DE102012222199A1 - Flat transmission control module for motor car, has secondary strip conductor plate whose side is attached with side of support plate that is arranged in region of retainer such that components are partly raised up into retainer - Google Patents

Flat transmission control module for motor car, has secondary strip conductor plate whose side is attached with side of support plate that is arranged in region of retainer such that components are partly raised up into retainer

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Publication number
DE102012222199A1
DE102012222199A1 DE201210222199 DE102012222199A DE102012222199A1 DE 102012222199 A1 DE102012222199 A1 DE 102012222199A1 DE 201210222199 DE201210222199 DE 201210222199 DE 102012222199 A DE102012222199 A DE 102012222199A DE 102012222199 A1 DE102012222199 A1 DE 102012222199A1
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DE
Germany
Prior art keywords
circuit board
side
control module
transmission control
secondary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE201210222199
Other languages
German (de)
Inventor
Uwe Liskow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE201210222199 priority Critical patent/DE102012222199A1/en
Publication of DE102012222199A1 publication Critical patent/DE102012222199A1/en
Pending legal-status Critical Current

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16HGEARING
    • F16H61/00Control functions within control units of change-speed- or reversing-gearings for conveying rotary motion ; Control of exclusively fluid gearing, friction gearing, gearings with endless flexible members or other particular types of gearing
    • F16H61/0003Arrangement or mounting of elements of the control apparatus, e.g. valve assemblies or snapfittings of valves; Arrangements of the control unit on or in the transmission gearbox
    • F16H61/0006Special features of electronic control units
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16HGEARING
    • F16H59/00Control inputs to control units of change-speed-, or reversing-gearings for conveying rotary motion
    • F16H59/02Selector apparatus
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16HGEARING
    • F16H57/00General details of gearing
    • F16H57/04Features relating to lubrication or cooling or heating
    • F16H57/0412Cooling or heating; Control of temperature
    • F16H57/0415Air cooling or ventilation; Heat exchangers; Thermal insulations
    • F16H57/0417Heat exchangers adapted or integrated in the gearing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/0026Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers

Abstract

The present invention relates to transmission control modules. For improved heat dissipation with the lowest possible overall height, a transmission control module (10) of a motor vehicle transmission has a primary printed circuit board (12) and a secondary printed circuit board (16) which is equipped with electronic components (20) on a first side (18), and electrical connections (22) between the primary and the secondary printed circuit board, and a matrix mass (24) which is arranged in the area between the electronic components. The secondary printed circuit board and the components arranged thereon are sealed off from the environment (26). A carrier plate (28) is also provided, which can be fastened to a transmission component on a first side (30) and forms at least one receiving volume (34) on an opposite second side (32), which is encircled laterally by side wall regions (36). The primary interconnect plate lies on the side wall regions, the secondary interconnect plate with the first side facing the second side of the carrier plate in the region of the receiving volume such that the components protrude at least partially into the receiving volume which is filled with the matrix mass.

