DE102011122991B3 - Process for monitoring the processing and device for processing a workpiece with a high-energy processing beam - Google Patents

Abstract

Method for monitoring the processing of a workpiece (12) with a high-energy processing beam, comprising the following steps- illuminating at least one point of impingement of the processing beam (18) on the workpiece (12) by means of an illumination source (32) which emits a light with a different frequency and intensity than that of the processing beam (18),- recording and storing a series of images that can be evaluated electronically, which contain at least the point of impact of the processing beam (18) on the workpiece, during the processing to be monitored,- recording a series of actual values of at least one the process parameters to be monitored that determine the processing by at least one sensor in synchronism with the recording of the series of electronically analyzable images and storage of the recorded actual values, and evaluation of the stored electronically analyzable images, in which the electronically analyzable images are exposed to light with a different frequency and intensity than that of the processing beam (18) are generated, and the electronically analyzable images and the actual values are stored in such a way that an image recorded at a first point in time (t1) can be assigned to an actual value recorded at the first point in time (t1). is.

Description

The invention relates to a method for monitoring the processing of at least one workpiece with a high-energy processing beam. In the following, monitoring is understood to mean both merely passive monitoring and active control or regulation of the processing. In addition, the invention relates to a device for processing a workpiece using a high-energy processing beam.

Fusion joining or cutting or separating operations can be carried out precisely with a high-energy processing beam, such as an electron beam or laser beam, focused on a surface of a workpiece to be processed, but also with an electric arc. Online quality control and, even more advantageously, online regulation of the processing are important for a perfect work result.

From the DE 20 2007 018 689 U1 a system for active readjustment of the focus position in optics for high-power laser radiation for laser material processing is known, which contains a sensor for determining the focus position and a control computer that processes the sensor data and uses it to determine correction data, according to which at least parts of the optics for changing the focus position are parallel be shifted to the optical axis.

From the DE 10 2005 024 085 A1 a device for monitoring a laser machining process is known, which contains a radiation-sensitive receiver arrangement for detecting radiation from the impact point of the laser beam on a workpiece surface, which comprises at least one radiation-sensitive receiver and at least one camera. The monitoring device also contains at least one imaging device, which images at least one area of the point of impact to be observed on the receiver arrangement, and an evaluation circuit, to which the output signals of the at least one radiation-sensitive receiver and the at least one camera are fed simultaneously and which processes the received output signals of the receiver arrangement in order to to deliver output signals that characterize the course of the laser processing process and enable its assessment.

Further methods for monitoring the processing of a workpiece with a high-energy processing beam are pending DE 691 01 789 T2 and WO 2011/009 594 A1 known.

Process data acquisition systems for laser material processing are also known, in which video images of the point of impact of the laser beam on a workpiece are acquired simultaneously with process data, such as movement parameters of a processing head relative to the workpiece, and signal curves are monitored for target specifications.

The invention is based on the object of specifying a way in which the processing of a workpiece can be improved by means of a high-energy processing beam.

This object is achieved according to the invention by a method having the features of claim 1 and a device having the features of claim 7. Further developments of the invention can be found in the dependent claims.

The processing of a workpiece with a high-energy processing beam includes cutting, remelting hardening and remelting joining, such as soldering or welding. The term workpiece thus includes a single component, for example a metal sheet, which is to be severed, and components which are to be connected to one another by fusion joining, for example two metal sheets. The processing beam can be a laser beam, an electron beam or an arc, for example.

The invention is explained below by way of example and with further details using schematic drawings.

• 1 eine Prinzipansicht einer erfindungsgemäßen Vorrichtung,
• 2 ein vereinfachtes Blockschaltbild der Vorrichtung,
• 3 eine Ansicht einer beispielhaften Bildschirmdarstellung,
• 4 ein Flussbild des Ablaufes eines Überwachungsverfahrens.

In the figures represent:

• 1 a schematic view of a device according to the invention,
• 2 a simplified block diagram of the device,
• 3 a view of an example screen display,
• 4 a flow chart of the sequence of a monitoring procedure.

According to 1 a workpiece 12 to be machined is arranged on a base 10 . The workpiece is machined by means of a high-energy machining beam, in the example shown a laser beam, which emerges from a machining head designated 14 in its entirety. The processing head contains a laser beam source 16, from which a collimated laser beam 18 emerges and impinges on a semi-transparent, preferably dichroic mirror 20, which reflects the laser beam onto a focusing lens 22, which focuses the laser beam on a point on the surface of the workpiece 12 to be processed.

