DE102014211467A1 - Contact system with an electrically conductive laminate foil - Google Patents

Contact system with an electrically conductive laminate foil Download PDF

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Publication number
DE102014211467A1
DE102014211467A1 DE102014211467.5A DE102014211467A DE102014211467A1 DE 102014211467 A1 DE102014211467 A1 DE 102014211467A1 DE 102014211467 A DE102014211467 A DE 102014211467A DE 102014211467 A1 DE102014211467 A1 DE 102014211467A1
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Germany
Prior art keywords
electrically conductive
laminate film
contact system
particles
component
Prior art date
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Application number
DE102014211467.5A
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German (de)
Inventor
Steffen ORSO
Heiko Buss
Immanuel Mueller
Peter Bartscherer
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Robert Bosch GmbH
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Robert Bosch GmbH
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Priority to DE102014211467.5A priority Critical patent/DE102014211467A1/en
Publication of DE102014211467A1 publication Critical patent/DE102014211467A1/en
Withdrawn legal-status Critical Current

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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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Abstract

Die Erfindung betrifft ein Kontaktsystem. Das Kontaktsystem weist wenigstens ein elektronisches Bauelement, insbesondere Halbleiterbauelement, auf. Das Kontaktsystem weist auch einen Schaltungsträger auf, wobei ein Oberflächenbereich des Bauelements mit dem Schaltungsträger elektrisch leitfähig verbunden ist. Erfindungsgemäß weist das Kontaktsystem eine sich flach erstreckende Laminatfolie, insbesondere eine verpresste Prepreg-Folie auf. Die Laminatfolie ist zwischen dem Bauelement und dem Schaltungsträger angeordnet. Die Laminatfolie weist bevorzugt elektrisch leitfähige Partikel auf, wobei die Partikel jeweils einander elektrisch leitfähig derart berühren, dass die Laminatfolie quer zu ihrer flachen Erstreckung elektrisch leitfähig ausgebildet ist.The invention relates to a contact system. The contact system has at least one electronic component, in particular a semiconductor component. The contact system also has a circuit carrier, wherein a surface region of the component is electrically conductively connected to the circuit carrier. According to the invention, the contact system has a flatly extending laminate film, in particular a compressed prepreg film. The laminate film is arranged between the component and the circuit carrier. The laminate film preferably has electrically conductive particles, the particles each touching each other in an electrically conductive manner in such a way that the laminate film is designed to be electrically conductive transversely to its flat extent.

Description

Stand der Technik State of the art

Die Erfindung betrifft ein Kontaktsystem. Das Kontaktsystem weist wenigstens ein elektronisches Bauelement, insbesondere Halbleiterbauelement, auf. Das Kontaktsystem weist auch einen Schaltungsträger auf, wobei ein Oberflächenbereich des Bauelements mit dem Schaltungsträger elektrisch leitfähig verbunden ist. The invention relates to a contact system. The contact system has at least one electronic component, in particular a semiconductor component. The contact system also has a circuit carrier, wherein a surface region of the component is electrically conductively connected to the circuit carrier.

Bei aus dem Stand der Technik bekannten Halbleiterbauelementen, insbesondere Halbleiterschalter oder integrierte Schaltkreise, bei denen ein Oberflächenbereich durch einen elektrischen Kontakt gebildet ist, wird der Oberflächenbereich mit einem Schaltungsträger – beispielsweise durch Verlöten – elektrisch verbunden. Bei dieser Lötverbindung sind jeweils Oberflächenmetallisierungen, insbesondere Galvanisierungen, gebildet, welche ein Verlöten des Bauelements mit dem Schaltungsträger jeweils erleichtern, beziehungsweise ermöglichen. In semiconductor devices known from the prior art, in particular semiconductor switches or integrated circuits, in which a surface region is formed by an electrical contact, the surface region is electrically connected to a circuit carrier, for example by soldering. In this solder joint surface metallizations in each case, in particular galvanizations, are formed, which facilitate a soldering of the device to the circuit substrate respectively, respectively allow.