Description

  • The present invention relates to a transmission control module according to the preamble of claim 1, as well as a motor vehicle transmission according to the preamble of independent claim 9, and a method according to independent claim 10.
  • FIELD OF THE INVENTION
  • In transmissions in motor vehicles electronic transmission controls are increasingly used. For example, electronic power circuits having terminals to components other than transmission control modules are formed, and the transmission control modules are used e.g. housed within gear housings, the power electronics e.g. housed within a control unit housing, which is exposed to the transmission oil for better dissipation of heat energy. In connection with the further improvement of motor vehicle drives, in particular the performance optimization with simultaneously reduced fuel consumption and reduced exhaust emissions, more efficient circuits are required, but at the same time require increased heat dissipation.
  • STATE OF THE ART
  • From the DE 10 2010 030 170 A1 a transmission control module of a transmission for motor vehicles is known in which a circuit carrier is provided with a number of electrical components and on its underside a wiring substrate and at its top a heat sink. The electronic components are surrounded by a molding compound, which is provided within a frame.
  • DISCLOSURE OF THE INVENTION
  • However, it has been found that there is a need for improved heat dissipation, while simultaneously occurring requirement for the lowest possible height.
  • This object is achieved by a transmission control module, a motor vehicle transmission and a method according to one of the independent claims. Exemplary embodiments are presented in the dependent claims.
  • According to the invention, there is provided a transmission control module of a motor vehicle transmission having a primary circuit board provided with terminals for external connection or contacting for other components, and a secondary circuit board mounted on a first side with electronic components. In addition, electrical connections between the primary and the secondary wiring board are provided. Furthermore, a matrix mass is provided which is arranged in the region between the electronic components. The secondary printed circuit board and the components arranged thereon are sealed from the environment. According to the present invention, a support plate is provided, which is fastened on a first side to a transmission component and on a second side, which is opposite to the first side, at least one receiving volume, which is laterally encircled by side wall portions. The primary circuit board rests on the sidewall areas. The secondary conductor track plate is arranged with the first side of the second side of the carrier plate in the region of the receiving volume facing such that the components at least partially protrude into the receiving volume. The receiving volume is filled up with the matrix mass.
  • The primary circuit board is also referred to as a printed circuit board (PCB) and has, for example, internal tracks so that the primary circuit board can be directly exposed to the environment, e.g. the transmission oil. The secondary printed circuit board is also referred to as a carrier substrate or circuit carrier. The electronic components form e.g. the transmission control unit (TCU) of a transmission, e.g. an automatic transmission. The arrangement of the power electronics in the direction of the carrier plate and the filling of the resulting gap with the matrix mass offer the advantage that the resulting heat can be delivered via the matrix mass to the carrier plate in order from there in the most efficient manner the heat energy to the surrounding medium, e.g. the surrounding gear oil to deliver. This not only ensures a particularly efficient heat dissipation, but also a reliable sealing of the power electronics from the environment due to the matrix mass. The formation of a separate housing is therefore not required. The use of a potting compound has the advantage, for example, of molding compounds, that the introduction can take place without pressure, as is conventionally provided for molding compounds. Casting compounds also offer the advantage that no injection molding or molding machines and tools are needed, but only simple Vergießanlagen, possibly also as Vakuumvergießanlage. As on separate housing parts, seals u.a. can be omitted, the embodiment described above provides a reduced in height transmission control module available.
  • According to one example, the matrix mass is a potting compound introduced by a casting process. For example, the potting compound is an epoxy resin. The thermal expansion coefficient (CTE) of the potting compound should be about 20 ppm /, which can be achieved, for example, by highly filled epoxides, for example by acid anhydride-curing, filled epoxy.
  • According to one example, the primary circuit board has a cutout in which the secondary circuit board is arranged, and the secondary circuit board is surrounded on all sides by matrix material. As a result, it is possible, for example, to use a secondary printed circuit board in which the electronic components are arranged on one side, but the fixing or also contacting takes place on the other side. Since the printed circuit board is surrounded on all sides by matrix material, the necessary seal against the environment is ensured.
  • According to one example, the electrical connections, for example bond connections, are enclosed by the matrix compound. When using a matrix material which is introduced in a potting process, relatively thin bond connections can also be used since no or only very small forces act on the bond connections when introducing the matrix compound.
  • In one example, the primary circuit board is continuous and the secondary circuit board is secured to the primary circuit board on the side facing the carrier board. The secondary wiring board is connected to the primary wiring board e.g. connected via a ball grid array (BGA) electrically and mechanically.
  • According to the invention, a motor vehicle transmission is provided which has a transmission device and a transmission housing. In addition, a transmission control module according to one of the preceding examples is provided, wherein the transmission device is enclosed by the transmission housing and wherein the transmission control module is fixed to the support plate on an inner side of the transmission housing. By contacting the carrier plate with the gear housing, a heat dissipation to the gear housing is provided, while due to the surrounding gear oil and a heat dissipation via the matrix material is provided, which can be directly adjacent to the gear oil.
  • According to the invention, there is also provided a method for assembling a transmission control module comprising the steps of:
    • a) Provision of a carrier plate, wherein the carrier plate can be fastened on a first side to a transmission component and forms on a second side, which is opposite to the first side, at least one receiving volume, which is laterally enclosed by side wall areas circumferentially.
