuit board; 2 with various in 1 recognizable electronic control components. The Semiflex PCB 2nd has two rigid PCB sections extending one above the other, essentially parallel to one another 3rd and 4th as well as two semi-flexible PCB sections in this example 5 and 6 on each of which is the rigid PCB sections 3rd and 4th connects with each other. Each of the semi-flexible PCB sections 5 and 6 is through two consecutive semiflex bends 5b and 5c or. 6b and 6c by 90 ° each as well as an intermediate, flat, to both rigid PCB sections 3rd and 4th vertical connection section 5a or. 6a educated.

Furthermore, the 3D semiflex PCB arrangement 1 of FIG 1 one between the two rigid PCB sections 3rd and 4th arranged spacers 7 to the mechanical fixation of the two rigid PCB sections 3rd and 4th at a predetermined distance from each other several flat support surfaces 7a (in 1 covered, cf. 3rd ), which in each case on corresponding flat contact surfaces 3a or. 4a (in 1 covered, cf. 2nd ) of the two rigid PCB sections 3rd and 4th and at the flat connecting sections 5a and 6a of the semi-flexible PCB sections 5 and 6 issue.

The semi-flexible PCB sections are purely exemplary 5 and 6 in the form of relatively narrow semiflex strips with a width that can be scaled depending on the application and at a predetermined distance from one another, in each case from sides connected to one another by a lateral edge region 3b and 4b of the two rigid PCB sections 3rd and 4th out. In between you can see the rigid PCB sections 3rd and 4th purely by way of example also on their pages 3b and 4b with extension areas 3c and 4c go out as in 1 shown.

Overall dimensions of the 3D Semiflex PCB arrangement 1 of approximately 60 mm in length, 60 mm in width and 40 mm in height are possible by way of example, the length and width being in the direction of the rigid PCB sections 3rd and 4th and measure the height perpendicular to it. However, the structure of the 3D Semiflex PCB arrangement described here stands out 1 due to its spatial compactness, structural simplicity and mechanical stability, in particular also due to its scalability to basically any dimensions that a specific application requires.

2nd shows the 3D Semiflex PCB arrangement 1 of FIG 1 in one opposite 1 Perspective side view rotated about 180 ° about a horizontal axis, in which the rigid PCB sections 3rd and 4th across from 1 swapped places. For the sake of illustration, the 3D Semiflex PCB arrangement is 1 of the 1 in 2nd without the spacer 7 shown the design of the Semiflex PCB 2nd in the 3D Semiflex PCB arrangement 1 , and especially those related to 1 mentioned flat connecting sections 5a and 6a of the semi-flexible PCB sections 5 and 6 and the flat contact surfaces 3a and 4a of the two rigid PCB sections 3rd and 4th , to show.

As in 2nd The flat connecting sections are particularly easy to see 5a and 6a of the semi-flexible PCB sections 5 and 6 as reinforcement areas with a relative to the adjacent areas of the semi-flexible PCB sections 5 and 6 in this example, the thickness of the milling process is gradually increased, e.g. B. in the form of rectangular PCB laminate webs. In particular, such a reinforcement area as in 2nd in the middle between the two 90 ° Semiflex bends 5b and 5c or. 6b and 6c extend.

3rd shows in the same perspective view as in 1 the spacer 7 the 3D Semiflex PCB arrangement 1 of the 1 again separately. The spacer 7 is formed in this example as a support frame, which is between its several elongated flat support surfaces 7a Recesses and / or empty spaces 7b for example, to save weight and material. In order to ensure the best possible support and mechanical robustness of the 3D Semiflex PCB arrangement 1, the flat support surfaces extend 7a of the spacer 7 and the corresponding flat contact surfaces 3a or. 4a (see. 1 and 2nd ) at least one of the two rigid PCB sections 3rd and 4th along much, in 1-3 each between about 60% and 95%, a total length of three of its four sides.

4th shows a perspective view of a mechatronic system 8th in the form of a drive with a rotary electrical machine 9 , on one end of which is the 3D Semiflex PCB arrangement 1 of the 1 with associated control electronics in this example in the spacer 7 provided fasteners (in 4th hidden) is attached.

5 shows an axial cross section of the mechatronic system 8th of the 4th .

The rotary electrical machine 9 is in 4th and 5 Designed purely by way of example as an electronically commutated internal rotor machine and has a stator 10 with inward-facing stator teeth, that in the mechatronic system 8th of the 4th and 5 outside of a cylindrical housing 11 is protected. In an interior surrounded by the stator teeth 12th is a rotor shaft with permanent magnets 13 rotatably arranged. There are stator coils on the stator teeth 14 wound on which in the operation of the mechatronic system 8th using the in the 3D Semiflex PCB arrangement 1 Control electronics provided a suitable electrical voltage is applied according to the electronic commutation to a wandering magnetic field in the interior 12th of the electrical machine 9 to create. This causes a rotation of the rotor shaft 13 required torque.

