DE102018207293A1 - LIDAR measuring system and method for mounting a LIDAR measuring system - Google Patents

Abstract

LIDAR measuring system (78), comprising a fastening element (80), in particular a motherboard (80), a transmitter board (86) on which a transmission chip (88) is arranged, a receiving board (94) on which a receiving chip (96) is arranged , a transmitting optical carrier (90) having a transmitting optics (92), and a receiving optical carrier (98) having a receiving optics (100), wherein the transmitting optical carrier (90) is arranged on the transmitting board (86) and the receiving optical carrier (98) is arranged on the receiving board (94) and wherein the transmitting board (86) and the receiving board (94) are each arranged on the fastening element.

Description

The invention relates to a LIDAR measuring system and a method for mounting a LIDAR measuring system.

WO 2017/081 294 A1 discloses a measuring system which has a transmission chip with a plurality of emitter elements and a reception chip with a plurality of sensor elements. The transmitting chip and the receiving chip are statically formed on the measuring system, wherein the emitter elements and the receiving elements are imaged via optics onto a specific spatial area which the measuring system views. Associated emitter elements and sensor elements are each assigned to a solid angle, which preferably completely overlap. The emitter element emits laser light into this solid angle and the associated sensor element detects light which arrives from the same solid angle. Over the duration of the light pulses then the distance of reflective objects in the field of view can be determined.

Precise measurements require precise alignment of the individual components of the measuring system.

It is therefore the task to provide a LIDAR measuring system, which provides the high demands on a precise alignment of the components. Furthermore, it is also an object to provide a method for mounting such a LIDAR measuring system.

This object is achieved by a LIDAR measuring system according to claim 1. The dependent claims represent advantageous embodiments of the measuring system.

The measuring system preferably performs the distance determination according to the Time Correlated Single Photon Counting method, TCSPC. Conveniently, the measuring system does not work according to the RADAR principle, ie superposition of the transmitted wave with a reference wave and the subsequent analysis of the mixing wave.

The LIDAR measuring system preferably comprises a LIDAR transmitting unit and a LIDAR receiving unit. Furthermore, the LIDAR measuring system and its components are preferably arranged in a static, that is immovable structure. This means that the LIDAR measuring system and its components have no active movement or adjustment mechanisms, such as electric motors, for the measurement process. The arrangement on a motor vehicle preferably also takes place statically.

The LIDAR receiving unit and / or the LIDAR transmitting unit are conveniently designed in a focal plane array configuration. The elements of the respective unit are arranged substantially in one plane, favorably on a chip. The respective unit is arranged on the LIDAR measuring system, preferably in a focal point of a corresponding optics, transmission optics, or receiving optics. In particular, the sensor elements or the emitter elements are arranged in the focal point of the receiving optics. Such an optic can be formed for example by an optical lens system.

The LIDAR receiving unit, in particular its receiving chip, has a plurality of sensor elements, which are preferably designed as SPAD, single photon avalanche diode. The LIDAR transmitting unit, in particular its transmission chip, has a plurality of emitter elements for emitting laser light, conveniently laser pulses. The emitter elements are favorably designed as VCSEL, vertical cavity surface emitting laser.

The transmission chip has at least one, preferably a plurality of emitter elements which emit the laser light. The receiving chip has at least one, preferably a plurality of sensor elements which detect incident light. In particular, the sensor elements also detect the laser light emitted by the emitter elements.

The LIDAR measuring system comprises a central fastening element, in particular a motherboard. Furthermore, the measuring system has a transmission board, on which a transmission chip is arranged, and a reception board, on which a reception chip is arranged.

Furthermore, the measuring system has a transmission optical carrier for a transmitting optical system and a receiving optical carrier for a receiving optical system.

The receiving optics and the transmitting optics are arranged on a respective optics carrier. The optical components can be arranged directly or indirectly on the optical carrier. In this case, the optic itself may have a housing, which is then arranged on the optics carrier, or the optics carrier serves as a housing for the optical components. Here, the latter is an advantage. For example, the optical components are arranged in a housing, which in turn is attached to the optical carrier, for example screwed or glued. If appropriate, the optics carrier also provides receptacles for the individual optical components of the optics, so that they are arranged directly on the optics carrier.

The optics can have a single or a plurality of optical components, for example lenses.

