DE102017101769A1 - METHOD FOR PRODUCING AN OPTOELECTRONIC FIBER AND OPTOELECTRONIC FIBER - Google Patents

Abstract

In various embodiments, there is provided a method of making an opto-electronic fiber (20) comprising: placing an electrically conductive first wire (30) and at least one electrically conductive second wire (32) side-by-side; at least one first optoelectronic component (22) is mechanically and electrically connected to the first wire (30) and the second wire (32) such that the first optoelectronic component (22) is connected by means of the first wire (30) and the second wire (32 ) can be energized and controlled; and the first wire (30), the second wire (32) and the first optoelectronic device (22) are embedded in an at least partially transparent sheath (34) such that the sheath (34) comprises the first wire (30), the second Wire (32) and the first optoelectronic component (22) in the radial direction surrounds.

Description

The invention relates to a method for producing an optoelectronic fiber and an optoelectronic fiber.

There are increasingly luminous textiles on the market. For luminous textiles, essentially two different concepts are known:

In a first concept, textiles forming fabrics are made by optical fibers, such as glass fibers or polymeric optical fibers (POF). A light coupling into the corresponding fiber bundles by means of conventional LEDs on the end faces of the fibers. The light propagates within the fibers due to multiple total reflection. A light extraction along the fibers takes place for example by structuring the surfaces of the fibers, for example by surface roughening and / or partial removal of the fiber cladding (cladding). The fabric with the optical fibers has a central light generation, in particular on the end faces of the optical fibers, for which the corresponding fiber bundles must be connected to highly luminous Lightengines.

In a second concept, metallic fibers, in particular wires, are woven into textile fabrics. At crossing points of these fibers conventional LEDs, such as premold LED packages, arranged and electrically contacted, for example, soldered.

An object of the invention is to provide a method for producing an optoelectronic fiber which is simple, quick and / or inexpensive to carry out and / or which contributes to the fact that a tissue can be produced in a simple manner by means of the optoelectronic fiber, in particular by means of a conventional one weaving.

An object of the invention is to provide an optoelectronic fiber which is simple, quick and / or inexpensive to produce and / or which makes it possible to produce a fabric in a simple manner, in particular in which it can be further processed by means of a conventional weaving method.

An object of the invention is achieved by a method for producing an optoelectronic fiber, in which: an electrically conductive first wire and at least one electrically conductive second wire are arranged side by side; at least one first optoelectronic component is mechanically and electrically connected to the first wire and the second wire in such a way that the first optoelectronic component can be supplied with energy and controlled by means of the first wire and the second wire; the first wire, the second wire and the first optoelectronic component are embedded in an at least partially transparent sheath such that the sheath surrounds the first wire, the second wire and the first optoelectronic component in the radial direction.

The connection of the optoelectronic component to the wires and the embedding of the wires and the optoelectronic component in the enclosure can be carried out simply, quickly and / or inexpensively. The cladding causes the opto-electronic fiber to be used and processed like a conventional fiber. For example, a tissue can be produced in a simple manner by means of the optoelectronic fiber, in particular in a conventional and / or established weaving method.

If the optoelectronic component is a light emitting component, for example an LED or an OLED, the optoelectronic fiber is a luminous fiber. If the light-emitting component is a light-absorbing component, for example a photodiode or a solar cell, the optoelectronic fiber is a light-absorbing fiber, for example a light-sensitive and / or power-generating fiber. The fact that the envelope is at least partially transparent means, for example, that the envelope is transparent or at least translucent for the light emitted by means of the light-emitting component.

The process enables the production of luminous fibers using LED components / chips directly while miniaturizing. Compared to a population of conventional fibers having fabric with premold components results in a significant miniaturization and improvement of the design degree of freedom. After production of the fabric, no additional assembly costs are required. Compared to a fabric of optical fibers with central light generation more flexible applications are given.

According to a development, at least one electrically conductive third wire and at least one second optoelectronic component are arranged before embedding in the sheath and connected to the first wire, the second wire and the first optoelectronic component such that the first optoelectronic component and the second optoelectronic component are electrically connected in parallel or electrically in series by means of the first wire, the second wire and the third wire.

