DE102016015787A1 - Method and device for the production of an antenna circuit with a printing form - Google Patents

Abstract

A method for producing a transponder comprises the following steps:
Providing a first carrier substrate having a front side and a back side; wherein at least one antenna circuit is arranged on the front side;
Providing a second carrier substrate having a front side and a rear side,
Populating the front surface of the second support substrate with an electrical device having two ends of electrodes in one or more steps; wherein the electrical device comprises a semiconductor chip;
Connecting the front side of the first carrier substrate to the front side of the second carrier substrate such that the ends of the electrodes of the electrical device are electrically connected to ends of the antenna circuit and thus generate a transponder while simultaneously laminating the front sides of the first and second carrier substrates to a transponder.

Description

background

Here, a method of manufacturing a transponder will be described. In particular, a method for producing RFID transponders is described. A device for producing a transponder as well as an embossing or printing form and a transponder are also described.

Such transponders are used, for example, for value or security documents or the like, and usually have a monolayer or multilayer body.

In order to meet rising security requirements, transponders (inlays) are increasingly used in value and security documents (debit, credit cards, passports, identity cards, access control cards, etc.). Today, value and security documents are often produced centrally, with the exception of personalization data, and then provided with personalization locally, for example at registration offices, at authorities or in companies that are authorized to issue such value and security documents. During personalization, the individual owners of the value and security document will receive individually identifying textual, numerical and / or pictorial data (such as the name and address of the holder, date of birth, place of birth, photograph of the holder, biometric data of the holder, etc.) Value and security document entered.

A transponder, in particular for RFID (= Radio Frequency Identification), essentially has a semiconductor chip and an antenna designed as a coil, a spiral or a dipole. The antenna allows non-contact data access, i. H. a non-contact, automated writing and / or reading of (personalization) data in / from the semiconductor chip of the transponder. Transponder inlays are used as manufacturing units that can be processed. Such transponder inlays have a substrate layer for arranging a transponder unit comprising the transponder antenna and the semiconductor chip, which is located on a contact surface of the substrate layer. The semiconductor chip can be integrated, for example, in a chip module.

To integrate such transponders (inlays) into, for example, value and security documents makes special demands on the transponder inlays. Such transponder inlays should affect the previous weight and format of the value and security documents as little as possible and also be easy to manufacture. On the other hand, the handling of the value and security documents in the course of their period of validity results in mechanical stresses for the transponder inlays or for the antennas arranged on the substrate layer of the transponder inlays and the semiconductor chip / chip module and their electrical / mechanical connection. Furthermore, a requirement for such transponders can still be that they can simply be made inoperable after a defined operating time.

State of the art

Such an RFID transponder is for example from the WO 2006/136 466 A1 known. This document discloses an RFID tag with an RFID chip and a dipole antenna disposed on a non-conductive substrate. The dipole antenna disclosed therein has two conductor track sections of the same length, between which the RFID chip is arranged and connected. Furthermore, transponders are known from the prior art, which have a plurality of substrate layers. Such a transponder and a method for producing desselbigen are for example in the EP 1 291 818 A1 described. This document discloses a transponder in which two spiral antennas are printed on an insulating material. One of the two spiral antennas has connections for an electronic circuit, for example a chip of a transponder. For this purpose, the electronic circuit is first connected within the one spiral antenna with the connections provided for this purpose. Subsequently, the plate is folded along a line of symmetry, the antennas being superimposed and their terminals covering each other. The connections are formed without conductors bridging the turns of the spiral antennas. Since the printed spirals face each other, an insulating layer is interposed between them. The terminals of the spiral antennas overlapping each other after folding are connected together by a pin.

In general, known RFID transponders have semiconductor chips which are contacted on one side and which require comparatively complex designs of antennas and have high demands on the positioning accuracy during manufacture.

Problem to be solved

The aim is to provide a manufacturing method and an apparatus for producing a transponder, as well as a printing forme of the type described above, which enable a simple and rapid production of a transponder. Another goal is to provide a transponder that can be easily produced in various forms.

