DE102014211462A1 - power module - Google Patents
power module Download PDFInfo
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- DE102014211462A1 DE102014211462A1 DE102014211462.4A DE102014211462A DE102014211462A1 DE 102014211462 A1 DE102014211462 A1 DE 102014211462A1 DE 102014211462 A DE102014211462 A DE 102014211462A DE 102014211462 A1 DE102014211462 A1 DE 102014211462A1
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- current
- control
- protection circuit
- current electrode
- electrode
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/08—Modifications for protecting switching circuit against overcurrent or overvoltage
- H03K17/082—Modifications for protecting switching circuit against overcurrent or overvoltage by feedback from the output to the control circuit
- H03K17/0828—Modifications for protecting switching circuit against overcurrent or overvoltage by feedback from the output to the control circuit in composite switches
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/08—Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/32—Means for protecting converters other than automatic disconnection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/62—Protection against overvoltage, e.g. fuses, shunts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/0003—Details of control, feedback or regulation circuits
- H02M1/0009—Devices or circuits for detecting current in a converter
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
- H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
- H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M7/53—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
- H02M7/537—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
- H02M7/5387—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Power Conversion In General (AREA)
- Inverter Devices (AREA)
- Electronic Switches (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
Ein Leistungsmodul enthält ein Schaltelement (20) und ein Steuer-IC (100), das das Schaltelement steuert. Das Steuer-IC enthält einen Controller (10), der eine Gatespannung des Schaltelements steuert, und eine Schutzschaltung (11), die elektrisch unabhängig von dem Controller ist und die mit der Masse des Steuer-ICs verbunden ist. Die Schutzschaltung ist nicht mit einer Gateelektrode (10D) und einer Hauptstromelektrode (14D) des Schaltelements (20) verbunden. Die Schutzschaltung ist mit einer Fühlstromelektrode (15D) des Schaltelements verbunden.A power module includes a switching element (20) and a control IC (100) that controls the switching element. The control IC includes a controller (10) that controls a gate voltage of the switching element, and a protection circuit (11) that is electrically independent of the controller and that is connected to the ground of the control IC. The protection circuit is not connected to a gate electrode (10D) and a main current electrode (14D) of the switching element (20). The protection circuit is connected to a sense current electrode (15D) of the switching element.
Description
Die vorliegende Erfindung bezieht sich auf ein Leistungsmodul.The present invention relates to a power module.
Spritzgepresste intelligente Leistungsmodule (IPMs, Intelligent Power Modules), bei denen die Schaltelemente wie. z. B. Bipolartransistoren mit isoliertem Gate (IGBTs, Insulated Gate Bipolar Transistors) und integrierte Steuerschaltungen (ICs, Integrated Circuits) zum Schützen und Treiben der Schaltelemente auf demselben plattierten Anschlussrahmen angebracht sind und bei denen sie weiter mit einem Harz versiegelt sind, sind bereits bekannt.Injection molded intelligent power modules (IPMs, Intelligent Power Modules) in which the switching elements such as. z. For example, insulated gate bipolar transistors (IGBTs) and integrated circuits (ICs) for protecting and driving the switching elements are mounted on the same plated leadframe and are further sealed with a resin, are already known.
Als eine der Schutzfunktionen hat das Schaltelement des Steuer-IC eine Überstromschutzfunktion, die verhindert, dass ein Überstrom durch das Schaltelement fließt, wenn die Last kurzgeschlossen ist. Ein konkretes Verfahren zum Bestimmen, ob ein Überstrom vorliegt, ist das Hauptstrombestimmungsverfahren, bei dem ein Shuntwiderstand in einem Hauptstrompfad eingesetzt wird, um den Strom zu erfassen, oder das Fühlstromerfassungsverfahren, das unter Verwendung eines Schaltelements mit einem Fühlemitter einen Fühlstrom erfasst.As one of the protection functions, the switching element of the control IC has an overcurrent protection function that prevents overcurrent from flowing through the switching element when the load is shorted. A concrete method for determining whether an overcurrent exists is the main current determining method in which a shunt resistor is used in a main current path to detect the current, or the sense current detection method that detects a sense current using a switching element with a sense emitter.
Das Hauptstromerfassungsverfahren hat den Vorteil, dass die Genauigkeit der Stromerfassung hoch ist, und es hat den Nachteil, dass der Leistungsverlust als Modul ansteigt, weil der Widerstand direkt mit dem Hauptstrompfad verbunden ist.The main current detection method has the advantage that the accuracy of the current detection is high, and it has the disadvantage that the power loss as a module increases because the resistor is connected directly to the main current path.
Das Fühlstromerfassungsverfahren hat dagegen den Vorteil, dass der Leistungsverlust verringert sein kann durch Verwenden des Fühlemitters, der einen Teil des Hauptstroms ableitet, wenn der Fühlstrom erfasst wird. Das Fühlstromerfassungsverfahren hat jedoch den Nachteil, dass die Genauigkeit der Stromerfassung niedriger ist als diejenige bei dem Hauptstromerfassungsverfahren.On the other hand, the sense current detection method has the advantage that the power loss can be reduced by using the sense emitter, which diverts a part of the main current when the sense current is detected. However, the sense current detection method has the disadvantage that the accuracy of current detection is lower than that in the main current sense method.