The series connection and the parallel connection make it possible in each case to operate the optoelectronic components jointly. The series connection makes it possible to keep an operating current constant and / or that the operating current remains below a predetermined threshold value. The parallel circuit, however, makes it possible to keep an operating voltage constant and / or that the operating voltage remains below a predetermined threshold.

Optionally, one, two or more further optoelectronic components can be arranged and electrically connected to the first, second and / or third wire. Furthermore, one, two or more further wires can be arranged and connected to the optoelectronic components. The further optoelectronic components can be electrically connected in series by means of the wires to the first and / or second optoelectronic component or can be connected in parallel electrically to them.

If necessary, the wires can each be interrupted at one, two or more suitable locations, so that no short circuits occur when the parallel connection or series connection is produced. Optionally, electrically conductive bridges for electrically connecting two or more wires can be arranged. Furthermore, by means of the wires, suitable bridges and / or suitable interruptions of the wires, different groups of optoelectronic components can be formed. For example, all the optoelectronic components within a group can be electrically connected in series, and the groups can be connected in parallel with each other electrically. Alternatively, all the optoelectronic components within a group may be electrically connected in parallel and the groups may be electrically connected in series with each other.

According to a development, the wires are arranged so that they extend in a longitudinal direction. The wires are wound around a predetermined longitudinal axis which is parallel to the longitudinal direction. This causes the optoelectronic components connected to the devices to be arranged along the longitudinal axis in different angular ranges around the longitudinal axis. In the case of light-emitting components as optoelectronic components, this causes the emitted light to be emitted in different directions. In the case of light-absorbing components as optoelectronic components, this causes light to be received from different directions. This contributes to a rotationally symmetric mode of operation of the optoelectronic fiber. In other words, the mode of operation of the optoelectronic fiber is not impaired, or at least only negligibly, by a random rotation of the optoelectronic fiber about the longitudinal axis, for example in a weaving method.

According to a development, at least one of the wires is flattened at least within a wire section of the corresponding wire, before it is connected to the first optoelectronic component and / or second optoelectronic component. For example, the corresponding wire may initially have a circular profile and may then be pressed within the wire section to subsequently have a substantially rectangular profile in the wire section. This contributes to the fact that the corresponding wire within the wire section is particularly easy to contact electrically. In particular, the flattened wire section can contribute to a simple and / or secure mechanical and electrical connection of the first optoelectronic component to the corresponding wire. For example, the first optoelectronic component within the flattened wire section can be connected to the corresponding wire.

According to a development, the envelope is integrally formed. For example, the wrapper is formed of a single material. Alternatively or additionally, the envelope is formed in a single step.

Alternatively or additionally, the enclosure has no internal interfaces. This can help to make the wrapper particularly easy to produce.

In a further development, the enclosure is formed to include an inner wrapper and an outer wrapper, the outer wrapper surrounding the inner wrapper in the radial direction. For example, the inner sheath may be formed of a different material than the outer sheath. Alternatively, the inner wrapper and the outer wrapper may be formed of the same material. Alternatively or additionally, the inner sheath can be formed in a different step than the outer sheath. The inner wrapper and the outer wrapper have a common interface, which is an internal interface of the wrapper.

According to a further development, before forming the cladding in a material for producing the cladding, a dye and / or conversion material for converting light with respect to its wavelength is introduced. The dye contributes to the optoelectronic fiber having a given color. The conversion material makes it possible to convert the light generated by means of the optoelectronic component (s) with respect to its wavelength, so that the optoelectronic fiber can emit light of a different color than the optoelectronic component (s).

An object of the invention is achieved by an optoelectronic fiber, comprising: an electrically conductive first wire and at least one electrically conductive second wire, which are arranged side by side; at least one first opto-electronic device mechanically and electrically connected to the first wire and the second wire such that the first opto-electronic device can be powered and driven by the first wire and the second wire; and an at least partially transparent cladding, in which the first wire, the second wire and the first optoelectronic component are embedded in such a way that the cladding surrounds the first wire, the second wire and the first optoelectronic component in the radial direction.

The above-explained advantages and / or developments of the method for producing the optoelectronic fiber can be readily transferred to the optoelectronic fiber. In order to avoid repetition, therefore, at this point a repeated explanation of the advantages or developments is omitted and referred to the above.