The transmission optical carrier is arranged on the transmission board, directly or indirectly. The receiving optical carrier is arranged on the receiving board, directly or indirectly. The optics carrier and the optics are arranged such that the respective chip is imaged via the associated optics on the solid angle considered by the measuring system. The transmission board and the receiving board are each attached to the fastening element, which is preferably designed as a motherboard. The fastener is used for the direct arrangement of the transmitter board and receiver board and thus the adjusted attachment of the transmitter chip and the Einpfangschips. The motherboard, which has further electronic components, can also be arranged next to the transmitter board and the receiver board and can be electrically connected thereto, but not perform a fastening function.

The attachment of the optical carrier to the transmitting board and the receiving board can be made directly or indirectly, in this embodiment, the latter is preferred. In this case, at least one further component is arranged between the respective optics carrier and the main circuit board. This can be, for example, a part of the housing. This component has corresponding receptacles which are designed to be complementary to the optics carrier. In particular, a space is kept free by the complementary shape to allow alignment of the optics carrier with the motherboard and the chips for mounting.

The separate design of the boards for the two chips and also the optics and the optics carrier creates the opportunity to optimally align the optics with respect to the transmission chip and the receiving chip.

In addition, advantageous embodiments of the measuring system are explained.

Conveniently, the board, in particular the transmitting board or the receiving board, directly or indirectly on the counterpart, in particular the optical transmitting carrier or the optical receiving carrier, is formed.

Conveniently, the fastening element, in particular the motherboard, directly or indirectly on the counterpart, in particular the transmitting board or the receiving board is formed.

Immediately, the board and / or the fastening element is arranged directly on the respective counterpart and attached thereto. Optionally, in this case, the fastening means, for example, an adhesive disposed therebetween.

In the case of the indirect arrangement, the circuit board and / or the fastening element is arranged on a further component, for example a housing of the measuring system or a plate, this further component being directly or indirectly connected to the counterpart or being fastened thereto.

Conveniently, at least one fastening means between two components of the measuring system is formed by adhesive.

This is advantageous because the individual components can initially be optimally aligned, since the adhesive has not yet cured. The adhesive can thus be displaced to be able to align the components correctly. The adhesive can be pre-cured after proper orientation so that the correct arrangement is fixed. After complete curing of the adhesive, the components are firmly connected. In particular, the adhesive is a UV curing adhesive which can be cured, inter alia, by UV light.

Optionally, a volume of the adhesive must be provided by which the adhesive changes during the curing process, in particular shrinking. As a result, the measuring system is correctly adjusted after alignment and curing. For example, the adhesive may be applied to each other prior to placement of the components or may be introduced after placement.

Advantageously, at least one of the connection points of the components between one of the chips and one of the optics is formed by adhesive.

Advantageously, at least one of possibly a plurality of fastening means, which is arranged functionally between a chip and the associated optics, for example the transmitting chip and the transmitting optics, is formed by an adhesive.

It can also be formed by adhesive a plurality of these fastening means.

Preferably, the chips are arranged on the board and secured thereto.

It is also possible for only one of the chips from the receiving chip and the transmitting chip to be arranged on the respective circuit board and fastened thereto.

In contrast, it is also advantageous if the chips are arranged in a recess of the board.

It can also be arranged in the recess of the respective board only one of the chips from receiving chip and transmission chip. Through the recess of the respective chip is also arranged on another component, such as a metal plate. This metal plate may be part of the housing, in particular a rear wall. The chip within the recess of the board is conveniently located on the further component, ie the metal plate. Preferably, the chip is also attached to this, for example by adhesive. This improves the thermal conductivity. The board is also conveniently attached to the component.

The chip disposed within the recess is electrically connected to the board.

It is proposed that the parts of the housing are made of the same material, in particular metal.

As a result, stresses due to differential thermal expansion are avoided. Optionally, a housing of the optics may be formed by the same material. Preferably, the material is a metal, whereby an optimal heat dissipation is ensured, in particular aluminum.

The object is also achieved by the method for mounting the measuring system according to claim 8. In the dependent claims advantageous embodiments are explained.

According to the method of mounting, a fastener, in particular a motherboard, a transmitter board with a transmit chip and a receive board with a receive chip are provided. The send chip and the receive chip are attached to the respective board and already aligned to the respective one. Alternatively, the transmission chip and the receiving chip can also be arranged on the respective board, aligned and then attached.

Furthermore, a transmission optical carrier with a transmitting optical system and a receiving carrier with a receiving optical system are provided.

The optical carriers are then arranged on the respective circuit board and the optics are aligned with respect to the associated chip. As a result, both chips are optimally aligned with respect to the associated optics, so that an optimal mapping to the solid angle is provided. For orientation, a measuring system, in particular an optical measuring system, is preferably used. This can be for example a camera. The alignment does not necessarily correspond to the final relative position of the components. For example, a shrinkage of an adhesive can be kept. More will be explained later.