The processing head 14 also contains a focusing lens 24 arranged behind the mirror 20 in the extension of the optical axis of the laser beam impinging on the workpiece surface, which focuses the radiation generated by the point of impact of the laser beam on the workpiece surface onto an image converter field 26 of an electronic camera 28, so that there an image the surface processed by the laser beam (processing point or point of impact).

Optionally, the processing head 14 also contains an auxiliary material device 30, by means of which auxiliary material, for example a welding wire, can be fed to the point of impact of the laser beam on the workpiece surface. Furthermore, an illumination source 32 can be arranged on the machining head 14, with which the point of impact of the laser beam on the workpiece surface, which is the machining point, can be illuminated. In this way, an image of the processing point generated with light of a different frequency and intensity than the radiation of the laser beam can be recorded and evaluated electronically. Depending on the transparency of the dichroic mirror 20, the image generated with the illumination source 32 can be recorded by the camera 28 or by an additional camera combined with the illumination source 32, in which case this image is recorded with an imaging angle that differs from that of the of the Camera 28 generated image is. The additional camera or the camera 28 can be a thermal imaging camera, so that temperature data can be obtained in addition to geometric image data.

The machining head 14 is movably attached to a console 34 of a robot, generally designated 36, which for the sake of simplicity has actuators generally designated 38, by means of which the machining head 14 can preferably be moved spatially freely in translation and rotation. The console 34 is rigidly connected to the base 10 via a frame 40 .

An electronic control device 42 is used to convert and evaluate the images recorded by camera 28 and, if necessary, another image by illumination from illumination source 32, and to evaluate actual signals that indicate the position of actuators 38 and an actuator for controlling auxiliary material device 30 with data memories, program memories, at least one processor and input and output units. The electronic device 42 supplies signals for controlling the actuators 38, an actuator of the auxiliary material device 30, the power of the laser beam source 16, parameters of the camera 28, for example filters pushed into its beam path for spectral decomposition of the radiation generated by the processing point, etc.

• Ein Druckluftregler 50r dient der Beaufschlagung der Auftreffstelle des Laserstrahls auf die Werkstückoberfläche mit Druckluft, wie sie beispielsweise beim Löten erforderlich ist.

2 shows the functional structure of the signal processing and processing in the device described, with some more in 1 devices not shown are provided with which the processing head 14 can be provided:

• A compressed air regulator 50r is used to apply compressed air to the point of impact of the laser beam on the workpiece surface, as is required, for example, when soldering.

52r designates a processing optics controller with which the focusing lens 22 can be adjusted for fine adjustment of the focus of the laser beam, preferably in the axial direction of the laser beam and perpendicular thereto, without the processing head 14 being moved as a whole.

54r designates a shielding gas regulator with which the amount of shielding gas supplied to the processing point can be adjusted, as is required for welding, for example.

With the described units, compressed air regulator 50r, wire feed regulator 30r, laser beam source regulator 16r, robot regulator 38r, processing optics regulator 52r and protective gas regulator 54r, process parameters can be set that determine the properties of the machining of the workpiece surface. The laser beam source controller 16 regulates the power of the laser beam source 16.

Depending on the intended machining process, target values are assigned to the individual controlled process parameters, which are calculated, determined in tests or predetermined in some other way and which should be adhered to during machining in order to ensure perfect machining quality.

The controllers described and the camera 28 communicate via a bus system containing a field bus distributor 56 with a data processor 58 and a system controller 60 which are contained in the electronic device 42 .

The function of the device described is based on the following 3 1, which shows an example of an image viewable on an interactive screen 62 of the electronic device 42. FIG. Various process parameters such as laser beam power, speed at which the point of impact of the laser beam moves along the workpiece surface, protective gas throughput, feed speed of the auxiliary material wire, etc. are listed in an upper right process parameter selection field 64 of screen 62 and can be selected by clicking on the respective box be activated. In the lower area of the screen 62, which forms a process parameter field 66, the respective actual process value, which is recorded by a respective sensor contained in the associated controller and supplied to the data processing unit 58, is displayed over time; in in 3 In the example shown, the power of the laser beam source 16 is shown. The process parameter field 66 also shows the desired value of the respectively selected process parameter over time, which is stored in the data processing unit 58 . In the example shown, the target value for the power of the laser beam source 16 can be between an upper limit and a lower limit. It should be noted that multiple process parameters can be displayed simultaneously in the process parameter box 66 by clicking multiple boxes.