According to a further development, at least one electrically conductive third wire and at least one second optoelectronic component are arranged and connected to the first wire, the second wire and the first optoelectronic component such that the first optoelectronic component and the second optoelectronic component are connected by means of the first wire, second wire and the third wire are electrically connected in parallel or electrically in series.

According to a development, the wires extend in a longitudinal direction and are wound around a predetermined longitudinal axis, which is parallel to the longitudinal direction.

According to a development, at least one of the wires is flattened at least within a wire section of the corresponding wire.

According to a development, the envelope is integrally formed.

According to a development, the casing has an inner casing and an outer casing, wherein the outer casing surrounds the inner casing in the radial direction.

According to a development, the envelope has a dye and / or conversion material for converting the light with respect to its wavelength.

According to a development, the first optoelectronic component and the second optoelectronic component are each a light-emitting component and / or a light-absorbing component.

Embodiments of the invention are illustrated in the figures and are explained in more detail below.

• 1 eine Schnittdarstellung eines Ausführungsbeispiels einer optoelektronischen Faser;
• 2 eine Schnittdarstellung eines Ausführungsbeispiels einer optoelektronischen Faser;
• 3 ein Schaltbild eines Ausführungsbeispiels einer optoelektronischen Faser;
• 4 ein Schaltbild eines Ausführungsbeispiels einer optoelektronischen Faser;
• 5 eine seitliche Schnittdarstellung eines Ausführungsbeispiels eines optoelektronischen Bauelements;
• 6 eine seitliche Schnittdarstellung eines Ausführungsbeispiels eines optoelektronischen Bauelements;
• 7 eine seitliche Schnittdarstellung eines Ausführungsbeispiels eines optoelektronischen Bauelements;
• 8 eine seitliche Schnittdarstellung eines Ausführungsbeispiels eines optoelektronischen Bauelements;
• 9 eine seitliche Schnittdarstellung eines Ausführungsbeispiels eines optoelektronischen Bauelements;
• 10 einen ersten Zustand während eines Ausführungsbeispiels eines Verfahrens zum Herstellen einer optoelektronischen Faser;
• 11 einen zweiten Zustand während des Verfahrens zum Herstellen der optoelektronischen Faser;
• 12 einen dritten Zustand während des Verfahrens zum Herstellen der optoelektronischen Faser;
• 13 einen vierten Zustand während des Verfahrens zum Herstellen der optoelektronischen Faser.

Show it:

• 1 a sectional view of an embodiment of an optoelectronic fiber;
• 2 a sectional view of an embodiment of an optoelectronic fiber;
• 3 a circuit diagram of an embodiment of an optoelectronic fiber;
• 4 a circuit diagram of an embodiment of an optoelectronic fiber;
• 5 a side sectional view of an embodiment of an optoelectronic device;
• 6 a side sectional view of an embodiment of an optoelectronic device;
• 7 a side sectional view of an embodiment of an optoelectronic device;
• 8th a side sectional view of an embodiment of an optoelectronic device;
• 9 a side sectional view of an embodiment of an optoelectronic device;
• 10 a first state during one embodiment of a method of making an optoelectronic fiber;
• 11 a second state during the process for producing the optoelectronic fiber;
• 12 a third state during the process for producing the optoelectronic fiber;
• 13 a fourth state during the process for producing the optoelectronic fiber.

In the following detailed description, reference is made to the accompanying drawings, which form a part of this specification, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. Because components of embodiments may be positioned in a number of different orientations, the directional terminology is illustrative and is in no way limiting. It should be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. It should be understood that the features of the various embodiments described herein may be combined with each other unless specifically stated otherwise. The following detailed description is therefore not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims. In the figures, identical or similar elements are provided with identical reference numerals, as appropriate.

An optoelectronic fiber may have one, two or more optoelectronic components. Optionally, an optoelectronic fiber can also have one, two or more electronic components. An electronic component may have, for example, an active and / or a passive component. An active electronic component may have, for example, a computing, control and / or regulating unit and / or a transistor. A passive electronic component may, for example, comprise a capacitor, a resistor, a diode or a coil.