Following alignment, the optics carrier is then attached to the motherboard. The attachment can be done for example by pre-curing of an adhesive between the components. Furthermore, the attachment can be made directly or indirectly.

Then, one of the boards of the transmission board and the receiving board is arranged on the fastening element, in particular the motherboard, and the board is aligned with respect to the fastening element. Then the board is attached to the fastener.

Subsequently, the other board of the transmitter board and receiving board is arranged on the fastener. Then, the other board is aligned, so that the transmission chip and the receiving chip optimally map each other. For orientation, a measuring system, in particular an optical measuring system, is preferably used. This can be for example a camera.

Following alignment, the other board is then attached to the fastener. The attachment can be done for example by pre-curing of an adhesive between the components. Furthermore, the attachment can be made directly or indirectly. As a result, an optimal adjustment of the imaging behavior of the two chips with each other and an optimal adjustment of the compared to the optics is achieved.

The object is also achieved by an alternative mounting method according to claim 9.

In this case, the transmission board and the receiving board are arranged at the same time on the fastening element. Then, the transmission chip and the receiving chip are aligned with each other and then attached both. As a result, the number of degrees of freedom for an optimal adjustment is even higher. In the remaining steps, this procedure is in accordance with the explanations regarding the assembly method explained above.

Both methods are suitable for mounting a measuring system according to the previous embodiments.

In the following, advantageous embodiments of the method will be explained.

Conveniently, two of the components of the measuring system are secured together by pre-curing or one adhesive.

The pre-cure can be provided, for example, by UV irradiation of a UV-curing adhesive. As a result, the components are temporarily correctly aligned with each other. The measuring system can be transported to a curing oven, for example, whereby the correct adjustment is maintained. Conveniently, more than two components can be secured together by adhesive.

It is suggested that the pre-cured adhesive of the measuring system then be fully cured.

This curing can be done for example in a curing oven.

With particular advantage, a shrinkage volume of the adhesive is held up during fastening.

This can be done, for example, that the components are aligned correctly. Then, using the information from a measuring system, a relative distance between the components is determined. From this, a fixing position can be calculated, which is then adjusted. The adhesive is now pre-cured. In the curing oven, the adhesive shrinks to such an extent that the components are optimally adjusted after curing.

It is further proposed that a correct position is determined in the arrangement, then a shrinkage is determined and a pre-hardening position is set between the components. The attachment is then provided by pre-curing the adhesive.

Preferably, the arrangement and / or attachment between fastener and transmitter board or receiver board of the measuring system is formed directly or indirectly.

Preferably, the arrangement and / or attachment between the transmission optical carrier and the transmission board of the measuring system is formed directly or indirectly.

Preferably, the arrangement and / or attachment between the receiving optical carrier and the receiving board of the measuring system is formed directly or indirectly.

With particular advantage, the fastening element, the transmission board, the receiving board, the optical transmission carrier and / or the receiving optical carrier is arranged on a part of the housing of the measuring system.

It is proposed that the fastening element is formed by the housing or at least provides a part of the housing.

• 1 eine schematische Darstellung des LIDAR Messsystems;
• 2 einen Sendechip und einen Empfangschip;
• 3 einen Aufbau des LIDAR Messsystems;
• 4 einen weiteren Aufbau des LIDAR Messsystems;
• 5 einen weiteren Aufbau des LIDAR Messsystems;
• 6 einen weiteren Aufbau des LIDAR Messsystems;
• 7 einen weiteren Aufbau des LIDAR Messsystems;
• 8 eine konkrete Ausgestaltung des LIDAR Messsystems gemäß 4;
• 9 eine weitere konkrete Ausgestaltung des LIDAR Messsystems gemäß 4.

The LIDAR measuring system and the method of assembly will be further exemplified with reference to several figures, in particular 5 , explained. In addition, other measuring systems of the same type are explained with their mounting method. Show it:

• 1 a schematic representation of the LIDAR measuring system;
• 2 a send chip and a receive chip;
• 3 a structure of the LIDAR measuring system;
• 4 another setup of the LIDAR measuring system;
• 5 another setup of the LIDAR measuring system;
• 6 another setup of the LIDAR measuring system;
• 7 another setup of the LIDAR measuring system;
• 8th a concrete design of the LIDAR measuring system according to 4 ;
• 9 Another specific design of the LIDAR measuring system according to 4 ,

In the 1 is a LIDAR measuring system 10 with a receiving unit 12 and a transmitting unit 14 shown. The measuring system 10 includes a receiving optics 16 as well as a transmission optics 18 , This measuring system 10 is intended for placement on a motor vehicle to monitor an environment and a position and movement of an object 20 to determine the motor vehicle. Such a measuring system 10 can be used, for example, for autonomous driving. The operating principle is as follows.

