DE102018129885A1 - Composite and manufacturing-friendly waveguide couplers - Google Patents

Abstract

Embodiments include waveguide couplers and connectors (WLC) and a method of forming a WLC. The WLC includes a waveguide connector having a waveguide coupler, a taper, and a slotline signal transducer; and a balun structure on the slotline signal converter, wherein the taper is disposed on the slotline signal converter and a terminal end of the waveguide connector to form a channel and a tapered slot. The WLC may include the waveguide connector disposed on the housing and a waveguide coupled to the waveguide connector. The WLC may include composition pads and outer walls of the waveguide connector that are electrically coupled to the housing. The WLC can have the balun structure convert a signal into a slotline signal, and the waveguide coupler converts the slotline signal into a closed waveguide mode signal and emits the closed signal along the channel and propagates the closed signal along the tapered slot to the waveguide coupled to the waveguide connector.

Description

TERRITORY

Embodiments relate to semiconductor packaging. In particular, the embodiments relate to semiconductor packages having a waveguide coupler and connector.

BACKGROUND

As more and more devices are networked and users consume more data, the demands on servers accessed by users have risen accordingly and show no sign of slowing down in the near future. These requirements include increased data transfer rates, switching architectures that require longer interconnections, and extremely economical and low-power solutions.

Today, there are many interconnects within server and high performance computing (HPC) architectures. These interconnects include interconnections within a blade, interconnects within a rack, and rack-to-rack or rack-to-switch interconnects. In today's architectures, short interconnects (e.g. interconnects within a rack and some rack-to-rack) are achieved with electrical cables - e.g. Ethernet cable, coaxial cable, or double axial cable, depending on the required data rate. For longer distances, optical solutions are used due to the very long range and high bandwidth offered by fiber optic solutions. With the advent of new architectures, e.g. 100 Gigabit Ethernet, however, traditional electrical connections are becoming more and more expensive and power hungry to support the required data rates. For example, to extend the range of a cable or the given bandwidth on a cable, it may be necessary to use higher quality cables or apply advanced equalization, modulation and / or data correction techniques, adding power and latency to the system. For some of the distances and data rates required by proposed architectures, there is no viable electrical solution today. The optical transmission over fiber is able to support the required data rates and distances, but with a high power and cost burden, especially for short to medium distances, such. B. a few meters.

list of figures

• 1 ist eine perspektivische Ansicht eines Wellenleiterankoppler-Systems, das einen Wellenleiterverbinder, einen oder mehrere Gestapelt-Patch-Ankoppler und ein Gehäuse umfasst.
• 2A ist eine perspektivische Ansicht eines Wellenleiterankoppler-Systems, das ein Gehäuse mit einer ersten Schicht, einer zweiten Schicht und einer Mikrostreifen-Speiseleitung umfasst, gemäß einem Ausführungsbeispiel.
• 2B ist eine perspektivische Ansicht eines Wellenleiterankoppler-Systems, das ein Gehäuse mit einer ersten Schicht, einer zweiten Schicht und einer Mikrostreifen-Speiseleitung, und einen Wellenleiterverbindern mit einem Schlitzleitung-Signalwandler, einer Balunstruktur und einem Verjüngter-Schlitz-Ankoppler umfasst, gemäß einem Ausführungsbeispiel.
• 2C ist eine perspektivische Ansicht eines Wellenleiterankoppler-Systems, das ein Gehäuse mit einer ersten Schicht, einer zweiten Schicht und einer Mikrostreifen-Speiseleitung, und einen Wellenleiterverbinder mit einem Schlitzleitung-Signalwandler, einer Balunstruktur und einem Verjüngter-Schlitz-Ankoppler umfasst, gemäß einem Ausführungsbeispiel.
• 2D ist eine Querschnittsansicht eines Wellenleiterankoppler-Systems, das ein Gehäuse mit einer ersten Schicht, einer zweiten Schicht und einer oder mehreren dielektrischen Schichten umfasst, gemäß einem Ausführungsbeispiel.
• 3 ist eine detaillierte perspektivische Ansicht eines Wellenleiterankoppler-Systems, das ein Gehäuse mit einer ersten Schicht, einer zweiten Schicht und einer Mikrostreifen-Speiseleitung, und einen Wellenleiterverbindern mit einem Schlitzleitung-Signalwandler, einer Balunstruktur und einem Verjüngter-Schlitz-Ankoppler umfasst, gemäß einem Ausführungsbeispiel.
• 4A ist eine perspektivische Ansicht eines Wellenleiterankoppler-Systems, das einen Wellenleiterverbinder mit einer oder mehreren Kammern umfasst, gemäß einem Ausführungsbeispiel.
• 4B ist eine perspektivische Ansicht eines Wellenleiterankoppler-Systems, das ein Gehäuse mit einer ersten Schicht und einer zweiten Schicht umfasst, gemäß einem Ausführungsbeispiel.
• 4C ist eine Draufsicht und perspektivische Ansicht eines Wellenleiterankoppler-Systems, das ein Gehäuse mit einer ersten Schicht und einer zweiten Schicht, und einen Wellenleiterverbinder mit einem Schlitzleitung-Signalwandler, einer Balunstruktur, einem Verjüngter-Schlitz-Ankoppler und einer oder mehreren Zusammensetzungs-Anschlussflächen umfasst, gemäß einem Ausführungsbeispiel.
• 5A ist eine perspektivische Ansicht eines Wellenleiterankoppler-Systems, das einen Wellenleiterverbinder mit einer oder mehreren Kammern mit einer oder mehreren Verjüngungen umfasst, gemäß einem Ausführungsbeispiel.
• 5B ist eine perspektivische Ansicht eines Wellenleiterankoppler-Systems, das ein Gehäuse mit einer oberen leitfähigen Schicht, einer Balunstruktur und einer Mikrostreifen-Speiseleitung umfasst, gemäß einem Ausführungsbeispiel.
• 5C ist eine Querschnittsansicht eines Wellenleiterankoppler-Systems, das ein Gehäuse mit einer ersten Schicht, einer zweiten Schicht und einer oder mehreren dielektrischen Schichten umfasst, gemäß einem Ausführungsbeispiel.
• 6 ist eine perspektivische Ansicht eines Wellenleiterankoppler-Systems, das einen Wellenleiterverbinder mit einer oder mehreren Kammern mit einer oder mehreren gestuften Verjüngungen umfasst, gemäß einem Ausführungsbeispiel.
• 7 ist eine Querschnittsansicht eines Wellenleiterankoppler-Systems, das ein Gehäuse mit einer oberen leitfähigen Schicht, einem Verbindungspunkt und einer Mikrostreifen-Speiseleitung, und einen Wellenleiterverbinder mit einem Schlitzleitung-Signalwandler, einer Balunstruktur und einem Doppelt-Verjüngter-Schlitz-Ankoppler umfasst, gemäß einem Ausführungsbeispiel.
• 8 ist eine perspektivische Ansicht eines Vertikaler-Wellenleiterankoppler-Systems, das ein Gehäuse mit einer oberen leitfähigen Schicht und einer Mikrostreifen-Speiseleitung, und einen Wellenleiterverbinder mit einem Schlitzleitung-Signalwandler, einer Balunstruktur und einem Gespiegelt-Verjüngter-Schlitz-Ankoppler umfasst, gemäß einem Ausführungsbeispiel.
• 9 ist eine perspektivische Ansicht eines Vertikaler-Wellenleiterankoppler-Systems, das einen Wellenleiterverbinder mit einer oder mehreren als Array angeordneten Kammern mit einer oder mehreren Verjüngungen umfasst, gemäß einem Ausführungsbeispiel.
• 10A ist eine perspektivische Ansicht eines Vertikaler-Wellenleiterankoppler-Systems mit einem Wellenleiterverbinder, einer oder mehreren Verjüngungen und einer oder mehreren Balunstrukturen gemäß einem Ausführungsbeispiel.
• 10B ist eine Draufsicht eines Vertikaler-Wellenleiterankoppler-Systems mit einem Wellenleiterverbinder, einer oder mehreren Verjüngungen und einer oder mehreren Balunstrukturen gemäß einem Ausführungsbeispiel.
• 11A ist eine perspektivische Ansicht eines Vertikaler-Wellenleiterankoppler-Systems mit einem Wellenleiterverbinder, einer oder mehreren Verjüngungen und einer oder mehreren Balunstrukturen gemäß einem Ausführungsbeispiel.
• 11B ist eine Draufsicht eines Vertikaler-Wellenleiterankoppler-Systems mit einem Wellenleiterverbinder, einer oder mehreren Verjüngungen und einer oder mehreren Balunstrukturen gemäß einem Ausführungsbeispiel.
• 12 ist ein schematisches Blockdiagramm, das ein Computersystem veranschaulicht, das ein Bauelementgehäuse mit einem oder mehreren Wellenleiterankoppler-Systemen verwendet, gemäß einem Ausführungsbeispiel.

Embodiments described herein are illustrated by way of example and not limitation in the figures of the accompanying drawings in which like references indicate similar features. Further, some conventional details have been omitted so as not to obscure the inventive concepts described herein.

• 1 Figure 4 is a perspective view of a waveguide coupler system including a waveguide connector, one or more stacked patch couplers, and a housing.
• 2A FIG. 12 is a perspective view of a waveguide coupler system including a housing having a first layer, a second layer, and a microstrip feed line, according to one embodiment. FIG.
• 2 B Figure 4 is a perspective view of a waveguide coupler system including a housing having a first layer, a second layer, and a microstrip feed line, and a waveguide connector having a slotline signal converter, a balun structure, and a tapered slot coupler, according to an embodiment.
• 2C FIG. 12 is a perspective view of a waveguide coupler system including a housing having a first layer, a second layer, and a microstrip feed line, and a waveguide connector having a slotline signal converter, a balun structure, and a tapered slot coupler according to one embodiment. FIG.
• 2D FIG. 12 is a cross-sectional view of a waveguide coupler system including a package having a first layer, a second layer, and one or more dielectric layers, according to one embodiment.
• 3 FIG. 12 is a detailed perspective view of a waveguide coupler system including a housing having a first layer, a second layer, and a microstrip feed line, and a waveguide connector having a slotline signal converter, a balun structure, and a tapered slot coupler according to one embodiment ,
• 4A FIG. 12 is a perspective view of a waveguide coupler system including a waveguide connector having one or more chambers, according to one embodiment. FIG.
• 4B FIG. 12 is a perspective view of a waveguide coupler system including a housing having a first layer and a second layer. FIG Layer comprises, according to an embodiment.
• 4C FIG. 4 is a plan and perspective view of a waveguide coupler system including a housing having a first layer and a second layer, and a waveguide connector having a slotline transducer, a balun structure, a tapered slot coupler, and one or more composite pads; according to an embodiment.
• 5A FIG. 13 is a perspective view of a waveguide coupler system including a waveguide connector having one or more chambers with one or more tapers, according to one embodiment. FIG.
• 5B FIG. 13 is a perspective view of a waveguide coupler system including a housing having an upper conductive layer, a balun structure, and a microstrip feed line, according to one embodiment. FIG.
• 5C FIG. 12 is a cross-sectional view of a waveguide coupler system including a package having a first layer, a second layer, and one or more dielectric layers, according to one embodiment.
• 6 FIG. 13 is a perspective view of a waveguide coupler system including a waveguide connector having one or more chambers with one or more stepped tapers, according to one embodiment.
• 7 FIG. 12 is a cross-sectional view of a waveguide coupler system including a housing having an upper conductive layer, a connection point, and a microstrip feed line, and a waveguide connector having a slotline signal converter, a balun structure, and a dual tapered slot coupler according to one embodiment ,
• 8th FIG. 12 is a perspective view of a vertical waveguide coupling system including a housing having an upper conductive layer and a microstrip feed line, and a waveguide connector having a slotline signal converter, a balun structure, and a mirrored tapered slot coupler according to one embodiment. FIG ,
• 9 FIG. 12 is a perspective view of a vertical waveguide coupling system including a waveguide connector having one or more arrayed chambers with one or more tapers, according to one embodiment. FIG.
• 10A Figure 3 is a perspective view of a vertical waveguide coupling system having a waveguide connector, one or more tapers, and one or more balun structures according to one embodiment.
• 10B FIG. 10 is a top view of a vertical waveguide coupling system having a waveguide connector, one or more tapers, and one or more balun structures according to one embodiment. FIG.
• 11A Figure 3 is a perspective view of a vertical waveguide coupling system having a waveguide connector, one or more tapers, and one or more balun structures according to one embodiment.
• 11B FIG. 10 is a top view of a vertical waveguide coupling system having a waveguide connector, one or more tapers, and one or more balun structures according to one embodiment. FIG.
• 12 FIG. 10 is a schematic block diagram illustrating a computer system that utilizes a device package having one or more waveguide coupler systems, according to one embodiment.