An optoelectronic component may be an electromagnetic radiation emitting component or an electromagnetic radiation absorbing component. An electromagnetic radiation absorbing component may be, for example, a solar cell. In various embodiments, a component emitting electromagnetic radiation can be a semiconductor device emitting electromagnetic radiation and / or a diode emitting electromagnetic radiation, a diode emitting organic electromagnetic radiation, a transistor emitting electromagnetic radiation or a transistor emitting organic electromagnetic radiation be. The radiation may, for example, be light in the visible range, UV light and / or infrared light. In this context, the electromagnetic radiation emitting device may be formed, for example, as a light emitting diode (LED) as an organic light emitting diode (OLED), as a light emitting transistor or as an organic light emitting transistor. The light emitting device may be part of an integrated circuit in various embodiments. Furthermore, a plurality of light-emitting components may be provided, for example housed in a common housing.

1 shows a sectional view of an embodiment of an optoelectronic fiber 20 , The optoelectronic fiber 20 has an optoelectronic component 22 , a first wire 30 , a second wire 32 and a serving 34 on.

The optoelectronic component 22 has a semiconductor chip 23 on, at the bottom of a first contact 24 and a second contact 26 for electrically contacting the semiconductor chip 23 are arranged. The first contact 24 is mechanical and electrical with the first wire 30 connected. The second contact 26 is mechanical and electrical with the second wire 32 connected. The envelope 34 surrounds the optoelectronic component 22 and the wires 30, 32 in the radial direction. In particular, the cladding surrounds 34 the optoelectronic component 22 and the wires 30 . 32 in the radial direction completely. This means that in the longitudinal sections of the optoelectronic fiber 20 in which the optoelectronic device 22 or optionally further optoelectronic components are arranged, the enclosure 34 the optoelectronic component 22 and the wires 30 . 32 completely surrounds in the radial direction. However, there may be longitudinal sections in which the enclosure 34 at least partially removed, for example around the wires 30 . 32 to contact or lead to the outside.

A longitudinal direction of the optoelectronic fiber 20 is in 1 perpendicular to the drawing plane. In addition to the first optoelectronic component 22 can along the longitudinal direction of the optoelectronic fiber 20 one, two or more further optoelectronic components may be arranged. If as in the in 1 shown embodiment, only two wires 30 . 32 are arranged in the optoelectronic fiber 20, so are the optoelectronic devices 22 all connected in parallel.

The first and / or the second wire 30 . 32 may include or be formed of metal. The first and / or the second wire 30 . 32 For example, copper, silver, aluminum, iron and / or gold or an alloy containing a substantial proportion of one or more of said metals, or may be formed thereof. The first and / or the second wire 30 . 32 may each have a core and a surface coating or be formed thereof to a particularly good electrical connection to the contacts 24 . 26 the optoelectronic components 22 to ensure. For example, the first and / or the second wire 30 . 32 each have a copper wire as the core and an external gold layer as a surface coating. Alternatively or additionally, the first and / or the second wire 30 . 32 be coated as corrosion protection and / or to avoid unwanted electrical contacts with an electrically insulating insulating material. The cross section of the wires 30 . 32 is circular, but may alternatively be rectangular, for example as a band. Further, along the longitudinal direction of the wires 30 . 32 be formed elongated wire sections, in which to ensure a particularly good mountability of the optoelectronic components 22 the circular cross-section is converted by embossing and / or high pressure into a nearly rectangular cross-section.

The serving 34 may for example comprise plastic or be formed by plastic. The serving 34 For example, PMMA, PC, PES, PET, PA, PI, PAI, PPS, PAN, PTFE, PE, PP, PVC, polyurethane, silicones, silarzanes, and / or siloxanes may be or may be formed from. The serving 34 may optionally have scattering particles and / or conversion material for converting the light emitted by the first optoelectronic component 22 light.

The optoelectronic fiber 20 may have a diameter in a range, for example, from 200 microns to 5 mm, for example from 400 microns to 1 mm. For example, the diameters of the optoelectronic fiber 20 depending on the desired field of application up to 600 microns, for example for the manufacture of clothing, or up to 5 mm, for example for the manufacture of technical fabrics, such as tarpaulins amount. The first optoelectronic component 22 and possibly further optoelectronic components may have a height in a range, for example, of 5 .mu.m to 3 mm, for example of 50 .mu.m to 500 .mu.m, and a width and / or a length in a range of, for example, 50 .mu.m to 5 mm, for example 100 μm to 500 μm. The wires 30 . 32 may each have a diameter in a range for example from 20 microns to 2 mm, for example from 50 microns to 200 microns.

