DE102016117917A1 - Method for producing a heating device and heating device - Google Patents

Abstract

The invention relates to a method for producing a heating device and such a heating device, wherein a layer arrangement of a first layer and a second layer disposed on the first layer is provided, wherein the first layer comprises at least a first particulate material embedded in a first plastic matrix, wherein the is formed electrically conductive, wherein the first plastic matrix of the first layer is evaporated such that at least one breakthrough formed by the first layer to the second layer and the first particulate material forms at least a portion of a first primer layer at the opening, wherein for forming a Conductor structure on the first primer layer, an electrically conductive material is deposited, wherein the further electrically conductive material forms an electrical connection to the second layer.

Description

The invention relates to a method for producing a heating device according to claim 1 and a heating device according to claim 12.

A heating device is known which has a printed circuit board and electrical printed conductors on the printed circuit board.

It is the object of the invention to provide an improved method of manufacturing a heater and an improved heater.

This object is achieved by means of a method according to claim 1 and by means of a heating device according to claim 12. Advantageous embodiments are given in the dependent claims.

According to the invention, it has been recognized that an improved method for producing a heating device can be provided by providing a layer arrangement comprising a first layer and a second layer arranged on the first layer, wherein the first layer comprises at least one first particle material embedded in a first plastic matrix , The second layer is electrically conductive. The first plastic matrix of the first layer is evaporated in such a way that at least one breakthrough through the first layer to the second layer is formed and the first particulate material forms at least a portion of a first primer layer at the aperture, wherein an electrically conductive layer is formed on the first primer layer to form a conductor pattern Material is deposited, wherein the further electrically conductive material forms an electrical connection to the second layer.

As a result, the heating device can be made particularly compact and film-like. Furthermore, the heater has a particularly uniform surface heating.

In a further embodiment, the first plastic matrix of the first layer is vapor-deposited in sections such that at least one recess is formed in the first layer and the first particle material forms a further section of the first primer layer in the recess. A recess base of the recess is arranged at a distance from the second layer, wherein the electrically conductive material is deposited on the further section of the first primer layer.

In a further embodiment, the second layer is provided with a second plastic matrix, the first particulate material and a second particulate material. Below the aperture, the second plastic matrix is partially evaporated in such a way that a groove is formed in the second layer, wherein the first particle material of the second layer forms in sections a further portion of the first primer layer at the groove.

In a further embodiment, in order to form a further conductor structure, the first plastic matrix of the first layer is partially vaporized in such a way that at least one further breakthrough through the first layer to the second layer forms and the first particle material forms a subregion of a second primer layer on the further breakthrough on the portion of the second primer layer, a further electrically conductive material is deposited.

In a further embodiment, the first plastic matrix of the first layer is evaporated in such a way that at least one further recess is formed in the first layer and the first particle material forms a further section of the wide primer layer in the further recess, whereby a further recess bottom is spaced from the further recess arranged the second layer and is arranged offset to the recess, wherein on the further portion of the second primer layer, the further electrically conductive material is deposited. In a further embodiment, below the further opening, the second plastic matrix is partially vaporized in such a way that a further groove forms in the second layer, the first particle material of the second layer forming a further subregion of the second primer layer on the further groove, wherein on the second Primer layer, the further electrically conductive material for forming the further conductor structure is deposited, wherein the further electrically conductive material forms the electrical connection to the second layer at the further groove.

In a further embodiment, the layer arrangement is provided with a third layer, wherein the third layer is arranged on an opposite side of the second layer to the first layer, wherein in the third layer at least the first particulate material is embedded in a third plastic matrix, wherein in sections on a the first layer facing away from the third layer, the third plastic matrix of the third layer is vaporized such that a further breakthrough through the third layer to the second layer is formed and the first particulate material forms a portion of a second primer layer on the further breakthrough, wherein on the portion of the second primer layer another electrically conductive material is deposited to form a further ladder structure. As a result, a reliable heating substantially over the entire width of the heater can be ensured.

In a further embodiment, the third plastic matrix of the third layer is evaporated in such a way that at least one further recess is formed in the third layer and the first particle material forms a further section of the further primer layer in the further recess, wherein a further recess bottom of the further recess is spaced apart the second layer is arranged, wherein on the further portion of the second primer layer, the further electrically conductive material is deposited.

In a further embodiment, above the aperture, the second plastic matrix is partially evaporated in such a way that a groove forms in the second layer, the first particle material of the second layer forming the second primer layer at the groove in sections.

In a further embodiment, the plastic matrix is evaporated by means of a laser.

In a further embodiment, the electrically conductive material is deposited by means of a metallic plasma and / or by means of electroplating.

In a further embodiment, the heating device has a layer arrangement and a conductor structure, wherein the layer arrangement comprises a first layer and at least one second layer, wherein the first layer comprises at least a first particulate material and a first plastic matrix, wherein the first particulate material embedded in the first plastic matrix is, wherein the second layer is electrically conductive, wherein in the first layer, an opening is arranged, wherein in the first layer, a recess is arranged, wherein the aperture and the recess are interconnected, wherein a recess base of the recess spaced from the second Layer is arranged, wherein in the recess and the aperture, the conductor pattern is arranged, wherein the conductor structure is at least partially electrically connected to the second layer.

In a further embodiment, the heating device has a further conductor structure. In the first layer, a further opening and a further recess are arranged. The further breakthrough is offset from the opening and the further recess arranged offset to the recess. A further recess base of the further recess is arranged at a distance from the second layer, wherein the further opening and the further recess are connected, wherein the further conductor structure is arranged in the further opening and in the further recess, wherein the further conductor structure at least in sections with the second layer electrically connected.