DETAILED DESCRIPTION

Described herein are systems that include a waveguide coupler and connector for exciting waveguides. In particular, a waveguide coupler system, as described below, includes a housing having a microstrip feed line and one or more layers, and a waveguide connector having a slotline transducer, a balun (or dumbbell structure / aperture), and a tapered slot coupler , Also described below is a method of forming such a system, which includes placing a waveguide connector on a housing; aligning a microstrip feed line on the housing with a slotline transducer disposed on the waveguide connector; converting a microstrip signal of the microstrip feed line into a slot line signal having a balun structure arranged on the slot line converter; and propagating a closed waveguide mode signal with a tapered slot coupler disposed on the waveguide connector, the tapered slot coupler converting the slotline signal generated by the slotline transducer into the closed waveguide mode signal (eg, a TE10 Signal for an effectively coupled rectangular waveguide).

Accordingly, the waveguide coupler system described herein may be used to propagate the closed waveguide mode signal along a waveguide that is communicatively coupled to the tapered slot coupler and waveguide connector. In some embodiments, the waveguide connector may be a fully integrated and stand-alone SMT component (surface-mount technology) disposed on the package or a semi-integrated SMT component in which the slotline converter is coupled to the Structured / printed on the housing and then the semi-integrated SMT component is placed on the housing. These embodiments described herein enable the fabrication of lower cost and higher performance (performance) millimeter wave (mm-wave) waveguides using more common and less expensive dielectrics, further reducing the cost and performance requirements for data communication between server racks in Data centers and server farms.

In the following description, various aspects of the representative implementations will be described using terms commonly used by those skilled in the art to convey the content of their work to others of ordinary skill in the art. However, it will be apparent to those skilled in the art that the present embodiments may be practiced with only some of the aspects described. For purposes of explanation, certain numbers, materials and configurations are set forth in order to provide a thorough understanding of the illustrative implementations. However, it will be apparent to those skilled in the art that the present embodiments may be practiced without these specific details. In other instances, known features have been omitted or simplified so as not to obscure the representative implementations.

Again, various operations are described as multiple discrete operations in a manner most helpful to the understanding of the present embodiments, however, the order of the description should not be construed to imply that these operations are necessarily order-dependent. In particular, these operations are not required to be performed in the order of presentation.

As used herein, the terms "top," "bottom," "top, r, s," "bottom, r, s," "bottom, r, s," and "top, r, s" when used in relation to give one or more elements a relative and not absolute physical configuration. Thus, an element described in a device as a "topmost element" or "topping element" may instead form the "lowest element" or "bottom element" in the device when the device is reversed. Similarly, an element described in the device as the "lowermost element" or "lower element" may instead form the "topmost element" or "top element" in the device when the device is reversed.

As data transfer rates continue to increase, cost-effective and low-power solutions are required for communication between rack-mounted blades and adjacent racks. Such distances typically range from less than 1 meter to about 10 meters. The systems and methods disclosed herein utilize millimeter-wave (mm-wave) transceivers paired with waveguides to communicate data between blades and / or racks at transmission rates greater than 25 gigabits per second (Gbps). The mm-wave couplers used to transfer data may be located (or formed) in and / or on or around the semiconductor package. A major challenge is aligning the mm-wave coupler with the waveguide member to maximize energy transfer from the mm-wave coupler to the waveguide member. Further difficulties may arise when recognizing the wide variety of available waveguide members. Although metallic and metal coated waveguide members are predominant, such waveguide connectors may have rectangular, circular, polygonal, oval, and other shapes. These waveguide members may include hollow members, members having a conductive and / or nonconductive internal structure, and hollow members partially or completely filled with a dielectric material.

Ideally, however, such a positioning is often dictated by the shape and / or configuration of the waveguide system itself, the relatively small dimensions associated with the waveguide (e.g., 2 millimeters or less), the relatively tight tolerances required to maximize energy transfer are complex (eg, 100 microns or less) and precise positioning of the waveguide near a mm-wave coupler and connector, which is potentially hidden beneath the surface of the semiconductor package.

The systems and methods described herein are novel, novel, innovative and improved systems and methods for making, positioning, and coupling waveguides and waveguide connectors to semiconductor packages such that energy transfer from the mm-wave coupler and waveguide connector to the waveguide is enhanced, e.g. For example, about current patch and stacked patch emitter designs. The systems and methods described herein provide novel, novel, innovative, and improved systems and methods for manufacturing, positioning, and coupling waveguides and waveguide connectors to semiconductor packages that provide (i) greater bandwidth in thinner packages, (ii) higher coupler efficiency with the traveling wave coupler compared to more traditional structures using resonant patch couplers and (iii) enabling improved (and simpler) composition and fabrication of the coupler and connectorization (passport) system.

The systems and methods disclosed herein implement a novel coupler and waveguide connector for exciting mm-wave signals in waveguides, which waveguide connector may be a fully integrated and stand-alone surface mounted technology (SMT) component, which is then arranged and coupled to a semiconductor package becomes. As described herein, a waveguide coupler system may include a package having a microstrip feed line and one or more conductive layers, and a waveguide connector having a slotline signal converter, one or more balun structures, and one or more tapered slot couplers. In some embodiments, the waveguide coupling system helps to provide a power-saving solution that can support very high data rates, e.g. Over short to medium distances, which would be extremely advantageous for interconnections within server and HPC architectures and / or autonomous / self-propelled vehicles. Further, the waveguide coupler system includes tapered slot couplers and connectors for exciting the waveguides, allowing use of thin package substrates as the demand for miniaturization steadily increases.

For example, existing semiconductor package mounted couplers include a patch or stacked patch structure that is electrically coupled to the waveguide walls. Such "patch" or "stacked patch" installations suffer from limited bandwidth for thin semiconductor package substrates and thus use relatively thick semiconductor package substrates. Such thick semiconductor package substrates can cause manufacturing and compositional limitations. In addition, such waveguide / semiconductor patch systems are susceptible to waveguide alignment and conductive coupling to the signal generator in the semiconductor package.

The systems and methods described herein use a different type of excitation structure, a tapered slot coupler and connector compatible therewith, and arranged (assembled, placed, formed, etc.) on a package using conventional printed circuit board (PCB) manufacturing processes. ) can be. It should be understood that as used herein, a "tapered slot coupler and connector" (also referred to as a tapered slot waveguide coupler / connector, a tapered slot coupler, and / or a tapered slot connector, etc.) may be used ) may refer to a waveguide connector having a tapered slot coupler structure disposed within the one or more walls of the waveguide connector (eg, as in FIG 3 shown). It is further noted that the "tapered slot coupler and connector" may be a single, fully integrated SMT component or separate components that are assembled on the semiconductor package.

The tapered slot coupler systems described herein comprise a tapered slot coupler including at least one of a single planar slot / member (e.g., as in FIG 2-6 and 9 shown), and coplanar, spaced, first and second planar members that together form the tapered slot coupler (eg, as in FIG 7-8 and 10-11 shown). This horizontal and / or vertical tapered slot coupler and connector may be incorporated into a waveguide such that when the waveguide is conductively coupled to a semiconductor package, the tapered slot coupler and connector form a balun structure in a slotline signal converter which is aligned and disposed on the surface of the semiconductor package, wherein a microstrip signal may be sent from a microstrip feed line on the package to the balun structure on the slotline signal converter of the coupler / connector.

The tapered slot coupler converts a slotline signal provided by the slotline signal converter into a closed waveguide type signal that can propagate via a waveguide to other nodes. Tapered slot couplers advantageously provide greater bandwidth and higher energy efficiency than patch and stacked patch couplers. Such tapered slot couplers, as described below, may be advantageously combined to provide space-efficient two-dimensional and three-dimensional waveguide arrays significant advantage in the limits of a typical data center rack environment. Such tapered slot couplers described herein are also less sensitive to manufacturing tolerances. For example, compared to patch or stacked patch couplers, the systems and methods described herein advantageously provide increased bandwidth in a thinner package semiconductor. In addition, the systems and methods described herein can be advantageously adapted to dielectric waveguides through the use of 180 degree opposing slot couplers and can also be adapted to different waveguide geometries by adjusting the shape of the contour on the semiconductor package to match the geometry of the waveguide Waveguide match (eg as in 9-11 shown).

1 FIG. 12 is a perspective view of a waveguide coupling system. FIG 100 that has a waveguide connector 150 , one or more patch couplers 124 and 126 and a housing 130 includes. The waveguide coupler system 100 uses standard enclosures / PCB couplers, which are typically stacked patches 124 and 126 (or a patch) with the walls of the waveguide connector 150 are electrically coupled. The waveguide coupler system 100 can be a feed transmission line 140 (eg, feed from a semiconductor die) comprising a via feed structure 121 is electrically coupled, which also with the patch coupler 124 is electrically coupled to transmit a waveguide signal.

As previously mentioned, the waveguide coupler system suffers 100 when using a thin package substrate typically with a limited bandwidth, therefore, the package requires 130 using relatively thick substrates, resulting in various manufacturing and compositional limitations (e.g. 1 patch couplers typically sensitive to waveguide alignment and electrical contacts). Therefore, a new docking and connector architecture is needed to excite the waveguides, including an architecture that is also manufacturable and composition friendly, and provides a low-power solution that can support very high data rates over short to medium distances.

2A-2D illustrate a waveguide coupler system 200 with a housing 230 and a waveguide connector 250 , which is a tapered slot coupler 220 used to excite a waveguide, according to some embodiments. Additionally illustrate 2A-2D a fully integrated and stand-alone SMT waveguide connector 250 on the case 230 arranged and with a rectangular waveguide 254 connected is. The waveguide coupler system 200 includes the fully integrated SMT waveguide connector 250 with a waveguide coupler 220 , a rejuvenation 226 and a slot line signal converter 221 , The waveguide coupler system 200 also includes a balun structure 218 on the slotline signal converter 211 , wherein the rejuvenation 226 on the slotline signal converter 211 and a connection end 252 of the waveguide connector 250 is arranged to a channel 221 and a tapered slot 222 to build.

It should be noted that each of the 2A-2D a component of the waveguide coupling system 200 highlights (eg 2A shows the case, 2 B shows the alignment of a microstrip feed line of the housing and a slot line signal converter of the waveguide connector, 2C shows a tapered slot coupler 120 the waveguide connector disposed on an upper surface of the housing, and 2D shows one or more layers of the housing.)