Offenbarung der Erfindung Disclosure of the invention

Erfindungsgemäß weist das Kontaktsystem der eingangs genannten Art eine sich flach erstreckende Laminatfolie, insbesondere eine verpresste Prepreg-Folie, auf. Die Laminatfolie ist zwischen dem Bauelement und dem Schaltungsträger angeordnet. Die Laminatfolie weist bevorzugt elektrisch leitfähige Partikel auf, wobei die Partikel jeweils einander elektrisch leitfähig derart berühren, dass die Laminatfolie quer zu ihrer flachen Erstreckung elektrisch leitfähig ausgebildet ist. So können vorteilhaft in der Laminatfolie durch einander berührende elektrisch leitfähige Partikel quer zur flachen Erstreckung der Laminatfolie elektrisch leitfähige Pfade ausgebildet sein. Dadurch kann das Bauelement, insbesondere ein durch einen Oberflächenbereich des Bauelements gebildete elektrischer Anschluss, über die elektrisch leitfähige Laminatfolie mit dem Schaltungsträger und dort mit einem elektrisch leitfähigen Bereich des Schaltungsträgers elektrisch verbunden sein. Vorteilhaft sind für diese Art der elektrischen Verbindung keine besonderen Galvanisierungen der Oberflächenbereiche erforderlich. Weiter vorteilhaft sind bei dieser Art der elektrischen Verbindung Prozesstemperaturen im Vergleich zum Reflow-Verlöten des Bauelements mit dem Schaltungsträger kleiner als beim Reflow-Verlöten. Der Oberflächenbereich ist beispielsweise eine Facette eines quaderförmigen Bauelements, umfassend sechs insbesondere zueinander orthogonal angeordnete Facetten. According to the invention, the contact system of the type mentioned at the outset comprises a flatly extending laminate film, in particular a compressed prepreg film. The laminate film is arranged between the component and the circuit carrier. The laminate film preferably has electrically conductive particles, the particles each touching each other in an electrically conductive manner in such a way that the laminate film is designed to be electrically conductive transversely to its flat extent. Thus, electrically conductive paths can advantageously be formed in the laminate film by contacting electrically conductive particles transversely to the flat extension of the laminate film. As a result, the component, in particular an electrical connection formed by a surface region of the component, can be electrically connected to the circuit carrier via the electrically conductive laminate film and there to an electrically conductive region of the circuit carrier. Advantageously, no special galvanizations of the surface areas are required for this type of electrical connection. Further advantageous in this type of electrical connection process temperatures compared to the reflow soldering of the device to the circuit carrier smaller than reflow soldering. The surface area is, for example, a facet of a parallelepiped component, comprising six facets arranged in particular orthogonal to one another.

Die zuvor erwähnten elektrisch leitfähigen Partikel können bevorzugt beim Laminieren, insbesondere beim Verpressen der Laminatfolie zwischen dem Bauelement und dem Substrat miteinander berühren und so Perkolationspfade, das heißt geschlossene Pfade von miteinander berührenden Partikeln, ausbilden. The aforementioned electrically conductive particles may preferably contact one another during lamination, in particular during pressing of the laminate film between the component and the substrate, and thus form percolation paths, that is to say closed paths of mutually contacting particles.

In einer anderen Ausführungsform berühren die Partikel vor dem Verpressen wenigstens teilweise einander, so dass Perkolationspfade in der Laminatfolie ausgebildet sind. Bevorzugt wird die Zahl der Perkolationspfade durch das Verpressen erhöht. In another embodiment, the particles at least partially contact each other prior to pressing so that percolation paths are formed in the laminate film. Preferably, the number of percolation paths is increased by the pressing.

In einer bevorzugten Ausführungsform ist der Schaltungsträger ein DBC-Substrat (DBC = Direct-Bonded-Copper). So kann vorteilhaft Verlustwärme von dem Bauelement, insbesondere Halbleiterbauelement, über die Laminatfolie an das Substrat geleitet werden, als auch eine elektrische Verbindung zwischen dem Bauelement und dem Substrat erzeugt werden. Die Laminatfolie kann so vorteilhaft beispielsweise eine Masseverbindung zwischen dem Bauelement und dem Substrat oder einer Abschirmung erzeugen. In a preferred embodiment, the circuit carrier is a DBC substrate (DBC = Direct-Bonded-Copper). Thus, advantageously, heat loss from the component, in particular semiconductor component, can be conducted via the laminate film to the substrate, as well as an electrical connection between the component and the substrate can be produced. The laminate film can thus advantageously produce, for example, a ground connection between the component and the substrate or a shield.

In einer bevorzugten Ausführungsform ist die Laminatfolie eine epoxidharzhaltige Folie. Die Folie ist bevorzugt eine Prepreg-Folie, welche ausgebildet ist, unter Einwirkung von Druck und Temperatur zu polymerisieren. Bei dem vorab beschriebenen Kontaktsystem ist die Prepreg-Folie verpresst und das Bauelement mit dem Schaltungsträger mittels der verpressten Prepreg-Folie elektrisch leitfähig und mechanisch verbunden. In a preferred embodiment, the laminate film is an epoxy resin-containing film. The film is preferably a prepreg film, which is designed to polymerize under the action of pressure and temperature. In the contact system described above, the prepreg sheet is compressed and the component with the circuit carrier by means of the compressed prepreg sheet electrically conductive and mechanically connected.