The transmitting unit 14 has emitter elements 22 on, with these emitter elements 22 Emit laser light in the form of light pulses. These emitter elements 22 For example, they may be formed by vertical cavity surface emitting lasers, in short VCSELs. One from an emitter element 22 emitted pulse 24 goes through the transmission optics 18 , becomes an object 20 reflected and via a receiver optics 16 on one of several sensor elements 26 is directed. Such a sensor element may be formed, for example, by a single photon avalanche diode, also called SPAD.

In the 1 is a simple representation of the path covered a ray 25 a single emitter element 22 presented the the Course of the pulse 24 should clarify. One from a sensor element 26 detected light pulse 24 becomes of a readout element 28 read out and sent to an evaluation unit 30 passed, which, inter alia, has a memory element. It is used to determine the distance of the object 20 from the motor vehicle, the time of flight principle, also called TOF applied. The emitted pulse is the elapsed time until the arrival at the receiving unit 12 linked, from which the running distance of the light pulse 24 can be determined. A corresponding coordination of the running processes is by the control unit 32 realized. The readout element in this embodiment variant is formed by a time-to-digital converter, TDC, which fills a memory element which maps a histogram. In particular, on this measuring system 10 the TCSPC method, time correlated single photon counting, used. However, these explanations are very basic and should only clarify the general principle. This embodiment is by no means limiting for the electronic construction of the measuring system. In order not to exceed the scope of this document, not all interactions between the respective electronic components and their concrete structure can be represented and explained. The LIDAR measuring system is connected to other components of the motor vehicle via a connection 34 connected via which the corresponding data can be transmitted.

With the help of the optics 16 and 18 and the plurality of emitter elements 22 and sensor elements 26 scans the measuring system 10 a room on objects. Every element 22 . 26 considered about the associated optics 16 . 18 a certain solid angle. The emitter element 26 sends the light pulse 24 via the transmission optics 18 in this solid angle, where the light pulse on an object 20 can be reflected, and from the solid angle on the receiving optics 16 on the sensor elements 26 be steered. Accordingly, the measuring system 10 emitting elements 22 and sensor elements 26 on, about their optics 16 . 18 consider the same solid angle. The representation of the solid angle in the 1 is an example and serves to explain the overall function, but does not correctly reflect the identical solid angles. So that the measuring system 10 works correctly, the emitter elements must 22 , the sensor elements 26 , the transmitting optics 18 and the receiving optics are aligned with each other exactly. The emitter elements 22 and the sensor elements 26 are each arranged on a chip, so that the alignment of the chips and the optics to each other must be carried out very accurately.

In the 2 are a send chip 36 and a reception chip 38 each partially shown. The sending chip 36 has a plurality of emitter elements 22 on, for example, in rows and columns on the transmission chip 36 are arranged. The receiving chip 38 has a plurality of sensor elements 26 on, also in rows and columns on the receiving chip 38 are arranged. Each of the emitter elements 22 is a plurality of sensor elements 26 assigned. This multiple assignment is indicated by dashed lines. The respective emitter element 22 and the associated sensor elements 26 consider the same solid angle over the respective optics, so that a light pulse coming from the emitter element 22 is emitted in a reflection of the associated sensor elements 26 can be detected.

In order to allow a correct and accurate detection of objects, the chips must 36 and 38 as well as the optics should also be exactly aligned with each other. In the 3 - 9 There are several variants that can be used to achieve precise alignment. The 3 to 7 represent different basic concepts, which clarify the basic structure. The versions of the individual variants are mutatis mutandis applicable to the other concepts.

According to the 3b has the measuring system 10 a transmission board 40 and a receiving board 42 on. The sending chip 36 is on the transmitter board 40 attached, the receiving chip 38 on the receiving board 42 is attached. Furthermore, the measuring system 10 an optics carrier 44 on, on which a transmission optics 46 and a receiving optics 48 are arranged. The optics 46 and 48 are for example in the optics carrier 44 screwed in or glued to it. There are also other types of attachment possible. In particular, each optic has a housing. The transmission board 40 and the receiving board 42 are each by an adhesive 50 on the optics carrier 44 attached. In this regard, other fasteners are possible.