The digitally generated image recorded by the camera 28 is displayed in the upper left area of the screen 62, which forms an image field 68, with the time at which the image was recorded being shown as a continuous vertical line in the process parameter field 66, with marked with an arrow can be moved back and forth on the timeline. The image recorded at time t1 shows the point of impact 70 of the laser beam on the workpiece surface at time t1, which is adjoined to the left by an area 72 that is still melted, which in turn is adjoined further to the left by an area 74 that has already cooled. In the example shown, the point of impact 70 moves to the right across the workpiece surface.

An impact point 70 with a predetermined diameter or geometric dimensions, which is stored in the data processing unit 58, belongs to a laser beam power lying within the permissible desired value. At the time t1, both the image data (diameter of the impact point 70) and the laser power are within the permissible setpoint range).

At time t2, the laser power exceeds the specified limit. The contour of the image at time t2 is shown in dashed lines in image field 68 . The diameter of the point of impact 70 is greater than a previously stored target value. In data processing 58, both an image error signal (above threshold deviation) of the actual image data from the target image data and a process error signal are generated, which in turn can lead to the generation of an acoustically or optically perceptible error signal and other measures when the device is only used for quality assurance or with online control can lead to the power of the laser being readjusted in order to be within the permissible setpoint range again.

4 clarifies the processes described using a flowchart.

Suppose in step 100 a processing starts. In step 102, a check is then made as to whether the actual image data, which are constantly being generated at the same time as the processing, matches the stored target image data. If there is an above-threshold deviation between the actual image data and the target image data, the program proceeds to step 104, in which it is checked whether actual process parameters or their values match target process parameters. If there is an above-threshold or impermissible deviation between at least one actual process parameter and a target process parameter, an error signal is generated only for quality control in step 106 if the device is implemented, which can lead to the termination of processing according to step 108 . When the online machining control system is executed, the program proceeds from step 104 to step 108 in which a process whose actual process parameters or actual process parameter values deviate from the stored target process parameters or target process parameter values is changed in this way that the deviation falls below a threshold value or is within a target range. Then the program returns to step 102. With online control, the program ends, for example, when a predetermined point is reached on the workpiece surface or when the time has elapsed. The based on the 4 The process described can be modified in many ways. For example, the error signal can be generated and stored together with other parameters of the processing, so that even if the processing is not interrupted when an error signal occurs, it can be determined afterwards at which points of the processing, for example a long weld seam, there was an error , so that these areas of the weld seam can then be reworked separately.

The invention was based on the 1 described with a beam source 16, which generates a high-energy processing beam, such as a laser beam or electron beam. The processing head 14 can also be designed in such a way that, for example, instead of the focusing lens 22, it has an electrode connected to a high-voltage source, and the workpiece 12 forms a counter-electrode connected to the high-voltage source, so that the processing of the workpiece 12 takes place with an arc whose energy can be controlled via voltage and current.

With the system described, a high level of security is achieved in the quality assessment or Process control achieved because process errors that affect processing are reliably detected. If, for example, only the optics of the system are so dirty that the image recorded by the camera is affected without the actual process parameters deviating from the target process parameters, this is not recognized as an error and does not lead to readjustment. If a deviation between the actual value and the target value is displayed, for example caused by a flow sensor of a gas sensor being faulty, this also does not result in a process parameter change, particularly as long as the image data is correct with regard to the effects of this process parameter.

It should be pointed out that the most diverse types of image generation and the comparison of the actual image data with target image data are possible, for example a spectral evaluation of the image, a comparison of the position of the point of impact relative to the workpiece surface with a target position, which may lead to an intervention in control the actuators 38 of the robot 36, etc. The processing head 14 can also contain a temperature sensor, with which the temperature of the impact point of the laser beam on the workpiece surface is recorded as a process parameter and compared with a stored setpoint temperature.

