DE102011115163A1 - Carrier layer structure for smart card, has carrier portion that is provided with recess for retaining smart card module such that side surface of smart card module is attached with side surface of carrier portion - Google Patents

Abstract

The carrier layer structure has a carrier portion (100) that is provided with a recess (300) for retaining a smart card module (200). A side surface of the smart card module is attached with a side surface of the carrier portion. A contact surface of the carrier portion is electrically connected with an electrical contact surface of the smart card module through an adhesive agent (400) or by aluminum wire. The thickness values of narrow sides of the smart card module and the carrier portion are set to predetermined ranges. An independent claim is included for a method for manufacturing carrier layer structure.

Description

The present invention relates to a chip card with a carrier layer and a chip card module.

In general, the invention is concerned with the maximum integration of electronic elements or package integrated circuits or electronic modules referred to in the present invention as a "smart card module".

In many areas of electronics, sensor technology and microsystems technology, production requirements are compelling to increase miniaturization and increase productivity by integrating subsystems into more integrated structures. The trend towards ever more integrated and compact designs, which can also be used directly in chip cards, already leads to the use of components that are arranged directly in modules. Such modules are for example the contactless modules of the known series MCC, MOB or MOA. In these modules, the chip is contacted by means of so-called wire bonds and is covered by a plastic sheath (Mold). Due to the construction, this type of integration leads to a large overall thickness of the module and thus makes integration into a chip card more difficult.

Furthermore, contactless chip card modules are known, such as for example the MFCC1 module. In the MFCC1, the chip is contacted by means of NiAu contacts in the so-called flip-chip mounting. In flip-chip mounting, the chip with the active contacting side is mounted directly down to the substrate or circuit carrier. As a result, no coverage of the chip is necessary. Thus, the total thickness of the smart card module is determined mainly by the chip thickness. However, such a contactless chip card module is very susceptible to mechanical stress and is not very rigid due to the small chip thickness.

Also known is a method which is referred to as frame gluing. By means of this method, the desired stabilization or stiffening of the module should be ensured. For frame gluing, a frame is glued to the leadframe prior to further processing. For this, however, an adhesive is necessary, which goes directly into the total thickness of the module. Typical frame heights are 300 μm, so modular structures of the required thickness can not be realized. Furthermore, there is a risk of delamination between the frame and the leadframe.

Also known is the sticking of the chip on a steel plate with a thickness of about 120 microns. In this case, however, the active surface of the chip remains unprotected and during further processing, the contacting of an antenna to the module must take place directly on the chip.

The present invention has for its object to provide a carrier layer for a smart card, which is thin, but still robust and inexpensive to produce.

This object is solved by the subject matter of independent claims 1, 15 and 20. The dependent claims each describe advantageous embodiments of the present invention.

A carrier layer for a chip card has a chip card module, wherein the chip card module is embedded in the carrier layer and wherein one side of the chip card module can terminate flush with one side of the carrier layer. This ensures a particularly simple and cost-effective production of the carrier layer with chip card module. The fact that the smart card module is embedded in a carrier layer, a particularly thin and yet robust design of a smart card is guaranteed. Furthermore, this ensures a high degree of robustness and flexural stiffness of the carrier layer, and thin carrier layers with a chip card module with overall thicknesses <200 μm can be realized.

In one embodiment, the carrier layer may have a recess for receiving the chip card module. By being present a recess in the carrier layer, the chip card module can be easily embedded in the carrier layer. In this case, the recess may preferably be a hole or a blind hole. In a hole, the chip card module may be arranged such that the chip card module terminates flush with the carrier layer on a first side. In a blind hole, the chip card module contacts the remaining thin region of the carrier layer in the lower region of the blind hole. As a result, the chip card module can terminate flush with the side of the carrier layer opposite the first side.

In one embodiment, a through hole for receiving the chip card module may be formed in the carrier layer. This offers the advantage that the chip card module is accessible from both sides for the purpose of making electrical contact.

In one embodiment, the chip card module by means of heat supply in particular by Application of ultrasound are introduced into the carrier layer and be contacted directly with the carrier layer. In general, this type of connection is also referred to as "welding" in plastic substrates such as PC, PVC or PET. As a result, a cost-effective and easy to implement connection between the carrier layer and smart card module can be realized.

In one embodiment, the smart card module may be connected to the carrier layer by means of an adhesive. By means of this method, the chip card module is simply "glued" to the carrier layer. As a result, a cost-effective and easy-to-implement connection between the carrier layer and the chip card module can likewise be realized.