In a further embodiment, the heating device has a further conductor structure. The layer arrangement comprises a third layer. The second layer is disposed between the first layer and the third layer, wherein the third layer comprises a third plastic matrix and the first particulate material, wherein in the third layer, a further opening and a further recess are arranged, wherein a further recess bottom of the further recess spaced is arranged to the second layer, wherein the further opening and the further recess are connected to each other in sections, wherein in the further breakthrough and in the further recess, the further conductor structure is arranged, wherein the further conductor structure is at least partially electrically connected to the second layer.

In a further embodiment, the recess is arranged inclined to the opening.

In a further embodiment, the first particulate material has at least metal oxide as material. Additionally or alternatively, the second particulate material comprises at least one of the following materials: graphene, carbon black, graphene-like nanoparticles, inorganic semiconductor material, organic semiconductor material. Additionally or alternatively, the first plastic matrix and / or the second plastic matrix comprises at least one of the following materials: thermoplastic, thermoset, elastomer, polyethylene.

In a further embodiment, the first layer has a first thickness with a value which lies in the range of 0.005 mm to 0.1 mm, in particular in a range of 0.02 mm to 0.04 mm, and / or points the second layer has a second thickness of a value ranging from 0.01 mm to 0.2 mm, more preferably ranging from 0.07 to 0.11 mm.

As a result, the heating device can be produced in a particularly simple and cost-effective manner. Furthermore, the conductor structure can be designed geometrically freely.

The invention will be explained in more detail with reference to figures. Showing:

1 a perspective view of a heater according to a first embodiment;

2 a section of a sectional view through the in 1 shown heater along a in 1 shown first section plane AA;

3 a section of a sectional view through the in 1 shown heater along a in 1 shown second sectional plane BB;

4 shows a sectional view along an in 1 shown third section plane CC through the in 1 shown heater;

5 a flow diagram of a method for producing the in the 1 to 4 shown heater;

6 a schematic representation of the in the 1 to 4 shown heater after a first process step;

7 a schematic representation of the in the 1 to 4 shown heater during a second process step;

8th a schematic representation of the in the 1 to 4 shown heater according to a third method step;

9 a schematic representation of the in the 1 to 4 shown heater after a fourth process step;

10 a sectional view along an in 2 shown fourth sectional plane DD by a heater according to a second embodiment;

11 a flow chart of a method for producing the in 10 shown heater.

In the following figures is based on a coordinate system 5 Referenced. The coordinate system 5 is exemplified as a legal system and includes an x-axis (longitudinal direction), a y-axis (transverse direction) and a z-axis (height direction). Also, other embodiments of the coordinate system 5 conceivable.

1 shows a plan view of a heater 100 according to a first embodiment.

The heater 100 has a layer arrangement 105 , a first ladder structure 110 and by way of example at least one second conductor structure 115 on. The number of ladder structures 110 . 115 is not limited.

The layer arrangement 105 exemplifies a first layer 120 on. In the embodiment, the layer arrangement is exemplary 105 formed plan, wherein exemplified the first conductor structure 110 and the second conductor structure 115 as well as the first layer 120 are arranged substantially in a common plane.

Furthermore, the layer arrangement 105 at least a second layer 125 on. The second layer 125 is exemplary below (in the z-direction) of the first layer 120 arranged. Furthermore, the layer arrangement 105 a third layer 130 have, wherein the third layer 130 below the second layer 125 is arranged so that the second layer 125 between the first layer 120 and the third layer 130 is arranged.

The first shift 120 , the second layer 125 and the third layer 130 are formed in a composite. Of particular advantage here is when the layer arrangement 105 in a multi-layer extrusion process, wherein in a single process step the three layers 120 . 125 . 130 are made substantially simultaneously.

Alternatively, the individual layers 120 . 125 . 130 laminated together. It is essential that between the layers 120 . 125 . 130 no further adhesive layer is provided.

The first shift 120 has a first plastic matrix 121 and at least a first particulate material 122 on. The first particle material 122 is in the first plastic matrix 121 embedded. Of particular advantage is when the first plastic matrix 121 at least one of the following materials: thermoplastic, thermoset, elastomer, polyethylene. Furthermore, in the first plastic matrix 121 at least one additive may be provided to at least one physical property of the first plastic matrix 121 to influence. For example, the additive may be a plasticizer.

It is also advantageous if the first particulate material 122 at least metal oxide as a material. The first particle material 122 is preferably suitable for laser direct structuring.

The first particle material 122 is so in the first plastic matrix 121 the first layer 120 embedded that the individual particles of the first particulate material 122 each completely from the first plastic matrix 121 are surrounded and an electric current transmission between the individual particles of the first particulate material 122 by the dielectric property of the first plastic matrix 121 is prevented. This will ensure that the first layer 120 electrically insulating against the second layer 125 acts.

It is also advantageous if the first particulate material 122 at least 10 to 35 mass% of the first layer 120 depending on the selected material of the first plastic matrix 121 having.

The second layer 125 has a second plastic matrix 126 , the first particle material 122 and a second particulate material 127 on. The second layer 125 is electrically conductive. It is particularly advantageous if the second electrical layer 125 having a predefined electrical resistance.