Referring now to 2A FIG. 12 is a perspective view of a waveguide coupling system. FIG 200 shown. 2A shows a housing 230 with a microstrip feed line 240 , a first layer 212 and a second layer 210 according to an embodiment. In one embodiment, the first layer 212 on a section of the second layer 210 be arranged, wherein the first layer 212 may be any size and / or shape required (eg, based on the size and shape of the waveguide connector that is on the first layer 212 can be arranged). In one embodiment, the first layer 212 a solder mask and / or a dielectric layer (or the like). In one embodiment, the second layer is 210 an upper conductive layer (or an upper metal layer), the upper conductive layer being a ground (GND) plane layer (also referred to as a package GND). It should be noted that in one embodiment, the first layer 212 may be optional, therefore, the upper surface of the housing 230 the second layer 210 (one or more on the second layer 210 may comprise formed openings).

According to one embodiment, the housing 230 a semiconductor package, a package / substrate, a PCB, a motherboard, a high density interconnect (HDI) board, a ceramic substrate, or any organic semiconductor packaging substrate include, but are not limited to. In one embodiment, the housing is 230 a PCB. In one embodiment, the PCB is made of a FR-4 glass epoxy base with on both sides laminated thin copper foil (not shown). In certain embodiments, a multilayer PCB may be used (eg, as in FIG 2D shown) with preimpregnated (pre-preg) and copper foil (not shown) used to make additional layers. For example, the multilayer PCB may include one or more dielectric layers, where each dielectric layer may be a photosensitive dielectric layer (as in US Pat 2D shown). In some embodiments, holes (not shown) may be made in the housing 230 be bored. In one embodiment, the housing may 230 also include conductive copper traces, holes, metallic pads and vias (as in 2D shown).

The housing 230 may be a signal received from a source (eg, a die, a sensor, etc.) via the microstrip feed line 240 to a Balunstruktur 218 (eg, a dumbbell-shaped opening), which may be on a lower surface of a waveguide connector 250 is arranged (as in 2B-2C shown). As such, these can be found in 2A-2D illustrated embodiments of the waveguide connector 250 refer to a fully integrated SMT component using standard PCB composition techniques on the housing 230 can be composed. Alternatively, in other embodiments, a housing may send a signal received from a source via a microstrip feed line to a balun structure formed (or printed) on an upper surface of the housing (eg, as in FIG 5B-5C shown).

It should be noted that the waveguide coupling system 200 , as in 2A may include less or additional packaging components based on the desired packaging design.

2 B FIG. 12 is a perspective view of the waveguide coupling system. FIG 200 that the case 230 with the first layer 212 , the second layer 210 and the microstrip feed line 240 , and a waveguide connector 250 with a slotline signal converter 221 , a balancing structure 218 and a tapered slot coupler 220 comprises, according to an embodiment. In particular 2 B shows a connection point 219 who the microstrip feedline 240 of the housing 230 and the balustrade 218 on the slotline signal converter 211 of the waveguide connector 250 aligns. It should be understood that one or more known features may have been omitted or simplified so as not to obscure the representative implementations.

As in 2 B shown is the waveguide connector 250 a cladding consisting of one or more walls with an open end 154 is formed to effectively couple an external waveguide to the waveguide connector 150 accommodate. In one embodiment, the waveguide connector is 250 a fully integrated SMT component, therefore, has the lower surface of the waveguide connector 250 a slotline signal converter 211 on. In some embodiments, the waveguide connector 250 have any size, shape, physical geometry and / or physical configuration to effectively couple an external waveguide with the tapered slot coupler 220 to pair. In some embodiments, the waveguide connector 250 have one or more connection features around the entire or a portion of the open end 254 of the waveguide connector 250 are arranged. Such connection features may include mechanical latches, friction or resistance fit columns, alignment pins, wedge structures or similar structures, flared ends, high friction coatings or surface treatments, or combinations thereof. In some implementations, the external waveguide may be connected to the waveguide connector 250 be effectively coupled via a solder, a conductive adhesive or a similar conductive binder.

In one embodiment, the waveguide connector is 250 on the upper surface of the case 230 arranged to a connection point 219 align the microstrip feed line 240 of the housing 230 and the balustrade 218 on the slotline signal converter 211 aligns. The connection point 219 (or a feed point) may be a broadband radial stub termination that does not use any conductive via. In one embodiment, the waveguide connector 250 with the housing 230 using an opening (eg the opening 214 , as in 2D shown) on the first layer 212 be coupled to the outer walls of the waveguide connector 250 with the exposed second layer 210 coupled via the opening. In one embodiment, the outer walls of the waveguide connector 250 with the housing 230 coupled using solder paste printing, epoxy dispensing or the like.

After effectively coupling the waveguide connector 250 with the second layer 210 of the housing 230 The tapered slot coupler extends 220 at least partially in the waveguide connector 250 , The tapered slot coupler 220 may be a closed waveguide mode signal (as described below) from the signal passing through the microstrip feed line 240 is sent, and then can generate the closed waveguide mode signal along the Fiber connector 250 to the external waveguide (not shown). In some embodiments, the tapered slot coupler includes 220 a tapered slot based coupler. In other embodiments, a waveguide coupler may include a patch-based coupler, a tapered slot-based coupler, a stacked-patch coupler, a microstrip-to-slot transition coupler, a leaky-wave coupler, or any other mm-wave signal Coupling structure include, but are not limited to.

Although in 2 B and 2C shown as a rectangular waveguide connector, the waveguide connector 250 have any transverse geometric cross-section. In some embodiments, the first layer 212 of the housing 230 be physically adapted to one or more physical aspects (eg, the peripheral geometry) of the waveguide connector 250 correspond to. Thus, for example, if the waveguide connector 250 has a round or oval cross-section, the first layer 212 on the case 230 have a physical configuration that corresponds to the circumference of the waveguide connector 250 equivalent. In some embodiments, the waveguide connector 250 a hollow, electrically conductive waveguide connector (eg, a metallic waveguide connector). In other embodiments, the waveguide connector 250 a solid or hollow dielectric waveguide connector. In some embodiments, the waveguide connector 250 at least partially filled with one or more dielectric materials, which may also include metallic materials.

In one embodiment, the slotline signal converter comprises 211 a first electrically conductive member 211b (or a lower surface of the slotline signal converter) and a second electrically conductive member 211 (or an upper surface of the slotline signal converter) which are communicably coupled to each other. The first electrically conductive member 211b may be in, on, or around at least a portion of the first and / or second layers 212 and 210 of the housing 230 be arranged. The first electrically conductive member 211b is physically with the upper surface of the housing 230 coupled or otherwise attached to the same. The first electrically conductive member 211b may be communicatively coupled to one or more systems, structures, or components that are in, on, or around the housing 130 are arranged.

The slotline signal converter 211 includes a balun structure 218 to convert a signal received from a source into a slot line signal. In some embodiments, the balun structure may 218 a dumbbell, double lobed balustrade (or the like) and / or any other shapes, e.g. B. circular, rectangular, wedge-shaped, hexagonal, etc., have. In one embodiment, the shape of the balun structure 218 can be selected based on optimizing the performance given the available waveguide area. The first electrically conductive member 211b includes a balun structure having a first physical configuration and the second electrically conductive member 211 includes a balun structure with a second physical configuration. In some cases, the balun structure in the first electrically conductive member 211b the same as the balun structure in the second electrically conductive member 211 , In some cases, the balun structure may be in the first electrically conductive member 211b from the balun structure in the second electrically conductive member 211 differ.

The second electrically conductive member 211 is communicative with the tapered slot coupler 220 coupled. As in 2C includes the tapered slot coupler 220 a rejuvenation 226 that is physically and / or communicatively with the second electrically conductive member 211 coupled at a first location and extending diagonally to a second location on the upper interior wall of the waveguide connector 250 extends. In some embodiments, the taper is 226 arranged in a spaced arrangement to form a feed duct (eg, a feed duct 221 as in 3 shown) with the connection point 219 and the balustrade 218 to build. In embodiments, the taper 226 physically and / or conductive with the second electrically conductive member 211 at a first position in terms of balancing structure 218 and at a second location on the upper interior wall of the waveguide connector 250 in terms of balance structure 218 be coupled. In such embodiments, the first location and the second location may be opposite each other over (eg, on opposite sides of) the balun structure 218 be arranged (ie the rejuvenation 226 is based on the baluster structure 218 positioned). It should be noted that the tapered slot coupler 220 one or more coplanar tapered slots (eg as in 7 shown), and the rejuvenation 226 may be any size and / or shape based on the desired housing design and / or application.

The microstrip feed line 240 sets the signal to the balun structure 218 ready. In one embodiment, the connection point couples 219 the microstrip feed line 240 communicable with the balance structure 218 , The two cloths the balustrade 218 generate an impedance matched slotline signal. The tapered slot coupler 220 this changes through the balustrade 218 generated slot line signal into a closed waveguide mode signal (e.g., a TE10 signal for an effectively coupled rectangular waveguide) propagating along a waveguide (not shown) connected to the tapered slot coupler 220 via the waveguide connector 250 is effectively coupled. The traveling wave signal propagates along a slot channel (eg, a slot channel 221 out 3 ) and is provided by the tapered slot coupler 220 emitted. The traveling wave signal propagates along the waveguide associated with the tapered slot coupler 220 via the waveguide connector 250 is effectively coupled. As described herein, the waveguide may be at least one of a metallic waveguide, a dielectric waveguide, and a dielectric waveguide with a metallic coating (note that unlike data center applications, one embodiment may include using a non-metallic coated dielectric waveguide density and crosstalk are not a problem).

In some embodiments, the slotline signal converter converts 210 the microstrip signal from the microstrip feed line 240 into a slot line signal. The microstrip signal may be generated or otherwise created in some implementations and sent to the microstrip feed line 240 and then to the slotline signal converter 211 delivered by one or more components, such as a mm-wave die, mounted on the semiconductor package 230 arranged or communicably coupled thereto. In some embodiments, the microstrip signal may include, but is not limited to, a signal at a microwave frequency (eg, from about 30 GHz to about 300 GHz). It should be noted that other signal frequencies can be used for the same effect.

In one embodiment, the slotline signal converter 211 have any shape, size or configuration. As described above, in some embodiments, the slotline signal converter 211 with the tapered slot coupler 220 and the waveguide connector 250 be formed (and integrated). In alternative embodiments, the slotline signal converter 211 on an upper surface of a housing (eg, as in FIG 5B shown) or formed as a separate component, which can then be stacked with a housing and a waveguide connector. In some embodiments, the first electrically conductive member 211b on the upper surface of the case 230 be formed, structured or otherwise arranged. In other embodiments, the first electrically conductive element 211b on the upper surface of the case 230 disposed and conductively and / or physically coupled to one or more electrical contacts (eg, vias, pads, pads, or similar electrically conductive structures) disposed on the upper surface of the housing 230 are arranged. In such embodiments, the first electrically conductive member 211b be physically and conductively coupled to one or more electrical contacts via solder, an electrically conductive adhesive, or similar electrically conductive bonding or attachment systems and methods. In other embodiments, the first requires electrically conductive member 211b and the upper surface of the housing 230 no conductive connection (ie there is no need for any conductive connection under the body of the SMT component). It should be noted that, as described below in 2C described, the waveguide coupling system 200 one or more composition pads (e.g., compound pads 205 from 2C) may comprise, on one or more outer walls of the waveguide connector 250 are arranged, which can be used to the housing 230 and the waveguide connector 250 to couple electrically.