    • b) providing a primary circuit board provided with terminals for external connection or contacting for other components, the primary circuit board resting on the sidewall areas.
    • c) Providing a secondary printed circuit board, which is equipped on a first side with electronic components, wherein the secondary printed circuit board is arranged with the first side of the second side of the support plate in the region of the receiving volume facing such that the components at least partially protrude into the receiving volume.
    • d) providing electrical connections between the primary and secondary circuit board.
    • e) introducing a matrix mass at least in the region between the electronic components, wherein the receiving volume is filled with the matrix material and wherein the secondary conductor plate and the components arranged thereon are sealed from the environment.
  • If the module PCB, the TCU-PCB, the potting compound and the carrier plate in the operating temperature range of -40 to 150 ° C have very similar coefficients of thermal expansion, only low thermo-mechanical stresses occur, so that cracks in the potting compound or the PCBs can be avoided. When selecting materials in the coefficient of thermal expansion of about 15 to about 25 ppm / k, no cracks are expected. With alloyed steels, nickel silver or aluminum, for example, values between about 16 and about 23 ppm / k can be achieved. The circuit board can be brought in the range of about 15 to about 20 ppm / k by adjusting the base material.
  • According to the invention, the circuit arrangement for accommodating the power electronics with the individual electronic components is arranged facing a serving as a heat dissipation bottom plate. Through the formation of trough-like areas in which the power electronics are housed, a potting compound can be introduced to fill the resulting gaps, so that no air volume remains. The potting compound also serves to seal the electrical connections between the power electronics and the adjacent plate-shaped interconnect material, so that a cumbersome lead out electrical contacts through the potting compound is not provided to the outside. Instead, stands out From the potting compound, so to speak, only the surrounding strip conductor plate, which in particular offers advantages in terms of sealing against the environment, for example, Pindurchführungen are not required. By very small differences in the coefficient of thermal expansion of the materials, the cracking is avoided, which also protects against leakage. Since the interconnect plates can be formed such that the interconnects are within, thus the connection lines, or contacts for example sensors, plugs, actuators, etc. can be arranged protected. The transmission control module according to the invention is characterized by cost reduction by eliminating components and manufacturing steps, since, for example, no separate housing cover must be provided. In addition, the TCU connections are better protected against influences of the surrounding medium, such as transmission oil. When using a potting process, in contrast to a molding process, for example in thermosets or thermosets, a force-free introduction provided because a pressureless pouring of a liquid is provided, which sets and cures after a short time, which can be supported by a non-pressurized cooling process , The curing of the encapsulation can be provided at the same time as tempering of the circuit, for example as burn-in, the electronics, so-called burn-in.
  • It should be noted that the features of the examples of the devices or the transmission control module and the motor vehicle transmission also apply to embodiments of the method and use of the device and vice versa. In addition, even those features can be freely combined with each other, in which this is not explicitly mentioned, with synergetic effects can result, which goes beyond the addition of the various features.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • Hereinafter, embodiments of the invention will be further explained with reference to the accompanying drawings, wherein neither the drawings nor the description are to be construed as limiting the invention.
  • 1 shows an example of a transmission control module in a schematic cross-sectional view.
  • 2 to 6 show further examples of transmission control modules.
  • 7 shows another example of a transmission control module in a cross-sectional view.
  • 8th shows the example 7 in a schematic plan view.
  • 9 and 10 show further examples of a transmission control module.
  • 11 shows a motor vehicle transmission in a schematic sectional view.
  • 12 shows process steps for an example of a method for assembling a transmission control module.
  • EMBODIMENTS OF THE INVENTION
  • 1 shows a transmission control module 10 a motor vehicle transmission with a primary printed circuit board 12 that with connections 14 is provided for an external connection or a contact for other components. There is also a secondary trace plate 16 provided on a first page 18 with electronic components 20 is equipped. Furthermore, electrical connections 22 between the primary wiring board 12 and the secondary wiring board 16 intended. Finally, a matrix mass 24 provided in the area between the electronic components 20 is arranged. The secondary conductor plate 16 and the components arranged thereon 20 are opposite the environment 26 sealed. A carrier plate 28 is on a first page 30 attachable to a transmission component (not shown in detail) and forms on a second side 32 that's the first page 30 opposite, at least one recording volume 34 , the side of sidewall areas 36 is enclosed circumferentially. The primary circuit board 12 lies on the sidewall areas 36 on. The secondary conductor plate 16 is with the first page 18 the second page 32 the support plate in the region of the receiving volume 34 arranged facing and the components 20 at least partially protrude into the receiving volume 34 that with the matrix mass 24 is filled up. The matrix mass 24 is a potting compound, which is introduced by a casting process. For example, the potting compound is an epoxy resin.
  • According to another example, which is shown in different sub-aspects in the following figures, the primary printed circuit board has 12 a section 40 on, and the secondary circuit board 16 is arranged in the cutout. Such as in 2 It can be seen, is the secondary conductor plate 16 on all sides of the matrix mass 24 enclosed. According to another example, which is also shown in the figures, the side wall portions become 36 circulating through the carrier plate 28 formed, for example as cup-shaped imprints. The electrical connections 22 are from the matrix mass 24 enclosed.
  • In 2 in one example is the secondary trace plate 16 with spacers 42 provided and over this on the carrier plate 28 supported. As spacers and electronic components can serve. The spacer devices may also be projections of the carrier plate, eg knobs or embossments. For example, the spacers 42 an intermediate volume 44 Include when the spacers 42 be formed continuously. The internal volume 44 can be filled with a second matrix mass, which provides, for example, a further improved heat conduction.