The chips 36 and 38 are each on the side of the board 40 or 42 arranged, which of the respective optics 46 or 48 assigns. As a result, the laser light can be imaged by the associated optics on the associated solid angle and vice versa. The chips 36 and 38 as well as the optics 46 and 48 are aligned with each other so that the emitter elements 22 on the associated sensor elements 26 depict. To make this precise alignment possible, the LIDAR measuring system is used 10 mounted according to the following steps.

First, the optics carrier 44 according to the 3a provided. In this optics carrier 44 become the transmission optics 46 and the receiving optics 48 used. The transmission optics are thereby 46 and the receiving optics 48 aligned with each other. Of the Optics carrier keeps a space, which allows an alignment of the optics to each other. By the alignment of transmission optics 46 and receiving optics 48 a correlation between the optics is generated. For example, the optics may have the same angle of rotation about an optical axis and / or the optical axes may be parallel. With missing or insufficient alignment of the optics to each other, it may be difficult, if not impossible, for the further assembly process to provide the correct alignment of the chips, thus increasing the accuracy of the measurement system 10 can be significantly worsened.

In addition, a transmission board 40 with a send chip 36 and a receiver board 42 with a reception chip 38 provided. The chips are mounted on the associated board and, if necessary, aligned within certain tolerances with respect to the board to ensure a smooth further assembly within the measuring system.

One of these two boards, for example the transmission board 40 , is on the optics carrier 44 arranged and the associated chip, such as the transmission chip 36 , is compared with the associated optics, accordingly the transmitting optics 46 , aligned. The alignment ensures that the chip is optimally arranged to optimally map to the viewing area of the measuring system.

The properly aligned chip is then attached to the slide via the board. This attachment can for example by a fastener, here an adhesive 50 , to be provided. The adhesive 50 Already before the placement on the slide 44 be applied to the board or even subsequently, if the board is already aligned correctly. For example, the adhesive 50 be pre-cured by UV radiation to provide a first attachment, wherein the complete curing can be done in a later step.

Subsequently, the other board, for example, the receiving board 42 , with the other chip, for example the receiving chip 38 , on the optics carrier 44 attached. The other chip is then attached to the associated optics, such as the receiving optics 48 , and at the same time aligned with the chip. This alignment can be provided, for example, by an optical system which monitors the assembly process in real time and determines the correct placement. The other board is then via a fastener, such as the illustrated adhesive 50 on the slide 44 attached.

It can be the sending chip 36 or the receiving chip 38 be attached first.

The arrangement, alignment and mounting of the two boards can alternatively also be done at the same time, so that both boards are arranged on the slide, then both chips are simultaneously optimally aligned with respect to the other components and then the boards are attached.

The assembly of the individual parts is conveniently carried out fully automatically by means of automated robots. This can bring the parts together, align correctly with each other and thereby enable a high-precision assembly. In this case, the correct position of the parts is measured to each other, for example by an optical system which detects the relative arrangement of the components in real time.

In the 4 is another embodiment of a measuring system 58 shown. The measuring system 58 includes a motherboard 60 at the one transmission chip 62 and a reception chip 64 are arranged. The two chips are aligned and fixed to each other on the board.

Furthermore, the measuring system 58 a transmission optics carrier 66 with a transmission optics 68 and a receiving optical carrier 70 with a receiving optics 72 on. The optics can be screwed or glued, for example, in the optics carrier.

The transmission optics carrier 66 is on the motherboard 60 arranged such that the transmitting optics 68 the emitted laser light of the transmission chip 62 correctly on the observation area of the measuring system 58 directs. The same applies to the receiving optics carrier 70 , In addition, the transmission optics 68 and the receiving optics 72 as well as the send chip 62 and the receiving chip 64 aligned such that the VCSEL maps to the associated group of SPAD. This alignment is provided during the assembly process.

The transmission optics carrier 66 and the receiving optics carrier 70 are here via an adhesive 74 attached to the motherboard. This attachment can be provided directly or preferably indirectly. In particular, the motherboard can be arranged on or within a housing, also called optical housing, wherein the respective optics carrier is then fastened to the housing. Such an indirect connection is in principle possible for any adhesive connection which is explained with respect to the different design variants for measuring systems of this patent specification. The housing of the optics differs from the housing of the measuring system.

During assembly is in accordance with 4a the motherboard 60 provided. The sending chip 62 and the receiving chip 64 can already be aligned on the motherboard 10 be attached or arranged on the motherboard, aligned and fixed. The orientation may, for example, have a relative distance between the two chips and a certain rotational orientation to one another. In particular, a defined arrangement is predetermined on the motherboard. In particular, the chips are arranged such that, upon completion of the assembly, an image of the individual emitter elements and sensor elements takes place on the correct solid angle.

