DE102013106579A1 - Solder mask for wave soldering, has two soldering windows which are connected by channel - Google Patents
Solder mask for wave soldering, has two soldering windows which are connected by channel Download PDFInfo
- Publication number
- DE102013106579A1 DE102013106579A1 DE201310106579 DE102013106579A DE102013106579A1 DE 102013106579 A1 DE102013106579 A1 DE 102013106579A1 DE 201310106579 DE201310106579 DE 201310106579 DE 102013106579 A DE102013106579 A DE 102013106579A DE 102013106579 A1 DE102013106579 A1 DE 102013106579A1
- Authority
- DE
- Germany
- Prior art keywords
- soldering
- solder
- windows
- solder mask
- wave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0692—Solder baths with intermediary means for bringing solder on workpiece, e.g. rollers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Die Erfindung betrifft eine Lötmaske für Wellenlötverfahren. The invention relates to a solder mask for wave soldering.
Zum Verlöten von Leiterplatten, die sowohl mit SMD (Surface Mount Device) als auch mit THT (Through Hole Technology) Bauteilen bestückt sind, mit diesen Bauteilen werden oftmals nacheinander zwei Massenlötverfahren angewendet, nämlich das Reflow-Löten der SMD-Bauteile in einem Lötofen und anschliessend das Wellenlöten der THT-Bauteile in einer Wellenlötanlage. Wenn die Leiterplatte z.B. mit SMD-Bauteilen auf der Unterseite bestückt ist, dann müssen diese beim Wellenlöten mittels einer Lötmaske abgedeckt werden. Die Unterseite ist diejenige Seite der Leiterplatte, die der Lotwelle der Wellenlötanlage zugewandt ist. Lötmasken sind beispielsweise bekannt aus
Die Lötmaske ist ein Hilfsmittel, welches Bauteile und/oder Sektoren der Leiterplatte auf der Unterseite vor Wärme, Lotwelle und Flussmittel schützt. Die Lötmaske enthält Lötfenster für die Anschlusspins, Anschlussbeine bzw. Anschlussdrähte der THT-Bauteile, damit diese von der Lotwelle benetzt und gelötet werden. Dies ist anschaulich dargestellt in den
Beim Wellenlötverfahren wird flüssiges Lot durch eine Düse gepumpt, um eine Lotwelle, z.B. eine Jetwelle oder Lochwelle zu erzeugen. Die Lötmaske mit der Leiterplatte oder mit mehreren Leiterplatten wird entweder in horizontaler Richtung oder unter einem Winkel von typischerweise 7° so an der Lotwelle vorbei transportiert, dass die Lotwelle auf die Lötmaske auftrifft und das Lot die Lötfenster ausfüllt, so dass die THT-Bauteile mit der Leiterplatte gelötet werden. In the wave soldering process, liquid solder is pumped through a nozzle to form a solder wave, e.g. to create a Jetwelle or hole wave. The solder mask with the circuit board or with multiple circuit boards is transported either in the horizontal direction or at an angle of typically 7 ° past the solder wave, that the solder wave impinges on the solder mask and the solder fills the solder windows, so that the THT components with soldered to the circuit board.
Infolge der hohen Bauteiledichte auf heutigen Leiterplatten sind die Platzverhältnisse sehr beschränkt. Die abzudeckenden Bauteile sind zudem meistens verschieden gross und verschieden hoch. Dies führt dazu, dass die seitlichen Abmessungen der Lötfenster sehr unterschiedlich sein können. Wenn die Leiterplatte mit relativ grossen Bauteilen wie Stecker, Spulen oder anderen Spezialbauteilen bestückt ist, dann kann die Tiefe der Lötfenster ohne weiteres 10 bis 12 mm oder mehr erreichen. Dies führt zum Problem, dass das Lot beim Wellenlöten die Leiterplatte nicht immer erreicht, das Prozessfenster sehr klein wird oder im Extremfall sogar kein Prozessparameter gefunden werden kann, um alle Anschlüsse der Bauteile gleichzeitig gut zu löten. Due to the high component density on today's printed circuit boards, the space available is very limited. The components to be covered are also usually different sizes and different heights. This results in that the lateral dimensions of the soldering windows can be very different. If the printed circuit board is equipped with relatively large components such as plugs, coils or other special components, then the depth of the soldering windows can easily reach 10 to 12 mm or more. This leads to the problem that the solder does not always reach the circuit board during wave soldering, the process window becomes very small or in extreme cases even no process parameter can be found in order to solder all connections of the components simultaneously.