  • To the electrical connections 22 and also the top 46 the secondary circuit board 16 , on the electrical connections or connection points for the components 20 can be provided, can seal a frame 48 Be provided temporarily, which forms a trough-shaped, upwardly open Vergussbereich.
  • In 2 are next to the connection points 14 , For example, plug, and other components, such as sensors 50 and also actuators (not shown) provided.
  • 3 shows a variant in which the secondary conductor plate 16 on the sidewall areas 36 rests. To refill the under the secondary wiring board 16 provided volume, ie the receiving volume 34 To ensure, for example, are milling 52 the secondary circuit board 16 intended. It is also in 3 a hydraulic plate 54 indicated on which the carrier plate 28 can be attached and serves as a heat sink, what with a heat flow arrow 56 is indicated.
  • 4 shows in a further embodiment, a stepped edge formation 58 the primary circuit board 12 so that the electrical connections 22 For example, bond connections, attached or can be provided on a stepped paragraph. The graduated edge 58 For example, also serves as a frame for filling with the potting compound.
  • In 5 a further embodiment is shown in which the contact between the primary printed circuit board 12 and the secondary wiring board 16 with cold contact (also called press-fit contact) 60 are formed, for which overlap the two interconnect plates. This is, for example, the primary printed circuit board 12 (as in 5 shown) or alternatively or additionally, the secondary wiring board 16 formed with a stepped edge. 6 shows a stepped formation of the two printed circuit boards 12 . 16 ,
  • 7 shows a further embodiment in a cross section, in the carrier plate 28 a variety of recording volumes 34 and a plurality of secondary wiring boards 16a . 16b are provided. All contacts or components of the secondary printed circuit board are sealed from the environment. For example, to lead out a cable 62 another casting area 64 be provided, which is the primary circuit board 12 in the area of leading out or contacting by the cable 62 encloses. For example, the carrier plate 28 be stepped formed, for example, with a height offset.
  • 8th shows a schematic plan view of the embodiment 7 ; a section line AA, with reference numerals 66 provided, indicates the location of the sectional view 7 at.
  • 9 shows another example in which the primary circuit board 12 runs continuously and the secondary wiring board 16 is at the primary track plate 12 on the support plate 28 attached side facing. The primary circuit board 12 has at least one filling opening 68 on. For example, a second opening 70 be provided, which serves for venting during the introduction of the matrix mass. The secondary conductor plate 16 can work with the primary circuit board 12 For example, be electrically and mechanically connected via a ball grid connection. Alternatively or additionally, also bond connections, indicated by reference numerals 72 , be provided.
  • 10 shows a carrier plate 28 from a first material 74 , where in the range of recording volume 34 at least one use 76 from a second material 78 is provided, which has a higher thermal conductivity than the first material 74 , The one or more inserts form eg max. 50% of the area of the bottom plate, eg 20% or 10% or at most 5%. The inserts have a coefficient of thermal expansion in an example, for example, deviates by a maximum of 10%, for example by a maximum of 5% of the thermal expansion coefficient of the support plate. According to another example, also in 10 shown, but not necessarily with the use 76 combined must be formed, the support plate has 28 in the range of the recording volume 34 in places such a reduced plate thickness that on the top (relative to the drawing) depressions 80 are formed. The depressions are used, for example, to selectively increase the height of the receiving volume.
  • 11 shows a motor vehicle transmission 100 with a transmission device 102 coming from a gearbox 104 is enclosed. Besides that is a transmission control module 106 provided, which is designed according to one of the preceding examples. The transmission control module 106 is with the support plate, for example, on an inner side of the transmission housing 104 attached. The transmission device 102 has wheelsets 108 on. arrows 110 indicate drive and output train. The transmission control module 106 For example, on a hydraulic plate 112 be attached, for improved heat dissipation.
  • 12 shows a method 200 for the assembly of a transmission control module. In a first step 202 , Also referred to as step a), a support plate is provided which is fastened on a first side to a transmission component and on a second side, which is opposite to the first side, at least one receiving volume which is laterally enclosed by side wall areas circumferentially. In a second step 204 , also referred to as step b), a primary printed circuit board is provided, which is provided with connections for external connection or a contact for other components, wherein the primary wiring board rests on the side wall portions. In one step 206 , also referred to as step c), a secondary interconnect plate is provided which is equipped on a first side with electronic components, wherein the secondary interconnect plate is arranged with the first side of the second side of the support plate in the region of the receiving volume facing such that the components at least partially protrude into the receiving volume. In a fourth step 208 , also referred to as step d), electrical connections between the primary and the secondary wiring board are provided. In a fifth step 210 also referred to as step e), a matrix mass is introduced at least in the region between the electronic components, wherein the secondary printed circuit board and the components arranged thereon are sealed from the environment. The receiving volume is filled with the matrix mass.
  • According to a further, not shown embodiment is in the region of at least one opening 38 provided on the outside of the matrix mass a release liner. The separating layer serves, for example, to be able to release the matrix mass after casting from a sealing tool.
  • With reference to the figures shown, it should be noted in particular that the individual features can also be combined with each other, in particular the spacers shown with the different frame or trough-shaped edges, or even the stepped formations and the cold contacts with the spacers or the rest on the lateral sidewall areas. In addition, also in the 1 to 6 , and 7 and 8th shown features with the features of 9 and or 10 be combined. In particular, aspects of the method may also be used for embodiments of the devices as well as use of the devices, and vice versa.
  • In addition, it should be noted that "encompassing" does not exclude other elements or steps, and "a" or "an" does not exclude a multitude. It should also be appreciated that features or steps described with reference to any of the above embodiments and aspects may also be used in combination with other features or steps of other embodiments and aspects described above. Reference signs in the claims are not to be considered as limiting.
  • QUOTES INCLUDE IN THE DESCRIPTION
  • This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.
  • Cited patent literature
    • DE 102010030170 A1 [0003]