The invention has been described above by way of example with embodiments in which target image data and target values of the process parameters, which have been referred to as target process parameters, are stored in the electronic device. Alternatively, functional relationships or dependencies of process parameters can be stored in the electronic device 42, the function of which can be divided between units that are separate from one another and networked with one another. Such a functional relationship consists, for example, in the fact that it specifies a relationship between the relative speed of the workpiece surface to the impact point of the high-energy machining beam and the power of the high-energy machining beam, in that the quotient of power and relative speed is a predetermined constant. In this case, a process parameter error is identified if the quotient deviates from the constant, i.e. there are degrees of freedom for the beam power and the relative speed. In such an embodiment of the invention, the process parameters are not monitored on the basis of fixed limit values or target values, but rather, for example, according to a set of rules or algorithms that reflect the relationships of the machining process.

The functional relationships do not have to be limited to relationships only between the process parameters, but can also contain image data, for example the distance between the cooled near area 74 and the point of action 70 ( 3 ), which can depend on the relative speed of the point of action relative to the workpiece surface, the blasting power, the amount of protective gas supplied to the point of action, etc. The target image data can thus be networked with the target process parameters and can be stored as a function of the respective process data.

• Sei beispielsweise angenommen, bei der Schweißung einer Kehlnaht weist eine flache, möglichst breite Ausfüllung der Kehle auf eine maximale Anbindung und damit feste Verbindung hin. Aus den Ist-Bilddaten können in der Datenverarbeitung 58 (2) die Breite und die Wölbung beispielsweise der erkalteten Nahtbereiches (3) hergeleitet werden, die als getrennte Rechengrößen zur Verfügung stehen oder zu einer einzigen Rechengröße zusammengefasst werden. Weicht eine Ist-Rechengröße von einer vorher gespeicherten Soll-Rechengröße ab, so werden ein oder mehrere Prozessparameter von der Anlagensteuerung 60 (2) entsprechend in der Anlagensteuerung 60 gespeicherten Verknüpfungsrelationen zwischen den Prozessparametern und der Rechengröße derart verstellt, dass die Soll-Rechengrößen (Breite und Wölbung) wieder erreicht werden. Der Prozessparameter kann im vorliegenden Beispiel der Drahtvorschub (Regler 30r) sein, der beispielsweise vergrößert wird, wenn die Nahtwölbung zu klein wird.

Another example of a development or implementation of the invention is as follows:

• Suppose, for example, that when welding a fillet weld, filling the fillet flat and as wide as possible indicates a maximum connection and thus a strong connection. From the actual image data, 58 ( 2 ) the width and curvature, for example, of the cooled seam area ( 3 ) can be derived, which are available as separate operands or combined into a single operand. If an actual operand differs from a previously stored setpoint operand, one or more process parameters are set by the system control 60 ( 2 ) is adjusted in accordance with the linkage relationships between the process parameters and the operands stored in the system controller 60 in such a way that the target operands (width and camber) are reached again. In the present example, the process parameter can be the wire feed (controller 30r), which is increased, for example, if the curvature of the seam becomes too small.

One or more linking relations can form a set of rules that is determined by tests or otherwise and is permanently preset. However, the linkages can also be learned or optimized by learning, for example by successfully changing a process parameter at a predetermined critical point in previous welds, so that this change is weighted more heavily than other changes in other similar necessary interventions. In this way, the set of rules can react faster and better to changes in the operands, which are preferably obtained from image data, over the course of the application.

The set of rules or the linking relations can also be designed in such a way that even if there is no deviation in the actual operand from slight changes in process parameters occur in the target operand and the resulting change in the operand is determined. If the observed operand is changed in the sense of an improvement in processing, the setting of the process parameter is retained or adjusted in one direction until an optimum operand is exceeded. As soon as the observed operand deteriorates, the setting of the process parameter is reversed so that the optimum operand is retained. In this way, the machining process can regulate itself to an optimum.

• Sei angenommen, dass die Breite der flachen Nahtoberseite einer Kehlnaht einen großen Wert aufweist, der auf eine gute Anbindung und damit hohe Nahtfestigkeit schließen lässt. Sei angenommen, der Drahtvorschub ist dabei etwas unter einem voreingestellten oberen Grenzwert des Prozessparameters Drahtvorschub. Erfindungsgemäß kann unter Auswertung der Verknüpfung zwischen Drahtvorschub und Breite der Nahtoberseite der obere Grenzwert des Prozessparameters Drahtvorschub angehoben werden, so dass das Optimum im Bereich des Mittelwertes des zulässigen Drahtvorschubintervalls liegt und bei Abweichungen eine bessere Regelung möglich ist. Auf diese Weise können gespeicherte Soll-Prozessparameter selbsttätig an das jeweilige Prozessoptimum angepasst werden.

A further aspect of the invention is explained using the following example:

• Assume that the width of the flat seam surface of a fillet weld has a large value, which indicates a good connection and thus high seam strength. Assume that the wire feed is slightly below a preset upper limit of the wire feed process parameter. According to the invention, the upper limit value of the wire feed process parameter can be raised by evaluating the link between the wire feed and the width of the upper side of the seam, so that the optimum is in the range of the mean value of the permissible wire feed interval and better control is possible in the event of deviations. In this way, stored target process parameters can be automatically adapted to the respective optimum process.

Overall, the invention makes it possible to record all variables necessary for assessing the overall process of machining and, for example, using a set of linkages, to control the process parameters in a targeted manner in order to achieve an optimal machining result.

• Gemäß einem ersten Aspekt enthält das Verfahren folgende Schritte
  • - Aufnehmen eines elektronisch auswertbaren Bildes, das wenigstens die Auftreffstelle des Bearbeitungsstrahls auf das Werkstück enthält,
  • - Erzeugen von Ist-Bilddaten,
  • - Vergleichen der Ist-Bilddaten mit Soll-Bilddaten,
  • - Erzeugen eines Bildfehlersignals bei einer Abweichung der Ist-Bilddaten von den Soll-Bilddaten und
  • - Auslösen von Maßnahmen bei Vorhandensein eines Bildfehlersignals.

A method for monitoring the processing of a workpiece with a high-energy processing beam is further characterized by the following aspects:

• According to a first aspect, the method includes the following steps
  • - Recording an electronically analyzable image that contains at least the point of impact of the machining beam on the workpiece,
  • - Generation of actual image data,
  • - Comparing the actual image data with target image data,
  • - Generating an image error signal in the event of a deviation of the actual image data from the target image data and
  • - Triggering of actions in the presence of a frame error signal.

The first aspect is aimed at a method for monitoring the processing of a workpiece with a high-energy processing beam, in which an image error signal is generated if there is a deviation between actual image data and target image data. The presence of such an image error signal is a prerequisite for triggering further measures for monitoring or controlling or regulating the processing. According to the invention, the evaluation of an image of the impact point of the machining beam on the workpiece is an integrated part of the monitoring.

• - Erfassen von die Bearbeitung steuernden Ist-Prozessparametern synchron mit der Erzeugung der Ist-Bilddaten,
• - Vergleichen von Ist-Prozessparametern mit Soll-Prozessparametern,
• - Erzeugen eines Prozessfehlersignals bei einer Abweichung zwischen IstProzessparametern und Soll-Prozessparametern, und
• - Erzeugen eines Fehlersignals bei gleichzeitigem Vorhandensein eines Bildfehlersignals

und eines Prozessfehlersignals.According to a second aspect, the method includes the following steps:

• - Acquisition of the actual process parameters controlling the processing synchronously with the generation of the actual image data,
• - Comparison of actual process parameters with target process parameters,
• - generating a process error signal in the event of a deviation between actual process parameters and target process parameters, and
• - Generation of an error signal with the simultaneous presence of an image error signal

and a process error signal.

According to the second aspect, if an image error signal and a process error signal are present at the same time, an error signal is generated, which in turn can trigger different further measures. For example, an error signal can only be indicated acoustically or visually, or its occurrence can be registered together with data recording the time sequence or spatial sequence of processing of the workpiece, so that the processing can be reworked where an error signal occurs.

According to a third aspect, in the case of the second aspect, when an error signal is present, at least one process parameter is changed in such a way that the deviation of the associated actual process parameter from the setpoint process parameter decreases.

According to the third aspect, when an error signal is present, for example, a process parameter can be changed in such a way that the deviation of the associated actual process parameter from a setpoint process parameter decreases.

According to a fourth aspect, in the case of the second or third aspect, at least one operand is generated from image data, which is linked to at least one process parameter via at least one linkage relation, and at least one target process parameter is derived from a target operand variable generated from target image data using a linkage relation.

Desired process parameters can be stored as permissible value ranges or, according to the fourth aspect, can be derived from linkage relations which, for example, link an operand generated from image data to process parameters.

According to a fifth aspect, in the case of the fourth aspect, when an error signal is present, the actual process parameters are changed in the direction of reducing the deviation between the actual operand and the setpoint operand.