In einer bevorzugten Ausführungsform des Kontaktsystems ist die Laminatfolie eine faserverstärkte Folie, welche Fasern, insbesondere Glasfasern, aufweist. Die Folie kann so vorteilhaft flexibel ausgebildet sein. In a preferred embodiment of the contact system, the laminate film is a fiber-reinforced film which comprises fibers, in particular glass fibers. The film can be advantageously flexible.

In einer bevorzugten Ausführungsform ist wenigstens ein Teil der Fasern durch Metallfasern gebildet. So kann vorteilhaft das Ausbilden von den zuvor erwähnten elektrisch leitfähigen Pfaden unterstützt werden. Die Fasern erstrecken sich bevorzugt in der flachen Erstreckung der Folie. In a preferred embodiment, at least a portion of the fibers are formed by metal fibers. Thus, advantageously, the formation of the aforementioned electrically conductive paths can be supported. The fibers preferably extend in the flat extension of the film.

Die Metallfasern sind bevorzugt Kupferfasern. So kann vorteilhaft eine gute elektrische Leitfähigkeit der Laminatfolie gestützt werden. Die Partikel sind bevorzugt Metallpartikel, insbesondere Kupferpartikel. Die Partikel sind in einer anderen Ausführungsform Aluminiumpartikel oder Silberpartikel. Weitere vorteilhafte Metallpartikel sind Partikel umfassend wenigstens eines oder eine Kombination der der Elemente Kupfer, Nickel, Gold, Platin, Palladium, Zink, Zinn und Eisen. Eine vorteilhafte Legierung für die Metallpartikel ist beispielsweise Bronze oder Edelstahl. Die Folie kann so vorteilhaft gut elektrisch leitfähig ausgebildet sein. The metal fibers are preferably copper fibers. Thus, advantageously, a good electrical conductivity of the laminate film can be supported. The particles are preferably metal particles, in particular copper particles. In another embodiment, the particles are aluminum particles or silver particles. Further advantageous metal particles are particles comprising at least one or a combination of the elements copper, nickel, gold, platinum, palladium, zinc, tin and iron. An advantageous alloy for the metal particles is, for example, bronze or stainless steel. The film may advantageously be formed well electrically conductive.

Bevorzugt beträgt ein Anteil der Metallpartikel in der Laminatfolie wenigstens 20 Volumenprozent, bevorzugt zwischen 40 Volumenprozent und 80 Volumenprozent. Preferably, a proportion of the metal particles in the laminate film is at least 20% by volume, preferably between 40% by volume and 80% by volume.

In einer bevorzugten Ausführungsform ist das Bauteil ein Halbleiterschalter oder ein integrierter Schaltkreis. Der Halbleiterschalter ist bevorzugt ein IGBT (IGBT = Insulated-Gate-Bipolar-Transistor), ein Feldeffekttransistor, insbesondere ein MOS-Feldeffekttransistor. Der Halbleiterschalter weist bevorzugt ein Gehäuse auf, wobei der zum Verbinden mit dem Substrat ausgebildete Oberflächenbereich vorteilhaft durch einen elektrischen Anschluss gebildet ist. In a preferred embodiment, the component is a semiconductor switch or an integrated circuit. The semiconductor switch is preferably an IGBT (IGBT = Insulated Gate Bipolar Transistor), a field effect transistor, in particular a MOS field effect transistor. The semiconductor switch preferably has a housing, wherein the surface area formed for connection to the substrate is advantageously formed by an electrical connection.