Wie oben beschrieben, haben beide Verfahren Vorteile und Nachteile. Um es einem IPM zu ermöglichen, ein beliebiges der Stromerfassungsverfahren handhaben zu können, wurde ein Aufbau entwickelt mit Erfassungsanschlüssen zum Erfassen des Stroms, der durch einen Fühlstromanschluss fließt und einem Hauptstromanschluss, und jeder Anschluss ist einzeln zur Außenseite des IPM geführt, ohne in dem IPM verbunden zu sein.As described above, both methods have advantages and disadvantages. In order to enable an IPM to handle any one of the current detection methods, a construction has been developed with detection terminals for detecting the current flowing through a sense current terminal and a main power terminal, and each terminal is individually led to the outside of the IPM without being in the IPM to be connected.
Andererseits kann eine elektrostatische Entladung (ESD, Electrostatic Discharge) auf die Anschlüsse aufgebracht werden, so dass ein Schutzelement bereitgestellt werden muss. Der Aufbau mit dem Schutzelement ist beispielsweise in
Wenn die Vorrichtung, die das ESD-Schutzelement enthält, für das spritzgepresste IPM entsprechend dem Fühlstromerfassungsverfahren und dem Hauptstromerfassungsverfahren verwendet wird, treten die oben beschriebenen Probleme auf.When the device including the ESD protection element is used for the injection-molded IPM according to the sense current detection method and the main current sense method, the above-described problems arise.
In
In
Die Aufgabe der vorliegenden Erfindung besteht darin, ein Leistungsmodul bereitzustellen, das in der Lage ist, in geeigneter Weise eine ESD-Schutzfunktion eines Fühlstromanschlusses durchzuführen, ohne einen komplizierten Herstellungsprozess zu erfordern.The object of the present invention is to provide a power module capable of suitably performing an ESD protection function of a sense current terminal without requiring a complicated manufacturing process.
Die Aufgabe wird gelöst durch ein Leistungsmodul gemäß Anspruch 1. Weiterbildungen der Erfindung sind jeweils in den Unteransprüchen angegeben.The object is achieved by a power module according to
Ein Leistungsmodul enthält ein Schaltelement und ein Steuer-IC, das das Schaltelement steuert. Das Steuer-IC enthält einen Controller, der eine Gatespannung des Schaltelements steuert, und eine Schutzschaltung, die elektrisch unabhängig von dem Controller ist und die mit der Masse des Steuer-ICs verbunden ist. Die Schutzschaltung ist nicht mit einer Gateelektrode und einer Hauptstromelektrode des Schaltelements verbunden, und sie ist mit einer Fühlstromelektrode des Schaltelements verbunden.A power module includes a switching element and a control IC that controls the switching element. The control IC includes a controller that controls a gate voltage of the switching element and a protection circuit that is electrically independent of the controller and that is connected to the ground of the control IC. The protection circuit is not connected to a gate electrode and a main current electrode of the switching element, and is connected to a sense current electrode of the switching element.
Die ESD kann zu der Seite der Schutzschaltung fließen, so dass die ESD-Schutzfunktion auf der Seite der Fühlstromelektrode geeignet durchgeführt werden kann, ohne einen komplizierten Herstellungsprozess zu erfordern.The ESD may flow to the side of the protection circuit so that the ESD protection function on the sensing current electrode side is suitably performed can be, without requiring a complicated manufacturing process.
Weitere Merkmale und Zweckmäßigkeiten der Erfindung ergeben sich aus der Beschreibung von Ausführungsbeispielen anhand der beigefügten Zeichnungen.Further features and advantages of the invention will become apparent from the description of embodiments with reference to the accompanying drawings.
Mit Bezug auf die beigefügten Zeichnungen wird eine Ausführungsform beschrieben.An embodiment will be described with reference to the accompanying drawings.
Ein ESD-Schutzelement
In einem Fall, in dem die ESD beispielsweise an den Hauptstromanschluss
Eine Ausführungsform, die im Folgenden beschrieben wird, bezieht sich auf ein Leistungsmodul, das die o. g. Probleme verhindert.An embodiment, which will be described below, relates to a power module that satisfies the above-mentioned. Prevents problems.
Für ein in der folgenden Ausführungsform beschriebenes Schaltelement können Halbleitermaterialien verwendet werden. Außerdem können die Halbleitermaterialien einen Halbleiter mit großer Bandlücke einschließen. Halbleiter mit großer Bandlücke bezeichnet im Allgemeinen einen Halbleiter, der eine Breite des verbotenen Bands von etwa 2 eV oder größer hat und ist bekannt als ein Gruppe-iii-Nitrid, repräsentiert durch GaN, ein Gruppe-ii-Nitrid, repräsentiert durch ZnO, ein Gruppe-ii-Chalkogenid, repräsentiert durch ZnSe und SiC.For a switching element described in the following embodiment, semiconductor materials can be used. In addition, the semiconductor materials may include a wide bandgap semiconductor. A wide bandgap semiconductor generally refers to a semiconductor having a forbidden band width of about 2 eV or greater, and is known as a group III nitride represented by GaN, a group II nitride represented by ZnO Group II chalcogenide represented by ZnSe and SiC.