2 shows a sectional view of an embodiment of an optoelectronic fiber 20 , The optoelectronic fiber 20 largely corresponds to the optoelectronic fiber explained above 20 , The optoelectronic fiber 20 has an electrically conductive third wire 35 on. In addition to the third wire 35 can the optoelectronic fiber 20 still have one, two or more wires. By means of the wires 30 . 32 . 35 may be used as an alternative to the parallel connection in the reference to 1 explained embodiment, a series connection of the optoelectronic components 22 will be realized.

A pure parallel connection of the optoelectronic components 22 requires relatively high operating currents to operate the optoelectronic devices 22 , For a given line resistance, the high operating currents lead to a voltage drop which is rapid in the longitudinal direction and caused by resistance. This is a length of a longitudinal section in which the optoelectronic fiber 20 homogeneously lit, reduced compared to a series connection.

A pure series circuit, however, already leads after a short path length along the optoelectronic fiber 20 too high operating voltages. Assuming that every 5 mm along the optoelectronic fiber 20 each one LED is arranged, then a SELV maximum voltage between 40 V and 50 V, for example, of about 50 V is already reached after a length of 8.5 cm. It is preferable to keep the operating voltage within the SELV range.

By means of the wires 30 . 32 . 35 can be realized as an alternative to the pure parallel connection and the pure series connection, a combination of a series circuit and a parallel circuit, ie a serial-parallel circuit. This serves to improve the performance in one for long linear arrays of optoelectronic devices 22 to adjust particularly favorable ratio of voltage and current. For example, among the above-explained assumptions, for example, up to 15 LEDs may be connected in series. Additional LEDs can then be connected in parallel to these 15 LEDs. For example, several groups of LEDs, in each of which up to 15 LEDs are connected in series, are connected in parallel with each other.

3 shows a circuit diagram of an embodiment of an optoelectronic fiber 20 , The optoelectronic fiber 20 For example, it can be largely one of the optoelectronic fibers discussed above 20 correspond. The optoelectronic fiber 20 In addition to the first, second and third wire 30 . 32 . 35 an electrically conductive fourth wire 40 on. The optoelectronic fiber 20 has, in addition to the first optoelectronic component 22 a second optoelectronic device 36 , and a third optoelectronic device 38 on. The optoelectronic components 22 . 36 . 38 are with the first wire 30 and the second wire 32 mechanically and electrically connected directly.

In addition, the optoelectronic fiber has 20 still further optoelectronic components, which in principle as the first, second and / or third optoelectronic component 22, 36, 38 may be formed and are not marked for reasons of clarity and understandable explanation with further reference numerals. Thus form the first, second and third optoelectronic component 22 . 36 , 38 a first group of optoelectronic components and the optoelectronic components not marked with reference symbols form a second group of optoelectronic components.

The optoelectronic fiber 20 has several bridges 44 on, which are formed electrically conductive and the isolated the first wire 30 with the third wire 35 and the second wire 32 with the fourth wire 40 connect electrically. The first and the second wire 30 . 32 have several breaks 46 on. At the interruptions 46 is an electrical conductivity of the corresponding wire 30 . 32 interrupted. In other words, the breaks 46 represent electrical insulation. The breaks 46 are between the bridges 44 and the optoelectronic devices 22 . 36 . 38 alternating in the first wire 30 and the second wire 32 educated. The interruptions 46 cause the optoelectronic devices 22 . 36 . 38 are electrically connected in series within one of the groups. The bridges 44 cause the groups to be electrically connected in parallel with each other. In other words, the interruptions allow 46 and the bridges 44 the parallel-serial connection of the optoelectronic components 42 . 36 . 38 ,

Alternatively or additionally, all or some of the bridges 44 be designed as electrical resistors. This allows a particularly homogeneous light flux along the optoelectronic fiber 20 , even with long fiber lengths.