Subsequently, a first optical carrier of optical transmission carrier 66 and receiving optics carrier 72 with its optics on the motherboard 60 arranged. Then the optics is aligned with respect to the respective chip and the optics carrier on the motherboard 60 attached. The attachment can be made in accordance with the statements on the previously described measuring system. The alignment is carried out in particular by suitable measuring systems.

Subsequently, the other of the two optical carriers is arranged on the motherboard above the associated chip and then aligned the still movable optics with respect to both chips and the other optical carrier. Then the optics carrier is attached. When attaching with adhesive, it may be necessary in principle to pre-stock a shrinkage process of the adhesive during curing, so that after curing the correct mounting position is obtained. This provision can be provided, for example, by the respective component being aligned correctly, a measuring system determining a space for the adhesive, for example a distance or a volume. Then it is calculated how the components must be aligned with each other, so that after curing and the shrinking process, the correct alignment of the components of the measuring system is provided. The alignment then takes place in this relative position, so that after complete curing, the correct orientation of the measuring system is obtained. This is basically applicable to all variants of the measuring system explained here.

In an alternative assembly process, the optics carriers do not sequentially attach to the motherboard 60 arranged, aligned and fixed, but both optics carrier 66 . 70 be at the same time on the motherboard 60 arranged and then aligned with each other. This is due to the simultaneous alignment of the optics 68 and 72 more degrees of freedom for a better alignment. Then the optics 68 . 72 as previously explained fastened.

The 5b shows a further structure for such a measuring system 78 , The measuring system 78 includes a motherboard 80 at the one broadcasting group 82 as well as a reception group 84 arranged and attached.

The broadcasting group 82 includes a transmitter board 86 at the one transmission chip 88 is arranged. In addition, on the transmission board 86 a transmission optics carrier 90 with a transmission optics 92 attached. The transmission optics 92 is opposite the send chip 88 aligned, so that an optimal picture of the sending chip 88 is provided to the considered space area.

The reception group 84 includes a receiving board 94 at the a reception chip 96 is arranged. In addition, on the receiving board 94 a receiving optics carrier 98 with a receiving optics 100 attached. The receiving optics 100 is opposite the send chip 96 aligned so that an optimal mapping of the considered solid angle on the receiving chips 96 is provided.

The broadcasting group 82 and the reception group 84 turn on the motherboard 80 attached. The motherboard 80 is representative of any means in which the broadcasting group 82 and the reception group 84 can be attached. The components of the measuring system are also exemplary in this embodiment by adhesive 102 attached to each other. The attachment can also be done by other suitable means. Also, an indirect or immediate arrangement of the components together, as already explained for other embodiments, possible.

During assembly, first according to the 5a the broadcasting group 82 and the reception group 84 provided. In particular, the respective optics carrier 90 . 98 on the respective board 86 . 94 arranged. It follows the alignment of the optics 92 . 100 opposite the respective chip 88 . 96 in order to provide an optimal image on the considered area of space. Then the optics carrier 90 . 98 on the respective board 86 . 94 attached.

Then one of the groups becomes 82 . 84 arranged and attached to the motherboard. In particular, an alignment, so in particular a rotational orientation of the respective chip 88 . 96 given is. In addition, the group 82 . 84 within a given range on the motherboard 80 arranged, so that the construction of the measuring system described above 78 is provided.

Subsequently, the other of the groups becomes 82 . 84 on the motherboard 80 then placed opposite the other group 82 . 84 , especially with respect to the chip 88 . 96 of the other group 82 . 84 aligned and then fastened. This also ensures an optimal alignment of the individual components for the finished measuring system 78 provided.

In an alternative variant, both groups can 82 and 84 at the same time on the motherboard 80 arranged, aligned with each other and then on the motherboard 80 be attached.

The 6c and 7c show another measuring system 108 , which can be mounted in different ways.

The measuring system 108 has a motherboard 110 on, at the a transmission chip 112 and a reception chip 114 are arranged. Furthermore, on the motherboard 110 an optics carrier 116 arranged, which has a transmission optics 118 and a receiving optics 120 having. The optics carrier 116 is by means of an adhesive 122 on the motherboard 110 attached.

The measuring system 108 is formed such that the transmission chip 112 and the receiving chip 114 about the optics 118 and 120 optimally reproduce each other. For this are the chips 112 and 114 and also the optics 118 and 120 aligned with each other.

