DE102018007076A1 - Processes and systems for high-speed generation of structures on surfaces with a pulsed laser beam - Google Patents
Processes and systems for high-speed generation of structures on surfaces with a pulsed laser beam Download PDFInfo
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- DE102018007076A1 DE102018007076A1 DE102018007076.0A DE102018007076A DE102018007076A1 DE 102018007076 A1 DE102018007076 A1 DE 102018007076A1 DE 102018007076 A DE102018007076 A DE 102018007076A DE 102018007076 A1 DE102018007076 A1 DE 102018007076A1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/18—Sheet panels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
Abstract
In dieser vorliegenden Anmeldung werden Verfahren zur Hochgeschwindigkeitserzeugung von Oberflächenstrukturen mit einem gepulsten Laserstrahlangegeben. Die zentrale Idee besteht darin, dass die Fläche mit Strukturen in mehrere Flächenelemente aufgeteilt wird, wobei die Flächenelemente eine längliche Form mit einer Länge von L und einer Breite von W aufweisen. Zur Strukturierung der Oberfläche wird eine Strahlquelle verwendet, die einen gepulsten Laserstrahl emittiert. Zum Scannen des Laserstrahls wird ein Ablenksystem verwendet. Das Ablenksystem weist ein erstes Ablenkelement auf, das den Laserstrahl entlang der Länge eines Flächenelementes lenkt. Das Ablenksystem hat ein zweites Ablenkelement, das eine sehr hohe Dynamik aufweist. Das zweite Ablenkelement lenkt den Laserstrahl einer Vorgabe gemäß quer der Länge aus. Des Weiteren weist das Ablenksystem ein drittes Ablenkelement auf. Mit dem dritten Ablenkelement wird der Laserstrahl von einem Flächenelement zu einem anderen Flächenelement gerichtet. Damit wird die gesamte Fläche Flächenelement für Flächenelement abgescannt und die vorgegebenen Strukturen werden auf der gesamten Oberfläche erzeugt. In this present application, methods for high-speed generation of surface structures with a pulsed laser beam are given. The central idea is that the surface with structures is divided into several surface elements, the surface elements having an elongated shape with a length of L and a width of W. A beam source that emits a pulsed laser beam is used to structure the surface. A deflection system is used to scan the laser beam. The deflection system has a first deflection element which directs the laser beam along the length of a surface element. The deflection system has a second deflection element, which has a very high dynamic. The second deflecting element deflects the laser beam according to a specification according to the length. Furthermore, the deflection system has a third deflection element. The third deflection element directs the laser beam from one surface element to another surface element. This scans the entire surface area by area and the specified structures are created on the entire surface.
Description
Gepulste Laserstrahlen können zur Erzeugung unterschiedlicher funktionaler Strukturen auf Oberflächen verwendet werden. Funktionale Oberflächenstrukturen sind vielfältig. Beispiele sind u. a. hydrophobische Strukturen, hydrophile Strukturen, lichtabsorbierende Strukturen (z. B. schwarzer Kupfer, schwarzes Si, schwarzes Glas), gleitende Strukturen (Haifisch-Haut), wachstumshemmende Strukturen (z. B. Anti-Bakterien-Strukturen) und wachstumsfördernde Strukturen (Zellwachsen-Strukturen). Die Basis der funktionalen Oberflächen sind die Mikro- und Nano-Strukturen auf der Oberfläche.Pulsed laser beams can be used to create different functional structures on surfaces. Functional surface structures are diverse. Examples include a. hydrophobic structures, hydrophilic structures, light-absorbing structures (e.g. black copper, black Si, black glass), sliding structures (shark skin), growth-inhibiting structures (e.g. anti-bacterial structures) and growth-promoting structures (cell growth Structures). The basis of the functional surfaces are the micro and nano structures on the surface.
In den letzten Jahren ist die Erzeugung solcher Strukturen im Labormaßstab auf kleinen Flächen gelungen. Dabei werden insbesondere Laser mit ultrakurzen Pulsen verwendet. Ein typischer Aufbau besteht aus einem 2-dimensionalen Scanner, der einen gepulste Laserstrahl über die Fläche scannt und damit die Fläche abtastet. Aufgrund der limitierten Scangeschwindigkeit ist die erzielbare Flächenrate für die praktische Produktion oft zu gering.In recent years, such structures have been successfully produced on a laboratory scale on small areas. Lasers with ultra-short pulses are used in particular. A typical set-up consists of a 2-dimensional scanner that scans a pulsed laser beam over the surface and thus scans the surface. Due to the limited scanning speed, the achievable area rate is often too low for practical production.
