DE102017127076A1 - Mechatronics module with a hybrid circuit arrangement - Google Patents
Mechatronics module with a hybrid circuit arrangement Download PDFInfo
- Publication number
- DE102017127076A1 DE102017127076A1 DE102017127076.0A DE102017127076A DE102017127076A1 DE 102017127076 A1 DE102017127076 A1 DE 102017127076A1 DE 102017127076 A DE102017127076 A DE 102017127076A DE 102017127076 A1 DE102017127076 A1 DE 102017127076A1
- Authority
- DE
- Germany
- Prior art keywords
- circuit arrangement
- mechanical switch
- ceramic substrate
- hybrid circuit
- mechatronic assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
- H01H9/54—Circuit arrangements not adapted to a particular application of the switching device and for which no provision exists elsewhere
- H01H9/541—Contacts shunted by semiconductor devices
- H01H9/542—Contacts shunted by static switch means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H89/00—Combinations of two or more different basic types of electric switches, relays, selectors and emergency protective devices, not covered by any single one of the other main groups of this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
- H01H9/02—Bases, casings, or covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
- H01H9/54—Circuit arrangements not adapted to a particular application of the switching device and for which no provision exists elsewhere
- H01H9/548—Electromechanical and static switch connected in series
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H7/00—Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions
- H02H7/22—Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions for distribution gear, e.g. bus-bar systems; for switching devices
- H02H7/222—Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions for distribution gear, e.g. bus-bar systems; for switching devices for switches
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
- H01H9/54—Circuit arrangements not adapted to a particular application of the switching device and for which no provision exists elsewhere
- H01H9/541—Contacts shunted by semiconductor devices
- H01H9/542—Contacts shunted by static switch means
- H01H2009/543—Contacts shunted by static switch means third parallel branch comprising an energy absorber, e.g. MOV, PTC, Zener
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
- H01H9/54—Circuit arrangements not adapted to a particular application of the switching device and for which no provision exists elsewhere
- H01H9/541—Contacts shunted by semiconductor devices
- H01H9/542—Contacts shunted by static switch means
- H01H2009/544—Contacts shunted by static switch means the static switching means being an insulated gate bipolar transistor, e.g. IGBT, Darlington configuration of FET and bipolar transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10053—Switch
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electronic Switches (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Power Conversion In General (AREA)
- Protection Of Static Devices (AREA)
Abstract
Bei einer Mechatronikbaugruppe (1) mit einer hybriden Schaltungsanordnung (2), wird vorgeschlagen, dass die hybride Schaltungsanordnung (2) wenigstens eine Schaltstrecke (3) aufweist, welche Schaltstrecke (3) wenigstens einen ersten mechanischen Schalter (4) und wenigstens eine erste Halbleiterschaltungsanordnung (5) umfasst, wobei die hybride Schaltungsanordnung (2) an einer ersten Fläche (6) eines Keramiksubstrats (7) angeordnet ist, wobei eine, der ersten Fläche (7) gegenüber liegende, zweite Fläche des Keramiksubstrats (7) mit einer Metallplatte (10), insbesondere einer Kupferplatte, verbunden ist, wobei an der Metallplatte (10) eine Gehäuseschale (11) befestigt ist, welche das Keramiksubstrat (7) und die hybride Schaltungsanordnung (2) umschließt, wobei die Metallplatte (10) und die Gehäuseschale (11) ein Gehäuse (12) der Mechatronikbaugruppe (1) bilden, wobei Zwischenräume innerhalb des Gehäuses (12) wenigstens bereichsweise mit einer Vergussmasse gefüllt sind.In a mechatronic assembly (1) with a hybrid circuit arrangement (2), it is proposed that the hybrid circuit arrangement (2) has at least one switching path (3), which switching path (3) comprises at least one first mechanical switch (4) and at least one first semiconductor circuit arrangement (5), wherein the hybrid circuit arrangement (2) is arranged on a first surface (6) of a ceramic substrate (7), wherein a second surface of the ceramic substrate (7) opposite the first surface (7) is provided with a metal plate (7). 10), in particular a copper plate, to the metal plate (10) a housing shell (11) is fixed, which surrounds the ceramic substrate (7) and the hybrid circuit arrangement (2), wherein the metal plate (10) and the housing shell ( 11) form a housing (12) of the mechatronic assembly (1), wherein intermediate spaces within the housing (12) are at least partially filled with a potting compound.