The slotline signal converter 211 converts the received microstrip signal into a slotline mode signal (ie, two impedance matched signals) using the balun structure 218 around. The Balun structure 218 can be a double-lobed or dumbbell-shaped balustrade 218 have, as in 2 B and 2C shown. The Balun structure 218 can receive the input microstrip signal at a central location on the structure, e.g. B. a connection point 219 , The open spaces in the balustrade 218 provide an impedance matched slotline signal to the communicably coupled slotline signal converter 211 is communicated. In some embodiments, where the slotline signal converter 211 a single member with the first electrically conductive member 211b and the second electrically conductive member 211 is, can the balustrade 218 symmetrical across the thickness of the slotline signal converter 211 (ie the physical configuration of the balun structure 218 on the upper surface and the lower surface of the slotline signal converter 211 can be identical). In some embodiments, the balun structure may 218 asymmetric across the thickness of the slotline signal converter 211 (ie the physical configuration of the balun structure 218 on the upper surface and the lower surface of the slotline signal converter 211 can be different).

The Balun structure 218 may comprise a double-lobed structure with symmetrical or asymmetrical lobes of any physical configuration. As such, the lobes that form the balustrade can 218 be semi-circular, circular, semi-oval, oval, semi-polygonal, polygonal, rectangular, wedge-shaped, hexagonal, etc. to optimize performance in view of the available waveguide area. The physical dimensions and / or configuration of the lobes that make up the balun structure 218 may be based in whole or in part on the operating frequency and / or the frequency range of the microstrip signal passing through the microstrip feed line 240 to the slotline signal converter 211 is delivered.

In one embodiment, the tapered slot coupler operates 220 with the rejuvenation 226 from the propagation axis of the slot line mode signal passing through the balun structure 218 (and the feed channel) is provided via to another propagation axis (eg, to the axis that is the open end) 254 the waveguide connector) and converts the signal into the closed waveguide mode signal propagating along a waveguide (not shown). In some embodiments, the propagation axis of the closed waveguide mode signal may be parallel to the outer surface of the semiconductor package 130 his. In some embodiments, the propagation axis of the closed waveguide mode signal may be with a longitudinal axis of the waveguide connector 250 be aligned with or be parallel to the, with the traveling wave Ankoppler system 200 is coupled.

It should be noted that the waveguide coupling system 200 , as in 2 B may include less or additional packaging components based on the desired packaging design.

2C FIG. 12 is a perspective view of the waveguide coupling system. FIG 200 that the case 230 with the first layer 212 , the second layer 210 and the microstrip feed line 240 , and a waveguide connector 250 with a slotline signal converter 211 , a balancing structure 218 and a tapered slot coupler 220 comprises, according to an embodiment. In particular shows 2C the internal structure of the tapered slot coupler 220 and the waveguide connector 250 ,

As previously mentioned, the tapered slot coupler implements 220 on the waveguide connector 250 another excitation structure, z. By using a tapered slot feed channel. The tapered slot feed channel (eg, the feed channel 221 from 3 ) comes with a microstrip feed line 240 fed with a radial stub, z. B. the connection point 219 Completes without the use of any conductive vias. In one embodiment, the microstrip feed line is 240 on a housing layer (eg the second layer 210 of the housing 230 ) using a process compatible with standard PCB manufacturing. As such, the compound structure of the tapered slot coupler allows 220 , the waveguide connector 250 and the housing 230 an inherently wider bandwidth and is significantly less sensitive to manufacturing tolerances. It should be understood that, as shown in more detail below, the tapered slot coupler and connector may either be a stand-alone SMT component disposed on top of the housing, or partially textured on the housing and partially topped on the housing can be composed.

In some embodiments, the on the slotline signal converter 211 arranged balustrade 218 used to provide impedance matching (ie, the balun structure 218 is used as the inductive load for the slot line mode signal). Using the Rejuvenated Slot Coupler 220 The slot line mode signal is transmitted through a feed channel (e.g., feed channel 221 from 3 ) in a vertical direction (ie perpendicular to the housing 230 ) and through the rejuvenation 226 Thus, the slot line mode signal is thus converted into the closed waveguide mode signal (e.g., TE10 for the rectangular waveguide). In some embodiments, the taper 226 be formed with straight lines (eg as in 2C . 3 . 4C and 5A shown). In other embodiments, the taper 226 be formed with multiple shapes / types of tapers (eg, stepped tapers, exponential, square, elliptical, etc.) to improve the performance and / or manufacturability of the waveguide connector 250 to optimize.

In addition, as mentioned above, considering the manufacturing and composition constraints, the slotline signal converter 211 and the balustrade 218 either as a component on the upper layer of a housing (eg, as in FIG 5B shown) or as a component of a fully integrated and self-contained SMT component (eg, which forms the bottom surface of the SMT component) that are directly on top of the package 230 , as in 2C shown, arranged / assembled. It should be noted that in both variants, for example, it is necessary that the body of the component with the second layer 210 of the housing 230 (ie the chassis GND) using a conductive epoxy and composition pads 205 (eg as in 4C shown) is electrically coupled.

In other embodiments, there is no need for any conductive connection under the body of the SMT component (eg, below the bottom surface of the tapered slot coupler 220 and the waveguide connector 250 ), which may facilitate the composition because the component is similar to any other standard SMT component. The composition pads 205 (or legs / pins) around the outer wall (s) of the waveguide connector 250 can be used to make a simpler composition on the case 230 using standard SMT composition methods (or the like). In addition, the composition pads 205 to be used for self-alignment during a remelting composition. It should be understood that a single waveguide connector (eg, the waveguide connector 250 ) can also be arranged as an array for exciting more than one waveguide (as in 4-6 shown).

In addition, the one or more components of the waveguide coupling system 200 additionally be overmoulded. Using an overmolding process may be advantageous because the fitting structures of the system 200 , z. Alignment pins, key features and the like may be enabled on the molding material to allow proper mating between the waveguide and connector (e.g., a male-female mating approach).

It should be noted that the waveguide coupling system 200 , as in 2C may include less or additional packaging components based on the desired packaging design.

2D is a cross-sectional view of a portion of the housing 230 of the waveguide coupling system 200 , In one embodiment, the housing includes 230 the first layer 212 , the second layer 210 and one or more dielectric layers 207 according to an embodiment.

As in 2D shown, the first layer 212 on the second layer 210 be arranged and structured to an opening 214 to build. The opening 214 the first layer 212 is formed to the second layer 210 (the package GND) and the outer walls of the waveguide connector (not shown) using a solder paste printing process, a conductive epoxy dispensing process, or any similar process. In one embodiment, the first layer 212 a solder mask, a resist layer, and / or any other dielectric layer. It should be noted that the first layer 212 may be optional because the upper surface of the housing 230 the second layer 210 according to this optional implementation.

In one embodiment, the housing 230 one or more dielectric layers 207 which surround (arrange and / or are adjacent to) the one or more conductive layers, the second layer 210 the upper conductive layer is the GND level of the housing 230 forms. According to this embodiment, using a fully integrated SMT waveguide connector (eg, the waveguide connector 250 from 2B-2C who liked the Balun structure 218 on the bottom surface of the connector 250 includes) the housing 230 a connector connection area 203 which is used as the surface area / location where the SMT waveguide connector may be arranged.

For example, the connector connection area 203 between a mass via wall 209 and the second layer 210 be formed, with the mass via wall 209 formed around the circumference / contour of the waveguide connector and with at least one or more conductive layers of the housing 230 can be electrically coupled. In another embodiment, the housing 230 have a different architecture (eg as in 5C shown), if the SMT connector has no balun structure on the lower surface (and thus the SMT connector is partially integrated, since the balun structure on the second layer 210 the housing is formed / printed). In addition, the one or more composition pads 205 of the waveguide connector 250 on at least one or more openings 214 on the case 230 and then a reflow process can be used to seal the outer surface wall (s) of the connector 250 with the housing ground on the housing 530 electrically couple (and / or install).

It should be noted that the waveguide coupling system 200 , as in 2D may include less or additional packaging components based on the desired packaging design.

3 Figure 4 is a more detailed perspective view of the waveguide coupler system 200 that the case 230 with the first layer 212 , the second layer 210 and the microstrip feed line 240 , and the waveguide connector 250 With the slotline signal converter 211 , the balustrade structure 218 and the tapered slot coupler 220 comprises, according to an embodiment. In 3 is the waveguide coupler system 200 with a close-up of the tapered slot coupler 220 and the waveguide connector 250 shown. It should be noted that the waveguide coupling system 200 from 3 may be the same as the waveguide coupler system 200 from 2A-2D , It should also be understood that one or more known features may have been omitted or simplified so as not to obscure the representative implementations.

In one embodiment, the waveguide coupler system includes 200 a fully integrated SMT component, using standard PCB composition techniques on the housing 230 can be composed and arranged. The fully integrated SMT component can be the tapered slot coupler 220 include, in, on or around at least a portion of the inner cladding (or surfaces) of the waveguide connector 250 (ie, the tapered slot coupler is integral with the waveguide connector 250 formed), and the slot line signal converter 211 with the balustrade 218 also in, on or around the bottom surface of the waveguide connector 250 are arranged.

As in 3 As shown, the composition / fabrication of each of these components as a single, fully integrated and discrete SMT component allows for an improved (and facilitated) assembly and fabrication process for a waveguide coupler / connector system 200 , In some embodiments, the rejuvenation 226 of the tapered slot coupler 220 and the slotline signal converter 211 arranged in a spaced arrangement to a feed channel 221 to build. The feeding channel 221 aligns with a central section of the balustrade 218 of the slotline signal converter 211 and receives a microstrip signal from the microstrip feed line 240 , The slotline signal converter 211 then converts the microstrip signal using the balun structure 218 in a slot line mode signal and transmits the slot line mode signal via the feed channel 221 , Using the rejuvenation 226 go the tapered slot coupler 220 from the propagation axis of the slotline mode signal passing through the feed channel 221 is provided to another propagation axis toward the open end 254 of the waveguide connector 250 , The tapered slot coupler 220 has a tapered slot 222 on that with the rejuvenation 226 and the second electrically conductive member 211 of the slotline signal converter 211 is formed.

The tapered slot coupler 220 that transforms through the channel 221 fed slot conductor mode signal into a closed waveguide mode signal propagating along a waveguide (not shown). In some embodiments, the taper 226 of the tapered slot coupler 220 electrically isolated, using z. As a thin insulator, a dielectric layer or a similar material. In some embodiments, the waveguide coupling system 200 be formed using one or more different manufacturing / composition processes, for. Computer numerical control or micro-CNC with optional subsequent plating, metal injection molding, metal three-dimensional (3D) printing, plastic injection molding with metal coating and / or plastic 3D printing (temperature resistant) with metal coating. It should be understood that in addition, these manufacturing / assembly processes may then be followed by an overmolding process to allow for proper mating between the waveguide and connector. It is further noted that the waveguide coupler system 200 may be shaped to have any size and / or shape based on the desired packaging design and application (eg, dimensions may be based on operating frequency (eg, when operating at about 60 GHz, the dimensions may be approximately 2.5 mm × 2.5 mm, 3.5 mm × 1.75 mm and / or 4 mm × 2 mm, etc., and / or operating at about 120 GHz, the dimensions may be about 1.7 mm × 0.85 mm and / or 2 mm × 1 mm, etc.), which may vary from a few mm to centimeters (cm), for example, and / or the wall thicknesses (may, for example, vary) vary from less than 50 μm to several mm).

It should be noted that the waveguide coupling system 300 may include less or additional packaging components based on the desired packaging design.