Die Erfindung betrifft auch eine Prepreg-Folie zum elektrischen Verbinden eines elektronischen Bauelements mit einem Schaltungsträger. Die Prepreg-Folie umfasst Epoxidharz und in dem Epoxidharz eingebettete elektrisch leitfähige Partikel. Die Prepreg-Folie ist ausgebildet, beim Laminiertwerden quer zu ihrer flachen Erstreckung elektrisch leitfähige Pfade auszubilden, wobei die Pfade durch einander berührende elektrisch leitfähige Partikel gebildet sind. Die Partikel sind bevorzugt Metallpartikel, insbesondere Kupferpartikel, Aluminiumpartikel, Silberpartikel, Nickelpartikel, Goldpartikel, Platinpartikel, Palladiumpartikel, Zinkpartikel, Zinnpartikel oder Eisenpartikel oder eine Kombination, insbesondere in Form einer Legierung, aus wenigstens einer Teilmenge aus den vorgenannten Partikeln. The invention also relates to a prepreg film for electrically connecting an electronic component to a circuit carrier. The prepreg sheet comprises epoxy resin and electrically conductive particles embedded in the epoxy resin. The prepreg sheet is adapted to form electrically conductive paths when laminated across its flat extent, the paths being formed by contacting electrically conductive particles. The particles are preferably metal particles, in particular copper particles, aluminum particles, silver particles, nickel particles, gold particles, platinum particles, palladium particles, zinc particles, tin particles or iron particles or a combination, in particular in the form of an alloy, of at least a subset of the aforementioned particles.

Die Erfindung betrifft auch ein Verfahren zum elektrischen Verbinden eines elektronischen Bauelements mit einem Schaltungsträger. Bei dem Verfahren zum elektrischen Verbinden eines elektronischen Bauelements mit einem Schaltungsträger wird zwischen dem Bauelement, insbesondere einem Oberflächenbereich des Bauelements, und dem Schaltungsträger eine elektrisch leitfähige Laminatfolie angeordnet. Weiter wird das Bauelement mit dem Schaltungsträger zusammengepresst, so dass das Bauelement mittels der Laminatfolie mit dem Schaltungsträger verklebt wird, wobei elektrisch leitfähige Partikel in der Laminatfolie – insbesondere beim Zusammenpressen der Laminatfolie einander derart berühren, dass in der Laminatfolie quer zu einer flachen Erstreckung elektrisch leitfähige Pfade aus einander berührenden Partikeln gebildet sind. Dadurch kann vorteilhaft eine elektrisch leitfähige Verbindung oder zusätzlich eine wärmeleitfähige Verbindung zwischen dem Leistungshalbleiter und dem Substrat gebildet sein. The invention also relates to a method for electrically connecting an electronic component to a circuit carrier. In the method for electrically connecting an electronic component to a circuit carrier, an electrically conductive laminate foil is arranged between the component, in particular a surface region of the component, and the circuit carrier. Furthermore, the component is pressed together with the circuit carrier so that the component is adhesively bonded to the circuit carrier by means of the laminate film, wherein electrically conductive particles in the laminate film touch each other in such a way that in the laminate film electrically conductive transverse to a flat extension - in particular during compression of the laminate film Paths formed from touching particles. As a result, an electrically conductive connection or additionally a thermally conductive connection between the power semiconductor and the substrate can advantageously be formed.

In einer vorteilhaften Variante bildet die Laminatfolie eine Wärmeleitfolie. So kann vorteilhaft die Wärmeleitfähigkeit der Metallpartikel genutzt werden, um Verlustwärme aus einem Halbleiterbauelement an eine Wärmesenke abzuführen. In an advantageous variant, the laminate film forms a heat-conducting film. Thus, advantageously, the thermal conductivity of the metal particles can be used to dissipate heat loss from a semiconductor device to a heat sink.

Ein Kontaktsystem zum Abführen von Verlustwärme kann eine Wärmesenke, eine elektronisches Bauelement und eine Laminatfolie der vorbeschriebenen Art aufweisen. Das elektronische Bauelement ist ausgebildet, Verlustwärme zu erzeugen. Das Bauelement ist bevorzugt mittels der Laminatfolie mit der Wärmesenke wärmeleitend verbunden. Die Wärmesenke ist beispielsweise ein Kühlkörper, insbesondere ein Aluminium- oder Kupferkühlkörper. Der Kühlkörper weist bevorzugt Konvektionsrippen und/oder wenigstens einen Fluidkanal zum Führen eines Kühlfluids auf. A contact system for dissipating heat loss may include a heat sink, an electronic device, and a laminate film of the type described above. The electronic component is designed to generate waste heat. The component is preferably thermally conductively connected to the heat sink by means of the laminate film. The heat sink is, for example, a heat sink, in particular an aluminum or copper heat sink. The cooling body preferably has convection ribs and / or at least one fluid channel for guiding a cooling fluid.

Das Bauelement ist bevorzugt mit einem Oberflächenbereich eines Gehäuses des Bauelements, insbesondere Kunststoffgehäuse, mittels der Laminatfolie mit der Wärmesenke verbunden. The component is preferably connected to a surface region of a housing of the component, in particular a plastic housing, by means of the laminate foil with the heat sink.