Der Erfindung liegt die Aufgabe zugrunde, das Wellenlöten mit Lötmasken zu ermöglichen, deren Lötfenster eine vergleichsweise grosse Tiefe von typischerweise 10 bis 12 mm und stark unterschiedliche seitliche Abmessungen im Bereich von 1 bis 2 mm bis zu mehreren Millimetern haben. The invention has for its object to enable wave soldering with solder masks whose soldering windows have a comparatively large depth of typically 10 to 12 mm and very different lateral dimensions in the range of 1 to 2 mm to several millimeters.
Die genannte Aufgabe wird erfindungsgemäss gelöst durch die Merkmale des Anspruchs 1. The stated object is achieved according to the invention by the features of
Eine grundsätzliche Betrachtung des Erfinders hat die Erkenntnis gebracht, dass in einem Lötfenster zwei Drücke und zwei Kräfte auf das Lot einwirken, nämlich der hydrostatische Druck des Lots und der hydrodynamische Druck des Lots, die Schwerkraft des Lots und Oberflächenkräfte zwischen Lot und Lötmaske. Der hydrostatische Druck und der hydrodynamische Druck des Lots bewirken, dass das Lot im Lötfenster aufsteigt, während die Schwerkraft und die Oberflächenkräfte dem entgegenwirken. Weil die Lötmaske aus einem Material besteht, das vom Lot nicht benetzt wird, z.B. aus Glasfaserverbundstoffen oder Titan, muss das Lot beim Aufsteigen in den Fenstern die Oberflächenkräfte überwinden. Die Stärke der einwirkenden Oberflächenkräfte hängt von dem Benetzungswinkel und von den seitlichen Abmessungen des Lötfensters ab. Dies führt dazu, dass das Lot in den grossen Lötfenstern höher aufsteigt als in den kleinen Lötfenstern. A fundamental consideration of the inventor has been the realization that in a soldering window two pressures and two forces act on the solder, namely the hydrostatic pressure of the solder and the hydrodynamic pressure of the solder, the gravity of the solder and surface forces between solder and solder mask. The hydrostatic pressure and the hydrodynamic pressure of the solder cause the solder to rise in the soldering window while the force of gravity and the surface forces counteract it. Because the solder mask is made of a material that is not wetted by the solder, e.g. made of glass fiber composites or titanium, the solder must overcome the surface forces when rising in the windows. The strength of the applied surface forces depends on the wetting angle and the lateral dimensions of the soldering window. As a result, the solder rises higher in the large soldering windows than in the small soldering windows.
Die Erfindung schlägt vor, wenigstens zwei Lötfenster durch einen Kanal miteinander zu verbinden. Die Erfindung schlägt insbesondere vor, die kleinen Lötfenster einer Lötmaske mit den grösseren und grossen Lötfenstern der Lötmaske durch Kanäle zu verbinden. Die Unterseite der Lötmaske ist mit Ausnahme der Lötfenster und der Verbindungskanäle mit Vorteil eine ebene Fläche. The invention proposes to connect at least two soldering windows by a channel with each other. The invention proposes, in particular, to connect the small soldering windows of a solder mask with the larger and larger soldering windows of the solder mask through channels. The bottom of the solder mask is advantageously a flat surface except for the solder windows and the connection channels.
Die Erfindung wird nachfolgend anhand eines Ausführungsbeispiels und anhand der Zeichnung näher erläutert. The invention will be explained in more detail with reference to an embodiment and with reference to the drawing.