The second particulate material 127 as well as the first particulate material 122 are in the second plastic matrix 126 embedded. The second particulate material 127 has at least one of the following materials: carbon black, graphene, nanoparticles, inorganic semiconductor material, organic semiconductor material, 2 to 15 atomic layers of graphene embedded between graphite. Furthermore, the second plastic matrix 126 at least one of the following materials: thermoplastic, thermoset, elastomer, polyethylene. Furthermore, it is advantageous if the second particulate material 127 30 to 50 mass% of the second layer 125 having. The first particle material 122 points in the second layer 125 at least 5 to 25 percent by mass of the second layer 125 on. The remaining portions have the second plastic matrix 126 and optionally possible further constituents of the second layer 125 on.

The third layer 130 is exemplified in the embodiment as an insulating layer and has a third plastic matrix 131 on. The third plastic matrix 131 has at least one of the following materials: thermoplastic, thermoset, elastomer, polyethylene, plastic with dielectric properties.

Furthermore, the third layer 130 Also be designed as an adhesive layer, a cohesive connection to another component for fixing the layer arrangement 105 to provide at the further component.

Of particular advantage is when the first layer 120 a first thickness d1 having a value, wherein the value is in a range of at least 0.005 mm to 0.1 mm, in particular from 0.02 mm to 0.04 mm, and / or in particular 0.03 mm.

Of particular advantage is when the second layer 125 a second thickness d2 having a value, wherein the value is in a range of at least 0.01 mm to 0.2 mm, in particular from 0.07 mm to 0.11 mm, and / or in particular 0.09 mm.

Of particular advantage is when the third layer 130 a third thickness d3 having a value, wherein the value is in a range of at least 0.005 mm to 0.1 mm, in particular from 0.02 mm to 0.04 mm, and / or in particular 0.03 mm.

Furthermore, it is advantageous if the first thickness d1 is identical to the third thickness d3. In addition, it is advantageous if the second layer 125 three times as thick as the first layer 120 is.

The first ladder structure 110 has a first electrically conductive material 315 and the second conductor structure 115 a second electrically conductive material 316 on. The first electrically conductive material 315 and the second electrically conductive material 316 can be identical or different. The first and / or second electrically conductive material 315 . 316 preferably has copper, in particular a copper alloy, for the construction of the conductor structure 110 . 115 on.

The first ladder structure 110 has a first conductor section 135 , By way of example, a second conductor section 140 , a third conductor section 145 and a fourth conductor section 146 on. The first ladder section 135 is by way of example adjacent to a first side surface 150 the layer arrangement 105 arranged. Of course, the first conductor section 135 also spaced from the first side surface 150 be arranged. In the embodiment, the first conductor section extends 135 exemplary parallel to the first side surface 150 , also can be the first side surface 150 and the first conductor section 135 be arranged inclined to each other. Exemplary is the first side surface 150 plan educated.

The second conductor section 140 , the third ladder section 145 and fourth conductor section 146 are by way of example inclined, preferably perpendicular, to the first conductor section 135 arranged. The second to fourth conductor section 140 . 145 . 146 are exemplary on a common side of the first conductor section 135 arranged. Further, by way of example, the second to fourth conductor sections 140 . 145 . 146 arranged parallel to each other. The second to fourth conductor section 140 . 145 . 146 extend into one to the second side surface 170 facing direction. Further, in the longitudinal direction (x direction), the second to fourth conductor portions 140 . 145 . 146 staggered to each other. By way of example, the second and fourth conductor section 140 . 145 . 146 arranged in the y-direction at the same height.

The second ladder structure 115 has, for example, a fifth conductor section 155 , a sixth conductor section 160 and a seventh conductor section 165 on. The number of conductor sections 135 . 140 . 145 . 146 . 155 . 160 . 165 is exemplary.

The fifth ladder section 155 is exemplary adjacent to a second side surface 170 the layer arrangement 105 on one to the first side surface 150 opposite side of the layer arrangement 105 arranged. The fifth ladder section 155 is exemplary parallel to the first conductor section 135 and to the second side surface 170 arranged. In this case, the second to fourth conductor section ends 140 . 145 . 146 spaced in front of the fifth conductor section 155 exemplarily in the y-direction at the same height.

Also, the second side surface 170 and the fifth ladder section 155 be arranged inclined to each other. In the embodiment, the second side surface is 170 parallel to the first side surface 150 arranged opposite and trained exemplary plan. Also, the two side surfaces 150 . 170 inclined and / or independently trained and / or aligned.

The sixth ladder section 160 and the seventh ladder section 165 are by way of example inclined, preferably perpendicular, to the fifth conductor section 155 arranged. The sixth ladder section 160 and the seventh ladder section 165 are exemplary on a common the first conductor section 135 facing side of the fifth conductor section 155 arranged. The sixth ladder section 160 and the seventh ladder section 165 For example, they are arranged parallel to each other.

The sixth ladder section 160 and the seventh ladder section 165 extend from the fifth conductor section 155 in the direction of the first side surface 150 and ends spaced from the first conductor section 135 , In the longitudinal direction (x direction) between the second conductor section 140 and the third conductor section 145 is spaced the sixth conductor section 160 arranged. In the longitudinal direction (x-direction) between the third conductor section 145 and the fourth conductor section 146 is the sixth ladder section 165 arranged.

Furthermore, the layer arrangement 105 at least a first to seventh recess 175 . 180 . 195 . 200 . 205 . 210 . 211 on. The second to fourth recess 180 . 195 . 200 as well as the sixth and seventh recess 210 . 211 are inclined to the first recess 175 and / or the fifth recess 205 arranged. The first recess 175 and the fifth recess 205 are exclusively in the first layer 120 arranged.