Description
Die Erfindung betrifft eine Mechatronikbaugruppe gemäß Patentanspruch 1.The invention relates to a mechatronic assembly according to claim 1.
Es sind sog. hybride Schaltgeräte bekannt, welche sowohl mechanische Schalter als auch Halbleiterschalter aufweisen. Ein derartiges Schaltgerät ist etwa aus der
Bei hybriden Schaltgeräten liegen in der Regel mehrere mechanische Kontaktpaare seriell im Strompfand durch das Schaltgerät. Dies hat oftmals einen höheren Widerstand und eine höhere Eigenerwärmung zur Folge. Gleichzeitig sind Leistungshalbleiter zentrale Komponenten, die für ein Abschalten der Ströme durch das hybride Schaltgerät unerlässlich sind. Hohe Umgebungstemperaturen vermindern jedoch die Lebensdauer von Halbleiterschaltern. Ein Ausfall der Halbleiterschalter würde bedeuten, dass ein Strom lediglich durch das, parallel zu den Halbleiterschaltern angeordnete Bypassrelais ausgeschaltet werden müsste, welches dazu schlichtweg nicht ausgelegt ist, und welchem auch keine Lichtbogenlöscheinrichtung zugeordnet ist. Das Bypassrelais wird ohne funktionierende Halbleiterschalter beim Versuch einen hohen Strom abzuschalten, etwa einen Kurzschlussstrom in einer typischen Niederspannungs-Installationsumgebung, explosionsartig zerstört.In hybrid switching devices are usually several pairs of mechanical contact serially in the current collection through the switching device. This often results in a higher resistance and a higher self-heating. At the same time, power semiconductors are key components that are essential for switching off the currents through the hybrid switching device. High ambient temperatures, however, reduce the life of semiconductor switches. A failure of the semiconductor switch would mean that a current would have to be turned off only by the parallel to the semiconductor switches arranged bypass relay, which is simply not designed for this, and which is also associated with no arc quenching device. The bypass relay is exploded without functioning solid state switches in an attempt to turn off high current, such as a short circuit current in a typical low voltage installation environment.
Weiters können unterschiedliche Temperaturniveaus innerhalb des Schaltgeräts zu einer Beeinträchtigung der Funktion des hybriden Schaltgerätes führen.Furthermore, different temperature levels within the switching device can lead to an impairment of the function of the hybrid switching device.
Es hat sich weiters gezeigt, dass der tatsächliche elektromechanische Aufbau in ganz erheblicher Weise die Funktionsfähigkeit der hybriden Schaltungsanordnung, insbesondere deren Fähigkeit Kurzschlussströme mit einigen tausend Ampere sicher abzuschalten, beeinflusst.It has also been shown that the actual electromechanical structure quite significantly affects the functionality of the hybrid circuitry, in particular its ability to safely shut off short circuit currents of a few thousand amperes.
Aufgabe der Erfindung ist es daher eine Mechatronikbaugruppe der eingangs genannten Art anzugeben, mit welchem die genannten Nachteile hybrider Schaltgeräte vermieden werden können, und mit welchem über lange Zeit eine elektrische Absicherung gewährleistet werden kann.The object of the invention is therefore to provide a mechatronic assembly of the type mentioned, with which the mentioned disadvantages of hybrid switching devices can be avoided, and with which over a long time an electrical fuse can be guaranteed.
Erfindungsgemäß wird dies durch die Merkmale des Patentanspruches 1 erreicht.This is achieved by the features of claim 1 according to the invention.
