DE102015201632A1 - Coupon with sintered solder foil, process and component - Google Patents

Coupon with sintered solder foil, process and component Download PDF

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Publication number
DE102015201632A1
DE102015201632A1 DE102015201632.3A DE102015201632A DE102015201632A1 DE 102015201632 A1 DE102015201632 A1 DE 102015201632A1 DE 102015201632 A DE102015201632 A DE 102015201632A DE 102015201632 A1 DE102015201632 A1 DE 102015201632A1
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Germany
Prior art keywords
coupon
substrate
component
solder foil
sintered
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DE102015201632.3A
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German (de)
Inventor
Britta Laux
Thomas Nägel
Ingo Reinkensmeier
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Siemens AG
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Siemens AG
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Priority to DE102015201632.3A priority Critical patent/DE102015201632A1/en
Priority to PCT/EP2016/050546 priority patent/WO2016120068A1/en
Publication of DE102015201632A1 publication Critical patent/DE102015201632A1/en
Withdrawn legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F5/00Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
    • B22F5/04Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of turbine blades
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/08Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/0008Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0018Brazing of turbine parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233Sheets, foils
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3033Ni as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3046Co as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/04Making specific metal objects by operations not covered by a single other subclass or a group in this subclass turbine or like blades from several pieces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P6/00Restoring or reconditioning objects
    • B23P6/002Repairing turbine components, e.g. moving or stationary blades, rotors
    • B23P6/005Repairing turbine components, e.g. moving or stationary blades, rotors using only replacement pieces of a particular form
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01DNON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAM TURBINES
    • F01D5/00Blades; Blade-carrying members; Heating, heat-insulating, cooling or antivibration means on the blades or the members
    • F01D5/005Repairing methods or devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • B22F2007/068Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts repairing articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/001Turbines
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F05INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
    • F05DINDEXING SCHEME FOR ASPECTS RELATING TO NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES, GAS-TURBINES OR JET-PROPULSION PLANTS
    • F05D2230/00Manufacture
    • F05D2230/20Manufacture essentially without removing material
    • F05D2230/23Manufacture essentially without removing material by permanently joining parts together
    • F05D2230/232Manufacture essentially without removing material by permanently joining parts together by welding
    • F05D2230/238Soldering
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F05INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
    • F05DINDEXING SCHEME FOR ASPECTS RELATING TO NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES, GAS-TURBINES OR JET-PROPULSION PLANTS
    • F05D2230/00Manufacture
    • F05D2230/30Manufacture with deposition of material
    • F05D2230/31Layer deposition

Abstract

Die Erfindung betrifft ein Coupon, der als Substrat eine gesinterte Form aus zwei Pulvern aufweist, wobei das zweite Pulver ein gegenüber dem ersten Pulver eine um mindestens 10K niedrigere Schmelztemperatur aufweist, wobei auf dem gesinterten Substrat (4) eine Folie vorhanden ist, das gegenüber dem zweiten Pulver des Substrats (4) einen um mindestens 10K niedrigeren Schmelzpunkt aufweist. Ein erfindungsgemäßer Coupon weist zur besseren Fixierung eine weitere dünne Schicht aus einer Lotfolie auf, die mit der vorgesinterten Form durch Sintern verbunden ist.The invention relates to a coupon having as a substrate a sintered form of two powders, wherein the second powder has a melting temperature lower than the first powder by at least 10K, wherein on the sintered substrate (4) there is a film opposite to the one second powder of the substrate (4) has a melting point at least 10K lower. A coupon according to the invention has, for better fixing, a further thin layer of a solder foil, which is connected to the presintered form by sintering.

Description

Die Erfindung betrifft einen Coupon, der eine aufgesinterte Lotfolie aufweist, ein Verfahren und ein Bauteil. The invention relates to a coupon having a sintered solder foil, a method and a component.