Solution, benefits and design

In a method described here for producing a transponder, a first carrier substrate having a front side and a rear side is provided, wherein at least one antenna circuit is arranged on the front side. Furthermore, a second carrier substrate having a front side and a rear side is provided. The front side of the second carrier substrate is populated with an electrical device having two ends of electrodes in one or more steps, the electrical device comprising a semiconductor chip. An adhesive is applied to the front side of at least one carrier substrate. The front side of the first carrier substrate is connected to the front side of the second carrier substrate such that the ends of the electrodes of the electrical device are electrically connected to ends of the antenna circuit and thus generate a transponder, wherein the front sides of the first and second carrier substrates are laminated to a transponder simultaneously ,

An advantage over methods for producing transponders with a central insulation layer is that resources in the end product are spared by eliminating a central plastic layer, in particular of PET material. Thus, the cost of a glue material is significantly reduced, a target destruction of the product is easier and faster at delamination.

The semiconductor chip used may be substantially flat and / or cuboid, i. H. For example, two opposite side surfaces and four small side surfaces, which are each smaller than the large side surfaces.

In a variant of the method, the semiconductor chip has electrodes arranged on one side. The semiconductor chip is thus easy to manufacture and easy to contact with an electronic device. Alternatively, in another embodiment, the semiconductor chip may also have electrodes arranged on both sides.

The positioning accuracy between the semiconductor chip and its electrodes with those of an electrical device may be between 30 μm to 100 μm.

In one variant, the carrier substrates provided have an insulating structure, on the surface of each of which an electrically conductive layer may be located. The first carrier substrate and / or the second carrier substrate may contain one or more of the following materials: paper, polyvinyl chloride (PVC), polyethylene (PE), polyethylene terephthalate (PET) or glycol-modified polyethylene terephthalate (PETG), polyethylene naphthalate (PEN), acrylonitrile-butadiene-styrene Copolymer (ABS), polyvinyl butyral (PVB), polymethyl with acrylate (PMA), polymide (PI), polyvinyl alcohol (PVA), polystyrene (PS), polyvinylphenol (PVP), polypropylene (PP), polycarbonate (PC) or derivatives.

The carrier substrates may be formed substantially flat so that the first and second sides of the carrier substrates correspond to two opposite large side surfaces. Furthermore, the carrier substrates may have a flexible structure. This has the advantage that the step of providing the carrier substrates with and without the antenna subsections arranged thereon can take place by unwinding from a roll as continuous material.

Particularly in the case of a continuous production method, this variant can result in a reduction in the space requirement of a device for producing the transponder. In a variant of the method, the first and the second carrier substrate may be identical or different. In addition, the first and / or the second carrier substrate may have an adhesive layer on the front side and a silicone paper on the rear side. According to a variant, the antenna circuit can be arranged on the front side of the first carrier substrate by means of a sticking operation.

According to a further modification of the method, the first carrier substrate is provided, for example, before the provision of the first carrier substrate. B. pressed by a cutter against a printing plate with a pattern relief of the antenna circuit and simultaneously milled the antenna circuit of an electrically conductive layer on the front side of the at least double-layered first carrier substrate, wherein the antenna circuit is formed by electrical conductor forming portions, wherein the electrical layer sunk in the pattern relief of the printing form and protected against the removal of material (by the cutter). This has the advantage that the electrically conductive layer requires significantly less material than if an antenna circuit were glued separately. In addition, the manufacturing processes are shortened and simplified.

According to a further method, the second carrier substrate is pressed by means of a milling cutter against a printing plate with a pattern relief of a subassembly of the electrical device and at the same time the subassembly of the electrical device of an electrically conductive layer of the front of at least milled the double-layered second carrier substrate, wherein the sub-device of the electrical device is formed by an electric wire forming portions of the electrical layer in the pattern relief of the printing form sunk and protected from the material removal (eg by the cutter) remain. Advantage of such a method is that the transponder is very thin and can be produced with an extremely low cost of materials.