According to the fifth aspect, the linkage relationship can be determined by experiments in which the relationship between one or more process parameters and image data or operands generated from the image data, such as diameter, color, shape, three-dimensional contour of the image, etc. are determined.

According to a sixth aspect, in the case of the fourth or fifth aspect, the linkage relation is determined through experiments.

According to the sixth aspect, the linkage relation or the linkage relations can be derived analytically.

According to a seventh aspect, in the case of the fourth or fifth aspect, actual process parameters are changed during the machining of the workpiece, the changes in the operand caused by the changes in the process parameters are recorded and the linkage relation is used in the sense of improving the description of the relationship between process parameters and the operand optimized.

According to the seventh aspect, it is possible to change actual process parameters in small steps during the machining of the workpiece and to record the effect of the changes on changes in the image data or at least one operand generated from the image data. It is advantageously ensured that the actual value of the operand, due to the change in the process parameter or parameters, does not deviate more than permissible or only for a short time from the target value of the operand, so that problem-free processing is maintained. In this way, the linkage relationship between the process parameter and the operand can be optimized or made more precise during processing, for example by adapting coefficients in a formula that describes the relationship between the operand and process parameters using the least squares method. The method described can be used to teach in a linkage relation if starting values of the process parameters determined empirically or otherwise are assumed at the start of processing. In addition, those process parameters can be determined whose change is particularly effective for changing the operand, so that these process parameters are changed to regulate the processing. In addition, target values or permissible target value ranges can be changed if, for example, it turns out that a process parameter is at the edge of its permissible target value range for compliance with a target operand. This adjustment maintains a high level of control quality, since the process parameter whose setpoint range has been adjusted can be adjusted up and down if necessary after the adjustment. The aforementioned aspects are also considered to be worthy of protection regardless of their integration into a system for monitoring processing. An example of the aspects mentioned above is the following: Assume that there is an operand between the process parameters power L of the processing beam, relative speed v between the point of impact of the processing beam and the workpiece, feed rate vg of a welding wire and supply of protective gas sg and the diameter D of the melting area of the point of impact functional relationship D = f(L,v,vg,sg). Based on an assumed function at the start of processing, this function can be continuously checked and optimized during processing by changing the process parameters.

According to an eighth aspect, in the case of any of the preceding aspects, the image data will contain at least one of the following information: area of the melted portions; Shape of the melted areas; location of the melted areas relative to a predetermined path on the workpiece, frequency of radiation emitted from the melted areas; Frequency distribution of the radiation emitted by the melted areas.

The eighth aspect is aimed at examples of image data and operands that can be generated from the image data.

According to a ninth aspect, in the case of any of the preceding aspects, the Pro process parameters contain at least one of the following items of information: speed and direction of the relative movement between the point of impact of the high-energy machining beam on the workpiece, distance between a focus lens of the machining beam and the workpiece surface; Direction in which the processing beam hits the workpiece surface; processing beam power; Amount of shielding gas delivered to the point of impact; amount of compressed air supplied from the point of impact; Amount of auxiliary material brought to the point of impact.

The ninth aspect is directed to examples of process parameters.

• eine Basis (10) zum Halten des Werkstücks (12),
• einen Bearbeitungskopf (14) mit einer Strahlquelle (16) zum Erzeugen des hochenergetischen
• Bearbeitungsstrahls, einer Optik (22) zum Fokussieren des Bearbeitungsstrahls auf die Werkstückoberfläche
• und einer elektronischen Kamera (28) zum Aufnehmen eines Bildes, das wenigstens die Auftreffstelle des Bearbeitungsstrahls auf die Werkstückoberfläche enthält,
• einer Einrichtung (16r, 30r, 38r, 50r, 52r, 54r) zum Einstellen von die Bearbeitung des Werkstücks beeinflussenden Prozessparametern,
• eine Datenverarbeitungseinrichtung (58) zum Speichern von Soll-Daten sowie Auswerten von Ist-Daten und deren Vergleichen mit den Soll-Daten, und eine elektronischen Steuereinrichtung (60), die die Datenverarbeitungseinrichtung (58) und die Einrichtung zum Einstellen der Prozessparameter nach einem der Aspekte 1 bis 9 steuert. Der zehnte Aspekt ist auf den grundsätzlichen Aufbau einer Vorrichtung zum Bearbeiten eines Werkstücks mittels eines hochenergetischen Bearbeitungsstrahls gerichtet, in der wenigstens eines der erfindungsgemäßen Verfahren ablaufen kann. Aspekte 1 bis 9 steuert.
• Der zehnte Aspekt ist auf den grundsätzlichen Aufbau einer Vorrichtung zum Bearbeiten eines Werkstücks mittels eines hochenergetischen Bearbeitungsstrahls gerichtet, in der wenigstens eines der erfindungsgemäßen Verfahren ablaufen kann.

According to a tenth aspect, a device for machining a workpiece (12) by means of a high-energy machining beam (18) is provided, which has:

• a base (10) for holding the workpiece (12),
• a processing head (14) with a beam source (16) for generating the high-energy
• Machining beam, an optical system (22) for focusing the machining beam on the workpiece surface
• and an electronic camera (28) for recording an image that contains at least the point of impact of the machining beam on the workpiece surface,
• a device (16r, 30r, 38r, 50r, 52r, 54r) for setting process parameters influencing the machining of the workpiece,
• a data processing device (58) for storing target data and evaluating actual data and comparing it with the target data, and an electronic control device (60) which controls the data processing device (58) and the device for setting the process parameters according to one of Aspects 1 to 9 controls. The tenth aspect is aimed at the basic structure of a device for processing a workpiece using a high-energy processing beam, in which at least one of the methods according to the invention can take place. Aspects 1 to 9 controls.
• The tenth aspect is aimed at the basic structure of a device for processing a workpiece using a high-energy processing beam, in which at least one of the methods according to the invention can take place.

According to an eleventh aspect, the device according to the tenth aspect is characterized in that the processing head (14) contains an illumination source (32) for illuminating at least the surface area of the workpiece (12) struck by the processing beam and actual image data are generated which surface area illuminated by the illumination source.

According to a twelfth aspect, the device according to the tenth or eleventh aspect is characterized in that the device for setting process parameters contains actuators (38) for generating a relative movement between the base (10) and the processing head (14).

• eine Einrichtung (30r) zum Zuführen von Hilfsmaterial zu der Auftreffstelle des Bearbeitungsstrahls auf die Werkstückoberfläche,
• eine Einrichtung (54r) zum Beaufschlagen der Auftreffstelle des Bearbeitungsstrahls auf die Werkstückoberfläche mit Schutzgas,
• eine Einrichtung (50r) zum Beaufschlagen der Auftreffstelle des Bearbeitungsstrahls auf die Werkstückoberfläche mit Druckluft,
• eine Einrichtung (16r) zum Einstellen der Leistung des Bearbeitungsstrahls,
• eine Einrichtung (38r) zum Steuern einer Relativbewegung zwischen der Basis (10) und dem Bearbeitungskopf (14).

According to a thirteenth aspect, the device according to the tenth to twelfth aspect is characterized in that the processing head contains at least one of the following controllable devices:

• a device (30r) for feeding auxiliary material to the impact point of the machining beam on the workpiece surface,
• a device (54r) for applying protective gas to the impact point of the machining beam on the workpiece surface,
• a device (50r) for applying compressed air to the impact point of the machining jet on the workpiece surface,
• a device (16r) for adjusting the power of the machining beam,
• means (38r) for controlling relative movement between the base (10) and the processing head (14).

According to a fourteenth aspect, the device according to the tenth to thirteenth aspects is characterized in that the beam source is a laser beam source (16).

According to a fifteenth aspect, the device according to the tenth to fourteenth aspects is characterized in that the processing of the workpiece is one of the following processing: brazing, welding, hardening, cutting.

Reference List

10

Base

12

workpiece

14

processing head

16

laser beam source

18

laser beam

20

Mirror

22

focusing lens

24

focusing lens

26

imager panel

28

electronic camera

30

Auxiliary Material Facility

32

lighting source

34

console

36

robot

38

actuators

40

frame

42

electronic device

50

compressed air regulator

52

processing optics controller

54

inert gas regulator

56

fieldbus distributor

58

data processing

60

plant control

62

Screen

64

Process parameter selection field

66

process parameter field

68

image field

70

point of impact

72

melted area

74

cold area

Claims (12)