The first recess 175 is adjacent to the first side surface 150 arranged. The fifth recess 205 is adjacent to the second side surface 170 arranged. By way of example, the first recess extend 175 and the fifth recess 205 longitudinal. The first and fifth recesses 175 . 205 are groove-shaped, wherein the first and fifth recess 175 . 205 each a recess reason 185 . 190 exhibit. The recess reason 185 . 190 is exemplified plan and offset to the second layer 125 arranged so that between the recess bottom 185 . 190 and the second layer 125 Material of the first layer 120 is arranged.

In the first to fourth recess 175 . 180 . 195 . 200 is the respectively assigned first to fourth conductor section, 135 . 140 . 145 . 146 the first ladder structure 110 arranged. In the fifth to seventh recess 205 . 210 . 211 is the respectively assigned fifth to seventh conductor section 155 . 160 . 165 the second ladder structure 115 arranged.

In the first recess 175 is between the first conductor section 135 a first section 280 a first primer layer 275 arranged. In the second to fourth recess 180 . 195 . 200 is a second to fourth section 295 . 300 . 301 the first primer layer 275 between the first and second layers 120 . 125 and the second to fourth conductor sections 140 . 145 . 146 arranged.

In the fifth recess 205 is between the fifth conductor section 155 a first section 290 a second primer layer 285 arranged. In the sixth and seventh recess 210 . 211 is a second and third section respectively 305 . 310 the second primer layer 285 between the sixth and seventh ladder sections 160 . 165 and the first and second layers 120 . 125 arranged.

2 shows a section of a sectional view through the in 1 shown heater 100 along an in 1 shown first section plane AA.

The second to fourth recess 180 . 195 . 200 as well as the sixth and seventh recess 210 . 211 are each in the first shift 120 through a breakthrough 215 . 220 . 225 . 230 . 231 laterally limited. The breakthrough 215 . 220 . 225 . 230 . 231 is slit-like example in the first layer 120 arranged. The breakthrough 215 . 220 . 225 . 230 . 231 extends completely from an upper side 252 the first layer 120 to the second layer 125 , In this case, the second to fourth recess 180 . 195 . 200 as well as the sixth and seventh recess 210 . 211 additionally in the second layer 125 further through a groove 235 . 240 . 245 . 250 . 251 be bounded below. Alternatively, the second and / or fourth recess may also be used 180 . 195 . 200 and / or the sixth and / or the seventh recess 210 . 211 through a top 255 of the second layer 125 , in the remaining area the first layer 120 at the second layer 125 is limited.

By way of example, a second to fourth Ausnehmungsgrund 260 . 265 . 270 and a sixth and seventh recess reason 271 . 272 the respectively associated second to fourth recess 180 . 195 . 200 as well as the sixth and seventh recess 210 . 211 in the second layer 125 arranged.

Due to the wide configuration of the second to fourth conductor section 140 . 145 . 146 and the sixth and seventh ladder sections 160 . 165 can have a broad connection to the second layer in the transverse direction 125 to be provided.

By the longitudinally alternately offset arrangement of the second to fourth conductor portion 140 . 145 . 146 the first ladder structure 110 and the sixth and seventh ladder sections 160 . 165 forms the second layer 125 between the second to fourth conductor sections 140 . 145 . 146 the first ladder structure 110 and the sixth and seventh ladder sections 160 . 165 of the second conductor section 140 For example, between the second conductor section 140 and the sixth conductor section 160 , a resistance element 273 out. The resistance element 273 heats up when an electrical voltage is applied between the first conductor structure 110 and the second conductor structure 115 and gives off surface heat.

In this case, by the corresponding design of a material composition and / or a geometric configuration of the second layer 125 and a spatial spacing in the longitudinal direction of the second to fourth conductor portion 140 . 145 . 146 the first ladder structure 110 and the sixth and seventh ladder sections 160 . 165 of the second conductor section 140 an electrical resistance of the resistive element 273 be chosen constructively.

Advantageously, the second layer 125 in its second thickness d2 selected such that the electrical resistance of the resistive element 273 over a predefined distance, preferably between the second conductor section 140 and the sixth conductor section 160 and / or the third conductor section 145 and the sixth conductor section 165 and / or between the third conductor section 146 and the seventh conductor section 165 and / or between seventh conductor section 165 and the fourth conductor section 145 , has a predefined electrical resistance. Depending on the electrical resistance, a heating power of the heater 100 be easily adapted. Optional can on the top 252 the first layer 120 an insulating layer 274 be arranged, which is formed electrically insulating and the conductor structure 110 . 115 electrically isolated from an environment.

3 shows a section of a sectional view along an in 1 shown second sectional plane BB.

The second recess 180 and the first recess 175 are connected. Here is an example of the second recess reason 260 the second recess 180 downwards offset to the first Ausnehmungsgrund 185 arranged.

The first ladder structure 110 and the second conductor structure 115 are each integrally formed and of uniform material, so exemplified in 3 the first conductor section 135 and the second conductor section 140 pass directly into each other. The second conductor section 140 is electrically connected to the second layer 125 connected. The first ladder section 135 is through the first layer 120 electrically from the second layer 125 isolated.

Analogous to the in 3 The embodiment shown is also the third and fourth conductor section 145 . 146 and the first conductor section 135 educated.

4 shows a sectional view along an in 1 shown third section plane CC through the in 1 shown heater 100 ,

The second ladder structure 115 is similar to the first ladder structure 110 educated. Here is the fifth ladder section 155 in the first shift 120 in the fifth recess 205 arranged. The fifth recess reason 190 is above the sixth Ausnehmungsgrunds 271 arranged. The sixth ladder section 160 is electrical with the second layer 125 connected.