In order to produce high numbers of transponders as inexpensively as possible, the first and / or second carrier substrate, either as a roll or as a sheet with repeating electrical circuits, may be formed and provided lengthwise on the roll or sheet.

According to a variant of the method, the first and the second carrier substrate are formed in at least double-layered in one piece and have a fold line. The ends of the antenna circuit and the ends of the electrical device are arranged symmetrically to the fold line. The joining of the two carrier substrates takes place by means of a folding process along the fold line. A step of punching out of the carrier substrate takes place in such a way that the fold line belongs to the punched grid as punching waste. Thus, the process steps for the production of the transponder are standardized and cost-effective simplified, since the electrically conductive layers of the front of the two carrier substrates are uniformly removed (eg milled) in one operation and the electrically conductive tracks and lines are worked out.

The method makes it possible to produce a transponder with an antenna in the HF (= high frequency) frequency range. According to such a variant of the method, the antenna is designed as an inductive antenna, for example as a loop antenna. Further, the circuit may include a bridge and an insulator, wherein the step of providing the second carrier substrate with the electrical device comprises the steps of: arranging or forming a bridge as a subdevice of the electrical device on the front side of the second carrier substrate and mounting the semiconductor chip the front side of the second carrier substrate and the placement of an insulator on the semiconductor chip and the electrical device on the front side of the second carrier substrate, wherein the insulator is formed such that opposite ends of electrodes of the electrical device from the insulator remain uncovered and with electrode ends of the antenna circuit by at least a turn are separated. The antenna circuit thus forms an RF antenna. Thus, in simple manufacturing processes, a transponder with an RF antenna can be formed.

It is understood that the semiconductor chip can be arranged under or on the bridge. In such a case, the first two steps are reversed.

In an alternative method, it is provided to produce a transponder which has an at least two-part antenna. The antenna is designed in a variant as a dipole antenna. In this case, the dipole antenna is designed in a variant for use in a UHF (= ultra high frequency) frequency range. The electrical circuit comprises an insulator and a UHF band (strap) or a UHF loop. In providing the second carrier substrate, the method comprises arranging or forming a UHF band or a UHF loop as subdevice of the electrical circuit on the front side of the second carrier substrate, placing a semiconductor chip on the front side of the second carrier substrate and / or the arranging or forming a UHF antenna circuit for a UHF antenna in the first step in providing the first carrier substrate on its front side, so that the electrode ends of the UHF antenna are connected in the last step to the ends of the electrical circuit. In the case of a loop it is provided that the antenna is isolated from the loop, for example by means of an adhesive, in order to inductively couple the antenna and the loop.

Here, a device for producing a transponder with a first device for providing a first carrier substrate is described, on which an antenna circuit is arranged. As described above, the device comprises a second device for providing a second carrier substrate on which an electrical device is arranged. An equipping device for equipping the front side of the second carrier substrate with a semiconductor chip is likewise provided. A device for applying an adhesive to the front side of the first carrier substrate and a connecting device which connects the two front sides of the two carrier substrates in such a way that the ends of the electrodes of the electrical device are electrically connected to the ends of the antenna circuit comprise the device for producing a transponder , By means of a laminating device, the front sides of the first and the second carrier substrate can be laminated to form a transponder. The advantage is thus that a two-layer transponder can be produced efficiently, which is destroyed when an attempt is made to open the transponder. The manufacturing steps with such a device are simplified and reduced, the resource cost is also minimized.

Furthermore, the device can be developed in such a way that the method described above can be carried out with it.

A printing form is also described for producing a transponder for the method step of milling by means of a milling cutter on a double-layered carrier substrate for producing the transponder by means of a device described above, wherein the printing plate has a pattern relief from an antenna and / or a subassembly of an electrical device for a Transponder includes. The printing form can be used in the device described above. The pattern relief in the printing form may be formed as an RF antenna pattern for generating an RF antenna having two ends of the RF antenna separated by at least one turn, or the pattern relief is formed as a UHF antenna pattern.