Zur Reparatur von geschädigten Turbinenkomponenten kann eine strukturelle Reparatur durchgeführt werden, bei der die geschädigten Bereiche aus der Turbinenschaufel herausgetrennt werden und durch vorgefertigte Inserts aus dem gleichen Material ersetzt werden. Diese Inserts, „Coupons“ oder PSP, können mittels einer konventionellen Lotfolie in den abgetrennten Bereich eingefügt werden. Bei der Lotfolie besteht allerdings das Problem, dass diese in der Regel nur eine Dicke von 0,05–0,1mm aufweist. Sofern der Lötspalt, der sich zwischen der ausgemuldeten Komponente und dem Coupon ergibt, diese Dicke überschreitet, kommt es zu einer unvollständigen Anbindung des Coupons. Damit ist eine sehr präzise Vorbereitung der Komponente und des Coupons erforderlich, die mit hohen Kosten verbunden ist. To repair damaged turbine components, a structural repair may be performed in which the damaged areas are separated from the turbine blade and replaced with prefabricated inserts of the same material. These inserts, "coupons" or PSPs, can be inserted into the separated area using a conventional solder foil. The problem with the solder foil, however, is that it generally only has a thickness of 0.05-0.1 mm. If the solder gap, which results between the tolerated component and the coupon, exceeds this thickness, there is an incomplete connection of the coupon. This requires a very precise preparation of the component and the coupon, which is associated with high costs.

Eine Möglichkeit stellen flexible Tapes dar, die jedoch aufwendig zu applizieren sind. Weiterhin verfügen die flexiblen Tapes über einen Binderanteil, der das Risiko einer Porenbildung im Lötspalt birgt, sofern der Binder während des Lötens nicht ausgasen kann. One possibility is flexible tapes, which are expensive to apply. Furthermore, the flexible tapes have a binder content, which carries the risk of pore formation in the soldering gap, if the binder can not outgas during soldering.

Es ist daher Aufgabe der Erfindung, oben genanntes Problem zu lösen. It is therefore an object of the invention to solve the above-mentioned problem.

Die Aufgabe wird gelöst durch einen Coupon gemäß Anspruch 1, einem Verfahren gemäß Anspruch 5 und einem Bauteil gemäß Anspruch 8. The object is achieved by a coupon according to claim 1, a method according to claim 5 and a component according to claim 8.

In den Unteransprüchen sind weitere vorteilhafte Maßnahmen aufgelistet, die beliebig miteinander kombiniert werden können, um weitere Vorteile zu erzielen. In the dependent claims further advantageous measures are listed, which can be combined with each other in order to achieve further advantages.

Die Figuren und die Beschreibung stellen nur Ausführungsbeispiele der Erfindung dar. The figures and the description represent only embodiments of the invention.

Es zeigen Show it

1 ein Coupon mit Lotfolie, 1 a coupon with solder foil,

2 schematisch einen Schritt bei der Durchführung des erfindungsgemäßen Verfahrens und 2 schematically a step in the implementation of the method and

3 zeigt eine Liste von nickel- und kobaltbasierten Legierungen 3 shows a list of nickel and cobalt based alloys

Es wird vorgeschlagen, eine Lotfolie direkt auf Substrate von Coupons vorzugsweise aufzusintern. Bei den Folien könnte es sich um flexible Folien mit der gewünschten Lot-/ Grundwerkstoffmischung handeln. Diese könnten in der passenden Geometrie und Dicke hergestellt werden und bei niedrigen Temperaturen auf die Coupons aufgesintert werden. In diesem Schritt könnte der Binder ausgasen, so dass die Gefahr der Porenbildung deutlich reduziert werden kann. Es wäre auch denkbar, die Coupons vollständig applikationsfertig mitsamt dem aufgesinterten Tape zu beziehen, so dass im Rahmen der Applikation lediglich noch die Komponente vorbereitet werden müsste. It is proposed to preferably sinter a solder foil directly onto substrates of coupons. The films could be flexible films with the desired solder / base material mixture. These could be made in the proper geometry and thickness and sintered on the coupons at low temperatures. In this step, the binder could outgas, so that the risk of pore formation can be significantly reduced. It would also be conceivable to obtain the coupons completely ready for application together with the sintered-on tape, so that in the context of the application only the component would have to be prepared.