4 shows a circuit diagram of an embodiment of an optoelectronic fiber 20 , The optoelectronic fiber 20 For example, it can be largely related to 3 explained optoelectronic fiber 20 correspond. The optoelectronic components 22 . 36 . 38 are alternating over and under the wires 32 . 30 arranged. This can contribute to a particularly homogeneous, for example, all-round, light emission.

5 shows a side sectional view of an embodiment of an optoelectronic device, for example, the first optoelectronic device 22 , The optoelectronic component 22 For example, it may be a light emitting diode having an active region of inorganic compound semiconductors. For the light-emitting diode, for example, material systems such as InGaN, AlGaN and AlGaInP can be used. The two contacts 24 . 26 are on one side of the semiconductor chip 23 arranged, can alternatively but also be arranged on opposite sides of the semiconductor chip 23, as explained in more detail below with reference to the figures 7 to 9.

Alternatively or in addition to the light-emitting components, it is also possible to use light-absorbing components in the optoelectronic fiber 20 to be ordered. Then the optoelectronic fiber forms 20 a thread-like solar cell or a thread-like light sensor. Furthermore, the optoelectronic components can be organic light-emitting diodes, for example OLEDs, or organic solar cells, for example OPVs.

Furthermore, the optoelectronic component 22 be formed as a chip-package hybrid, in which the semiconductor chip 23 only of the epitaxial layers, with the contacts 24 . 26 exist exists. For this purpose it may be necessary to use metallic layers and plastic materials to support the semiconductor layers for mechanical stabilization.

Furthermore, the optoelectronic component 22 be designed as a chip-scale package (CSP). That is, the optoelectronic component 22 can the semiconductor chip 23 in a housing, that is, for example, an LED package with a semiconductor chip as explained above 23 with additional functions, which are explained below.

6 shows a side sectional view of an embodiment of an optoelectronic device 22 , For example, the largely to the above-explained first optoelectronic device 22 can correspond. The optoelectronic component 22 has a conversion element 48 which is arranged and configured so that it from the semiconductor chip 23 emitted primary radiation converted into secondary radiation. The primary radiation can mix with the secondary radiation, so that a more or less uniformly mixed light of primary radiation and secondary radiation is formed, for example white light. Alternatively, almost all of the primary radiation can be converted so that that of the optoelectronic fiber 20 radiated light consists essentially of converted light, which is also called full conversion, for example. The primary radiation may be, for example, blue light or UV light. The secondary radiation can be, for example, yellow light.

7 shows a side sectional view of an embodiment of an optoelectronic device 22 , For example, the largely one of the above-explained optoelectronic devices 22 can correspond. In the optoelectronic component 22 is the first contact 24 on another side of the semiconductor chip 23 formed as the second contact 26 , This allows a simple way, the optoelectronic device 22 between the wires 30 . 32 . 35 and or 40 to arrange.

8th shows a side sectional view of an embodiment of an optoelectronic device 22 , For example, the largely one of the above-explained optoelectronic devices 22 can correspond. The optoelectronic component 22 has an electrically conductive first flag 50 and an electrically conductive second flag 52 on. The first flag 50 is physical and electrical with the first contact 24 connected. The second flag 52 is physical and electrical with the second contact 26 connected. The first and the second flag 50 . 52 protrude laterally across the semiconductor chip on different sides 23 and optionally the conversion element 48 out.

The flags 50 . 52 in each case form a metallic contact extension extending beyond the semiconductor chip 23 for easier mounting of the first optoelectronic component 22 on one of the wires 30 . 32 and for improving the heat dissipation during operation of the first optoelectronic component 22 , These contact extensions can also serve to create contact points at positions useful for further processing, for example laterally laterally of the active semiconductor layers.

9 shows a side sectional view of an embodiment of an optoelectronic device 22 , The optoelectronic component 22 For example, it can largely be one of the optoelectronic components explained above 22 correspond. The optoelectronic component 22 has a first side contact on one of its lateral side surfaces 54 and on another of its lateral side surfaces, a second side contact 56 on. The first page contact 54 is physically and electrically with the first flag 50 connected. The second side contact 56 is physically and electrically with the second flag 52 connected. The page contacts 54 . 56 allow lateral contact of the optoelectronic device 22 , The page contacts 54 . 56 allow the optoelectronic device 22 in the lateral direction between the first and the second wire 30 . 32 to arrange.