Method for monitoring the processing of a workpiece (12) with a high-energy processing beam, comprising the following steps - Illuminating at least one point of impact of the machining beam (18) on the workpiece (12) by means of an illumination source (32) which generates a light with a different frequency and intensity than that of the machining beam (18), - Recording and storing a series of images that can be evaluated electronically, which contain at least the point of impact of the machining beam (18) on the workpiece, during the machining to be monitored, - detecting a series of actual values of at least one process parameter determining the processing to be monitored by at least one sensor synchronously with the recording of the series of electronically analyzable images and storing the detected actual values, and - Evaluation of the stored electronically analyzable images, in which the electronically analyzable images are generated with the light having a different frequency and intensity than that of the processing beam (18), and the electronically analyzable images and the actual values are stored in such a way that a an image recorded at a first point in time (t1) can be assigned to an actual value recorded at the first point in time (t1). procedure after claim 1 , with the following further step, simultaneous display on the same screen - of a chronological progression of at least some of the stored actual values of the at least one process parameter, and - one of the electronically analyzable images from the stored series of electronically analyzable images, with the display of the at the time of recording of the displayed image can be taken. procedure after claim 2 , with the following further step - additional display of target values of the at least one process parameter on the screen. procedure after claim 2 or 3 , at which the point in time at which the displayed image was recorded corresponds to a point in time marked in the display of the time profile of the stored actual values of the at least one process parameter. Procedure according to one of Claims 1 until 4 , with the following further step of generating image data from at least one of the stored electronically analyzable images, the image data containing at least one of the following information: area of the melted region; shape of the melted area; location of the fused area relative to a predetermined path on the workpiece, frequency of radiation emitted from the fused area; Frequency distribution of the radiation emitted from the melted area. Procedure according to one of Claims 1 until 5 , wherein the at least one process parameter contains at least one of the following information: speed and direction of the relative movement between the point of impact of the high-energy machining beam on the workpiece, distance between a focus lens of the machining beam and the workpiece surface; Direction in which the processing beam hits the workpiece surface; processing beam power; Amount of shielding gas delivered to the point of impact; amount of compressed air supplied from the point of impact; Crowd of auxiliary material brought to the point of impact. Device for processing a workpiece (12) by means of a high-energy processing beam (18), containing a base (10) for holding the workpiece (12), a processing head (14) with optics (22) for focusing a processing beam on the workpiece surface and an illumination source (32) for illuminating at least one point of impingement of the processing beam (18) on the workpiece (12), which emits a light with a different frequency and intensity than that of the processing beam (18), at least one controller (16r, 30r, 38r, 50r, 52r, 54r) for setting at least one process parameter influencing the machining of the workpiece, an electronic camera (28) for recording a series of electronically analyzable images, which contain at least the point of impact of the machining beam on the workpiece, during the machining to be monitored, at least one sensor for detecting a series of actual values of at least one process parameter determining the processing to be monitored synchronously with the recording of the series of electronically analyzable images, and a data processing device (58) for storing recorded images and the recorded actual values, in which the electronically analyzable images are generated with the light having a different frequency and intensity than that of the processing beam (18), the electronically analyzable images and the actual Values are stored in such a way that an image recorded at a first point in time (t1) can be assigned to an actual value recorded at the first point in time (t1), and the stored electronically analyzable images are evaluated. device after claim 7 , which further has a screen for simultaneously displaying - a chronological progression of at least some of the stored actual values of the at least one process parameter, and - one of the electronically analyzable images from the stored series of electronically analyzable images, with the display of the at the time the recording of the displayed image detected actual value can be removed. device after claim 8 , wherein the point in time at which the displayed image was recorded corresponds to a point in time marked in the display of the time profile of the stored actual values of the at least one process parameter. Device according to one of Claims 7 until 9 , Image data containing at least one of the following items of information being generated from at least one stored electronically analyzable image: area of the melted region; shape of the melted area; location of the fused area relative to a predetermined path on the workpiece, frequency of radiation emitted from the fused area; Frequency distribution of the radiation emitted from the melted area. Device according to one of Claims 7 until 10 , wherein the at least one process parameter contains at least one of the following information: speed and direction of the relative movement between the point of impact of the high-energy machining beam on the workpiece, distance between a focus lens of the machining beam and the workpiece surface; Direction in which the processing beam hits the workpiece surface; processing beam power; Amount of shielding gas delivered to the point of impact; amount of compressed air supplied from the point of impact; Amount of auxiliary material brought to the point of impact. Device according to one of Claims 7 until 11 , wherein the at least one sensor is contained in an associated controller.

Images