The cylindrical housing 11 is closed on both sides and points to his in 4th and 5 upper front end in this example, a housing cover firmly attached to it 15 on where both supply lines 16 for the power supply of the stator coils 14 as well as the 3D Semiflex PCB arrangement 1 with the associated control electronics fixed, space-saving and precise in relation to the electrical machine 9 are integrated. The 3D Semiflex PCB arrangement can be used for this 1 for example in the spacer 7 provided suitable fasteners such. B. clips or threaded holes for screw connections, on the housing cover 15 fixed and thereby on the electrical machine 9 mechanically coupled directly. The ground layers of the two PCB halves are connected or contacted by means of injected / inserted screw domes (metal sleeves) in the screw connections. This serves to increase the robustness with regard to EMC (electro-magnetic compatibility), both for radiation and radiation. Another secondary function of the carrier frame is the stiffening of the 3D Semiflex PCB during transport from plant to plant and handling in production.

The mechatronic system 8th is in this example in the manner specified above, in particular for operation at high temperatures of or up to about 120 ° C., 130 ° C., 140 ° C., 150 ° C. or 160 ° C., in particular permanently, in one of the 3D Semiflex PCB arrangement 1, in particular of its Semiflex PCB 2nd , occupied space area designed. In particular, this can be achieved by choosing a spacer material with a suitable temperature resistance and maintaining the required mechanical properties at these temperatures. Furthermore, for example, on the rigid PCB section 3rd which in this example is due to the direct coupling closer to the electrical machine 9 is arranged, less heat-emitting and / or less heat-sensitive electronic control components and / or also with a lower component density than on the other, from the electrical machine 9 rigid PCB section facing away 4th , for which, due to this positioning difference, more cooling options through surrounding air or close to outside of the mechatronic system 8th arranged cooler (not shown) can be realized. Furthermore, the mechatronic system 8th in this example in the manner indicated above, in particular for operation with high vibrations of or up to approximately 25 times, 30 times or 35 times the acceleration due to gravity, in particular permanently. Due to this temperature and vibration resistance, the mechatronic system is 8th For example, can also be used in a motor vehicle, such as. B. in an engine cooler system or for other rotary machines or actuators in the engine compartment.

Furthermore, the mechatronic system 8th in this example a magnetic sensor 17th to monitor the rotation of the rotor shaft 13 on their in the housing cover 15 stored end is arranged. The Semiflex PCB 2nd the 3D Semiflex PCB arrangement 1 also has an electronic sensor module, for example a magnetic sensor 17th (not shown in detail) to the rotor position of the rotor shaft 13 capture. By means of this rotor position signal, the stator coils of the EC motor can be controlled to excite the rotor shaft and / or the position of a part to be adjusted can be detected.

Claims (11)