By the film-like design of the heater 100 is the heater suitable 100 especially for heating large areas, for example aerodynamic elements, for example wings, rotor blades of wind turbines, control surfaces on aircraft or engine inlets, there to create ice and / or a melting of ice by the provision of heat by the heater 100 to achieve.

5 shows a flowchart of a method for producing the in the 1 to 4 described heater 100 ,

6 shows a schematic representation of the in the 1 to 4 shown heater 100 after a first process step 400 , 7 shows a schematic representation of the in the 1 to 4 shown heater 100 during a second process step 405 , 8th shows a schematic representation of the in the 1 to 4 shown heater 100 after a third process step 410 , 9 shows a schematic representation of the in the 1 to 4 shown heater 100 after a fourth process step 415 ,

In the first process step 400 becomes the layer arrangement 105 provided. The layer arrangement 105 can be wound, for example, on a roll. The layer arrangement 105 For example, in a multi-layer extrusion process in one before the first process step 400 produced further manufacturing process.

In the multi-layer extrusion process, the first plastic matrix 121 , the second plastic matrix 126 and the third plastic matrix 131 at the same time in a plastic-flowing state and in a single process to the multi-layer arrangement 105 hardened. This forms between the individual plastic matrices 121 . 126 . 131 in each case a cohesive connection, so that the layer arrangement 105 is designed to be particularly stable.

Alternatively, the layers can 120 . 125 . 130 each also be prepared separately. In a further partial step then the separately prepared layers 120 . 125 . 130 arranged on each other and pressed together under the action of heat. At the same time, the layers become 120 . 125 . 130 welded together, so the layers 120 . 125 . 130 are cohesively connected to each other. It is particularly advantageous if the first plastic matrix 121 , the second plastic matrix 126 and the third plastic matrix 131 essentially have an identical material and / or the respective material of each adjacent plastic matrices 121 . 126 . 131 with the other plastic matrix 121 . 126 . 131 can form a cohesive connection. Also in this process, an adhesive layer between the individual layers 120 . 125 . 130 avoided. Dispensing with the adhesive layer is necessary in the further process in order to be able to carry out the process described in the following process steps.

In a second process step 405 is by means of a directed heat source 276 , preferably by means of a laser, in the first layer 120 the first recess 175 brought in. By the heat source 276 becomes the first plastic matrix 121 evaporates and the first particulate matter 122 This activates the first particle material 122 itself from the first plastic matrix 121 releases and in the first recess 175 the first section 280 the first primer layer 275 formed.

This is the residence time of the focus 277 the heat source 276 on the first layer 120 chosen so short that the first plastic matrix 121 the first layer 120 is not completely evaporated and the first recess 185 spaced apart from the second layer 125 is arranged.

Furthermore, in the second process step 405 as well as the fifth recess 205 in the first layer 120 analogous to the formation of the first recess 175 be introduced. It also forms in the fifth recess 205 the first paragraph 290 the second primer layer 285 out.

The first primer layer 275 is formed by the evaporation of the first plastic matrix 121 the individual particles of the first particulate material 122 be exposed and at least partially together to form a thin-walled primer layer 275 . 285 merge.

The primer layer 275 . 285 is so thin that it is unsuitable, a significant stream for heating the second layer 125 transferred to. The primer layer 275 . 285 is also cohesively with the first plastic matrix 121 connected.

In a third process step 410 is by means of the heat source 276 the breakthrough 215 . 220 . 225 . 230 . 231 in the first layer 120 brought in. Here is the dwell time of the focus 277 at a point or area of the first layer 120 for the formation of the breakthrough 215 . 220 . 225 . 230 longer than for the formation of the first and / or fifth recess 175 . 205 , This is the breakthrough 215 . 220 . 225 . 230 . 231 the first layer 120 completely broken and after breaking through the first layer 120 the groove 235 . 240 . 245 . 250 . 251 in the second layer 125 brought in. By training the breakthrough 215 . 220 . 225 . 230 . 231 and the groove 235 . 240 . 245 . 250 . 251 becomes the second to fourth recess 180 . 195 . 200 , as well as the sixth and the seventh recess 210 . 211 in the layer arrangement 105 generated.

In this case, the evaporation of the first and second plastic matrix is formed 121 . 126 from the first particulate material 122 in the second to fourth recesses 180 . 195 . 200 , both on a wall of the first to third breakthrough 215 . 220 . 225 a first subarea 302 as well as in the first to third groove 235 . 240 . 245 a second subarea 303 of the second to fourth sections 295 . 300 . 301 the first primer layer 275 out.

Furthermore, the evaporation of the first and second plastic matrix forms 121 . 126 from the first particulate material 122 in the sixth and seventh recess 210 . 211 both on a wall of the first to third breakthrough 215 . 220 . 225 a third section 311 as well as in the fourth and fifth groove 250 . 251 a fourth section 312 of the second and third sections 305 . 310 the second primer layer 285 out.

In a fourth method step, attention is paid to the first primer layer 275 a first electrically conductive material 315 and on the second primer layer 285 a second electrically conductive material 316 electroplated. The galvanization can, for example, by means of a plasma 320 comprising the electrically conductive material 315 . 316 on the primer layer 275 . 285 be applied to the conductor structure 110 . 115 on the respectively assigned primer layer 275 . 285 deposit. Of particular advantage is when a surface 325 the ladder structure 110 . 115 in a plane with the top 252 the first layer 120 is arranged.