In the 10 to 13 are different states during one embodiment of a method of making an optoelectronic fiber, such as one of the optoelectronic fibers discussed above 20 represented. The various states are achieved by processing individual process steps of the method. Thus, the various states illustrated are also representative of the method steps of the method.

10 shows a first state during the process for producing the optoelectronic fiber 20 , In the first state, the wires are, for example, the first wire 30 and the second wire 32 arranged side by side. For example, the wires 30 . 32 be arranged parallel to each other. Optionally, other wires, such as the third wire 35 or the fourth wire 40 next to the first and the second wire 30 . 32 to be ordered.

11 shows a second state during the process for producing the optoelectronic fiber 20 , In the second state, the optoelectronic components, in particular the first optoelectronic component 22 and optionally further optoelectronic components 36 . 38 on the wires 30 . 32 arranged and electrically connected thereto. The optoelectronic components 22 . 36 . 38 For example, by gluing with conductive adhesive, by soldering, laser welding, sintering with silver, gold or copper or other suitable methods on the wires 30 , 32 are attached. With suitable shaping of the flags explained above 50 . 52 can the optoelectronic devices 42 . 36 . 38 by mechanical pressing and / or crimping on the wires 30 . 32 be attached.

If the optoelectronic devices 22 . 36 . 38 or optionally further optoelectronic components in the optoelectronic fiber 20 be electrically connected in series and / or electrically parallel, so the bridges 44 and / or the interruptions 46 be formed. The bridges 44 can go to the optoelectronic devices 22 . 36 . 38 corresponding way on the wires 30 . 32 be attached. The interruptions 46 For example, after mounting the optoelectronic devices 22 . 36 . 38 and bridges 44 be formed by laser or mechanical processing.

A combination of a series connection and a parallel circuit, as for example in the 3 and 4 is shown by means of four wires 30 . 32 . 35 . 40 particularly easy to implement. This combination is also with only three wires 30 . 32 . 35 realizable. In this case, then instead of the first and the second wire 30 , 32 just one of the wires 30 . 32 used that then between the two contacts 24 . 26 the same optoelectronic device 22 . 35 . 40 must be interrupted, which is technically complicated.

12 shows an optional third state during the process for producing the optoelectronic fiber 20 , In the third state are the wires 30 . 32 with the optoelectronic components 22 . 36 . 38 wound and / or twisted about a longitudinal axis 58. This allows targeted the mechanical properties of the optoelectronic fiber 20 be influenced and / or the direction are varied, from which the optoelectronic components 22 . 36 . 38 Receive light or in the optoelectronic devices 22 , 36, 38 emit light.

13 shows a fourth state during the process for producing the optoelectronic fiber 20 , In the fourth state are the wires 30 . 32 and the optoelectronic components 22 . 36 . 38 in the serving 34 embedded. The material of the cladding 34 is applied by a suitable method. This can be, for example, coextrusion, polycondensation, polymerization or polyaddition.

Optionally, the wrapper 34 an inner cladding 60 and an outer cladding 62 exhibit. Optionally, the optoelectronic components 22 . 36 . 38 and the wires 30 , 32 in the inner cladding 60 be embedded. The inner cladding 60 can in the outer cladding 62 be embedded. The inner cladding 60 and / or the outer wrap 62 may optionally comprise scattering particles and / or conversion material. For example, one of the sheaths 60 . 62 Have scattering particles and the other of the sheaths 60 . 62 may have conversion material. Alternatively or additionally, both sheaths 60 . 62 Have scattering particles and / or conversion material. For example, the wrappings 60 . 62 have different scattering particles or different conversion material.

The invention is not limited to the specified embodiments. For example, all of the exemplary embodiments shown may have one, two or more optoelectronic components and / or two, three or more wires. Further, all of the embodiments shown may include inner and outer sheaths 60, 62. Furthermore, in all embodiments shown in the 5 to 9 shown optoelectronic components 22 be used.