Additionally or alternatively, the printing form is formed with a pattern relief of a bridge as part of the electrical device for an RF transponder or pattern relief of a UHF band or a UHF loop as a part of the electrical circuit on the front side of the second carrier substrate for a UHF transponder ,

Further, the printing form may comprise a flexible sheet and be attachable to the lateral surface of a roller. Alternatively, the printing plate is formed as a cylinder and in particular made of metal, a metal alloy, a hard plastic with the pattern relief in the mantle surface.

A transponder with two carrier substrates is also described, which is produced in particular according to a method of the preceding claims, wherein at least one carrier substrate is double-layered, the front side of the carrier substrate comprises an electrical material from the group of metal, metal alloy, conductive polymer, aluminum and the transponder encapsulates an antenna circuit and an electrical device with a semiconductor chip. The transponder may further include a cover material on the back side of the second and first carrier substrates. The cover material can be printed. Alternatively, the cover material may be transparent and the back side of the second carrier substrate and / or the cover material may be printed.

In the operating state, the transponder receives a signal via the antenna and transmits it via the contact point of the antenna ends to the semiconductor chip. In the semiconductor chip, the signal is processed and generates a signal to be remitted, which is then transmitted via the two electrode contacts of the semiconductor and the electrode ends of the antenna, from where it is finally remitted.

The device and process details discussed below are presented in context; It should be noted, however, that they are independent of each other and can also be freely combined with each other. The ratios of the individual parts and sections thereof to one another and their dimensions and proportions shown in the figures are not to be understood as limiting. Rather, individual dimensions and proportions may differ from those shown.

Also, the claims do not limit the disclosure and thus the combination options of all identified features with each other. All features shown are also explicitly disclosed individually and in combination with all other features here.

Brief description of the drawings

Possible embodiments will now be explained in more detail with reference to the attached schematic illustrations, of which:

1 shows a sequence of the method according to a first embodiment variant;

2 , a sequence of the method according to a second embodiment variant shows

3 a schematic sectional view of a third, upstream process variant shows, which is connected upstream of the aforementioned embodiments;

4 a schematic sectional view of a transponder shows

5 shows a plan view of an RF inlay with antenna and chip according to a first embodiment of a transponder;

6 shows a plan view of an RF inlay with antenna and semiconductor chip according to a second embodiment of a transponder, and

7 a perspective view of a milling device shows.

Detailed description of the drawings

1 shows individual process steps in a device 400 for the production of a transponder 15 , In a first step S100 and a device 405 becomes a double-layered first carrier substrate 1 with a front side 2 and one back 3 provided. The double-layered carrier substrate 1 points to the front 2 , an electrically conductive layer, for example, an aluminum layer and on the back 3 a paper layer or a plastic layer, which in turn on the back 3 can be printed.

The carrier substrate 1 is either rolled up on a roll or provided as a bow.

In a next step S110, a UHF antenna will be formed by a specific method to be described below 5 on the front side 2 of the first carrier substrate 1 as antenna circuit 4 arranged or worked out in a procedure to be described below.

In a step S120, a second carrier substrate 6 with a front side 7 and a back 8th provided. Here, depending on the application, either a UHF loop 11 or a capacitive UHF band 14 on the front side 7 arranged or formed and corresponding electrode ends 34 , The training of a corresponding UHF band 11 or loop 11 is described to the following figures.

In the following step S130 is in a device 430 the front 7 of the second carrier substrate 6 with a semiconductor chip 9 and an insulating film 10 stocked.

In step S140, a plurality of steps are depicted on the abscissa t, which in at least three devices 440 be executed. The web of the first carrier substrate 1 and the web of the second carrier substrate 6 with the fronts 2 and 7 are accurately connected or in register with each other, with an adhesive on the front 2 of the first carrier substrate 1 can be applied before joining by means of a device. The webs of the first carrier substrate 1 and the tracks of the second carrier substrate 6 are accurately connected to 30 to 100 microns, so that the electrodes of the electrical device 12 that the semiconductor chip 9 and UHF bands 11 includes, exactly on the electrodes of the UHF antennas 5 get connected. By means of laminating rollers in a laminating device 444 become the two carrier substrates 1 and 3 connected, and subsequently the associated carrier substances, to individual transponders 15 with a UHF antenna 5 punched. For this purpose, a punching device 446 intended.