Dadurch kann die Wirtschaftlichkeit der Coupon-Repair deutlich erhöht werden. Die Coupon-Repair als innovative Reparaturtechnologie führt zu einer Erweiterung des Reparaturumfanges und einer Reduzierung der Anschlussrate. As a result, the cost-effectiveness of the coupon repair can be significantly increased. The coupon repair as an innovative repair technology leads to an extension of the scope of repair and a reduction of the connection rate.

1 zeigt einen erfindungsgemäßen Coupon 1. 1 shows a coupon according to the invention 1 ,

Der Coupon 1 weist ein Substrat 4 auf. The coupon 1 has a substrate 4 on.

Das Substrat 4 ist in bekannter Weise eine Mischung aus zumindest zwei verschiedenen Pulver, die zu einer Form gesintert werden. The substrate 4 is in a known manner a mixture of at least two different powders which are sintered into a mold.

Die zwei verschiedenen Pulver stellen vorzugsweise zum einen ein Material eines Grundwerkstoffs eines Bauteilsubstrats 10 (2) dar, das repariert werden soll als auch ein zweites Material, insbesondere Pulver, das gegenüber dem ersten Material eine um mindestens 10K niedrigere Schmelztemperatur aufweist. The two different powders preferably provide, on the one hand, a material of a base material of a component substrate 10 ( 2 ), which is to be repaired, as well as a second material, in particular powder, which has a melting point which is at least 10K lower than the first material.

Vorzugsweise sind das nickel- oder kobaltbasierte Superlegierungen, insbesondere gemäß 3 oder Modifikationen davon mit Schmelzpunkterniedrigern. Preferably, the nickel- or cobalt-based superalloys, in particular according to 3 or modifications thereof with melting point depressants.

Auf dem Substrat 4 des Coupons 1 ist eine Lotfolie 7 vorhanden, deren Schichtdicke deutlich dünner ist, insbesondere aber mindestens 50%, ganz insbesondere mindestens 70% dünner ausgeführt ist als das Substrat 4 des Coupons 1. Hierfür können bekannte flexible Lotfolien 7 verwendet werden. On the substrate 4 of the coupon 1 is a solder foil 7 present, whose layer thickness is significantly thinner, but in particular at least 50%, very particularly at least 70% made thinner than the substrate 4 of the coupon 1 , For this purpose, known flexible Lotfolien 7 be used.

Vorzugsweise sind das nickel- oder kobaltbasierte Superlegierungen, insbesondere gemäß 3 oder Modifikationen davon mit Schmelzpunkterniedrigern. Preferably, the nickel- or cobalt-based superalloys, in particular according to 3 or modifications thereof with melting point depressants.

Die Lotfolie 7 weist wiederum gegenüber der Schmelztemperatur Ts des Substrats 4 oder des zweiten Materials des Coupons 4, eine wiederum mindestens 10K niedrigere Schmelztemperatur auf. The solder foil 7 again indicates the melting temperature Ts of the substrate 4 or the second material of the coupon 4 , in turn, at least 10K lower melting temperature.

Zur Herstellung wird ein bekanntes Substrat 4 eines Coupons 1 aus dem Stand der Technik verwendet, das mit einer Lotfolie 7 aus dem Stand der Technik in einem separaten Herstellungsgang durch Sintern miteinander verbunden wird. For the production of a known substrate 4 a coupon 1 used in the prior art, that with a solder foil 7 from the prior art is connected in a separate manufacturing process by sintering together.

Ein solcher modifizierter Coupon 1 kann zur Reparatur eines Bauteilsubstrats 10 eines Bauteils 11 oder zur Neuherstellung verwendet werden (2). Such a modified coupon 1 can be used to repair a component substrate 10 a component 11 or used for remaking ( 2 ).

Dabei kommt der Coupon 1 mit der Lotfolie 7 auf eine Auflagefläche 13 des zu reparierenden Bauteilsubstrats 10 in Kontakt und wird erneut versintert, so dass ein repariertes Bauteil 11 oder ein Neubauteil aus mehreren Komponenten entsteht. Here comes the coupon 1 with the solder foil 7 on a support surface 13 of the component substrate to be repaired 10 in contact and is re-sintered, leaving a repaired component 11 or a new component of multiple components is created.

