DE102012219131A1 - Connection assembly for two contact elements used in gear box of motor car, has electrically leading filling material to electrically and mechanically interconnect plated-through holes of contact regions of contact elements - Google Patents

Abstract

The connection assembly (1) has specific portion to electrically and conductively connect contact regions (14,24) of respective contact elements (10,20) with one another. The contact regions are respectively provided with plated-through holes (32,34). The plated-through holes are aligned one above the other, and partially filled with an electrically leading filling material (36). The electrically leading filling material is provided to electrically and mechanically interconnect the plated-through holes by formation of a column (38). An independent claim is included for a method for connecting two contact elements.

Description

State of the art

The invention relates to a connection arrangement for at least two contact partners according to the preamble of independent claim 1 and to a method for connecting at least two contact partners according to the preamble of independent claim 6.

From the prior art transmission control devices are known in which electronic control units are housed directly in the gear housing. To protect the electronic components of such a control unit from the aggressive medium, i. To protect against the gear oil, these are preferably housed on a multi-layer ceramic substrate, such as a LTCC substrate (LTCC: Low Temperature Co-Fired Ceramic) in a metal housing. For future generations, the ceramic substrate is to be replaced by an organic multi-layer circuit carrier. In this case, the circuit substrate, as well as the electronic components to be exposed directly to the medium without additional housing or protective measures. In this construction, it must be prevented that the oil comes into direct contact with the copper interconnects of the circuit substrate or the Ankontaktierungen of the components. The additives of the oil, especially sulfur and sulfur compounds, as well as the base oil itself, react with the copper and copper compounds, allowing the copper to dissolve. Over the life of the control unit, this can lead to an interruption of the conductor track or Ankontaktierungen. Furthermore, electrically conductive deposits may form between two or more copper conductor tracks or contact holes.

Usually, a first contact partner of a connection arrangement comprises at least one first electrically conductive region and at least one first contact region. A second contact partner comprises at least one second electrically conductive region and at least one second contact region. The at least two contact partners are electrically conductively connected to one another at the at least one first contact region and at the at least one second contact region. For this purpose, conventional connection arrangements have a recess in at least one contact partner and / or housing, which exposes at least one inner conductive region or an inner current-carrying layer or the contact region of the contact partner. The contact partner may in this case be embodied, for example, as a multilayer circuit carrier, wherein the conductive regions are surrounded by insulating and / or protective layers. The conductive regions may also be disposed on a surface of the circuit substrate and are protected by the housing. Conventional connection arrangements also have a contact element, which is designed as a so-called flex foil and / or as a wire and / or as a sheet metal and / or as a cable and / or as another electrically conductive element. Here, the contact element can correspond to one of the two contact partners, or the contact element is arranged between the two contact partners and electrically conductively connected to the contact regions of the contact partners. The electrically conductive connection can be produced, for example, by soldering and / or screwing and / or welding and / or riveting.

In the published patent application DE 10 2010 039 189 A1 For example, an electrical contacting and a method for electrically contacting a flex foil with at least one conductor track will be described. The described flex foil is electrically conductively connected to at least one electrical contact region of a sensor module and / or a control device. For this purpose, an end portion of the flex foil is set against at least one electrical contact region formed above and electrically contacted at a contact point by heat input. The at least one above-formed electrical contact area is designed as a flat plug, which is materially connected to the flex foil. To produce a cohesive connection, laser and / or resistance welding methods and soldering methods can be used. Furthermore, the flex foil is guided in a 180 ° arc. The flex foil is inserted into a housing opening which is associated with a contact row with the contact points. After producing the cohesive connection, exposed metal elements can be surface-insulated, for example, with a resistant lacquer. The surface isolation may prevent short bursts that could occur when exposing exposed metal elements to oil and / or a transmission fluid. These conditions are to be expected in particular in a motor vehicle transmission.