The 2 shows the sequence of a method and the device 400 for making a transponder 15 with an RF antenna. Analogously to step S100, in a step S200 and a device 405 a first and second carrier substrate 1 . 6 provided with two layers. The outer layer is the back 3 respectively. 8th and made from a paper or plastic. On it is an electrically conductive coating from the group of the materials metal, metal alloy, conductive polymer or aluminum. As front side 2 respectively. 7 is the conductive coating on the back 3 respectively. 8th arranged.

In the following step S210, on the first carrier substrate 1 , on the front of which an RF antenna 18 arranged or formed.

In step S220 in a device 405 be on the carrier substrate 6 RF bridges 19 on the front side 7 arranged. In step S230 is applied to the second carrier substrate 6 on the HF bridges 19 a semiconductor chip 9 and on top of that an insulator 10 each arranged.

In step S240 is applied to the first carrier substrate 1 by means of a device for applying an adhesive 20 , on the front side 7 an adhesive is applied and on the second carrier substrate 6 become the electrical devices 12 perfect fit on the front 7 with electrical electrodes of the RF antennas 18 brought together and by means of a laminator 444 with laminating rollers 13 laminated and then by means of a punching device 446 to transponders 15 with an RF antenna 18 punched.

Thus, a simplified manufacturing process for RFID HF transponder is realized with a resource conservation and thus cost reduction to carrier substrate material, less glue, a higher environmental friendliness and a target destruction in delamination.

The 3 shows a schematic view of an upstream process step to either only on a carrier substrate 1 or the second carrier substrate 6 or both carrier substrates 1 . 6 form electrical conductor tracks. For this purpose, a milling device 22 with a router 24 and an opposing printing form 24 provided in the form of a cylinder. The carrier substrate 1 . 6 gets into a pattern relief 28 that is on the surface of the printing form 26 is formed with an electrically conductive coating in the direction of cutter 24 directed into the pattern relief 28 the printing form 26 sunk so that portions forming an electrical line remain protected from the cutter whereas ridges from the cutter remain protected 24 in the milling device 22 be milled away. In this way can be on double-layered carrier substrate 1 each form an antenna for an RF frequency or an antenna for a UHF frequency. Similarly, jumpers can be used for an RF transponder or strip, loop and band antennas for a UHF transponder 15 form.

The 4 shows the first carrier substrate 1 with a UHF antenna arranged thereon 5 as antenna circuit 4 formed and a second carrier substrate 6 with an electrically insulated and coated UHF band 11 , The first and second carrier substrate 1 . 6 encapsulate the UHF antenna 5 and the UHF band 11 , The UHF antenna 5 and the UHF band 11 are inductively coupled with each other.

The 5 shows in plan view a first carrier substrate 1 with an RF antenna 18 and a second carrier substrate 6 , The carrier substrate 1 is not punched out yet. carrier substrate 1 includes a sheet or sheet of paper or plastic as the back 3 on which the RF antenna 18 located. A sheet or sheet of paper or plastic forms the back 8th of the second carrier substrate 6 out. On the second carrier substrate 6 is the HF bridge 19 that with a semiconductor chip 9 is equipped. The first antenna end 20 the antenna circuit 4 lies within the turns 17 the antenna circuit 4 and the second antenna end 21 lies outside, there are meanders in between 17 , The HF bridge 19 is needed to the antenna ends 20 , 21 connect to each other, with the semiconductor chip in between 9 is switched. Before joining the two front sides 2 . 7 the two carrier substrates 1 . 6 At least one front side, ie a web, is coated with an adhesive. In addition, an insulating film 10 on the semiconductor chip 9 arranged so that the RF bridge 19 the turns 17 not touched. The 5 shows a plan view of the first carrier substrate 1 , wherein the semiconductor chip 9 over the turns 17 already arranged.