Die Erfindung wird nun im Folgenden anhand von Figuren und weiteren Ausführungsbeispielen beschrieben. Weitere vorteilhafte Ausführungsvarianten ergeben sich aus den in den Figuren und in den abhängigen Ansprüchen beschriebenen Merkmalen. The invention will now be described below with reference to figures and further embodiments. Further advantageous embodiments will become apparent from the features described in the figures and in the dependent claims.

1 zeigt ein Ausführungsbeispiel für ein Kontaktsystem, bei dem ein Halbleiterbauteil mittels einer elektrisch leitfähige Partikel aufweisenden Laminatfolie mit einem Schaltungsträger elektrisch leitend verbunden werden kann; 1 shows an exemplary embodiment of a contact system in which a semiconductor component can be electrically conductively connected to a circuit carrier by means of an electrically conductive particle-comprising laminate film;

2 zeigt das in 1 dargestellte Kontaktsystem, bei dem die Laminatfolie elektrisch leitfähig verpresst worden ist; 2 shows that in 1 shown contact system in which the laminate film has been electrically conductive pressed;

3 zeigt ein Ausführungsbeispiel für eine Laminatfolie, welche Metallfasern und elektrisch leitfähige Partikel aufweist. 3 shows an embodiment of a laminate film comprising metal fibers and electrically conductive particles.

1 zeigt ein Ausführungsbeispiel für ein Kontaktsystem 1. Das Kontaktsystem 1 umfasst einen Leistungshalbleiter, insbesondere einen Halbleiterbauteil 2. Der Halbleiterbauteil 2 bildet das bereits vorab erwähnte elektronische Bauelement, insbesondere Halbleiterbauelement. Der Halbleiterbauteil 2 weist einen elektrischen Anschluss 3 auf, welcher einen Oberflächenbereich des Halbleiterbauteils 2 ausbildet. Der Halbleiterbauteil 2 weist auch einen elektrischen Anschluss 4 auf, welcher mit einem Endabschnitt aus dem Halbleiterbauteil 2, insbesondere einem Mold-Körper 5 des Halbleiterbauteils 2, herausragt. Der Halbleiterbauteil 2 kann mit dem elektrischen Anschluss 4 mit einer Verbindungsleitung oder einem elektrisch leitfähigen Blech, auch Stanzgitter genannt, lötverbunden, schweißverbunden, mittels Runddraht oder mittels Flachdraht gebondet, steckverbunden oder schraubverbunden werden. 1 shows an embodiment of a contact system 1 , The contact system 1 comprises a power semiconductor, in particular a semiconductor device 2 , The semiconductor device 2 forms the already mentioned above electronic component, in particular semiconductor device. The semiconductor device 2 has an electrical connection 3 on which a surface area of the semiconductor device 2 formed. The semiconductor device 2 also has an electrical connection 4 on, which with an end portion of the semiconductor device 2 , especially a mold body 5 of the semiconductor device 2 , stands out. The semiconductor device 2 can with the electrical connection 4 with a connecting line or an electrically conductive sheet metal, also called stamped grid, soldered, welded, connected by means of round wire or by means of flat wire, plug-connected or screw-connected.

Das Kontaktsystem 1 umfasst auch ein Substrat 6, welches in diesem Ausführungsbeispiel durch ein DBC-Substrat (DBC = Direct-Bonded-Copper) gebildet ist. The contact system 1 also includes a substrate 6 , which is formed in this embodiment by a DBC substrate (DBC = Direct-Bonded-Copper).

Das Substrat 6 kann in einer anderen Ausführungsform als LTCC-Substrat ausgebildet sein (LTCC = Low-Temperature-Cofired-Ceramics). The substrate 6 may be formed in another embodiment as LTCC substrate (LTCC = low-temperature co-fired ceramics).

Das Substrat 6 weist in diesem Ausführungsbeispiel zwei elektrisch leitfähige Kupferschichten 7 und 8 auf, wobei das Substrat 6 eine Keramikschicht 9 aufweist, welche zwischen den Kupferschichten 7 und 8 – insbesondere nach Art eines Sandwiches – eingeschlossen ist. The substrate 6 in this embodiment has two electrically conductive copper layers 7 and 8th on, with the substrate 6 a ceramic layer 9 which is between the copper layers 7 and 8th - Especially in the manner of a sandwich - is included.