4A-4C illustrate a waveguide coupler system 400 with a housing 430 and a waveguide connector 450 using a tapered slot coupler 420 used to excite a waveguide, according to some embodiments. Additionally illustrate 4A-4C a fully integrated and stand-alone SMT waveguide connector 450 on the case 230 is arranged. The waveguide coupler system 400 can the waveguide coupler system 200 from 2A-2D be similar, but the waveguide coupling system 400 includes a fully integrated and patterned SMT waveguide coupler 450 arranged as an array for exciting more than one waveguide (not shown). It should be noted that each of the 4A-4C a component of the waveguide coupling system 400 highlights (eg 4A shows the waveguide connector 450 . 4B shows the case 430 and 4C shows a chamber of the waveguide connector 450 placed on an upper surface of the housing 430 using a conductive layer 406 and one or more composition pads 405 is arranged.)

Referring now to 4A FIG. 12 is a bottom perspective view of the waveguide connector. FIG 450 of the waveguide coupling system 400 shown. The waveguide connector 450 has one or more chambers (or sheaths) 450a-c that may be used to excite one or more waveguides. The waveguide connector 450 can the waveguide connector 250 from 2A-2D be similar, but, as in 4A shown, the waveguide connector 450 three chambers 450a-c on, each of the waveguide chambers 450a-c an individual / separate waveguide coupler. It should be noted that the waveguide connector 450 based on the desired packaging design may have any number of chambers.

The waveguide connector 450 has a lower surface 460 and an upper surface 461 on. The waveguide connector 450 includes one or more Balunstrukturen 418 on the bottom surface 460 are arranged. As mentioned above, each of the chambers 450a-c be used as a separate waveguide connector, each of the chambers 450a c a tapered slot coupler and a slot transducer with one of the balun structures 418 (eg, as in 4C shown). Each of the chambers 450a-c can be used to propagate a closed waveguide mode signal via a waveguide with an open end 454 communicatively coupled, in each of the chambers 450a-c is formed.

In some embodiments, the waveguide connector 450 one or more composition pads 405 include on one or more outer walls of the waveguide connector 450 are arranged. The one or more composition pads 405 can be used to connect the waveguide 450 and the case 430 align and electrically couple. The one or more composition pads 405 can on the case 430 and then a reflow process (or the like) may be used to seal the outer surface wall (s) of the connector 450 with a housing ground on the housing 430 electrically couple (and / or attach) (as in 4C shown).

It should be noted that the waveguide coupling system 400 , as in 4A may include less or additional packaging components based on the desired packaging design.

4B is a perspective view from the top of the housing 430 of the waveguide coupling system 400 , The housing 430 includes a first layer 412 and a second layer 210 according to an embodiment. In one embodiment, the first layer 412 on a section of the second layer 410 be arranged, wherein the waveguide connector 450 on the first layer 412 can be arranged (as in below 4C shown). In one embodiment, the first layer 412 a solder mask and / or a dielectric layer. In one embodiment, the second layer is 410 an upper conductive layer, wherein the upper conductive layer is a GND level layer. It should be noted that in one embodiment, the first layer 412 may be optional, therefore, the upper surface of the housing 430 the second layer 410 ,

It should be noted that the waveguide coupling system 400 , as in 4B may include less or additional packaging components based on the desired packaging design.

4C Figure 11 is a top perspective view of the waveguide coupler system 400 that the case 430 with the first layer 412 and the second layer 410 , and the waveguide connector 450 with a slotline signal converter 411 , a balancing structure 418 and a tapered slot coupler 420 comprises, according to an embodiment. In particular shows 4C the internal structure of the tapered slot coupler 420 and the waveguide connector 450 , It should be understood that one or more known features may have been omitted or simplified so as not to obscure the representative implementations (eg, the waveguide connector 450 one or more chambers 450a-c but for the sake of simplicity, there is only one chamber of the waveguide connector 450 shown).

In one embodiment, the waveguide connector is 450 on a section of the first layer 412 arranged. It may be necessary for the body of the waveguide connector 450 with the housing GND (eg the second layer 410 ) using the conductive layer 406 (or a conductive epoxy layer) and the composition pads 405 is coupled. For example, the conductive layer 406 on one or more outer walls of the waveguide connector 450 or under the lower surface 460 of the waveguide connector 450 be arranged. The conductive layer 406 and the composition pads 405 may be disposed on one or more openings (not shown) of the housing that are exposed to the package GND such that the conductive layer 406 and the composition pads 405 can be remelted to the connector 450 with the housing GND of the housing 430 to couple electrically. The conductive layer 406 and the composition pads 450 around the SMT waveguide connector 450 can form a simpler composition on the housing 430 facilitate (e.g., using standard SMT composition procedures) and can be used for self-alignment during the remelting / process.

The housing 430 may include a microstrip feed line which provides a signal to the balun structure 418 which transmits on the slotline signal converter 411 is arranged. The tapered slot coupler 420 can have a feeding channel 421 to receive the microstrip signal terminated with a broadband radial stub. The Balun structure 418 on the slot line signal converter 411 may be used to provide impedance matching and to convert the microstrip signal into a slotline mode signal. Using the Rejuvenated Slot Coupler 420 becomes the slot line mode signal through a feed channel 421 sent and through the tapered slot coupler 420 wherein the slot line mode signal is converted to a closed waveguide mode signal for transmission along an open end 454 of the connector 450 to an external waveguide (not shown).

It should be noted that the waveguide coupling system 400 , as in 4C may include less or additional packaging components based on the desired packaging design.

5A-5C illustrate a waveguide coupler system 500 with a housing 530 and a waveguide connector 550 containing one or more tapered slot couplers 520 used to excite one or more waveguides, according to some embodiments. Additionally illustrate 5A-5C a semi-integrated SMT waveguide connector 550 on the case 530 is arranged. The waveguide coupler system 500 can the waveguide coupling system 400 from 4A-4C be similar, but the semi-integrated SMT waveguide connector 550 is only with one or more rejuvenation slots 526 integrated (or structured / formed) while the other components (eg the Balunstrukturen 518 ) on an upper surface layer 510 of the housing 530 are arranged / printed. The waveguide coupler system 500 includes the semi-integrated SMT waveguide connector 550 with a waveguide coupler 520 and a rejuvenation 526 , The waveguide coupler system 500 also includes the housing 530 with a balance structure 518 on an upper surface 510 of the housing 530 , where the balustrade 518 on the upper surface 510 of the housing 530 is arranged to a slot line signal converter 511 to form, and the waveguide connector 550 is on the upper surface 510 of the housing 530 arranged. The rejuvenation 526 of the waveguide connector 552 can on the slot line signal converter 511 of the housing 530 and a terminal end of the waveguide connector 550 be arranged to a channel 521 and a tapered slot 522 to build.

It should be understood that similar composition techniques (eg, using solder, composition pads, and / or conductive epoxy layers), as described in U.S. Pat 4C shown with the waveguide coupling system 500 from 5A-5C can be used. It should also be noted that each of the 5A-5C a component of the waveguide coupling system 500 highlights (eg 5A shows the waveguide connector 550 . 5B shows the case 530 and 5C shows the one or more layers, vias and openings of the housing 530 .)

Referring now to 5A Figure 11 is a top perspective view of the waveguide connector 550 of the waveguide coupling system 500 shown. The waveguide connector 550 has one or more chambers 550a-c which can be used to excite one or more waveguides. The waveguide connector 550 can the waveguide connector 450 from 4A-4C be similar, but the waveguide connector 550 has a lower surface 560 not integrated with the balun structures and the slotline signal converter. Instead, as in 5B shown the balustrade 518 on the upper layer 510 of the housing 530 arranged.

The waveguide connector 550 has the bottom surface 560 and an upper surface 561 on. The lower surface 560 can be the bottom surfaces of the rejuvenations 526 and the outer / inner walls of the waveguide connector 550 include. As mentioned above, each of the chambers 550a-c be used as a separate waveguide connector, each of the chambers 550a-c may have at least one tapered slot coupler. Each of the chambers 550a-c can be used to propagate a closed waveguide mode signal via a waveguide with an open end 554 communicatively coupled, in each of the chambers 550a-c is formed. In some embodiments, the waveguide connector 550 one or more composition pads 505 include on one or more outer walls of the waveguide connector 550 are arranged. The one or more composition pads 505 can be used to connect the waveguide 550 , the balustrade 518 and the case 530 align and electrically couple.

It should be noted that the waveguide coupling system 500 , as in 5A may include less or additional packaging components based on the desired packaging design.

5B is a perspective view from the top of the housing 530 of the waveguide coupling system 500 , The housing 530 has a microstrip feed line 540 , a balancing structure 518 and an upper conductive layer 510 on. It should be understood that one or more known features may have been omitted or simplified so as not to obscure the representative implementations (eg, a first layer or solder mask, which is optional, may not be shown for simplicity).

In one embodiment, the upper conductive layer comprises 510 a GND level layer. In one embodiment, the balun structure is 518 on the upper conductive layer 510 formed (or structured / arranged), which also has a slot line converter on the housing 530 forms. As such, the microstrip feed line 540 a signal to the Balunstruktur 518 feed on the slot line converter. The slot line converter of the housing 530 may translate (and convert) the signal into a slotline signal and send the slotline signal to be aligned with or parallel to a z-axis. In one embodiment, the upper conductive layer 510 on or above the microstrip feed line 540 be arranged. In another embodiment, the lower surface 560 of the waveguide connector 550 (as in 5A shown) directly on the upper conductive layer 510 of the housing 530 be arranged, wherein the waveguide connector 550 now on each end, except for the one open end 554 , can be wrapped.

It should be noted that the waveguide coupling system 500 , as in 5B may include less or additional packaging components based on the desired packaging design.

5C is a cross-sectional view of a portion of the housing 530 of the waveguide coupling system 500 , In one embodiment, the housing may 530 a first layer 512 , a second layer 510 and one or more dielectric layers 507 according to one embodiment. The housing 530 can the housing 230 from 2D be similar, but in this embodiment, the housing 530 for a waveguide connector (eg waveguide connector 550 ) which does not include a balun structure on the bottom surface of the connector (hence, the balun structure is on the second layer 510 (or the top metal layer printed / patterned).

As in 5C shown, the first layer 512 on the second layer 510 be arranged and structured to an opening 514 to build. The opening 514 the first layer 512 is formed to the second layer 510 (the package GND) and the outer walls of the waveguide connector (not shown) using a solder paste printing process, a conductive epoxy dispensing process, or any similar process. In one embodiment, the first layer 512 a solder mask, a resist layer, and / or any other dielectric layer. It should be noted that the first layer 512 may be optional, thus, the upper surface of the housing 530 the second layer 210 according to this optional implementation.

In one embodiment, the first layer 512 and the second layer 510 both structured to an opening 515 and a connector terminal area 503 to build. The opening 515 may be used and patterned (eg, with a dumbbell-shaped opening) to form a beam structure for a slotline transducer on the upper surface of the housing 530 to implement. In one embodiment, the housing 530 one or more dielectric layers 507 which surround (arrange and / or are adjacent to) the one or more conductive layers, the second layer 510 the upper conductive layer is the GND level of the housing 530 forms. According to this embodiment using a semi-integrated SMT waveguide connector (eg, the waveguide connector 550 from 5A that does not have a baluster structure on the bottom surface of the connector 550 includes) the housing 530 the connector connection area 503 which is used as the surface area / location where the SMT waveguide connector may be arranged.

For example, the connector connection area 503 a section on the second layer 510 between an edge of the first layer 510 and a mass via wall 509 be assigned, with the upper pad of the ground via-wall 509 with the second layer 510 coupled and formed around the perimeter / contour of the waveguide connector to connect to at least one or more conductive layers of the housing 530 to couple electrically. In another embodiment, the housing 530 have a different architecture (eg as in 2D shown) when the SMT connector has no balun structure on the bottom surface (and thus the SMT connector is fully integrated since the balun structure is formed / printed on the bottom surface of the SMT connector). In addition, the one or more composition pads 505 of the waveguide connector 550 on at least one or more openings 514 on the case 530 and then a reflow process can be used to seal the outer surface wall (s) of the connector 550 with the housing ground on the housing 530 electrically couple (and / or install).