Der Controller
Der Überstromerfassungsabschnitt
Wie in
Der Erfassungsanschluss des Überstromerfassungsabschnitts
Der ESD-Schutzschaltungsabschnitt
Ein konkreter Aufbau des ESD-Schutzschaltungsabschnitts kann eine Schaltung sein, wie sie beispielsweise in
Wie in
Der Controller
Der ESD-Schutzschaltungsabschnitt
Ein Hauptstromanschluss
Der Erfassungsanschluss
Wenn bei diesem Aufbau beispielsweise die ESD an den Fühlstromanschluss
Wie in
Der ESD-Schutzschaltungsabschnitt
Ein Erfassungsanschluss
Wenn bei diesem Aufbau beispielsweise die ESD an den Fühlstromanschluss
Gemäß der Ausführungsform sind der IGBT
Das Steuer-IC
Der ESD-Schutzschaltungsabschnitt
Das Steuer-IC und der ESD-Schutzschaltungsabschnitt
Bei diesem Aufbau kann die ESD zu der Seite des ESD-Schutzschaltungsabschnitts
Außerdem enthält das Steuer-IC
Der Überstromerfassungsabschnitt
Das Steuer-IC
Wenn bei diesem Aufbau ESD erzeugt wird, wird das Ansteuern des IGBT
Weiter ist gemäß der Ausführungsform die Fühlstromelektrode
Wenn bei diesem Aufbau beispielsweise die ESD an dem Fühlstromanschluss
Auch wenn die Materialeigenschaften und die Materialien der Bestandteile, die Bedingungen für die Ausführung und dergleichen in der Ausführungsform beschrieben sind, dienen diese nur als Beispiele und sind nicht auf die oben beschriebenen eingeschränkt.Although the material properties and the constituent materials, conditions of execution and the like are described in the embodiment, these are only examples and are not limited to those described above.
ZITATE ENTHALTEN IN DER BESCHREIBUNG QUOTES INCLUDE IN THE DESCRIPTION
Diese Liste der vom Anmelder aufgeführten Dokumente wurde automatisiert erzeugt und ist ausschließlich zur besseren Information des Lesers aufgenommen. Die Liste ist nicht Bestandteil der deutschen Patent- bzw. Gebrauchsmusteranmeldung. Das DPMA übernimmt keinerlei Haftung für etwaige Fehler oder Auslassungen.This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.
Zitierte PatentliteraturCited patent literature
- JP 2008-42950 A [0007, 0009] JP 2008-42950 A [0007, 0009]
- JP 2011-103483 A [0007, 0010] JP 2011-103483 A [0007, 0010]
Claims (5)
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JP2013-160097 | 2013-08-01 | ||
JP2013160097A JP6168899B2 (en) | 2013-08-01 | 2013-08-01 | Power module |
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DE102014211462B4 DE102014211462B4 (en) | 2022-03-17 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3255785A4 (en) * | 2016-04-27 | 2017-12-20 | Mitsubishi Electric Corporation | Electric motor drive device and air conditioner |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008042950A (en) | 2006-08-01 | 2008-02-21 | Mitsubishi Electric Corp | Power transformer |
JP2011103483A (en) | 2011-01-24 | 2011-05-26 | Toyota Motor Corp | Semiconductor device with current detection function |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US5563759A (en) * | 1995-04-11 | 1996-10-08 | International Rectifier Corporation | Protected three-pin mosgated power switch with separate input reset signal level |
EP0757442A3 (en) | 1995-07-31 | 1998-12-30 | Delco Electronics Corporation | Ignition coil driver module |
JP4493865B2 (en) * | 2001-02-19 | 2010-06-30 | 三菱電機株式会社 | Semiconductor device |
JP4421849B2 (en) * | 2003-07-22 | 2010-02-24 | 株式会社デンソー | Input protection circuit |
JP5361788B2 (en) * | 2010-04-20 | 2013-12-04 | 三菱電機株式会社 | Power module |
-
2013
- 2013-08-01 JP JP2013160097A patent/JP6168899B2/en active Active
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008042950A (en) | 2006-08-01 | 2008-02-21 | Mitsubishi Electric Corp | Power transformer |
JP2011103483A (en) | 2011-01-24 | 2011-05-26 | Toyota Motor Corp | Semiconductor device with current detection function |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3255785A4 (en) * | 2016-04-27 | 2017-12-20 | Mitsubishi Electric Corporation | Electric motor drive device and air conditioner |
US10432131B2 (en) | 2016-04-27 | 2019-10-01 | Mitsubishi Electric Corporation | Motor drive apparatus and air conditioner |
Also Published As
Publication number | Publication date |
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JP6168899B2 (en) | 2017-07-26 |
JP2015033186A (en) | 2015-02-16 |
DE102014211462B4 (en) | 2022-03-17 |
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