By the described manufacturing method for producing the heating device 100 can the heater 100 be made particularly simple and inexpensive. Further, the heater is 100 particularly flexible and bendable, so the heater 100 for example, with a lower side of the third layer 130 arranged adhesive layer can be applied to a component, such as a rotor of a wind turbine or a structure of an aircraft. It also ensures that the heater 100 is particularly thin-walled and thus a particularly shallow transition between areas with the heater 100 and areas without heating 100 can be ensured on the component.

Furthermore, the manufacturing method described above provides the possibility of the geometry of the conductor structure 110 . 115 free to define. This configuration allows the heater 100 flexible to the geometry of the component, for example, without parallel side surfaces 150 . 170 or contour edges, is formed. Furthermore, the conductor structure 110 . 115 also be adapted to radii of the component. In particular, in this case also radii of the component can be heated over the entire surface.

Furthermore, the heater has 100 the advantage that by a variation of the voltage, the heater 100 can be operated in a temperature range of -30 ° C to 70 ° C, without damaging the plastic matrix 121 . 126 . 131 he follows. Further, the heater is 100 suitable to be operated both with DC voltage and with AC voltage. Preferably, an applied voltage is between the first conductor pattern 110 and the second conductor structure 115 for example, 12V or 24V or 48V. Also, other electrical voltages are between the first conductor structure 110 and the second conductor structure 115 conceivable. Furthermore, the electrical voltage is variable, so that a heating power of the heater 100 and thus one by the heater 100 delivered heat can be flexibly adapted to an ambient temperature.

10 shows a sectional view along an in 1 shown section plane AA by a heater 100 according to a second embodiment.

The heater 100 is essentially identical to that in the 1 to 9 shown heater 100 educated. Deviating from this is the second conductor structure 115 adjacent to a base 317 the layer arrangement 105 arranged. This embodiment has the advantage that the conductor structure 110 . 115 wider in y-direction than in 1 shown can be formed. This allows the heater 100 essentially over the entire width of the heater 100 essentially be heated by the fact that the first conductor structure 110 , And here in particular the extending in the y-direction second to fourth conductor portion 140 . 145 . 146 , up to substantially the second side surface 170 can extend. Likewise, the sixth and seventh conductor section 160 . 165 from the fifth conductor section 155 up to the first side surface 150 extend.

Further, the third layer 130 deviating from that in the 1 to 9 described embodiment of the third layer 130 to the effect that the third layer 130 in addition to the third plastic matrix 131 the first particulate material 122 having.

11 shows a flowchart of a manufacturing method according to a second embodiment for the preparation of in 10 shown heater 100 ,

In a first process step 500 becomes the layer arrangement 105 provided.

A second process step 505 is similar to the one in 5 described second method step 405 educated. Identical to the second process step 405 of in 5 described method is that by means of the directed heat source 276 , preferably by means of the laser, in the first layer 120 by evaporating the first plastic matrix 121 the first recess 175 is introduced.

Deviating from the second process step 405 of in 5 described method is further by means of the heat source 276 in the third layer 130 the fifth recess 205 in the third layer 130 brought in. The fifth recess 205 can be directly below adjacent to the first side surface 150 under the first recess 175 be arranged. Alternatively, of course, also conceivable, as in 10 shown that the first recess 175 adjacent to the first side surface 150 and the fifth recess 205 adjacent to the second side surface 170 and thus in the transverse direction opposite to the first recess 175 is arranged.

A third process step 510 is essentially identical to the one in 5 described third method step 410 , Deviating from this, the sixth and seventh recess 210 . 211 by means of the heat source 276 in the third layer 130 brought in.

Further, the lower side becomes the second layer 125 above the fourth and fifth breakthrough 230 . 231 the fourth groove 250 and the fifth groove 251 by evaporating the second plastic matrix 126 generated.

A fourth process step 515 is essentially the same as in 5 described fourth method step 415 , wherein the lower side of the second electrical material 316 on the second primer layer 285 galvanized.

In an additional fifth process step 520 can be on top of the first ladder structure 110 and the top 252 the first layer 120 the insulating layer 274 and on a bottom 317 another insulating layer 335 be applied. The further insulating layer 335 is electrically insulating and isolates the second conductor structure 115 electrically opposite the environment.

It should be noted that the in 1 to 11 described heater 100 Of course, it can also be designed differently. For example, any ladder structure 110 . 115 additionally have a contact area for electrical contact.

It should also be noted that individual features may be omitted or added in addition. It should also be noted that, of course, the number of conductor sections 135 . 140 . 145 . 146 . 155 . 160 . 165 as well as the recesses 175 . 180 . 195 . 200 . 205 . 210 . 211 can be chosen differently. Furthermore, a different number of layers may also be used 120 . 125 . 130 be provided.