It should be noted that the waveguide coupling system 500 , as in 5C may include less or additional packaging components based on the desired packaging design.

6 FIG. 12 is a perspective view of a waveguide coupling system. FIG 600 with a waveguide connector 650 , which utilizes one or more tapered slot couplers to excite one or more waveguides, in accordance with some embodiments. The waveguide coupler system 600 illustrates a semi-integrated SMT waveguide connector 650 (eg the SMT waveguide connector 550 from 5A) , The waveguide coupler system 600 can the waveguide coupling system 400 from 4A-4C be similar, but the semi-integrated SMT waveguide connector 650 is only with one or more rejuvenation slots 626 while the other components (eg, a balun structure) may be disposed on an upper surface layer of a housing. Likewise, the waveguide coupling system 600 the waveguide coupling system 500 from 5A-5C be similar, but the semi-integrated SMT waveguide connector 650 includes a rejuvenation 626 , which has a stepped-tapered shape that is used to improve the performance and / or manufacturability of the waveguide coupling system 600 to optimize. It should be understood that similar composition techniques (eg, using solder, composition pads, and / or conductive epoxy layers), as described in U.S. Pat 4C shown with the waveguide coupling system 600 can be used.

As in 6 is a bottom perspective view of the waveguide connector 650 of the waveguide coupling system 600 shown. The waveguide connector 650 has one or more chambers 650a-c which can be used to excite one or more waveguides. The waveguide connector 650 has a lower surface 660 and an upper surface 661 on. The lower surface 660 can be the bottom surfaces of the rejuvenations 626 and the outer / inner walls of the waveguide connector 650 include. As mentioned above, each of the chambers 650a-c be used as a separate waveguide connector, each of the chambers 650a-c a tapered slot coupler with a stepped taper 626 may include.

The stepped rejuvenation 626 may be structured to have one or more stepped edges on the taper, for example, wherein the outer stepped edges are structured between a protruding inner step. It is noted that a stepped taper may have a plurality of steps (or edges). As in 6 shows, for example, the stepped taper 626 three stages, but other embodiments may include more or less than three stages as needed. In addition, the waveguide connector 650 comprise one or more different types of tapers (eg, straight lines, exponential, square, elliptical, double-fingered, etc.) comprising structuring one or more different types of tapers for at least one or more of the chambers 650a-c (ie the chamber 650a may have a stepped taper, 650b may have a double-finned taper, and 650c may have an elliptical taper).

Each of the chambers 650a-c can be used to propagate a closed waveguide mode signal via a waveguide with an open end 654 communicatively coupled, in each of the chambers 650a-c is formed. In some embodiments, the waveguide connector 650 one or more composition pads 605 include on one or more external walls of the Fiber connector 650 are arranged. The one or more composition pads 605 can be used to connect the waveguide 650 align with a housing and electrically couple.

It should be noted that the waveguide coupling system 600 may include less or additional packaging components based on the desired packaging design.

7 FIG. 12 is a cross-sectional view of a waveguide coupling system. FIG 700 that is a case 730 with an upper conductive layer 710 and a microstrip feed line 740 , and a waveguide connector 750 with a slotline signal converter 711 , a balancing structure 718 and a tapered slot coupler 720 comprises, according to an embodiment. The waveguide coupler system 700 can the waveguide coupling system 200 and from 2-3 be similar, but the waveguide coupling system 700 has the tapered slot coupler 720 on, the two coplanar members (twin-finger taper slots or coplanar panels), a first member 724 that is physically and / or communicably with an upper surface of the slotline transducer 711 coupled at a first location, and a second member 726 also physically and / or communicably with the top surface of the slotline transducer 711 coupled at a second location. It should also be understood that one or more known features may have been omitted or simplified so as not to obscure the representative implementations.

In some embodiments, they are a planar first member 724 and a planar second member 726 coplanar arranged in a spaced arrangement around a feed duct 721 and a tapered slot 722 to build. In embodiments, the first member 724 physically and / or conductive with the top surface of the slotline transducer 711 at a first position in terms of balancing structure 718 be coupled and the second member 726 may be physically and / or conductively connected to the top surface of the slotline transducer 711 in a second place with respect to the balustrade 718 be coupled. In such embodiments, the first location and the second location may be opposite each other over (eg, on opposite sides of) the balun structure 718 be arranged.

The first member 724 and the second member 726 may be planar members that are coplanar with each other (ie, the first member 724 and the second member 726 may be in the same plane or otherwise dropped in the same plane) to a double-ended tapered slot coupler 720 within the waveguide connector 750 to build. The first edge of the first song 724 may be near the top surface of the slotline signal converter 711 be arranged. The first edge of the first song 724 may be physically and / or conductively connected to the top surface of the slotline transducer 711 be coupled. The second edge of the first song 724 may be at least a portion of a boundary, boundary or circumference of the tapered slot 722 form. Accordingly, the first edge of the second member 726 near the waveguide connector 750 be arranged. The first edge of the second member 726 may be physical and / or conductive with the waveguide connector 750 be coupled. The second edge of the second member 726 may be at least a portion of a boundary, boundary or circumference of the tapered slot 722 form.

In such embodiments, the second edge of the first member form 724 and the second edge of the second member 726 a tapered slot 722 , The second edge of the first song 724 and the second edge of the second member 726 may extend at an angle such that at a first end of the tapered slot 722 the second edges are arranged relatively closer to each other than at an opposite second end of the tapered slot 722 wherein the second edges are relatively remotely located (ie, the tapered angle of the tapered slot 722 is the smaller, the closer the second edges of the first and second member 724 and 726 at a feed channel 721 are. In embodiments, the first member 724 and the second member 726 using the tapered slot coupler 720 form, via the waveguide connector 750 which is on the upper conductive layer 710 (Enclosure GND) of the housing 730 is arranged, with a ground plane of the housing 730 connected to ground. In other embodiments, the first member may 724 and the second member 726 using the tapered slot coupler 720 form, directly or indirectly with the ground plane of the housing 730 be coupled.

In some embodiments, the second edge of the second member may 724 and / or the second edge of the second member 726 a straight edge, a stepped edge, a curved edge, an elliptical edge or an arcuate edge include, but not limited to. The distance between the first member 724 and the second member 726 For example, in some embodiments, it may be based, in whole or in part, on the frequency and / or frequency band of a closed waveguide mode signal received through the tapered slot coupler 720 is sent.

According to some embodiments, all or a portion of the first member may 724 and / or all or part of the second member 726 be integrally formed with the top surface, the slot line signal converter 711 forms. In one embodiment, the first member extends 724 and the second member 726 at an angle of about 45 ° to about 90 ° from the top surface of the slotline transducer 711 measured with respect to the top surface of the slotline signal converter 711 , In some embodiments, the overall physical dimensions of the first member may be 724 and the second member 726 are based, in whole or in part, on the frequency or frequency band of the closed waveguide mode signal transmitted through the tapered slot coupler 720 is sent.

In one embodiment, the waveguide coupler system includes 700 a fully integrated SMT waveguide connector / component 750 using the standard PCB composition techniques on the housing 730 can be composed and arranged. The fully integrated SMT waveguide connector 750 can use the tapered slot coupler 720 in, on or around at least a portion of the inner cladding of the waveguide connector 250 is arranged, and the slot line signal converter 711 with the balustrade 718 also in, on or around the bottom surface of the waveguide connector 750 are arranged to comprise.

In some embodiments, the first and second members are 724 and 725 of the tapered slot coupler 720 and the slotline signal converter 711 arranged in a spaced arrangement to a feed channel 721 to build. The feeding channel 721 aligns with a central section of the balustrade 718 of the slotline signal converter 711 and receives a microstrip signal from the microstrip feed line 740 at a connection point 719 ends. The slotline signal converter 711 then converts the microstrip signal using the balun structure 718 in a slot line mode signal and transmits the slot line mode signal via the feed channel 721 , The tapered slot coupler 720 goes from the propagation axis of the slot line mode signal passing through the feed channel 721 is provided to another propagation axis in the direction of the tapered slot 722 of the waveguide connector7. The tapered slot coupler 720 includes the tapered slot 722 , the one with the coplanar members 724 and 726 is formed. The tapered slot coupler 720 that transforms through the channel 721 fed slot conductor mode signal into the closed waveguide mode signal propagating along a waveguide (not shown). In some embodiments, the coplanar members may 724 and 726 of the tapered slot coupler 720 be electrically isolated from each other, using z. As a thin insulator, a dielectric layer or a similar material.

It should be noted that the waveguide coupling system 700 may include less or additional packaging components based on the desired packaging design.

8th Fig. 12 is a perspective view of a vertical waveguide coupling system 800 that is a case 830 with an upper conductive layer 810 and a microstrip feed line 840 , and a waveguide connector 850 with a slotline signal converter 811 , a balancing structure 818 and a tapered slot coupler 820 comprises, according to an embodiment. The waveguide coupler system 800 can the waveguide coupling system 200 and from 2-3 be similar, but the waveguide coupling system 800 can be used to form an open dielectric waveguide (not shown) by mirroring the tapers 824 and 826 of the tapered slot coupler 820 to stimulate one of the axes. In one embodiment, the vertical waveguide coupling system 800 only be used with dielectric waveguides.

The Vertical Waveguide Coupler System 800 Can also be used to excite circular waveguides by changing the shape of the case 830 is changed from rectangular to circular. The waveguide connector 850 can be a fully integrated SMT component containing the balun structure 818 includes, on a lower surface of the connector 850 is arranged, wherein the lower surface of an open end 854 of the connector 850 opposite. The waveguide connector 850 also includes the tapered slot coupler 820 , the two mirrored rejuvenations 824 and 826 includes, wherein the exposed edges of the mirrored tapers 824 and 826 a feeding channel 821 and a tapered slot 822 form. The rejuvenation 824 is at opposite ends of the taper 826 arranged, and the lower surfaces of the tapers 824 and 826 are through the balustrade 818 and a feeding channel 821 separated.

The waveguide connector 850 includes the slotline signal converter 811 who liked the Balun structure 818 having. The slotline signal converter 811 has an upper surface and a lower surface. The rejuvenations 824 and 826 are on the top surface of the slotline signal converter 811 disposed while the lower surface of the slotline signal converter 811 on the upper conductive layer 810 on the case 830 is arranged. The housing 830 includes the microstrip feed line 840 to receive a signal from a source to the slotline signal converter 811 to send.

It should be noted that the waveguide coupling system 800 may include less or additional packaging components based on the desired packaging design.

9 Fig. 12 is a perspective view of a vertical waveguide coupling system 900 that is a case 930 with an upper conductive layer 910 and one or more microstrip feeders 940 , and a waveguide connector 950 with one or more chambers 950a -f, one or more slotline transducers 911 , one or more Balunstrukturen 918 and one or more tapered slot couplers 920 comprises, according to an embodiment. The waveguide coupler system 900 can the waveguide coupling system 200 and from 2-3 be similar, but the waveguide coupling system 900 can be used to energize / feed one or more waveguides (not shown) by the waveguide connector 950 along one or two dimensions is arranged as an array.