Das Kontaktsystem 1 weist auch eine Laminatfolie, in diesem Ausführungsbeispiel eine Prepreg-Folie 10, auf. Die Prepreg-Folie 10 weist in diesem Ausführungsbeispiel elektrisch leitfähige Partikel auf, von denen ein Partikel 11 beispielhaft bezeichnet ist. Die Partikel 11 sind in diesem Ausführungsbeispiel Kupferpartikel. The contact system 1 also includes a laminate film, in this embodiment a prepreg film 10 , on. The prepreg foil 10 has in this embodiment, electrically conductive particles, of which a particle 11 is designated by way of example. The particles 11 are copper particles in this embodiment.

Das Halbleiterbauteil 2 weist auch einen Halbleiter 12 auf, welcher in diesem Ausführungsbeispiel als gehäuseloser Halbleiter, insbesondere Bare-Die genannt, ausgebildet ist. Der Halbleiter 12 ist in diesem Ausführungsbeispiel mit dem elektrischen Anschluss 3 elektrisch verbunden. Der Halbleiter 12 ist beispielsweise ein Halbleiterschalter, insbesondere Feldeffekttransistor oder IGBT (IGBT = Insulated-Gate-Bipolar-Transistor), wobei ein Schaltstreckenanschluss des Halbleiterschalters durch einen Oberflächenbereich des Halbleiters 12 gebildet ist. Der Schaltstreckenanschluss ist mit dem elektrischen Anschluss 3 beispielsweise lötverbunden. Der Anschluss 3 ist in diesem Ausführungsbeispiel durch ein elektrisch leitfähiges Blech, insbesondere Kupferblech, gebildet. The semiconductor device 2 also has a semiconductor 12 which, in this exemplary embodiment, is designed as a caseless semiconductor, in particular bare die. The semiconductor 12 is in this embodiment with the electrical connection 3 electrically connected. The semiconductor 12 is, for example, a semiconductor switch, in particular field effect transistor or IGBT (Insulated Gate Bipolar Transistor IGBT), wherein a switching path terminal of the semiconductor switch through a surface region of the semiconductor 12 is formed. The switchgear connection is with the electrical connection 3 for example soldered. The connection 3 is formed in this embodiment by an electrically conductive sheet, in particular copper sheet.

Die Prepreg-Folie 10 ist in diesem Ausführungsbeispiel zwischen dem Halbleiterbauteil 2 und dem Substrat 6 angeordnet und nach Art eines Sandwiches zwischen dem Halbleiterbauteil 2, insbesondere dem elektrischen Anschluss 3 und dem Substrat 6, und dort der Kupferschicht 7, angeordnet. The prepreg foil 10 is in this embodiment between the semiconductor device 2 and the substrate 6 arranged and in the manner of a sandwich between the semiconductor device 2 , in particular the electrical connection 3 and the substrate 6 , and there the copper layer 7 arranged.

2 zeigt das in 1 bereits dargestellte Kontaktsystem 1, wobei das Halbleiterbauteil 2 und das Substrat 6, zusammen mit der in 1 dargestellten Prepreg-Folie 10, miteinander verpresst worden sind. Die in 1 dargestellte Prepreg-Folie 10 ist in 2 als verpresste Prepreg-Folie 10‘ dargestellt. 2 shows that in 1 already shown contact system 1 , wherein the semiconductor device 2 and the substrate 6 , together with the in 1 illustrated prepreg film 10 , have been pressed together. In the 1 illustrated prepreg film 10 is in 2 as pressed prepreg foil 10 ' shown.

Beim Verpressen der Prepreg-Folie 10 zu der verpressten Prepreg-Folie 10‘ sind mittels der elektrisch leitfähigen Partikel 11 elektrisch leitfähige Pfade erzeugt worden. Von den elektrisch leitfähigen Pfaden sind in diesem Ausführungsbeispiel in 2 Pfade 13, 14, 15, 16, 17 und 18 beispielhaft bezeichnet. Die elektrisch leitfähigen Pfade, welche durch jeweils einander berührende elektrisch leitfähige Partikel wie das beispielhaft bezeichnete Partikel 11 gebildet sind, bilden jeweils eine elektrische Verbindung in der verpressten Prepreg-Folie 10‘ aus, welche sich quer zu einer flachen Erstreckung der verpressten Prepreg-Folie 10‘ erstreckt und welche die verpresste Prepreg-Folie 10‘ entlang einer dicken Erstreckung 19 durchsetzen. When pressing the prepreg film 10 to the compressed prepreg film 10 ' are by means of the electrically conductive particles 11 electrically conductive paths have been generated. Of the electrically conductive paths are in this embodiment in 2 paths 13 . 14 . 15 . 16 . 17 and 18 designated by way of example. The electrically conductive paths, which are in each case by contact with one another electrically conductive particles such as the particles designated by way of example 11 are formed, each forming an electrical connection in the pressed prepreg sheet 10 ' out, which is transverse to a flat extension of the pressed prepreg sheet 10 ' extends and which the pressed prepreg sheet 10 ' along a thick extension 19 push through.