In a first assembly variant according to the 6 becomes the motherboard 110 provided and on this the send chip 112 and the receiving chip 114 arranged, aligned and fastened. The sending chip 112 and the receiving chip 114 are already aligned with high precision to each other. This is done by the optics carrier 116 and the later arrangement of the optics 118 and 120 still provided sufficient leeway for optimal adjustment to provide optimal alignment of the individual components to each other.

In addition, the optics carrier 116 on the motherboard 110 arranged, aligned with respect to this and then fastened.

The alignment can be done with respect to the board and / or compared to the chips.

It is possible first the chips 112 and 114 and then the optics carrier 116 or first the optics carrier 116 and then the chips 112 and 114 on the motherboard 110 to fix.

After that, the optics become 118 and 120 in the optics carrier 116 inserted, aligned and then fastened. It can be one of the optics 118 . 120 opposite the associated chip 112 . 114 aligned and fixed and then the other of the optics 118 . 120 opposite to both chips 112 and 114 aligned and fastened. Alternatively, both optics may be placed at the same time, optimally aligned, and then secured.

In the other installation variant, which in the 7 is shown, on the one hand, the motherboard 110 with the precisely aligned chips 112 and 114 provided. On the other hand, the optics carrier 116 with the already on the optics carrier 116 attached optics 118 and 120 provided. The optics 118 and 120 are on the optics carrier 116 also precisely aligned with each other.

Then the optics carrier 116 on the motherboard 110 arranged the optics 118 and 120 and the chips 112 and 114 optimally aligned with each other and then optics carrier 116 on the motherboard 110 attached. Here is the correct and precise alignment of the optics 118 . 120 on the optics carrier 116 and the chips 112 . 114 on the motherboard 110 crucial to high quality for the measuring system 108 to enable.

The 8th shows the exemplary concept of the measuring system of 4 in a more concrete embodiment variant.

The measuring system 58 has a back wall 76 of a housing. The motherboard 60 with the sending chip 62 and the receiving chip 64 is between the rear wall of the housing and a middle part 77 arranged. The middle part 77 is via a screw on the back wall 76 attached to the housing. The motherboard 60 is via an adhesive connection on the back wall 76 attached to the housing and also indirectly via the on the rear wall 76 fastened middle part. As a result, a secure attachment of the motherboard and also an optimal dissipation of the heat generated to the rear wall 76 given.

The back wall 76 may be a separate component in an alternative embodiment variant, which is used for heat dissipation. This can also be a component within the housing.

The middle part 77 has two openings 77a on that the chips 62 and 64 are assigned and a receptacle for the optics carrier 66 and 70 provide. The optics carrier 66 . 70 grab part of these openings in the middle part 77 one and are with an adhesive 74 at the middle part 77 attached. The adhesive 74 seals the chips 62 and 64 from the environment, in particular from penetrating light and impurities. In addition, the previously described assembly method is made possible by the adhesive. In particular, the middle section represents 77 an indirect attachment of the optics carrier 66 . 70 on the motherboard 60 ready. The optics carrier 66 . 70 have the optics, which is an optimal illustration of the crisps 62 . 64 allow for the considered area of space.

In addition, a flex band is formed around the motherboard 60 and the chips 62 . 64 to connect with the other electronics.

At the previously for 4 explained method of assembly, it is in the specific embodiment variant according to 8th beneficial if the motherboard 60 before the arrangement of the optics carrier 66 . 70 , through the middle part 77 on the back wall 76 is attached. This will ensure a secure attachment between the motherboard 60 and middle part 77 produced.

In the 9a and 9b is another concrete design for a measuring system 58 according to the concept 4 shown. The 9a shows a three-dimensional exploded view, the 9b represents the measuring system 58 in cross section.

The measuring system 58 discloses a motherboard 60 , where a transmission chip 62 and a reception chip 64 are arranged. The chips 62 and 64 are electronic with the motherboard 60 connected. Furthermore, the measuring system 58 a transmission optics carrier 66 with a transmission optics 68 and a receiving optical carrier 70 with a receiving optics 72 on.

An optical carrier accommodates a plurality of optical components. According to the 9a the optics carrier are cylindrical.

The measuring system 58 has in addition to a housing which, among other things, a rear wall 76 and a middle part 77 includes. The middle part 76 is over two adhesive strips 74b on the back wall 76 attached. There are also two openings 77a provided for screws to attach the middle section 77 to allow on the housing. This will fix the middle part 77 on the back wall 76 secured again.

The middle part 77 and the back plate 76 are aligned with each other via complementary alignment means. The back plate 76 has two recesses for this purpose 76a on and the middle part two complementary surveys 77b , The openings 77a for the screws to reach through the alignment.