The vertical waveguide connector 950 includes the chambers 950a-f , each one of the chambers 950a-f an individual tapered slot coupler 920 with an open end 954 having. The vertical waveguide connector 950 may be a fully integrated SMT component that is on the top conductive layer 910 of the housing 930 is arranged. As in 9 can show a plurality of vias 909 (together "Vias 909 ") The slotline signal converter 911 and / or the waveguide connector 950 with a ground plane (eg, the upper conductive layer 910 ) on or within the housing 930 couple conductive. In some embodiments, the vias couple 910 communicable with the upper conductive layer 910 of the housing 930 and extend over all or a portion of the perimeter of the slotline signal transducers 911 of the waveguide connector 950 ,

It should be noted that the waveguide coupling system 900 may include less or additional packaging components based on the desired packaging design.

10A-10B and 11A-11B include one or more waveguide coupling systems 1000 and 1100 , which represent one or more different ways to convert the feed from a single polarization into multiple polarizations. 10A FIG. 12 is a perspective view of the waveguide coupling system. FIG 1000 , and 10B is the top view of the waveguide coupler system 1000 , Likewise is 11A a perspective view of the waveguide coupling system 1100 and 11B is the top view of the waveguide coupler system 1100 , In some embodiments, the waveguide coupling systems 1000 and 1100 need multiple polarizations. As in 10-11 Any of the waveguide coupling systems can be shown 1000 and 1100 each waveguide connector 1050 and 1150 and slotline signal converter 1021 and 1121 include.

In some embodiments, the waveguide coupling system 1000 from 10A-10B have a feed structure (or tapered slot coupler) which can be rotated 90 degrees to allow double polarization operation. Like in 10B includes the waveguide coupler system 1000 feed points 1071 with vertical polarizations and feed points 1072 with horizontal polarizations. In one embodiment, as in 10A-10B shown, the waveguide coupling system 1000 staggering rejuvenations 1024a-b and 1026a-b to avoid shorting and perforating the tapers (or fins) to the bellows structures 1018 to avoid. Alternatively, the waveguide coupling system 1100 from 11A-11B the rejuvenations 1124a-b and 1126a-b rotated 45 degrees to produce plus / minus (+/-) 45 degree polarization. Like in 11B includes the waveguide coupler system 1100 feed points 1171 with a -45 degree polarization and feed points 1172 with a 45 degree polarization. In one embodiment, as in 11A-11B shown, the waveguide coupling system 1100 mirrored rejuvenations 1124a-b and 1126a-b exhibit to the Balunstrukturen 1118 to avoid.

It should be noted that the waveguide coupling systems 1000 and 1100 , as in 10A-10B and 11A-11B may include less or additional packaging components based on the desired packaging design.

12 is a schematic block diagram illustrating a computer system 1200 illustrates that a component housing 1210 used with one or more waveguide coupling systems, according to one embodiment. 12 illustrates an example of a computing device 1200 dar. The computing device 1200 houses a motherboard 1202 , In one embodiment, the motherboard 1202 the housings of 2-5 and 8th - 9 be similar (eg housing 230 . 430 . 530 . 830 and 930 from 2-5 and 8th - 9 ). The motherboard 1202 may include a number of components, including but not limited to a processor 1204 , a housing 1210 (or a crimped connector housing / system) and at least one communication chip 1206 , The processor 1204 is physical and electrical with the motherboard 1202 coupled. In some embodiments, at least one communication chip 1206 also physically and electrically with the motherboard 1202 be coupled. In other embodiments, at least one communication chip 1206 Part of the processor 1204 ,

Depending on their applications, the computing device may 1200 Include other components that are physically and electrically connected to the motherboard 1202 may or may not be coupled. These other components include, but are not limited to, volatile memory (e.g., DRAM), nonvolatile memory (e.g., ROM), flash memory, graphics processor, digital signal processor, crypto processor, and the like. a chipset, an antenna, a display, a touch-screen display, a touch screen control, a battery, an audio codec, a video codec, a power amplifier, a Global Positioning System (GPS) device, a compass , an accelerometer, a gyroscope, a speaker, a camera, and a mass storage device (eg, hard disk drive, CD (Compact Disk), DVD (Digital Versatile Disk), etc.).

At least one communication chip 1206 enables wireless communication for the transmission of data to and from the computing device 1200 , The term "wireless" and its derivatives can be used to describe circuits, devices, systems, methods, techniques, communication channels, etc. that can communicate data through the use of modulated electromagnetic radiation through a non-solid medium. The term does not imply that the associated devices do not include any wires, although they may not do so in some embodiments. At least one communication chip 1206 can implement any of a number of wireless standards or protocols, including but not limited to Wi-Fi (IEEE 802.11 family), WiMAX (IEEE 802.16 family), IEEE 802.20, Long Term Evolution (LTE), Ev-DO, HSPA + , HSDPA +, HSUPA +, EDGE, GSM, GPRS, CDMA, TDMA, DECT, Bluetooth, and derivatives thereof, as well as any other wireless protocols referred to as 3G, 4G, 5G, and beyond. The computing device 1200 can a plurality of communication chips 1206 include. For example, a first communication chip 1206 be earmarked for shorter range wireless communication, e.g. B. Wi-Fi and Bluetooth, and a second communication chip 1206 may be earmarked for longer range wireless communication, e.g. GPS, EDGE, GPRS, CDMA, WiMAX, LTE, Ev-DO, and others.

The processor 1204 the computing device 1200 includes an integrated circuit die, which is inside the processor 1204 is housed. The component housing 1210 may include, but is not limited to, a packaging substrate, a PCB, and a motherboard. The component housing 1210 includes a waveguide coupler system having a microstrip feed line packaging and one or more conductive layers, and a waveguide connector having a slotline signal converter, one or more balun structures, and one or more tapered slot couplers and the like or any other components the figures described herein - the computing device 1200 , According to some embodiments, the component housing comprises 1210 a waveguide coupler system that provides a low power solution that can support very high data rates, e.g. Over short to medium distances, which would be extremely advantageous for interconnections within server and HPC architectures and / or autonomous / self-propelled vehicles. Furthermore, the component housing comprises 1210 A tapered slot coupler and connector for energizing the waveguides, which allows for improvement in the manufacture and assembly of waveguide interconnect features. The component housing 120 provides a tapered slot waveguide coupler and connector that provides greater bandwidth for thin package substrates as the demand for miniaturization steadily increases, and less susceptibility to waveguide alignment and electrical contacts.

It should be noted that the component housing 1210 may be a single component device, a subset of components, and / or a whole system, as the materials, features, and components on the device housing 1210 and / or any other component that requires a waveguide coupler system.

In certain embodiments, the integrated circuit die may be packaged with one or more devices on a package substrate that includes a thermally stable RFIC and an antenna for use with wireless communication and the device package as described herein to increase the z-height of the package To reduce computing device. The term "processor" may refer to any device or section of a device that processes electronic data from registers and / or memory to transform that electronic data into other electronic data that can be stored in registers and / or memory.

At least one communication chip 1206 also includes an integrated circuit die, which is within the communication chip 1206 is housed. In some embodiments, the integrated circuit die of the communication chip may be packaged with one or more devices on a package substrate that includes one or more device packages as described herein.

In the foregoing description, the embodiments have been described with reference to specific example embodiments thereof. However, it should be kept in mind that all of these and similar expressions are to be assigned to the appropriate physical quantities and are merely practical terms applied to these quantities. It will be apparent that various modifications can be made thereto without departing from the broader spirit and scope. Accordingly, the description and drawings are to be considered in an illustrative rather than a limiting sense.

The following examples relate to further embodiments. The various features of the different embodiments may be variously combined with some features included, and others may be excluded to suit a variety of different applications.

The following examples relate to further embodiments.

Example 1 is a waveguide coupler and connector comprising a waveguide connector having a waveguide coupler, a taper, and a slotline signal transducer; and a balun structure on the slotline signal converter. The taper is disposed on the slotline signal converter and a terminal end of the waveguide connector to form a channel and a tapered slot.

In Example 2, the article of Example 1 may optionally include a housing having one or more layers, a conduit, and a radial stub. The lead is on a layer of the housing, the lead is a microstrip feed lead, and the lead terminates at the radial stub; the waveguide connector having one or more composition pads on one or more outer walls of the waveguide connector; the waveguide connector on an upper surface of the housing. At least one of the composition pads and the outer walls of the waveguide connector is electrically coupled to the upper surface of the housing; and a waveguide coupled to the waveguide connector.

In Example 3, the subject matter of any one of Examples 1-2 may optionally include the waveguide coupler including a single-layer resonant patch coupler, a stacked patch coupler, a tapered slot coupler, a leaky-wave coupler, or a microstrip-to-coupler. Slotted junction coupler includes.

In example 4, the article of any of examples 1-2 may optionally include the balun structure comprising one or more shaped openings. The one or more shaped openings have a dumbbell-like structure and a double lobed structure. The one or more shaped apertures include a circular aperture, a rectangular aperture, a wedge-shaped aperture, a hexagonal aperture, a semicircular aperture, a semi-rectangular aperture, a semi-polygonal aperture and a semi-hexagonal aperture.

In example 5, the subject matter of any of examples 1-4 may optionally include the waveguide connector having one or more interior walls. The one or more inner walls include the terminal end, a top surface and a bottom surface opposite the top surface. The bottom surface of the waveguide connector forms the slotline signal converter.

In example 6, the subject matter of any one of examples 1-5 may optionally include the taper comprising at least one of a straight taper, a stepped taper, a double-snake taper, an exponential taper, a square taper, and an elliptical taper.

In example 7, the subject matter of any one of examples 1-6 may optionally include the balun structure which receives a signal from the microstrip feed line of the housing and converts the signal into a slotline signal. The waveguide coupler converts the slotline signal into a closed waveguide mode signal with the taper. The waveguide coupler emits the closed waveguide mode signal along the channel and propagates the closed waveguide mode signal along the taper slot of the waveguide coupler to the waveguide mode signal Waveguide, which is coupled to the waveguide connector.

In example 8, the subject matter of any one of examples 1-7 may optionally include the waveguide connector further comprising one or more chambers. Each of the chambers includes a balun structure, a waveguide coupler, a taper, and a slotline transducer.

In example 9, the subject matter of any one of examples 1-8 may optionally include the waveguide connector being at least one of a metallic waveguide and a dielectric waveguide.

Example 10 is a method of forming a waveguide coupler and connector comprising arranging a waveguide coupler, a taper, and a slotline signal converter on a waveguide connector; and arranging a balun structure on the slotline signal converter. The taper is disposed on the slotline signal converter and a terminal end of the waveguide connector to form a channel and a tapered slot.

In example 11, the article of example 10 may optionally include placing one or more layers, a lead, and a radial stub on a housing. The lead is on a layer of the housing, the lead is a microstrip feed lead, and the lead terminates at the radial stub; Arranging one or more composition pads on one or more outer walls of the waveguide connector; Placing the waveguide connector on an upper surface of the housing. At least one of the composition pads and the outer walls of the waveguide connector is electrically coupled to the upper surface of the housing; and coupling a waveguide to the waveguide connector.

In Example 12, the subject matter of any one of Examples 10-11 may optionally include the waveguide coupler including a single-layer resonant patch coupler, a stacked patch coupler, a tapered slot coupler, a leaky-wave coupler, or a microstrip-to-coupler. Slotted junction coupler includes.

In example 13, the subject matter of any one of examples 10-12 may optionally include the balun structure comprising one or more shaped apertures. The one or more shaped openings have a dumbbell-like structure and a double lobed structure. The one or more shaped apertures include a circular aperture, a rectangular aperture, a wedge-shaped aperture, a hexagonal aperture, a semicircular aperture, a semi-rectangular aperture, a semi-polygonal aperture and a semi-hexagonal aperture.

In example 14, the subject matter of any one of examples 10-13 may optionally include the waveguide connector having one or more interior walls. The one or more inner walls include the terminal end, a top surface and a bottom surface opposite the top surface. The bottom surface of the waveguide connector forms the slotline signal converter.