In the published patent application DE 10 2008 058 025 A1 For example, a multilayer circuit carrier is described. The circuit carrier described comprises at least two insulating layers, between which a current-carrying layer is arranged. This current-carrying layer comprises a flexible conductor which comprises a first longitudinal section and a second longitudinal section. Here, the first longitudinal section is arranged immovably between the insulating layers and the second longitudinal section is flexible either outside the circuit substrate or in the region of a recess in arranged at least one insulating layer. Through the recess, an electrically conductive contact can be produced from the second longitudinal section to the outside via a contact element. The electrically conductive contact between the current-carrying layer and the contact element can be formed, for example, by screwing, welding and / or riveting the contact element to the second longitudinal section.

Disclosure of the invention

The connection arrangement according to the invention for at least two contact partners with the features of independent patent claim 1 and the method according to the invention for connecting two contact partners with the features of independent claim 6 have the advantage that the sensitive contact areas are protected by the filling material. As a result, for example, a circuit carrier with electronic and / or electrical components without additional housing or protective measures directly a liquid medium, such as oil, are exposed. Advantageously, ceramic substrates can be replaced by organic circuit carriers.

Embodiments of the present invention provide a connection arrangement for at least two contact partners. In this case, a first contact partner comprises at least one first electrically conductive region and at least one first contact region, and a second contact partner comprises at least one second electrically conductive region and at least one second contact region. The at least two contact partners are electrically conductively connected to one another at the at least one first contact region and at the at least one second contact region. According to the invention, the at least one first contact region comprises a first via, and the at least one second contact region comprises a second via, wherein the first via and the second via are substantially aligned one over the other and at least partially filled with an electrically conductive fill material. The electrically conductive filler connects the two vias electrically and mechanically by forming a column together.

Furthermore, a method for connecting at least two contact partners is proposed, wherein a first contact partner comprises at least one first electrically conductive region and at least one first contact region. A second contact partner comprises at least one second electrically conductive region and at least one second contact region, wherein the at least two contact partners are electrically conductively connected to one another at the at least one first contact region and at least one second contact region. According to the invention, a first through-connection is introduced into the at least one first contact region, and a second through-contact is introduced into the at least one second contact region. The first via and the second via are substantially aligned and at least partially filled with an electrically conductive filler, wherein the electrically conductive filler electrically and mechanically connects the two vias by forming a column together.

The two contact partners are preferably used in a transmission housing, wherein the transmission housing is filled with oil, for example. The two plated-through holes can advantageously be produced simply by drilling and / or laser machining and / or etching and subsequent metallization. The trained column advantageously performs a dual task. Thus, the trained column connects the vias electrically conductive with each other. Furthermore, the formed column acts like a riveted connection and fixes the contact partners in the connection area. Due to the filled vias, an improved contacting is made possible, which withstands in particular aggressive media. Advantageously, a protective housing can be eliminated by the improved contacting. Furthermore, in particular organic substrates with laminated electrically conductive regions and / or multilayer circuit carriers with insulated, electrically conductive regions and / or flex modules or flex films with electrically conductive regions can be reliably contacted via the plated-through holes. Furthermore, advantageously, an internal electrically conductive region can be contacted at any regions of a circuit carrier. Furthermore, in this connection arrangement, it can be prevented that the oil comes into direct contact with electrically contact areas and / or conductive areas, which are designed as copper tracks. The connection arrangement can be used advantageously for the construction of evaluation and control units for a transmission control and for the connection of units with a base circuit carrier.

The measures and refinements recited in the dependent claims advantageous improvements of the independent claim 1 connection arrangement and specified in the independent claim 6 method for connecting two contact partners are possible.

It is particularly advantageous that the electrically conductive filler material can be performed as solder material and / or conductive adhesive. A solder material and / or a conductive adhesive advantageously has a liquid first state and can almost ideally be adapted in the liquid state to the forms of the plated-through holes. After curing, the solder material and / or the conductive adhesive have a solid second state, in which the solder material and / or the conductive adhesive can advantageously form a reliable and stable electrically conductive column. Thus, advantageously tools for molding the appropriate column can be saved.

In an advantageous embodiment of the connection arrangement according to the invention, the electrically conductive filling material can seal metallizations of the plated-through holes in a fluid-tight manner. Thus, it can be advantageously prevented that the metallic layer of the via and the exposed through the via internal conductive regions react with additives of the oil, in particular sulfur and / or sulfur compounds, and / or with the base oil itself. This can be prevented in an advantageous manner that in particular copper can go into solution. As a result, an interruption of the conductor track and / or an interruption of the contact region and / or an interruption of the through-connection can be prevented in an advantageous manner. Furthermore, advantageously, electrically conductive deposits between two or more electrically conductive regions can be prevented, which can generate a short circuit.