Die
Beim Wellenlöten wird die Lötmaske
Die
Bei dem in den
Wie aus den
ZITATE ENTHALTEN IN DER BESCHREIBUNG QUOTES INCLUDE IN THE DESCRIPTION
Diese Liste der vom Anmelder aufgeführten Dokumente wurde automatisiert erzeugt und ist ausschließlich zur besseren Information des Lesers aufgenommen. Die Liste ist nicht Bestandteil der deutschen Patent- bzw. Gebrauchsmusteranmeldung. Das DPMA übernimmt keinerlei Haftung für etwaige Fehler oder Auslassungen.This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.
Zitierte PatentliteraturCited patent literature
- EP 346228 [0002] EP 346228 [0002]
- US 4739919 [0002, 0003] US 4739919 [0002, 0003]
- US 5617990 [0002] US 5617990 [0002]
- EP 2361001 [0002, 0003] EP 2361001 [0002, 0003]
Claims (1)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH1056/12 | 2012-07-09 | ||
CH10562012 | 2012-07-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE102013106579A1 true DE102013106579A1 (en) | 2014-01-09 |
Family
ID=49780781
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE201310106579 Withdrawn DE102013106579A1 (en) | 2012-07-09 | 2013-06-24 | Solder mask for wave soldering, has two soldering windows which are connected by channel |
Country Status (2)
Country | Link |
---|---|
CH (2) | CH706707A1 (en) |
DE (1) | DE102013106579A1 (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4739919A (en) | 1987-06-15 | 1988-04-26 | Northern Telecom Limited | Masking of circuit boards for wave soldering |
EP0346228A1 (en) | 1988-06-08 | 1989-12-13 | Bull S.A. | Masking plate for equipped printed-circuit boards, and method of manufacturing the same |
US5617990A (en) | 1995-07-03 | 1997-04-08 | Micron Electronics, Inc. | Shield and method for selective wave soldering |
EP2361001A1 (en) | 2010-02-19 | 2011-08-24 | Endress + Hauser GmbH + Co. KG | Soldering mask for wave soldering and method for selective soldering of individual components of a circuit board in a wave soldering machine |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5454505A (en) * | 1994-09-26 | 1995-10-03 | Paragon Electric Company, Inc. | Wave solder pallet |
US6145729A (en) * | 1998-06-18 | 2000-11-14 | Mcms, Inc. | Non-connected drainage channels for selective wave solder pallets |
DE10132029A1 (en) * | 2001-07-03 | 2003-01-16 | Seho Systemtechnik Gmbh | Soldering nozzle for wave soldering of printed circuit boards |
CN102326462A (en) * | 2009-06-04 | 2012-01-18 | 松下电器产业株式会社 | Jet soldering device and soldering method |
-
2012
- 2012-11-13 CH CH02360/12A patent/CH706707A1/en not_active Application Discontinuation
-
2013
- 2013-06-20 CH CH11562013A patent/CH706740A2/en not_active Application Discontinuation
- 2013-06-24 DE DE201310106579 patent/DE102013106579A1/en not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4739919A (en) | 1987-06-15 | 1988-04-26 | Northern Telecom Limited | Masking of circuit boards for wave soldering |
EP0346228A1 (en) | 1988-06-08 | 1989-12-13 | Bull S.A. | Masking plate for equipped printed-circuit boards, and method of manufacturing the same |
US5617990A (en) | 1995-07-03 | 1997-04-08 | Micron Electronics, Inc. | Shield and method for selective wave soldering |
EP2361001A1 (en) | 2010-02-19 | 2011-08-24 | Endress + Hauser GmbH + Co. KG | Soldering mask for wave soldering and method for selective soldering of individual components of a circuit board in a wave soldering machine |
Also Published As
Publication number | Publication date |
---|---|
CH706740A2 (en) | 2014-01-15 |
CH706707A1 (en) | 2014-01-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |