DE102014112516B3 - Power electronic system with liquid cooling device and method of manufacturing the liquid cooling device - Google Patents

Abstract

The electronic power system according to the invention (1) comprises a liquid cooling device (3) and a switching device (2), said switching device (2) having a power semiconductor components on its side facing away from the liquid cooling device (3) on electrically insulated interconnects (14) (16) and in particular connected to one another by means of a connecting device (18), this liquid cooling device (3) having a first (30) and a second partial body (32) between which an inflow volume region (34), a cooling volume region (36) and an outflow volume region (38) is formed, wherein a plurality of heat transfer bodies (4) project from the first part body (30) into the cooling volume region (36), wherein in the cooling volume region (36) a plastic flow guide body (5) is arranged, which has a plurality of recesses (6), wherein one or more Rere heat transfer body (4) extend into an associated recess (6) of the plastic flow guide (5).

Description

The invention describes a power electronic system with a liquid cooling device and with a switching device, which is preferably designed as a power converter. Furthermore, the invention describes a method for producing a liquid cooling device, in particular for such a power electronic system.

From the prior art, disclosed by way of example in the US 6,594,149 B2 , a liquid-cooled circuit device is known. This includes a switching module having a circuit element and a switching module base plate on which the circuit element is mounted, a switching housing for receiving the switching module and a cooling liquid chamber for conducting a cooling liquid in contact with a back of a module base plate of the switching module. Similar switching devices with liquid cooling devices are known from the DE 10 2010 043 446 B3 or the DE 10 2010 040 610 A1 known.

Furthermore, by way of example from the DE 10 2012 102 666 A1 , or similar from the US 2006/0231236 A1 known that a cooling device constructed of two part bodies on the first part body heat transfer body has, similar to the above-mentioned publications, and the second part body may have corresponding second means which generally serve to guide the flow and improve the overall cooling performance.

A constant shortcoming of such systems lies in the inadequate cooling capacity, wherein the, typically thermal, energy, which usually results from losses of the switching device, must be dissipated to a cooling medium in order to protect the switching device from overheating and thus destruction.

In view of these conditions mentioned, the invention has for its object to further develop the liquid cooling device of a power electronic system such that the heat transfer from the switching device of the power electronic system to a cooling medium, more specifically to a cooling liquid is improved and also a method for producing such Specify liquid cooling device.

This object is achieved by a power electronic system having the features of claim 1, and by a method for producing a liquid cooling device with the features of claim 10. Preferred embodiments are described in the respective dependent claims.

The power electronic system according to the invention has a liquid cooling device and a switching device, said switching device comprises a substrate, on the liquid cooling device side facing away from each other electrically insulated interconnects power semiconductor components arranged and circuitally connected by means of a connecting device in particular, said liquid cooling means a first and a second Partial body has, between which a Einströmvolumenbereich, a cooling volume range and a Ausströmvolumenbereich are formed, projecting from the first part of body, a plurality of heat transfer bodies in the cooling volume range, wherein in the cooling volume region, a plastic flow guide body is arranged, which has a plurality of recesses, wherein a single or a plurality of heat transfer body in an associated recess of the plastic Strömu extend ngsleitkörpers.

Of course, unless this is excluded per se, the features mentioned in the singular, in particular the cooling volume range and the plastic flow guide, may also be present multiple times in the system according to the invention.

It can be advantageous if the plastic flow guide body is arranged on a surface of the second part body in the cooling volume range or is formed integrally with this part body. In the first variant, the multi-piece configuration, it is also advantageous if the plastic flow guide is formed of a plastic material.

In a preferred embodiment, the heat transfer body on a round, oval, polyhedral or free-shaped base and are pointed or tapered or not tapered.

In particular, the volume of the reaching into the recess portion of the recess of the associated heat transfer body can be at most 25%, in particular at most 10% smaller than the volume of each recess or as the average volume of all recesses of the plastic flow guide.

Furthermore, it may be advantageous if each heat-transporting body or on average of all heat-transporting bodies extend at least 20%, in particular at least 40%, of the volume into an associated recess.

A further preferred embodiment results when the heat transfer body of the Floor surface of the recesses are arranged spaced or extend into an elastic surface portion of the bottom surface or abut flush there. For this purpose, it is advantageous if the plastic flow guide body consists of a two-component plastic and that part of the bottom surface into which the heat transfer body extends consists of an elastic plastic.

It may optionally be advantageous if a bypass line runs through at least two recesses through the plastic flow guide body, whereby a channel is formed between the two recesses through which cooling fluid can flow.

A particularly preferred embodiment is when the plastic flow guide has a positioning that determines its location in the cooling volume range. As a result, the proper function can be ensured in continuous operation, since the plastic flow guide is permanently secured securely at the desired location.

In some applications, it may be advantageous if, in the case of a plurality of switching devices arranged in series and identically formed cooling volume regions assigned to them, the plastic flow guide bodies are designed differently for each cooling volume region and different flow velocities per cooling volume range are thereby achieved during operation.

• a) Ausbilden und Bereitstellen eines ersten Teilkörpers und eines zweiten Teilkörpers, wobei der erste Teilkörper eine Mehrzahl von Wärmetransportkörpern aufweist, die im Bereich des sich im Verfahren ausbildenden Kühlvolumenbereich angeordnet sind;
• b) Ausbilden und Bereitstellen eines Kunststoff-Strömungsleitkörpers mit einer Mehrzahl von Ausnehmungen, die dazu ausgebildet sind zugeordnete Wärmetransportkörper teilweise aufzunehmen;
• c) Anordnen des ersten und zweiten Teilkörper sowie des Kunststoff-Strömungsleitkörpers derart, dass zwischen den beiden Teilkörpern ein Einströmvolumenbereich, ein Kühlvolumenbereich und ein Ausströmvolumenbereich ausgebildet werden und dass der Kunststoff-Strömungsleitkörper derart in dem Kühlvolumenbereich angeordnet ist, dass ein einzelner oder mehrere Wärmetransportkörper in eine zugeordnete Ausnehmung des Kunststoff-Strömungsleitkörpers hineinreichen;
• d) Flüssigkeitsdichtes kraft- oder stoffschlüssiges Verbinden des ersten und zweiten Teilkörpers.

The inventive method for producing a liquid cooling device mentioned above by means of the following directly or indirectly successive steps:

• a) forming and providing a first part body and a second part body, wherein the first part body has a plurality of heat transfer bodies, which are arranged in the region of forming in the method cooling volume range;
• b) forming and providing a plastic flow guide body having a plurality of recesses adapted to partially receive associated heat transfer bodies;
• c) arranging the first and second part body and the plastic flow guide such that an inflow volume range, a cooling volume range and an outflow volume range are formed between the two part bodies and that the plastic flow guide is arranged in the cooling volume range such that a single or multiple heat transfer body in extend an associated recess of the plastic flow guide;
• d) Liquid-tight non-positive or cohesive connection of the first and second part body.

In this method, it may be advantageous if the first and optionally also the second part body are produced by means of an aluminum casting process.

In principle, it is preferred if the plastic flow guide body is produced in a plastic injection molding process, since in this case the shaping is simple and flexible.

It is understood that the various embodiments of the invention, ie the power electronic system as well as the method for producing a liquid cooling device for this purpose, can be implemented individually or in any desired combinations in order to achieve improvements. In particular, the features mentioned above and here or below can be used not only in the specified combinations, but also in other non-exclusive combinations or alone, without departing from the scope of the present invention.

Further explanations of the invention, advantageous details and features, will become apparent from the following description of the in the 1 to 11 schematically illustrated embodiments of the invention, or of respective parts thereof.

1 shows a three-dimensional view of an inventive power electronic system, partially in an exploded view.

2 shows in three-dimensional view a plastic flow guide of a power electronic system according to the invention.

3 shows in three-dimensional view a section through an inventive power electronic system.

4 shows a section of a power electronic system according to the prior art.

5 shows a section of a liquid cooling device of a power electronic system according to the invention in an exploded view.

6 to 8th show various sections of liquid cooling devices according to the invention power electronic systems.

9 to 11 showed different designs of heat transfer bodies of liquid cooling devices and associated recesses of plastic flow guide bodies.

1 shows a three-dimensional view of an inventive power electronic system 1 , partially in exploded view. Shown here is a liquid cooling device 3 consisting of a first part body 30 and a second part body 32 , At least the first part of the body 30 is preferably produced by means of an aluminum casting process. This liquid cooling device 3 continues to have an 340 and a drain port 380 on. Between the 340 and the drain port 380 arise through the arrangement of the second body part 32 three adjoining cooling volume ranges 36 , each with an inflow 34 and an outflow volume range 38 , Due to the design with adjoining cooling volume ranges 36 forms the one cooling volume range 36 associated outflow volume range 38 the inflow volume range 34 of the adjacent cooling volume range 36 from or go into each other.

In every cooling volume range 36 protrude a plurality of cylindrical heat transfer bodies 4 into it. On the cooling volume areas 36 facing surface 320 of the second part body 32 the liquid cooling device 3 is every cooling volume range 36 assigned a plastic flow guide 5 , shown explicitly in 2 arranged. This has substantially a cuboid shape with a plurality of cylindrical recesses 6 on. In each of these cylindrical recesses 6 extends a heat transfer body 4 to 40% to 60% of its length and otherwise in that between the cylinder jacket inner surface 60 the recess 6 and the cylinder shell outer surface 40 of the heat transfer body 4 a flow area 64 remains free to flow through the coolant, see. For this 7 ,

Each of the similarly arranged cooling volume ranges arranged in series 36 is a switching device 2 assigned, although the plastic flow guide 5 per cooling volume range 36 are formed slightly different and thus a change in temperature of the cooling liquid and thus a necessary change in the heat transfer behavior in a downstream cooling volume range 36 Take into account. Thus, different flow rates and thus a different heat transfer behavior per cooling volume range are achieved during operation. This can be achieved particularly easily by means of different depths or different diameters of the recesses.

From the switching device 2 of the power electronic system 1 are in this illustration only load connection elements 20 visible, noticeable.

2 shows in three-dimensional view one, preferably produced by a plastic injection molding process, plastic flow guide 5 a power electronic system according to the invention 1 , Explicitly shown here are next to the recesses 6 for the arrangement of heat transfer bodies and two positioning 50 , Which are provided for the location of the plastic flow guide 5 in the cooling volume range 36 set. In other words, the positioning serve to attach the plastic flow guide at the desired location of the cooling volume range of the liquid cooling device.

3 shows in three-dimensional view a section through an inventive power electronic system 1 , Here is the first part body 30 the liquid cooling device 3 from a basic body 300 and an insert body 302 , wherein the insert body 302 a variety of heat transport bodies 4 has and with the main body 300 cohesively connected by means of a welded connection. This simplifies the production of the power electronic system, since here the switching device or parts thereof on the Einsetzkörper 302 are arranged and this as a fully tested assembly in the body 300 can be used.

The switching device 2 in turn has a substrate 10 on which the liquid cooling device 3 side facing away from each other on electrically insulated interconnects 14 Power semiconductor components 16 arranged and circuit-wise by means of a connection device 18 are connected, cf. also 4 ,

Also shown is the plastic flow guide 5 designed analogously to 1 and 2 , In particular, in the enlarged detail can be seen how the heat transfer body 4 in the respective associated recess 6 the plastic flow guide 5 reach in, here without the bottom surface 62 the recess 6 to touch, reducing the flow area 64 also in the area between the cylinder top surface 42 the heat transfer body 4 , see. 7 , and the bottom surface 62 the recess 6 is extended. In this embodiment of the liquid cooling device 3 the volume of the portion of each heat-transporting body extending into the recess is 10% greater than the volume of the associated recess of the plastic flow-guiding body. In addition, each heat transfer body reaches 40% of its volume into an associated recess.

4 shows a section of a power electronic system with a switching device 2 and a liquid cooling device 3 according to the prior art. The switching device 2 here has a substrate 10 with on his the liquid cooling device 3 remote surface arranged plurality of conductor tracks 14 on. On these tracks 14 are power semiconductor devices 16 arranged and by means of a connecting device 18 connected properly. Furthermore, on the substrate 10 connection elements 20 arranged for external connection.

The tracks 14 of the substrate 10 are by means of an insulation layer 12 electrically from the liquid cooling device 3 isolated. This isolation situation 12 is, however, thermally conductive to thermal energy resulting from losses of the switching device, more specifically the power semiconductor devices 16 , results in a cooling medium of the liquid cooling device 3 dissipate.

The liquid cooling device 3 consists in turn of a first and a second body part 30 . 32 between which an inflow volume range 34 , a cooling volume range 36 and an outflow volume range 38 are formed. In this embodiment, the first part body 30 from a basic body 300 and an insert body 302 formed, wherein the insert body 302 with the main body 300 by means of a welded joint 304 connected is. The insert body 302 or more generally the first part body 30 has a plurality of heat transfer bodies 4 on, that of the first part body 30 in the cooling volume range 36 protrude.

The liquid heat sink 3 is thus designed such that a cooling liquid through the Einströmvolumenbereich 34 in the cooling volume range 36 flow in, through this and through the outflow volume range 38 can leave again. When flowing through the cooling volume range 36 is thermal energy of the circuit device 2 via heat transfer body 4 delivered to the coolant.

5 shows a section of a liquid cooling device 3 a power electronic system according to the invention 1 in exploded view. The first part body 30 the liquid cooling device 3 is identical to the one according to 4 educated. The second heat sink 32 has a cooling volume range 36 facing surface 320 on, on which a plastic flow guide 5 , basically analogous to that according to 2 is arranged, wherein 6 this liquid cooling device 3 in normal view shows.

Within the scope of the production method according to the invention of a liquid cooling device 3 become the two part bodies 30 . 32 and the plastic flow guide 5 arranged as shown to each other and then liquid-tight, preferably connected to each other by means of a welded joint.

6 to 8th show different sections of liquid cooling devices 3 inventive power electronic systems. The embodiment according to 6 here corresponds essentially to the representations of 1 to 3 , Here is each heat transport body 4 exactly one recess 6 the plastic flow guide 5 assigned. In addition, the plastic flow guide 5 integral with the second part body 32 be educated. Here it is then for the connection to the first part of the body 30 advantageous if the second part body 32 also produced in an aluminum casting process. Alternatively, the second part body 32 including integrally formed plastic flow guide 5 be made of plastic and with the first part body 30 non-positively connected in particular with a sealing device arranged therebetween.

7 shows different, even from a strict assignment of heat transfer body and recess, deviating configurations. There is a recess 6 the plastic flow guide 5 several, here two, heat transport bodies 4 assigned.

Furthermore, the heat transfer body 4 down to the floor area 62 the recess 6 reach down. In this case, it is advantageous if these have an elastic surface section 620 having.

In addition, according to 8th between at least two recesses 6 a bypass line 640 through the plastic flow guide 5 run. This can as a further recess, from that side of the plastic flow guide 5 be formed on the surface 320 of the second part body 32 rests. The second part body 32 , or its surface 320 , then forms almost a part of this bypass line 640 ,

Basically, the heat transfer body 4 have a round, oval, polyhedron-shaped or free-shaped base surface and pointed or tapered in the direction of the second part of the body 32 the liquid cooling device 3 or not be tapered.

The shape of the recesses 6 the plastic flow guide 5 can be wholly or partly with the various forms of heat transfer body 4 correspond. In a simple way this is in the 1 and 3 described, where there the heat transfer body and the associated recess are each cylindrical.

Basically, it is advantageous if the volume of the recess 6 reaching in part of the recess 6 associated heat transfer body 4 a maximum of 25%, in particular a maximum of 10% smaller than the volume of each recess or as the average volume of all recesses of the plastic flow guide. A preferred lower limit for this is at least 2%.

It is also advantageous if each heat transfer body 4 or on average of all heat transfer bodies at least 20%, in particular at least 40%, of the volume in an associated recess 6 extend. A preferred upper limit for this is a maximum of 80%.

9 to 11 show different versions of heat transfer bodies 4 of liquid cooling devices 3 and associated recesses 6 of plastic flow guide bodies 5 ,

9 corresponds to the embodiments of 1 to 3 , wherein the heat transfer body 4 have a circular cross section and the respective associated recesses 6 the plastic flow guide 5 also have a circular cross-section. In addition, the heat transfer body 4 concentric in the associated recesses 6 arranged, thereby forming an annular cross-section Umströmbereich 64 out.

10 shows heat transfer body 4 with diamond-shaped cross-section each in associated diamond-shaped recesses 6 , but not concentric but in the flow direction 5 are arranged offset.

11 shows groups of a plurality of heat-transporting bodies 4 , each in an associated recess 6 are arranged. The nesting of the heat transfer body 4 improves the heat output here again. It is particularly preferred if the groups of heat transfer bodies are assigned in their position to the heat sources, that is to say the power semiconductor components of the switching device.