The motherboard 60 and the chips 62 . 64 are about an adhesive 74a on the back plate 76 attached. The motherboard 60 has two recesses for this purpose 60a . 60b on, which is complementary to the dimensions of the chips 62 are designed. This is a direct arrangement of the chips 62 . 64 possible on the rear wall, whereby a good heat dissipation is ensured. In addition, the chips can 62 . 64 electrically with the motherboard 60 get connected.

The middle part 77 also has two recording areas 77c on, which are formed substantially cylindrical. The complementarily formed optics carrier 66 and 70 are within the reception areas 77c arranged and with the help of an adhesive 74c attached.

In order to avoid stresses on the components of the housing are all housing parts, ie in particular back plate 76 and middle part 77 formed by the same material, for example aluminum.

LIST OF REFERENCE NUMBERS

10

measuring system

12

receiver unit

14

transmission unit

16

receiving optics

18

transmission optics

20

object

22

Emitter element, VCSEL

24

Laser light, pulse

25

beam

26

sensor element

28

readout element

30

evaluation

32

control unit

34

connection

36

transmitting chip

38

receiving chip

40

transmitting printed circuit board

42

receiver board

44

optics carrier

46

transmission optics

48

receiving optics

58

measuring system

60

motherboard

60a, b

recess

62

transmitting chip

64

receiving chip

66

Transmission optics carrier

68

transmission optics

70

Receiving optics carrier

72

receiving optics

74

adhesive

76

Rear wall of a housing

76a

Alignment means / recess

77

midsection

77a

opening

77b

Alignment means / survey

77c

reception area

78

measuring system

80

motherboard

82

transmission group

84

reception group

86

transmitting printed circuit board

88

transmitting chip

90

Transmission optics carrier

92

transmission optics

94

receiver board

96

receiving chip

98

Receiving optics carrier

100

receiving optics

102

adhesive

108

measuring system

110

motherboard

112

transmitting chip

114

receiving chip

116

optics carrier

118

receiving optics

120

transmission optics

122

adhesive

Claims (9)

LIDAR measuring system (78), comprising a fastening element (80), in particular a motherboard (80), a transmission board (86) on which a transmission chip (88) is arranged, a receiving board (94) on which a receiving chip (96) is arranged, - A transmission optical carrier (90) having a transmitting optics (92), and - A receiving optical carrier (98) having a receiving optical system (100), wherein - The transmission optical carrier (90) on the transmission board (86) is arranged and the receiving optical carrier (98) on the receiving board (94) is arranged and wherein - The transmission board (86) and the receiving board (94) are each arranged on the fastening element. LIDAR measuring system (78) according to any one of the preceding claims, characterized in that at least one fastening means (102) between two components of the measuring system (78) formed by adhesive (102). LIDAR measuring system (78) according to one of the preceding claims, characterized in that at least one of a plurality of fastening means (102), the functionally between a chip (88, 96) and the associated optics (92, 100), for example, the transmission chip (88) and the transmitting optics (92) is arranged, formed by an adhesive (102). LIDAR measuring system (78) according to any one of the preceding claims, characterized in that at least one of the chips (88, 96) in a recess of the associated board (86,94) are arranged. LIDAR measuring system (78) according to one of the preceding claims, characterized in that the transmitting board (86) and / or the receiving board (94) is arranged directly or indirectly on the respective optics carrier (90, 98). LIDAR measuring system (78) according to one of the preceding claims, characterized in that the transmitting board (86) and / or the receiving board (94) is arranged directly or indirectly on the fastening element (80). Method for assembling a LIDAR measuring system (78), - wherein a receiving optical carrier (98) is disposed on a receiving board (94) with a receiving chip (96), aligned and then attached, and - wherein a transmission optical carrier (90) on a transmission board (86) with a transmission chip (88) arranged, aligned and then one of the boards of the transmitter board (86) and receiver board (94) is aligned with the fastener (80) and then fastened, and then the other of the boards (86; 94) is attached to the fastener (80) ) and aligned with the chip (88; 96) of the other board (86; 94) and then fastened. Method for mounting a LIDAR measuring system (78), - Wherein a receiving optical carrier (98) on a receiving board (94) with a receiving chip (96) is arranged, aligned and then secured, and - wherein a transmission optical carrier (90) is arranged on a transmission board (86) with a transmission chip (88), aligned and then fixed, - Subsequently, the transmission board (86) and the receiving board (94) at the same time on the fastener (80) are arranged, aligned and then secured. Method according to one of the preceding Claims 7 or 8th , characterized in that two of the components of the measuring system (78) are secured together by pre-curing or curing an adhesive (102).

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