Das Halbleiterbauteil 2 ist so mittels der Prepreg-Folie 10‘ mit dem Substrat 6 sowohl elektrisch leitfähig als auch mechanisch klebeverbunden. Vorteilhaft kann so auch eine thermische Leitfähigkeit der Laminatfolie, in diesem Ausführungsbeispiel der Prepreg-Folie 10‘ gebildet The semiconductor device 2 is so by means of the prepreg film 10 ' with the substrate 6 both electrically conductive and mechanically adhesively bonded. Advantageously, such a thermal conductivity of the laminate film, in this embodiment, the prepreg sheet 10 ' educated

Die elektrisch leitfähige Schicht ist so mittels der die Prepreg-Folie 10‘ quer durchtretenden elektrischen Verbindungen 13, 14, 15, 16, 17, 18 mit dem elektrischen Anschluss 3 elektrisch, oder zusätzlich wärmeleitfähig verbunden. The electrically conductive layer is so by means of the prepreg sheet 10 ' transverse electrical connections 13 . 14 . 15 . 16 . 17 . 18 with the electrical connection 3 electrically connected, or in addition thermally conductive.

3 zeigt ein Ausführungsbeispiel für eine Laminatfolie 20, welche aus einer verpressten Prepreg-Folie erzeugt worden ist. Die Laminatfolie weist zusätzlich zu den in 1 bereits dargestellten elektrisch leitfähigen Partikeln 11 elektrisch leitfähige Metallfasern 21, in diesem Ausführungsbeispiel Kupferfasern auf. Die Metallfasern 21 sind ausgebildet, gemeinsam mit den elektrisch leitfähigen Partikeln 11 elektrisch leitfähige Pfade wie den Pfad 22 auszubilden, welche sich quer zu einer flachen Erstreckung der Laminatfolie 20 erstrecken. Die Laminatfolie 20 kann anstelle der in 1 gezeigten Laminatfolie 10 Bestandteil des Kontaktsystems sein. 3 shows an embodiment of a laminate film 20 , which has been produced from a pressed prepreg sheet. The laminate film has, in addition to the in 1 already shown electrically conductive particles 11 electrically conductive metal fibers 21 , in this embodiment, on copper fibers. The metal fibers 21 are formed, together with the electrically conductive particles 11 electrically conductive paths like the path 22 form, which is transverse to a flat extension of the laminate film 20 extend. The laminate film 20 can instead of in 1 shown laminate film 10 Be part of the contact system.

Die in den 3 dargestellte Laminatfolie 20 kann vorteilhaft bei einem Kontaktsystem umfassend ein Halbleiterbauelement und eine Wärmesenke, mittels der Laminatfolie wärmeleitfähig verbunden werden. Die Laminatfolie 20 kann so eine Wärmeleitfolie bilden, mittels der das Halbleiterbauteil mit der Wärmesenke wärmeleitfähig verbunden sein kann. The in the 3 illustrated laminate film 20 can advantageously in a contact system comprising a semiconductor device and a heat sink, are thermally conductively connected by means of the laminate film. The laminate film 20 can thus form a Wärmeleitfolie, by means of which the semiconductor device may be thermally conductively connected to the heat sink.

Claims (11)