In dieser vorliegenden Anmeldung werden Verfahren zur Hochgeschwindigkeitserzeugung von Oberflächenstrukturen mit einem gepulsten Laserstrahl angegeben. Die zentrale Idee besteht darin, dass die Fläche mit Strukturen in mehrere Flächenelemente (Flächenelement
Für eine möglichst schnelle Bearbeitung werden die Flächenelemente so ausgewählt, dass das Verhältnis von Länge L zu Breite W größer als 10 ist.For the fastest possible processing, the surface elements are selected so that the ratio of length L to width W is greater than 10.
Bevorzugte Ausführungsbeispiele des ersten Ablenkelements sind ein ein-achsiger Galvoscanner, ein Polygonscanner oder ein rotierender Zylinder. Bei einem rotierenden Zylinder wird ein biegsames Werkstück auf dem Zylinder so aufgespannt, dass die zu strukturierende Fläche dem Laserstrahl zugerichtet ist.Preferred exemplary embodiments of the first deflection element are a single-axis galvo scanner, a polygon scanner or a rotating cylinder. In the case of a rotating cylinder, a flexible workpiece is clamped on the cylinder in such a way that the surface to be structured is aligned with the laser beam.
Als zweites Ablenkelement mit hoher Dynamik kann ein Piezo-Element getriebener Umlenkspiegel verwendet werden. Dabei wird die Orientierung des Spiegels mit der am Piezo-Element angelegte Spannung gezielt verändert werden.A piezo element-driven deflection mirror can be used as the second deflection element with high dynamics. The orientation of the mirror will be specifically changed with the voltage applied to the piezo element.
Eine weitere Ausführung des zweiten Ablenkelements bildet ein elektrooptischer Deflektor. Dabei wird eine Spannung an einen elektrooptischen Kristall angelegt. Das durch die Spannung erzeugte elektrische Feld in dem elektrooptischen Kristall verändert die Brechungszahl. Dadurch wird die Richtung des Laserstrahls beim Austritt verändert. So wird eine definierte Ablenkung des Laserstrahls durch Anlegen einer definierten Spannung erreicht.Another embodiment of the second deflection element is an electro-optical deflector. A voltage is applied to an electro-optical crystal. The electric field generated by the voltage in the electro-optical crystal changes the refractive index. This changes the direction of the laser beam on exit. In this way, a defined deflection of the laser beam is achieved by applying a defined voltage.
Eine bevorzugte Ausführung des zweiten Ablenkelements bildet ein akustooptischer Deflektor. Ein akustooptischer Deflektor besteht aus einem akustooptischen Medium, durch welches der Laserstrahl durchläuft, und einem Hochfrequenztreiber. Die Hochfrequenzleistung wird z. B. mittels eines an dem akustooptischen Medium angebrachten Piezo-Element in das akustooptischen Medium eingekoppelt. Dadurch wird in dem akustooptischen Medium eine Schallwelle generiert. Die Schallwelle generiert ein Brechungszahlgitter, dessen Periode der Wellenlänge der Schallwelle entspricht. An dem Brechungszahlgitter wird der Laserstrahl in Abhängigkeit der Periode gebeugt. Durch eine definierte Frequenz der Hochfrequenzleistung kann dann der Laserstrahl definiert abgelenkt werden. Darüber hinaus kann die Pulsenergie des Laserstrahls durch die Höhe der Hochfrequenzleistung gemäß einer Vorgabe eingestellt werden.A preferred embodiment of the second deflection element is an acousto-optical deflector. An acousto-optical deflector consists of an acousto-optical medium through which the laser beam passes and a high-frequency driver. The high frequency power is e.g. B. coupled into the acousto-optic medium by means of a piezo element attached to the acousto-optic medium. As a result, a sound wave is generated in the acousto-optical medium. The sound wave generates a refractive index grating whose period corresponds to the wavelength of the sound wave. The laser beam is diffracted at the refractive index grating as a function of the period. The laser beam can then be deflected in a defined manner by a defined frequency of the high-frequency power. In addition, the pulse energy of the laser beam can be set according to a specification by the amount of high-frequency power.
Ein besonderer Vorteil ist, dass bei einem akustooptischen Deflektor der Leistungsbedarf im Vergleich zu elektrooptischen Deflektoren sehr gering ist. Allerdings ist der erreichbare Ablenkwinkel bei einer akzeptablen Effizienz limitiert. Typischerweise beträgt der volle Ablenkwinkel etwa das 4- bis 20-fache des Voll-Divergenzwinkels des Strahls. Aus diesem Grund werden die Flächenelemente so ausgelegt, dass die Breite W von einem einzelnen Flächenelement dem 2- bis 20-fachen des Fokusdurchmessers des Laserstrahls entspricht.A particular advantage is that the power requirement for an acousto-optical deflector is very low compared to electro-optical deflectors. However, the achievable deflection angle is limited with an acceptable efficiency. Typically, the full deflection angle is about 4 to 20 times the full divergence angle of the beam. For this reason, the surface elements are designed so that the width W of a single surface element corresponds to 2 to 20 times the focus diameter of the laser beam.