In a further advantageous embodiment of the connection arrangement according to the invention, at least one contact partner can be designed as a multilayer circuit carrier. In an advantageous manner, a plurality of multilayer circuit carriers with inner core layers and / or outer layers can be connected to one another via the connection arrangement.

In a further advantageous embodiment of the contact arrangement according to the invention, at least one contact partner can be designed as a flex foil and / or flex module. These flex modules and / or flex films can be designed, for example, as a polyimide printed circuit board and / or as a flexible printed circuit board. This advantageously enables punching grid-free evaluation and control units which can be used in a gearbox, since the electrical and / or electronic components can be arranged on such a flex foil and / or on a flex module. Thus, a cost-effective alternative to evaluation and control units based on stamped gratings and / or ceramic substrates can be created in an advantageous manner. Furthermore, such flex foils can be advantageously connected by means of the connection arrangement according to the invention to circuit carriers and / or to further flex foils and / or flex modules. Advantageously, the use of flex films and / or flex modules in conjunction with the connection arrangement according to the invention can enable the partial use of flexible printed circuit board technology without constructing complete circuit boards in flexible technology.

In a further advantageous embodiment of the method according to the invention, the electrically conductive filler can be introduced in a liquid or pasty form in the vias and at least partially fill, wherein the electrically conductive filler is cured and can form the column in the cured state. Thus, a shortening of development times, in particular in the production of patterns, and a saving of tooling costs can be achieved in an advantageous manner, since the liquid material adapts almost perfectly and without further aids to the predetermined space of the plated-through holes.

In a further advantageous embodiment of the method according to the invention, a plurality of internal electrically conductive regions of the first contact partner can be electrically conductively connected to the at least one electrically conductive region of the second contact partner via at least one plated through hole. Advantageously, an assembly, such as a multilayer printed circuit board and / or a sensor unit and / or an evaluation and control unit or other peripheral circuit components, such as a plug, are connected to another assembly. In this case, at least one module can advantageously comprise a flex foil and / or a flex module.

In a further advantageous embodiment of the method according to the invention, the two contact partners can be aligned and prefixed via a fixing arrangement in the aligned position. For example, the contact partners can be aligned in an advantageous manner via a joining aid. The fixing device can be designed as a clamping device and / or as a riveting device. These fixing devices can be reliably and inexpensively implemented in an advantageous manner.

Embodiments of the invention are illustrated in the drawings and are explained in more detail in the following description. In the drawings, like reference numerals designate components that perform the same or analog functions.

Brief description of the drawings

1 shows a schematic cross section of an embodiment of a connection arrangement according to the invention with a multilayer circuit carrier and a flex module.

2 shows a plan view of the connection arrangement according to the invention 1 ,

3 shows a schematic cross section of another embodiment of a connecting arrangement according to the invention with a first multilayer circuit carrier and a second multilayer circuit carrier.

Embodiments of the invention

How out 1 to 3 it can be seen comprises a connection arrangement according to the invention 1 . 1' at least two contact partners 10 . 10 ' . 20 . 20 ' , being a first contact partner 10 . 10 ' at least one first electrically conductive region 12 . 12 ' and at least a first contact area 14 . 14 ' includes. A second contact partner 20 . 20 ' includes at least a second electrically conductive region 22.1 . 26.1 and at least one second contact area 24 . 28 , The at least two contact partners 10 . 10 ' . 20 . 20 ' are at the at least one first contact area 14 . 14 ' and at least one second contact area 24 . 28 electrically connected to each other. Here, in the illustrated embodiments, at least one contact partner 10 . 10 ' as a multilayer circuit carrier 26 with at least one surface for arranging electrical and / or electronic components 50 . 50 ' and at least one internal electrically conductive region 18 . 18 ' executed. The surface of the multilayer circuit board 10 . 10 ' is executed in the illustrated embodiments structured and has electrically conductive first layers or areas 12 . 12 ' and electrically insulating layers or areas 16 . 16 ' on. The at least one electrically conductive area 12 . 12 ' is preferably designed as a copper conductor track. Instead of copper, another material with similarly good electrical and thermal conductivities may be used. The at least one component 50 . 50 ' For example, it can be embodied as a sensor element and / or as a switching element and / or control element and / or as an evaluation element. Furthermore, the at least one internal electrically conductive region 18 . 18 ' laminated between organic substrates, wherein a plurality of internal electrically conductive regions 18 . 18 ' by electrically insulating areas 16 . 16 ' are separated from each other. The contact partners 10 . 10 ' . 20 . 20 ' are adapted to form an evaluation and control unit for a transmission control and / or a sensor unit, wherein the contact partners 10 . 10 ' . 20 . 20 ' be housed directly in the gearbox.