LIST OF REFERENCE NUMBERS

5

 coordinate system

100

 heater

105

 layer arrangement

110

 first ladder structure

115

 second ladder structure

120

 first shift

121

 first plastic matrix

122

 first particulate material

125

 second layer

126

 second plastic matrix

127

 second particulate material

130

 third layer

131

 third plastic matrix

135

 first ladder section

140

 second conductor section

145

 third ladder section

146

 fourth conductor section

150

 first side surface

155

 fifth conductor section

160

 sixth ladder section

165

 seventh conductor section

170

 second side surface

175

 first recess

180

 second recess

185

 first recess

190

 fifth recess

195

 third recess

200

 fourth recess

205

 fifth recess

210

 sixth recess

211

 seventh recess

215

 first breakthrough of the second recess

220

 second breakthrough of the third recess

225

 third breakthrough of the fourth recess

230

 fourth breakthrough of the sixth recess

231

 fifth breakthrough of the seventh recess

235

 first groove of the second recess

240

 second groove of the third recess

245

 third groove of the fourth recess

250

 fourth groove of the sixth recess

251

 fifth groove of the seventh recess

252

 Top of the first layer

255

 Top of the second layer

260

 second recess reason

265

 third recess

270

 fourth recess

271

 sixth recess reason

272

 seventh recess reason

273

 resistive element

274

 insulating

275

 first primer layer

276

 heat source

277

 focus

280

 first section of the first primer layer

285

 second primer layer

290

 first section of the second primer layer

295

 second section of the first primer layer

300

 third section of the first primer layer

301

 fourth section of the first primer layer

302

 first subarea

303

 second subarea

305

 second section of the second primer layer

310

 third section of the second primer layer

311

 third subarea

312

 fourth subarea

315

 first electrically conductive material

316

 second electrically conductive material

317

 bottom

320

 plasma

325

 surface

335

 further insulating layer

400

 first process step

405

 second process step

410

 third process step

415

 fourth process step

500

 first process step

505

 second process step

510

 third process step

515

 fourth process step

520

 fifth process step

Claims (18)

