DE102012214484A1 - Method for producing a band-shaped lighting module - Google Patents

Method for producing a band-shaped lighting module

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Publication number
DE102012214484A1
DE102012214484A1 DE102012214484.6A DE102012214484A DE102012214484A1 DE 102012214484 A1 DE102012214484 A1 DE 102012214484A1 DE 102012214484 A DE102012214484 A DE 102012214484A DE 102012214484 A1 DE102012214484 A1 DE 102012214484A1
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DE
Germany
Prior art keywords
polymer composition
light
polymer
band
shaped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102012214484.6A
Other languages
German (de)
Inventor
Martin Reiss
Thomas Rieger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Priority to DE102012214484.6A priority Critical patent/DE102012214484A1/en
Publication of DE102012214484A1 publication Critical patent/DE102012214484A1/en
Application status is Withdrawn legal-status Critical

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/284Applying non-metallic protective coatings for encapsulating mounted components
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00Lighting devices or systems using a string or strip of light sources
    • F21S4/20Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90Methods of manufacture
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/54Encapsulations having a particular shape
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305Moulding and encapsulation
    • H05K2203/1316Moulded encapsulation of mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305Moulding and encapsulation
    • H05K2203/1327Moulding over PCB locally or completely

Abstract

The method for producing a band-shaped light-emitting module (11) has at least the following steps: a) providing a band-shaped, not yet fully cured first polymer mass (17); b) providing a luminous band (12) with a band-shaped printed circuit board (13), on whose front side (14) a row of light sources (15) is arranged; c) sinking at least of light exit surfaces of the light sources (15) of the luminous band (12) in the first polymer mass (17). A band-shaped light module (11) has a light strip (12) with a band-shaped printed circuit board (13), on whose front side (14) a row of light sources (15) is arranged, wherein at least the light exit surfaces of the light sources (15) of a polymer mass (17; 33) are covered and wherein the lighting module (11) has been produced by the method.

Description

  • The invention relates to a method for producing a band-shaped light module, comprising a light strip with a band-shaped printed circuit board, at the front side of a number of light sources is arranged. The invention further relates to a band-shaped lighting module, comprising a light strip with a ribbon-shaped printed circuit board, at the front side of a series of light sources is arranged, wherein at least the light exit surfaces of the light sources are covered by a polymer composition. The invention is particularly applicable to flexible lighting modules, in particular LED modules.
  • There are light strips with band-shaped, flexible circuit board known, which are equipped at its front at regular intervals with light-emitting diodes ('LED bands'). You can with their back, for example be attached by means of a double-sided adhesive tape. Such LED strips are available, for example, as LINEARLight Flex from Osram.
  • For protection against external stresses, it is known to introduce such LED strips in a tubular casing made of transparent plastic. It is also known to shed such LED tapes in a transparent or diffuse silicone potting compound. In addition, it is known to introduce such LED strips in a U-shaped profile made of silicone and shed in potting compound, e.g. transparent or diffused silicone.
  • In these protective embodiments it is i.a. disadvantageous that the optical properties of the light emitted by the LED tape light through the protective sheath are not or not in a sufficiently precise manner can be influenced, in particular with regard to a beam forming and / or a resource-saving material use.
  • It is the object of the present invention to at least partially overcome the disadvantages of the prior art.
  • This object is achieved according to the features of the independent claims. Preferred embodiments are in particular the dependent claims.
  • The object is achieved by a method for producing a band-shaped light module, wherein the method comprises at least the following steps: a) providing at least one band-shaped, not yet completely cured first polymer mass, b) providing a light band with a band-shaped printed circuit board, at the front side of a Row of light sources is arranged and c) sinking at least of light exit surfaces of the light sources of the light band in the first polymer composition.