Claims (10)

  1. Transmission control module ( 10 ) of a motor vehicle transmission, comprising: - a primary printed circuit board ( 12 ), with connections ( 14 ) is provided for external connection or contacting for other components; A secondary printed circuit board ( 16 ) on a first page ( 18 ) with electronic components ( 20 ) is equipped; - electrical connections ( 22 ) between the primary and secondary wiring board; and a matrix mass ( 24 ) disposed in the region between the electronic components; wherein the secondary printed circuit board and the components arranged thereon with respect to the environment ( 26 ) are sealed; characterized in that - a carrier plate ( 28 ) is provided; wherein the carrier plate on a first side ( 30 ) is attachable to a transmission component and on a second side ( 32 ) facing the first page, at least one recording volume ( 34 ) formed laterally of side wall areas ( 36 ) is enclosed circumferentially; wherein the primary circuit board rests on the side wall portions; wherein the secondary printed circuit board is arranged with the first side of the second side of the support plate in the region of the receiving volume facing such that the components at least partially protrude into the receiving volume; and wherein the receiving volume is filled with the matrix mass.
  2.  Transmission control module according to claim 1, wherein the matrix mass is a potting compound, which is introduced by a casting process.
  3. Transmission control module according to claim 1 or 2, wherein the primary printed circuit board a cutout ( 40 ) and the secondary wiring board is disposed in the cutout; and wherein the secondary conductor plate is surrounded on all sides by matrix material.
  4.  Transmission control module according to claim 1, 2, or 3, wherein the side wall portions are formed circumferentially by the support plate.
  5.  Transmission control module according to one of the preceding claims, wherein the electrical connections are enclosed by the matrix mass.
  6. Transmission control module according to one of the preceding claims, wherein the carrier plate of a first material ( 74 ) and at least one insert ( 76 ) of a second material ( 78 ) is provided, which has a higher thermal conductivity than the first material.
  7. Transmission control module according to one of the preceding claims, wherein the carrier plate in places in the region of the receiving volume has such a reduced plate thickness, so that depressions ( 80 ) are formed.
  8. The transmission control module of any one of the preceding claims, wherein the primary circuit board is continuous and the secondary circuit board is secured to the primary circuit board on the side facing the support board; and wherein the primary printed circuit board has at least one filling opening ( 68 ) for filling the matrix mass.
  9. Motor vehicle transmission ( 100 ), with a transmission device ( 102 ) and a transmission housing ( 104 ), characterized in that a transmission control module ( 106 ) is provided according to one of the preceding claims; wherein the transmission device is enclosed by the transmission housing; and wherein the transmission control module is secured to the carrier plate on an inner side of the transmission housing.
  10. Procedure ( 200 ) for assembling a transmission control module comprising: a) providing ( 202 ) a support plate, wherein the support plate is fastened on a first side to a transmission component and on a second side, which is opposite to the first side, at least one receiving volume which is laterally enclosed by side wall areas circumferentially; b) Provide ( 204 ) a primary circuit board provided with terminals for external connection or contacting for further components, the primary circuit board resting on the side wall areas; c) Provide ( 206 ) a secondary printed circuit board, which is equipped on a first side with electronic components, the secondary printed circuit board is arranged with the first side of the second side of the support plate in the region of the receiving volume facing such that the components at least partially project into the receiving volume; d) Provide ( 208 ) electrical connections between the primary and secondary circuit board; and e) introducing ( 210 ) of a matrix mass at least in the region between the electronic components, wherein the secondary printed circuit board and the components arranged thereon with respect to the Be sealed environment, and wherein the receiving volume is filled with the matrix material.
DE201210222199 2012-12-04 2012-12-04 Flat transmission control module for motor car, has secondary strip conductor plate whose side is attached with side of support plate that is arranged in region of retainer such that components are partly raised up into retainer Pending DE102012222199A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE201210222199 DE102012222199A1 (en) 2012-12-04 2012-12-04 Flat transmission control module for motor car, has secondary strip conductor plate whose side is attached with side of support plate that is arranged in region of retainer such that components are partly raised up into retainer