Claims (9)

Coupon (1), der als Substrat (4) eine gesinterte Form aus zumindest zwei Pulvern aufweist, wobei das zweite Pulver des Substrats (4) ein gegenüber dem ersten Pulver eine um mindestens 10K niedrigere Schmelztemperatur aufweist, wobei mit dem gesinterten Substrat (4) eine Lotfolie (7) verbunden ist, die (7) gegenüber dem Substrat (4) eine um mindestens 10K niedrigere Schmelztemperatur aufweist. Coupon ( 1 ), which can be used as substrate ( 4 ) has a sintered form of at least two powders, wherein the second powder of the substrate ( 4 ) has a melting temperature which is at least 10K lower than that of the first powder, with the sintered substrate ( 4 ) a solder foil ( 7 ), which ( 7 ) relative to the substrate ( 4 ) has a melting point at least 10K lower. Coupon nach Anspruch 1, bei dem die Pulver für das Substrat (4) nickel- oder kobaltbasiert sind. Coupon according to Claim 1, in which the powders for the substrate ( 4 ) are nickel- or cobalt-based. Coupon nach Anspruch 1, bei dem das Material der Lotfolie (7) nickel- oder kobaltbasiert ist. Coupon according to claim 1, in which the material of the solder foil ( 7 ) is nickel or cobalt based. Coupon nach einem oder mehreren der Ansprüche 1, 2 oder 3, bei dem die Lotfolie (7) mit dem Substrat (4) versintert ist. Coupon according to one or more of claims 1, 2 or 3, in which the solder foil ( 7 ) with the substrate ( 4 ) is sintered. Verfahren zur Reparatur oder Herstellung eines Bauteils (10), bei dem ein Coupon (1) gemäß einem oder mehreren der Ansprüche 1, 2, 3 oder 4 verwendet wird. Method for repairing or producing a component ( 10 ), where a coupon ( 1 ) according to one or more of claims 1, 2, 3 or 4 is used. Verfahren nach Anspruch 5, bei dem das Bauteilsubstrat (10) eine nickel- oder kobaltbasierte Superlegierung aufweist. Method according to Claim 5, in which the component substrate ( 10 ) has a nickel- or cobalt-based superalloy. Verfahren nach Anspruch 5 oder 6, bei dem die Lotfolie (7) mit dem Coupon (1) zur Auflage auf eine Oberfläche (13) des Bauteilsubstrats (10) gelangt. Method according to Claim 5 or 6, in which the solder foil ( 7 ) with the coupon ( 1 ) to rest on a surface ( 13 ) of the component substrate ( 10 ). Bauteil (11) aus einem Bauteilsubstrat (10) mit einer Auflagefläche (13), wobei mit der Auflagefläche (13) ein Coupon (1) nach einem oder mehreren der Ansprüche 1, 2, 3 oder 4 verbunden ist. Component ( 11 ) from a component substrate ( 10 ) with a bearing surface ( 13 ), with the bearing surface ( 13 ) a coupon ( 1 ) is connected according to one or more of claims 1, 2, 3 or 4. Verfahren oder Bauteil nach einem oder mehreren der Ansprüche 5, 6, 7 oder 8, wobei eine Materialkomponente des Substrats (4) oder der Lotfolie (7) dem Material eines Bauteilsubstrats (10) entspricht. Method or component according to one or more of claims 5, 6, 7 or 8, wherein a material component of the substrate ( 4 ) or the solder foil ( 7 ) the material of a component substrate ( 10 ) corresponds.
DE102015201632.3A 2015-01-30 2015-01-30 Coupon with sintered solder foil, process and component Withdrawn DE102015201632A1 (en)

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DE102015201632.3A DE102015201632A1 (en) 2015-01-30 2015-01-30 Coupon with sintered solder foil, process and component
PCT/EP2016/050546 WO2016120068A1 (en) 2015-01-30 2016-01-13 Coupon having a sintered soldering foil, method and component

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DE102015201632.3A DE102015201632A1 (en) 2015-01-30 2015-01-30 Coupon with sintered solder foil, process and component

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WO2020083493A1 (en) * 2018-10-25 2020-04-30 Siemens Aktiengesellschaft Max phase coupons for high temperature applications and method

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