Dadurch kann sicher über eine lange Zeit eine elektrische Absicherung gewährleistet werden. Dadurch kann im Falle eines Ausfalls der ersten Halbleiterschaltungsanordnung die Umgebung sicher vor den Folgen einer Zerstörung des mechanischen Schalters geschützt werden. Durch die Ankoppelung an die Metallplatte kann innerhalb der Mechatronikbaugruppe eine ausgeglichene Temperatur erreicht werden. Die nach Außen freie Fläche der Metallplatte kann gut Wärme an die Umgebung abgeben. Durch die Summe der gegenständlichen Maßnahmen kann ein realer Aufbau einer hybriden Schaltungsanordnung geschaffen werden, welcher langlebig und funktionssicher ist.As a result, an electrical fuse can be safely ensured over a long time. As a result, in the event of a failure of the first semiconductor circuit arrangement, the environment can be safely protected from the consequences of destruction of the mechanical switch. By coupling to the metal plate, a balanced temperature can be achieved within the mechatronic assembly. The outer surface of the metal plate can give off heat to the environment well. By the sum of the representational measures, a real structure of a hybrid circuit arrangement can be created, which is durable and reliable.
Die Unteransprüche betreffen weitere vorteilhafte Ausgestaltungen der Erfindung.The subclaims relate to further advantageous embodiments of the invention.
Ausdrücklich wird hiermit auf den Wortlaut der Patentansprüche Bezug genommen, wodurch die Ansprüche an dieser Stelle durch Bezugnahme in die Beschreibung eingefügt sind und als wörtlich wiedergegeben gelten.It is hereby expressly referred to the wording of the claims, whereby the claims at this point are incorporated by reference into the description and are considered to be reproduced verbatim.
Die Erfindung wird unter Bezugnahme auf die beigeschlossenen Zeichnungen, in welchen lediglich bevorzugte Ausführungsformen beispielhaft dargestellt sind, näher beschrieben. Dabei zeigt:
-
1 einen Stromlaufplan einer Ausführungsform einer gegenständlichen hybriden Schaltungsanordnung; -
2 eine gegenständliche Mechatronikbaugruppe ohne Gehäuseschale in axonometrischer Darstellung; -
3 die Mechatronikbaugruppe gemäß2 im Grundriss; und die -
4 die Mechatronikbaugruppe gemäß2 mit geschlossenem Gehäuse in axonometrischer Darstellung.
-
1 a circuit diagram of an embodiment of a subject hybrid circuitry; -
2 an objective mechatronics module without housing shell in axonometric representation; -
3 the mechatronics module according to2 in the floor plan; and the -
4 the mechatronics module according to2 with closed housing in axonometric representation.
Die gegenständliche hybride Schaltungsanordnung
In der ersten Schaltstrecke
Parallel zu dieser Schaltanordnung ist ein Varistor
Der hybriden Schaltungsanordnung
Die hybride Schaltungsanordnung
Die hybride Schaltungsanordnung
Die hybride Schaltungsanordnung
Weiters weist die hybride Schaltungsanordnung
Die
Die, der ersten Fläche
Bevorzugt ist vorgesehen, dass das Keramiksubstrat
Weiters kann vorgesehen sein, dass die Metallplatte
An der Metallplatte
Zwischenräume innerhalb des Gehäuses
Wie im einleitenden Teil bereist angeführt, ist die tatsächliche Anordnung der Bauteile sowie die Konzeption des elektromechanischen Aufbaus wichtig für das Funktionieren der hybriden Schaltungsanordnung
Bevorzugt ist vorgesehen, dass der erste mechanische Schalter
Sofern die hybride Schaltungsanordnung
Der oder die Schalter
Die Anschlussklemmen
Derartige Befestigungsblöcke
Die erste Halbleiterschaltungsanordnung
Die dritte Halbleiterschaltungsanordnung
Es hat sich als besonders vorteilhaft erwiesen, dass ein MosFet
Weiters ist bevorzugt vorgesehen, dass die hybride Schaltungsanordnung
Die Mechatronikbaugruppe
Der wenigstens einen Shunt
Die Mechatronikbaugruppe
Besonders bevorzugt ist vorgesehen, dass die Leistungsbaugruppen eines Niederspannungs-Schutzschaltgeräts in einer gegenständlichen Mechatronikbaugruppe
ZITATE ENTHALTEN IN DER BESCHREIBUNG QUOTES INCLUDE IN THE DESCRIPTION
Diese Liste der vom Anmelder aufgeführten Dokumente wurde automatisiert erzeugt und ist ausschließlich zur besseren Information des Lesers aufgenommen. Die Liste ist nicht Bestandteil der deutschen Patent- bzw. Gebrauchsmusteranmeldung. Das DPMA übernimmt keinerlei Haftung für etwaige Fehler oder Auslassungen.This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.