LIST OF REFERENCE NUMBERS

optoelectronic fiber 20 first optoelectronic component 22 Semiconductor chip 23 first contact 24 second contact 26 first wire 30 second wire 32 third wire 35 second optoelectronic component 36 third optoelectronic component 38 fourth wire 40 bridge 44 interruption 46 conversion element 48 first flag 50 second flag 52 first page contact 54 second page contact 56 longitudinal axis 58 inner cladding 60 outer cladding 62

Claims (15)

Method for producing an optoelectronic fiber (20), in which an electrically conductive first wire (30) and at least one electrically conductive second wire (32) are arranged side by side, at least one first optoelectronic component (22) is mechanically and electrically connected to the first wire (30) and the second wire (32) such that the first optoelectronic component (22) is connected by means of the first wire (30) and the second wire (32 ) can be energized and controlled, and the first wire (30), the second wire (32) and the first optoelectronic device (22) are embedded in an at least partially transparent cladding such that the cladding comprises the first wire (30), the second wire (32) and the first one Optoelectronic component (22) surrounds in the radial direction. Method according to Claim 1 in which at least one electrically conductive third wire (35) and at least one second optoelectronic component (36) are arranged prior to embedding in the sheath (34) and connected to the first wire (30), the second wire (32) and the first optoelectronic component (22), that the first optoelectronic component (22) and the second optoelectronic component (36) by means of the first wire (30), the second wire (32) and the third wire (35) electrically parallel or electrically in Series are switched. A method according to any one of the preceding claims, wherein the wires are arranged to extend in a longitudinal direction and wound around a predetermined longitudinal axis parallel to the longitudinal direction. Method according to one of the preceding claims, wherein at least one of the wires (30, 32, 35) is flattened at least within a wire section of the corresponding wire (30, 32, 35) before it is connected to the first optoelectronic component (22) and / or second optoelectronic component (36). Method according to one of the preceding claims, wherein the envelope (34) is integrally formed. Method according to one of Claims 1 to 4 in that the sheath (34) is formed to include an inner sheath (60) and an outer sheath (62), the outer sheath (62) surrounding the inner sheath (60) in the radial direction. A method according to any one of the preceding claims, wherein prior to forming the cladding (34) in a material for forming the cladding (34) a dye and / or conversion material for converting the light in wavelength is introduced. Optoelectronic fiber (20), with an electrically conductive first wire (30) and at least one electrically conductive second wire (32), which are arranged side by side, at least one first optoelectronic component (22), which is mechanically and electrically connected to the first wire (30) and the second wire (32) such that the first optoelectronic component (22) by means of the first wire (30) and the second wire (32) can be energized and controlled, and an at least partially transparent cladding (34) into which the first wire (30), the second wire (32) and the first optoelectronic device (22) are embedded such that the cladding (34) encases the first wire (30) second wire (32) and the first optoelectronic component (22) in the radial direction surrounds. Optoelectronic fiber (20) according to Claim 8 in which at least one electrically conductive third wire (35) and at least one second optoelectronic component (36) are arranged and connected to the first wire (30), the second wire (32) and the first optoelectronic component (22) the first optoelectronic component (22) and the second optoelectronic component (36) are connected electrically in parallel or electrically in series by means of the first wire (30), the second wire (32) and the third wire (35). Optoelectronic fiber (20) according to one of Claims 8 or 9 in that the wires (30, 32, 35) extend in a longitudinal direction and are wound around a predetermined longitudinal axis (58) which is parallel to the longitudinal direction. Optoelectronic fiber (20) according to one of Claims 8 to 10 in which at least one of the wires (30, 32, 35) is flattened at least within a wire section of the corresponding wire. An optoelectronic fiber (20) according to any one of the preceding claims, wherein the sheath (34) is integrally formed. Optoelectronic fiber (20) according to one of Claims 8 to 11 in that the sheath (34) has an inner sheath (60) and an outer sheath (62), the outer sheath (62) surrounding the inner sheath (60) in the radial direction. Optoelectronic fiber (20) according to one of Claims 8 to 13 in that the sheath (34) comprises a dye and / or conversion material for converting the light with respect to its wavelength. Optoelectronic fiber (20) according to one of Claims 8 to 14 in which the first optoelectronic component (22) and the second optoelectronic component (36) are each a light-emitting component and / or a light-absorbing component.

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