In example 15, the subject matter of any of examples 10-14 may optionally include the taper comprising at least one of a straight taper, a stepped taper, a double-snake taper, an exponential taper, a square taper, and an elliptical taper.

In example 16, the subject matter of any of examples 10-15 may optionally include converting a signal from the microstrip feed line of the housing into a slotline signal having the balun structure; converting the slot line signal into a closed waveguide mode signal with the taper of the waveguide coupler; emitting the closed waveguide mode signal along the channel of the waveguide coupler; and propagating the closed waveguide mode signal along the taper slot of the waveguide coupler to the waveguide coupled to the waveguide connector.

In example 17, the subject matter of any one of examples 10-16 may optionally include the waveguide connector further comprising one or more chambers. Each of the chambers includes a balun structure, a waveguide coupler, a taper, and a slotline transducer.

In example 18, the subject matter of any one of examples 10-17 may optionally include the waveguide connector being at least one of a metallic waveguide and a dielectric waveguide.

Example 19 is a waveguide coupler and connector comprising a waveguide connector with a waveguide coupler and a taper; and a housing having a balun structure on an upper surface of the housing. The balun structure is disposed on the upper surface of the housing to form a slotline signal transducer. The waveguide connector is disposed on the slotline signal converter and the top surface of the housing.

In example 20, the subject matter of example 19 may optionally include the taper of the waveguide connector being disposed on the slot line transducer of the housing and a terminal end of the waveguide connector to form a channel and a tapered slot; the housing with one or more layers, a conduit and a radial stub. The lead is on a layer of the housing, the lead is a microstrip feed lead, and the lead terminates at the radial stub; the waveguide connector having one or more composition pads on one or more outer walls of the waveguide connector. At least one of the composition pads and the outer walls of the waveguide connector is electrically coupled to the upper surface of the housing; and a waveguide coupled to the waveguide connector. The waveguide is at least one of a metallic waveguide and a dielectric waveguide.

In Example 21, the subject matter of any one of Examples 19-20 may optionally include the waveguide coupler including a single-layer resonant patch coupler, a stacked patch coupler, a tapered slot coupler, a leaky-wave coupler, or a microstrip-to-coupler. Slotted junction coupler includes.

In example 22, the subject matter of any one of examples 19-21 may optionally include the balun structure that includes one or more shaped openings patterned on the top surface of the housing. The one or more shaped openings have a dumbbell-like structure and a double lobed structure. The one or more shaped apertures include a circular aperture, a rectangular aperture, a wedge-shaped aperture, a hexagonal aperture, a semicircular aperture, a semi-rectangular aperture, a semi-polygonal aperture and a semi-hexagonal aperture.

In example 23, the subject matter of any of examples 19-22 may optionally include the waveguide connector having one or more interior walls. The one or more inner walls include the terminal end and an upper surface. An upper surface of the slotline signal converter forms a bottom surface for the waveguide connector disposed on the housing.

In example 24, the subject matter of any one of examples 19-23 may optionally include the taper comprising at least one of a straight taper, a stepped taper, a double-snake taper, an exponential taper, a square taper, and an elliptical taper. The waveguide connector further comprises one or more chambers. Each of the chambers includes at least one waveguide coupler and a taper.

In example 25, the subject matter of any one of examples 19-24 may optionally include the balun structure that receives a signal from the microstrip feed line of the housing and converts the signal into a slotline signal. The waveguide coupler converts the slotline signal into a closed waveguide mode signal with the taper. The waveguide coupler emits the closed waveguide mode signal along the channel and propagates the closed waveguide mode signal along the taper slot of the waveguide coupler to the waveguide coupled to the waveguide connector.

In the foregoing description, methods and apparatus have been described with reference to specific example embodiments thereof. It will be apparent that various modifications can be made thereto without departing from the broader spirit and scope. Accordingly, the description and drawings are to be considered in an illustrative rather than a limiting sense.

Claims (25)

A waveguide coupler and connector, comprising: a waveguide connector having a waveguide coupler, a taper and a slotline signal converter; and a balun structure on the slotline signal converter, wherein the taper is disposed on the slotline signal converter and a terminal end of the waveguide connector to form a channel and a tapered slot. The waveguide coupler and connector according to Claim 1 , further comprising: a housing having one or more layers, a conduit and a radial stub, the conduit being on a layer of the housing, the conduit being a microstrip feed line and the conduit terminating at the radial stub; the waveguide connector having one or more composition pads on one or more outer walls of the waveguide connector; the waveguide connector on an upper surface of the housing, at least one of the composition pads and the outer walls of the waveguide connector having the upper surface of the housing is electrically coupled; and a waveguide coupled to the waveguide connector. The waveguide coupler and connector of any preceding claim, wherein the waveguide coupler comprises a single-layer resonant patch coupler, a stacked patch coupler, a tapered slot coupler, a leaky-wave coupler, or a microstrip-to-slot coupler includes. The waveguide coupler and connector of any one of the preceding claims, wherein the beam structure comprises one or more shaped openings, the one or more shaped openings having a dumbbell-shaped structure and a double lobed structure, and wherein the one or more shaped openings is a circular opening , a rectangular opening, a wedge-shaped opening, a hexagonal opening, a semicircular opening, a semi-rectangular opening, a semi-polygonal opening and a half-hexagonal opening. The waveguide coupler and connector of any one of the preceding claims, wherein the waveguide connector has one or more interior walls, the one or more interior walls comprising the terminal end, a top surface, and a bottom surface opposite the top surface, and wherein the bottom surface of the waveguide connector forms the slotline signal converter. The waveguide coupler and connector of any preceding claim, wherein the taper comprises at least one of a straight taper, a stepped taper, a double-snake taper, an exponential taper, a square taper, and an elliptical taper. The waveguide coupler and connector according to any one of Claims 2 - 6 wherein the balun structure receives a signal from the microstrip feed line of the housing and converts the signal into a slotline signal, the waveguide coupler converting the slotline signal into a closed waveguide mode signal with the taper, and wherein the waveguide coupler is the closed waveguide mode. Emitted signal along the channel and the closed waveguide mode signal propagates along the taper slot of the waveguide coupler to the waveguide, which is coupled to the waveguide connector. The waveguide coupler and connector of any one of the preceding claims, wherein the waveguide connector further comprises one or more chambers, and wherein each of the chambers comprises a balun structure, a waveguide coupler, a taper, and a slotline signal transducer. The waveguide coupler and connector according to any one of Claims 2 - 8th wherein the waveguide is at least one of a metallic waveguide and a dielectric waveguide. A method of forming a waveguide coupler and connector, comprising: Arranging a waveguide coupler, a taper, and a slotline signal converter on a waveguide connector; and Arranging a balun structure on the slotline signal converter, wherein the taper is disposed on the slotline signal converter and a terminal end of the waveguide connector to form a channel and a tapered slot. The method according to Claim 10 further comprising: disposing one or more layers, a conduit and a radial stub on a housing, the conduit being on a layer of the housing, the conduit being a microstrip feed line and the conduit terminating at the radial stub; Arranging one or more composition pads on one or more outer walls of the waveguide connector; Arranging the waveguide connector on an upper surface of the housing, wherein at least one of the composition pads and the outer walls of the waveguide connector is electrically coupled to the upper surface of the housing; and coupling a waveguide to the waveguide connector. The method according to one of Claims 10 - 11 wherein the waveguide coupler comprises a single-layer resonant patch coupler, a stacked patch coupler, a tapered slot coupler, a leaky-wave coupler, or a microstrip-to-slot transition coupler. The method according to one of Claims 10 - 12 wherein the beam structure comprises one or more shaped openings, the one or more shaped openings having a dumbbell-shaped structure and a double-lobed structure, and wherein the one or more formed openings have a circular opening, a rectangular opening, a wedge-shaped opening hexagonal opening, a semicircular opening, a half-rectangular opening, a half-polygonal opening and a half-hexagonal opening. The method according to one of Claims 10 - 14 wherein the waveguide connector has one or more inner walls, the one or more inner walls comprising the terminal end, a top surface, and a bottom surface facing the top surface, and wherein the bottom surface of the waveguide connector forms the slotline signal transducer. The method according to one of Claims 10 - 14 wherein the taper comprises at least one of a straight taper, a stepped taper, a double-snake taper, an exponential taper, a square taper, and an elliptical taper. The method according to one of Claims 11 - 15 further comprising: converting a signal from the microstrip feed line of the housing into a slotline signal having the balun structure; Converting the slotline signal into a closed waveguide mode signal with the taper of the waveguide coupler; Emitting the closed waveguide mode signal along the channel of the waveguide coupler; and propagating the closed waveguide mode signal along the taper slot of the waveguide coupler to the waveguide coupled to the waveguide connector. The method according to one of Claims 10 - 16 wherein the waveguide connector further comprises one or more chambers, and wherein each of the chambers comprises a balun structure, a waveguide coupler, a taper, and a slotline signal transducer. The method according to one of Claims 11 - 16 wherein the waveguide is at least one of a metallic waveguide and a dielectric waveguide. A waveguide coupler and connector, comprising: a waveguide connector having a waveguide coupler and a taper; and a housing having a balun structure on an upper surface of the housing, the balun structure being disposed on the top surface of the housing to form a slotline signal transducer, and wherein the waveguide connector is disposed on the slotline transducer and the top surface of the housing. The waveguide coupler and connector according to Claim 19 further comprising: the taper of the waveguide connector is disposed on the slot line transducer of the housing and a terminal end of the waveguide connector to form a channel and a tapered slot; the housing having one or more layers, a conduit and a radial stub, the conduit being on a layer of the housing, the conduit being a microstrip feed line and the conduit terminating at the radial stub; the waveguide connector having one or more composition pads on one or more outer walls of the waveguide connector, at least one of the composition pads and the outer walls of the waveguide connector being electrically coupled to the upper surface of the housing; and a waveguide coupled to the waveguide connector, the waveguide being at least one of a metallic waveguide and a dielectric waveguide. The waveguide coupler and connector according to any one of Claims 19 - 20 wherein the waveguide coupler comprises a single-layer resonant patch coupler, a stacked patch coupler, a tapered slot coupler, a leaky-wave coupler, or a microstrip-to-slot transition coupler. The waveguide coupler and connector according to any one of Claims 19 - 21 wherein the beam structure comprises one or more shaped openings structured on the upper surface of the housing, the one or more shaped openings having a dumbbell-shaped structure and a double-lobed structure, and wherein the one or more formed openings is a circular opening , a rectangular opening, a wedge-shaped opening, a hexagonal opening, a semicircular opening, a semi-rectangular opening, a semi-polygonal opening and a half-hexagonal opening. The waveguide coupler and connector according to any one of Claims 19 - 22 wherein the waveguide connector has one or more inner walls, the one or more inner walls comprising the terminal end and a top surface, and wherein an upper surface of the slotline signal converter forms a bottom surface for the waveguide connector disposed on the housing. The waveguide coupler and connector according to any one of Claims 19 - 23 wherein the taper is at least one of a straight taper, a stepped taper, a double-fingered Taper, an exponential taper, a square taper, and an elliptical taper, the waveguide connector further comprising one or more chambers, and wherein each of the chambers comprises at least one of a waveguide coupler and a taper. The waveguide coupler and connector according to any one of Claims 20 - 24 wherein the balun structure receives a signal from the microstrip feed line of the housing and converts the signal into a slotline signal, the waveguide coupler converting the slotline signal into a closed waveguide mode signal with the taper, and wherein the waveguide coupler is the closed waveguide mode. Emitted signal along the channel and the closed waveguide mode signal propagates along the taper slot of the waveguide coupler to the waveguide, which is coupled to the waveguide connector.

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