Zitierte PatentliteraturCited patent literature
- WO 2015/028634 A1 [0002]WO 2015/028634 A1 [0002]
Claims (14)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102017127076.0A DE102017127076A1 (en) | 2017-11-17 | 2017-11-17 | Mechatronics module with a hybrid circuit arrangement |
PCT/EP2018/080778 WO2019096692A1 (en) | 2017-11-17 | 2018-11-09 | Mechatronic module having a hybrid circuit arrangement |
CN201880074611.7A CN111386586B (en) | 2017-11-17 | 2018-11-09 | Electromechanical module with hybrid circuit arrangement |
EP18800628.2A EP3711075B1 (en) | 2017-11-17 | 2018-11-09 | Mechatronic module having a hybrid circuit arrangement |
US16/764,407 US11948768B2 (en) | 2017-11-17 | 2018-11-09 | Mechatronic module having a hybrid circuit arrangement |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102017127076.0A DE102017127076A1 (en) | 2017-11-17 | 2017-11-17 | Mechatronics module with a hybrid circuit arrangement |
Publications (1)
Publication Number | Publication Date |
---|---|
DE102017127076A1 true DE102017127076A1 (en) | 2019-05-23 |
Family
ID=64270903
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102017127076.0A Pending DE102017127076A1 (en) | 2017-11-17 | 2017-11-17 | Mechatronics module with a hybrid circuit arrangement |
Country Status (5)
Country | Link |
---|---|
US (1) | US11948768B2 (en) |
EP (1) | EP3711075B1 (en) |
CN (1) | CN111386586B (en) |
DE (1) | DE102017127076A1 (en) |
WO (1) | WO2019096692A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102019125733B4 (en) * | 2019-09-25 | 2021-10-07 | Audi Ag | Molded power module with integrated excitation circuit |
FR3123142A1 (en) * | 2021-05-20 | 2022-11-25 | Schneider Electric Industries Sas | Electrical protection devices and systems comprising an integrated cut-off module |
Citations (4)
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DE4122428A1 (en) * | 1991-04-08 | 1993-01-28 | Export Contor Aussenhandel | CIRCUIT ARRANGEMENT |
DE102009002993A1 (en) * | 2009-05-11 | 2010-11-18 | Infineon Technologies Ag | Power semiconductor module with spaced circuit carriers |
US20140313628A1 (en) * | 2011-11-18 | 2014-10-23 | Abb Technology Ag | Hvdc hybrid circuit breaker with snubber circuit |
WO2015028634A1 (en) | 2013-08-30 | 2015-03-05 | Eaton Industries (Netherlands) B.V. | Circuit breaker with hybrid switch |
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US20090161277A1 (en) * | 2007-12-21 | 2009-06-25 | Robert Roesner | Method and device for preventing damage to a semiconductor switch circuit during a failure |
US8237260B2 (en) * | 2008-11-26 | 2012-08-07 | Infineon Technologies Ag | Power semiconductor module with segmented base plate |
DE102009002191B4 (en) * | 2009-04-03 | 2012-07-12 | Infineon Technologies Ag | Power semiconductor module, power semiconductor module assembly, and method of making a power semiconductor module assembly |
CN101854075B (en) * | 2010-05-27 | 2012-09-05 | Asco电力技术公司 | Arc extinguishing hybrid switch and switching method |