3D Semiflex PCB arrangement (1) for a mechatronic system (8), in particular a drive with an electric motor (9) and control electronics directly mechanically coupled thereto, comprising: - a Semiflex PCB (2) with electronic control components, the two has rigid PCB sections (3, 4) which extend essentially parallel to one another and at least one semi-flexible PCB section (5, 6) connecting them, which by two successive semiflex bends by approximately 90 ° (5b, 5c; 6b, 6c) and one between these 90 ° Semiflex bends (5b, 5c; 6b, 6c) lying flat connection section (5a, 6a) which is essentially perpendicular to both rigid PCB sections (3, 4); and - a spacer (7) which is arranged between the two rigid PCB sections (3, 4) and which has a plurality of flat supporting surfaces (7a) for their mechanical fixing at a predetermined distance from one another, each of which has corresponding flat contact surfaces (3a, 4a ) of the two rigid PCB sections (3, 4). 3D Semiflex PCB arrangement (1) according to Claim 1 , wherein the flat connecting section (5a, 6a) of the at least one semi-flexible PCB section (5, 6) as a reinforcement area, in particular in the form of a rectangular PCB laminate web, through a relative to the adjacent areas of the at least one semi-flexible PCB Section (5, 6) of increased thickness is formed and preferably extends essentially centrally between the two 90 ° Semiflex bends (5b, 5c; 6b, 6c) - and in particular the flat support surfaces (7a) on the flat connecting section (5a, 6a) of the at least one semi-flexible PCB section (5, 6). 3D Semiflex PCB arrangement (1) according to Claim 1 or 2nd , wherein the spacer (7) also has fastening elements for the direct mechanical coupling of the 3D Semiflex PCB arrangement (1) to a mechanical subsystem of the mechatronic system (8), in particular to an electric motor (9). 3D Semiflex PCB arrangement (1) according to one of the preceding claims, in which materials, dimensions, the relative arrangement of the Semiflex PCB (2) and the spacer (7) to one another and / or the arrangement of electronic control components on the Semiflex PCBs (2) are such that the 3D semiflex PCB arrangement (1) can be used even at high operating temperatures of or up to approximately 120 ° C, 140 ° C or 160 ° C, and in particular permanently, without impairing the functionality . 3D Semiflex PCB arrangement (1) according to one of the preceding claims, in which materials, dimensions, the relative arrangement of the Semiflex PCB (2) and the spacer (7) to one another and / or the arrangement of electronic control components on the Semiflex PCBs (2) are such that the 3D semiflex PCB arrangement (1) even with high vibrations of or up to approximately 25 times, 30 times or 35 times the acceleration due to gravity, and in particular permanently, without impairing the functionality can be used. 3D semiflex PCB arrangement (1) according to one of the preceding claims, wherein the at least one semi-flexible PCB section (5, 6) comprises two semi-flexible PCB sections (5, 6), which are at a predetermined distance from each other and each a side edge area of interconnected sides (3b, 4b) of the two rigid PCB sections (3, 4). 3D Semiflex PCB arrangement (1) according to one of the preceding claims, wherein the spacer (7) is designed as a support frame which has recesses and / or empty spaces (7b) between the plurality of flat support surfaces (7a), the flat support surfaces (7a) of the spacer (7) and the corresponding flat contact surfaces (3a, 4a) of at least one of the two rigid PCB sections (3, 4) extend along at least a fifth, a quarter, a third or a half of its perimeter, - At least one of the two rigid PCB sections (3, 4) is in particular essentially rectangular and its flat contact surfaces (3a, 4a) which bear against the associated support surfaces (7a) of the spacer (7) extend along a large part of a respective overall length extend from two, three or all four of its sides. Mechatronic system (8) with a 3D Semiflex PCB arrangement (1) according to one of the preceding claims, in particular a drive with a rotary electrical machine (9), on one end face of which the 3D Semiflex PCB arrangement (1) is attached to the associated control electronics by means of the spacer (7), - The mechatronic system (8) preferably comprises at least one sensor (17) for its monitoring and the Semiflex PCB (2) further comprises at least one electronic sensor module for controlling and / or reading out the at least one sensor (17). Method for producing a 3D Semiflex PCB arrangement (1) according to one of the Claims 1 to 7 for a mechatronic system (8) in particular according to Claim 8 , with the steps: - providing a semiflex PCB (2) which extends essentially in one plane, the two rigid PCB sections (3, 4) and at least one intermediate semi-flexible PCB section (5, 6) connecting them includes; - equipping the provided Semiflex PCB (2) with electronic control components for the mechatronic system (8); - Providing a spacer (7) which has a plurality of outwardly facing, flat support surfaces (7a); - Bending the at least one semi-flexible PCB section in its areas between the two rigid PCB sections (3, 4) in each case by approximately 90 ° with the aid of the spacer (7), in each case by moving to the flat support surfaces (7a) of the spacer (7 ) corresponding level Contact surfaces (3a, 4a) of the two rigid PCB sections (3, 4) and a flat connecting section (5a, 6a) of the semi-flexible PCB section (5, 6) for contacting the associated support surfaces (7a) of the spacer (7) brought and thereby positioned relative to this and mechanically stabilized; and - preferably permanently attaching the Semiflex PCB (2) thus bent around the spacer (7) to the spacer (7). Method for manufacturing a mechatronic system (8) according to Claim 8 in the form of a drive with a rotary electrical machine (9), with the steps: - providing a 3D Semiflex PCB arrangement (1) according to one of the Claims 1 to 7 through a process according to Claim 9 , wherein the spacer (7) further comprises fastening elements for fastening the 3D semiflex PCB arrangement (1) to the rotary electrical machine (9), and - fastening the provided 3D semiflex PCB arrangement (1) to a predetermined one Position on an end face of the rotary electrical machine (9) by means of the fastening elements of the spacer (7), as a result of which the 3D Semiflex PCB arrangement (1) is mechanically coupled directly to it. Method for operating a mechatronic system (8) according to Claim 8 , - in a space area occupied by the 3D Semiflex PCB arrangement (1), in particular by its Semiflex PCB (2), in an operating state of the mechatronic system (8), high temperatures of or up to approximately 120 ° C., 140 ° C or 160 ° C, especially permanent, prevail; and / or - the 3D Semiflex PCB arrangement (1) in an operating state of the mechatronic system (8) is exposed to high vibrations of or up to approximately 25 times, 30 times or 35 times gravitational acceleration, in particular permanently .

Images