The 6 shows an alternative embodiment. Two connection surfaces of the antenna circuit 18 lie within the turns 17 , The bridge 19 is at the antenna end 21 outside the turns. As in 2 shown, the tracks of the two carrier substrates 1 . 6 Registered laminated to each other, so that the contact areas of the RF bridge 19 the two ends 20 . 21 the antenna circuit 18 contact electrically. Thus, a two-layer transponder 15 created in the form of a label. The transponder 15 is destroyed when attempting to open the transponder. There is thus a so-called "target tear effect" at the contact point between the ends of the 20 . 21 the antenna circuit 18 and the HF bridge 19 connected to the second carrier substrate 6 is more firmly achieved.

It is understood that the first or second carrier substrate 1 . 6 each on the back 3 . 8th can be printed with a specific print image or with barcodes. It can be the loading of the bridge 19 with the semiconductor chip 9 with a device for direct application of the chip, z. B. a Mühlbauer DDA 20000 (DDA = direct attach) done. Herein, the second carrier substrate 6 pass through the DDA device, ie under a wafer, and the semiconductor chip is transferred directly to the bridge by a chip ejector (the ejector).

According to one embodiment, the first and second carrier substrates 1 . 6 Starting products, for example, two web rolls, each with a conductive coating on the front. The conductive coated surface is larger than the largest dimension of the antenna circuit 4 ,

The electrically conductive coating is either a (non-ferrous) metal (eg, copper, aluminum or the like) or an alloy containing these metals, a conductive polymer. Either the antenna circuit 4 or the bridge 11 . 19 is produced by ablation (eg milling, lasers, or the like) of the surface. The 7 shows for this purpose a milling device 22 that is part of the device 400 for producing a transponder. By a subtractive mechanical method z. B. by means of a router 24 the non-antenna part or the non-bridge part milled away. This is a suitable printing form 26 required. The printing form 26 includes a pattern relief 28 with depressions and elevations. In the pattern relief 28 becomes the carrier substrate 1 . 6 pressed so that sinks as electrical wires 30 in front of the router 24 are protected, with surveys 33 from the router 24 be milled away. If like to 1 and 2 described, two different tracks each for the preparation of the first carrier substrate 1 and the second carrier substrate 6 are used, are two milling processes, each with a suitable embossing or printing form 26 required. The bridge 11 . 19 is then back with a semiconductor chip 9 and with an insulating film 10 equipped and with the antenna circuit 4 connected to a two-ply transponder 15 to obtain. According to a further variant and a corresponding manufacturing method of the transponder 15 produced by folding the double-layered carrier substrate. The carrier substrate is thus integrally formed in the initial shape.

A fold line 42 is symmetrical to the ends 20 . 21 the antenna circuit 4 and ends 43 . 44 the electrical device 12 arranged. In a device for folding, both carrier substrates are used 1 . 6 folded and then brought together and laminated by a laminator. This is the fold line 42 outside the finished transponder 15 , After folding and joining the two carrier substrates 1 . 6 becomes the transponder 15 punched out of the carrier substrate such that the fold line 42 belongs to an unrepresented punched grid as punching waste. Thus, on the finished product, ie on the transponder 15 , after punching in the Punching device barely or no longer recognizable, whether the transponder 15 from two different webs of different carrier substrates 1 . 6 was made or from a single track.

Next are in an apparatus and a method for manufacturing the transponder 15 the two latter method steps realized in a common device. Thus, it is a double-layer provided with an electrically conductive layer web, as described above, being used in a milling method by means of the milling cutter 24 both the electrical antenna circuit 4 either as a UHF antenna 5 or as an RF antenna 18 as well as an electrical device 12 as a subassembly of the electrical device without the semiconductor chip 9 is produced in the milling process in one operation. The electrical device 12 includes as sub-device depending on the type of transponder 15 either a UHF loop or a UHF band. The embossing or printing form 26 thus includes a pattern relief 28 that according to this particular embodiment, the electrical lines 30 on the surfaces of the first and second carrier substrates 1 . 6 generated. The printing form 26 is either a flexible sheet, which is attached as a lateral surface around a roller or the printing plate 26 is designed as a cylinder with the corresponding pattern relief 28 , It is understood that the printing form 26 wider than the working area of the roller and the web of the carrier substrate. The printing form 26 can be clamped as a sheet, for example with clamping means on the roller. The embossing or printing form 26 is made in different variants of metal, a metal alloy or hard plastic.