Method for producing a heating device ( 100 ), - wherein a layer arrangement ( 105 ) from a first layer ( 120 ) and one on the first layer ( 120 ) arranged second layer ( 125 ), the first layer ( 120 ) at least one first particulate material ( 122 ) embedded in a first plastic matrix ( 121 ), wherein the second layer ( 125 ) is electrically conductive, - characterized in that - the first plastic matrix ( 121 ) of the first layer ( 120 ) is vaporized such that at least one breakthrough ( 215 . 220 . 225 ) through the first layer ( 120 ) to the second layer ( 125 ) and the first particulate material ( 122 ) at least one subarea ( 302 ) a first primer layer ( 275 ) at the breakthrough ( 215 . 220 . 225 ), whereby - in order to form a ladder structure ( 110 ) on the first primer layer ( 275 ) an electrically conductive material ( 315 ) is deposited, - wherein the further electrically conductive material ( 316 ) an electrical connection to the second layer ( 125 ) trains. Method according to claim 1, - wherein the first plastic matrix ( 121 ) of the first layer ( 120 ) is vaporized in sections such that at least one recess ( 175 ) in the first layer ( 120 ) and the first particulate material ( 122 ) a section ( 280 ) of the first primer layer ( 275 ) in the recess ( 175 ), whereby a recess reason ( 185 ) of the recess ( 175 ) spaced from the second layer ( 125 ), wherein on the section ( 280 ) of the first primer layer ( 275 ) the electrically conductive material ( 315 ) is deposited. Method according to Claim 1 or 2, - the second layer ( 125 ) with a second plastic matrix ( 126 ), the first particulate material ( 122 ) and a second particulate material ( 127 ), whereby below the breakthrough ( 215 . 225 ) the second plastic matrix ( 126 ) is evaporated in sections such that a groove ( 235 . 240 . 245 ) in the second layer ( 125 ), the first particulate material ( 122 ) of the second layer ( 125 ) section by section another subarea ( 303 ) of the first primer layer ( 275 ) at the groove ( 235 . 240 . 245 ) trains. Method according to one of the preceding claims, - wherein in sections the first plastic matrix ( 121 ) of the first layer ( 120 ) is vaporized in such a way that at least one further breakthrough ( 230 . 231 ) through the first layer ( 120 ) to the second layer ( 125 ) and the first particulate material ( 122 ) a subarea ( 311 ) a second primer layer ( 285 ) on the further breakthrough ( 220 . 230 ), - wherein on the second primer layer ( 285 ) another electrically conductive material ( 316 ) for the development of a further ladder structure ( 115 ) is deposited. Method according to claim 4, - wherein the first plastic matrix ( 121 ) of the first layer ( 120 ) is vaporized such that at least one further recess ( 180 ) in the first layer ( 120 ) and the first particulate material ( 122 ) a section ( 290 ) of the wide primer layer ( 285 ) in the further recess ( 180 ), whereby another recess ( 190 ) of the further recess ( 180 ) spaced from the second layer ( 125 ) and offset to the recess ( 175 ), - referring to the section ( 290 ) of the second primer layer ( 285 ) the further electrically conductive material ( 316 ) is deposited. Method according to claim 4 or 5, wherein below the further break-through ( 230 . 231 ) the second plastic matrix ( 126 ) is vaporized in sections such that another groove ( 250 . 251 ) in the second layer ( 125 ), the first particulate material ( 122 ) of the second layer ( 125 ) a further subarea ( 312 ) of the second primer layer ( 285 ) at the further groove ( 250 . 251 ), - wherein on the second primer layer ( 285 ) the further electrically conductive material ( 316 ) for the formation of the further ladder structure ( 115 ) is deposited, - wherein the further electrically conductive material ( 316 ) the electrical connection to the second layer ( 125 ) at the further groove ( 250 . 251 ) trains. Method according to one of claims 1 to 3, - wherein the layer arrangement ( 105 ) with a third layer ( 130 ), the third layer ( 130 ) on one to the first layer ( 120 ) opposite side of the second layer ( 125 ), - wherein in the third layer ( 130 ) at least the first particulate material ( 122 ) in a third plastic matrix ( 131 ) is embedded, whereby in sections on one to the first layer ( 120 ) side facing away from the third plastic matrix ( 131 ) of the third layer ( 130 ) is vaporized in such a way that at least one further breakthrough ( 220 . 230 ) through the third layer ( 130 ) to the second layer ( 125 ) and the first particulate material ( 122 ) a further subarea ( 311 ) a second primer layer ( 285 ) on the further breakthrough ( 220 . 230 ), - referring to the section ( 305 . 310 ) of the second primer layer ( 285 ) a second electrically conductive material ( 316 ) for the development of a further ladder structure ( 115 ) is deposited. Method according to claim 7, - wherein the third plastic matrix ( 131 ) of the third layer ( 130 ) is evaporated such that at least one further recess ( 180 ) in the third layer ( 130 ) and the first particulate material ( 122 ) another section ( 290 ) of the further primer layer ( 285 ) in the further recess ( 180 ), whereby another recess ( 190 ) of the further recess ( 180 ) spaced from the second layer ( 125 ), - with reference to the further section ( 290 ) of the second primer layer ( 285 ) the further electrically conductive material is deposited. Method according to claim 7 or 8, wherein above the breakthrough ( 215 . 225 ) the second plastic matrix ( 126 ) is evaporated in sections such that a groove ( 235 . 240 . 245 ) in the second layer ( 125 ), the first particulate material ( 122 ) of the second layer ( 125 ) sectionwise the second primer layer ( 285 ) at the groove ( 235 . 240 . 245 ) trains. Method according to one of the preceding claims, - wherein by means of a laser ( 276 ) the plastic matrix ( 121 . 126 . 131 ) is evaporated. Method according to one of the preceding claims, - wherein by means of a plasma ( 320 ) and / or by means of a galvanization of the electrically conductive material ( 315 . 316 ) is deposited. Heating device ( 100 ), - whereby the heating device ( 100 ) is produced by a method according to any one of the preceding claims. Heating device ( 100 ) according to claim 12, - comprising a layer arrangement ( 105 ) and a ladder structure ( 110 ), - the layer arrangement ( 105 ) a first layer ( 120 ) and at least one second layer ( 125 ), wherein the first layer ( 120 ) at least one first particulate material ( 122 ) and a first plastic matrix ( 121 ), wherein the first particulate material ( 122 ) in the first plastic matrix ( 121 ), the second layer ( 125 ) is electrically conductive, - wherein in the first layer ( 120 ) a breakthrough ( 215 . 225 ), wherein - in the first layer ( 120 ) a recess ( 175 ), the breakthrough ( 215 . 225 ) and the recess ( 175 ), wherein a recess reason ( 185 ) of the recess ( 175 ) spaced from the second layer ( 125 ) is arranged, - wherein in the recess ( 175 ) and the breakthrough ( 215 . 225 ) the ladder structure ( 110 . 115 ), the conductor structure ( 110 . 115 ) at least in sections electrically with the second layer ( 125 ) connected is. Heating device ( 100 ) according to claim 13, - comprising a further conductor structure ( 115 ), - wherein in the first layer ( 120 ) another breakthrough ( 220 . 230 ) and a further recess ( 180 ) are arranged - where the further breakthrough ( 220 . 230 ) offset the breakthrough ( 215 . 225 ) and the further recess ( 180 ) offset to the recess ( 175 ) are arranged, - whereby a further recess reason ( 190 ) of the further recess ( 180 ) spaced from the second layer ( 125 ), the further breakthrough ( 220 . 230 ) and the further recess ( 180 ), whereby in the further breakthrough ( 220 . 230 ) and in the further recess ( 180 ) the further ladder structure ( 115 ), the further conductor structure ( 115 ) at least in sections electrically with the second layer ( 125 ) connected is. Heating device ( 100 ) according to claim 13, - comprising a further conductor structure ( 115 ), - the layer arrangement ( 105 ) a third layer ( 130 ), wherein the second layer ( 125 ) between the first layer ( 120 ) and the third layer ( 130 ), the third layer ( 130 ) a third plastic matrix ( 131 ) and the first particulate material ( 122 ), - wherein in the third layer ( 130 ) another breakthrough ( 220 . 230 ) and a further recess ( 180 ) are arranged, - whereby a further recess reason ( 190 ) of the further recess ( 180 ) spaced from the second layer ( 125 ), the further breakthrough ( 220 . 230 ) and the further recess ( 180 ) are connected to each other in sections, - in the further breakthrough ( 220 . 230 ) and in the further recess ( 180 ) the further ladder structure ( 115 ), the further conductor structure ( 115 ) at least in sections electrically with the second layer ( 125 ) connected is. Heating device ( 100 ) according to one of claims 12 to 15, - wherein the recess ( 175 ) inclined to the breakthrough ( 215 . 225 ) is arranged. Heating device ( 100 ) according to one of claims 12 to 16, - wherein the first particulate material ( 122 ) at least metal oxide as a material, - and / or - wherein the second particulate material ( 127 ) comprises at least one of the following materials: - graphene, - carbon black - nanoparticles, - inorganic semiconductor material, - organic semiconductor material, - graphite, - 2 to 15 atomic layers of graphene embedded between graphite, - and / or - wherein the first plastic matrix ( 121 ) and / or the second plastic matrix ( 126 ) comprises at least one of the following materials: - thermoplastic, - thermoset, - elastomer, - polyethylene. Heating device ( 100 ) according to any one of claims 12 to 17, - wherein the first layer ( 120 ) has a first thickness (d1) of a value which is in a range of 0.005 mm to 0.1 mm, in particular in a range of 0.02 mm to 0.04 mm, - and / or - wherein the second Layer ( 125 ) has a second thickness (d2) of a value ranging from 0.01 mm to 0.2 mm, more preferably from 0.07 to 0.11 mm.

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