According to the invention, the at least one first contact area 14 . 14 ' a first via 32 . 32 ' and the at least one second contact area 24 . 28 includes a second via 34 . 34 ' , wherein the first via 32 . 32 ' and the second via 34 . 34 ' arranged substantially flush with each other and at least partially with an electrically conductive filler 36 . 36 ' are filled. The electrically conductive filler 36 . 36 ' connects the two vias 32 . 32 ' . 34 . 34 ' electrically and mechanically by training a column 38 . 38 ' together. This creates an electrical connection 30 . 30 ' of which the illustrated embodiments of the connection arrangement according to the invention 1 . 1' may have a plurality, so that, for example, circuit modules or other peripheral circuit components, such as connectors 60 , can be connected with each other.

The illustrated embodiments of the connection arrangement according to the invention 1 . 1' are preferably used in a vehicle transmission and exposed without protective housing the liquid medium in the vehicle transmission.

How out 1 to 3 can be further seen, the filler material 36 . 36 ' the vias 32 . 32 ' . 34 . 34 ' overlap at the edge areas at least partially. This advantageously allows a reliable electrical connection, since the overlap form another contact surface and additional stability for the electrical connection 30 . 30 ' allow, so that the electric power can be reliably dissipated and / or supplied, wherein the under the filling material 36 . 36 ' lying electrically conductive regions of the vias 32 . 32 ' . 34 . 34 ' from the filler 36 . 36 ' be protected from the liquid medium. As filler 36 . 36 ' For example, a solder material and / or a conductive adhesive can be used.

How out 1 to 3 it can be seen further, the plated-through holes 32 . 32 ' . 34 . 34 ' in the illustrated embodiments of the connection arrangement according to the invention 1 . 1' completely with the filler 36 . 36 ' filled. The filling material 36 . 36 ' or from the cured filling material 36 . 36 ' formed pillar 38 . 38 ' seals the metallizations of the vias 32 . 32 ' . 34 . 34 ' fluid-tight.

How out 1 and 2 is further apparent, in the illustrated first embodiment, the first contact partner 10 as a multilayer Running circuit carrier and the second contact partner 20 is as Flexmodul or Flexfolie 22 with several conductive areas 22.1 executed. The two contact partners 10 . 20 are over several electrical connections 30 connected with each other. Here, the circuit carrier 10 electrical and / or electronic components 50 on and the flex module or the flex foil 22 has a plug 60 on. By connecting the flex foil 60 with a multi-layer circuit carrier 10 a partial use of flexible printed circuit board technology can be made possible without the circuit carrier 10 must be built in flexible technology. This allows a lattice-free construction of the transmission control, wherein the flex module or the flex foil 22 can be designed as a polyimide or flex circuit board.

How out 2 can be further seen, comprises the connection arrangement according to the invention 1 in the illustrated embodiment, several electrical connections 30 with the corresponding vias 32 . 34 and as pillars 38 trained filling materials 36 ,

How out 3 is further apparent, are both contact partners in the illustrated second embodiment 10 ' . 20 ' designed as a multi-layer circuit carrier and several electrical connections 30 ' connected with each other. The as a circuit carrier 26 executed second contact partner 20 ' comprises on its surface at least a second electrically conductive region 26.1 and a plurality of internal electrically conductive area 26.3 , each by insulating areas 26.2 are separated from each other. Here, the first circuit carrier 10 ' analogous to the first embodiment, a plurality of electrical and / or electronic components 50 ' on and the second circuit carrier 26 is over a flex foil 62 with a plug 60 connected.