Als das dritte Ablenkelement kann ein weiterer ein-achsiger Galvoscanner verwendet werden. In diesem Fall ist es vorteilhaft, dass das erste Ablenkelement, bestehend aus einem ein-achsigen Galvoscanner und das dritte Ablenkelement in einem 2-achsigen Galvoscanner zusammen als xy-Scanner integriert werden.Another single-axis galvo scanner can be used as the third deflection element. In this case, it is advantageous that the first deflection element, consisting of a single-axis galvo scanner, and the third deflection element in a two-axis galvo scanner are integrated together as an xy scanner.
Als das dritte Ablenkelement kann auch eine lineare Achse verwendet werden. Ein weiteres Ausführungsbeispiel für das dritte Ablenkelement entsteht, wenn das Werkstück auf einer linearen Achse montiert wird.A linear axis can also be used as the third deflection element. Another exemplary embodiment of the third deflection element arises when the workpiece is mounted on a linear axis.
Die Oberflächenstrukturen sind vielfältig. Z. B. können die Strukturen periodisch oder ungeordnet sein.
Zur Erzeugung der einzelnen Strukturen, deren Mittelpunkte nicht auf der Spur liegen, wird eine Ablenkung des Laserstrahls durch das zweite Ablenkelement nach einer Vorgabe quer zu den Spuren generiert.In order to generate the individual structures, the centers of which are not on the track, a deflection of the laser beam is generated by the second deflection element according to a specification transverse to the tracks.
Alle einzelnen Strukturen, die um eine Spur und innerhalb eines Flächenelements liegen, werden vorteilhaft durch eine Überfahrt generiert.All individual structures that lie around a track and within a surface element are advantageously generated by a crossing.
Die Spurwechsel werden durch das dritte Ablenkelement realisiert. In dem Fall, dass ein xy-Scanner als das erste und das dritte Ablenkelement verwendet wird, ist es vorteilhaft, wenn die Fläche in Form der Mäander-Form abgescannt wird (vgl.
Die entlang der Spur projektierten Abstände zwischen den benachbarten einzelnen Strukturen können durch Triggerung der Laserpulse gemäß einer Vorgabe variiert werden.The distances projected along the track between the adjacent individual structures can be varied by triggering the laser pulses in accordance with a specification.
Bei dem in
Abweichend von rechteckigen Flächenelementen kann die Fläche auch in Flächenelemente anderer Formen z. B. Kreisbogen unterteilt werden.Deviating from rectangular surface elements, the surface can also be in surface elements of other shapes. B. circular arc can be divided.
Claims (14)
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DE102018007076.0A DE102018007076A1 (en) | 2018-09-09 | 2018-09-09 | Processes and systems for high-speed generation of structures on surfaces with a pulsed laser beam |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2054760A1 (en) * | 1970-11-06 | 1972-05-31 | Siemens Ag | Method for controlling an optical data printer |
DE4133620C1 (en) * | 1991-10-10 | 1993-04-22 | Maho Ag, 8962 Pfronten, De | |
DE19745280A1 (en) * | 1997-10-15 | 1999-04-22 | Daimler Chrysler Ag | Method for fine or micro-machining of workpieces using laser beams |
DE102004043124A1 (en) * | 2004-09-07 | 2006-03-09 | Robert Bosch Gmbh | Device for modifying a laser beam |
EP2428307A1 (en) * | 2010-09-10 | 2012-03-14 | ACSYS Lasertechnik GmbH | Method for generating rough surface structures |
EP2647464A1 (en) * | 2012-04-02 | 2013-10-09 | Agie Charmilles New Technologies SA | Laser ablation method by machining dots randomly |
-
2018
- 2018-09-09 DE DE102018007076.0A patent/DE102018007076A1/en not_active Ceased
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2054760A1 (en) * | 1970-11-06 | 1972-05-31 | Siemens Ag | Method for controlling an optical data printer |
DE4133620C1 (en) * | 1991-10-10 | 1993-04-22 | Maho Ag, 8962 Pfronten, De | |
DE19745280A1 (en) * | 1997-10-15 | 1999-04-22 | Daimler Chrysler Ag | Method for fine or micro-machining of workpieces using laser beams |
DE102004043124A1 (en) * | 2004-09-07 | 2006-03-09 | Robert Bosch Gmbh | Device for modifying a laser beam |
EP2428307A1 (en) * | 2010-09-10 | 2012-03-14 | ACSYS Lasertechnik GmbH | Method for generating rough surface structures |
EP2647464A1 (en) * | 2012-04-02 | 2013-10-09 | Agie Charmilles New Technologies SA | Laser ablation method by machining dots randomly |
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