Kontaktsystem (1) mit wenigstens einem elektronischen Bauelement (2), insbesondere Halbleiterbauelement und einem Schaltungsträger (6), wobei ein durch einen Oberflächenbereich des Bauelements (2) gebildeter elektrischer Anschluss (3) des Bauelements (2) mit dem Schaltungsträger (6) elektrisch leitfähig verbunden ist, dadurch gekennzeichnet, dass das Kontaktsystem (1) eine sich flach erstreckende Laminatfolie (10), insbesondere eine verpresste Prepreg-Folie aufweist, wobei die Laminatfolie (10) elektrisch leitfähige Partikel (11) aufweist, wobei wenigstens ein Teil der Partikel (11) einander elektrisch leitfähig derart berühren, dass die Laminatfolie (10) quer zu ihrer flachen Erstreckung elektrisch leitfähig ausgebildet ist. Contact system ( 1 ) with at least one electronic component ( 2 ), in particular semiconductor component and a circuit carrier ( 6 ), wherein a through a surface region of the device ( 2 ) formed electrical connection ( 3 ) of the component ( 2 ) with the circuit carrier ( 6 ) is electrically conductively connected, characterized in that the contact system ( 1 ) a flat extending laminate film ( 10 ), in particular a compressed prepreg film, wherein the laminate film ( 10 ) electrically conductive particles ( 11 ), wherein at least a part of the particles ( 11 ) Touch each other electrically conductive so that the Laminate film ( 10 ) is formed electrically conductive transversely to its flat extent. Kontaktsystem (1) nach Anspruch 1, dadurch gekennzeichnet, dass der Schaltungsträger (6) ein DBC-Substrat ist. Contact system ( 1 ) according to claim 1, characterized in that the circuit carrier ( 6 ) is a DBC substrate. Kontaktsystem (1) nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass die Laminatfolie (10) eine Epoxidharz haltige Folie ist. Contact system ( 1 ) according to claim 1 or 2, characterized in that the laminate film ( 10 ) is an epoxy resin-containing film. Kontaktsystem (1) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Laminatfolie (10) eine faserverstärkte Folie ist, welche Fasern, insbesondere Glasfasern aufweist. Contact system ( 1 ) according to one of the preceding claims, characterized in that the laminate film ( 10 ) is a fiber-reinforced film comprising fibers, in particular glass fibers. Kontaktsystem (1) nach Anspruch 4, dadurch gekennzeichnet, dass wenigstens ein Teil der Fasern durch Metallfasern gebildet ist. Contact system ( 1 ) according to claim 4, characterized in that at least a part of the fibers is formed by metal fibers. Kontaktsystem nach Anspruch 5, dadurch gekennzeichnet, dass die Metallfasern Kupferfasern sind. Contact system according to claim 5, characterized in that the metal fibers are copper fibers. Kontaktsystem nach Anspruch 6, dadurch gekennzeichnet, dass die Metallfasern als Gewebe ausgebildet sind. Contact system according to claim 6, characterized in that the metal fibers are formed as tissue. Kontaktsystem nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Partikel Metallpartikel, insbesondere Kupferpartikel sind. Contact system according to one of the preceding claims, characterized in that the particles are metal particles, in particular copper particles. Kontaktsystem nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Bauteil ein Halbleiterschalter oder ein Intergrierter Schaltkreis ist. Contact system according to one of the preceding claims, characterized in that the component is a semiconductor switch or an integrated circuit. Prepreg-Folie zum elektrischen Verbinden eines elektronischen Bauelements mit einem Schaltungsträger, wobei die Prepreg-Folie Epoxidharz und in dem Epoxidharz eingebettete elektrisch leitfähige Metallpartikel umfasst, wobei die Prepreg-Folie ausgebildet, ist beim Laminiertwerden quer zu ihrer flachen Erstreckung elektrisch leitfähige Pfade auszubilden, wobei die Pfade durch einander berührende elektrisch leitfähige Metallpartikel gebildet sind.  A prepreg sheet for electrically connecting an electronic component to a circuit carrier, the prepreg sheet comprising epoxy resin and electrically conductive metal particles embedded in the epoxy resin, wherein the prepreg sheet is formed to form electrically conductive paths when laminated across its flat extent the paths are formed by contacting electrically conductive metal particles. Verfahren zum elektrischen Verbinden eines elektronischen Bauelements mit einem Schaltunsgträger, bei dem zwischen dem Bauelement, insbesondere einem Oberflächenbereich des Bauelements, und dem Schaltungsträger eine elektrisch leitfähige Laminatfolie angeordnet wird, und das Bauelement mit dem Schaltungsträger zusammengepresst wird, so dass das Bauelement mittels der Laminatfolie mit dem Schaltungsträger verklebt wird, wobei elektrisch leitfähige Partikel in der Laminatfolie – insbesondere beim Zusammenpressen der Laminatfolie einander derart berühren, dass in der Laminatfolie quer zu einer flachen Erstreckung elektrisch leitfähige Pfade aus einander berührenden Partikeln gebildet sind.  Method for electrically connecting an electronic component to a circuit carrier, in which an electrically conductive laminate film is arranged between the component, in particular a surface region of the component, and the circuit carrier, and the component is pressed together with the circuit carrier, so that the component by means of the laminate film the electrically conductive particles in the laminate film - in particular during compression of the laminate film touching each other such that are formed in the laminate film transverse to a flat extension electrically conductive paths of particles touching each other.
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