In an embodiment not shown, two flex films can also be used 22 or flex modules are interconnected. Building units which are constructed from flex films or flex modules offer a more cost-effective alternative to structural units based on stamped gratings and / or ceramic substrates.

How out 1 to 3 is further apparent, is the illustrated multi-layer circuit carrier 10 . 10 ' with electrical connections 30 . 30 ' shown, which only one lying on the surface electrically conductive region 12 . 12 ' contacted. Of course, the electrical connection 30 . 30 ' also internal electrical conductive areas 18 . 18 ' contacted. In addition, more than two contact partners 10 . 10 ' . 20 . 20 ' via the connection arrangement according to the invention 1 . 1' be connected to each other.

In a method, not shown, for connecting at least two contact partners 10 . 10 ' . 20 . 20 ' become in a process step the at least two contact partners 10 . 10 ' . 20 . 20 ' at the at least one first contact region and at the at least one second contact region electrically conductively connected to each other, wherein a first contact partner 10 . 10 ' at least one first electrically conductive region 12 . 12 ' and at least a first contact area 14 . 14 ' includes, and a second contact partner 20 . 20 ' at least one second electrically conductive region 22.1 . 26.1 and at least one second contact area 24 . 28 includes.

According to the invention, the at least one first contact region is formed 14 . 14 ' a first via 32 . 32 ' introduced and in the at least one second contact area 24 . 28 becomes a second via 34 . 34 ' brought in. Around the vias 32 . 32 ' . 34 . 34 ' bring in advance, in the contact partner 10 . 10 ' . 20 . 20 ' , For example, by milling and / or drilling and / or etching and / or by a laser machining a recess having a predetermined cross-section introduced, in which the vias 32 . 32 ' . 34 . 34 ' be pressed. Alternatively, the vias 32 . 32 ' . 34 . 34 ' be produced by a metallization of the walls of the recesses. In a further method step, the first via 32 . 32 ' and the second via 34 . 34 ' arranged substantially flush with each other. In this way arises between the two contact partners 10 . 10 ' . 20 . 20 ' a continuous cavity, which. in a further process step at least partially with an electrically conductive filler 36 . 36 ' is filled. The electrically conductive filler 36 . 36 ' can in one embodiment of the method according to the invention in liquid or pasty form in the vias 32 . 32 ' . 34 . 34 ' be introduced and at least partially fill them. Subsequently, the electrically conductive filler material 36 . 36 ' cured and forms a column in the cured state 38 . 38 ' out. The electrically conductive filler 36 . 36 ' connects the two vias 32 . 32 ' . 34 . 34 ' electrically and mechanically through the formation of the column 38 . 38 ' ,

About the at least one first via 32 . 32 ' can have several internal electrically conductive areas 18 . 18 ' of the first contact partner 10 . 10 ' with the at least one electrically conductive second region 22.1 of the second contact partner 20 . 20 ' be electrically connected. But there is also the possibility targeted an electrically conductive area 12 . 12 ' on the surface or an electrically conductive area 18 . 18 ' inside the circuit board 10 . 10 ' over the at least one first via 32 . 32 ' to contact.

In an optional process step, the two contact partners 10 . 10 ' 20 . 20 ' aligned in advance and a fixation arrangement 40 prefixed in the aligned position. The alignment can be done for example via a joining aid or fixing device, which in the vias 32 . 32 ' . 34 . 34 ' is introduced. The fixing device can be executed, for example, as a clamping device and / or as a riveting device, which an unintentional changing the position of the contact partners 10 . 10 ' . 20 . 20 ' prevented during the filling process. How out 3 can be further seen, for example, for pre-fixing a rivet 44 in a second via 42 which are both contact partners 10 ' . 20 ' penetrates.