The above-described variants of the method and the device are only for the better understanding of the structure, the operation and the properties of the proposed solution; they do not restrict the revelation to the exemplary embodiments. The figures are schematic, essential features and effects being shown, in part, clearly enlarged, in order to clarify the functions, operating principles, technical configurations and features. In this case, every mode of operation, every principle, every technical embodiment and every feature which is / are disclosed in the figures or in the text, with all claims, every feature in the text and in the other figures, other modes of operation, principles, technical embodiments and features contained in or resulting from this disclosure are combined freely and arbitrarily, so that all conceivable combinations attributable to the described solution. In this case, combinations between all individual versions in the text, that is to say in every section of the description, in the claims and also combinations between different variants in the text, in the claims and in the figures.

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• WO 2006/136466 A1 [0006]
• EP 1291818 A1 [0006]

Claims (10)

A method for the manufacture of an antenna circuit comprises the steps: a) pressing a first at least double-layered carrier substrate against a printing form with a pattern relief of an antenna circuit and simultaneously b) structuring the antenna circuit of an electrically conductive layer on the front side of the first carrier substrate, wherein formed to form the antenna circuit, an electrical conductor forming portions of the layer in the pattern relief of the printing form and remain protected from material removal. The method of claim 1, wherein the method further comprises the steps of: c) pressing a second carrier substrate against a printing plate with a pattern relief of a subassembly of an electrical device and simultaneously d) ablating the subassembly of the electrical device from an electrically conductive layer of the front side of the at least double-layered second carrier substrate, wherein formed to form the subassembly of the electrical device, electrical conductor forming portions of the electrical layer in the pattern relief of the printing form and remain protected from material removal. The method of any one of the preceding claims, further comprising the step a0) providing the first and / or second carrier substrate either as a roll or as a sheet. The method of claim 2 or 3, wherein the first and second carrier substrate are formed at least double-layered in one piece and having a fold line. Method according to one of the preceding claims 2 to 4, wherein the electrical device comprises a bridge and an insulator, wherein the method further comprises the steps: d) arranging or forming a bridge as a subassembly of the electrical device on the front side of the second carrier substrate, e) placing a semiconductor chip on the front side of the second carrier substrate, f) placing an insulator on the semiconductor chip and the electrical device on the front side of the second carrier substrate. Method according to one of the preceding claims 2 to 4, wherein the electrical Vorrichtrung comprises an insulator and a UHF band antenna or a UHF loop antenna, the method further comprising the steps g) arranging or forming a UHF band antenna or a UHF loop antenna as a subassembly of the electrical device on the front side of the second carrier substrate, h) placing a semiconductor chip on the front side of the second carrier substrate. An apparatus for the manufacture of an antenna circuit, comprising: a printing form for the step material removal on a double-layered carrier substrate for producing the transponder, wherein the printing form comprises a pattern relief of an antenna for a transponder, and a milling cutter which is adapted to remove material from an at least double-layered carrier substrate. Apparatus according to the preceding claim, wherein the pattern relief is formed as an RF antenna pattern for generating an RF antenna with two ends of the RF antenna, which are separated by at least one antenna winding, or the pattern relief as a UHF antenna pattern. Device according to one of claims 7 or 8, wherein the printing form further comprises a pattern relief of a bridge as a subdevice of the electrical device for an RF transponder or a pattern relief of a UHF band or a UHF loop as a part of the electrical device on the front side of the second carrier substrate for a UHF transponder. Device according to one of claims 7 to 9, wherein the printing plate is formed as a flexible sheet metal and attachable to the lateral surface of a roll or cylinder is formed and in particular made of metal, a metal alloy, hard plastic with the pattern relief in the mantle surface.

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