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE201210222199 DE102012222199A1 (en) 2012-12-04 2012-12-04 Flat transmission control module for motor car, has secondary strip conductor plate whose side is attached with side of support plate that is arranged in region of retainer such that components are partly raised up into retainer
KR1020130149069A KR20140071923A (en) 2012-12-04 2013-12-03 Flat transmission control module
CN201310634740.6A CN103851176B (en) 2012-12-04 2013-12-03 Flat drive apparatus control module

Publications (1)

Publication Number Publication Date
DE102012222199A1 true DE102012222199A1 (en) 2014-06-05

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DE201210222199 Pending DE102012222199A1 (en) 2012-12-04 2012-12-04 Flat transmission control module for motor car, has secondary strip conductor plate whose side is attached with side of support plate that is arranged in region of retainer such that components are partly raised up into retainer

Country Status (3)

Country Link
KR (1) KR20140071923A (en)
CN (1) CN103851176B (en)
DE (1) DE102012222199A1 (en)

Cited By (1)

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WO2016169711A1 (en) * 2015-04-22 2016-10-27 Zf Friedrichshafen Ag Electronics module and a method for encapsulating same

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Publication number Priority date Publication date Assignee Title
DE102016224083A1 (en) * 2016-12-02 2018-06-07 Robert Bosch Gmbh Electrical assembly

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DE102010030170A1 (en) 2010-06-16 2011-12-22 Robert Bosch Gmbh Control device for transmission control module of gear box of motor car, has wiring carrier provided at lower surface of circuitry carrier, and heat sink provided at upper surface of circuitry carrier that is made of ceramic material

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US5959840A (en) * 1994-05-17 1999-09-28 Tandem Computers Incorporated Apparatus for cooling multiple printed circuit board mounted electrical components
FI972948A (en) * 1997-03-13 1998-09-14 Nokia Telecommunications Oy Increased power supply solution
DE102004061818A1 (en) * 2004-12-22 2006-07-06 Robert Bosch Gmbh Control module
DE102005002813B4 (en) * 2005-01-20 2006-10-19 Robert Bosch Gmbh Control module
DE102011004694A1 (en) * 2011-02-24 2012-08-30 Robert Bosch Gmbh Circuit device for transmission control unit used in motor car, has absorber containing hydrophobic bulk material, that is sealed in inner space for absorbing penetrated oil from outside

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DE102010030170A1 (en) 2010-06-16 2011-12-22 Robert Bosch Gmbh Control device for transmission control module of gear box of motor car, has wiring carrier provided at lower surface of circuitry carrier, and heat sink provided at upper surface of circuitry carrier that is made of ceramic material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016169711A1 (en) * 2015-04-22 2016-10-27 Zf Friedrichshafen Ag Electronics module and a method for encapsulating same

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CN103851176A (en) 2014-06-11
KR20140071923A (en) 2014-06-12
CN103851176B (en) 2018-03-30

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