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• DE 102010039189 A1 [0004]
• DE 102008058025 A1 [0005]

Claims (10)

Connection arrangement between at least two contact partners, whereby a first contact partner ( 10 . 10 ' ) at least one first electrically conductive region ( 12 . 12 ' ) and at least a first contact area ( 14 . 14 ' ) and a second contact partner ( 20 . 20 ' ) at least one second electrically conductive region ( 22.1 . 26.1 ) and at least one second contact area ( 24 . 28 ), wherein the at least two contact partners ( 10 . 10 ' . 20 . 20 ' ) at the at least one first contact area ( 14 . 14 ' ) and at least one second contact area ( 24 . 28 ) are electrically conductively connected to one another, characterized in that the at least one first contact region ( 14 . 14 ' ) a first via ( 32 . 32 ' ) and the at least one second contact area ( 24 . 28 ) a second via ( 34 . 34 ' ), wherein the first via ( 32 . 32 ' ) and the second via ( 34 . 34 ' ) arranged substantially in alignment with one another and at least partially with an electrically conductive filler material ( 36 . 36 ' ), wherein the electrically conductive filler ( 36 . 36 ' ) the two vias ( 32 . 32 ' . 34 . 34 ' ) electrically and mechanically by forming a column ( 38 . 38 ' ) connects to each other. Connecting arrangement according to claim 1, characterized in that the electrically conductive filling material ( 36 . 36 ' ) is designed as solder material and / or conductive adhesive. Connecting arrangement according to claim 1 or 2, characterized in that the electrically conductive filling material ( 36 . 36 ' ) Metallizations of the plated-through holes ( 32 . 32 ' . 34 . 34 ' ) seals fluid-tight. Connecting arrangement according to one of claims 1 to 3, characterized in that at least one contact partner ( 10 . 10 ' . 20 . 20 ' ) as a multilayer circuit carrier ( 10 . 10 ' . 26 ) is executed. Connecting arrangement according to one of claims 1 to 4, characterized in that at least one contact partner ( 10 . 10 ' . 20 . 20 ' ) as a flex foil ( 22 ) is executed. Method for connecting at least two contact partners, wherein a first contact partner ( 10 . 10 ' ) at least one first electrically conductive region ( 12 . 12 ' ) and at least a first contact area ( 14 . 14 ' ), wherein a second contact partner ( 20 . 20 ' ) at least one second electrically conductive region ( 22.1 . 26.1 ) and at least one second contact area ( 24 . 28 ), wherein the at least two contact partners ( 10 . 10 ' . 20 . 20 ' ) at the at least one first contact area ( 14 . 14 ' ) and at least one second contact area ( 24 . 28 ) are electrically conductively connected to each other, characterized in that in the at least one first contact region ( 14 . 14 ' ) a first via ( 32 . 32 ' ) and in the at least one second contact area ( 24 . 28 ) a second via ( 34 . 34 ' ), wherein the first via ( 32 . 32 ' ) and the second via ( 34 . 34 ' ) are arranged substantially flush with one another and at least partially with an electrically conductive filling material ( 36 . 36 ' ), and wherein the electrically conductive filler material ( 36 . 36 ' ) the two vias ( 32 . 32 ' . 34 . 34 ' ) electrically and mechanically by forming a column ( 38 . 38 ' ) connects to each other. Method according to claim 6, characterized in that the electrically conductive filling material ( 36 . 36 ' ) in a liquid or pasty form in the vias ( 32 . 32 ' . 34 . 34 ' ) is introduced and this at least partially filled, wherein the electrically conductive filler ( 32 . 32 ' . 34 . 34 ' ) is cured and in the cured state, the column ( 38 . 38 ' ) trains. Method according to claim 6 or 7, characterized in that via at least one plated-through hole ( 36 . 36 ' . 34 ' ) a plurality of internal electrically conductive areas ( 18 . 18 ' ) of the first contact partner ( 10 . 10 ' ) with the at least one electrically conductive region ( 22.1 . 26.1 ) of the second contact partner ( 20 . 20 ' ) are electrically connected. Method according to one of claims 6 to 8, characterized in that the two contact partners ( 10 . 10 ' . 20 . 20 ' ) and via a fixing arrangement ( 40 ) are prefixed in the aligned position. Method according to one of claims 6 to 9, characterized in that the fixing device ( 40 ) is designed as a clamping device and / or as a riveting device.

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