Claims (12)

Power electronic system ( 1 ) with a switching device ( 2 ) and with a liquid cooling device ( 3 ), wherein the switching device ( 2 ) a substrate ( 10 ) on which the liquid cooling device ( 3 ) facing away from each other on electrically insulated interconnects ( 14 ) Power semiconductor components ( 16 ) arranged and circuit-wise by means of a connection device ( 18 ), wherein the liquid cooling device ( 3 ) a first part body ( 30 ) and a second partial body ( 32 ), between which an inflow volume range ( 34 ), a cooling volume range ( 36 ) and an outflow volume range ( 38 ) are formed, wherein from the first part body ( 30 ) a plurality of heat transfer bodies ( 4 ) in the cooling volume range ( 36 protrude), wherein in the cooling volume range ( 36 ) a plastic flow guide ( 5 ) on a surface ( 320 ) of the second partial body ( 32 ) in the cooling volume area ( 36 ) is arranged, which has a plurality of recesses ( 6 ), wherein a single or a plurality of heat transfer body ( 4 ) in an associated recess ( 6 ) of the plastic flow guide body ( 5 ). Power electronic system according to one of the preceding claims, wherein the heat transfer body ( 4 ) have a round, oval, polyhedral or free-shaped base surface and are pointed or tapered or not tapered. Power electronic system according to one of the preceding claims, wherein the volume of the cavity in the recess ( 6 ) reaching into the part of the heat transfer body associated with the recess ( 4 ) is at most 25%, in particular at most 10% smaller than the volume of each recess ( 5 ) or as the mean volume of all recesses ( 5 ) of the plastic flow guide body ( 3 ). Power electronic system according to one of the preceding claims, wherein each heat transfer body ( 4 ) or in the mean of all heat transfer bodies at least 20%, in particular at least 40%, of the volume in an associated recess ( 6 ). Power electronic system according to one of the preceding claims, wherein the heat transfer body ( 4 ) from the bottom surface ( 62 ) of the recesses ( 6 ) are arranged spaced apart or in an elastic surface portion ( 620 ) of the floor surface ( 62 ). Power electronic system according to one of the preceding claims, wherein between at least two recesses ( 6 ) a bypass line ( 640 ) through the plastic flow guide ( 5 ) runs. Power electronic system according to one of the preceding claims, wherein the Plastic flow guide body ( 5 ) a positioning device ( 50 ) which has its position in the cooling volume range ( 36 ). Power electronic system according to one of the preceding claims, wherein, with a plurality of switching devices ( 2 ) and their associated identically designed cooling volume ranges ( 36 ), wherein the plastic flow guide ( 5 ) per cooling volume range ( 36 ) are formed differently and thereby different flow velocities per cooling volume range are achieved during operation. Method for producing a liquid cooling device ( 3 ) by means of the following directly or indirectly successive steps: a) forming and providing a first partial body ( 30 ) and a second partial body ( 32 ), wherein the first partial body ( 30 ) a plurality of heat transfer bodies ( 4 ) having; b) forming and providing a plastic flow guide body ( 5 ) with a plurality of recesses ( 6 ); c) arranging the first and the far body ( 30 . 32 ) as well as the plastic flow guide body ( 5 ) such that between the two partial bodies ( 30 . 32 ) an inflow volume area ( 34 ), a cooling volume range ( 36 ) and an outflow volume range ( 38 ) are formed and that the plastic flow guide ( 5 ) in the cooling volume range ( 36 ) is arranged that a single or more heat transfer bodies ( 4 ) in an associated recess ( 6 ) of the plastic flow guide body ( 5 extend into it; d) Liquid-tight non-positive or cohesive bonding of the first and second partial body ( 30 . 32 ). Method according to claim 9, wherein the first partial body ( 30 ) is produced by means of an aluminum casting process. Method according to one of claims 9 or 10; wherein the plastic flow guide body ( 5 ) is produced in a plastic injection molding process. A method according to any one of claims 9 to 11; wherein the first part body ( 30 ) from a basic body ( 300 ) and an insert body ( 302 ) is formed and in this case the insert body ( 302 ) Heat transfer body ( 4 ) and with the main body ( 300 ) is positively or materially connected.

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