CN102136380A (en) * | 2011-03-21 | 2011-07-27 | 齐齐哈尔齐力达电子有限公司 | Arc extinction combination switch with rectifier tube |
CN102999179A (en) * | 2011-09-09 | 2013-03-27 | 技嘉科技股份有限公司 | Mouse with switching device and switching device |
CN104205281B (en) * | 2012-03-09 | 2017-03-08 | 西门子公司 | Equipment for an extremely middle switching DC current in direct current network |
CN103021739B (en) * | 2012-11-30 | 2014-10-15 | 西安交通大学 | Hybrid direct-current circuit breaker |
DE102013102829B4 (en) | 2013-03-20 | 2017-10-19 | Semikron Elektronik Gmbh & Co. Kg | Power semiconductor module and arrangement hereby |
CN104767170B (en) * | 2014-01-06 | 2018-12-11 | 国家电网公司 | A kind of hybrid high voltage DC breaker and its implementation |
CN104979795B (en) * | 2014-04-08 | 2018-10-09 | 国家电网公司 | A kind of passive high voltage DC breaker and its implementation |
CN104979796B (en) * | 2015-06-10 | 2018-05-04 | 许继集团有限公司 | A kind of precharge type high speed d-c circuit breaker and its control method |
EP3157034B1 (en) * | 2015-10-13 | 2018-03-21 | General Electric Technology GmbH | Mechatronic circuit-breaker device |
CN105870877B (en) * | 2016-03-14 | 2019-12-13 | 全球能源互联网研究院 | passive hybrid direct current breaker based on thyristor and application method thereof |
CN105609344B (en) * | 2016-03-22 | 2019-06-11 | 国网天津市电力公司 | A kind of hybrid direct-current breaker topology structure |
CN106981858A (en) * | 2016-12-29 | 2017-07-25 | 全球能源互联网研究院 | Dc circuit breaker and its control method |
EP3373317A1 (en) * | 2017-03-06 | 2018-09-12 | General Electric Technology GmbH | Method for closing a mechatronic circuit breaker |
EP3429045B1 (en) * | 2017-07-11 | 2022-06-22 | General Electric Technology GmbH | Self-powered switch device adapted to be included in a mechatronic circuit breaker and method for controlling the self-powered switch device |
-
2017
- 2017-11-17 DE DE102017127076.0A patent/DE102017127076A1/en active Pending
-
2018
- 2018-11-09 EP EP18800628.2A patent/EP3711075B1/en active Active
- 2018-11-09 US US16/764,407 patent/US11948768B2/en active Active
- 2018-11-09 WO PCT/EP2018/080778 patent/WO2019096692A1/en unknown
- 2018-11-09 CN CN201880074611.7A patent/CN111386586B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4122428A1 (en) * | 1991-04-08 | 1993-01-28 | Export Contor Aussenhandel | CIRCUIT ARRANGEMENT |
DE102009002993A1 (en) * | 2009-05-11 | 2010-11-18 | Infineon Technologies Ag | Power semiconductor module with spaced circuit carriers |
US20140313628A1 (en) * | 2011-11-18 | 2014-10-23 | Abb Technology Ag | Hvdc hybrid circuit breaker with snubber circuit |
WO2015028634A1 (en) | 2013-08-30 | 2015-03-05 | Eaton Industries (Netherlands) B.V. | Circuit breaker with hybrid switch |
Also Published As
Publication number | Publication date |
---|---|
CN111386586B (en) | 2022-11-29 |
WO2019096692A1 (en) | 2019-05-23 |
US11948768B2 (en) | 2024-04-02 |
US20200357582A1 (en) | 2020-11-12 |
EP3711075B1 (en) | 2022-12-28 |
EP3711075A1 (en) | 2020-09-23 |
CN111386586A (en) | 2020-07-07 |
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