  • This method has the advantage that the polymer composition or a (polymer) body formed therefrom can be produced and in particular can be shaped independently of the luminous band. This allows a high variety of forms and variety of material selection. In particular, a shape and / or material distribution of the polymer composition can be set particularly precisely, which facilitates, for example, beam shaping by means of the polymer composition and / or improves the use of materials. The first polymer mass is thus optically downstream of the semiconductor light sources, that is to say that the light emitted by the light sources of the fluorescent strip is radiated virtually completely into the first polymer mass. When sinking is exploited, the first polymer mass is still viscous and so can be displaced from the light strip and can invest close to the recessed part of the light strip. Thus, a solid cohesive connection with the first polymer composition can be produced in a simple manner.
  • A non-fully cured polymer composition may be understood to mean a polymer composition that is not cured or virtually uncured, or a polymer composition in the process of curing that has a viscosity that still permits sinking in step c).
  • It is a development that the not yet fully cured first polymer composition forms a sufficiently stable at least for carrying out the process polymer body. This simplifies their handling and precise shaping. The polymer body is in particular flexible or bendable, in particular elastically or elastically-plastically bendable.
  • A ribbon-shaped light-emitting module has, in particular, an extension along its longitudinal extent, which is substantially larger than transversely or perpendicular to the longitudinal extension.
  • The luminous band may e.g. of the type LINEARLight Flex of the company Osram.
  • The light sources are preferably semiconductor light sources. The circuit board is preferably a flexible circuit board, e.g. made of FR4 or polyimide.
  • Preferably, the semiconductor light sources are light-emitting diodes. The LEDs can be lit in the same color or in different colors. A color can be monochrome (eg red, green, blue etc.) or multichrome (eg white). Also, the light emitted by the light emitting diodes an infrared light (IR LED) or an ultraviolet light (UV LED). Several light emitting diodes can produce a mixed light; eg a white mixed light. The light-emitting diodes may contain at least one wavelength-converting phosphor (conversion LED). The light-emitting diodes may be present in the form of at least individually light-emitting diodes or in the form of LED chips. Several LED chips can be mounted on a common substrate ("submount"). The light emitting diodes can be equipped with at least one own and / or common optics for beam guidance, eg at least one Fresnel lens, collimator, etc. Instead of or in addition to inorganic light emitting diodes, eg based on InGaN or AlInGaP, organic LEDs (OLEDs, eg polymer OLEDs) can be used. Alternatively, the light sources may include, for example, at least one diode laser.
  • The first polymer composition may in particular comprise silicone, epoxy resin or an acrylate-based polymer. The first polymer composition may be a thermoplastic, for example: acrylonitrile-butadiene-styrene (ABS), polyamides (PA), polylactate (PLA), polymethyl methacrylate (PMMA), polycarbonate (PC), polyethylene terephthalate (PET), polyethylene (PE), polypropylene (PP), polystyrene (PS), polyetheretherketone (PEEK) and polyvinyl chloride (PVC) and / or urethane-based thermoplastic elastomers (TPU). The first polymer mass may also be PU. The first polymer composition is in particular deformable, in particular elastically or elastically plastically deformable.
  • It is a further development that the countersinking in step c) comprises pressing in the luminous band into the first polymer mass. This allows any and precisely determinable penetration depth of the luminous band. Alternatively, the light strip may be sunk by its own weight in the first polymer mass.
  • It is an embodiment that the countersinking in step c) comprises sinking the luminous band up to the printed circuit board. As a result, the semiconductor light sources can be completely surrounded by polymer compound, which fixes and protects them particularly well. Also so conductor tracks of the circuit board are protected.
  • It is still an embodiment that at least one, in particular the first, polymer composition is a chemically active and / or UV-curable polymer composition. As a result, a curing of the first polymer composition can be produced without further measures (in the case of a chemically active polymer composition) or with only little effort for UV irradiation (in the case of a UV-activatable polymer composition).
  • A chemically active polymer composition may be understood to mean a polymer composition which cures without active external influences, e.g. by reaction with atmospheric oxygen. Such a polymer composition may also be reactive or capable of producing a cohesive compound in step c). In particular, a chemically active polymer composition may be a surface adherent or adhesive ('sticky') polymer composition, e.g. Silicone, PU etc.
  • A UV-activatable polymer composition may, in particular, be understood as meaning a polymer composition which hardens only upon irradiation with UV light. Until then, this polymer composition may be reactive even after its preparation for the production of a cohesive connection. This may be the case in particular if this polymer composition is dimensionally stable but not yet UV-cured. In particular, a UV-activatable polymer composition may be a surface-sticking or adhesive ('sticky') polymer composition.
  • Basically, the light module may have only a single polymer composition, namely the first polymer composition. This allows a particularly simple and inexpensive production of the light module. However, alternatively, the light module may have multiple polymer compositions, e.g. the first polymer composition and at least one other, different polymer mass.
  • It is a development that the light strip has only a first polymer mass, which is transparent. This enables a particularly effective beam bundling.
  • It is still a development that the second portion only has a second polymer mass, which second polymer mass is non-transparent translucent. Thereby, and in particular together with a suitable cross-sectional shape of the second partial region, the second partial region can be used as an effective transmitted-light optical element for beam shaping.
  • A non-transparent, translucent polymer composition may, in particular, be understood as meaning a diffusely scattering polymer composition mixed with phosphor (for at least partial wavelength conversion of an incident light into light, in particular of a larger wavelength). This allows a targeted influence on the light properties such as a color, a homogeneity, etc.
  • It is a development that for use as a diffuser, the polymer matrix is mixed with a diffusely scattering filler material, for example, with white particles of titanium oxide, alumina, etc., but also, for example, with small hollow spheres, etc. The particles may in particular have a, in particular average, diameter of 400 nm to 800 nm.
  • For coloring, filler may be used in the form of color particles.
  • It is still another embodiment that step a) comprises providing a dimensionally stable, belt-shaped (polymer) body having the first polymer composition and at least one second polymer composition, and the first polymer composition and the second polymer composition differing in particular, e.g. by the nature of the base material, by the presence of a filler and / or by a type of filler. As a result, a particularly varied light module can be provided. As a result, a particularly varied influence on the light emission pattern of the light module is possible, e.g. Also, a combination of beam shaping and change of light properties such as a color, a homogeneity, etc. The first polymer composition and the at least one second polymer composition are therefore present as different regions and are not mixed together.
  • It is a further development that one of the polymer masses of the luminous band, e.g. the first polymer mass, transparent and another polymer mass of the second portion, e.g. the second polymer composition is non-transparent translucent. By the non-transparent polymer mass (s), it is possible in particular to change a light property through which the transparent polymer mass (s), in particular a beam shaping, are carried out. Due to the independent production of the dimensionally stable polymer body, a precise spatial distribution of the polymer compositions is possible. Thereby, in particular, a cross-sectional shape of the non-transparent polymer mass (s) can be accurately defined, e.g. be particularly targeted and small area ausgestaltbar. For example, such a use of expensive filling material, in particular phosphor, may be reduced since a cross-sectional shape of an associated polymer mass can be formed without excess surface areas.
  • It is also an embodiment that the first polymer composition is transparent and the second polymer composition is non-transparent translucent. This allows a particularly broad-area homogeneous light emission, as from the light sources, in particular light-emitting diodes, exiting light can also spread laterally through the transparent material before it hits the non-transparent translucent second polymer composition. Also, such a reflected back into the light source luminous flux is reduced. In addition, it can be saved in comparison to a light module consisting entirely of non-transparent translucent polymer bulk filler.
  • It is also an embodiment that the polymer compositions (in the case of a plurality of different polymer compositions) are structured (arranged) in cross-section. As a result, a particularly accurate design of the light emission pattern of the light module can be provided. A structuring or structured arrangement may in particular be understood as meaning not only a simple layer-like arrangement of the polymer masses (with a constant layer thickness of a plate-shaped layer), ie in particular also an arrangement in which at least one polymer mass has at least one at least partially curved free edge in cross-section and / or has at least partially curved contact edge (interface) to another polymer mass. This allows a particularly accurate shaping of the polymer masses and thus also effective use of material as well as a targeted beam shaping.
  • It is also an embodiment that a second polymer composition used in step a) is cured. This simplifies handling of the polymer mass (s) or of a polymer body produced therefrom and improves its stability. In addition, the mechanical requirements for the uncured first polymer composition are lower. A dimensionally stable polymer body provided in step a) thus has the first (not completely) cured polymer composition and at least one cured further (second) polymer composition.
  • It is also an embodiment that for producing the light module, the second polymer composition is a casting mold for the first polymer composition and the first polymer composition is filled into the second polymer composition. For this purpose, the second polymer composition is preferably already cured. This embodiment has the advantage that it can be carried out by means of inexpensive filling methods, in particular casting methods, in particular an injection molding method. In addition, a viscosity of the first polymer composition can be so very low. The second polymer mass of the U-profile thereby forms an outer or outer layer of the polymer tape through which light which has passed through the first polymer mass passes.
  • It is a development that the serving as a casting second polymer composition is in the form of a (square or curved) U-shaped profile. So that no first polymer mass overflows in step c), it is preferred that in step a) a profile of the second polymer mass which is only partially filled with the first polymer mass is provided. A level of the first polymer mass in the U-shaped profile is achieved by sinking the Ribbons raised. It is preferred for a simple support and attachment of the light strip, that the back side of the printed circuit board of the light strip, the surrounding first polymer mass and an edge of the U-profile of the second polymer mass are flush with each other.
  • It is also an embodiment that a dimensionally stable (polymer) body provided in step a) is produced by means of a coextrusion process. In other words, the at least one polymer composition provided in step a) may be produced by means of a coextrusion process as a dimensionally stable, band-shaped body. In particular, a dimensionally stable polymer body having a plurality of polymer compositions can be prepared by coextrusion. This allows a particularly fast and economical production.
  • It is a general design, e.g. also applicable to the coextrusion method, that the second polymer composition is an outer or outer polymer composition. The second polymer mass of the U-profile thereby forms an outer or outer layer of the polymer tape through which light which has passed through the first polymer mass passes. This embodiment allows a particularly simple preparation of the polymer compositions or a polymer body consisting thereof. It can also be ensured that light radiated outward from the light strip has passed completely through the second polymer mass. For example, it can be ensured that, if the second polymer mass comprises phosphor, light emitted to the outside has been at least partially wavelength converted. However, the second polymer composition may also be transparent, e.g. for increased beam shaping.
  • It is a development that an interface or (in cross-sectional view) a contact edge between the first polymer mass and the second polymer mass is at least partially curved, in particular concave, is formed. The concave configuration corresponds to an outwardly curved interface.
  • It is still a further development that the boundary surface in cross-sectional view is curved in sections (in particular concave or convex) and sections in a straight line.
  • It is also a development that the interface in cross-sectional view a plurality of straight, against each other angled, in particular at right angles angled sections.
  • It is also a development that the boundary surface in cross-sectional view is partially concave and partially convex.
  • It is also an embodiment that the second polymer composition is embedded in the first polymer composition. As a result, the second polymer composition can be shaped in a particularly varied manner, since it does not have to take the form of a free surface or an interface. The shape, in particular cross-sectional shape, of the second polymer mass is thus basically freely selectable within the first polymer mass.
  • It is also an embodiment that the second polymer composition has a lenticular cross-sectional basic shape. This may allow beam shaping, in particular beam concentration in a predetermined direction, even for a diffusely acting second polymer mass.
  • A lenticular basic shape may, in particular, be understood as a cross-sectional shape which permits a defined beam narrowing or beam expansion in the sense of a lens.
  • The second polymer mass may in particular have a biplane, plano-convex, convex-planar, plano-concave, concave-planar, bi-convex, bi-concave, concave-convex or convex-concave cross-sectional shape.
  • It is yet another embodiment that the light module or its polymer compound (s) has an outer contour that is curved at least partially in cross-section or in a cross-sectional view on an outer or free surface. This supports beam shaping of the light beam emitted by the light module.
  • It is a further development that the light strip has on its outer or free surface a cross section or in cross-sectional view completely curved outer contour. The outer contour may, for example, have a circular-sector-shaped or parabolic shape.
  • At least one curved section may be convex or concave.
  • Also, the light strip on its outer or free surface may have a cross section at least partially rectilinear outer contour. For example, the outer contour may have a plurality of straight, against each other angled, in particular at right angles angled sections.
  • It is still an embodiment that the method additionally comprises the step d) covering the recessed luminous band with further not yet fully cured polymer composition. In particular, such a back of the circuit board may be covered. This allows a complete or all-round embedding of the fluorescent strip in polymer composition, which in turn increases its protection, for example with respect to one or more IP protection classes. The covering can be done by potting or covering with not yet cured polymer mass. This covering polymer composition may correspond to the first polymer composition or may be a different polymer composition, eg a second or yet another polymer composition.
  • The choice of polymer composition (s) is in principle not limited and may in particular comprise silicone, epoxy resin or an acrylate-based polymer. A polymer composition may in particular be a thermoplastic, for example ABS, PA, PLA, PMMA, PC, PET, PE, PP, PS, PEEK, PVC and / or thermoplastic TPU. A polymer compound may also be PU. A polymer composition may also comprise mixtures and / or derivatives of the said or other polymers. A polymer composition is in particular deformable, in particular elastically or elastically-plastically deformable.
  • The object is also achieved by a band-shaped light module, which has been produced by the method described above. The lighting module can be designed analogously to the method and have the same advantages.
  • In particular, the lighting module has a light strip with a strip-shaped printed circuit board, on whose front side a row of light sources is arranged, wherein at least the light exit surfaces of the light sources are covered by a polymer mass.
  • It is an embodiment that the finished light module is non-destructive bendable.
  • It is yet another embodiment that the light-emitting module or the light band and a dimensionally stable polymer body formed by at least the first polymer mass are moved by means of an endless feed device, e.g. a reel-to-reel device. This allows a high throughput.
  • The above-described characteristics, features, and advantages of this invention, as well as the manner in which they will be achieved, will become clearer and more clearly understood in connection with the following schematic description of exemplary embodiments which will be described in detail in conjunction with the drawings. In this case, the same or equivalent elements may be provided with the same reference numerals for clarity.
  • 1 shows an exploded view in cross section perpendicular to the longitudinal extent of an unassembled elongated light module according to a first embodiment;
  • 2 shows a plan view of a longitudinal section of a first portion of the lighting module according to the first embodiment;
  • 3 shows in cross section perpendicular to the longitudinal extension of the assembled light module according to the first embodiment;
  • 4 - 14 show in cross-section perpendicular to the longitudinal extent of a lighting module according to further embodiments;
  • 15 - 18 show, in cross-section, second polymer masses of a luminous band with at least one first and one second polymer mass;
  • 19 shows an exploded view in cross-section perpendicular to the longitudinal extension of a not yet assembled elongated light module according to yet another embodiment;
  • 20 shows in cross section perpendicular to the longitudinal extent of the assembled light module according to still another embodiment.
  • 1 shows an exploded view in cross section perpendicular to a longitudinal extent L (see also 2 ) An elongated, band-shaped light module 11 according to a first embodiment, which is not yet assembled. The longitudinal extent L is perpendicular to the image plane.
  • To manufacture the light module 11 Here is a light strip in the form of an LED band 12 provided. The LED band 12 has a band-shaped flexible circuit board 13 with on it on a front side 14 in series mounted light sources in the form of LED chips 15 , eg white LED chips, on. The LED band 12 is in 2 in plan view of the front 14 shown while in there 1 is arranged upside down.
  • Further provided, analogous to a step a), a dimensionally stable, band-shaped (polymer) body 16 from a first polymer composition 17 , For example, made of transparent silicone, which in a U-shaped profile 18 from a second polymer mass 19 , For example, made of non-transparent translucent silicone filled. The first polymer mass 17 and the second polymer composition 19 Thus, they can differ in particular here by an absence or presence of filling material.
  • While the second polymer mass 19 is cured, is the first polymer composition 17 not yet cured. The U-shaped profile 18 is not complete, so not up to its upper edge, with the first polymer mass 17 refilled.
  • The polymer body 16 may have been prepared, for example, by first applying the cured U-shaped profile 18 and then the first polymer mass 17 filled in, eg injected, has been. The U-shaped profile 18 So serves as a mold for the first polymer mass 17 ,
  • Alternatively, the polymer body likes 16 be prepared for example by means of a co-extrusion process. In this case, the polymer body 16 by combining and molding both polymer compositions 17 and 19 generated simultaneously in one step. The the U-shaped profile 18 constituting second polymer composition 19 may also not be cured or may cure faster than the first polymer mass 17 to sink the LED bands 12 already cured. The faster curing can be achieved, for example, by a different type of polymer material (base material) or a curing accelerating filler, for example, a reacting with oxygen or UV activatable crosslinking agent.
  • Providing the LED Tape 12 and the polymer body 16 follows, as indicated by the arrow, a sinking of the LED chips 15 (Including their light exit surfaces or emitter surfaces) in the first polymer composition 17 so that too the front 14 the circuit board 13 on the first polymer mass 17 rests. From the LED band 12 So it's practically just a back side 20 accessible, the rest is in the first polymer mass 17 embedded and protected by it.
  • Sumping may generally involve a step of curing the first polymer mass 17 connect. It likes the first polymer mass 17 be passively curable (eg by reaction with atmospheric oxygen) or be actively curable (eg by irradiation with UV light or by means of a heat treatment).
  • In an operation of a like in 3 shown, now ready assembled light module 11 that radiates from the LED chips 15 emitted light first, the first polymer mass 17 and then the layered outlying second polymer composition 19 , When passing through the second polymer mass 19 For example, the light may be scattered diffusely. In other words, the second polymer mass acts as one of the LED chips 15 optically downstream diffuser cover. Even a phosphor can have a diffuse effect and thus both a color conversion and a diffuse scattering of the LED chips 15 cause incident (excitation) light.
  • Generally, the first polymer composition 17 and the second polymer composition 19 from the same material or a different material (eg, different base material and / or different filler material).
  • It is particularly preferred when the light module 11 non-destructive bending, in particular elastic or elastic-plastic. The light module 11 So especially likes a flexible light module 11 be.
  • Generally, an absolute height and / or a relative height and / or width of the dimensions of the first polymer mass 17 and the second polymer composition 19 can be precisely varied and adjusted.
  • 4 shows in cross section a light module 21 according to a second embodiment, which is similar to the lighting module 11 has been produced. However, there is the dimensionally stable, band-shaped polymer body 22 only from the first, transparent polymer mass 17 ,
  • 5 shows in cross section a light module 31 according to a third embodiment. Here is the dimensionally stable, band-shaped polymer body 32 only from a first, now non-transparent translucent polymer mass 33 ,
  • 6 shows in cross section a light module 41 according to a fourth embodiment, which is similar to the lighting module 11 has been produced.
  • Again, the second polymer composition forms 19 an outer layer of the (polymer) body 42 , In contrast to the light module 11 is now however an upper interface 43 between the first polymer mass 17 and the second polymer composition 19 curved, namely bulging outwards / upwards or with respect to the second, non-transparent translucent polymer composition 19 concave curved. The second polymer mass 19 is here in the area of the interface 43 concave plan formed.
  • 7 shows in cross section a light module 51 according to a fifth embodiment, the lighting module 41 is similar. In contrast, however, now is an upper interface 53 of the polymer body 52 curved inwards / downwards or with respect to the second, non-transparent translucent polymer composition 19 convexly curved. The second polymer mass 19 is there in convex-plan so light emission.
  • 8th shows in cross section a light module 61 according to a sixth embodiment, which consists only of the transparent first polymer composition 17 consists. The polymer body 62 has a curved free surface or a curved cross-section outer contour 63 on. The outer contour 63 is, for example, circular-sector-shaped or parabolic-shaped and supports beam shaping. An to the curved outer contour 63 subsequent straight section serves as a flat support area 64 to rest on a substrate (eg by means of a double-sided adhesive tape) and is therefore not considered here as a free surface.
  • 9 shows in cross section a light module 71 according to a seventh embodiment, which is the lighting module 61 by the sole use of a non-transparent first polymer composition 33 for the polymer body 72 distinguished.
  • 10 shows in cross section a light module 81 according to an eighth embodiment, the lighting module 41 similar and similar made. In contrast to the light module 11 however, it is now the second polymer mass 19 not angular U-shaped, but rounded U-shaped, for example, in cross section annular sector-shaped. An interface 82 between the two polymer compositions 17 and 19 is thus formed circular sector. The second polymer mass 19 is thereby formed in the light propagation direction concave-convex, the first polymer composition 17 plano-convex.
  • 11 shows in cross section a light module 91 according to a ninth embodiment, the lighting module 81 is similar. The interface 92 between the two polymer compositions 17 and 19 However, it is now partially curved and partially, here: in a central area 93 , rectilinear in cross-section.
  • 12 shows in cross section a light module 101 according to a tenth embodiment, the lighting module 91 is similar. The interface 102 between the two polymer compositions 17 and 19 However, it is now partially curved in one direction and partially, here: in the central area 93 , curved in the other direction. The radii of curvature in the two directions may be the same or different.
  • 13 shows in cross section a light module 111 according to an eleventh embodiment. Here is the second, non-transparent polymer composition 19 in the first, transparent polymer mass 17 embedded and thus completely surrounded in cross-section. While the first polymer mass 17 has a rectangular cross-sectional shape is the second polymer composition 19 formed lens-shaped with a bi-convex basic shape.
  • 14 shows in cross section a light module 121 according to a twelfth embodiment, which is similar to the lighting module 111 is. However, here is the free surface or outer contour 63 the first polymer mass 17 (outside the planned circulation area 64 ) formed curved.
  • The embedded second polymer mass 19 , eg for the lighting modules 111 or 121 may have multiform cross-sectional shapes, eg a rectangular basic shape ( 15 ), a plan-concave basic form ( 16 ), a plano-convex basic form ( 17 ) or a bi-concave basic form ( 18 and much more
  • 19 shows an exploded view in cross-section of an unassembled elongated light module 131 according to a thirteenth embodiment. This is in addition to the light module 11 after sinking the LED chips 15 in the first polymer mass 17 added additional polymer mass, which is the LED band 12 covers. This additional polymer composition is here a third, opaque and reflective polymer composition 132 , eg on silicone basis, to keep light losses small. The added can be, for example, a potting or laying a not yet cured polymer layer with subsequent pressing.
  • 20 shows in cross section perpendicular to the longitudinal extension of the assembled light module 131 , The LED band 12 is complete and dense of polymer mass 17 . 132 surrounded and may be eg dust-proof and / or waterproof. Also, air and creepage distances can be increased.
  • Although the invention has been further illustrated and described in detail by the illustrated embodiments, the invention is not so limited and other variations can be derived therefrom by those skilled in the art without departing from the scope of the invention.
  • LIST OF REFERENCE NUMBERS
  • 11
    light module
    12
    LED tape
    13
    circuit board
    14
    Front of the circuit board
    15
    LED chip
    16
    polymer body
    17
    first polymer mass
    18
    U-shaped profile
    19
    second polymer mass
    20
    Back of the circuit board
    21
    light module
    22
    polymer body
    31
    light module
    32
    polymer body
    33
    first polymer mass
    41
    light module
    42
    polymer body
    43
    interface
    51
    light module
    52
    polymer body
    53
    interface
    61
    light module
    62
    polymer body
    63
    outer contour
    64
    support area
    71
    light module
    72
    polymer body
    81
    light module
    82
    interface
    91
    light module
    92
    interface
    93
    central area
    101
    light module
    102
    interface
    111
    light module
    121
    light module
    131
    light module
    132
    additional polymer mass
    L
    longitudinal extension

Claims (13)

  1. Method for producing a band-shaped light-emitting module ( 11 ; 21 ; 31 ; 41 ; 51 ; 61 ; 71 ; 81 ; 91 ; 101 ; 111 ; 121 ; 131 ), the method comprising at least the following steps: a) providing at least one strip-shaped, not yet fully cured first polymer composition ( 17 ; 33 ); b) providing a light band ( 12 ) with a ribbon-shaped printed circuit board ( 13 ), at the front ( 14 ) a series of light sources ( 15 ) is arranged; c) sinking at least of light exit surfaces of the light sources ( 15 ) of the illuminated strip ( 12 ) in the first polymer composition ( 17 ; 33 ).
  2. The method of claim 1, wherein sinking in step c) sinking the luminous band ( 12 ) to the circuit board ( 13 ).
  3. Method according to one of the preceding claims, wherein at least one polymer composition ( 19 ) is a chemically active and / or UV-curable polymer composition.
  4. Method according to one of the preceding claims, wherein step a) providing a dimensionally stable, band-shaped body ( 16 ; 42 ; 52 ) with the first polymer composition ( 17 ) and at least one second polymer composition ( 19 ), and the first ( 17 ) Polymer composition and the second polymer composition ( 19 ) in particular.
  5. Process according to claim 4, wherein the first polymer composition ( 17 ) is transparent and the second polymer composition ( 19 ) is non-transparent translucent.
  6. Method according to one of claims 4 to 5, wherein the second polymer composition ( 19 ) is cured in step a).
  7. Method according to one of claims 4 to 6, wherein for producing the lighting module ( 11 ; 41 ; 51 ; 81 ; 91 ; 101 ) the second polymer composition ( 19 ) a mold for the first polymer composition ( 17 ) and the first polymer composition ( 17 ) in the second polymer composition ( 19 ) is filled.
  8. Method according to one of the preceding claims, wherein the at least one polymer composition (a) provided in step a) 17 . 19 ; 33 ) by means of a coextrusion process as a dimensionally stable, band-shaped body ( 16 ; 22 ; 32 ; 42 ; 52 ; 62 ; 72 ) will be produced.
  9. Method according to one of claims 4 to 8, wherein the second polymer composition ( 19 ) is an external polymer composition.
  10. Method according to one of claims 4 to 8, wherein the second polymer composition ( 19 ) in the first polymer composition ( 17 ) is embedded.
  11. Method according to one of the preceding claims, wherein the method additionally comprises the step d) covering the recessed luminous band ( 12 ) with further, not yet fully cured polymer composition ( 132 ) having.
  12. Ribbon-shaped light module ( 11 ; 21 ; 31 ; 41 ; 51 ; 61 ; 71 : 81 ; 91 ; 101 ; 111 ; 121 ; 131 ), comprising a light strip ( 12 ) with a ribbon-shaped printed circuit board ( 13 ), at the front ( 14 ) a series of light sources ( 15 ), wherein at least the light exit surfaces of the light sources ( 15 ) of a polymer composition ( 17 ; 33 ) and wherein the light module has been produced by the method according to one of the preceding claims.
  13. Light module ( 11 ; 21 ; 31 ; 41 ; 51 ; 61 ; 71 : 81 ; 91 ; 101 ; 111 ; 121 ; 131 ) according to claim 12, wherein the lighting module is flexible.
DE102012214484.6A 2012-08-14 2012-08-14 Method for producing a band-shaped lighting module Withdrawn DE102012214484A1 (en)

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PCT/EP2013/066536 WO2014026889A1 (en) 2012-08-14 2013-08-07 Method for the production of a strip-shaped lighting module

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