In a further embodiment, the carrier layer may comprise at least one recess which is formed such that electrical contact surfaces of the chip card module z. B. are provided on the side walls of the smart card module for easy electrical contacting. The recess may be formed here, for example, as an elongated trench or as a hole. As a result, and due to the small thickness of the carrier layer and the chip card module is an easy to implement and easily accessible electrical contacting of the chip card module, for example, on the side walls, guaranteed.

In one embodiment, the recess of the carrier layer is designed such that the chip card module is electrically contactable on its side walls.

In one embodiment, electrical contact surfaces of the carrier layer may be electrically connected by means of a conductive adhesive to the electrical contacts of the chip card module. In this case, the conductive adhesive may be formed as an isotropically conductive or anisotropically conductive adhesive.

In a further embodiment, electrical contact surfaces of the carrier layer can be connected by means of soldering to the electrical contact surfaces of the chip card module. Here, for example, conductive wire ends of an antenna, which are applied to the carrier layer, for example, by means of a solder depot, which may be applied to the electrical contact surfaces of the chip card module, permanently contacted.

In one embodiment, the electrical contact surface of the carrier layer can be connected by means of pressure, temperature and / or ultrasound to the electrical contact surfaces of the chip card module. A suitable combination of said parameters for permanent contacting of the electrical contact surface of the carrier layer with the electrical contact surfaces of the chip card module is also known as thermal compression welding.

In one embodiment, electrical contact surfaces of the carrier layer may be formed as a conductor track. The conductor may be formed as aluminum conductor and be connected to the electrical contact surfaces of the smart card module. Aluminum is a cost-effective alternative to other known conductive metals in interconnect technology in the semiconductor industry. This allows the electrical connections between support layers and smart card modules can be realized inexpensively.

In one embodiment, the aluminum conductor track of the carrier layer may be formed as an aluminum antenna and connected to the electrical contact surfaces of the chip card module by means of an aluminum wire. The aluminum antenna may in this case be connected by means of the aluminum wire to the aluminum antenna, and this aluminum wire may be connected to the electrical contact surfaces of the chip card module. This has the advantage that the problem of aluminum oxide surface formation can be avoided.

A method for producing a carrier layer for a chip card comprises the following steps: providing a chip card module, arranging the chip card module in the carrier layer such that the chip card module is flush with at least one side of the carrier layer.

In the method for producing a carrier layer, a recess for receiving the chip card module in the carrier layer is produced in a further step.

In the method for producing a carrier layer, in a further step, the chip card module is connected to the carrier layer with the aid of heat, preferably by using ultrasound.

In the method for producing a carrier layer, the chip card module is directly contacted with the carrier layer by means of a non-conductive adhesive in a further step.

In the method for producing a carrier layer, in a further step, a thickness D of the narrower side of the carrier layer is connected to a thickness of the narrower side of the chip card module.

A chip card has a carrier layer, wherein the carrier layer has a chip card module, and wherein the chip card module is embedded in the carrier layer.

A chip card has a carrier layer and further layers are applied to the carrier layer.

1a and 1b schematically show a carrier layer for a smart card, and a smart card module, which is connected to the carrier layer.

2a and 2 B schematically show a carrier layer for a smart card, and a chip card module, which is connected to the carrier layer by means of further conductive layers.

3a and 3b show alternative embodiments of a chip card module with "wing structures" for easier contacting of the chip card module.

4a and 4b schematically show two embodiments of a carrier layer and a chip card module connected to the carrier layer. The carrier layer in this case has recesses, in which are formed to provide electrical contact surfaces for electrically contacting the chip card module. 4c shows a side view of 4a and 4b ,

5a to 5f schematically show different embodiments of possible electrical contacts of the electrical contact surfaces of the carrier layer with the electrical contact surfaces of the chip card module.

6a and 6b shows two views of a possible electrical contacting of an applied on the carrier layer antenna, with the smart card module.

Embodiments of the invention will be explained in more detail below, reference being made to the accompanying figures. However, the invention is not limited to the specific embodiments described, but may be modified and modified as appropriate. It is within the scope of the invention to suitably combine individual features and feature combinations of one embodiment with features and feature combinations of another embodiment in order to arrive at further embodiments according to the invention.

Before the embodiments of the present invention are explained in more detail below with reference to the figures, it is to be noted that the same elements in the figures are given the same or similar reference numerals and that a repeated description of these elements is omitted. Furthermore, the figures are not necessarily to scale. The emphasis is rather on the explanation of the basic principle.

1a shows a carrier layer 100 and a smart card module 200 with a chip 210 , The carrier layer 100 has an optional recess 300 on which is appropriate, the chip card module 200 take. The carrier layer 100 may be referred to as a monolayer because it has only a single layer. The chip card module 200 can advantageously by means of ultrasound in the carrier layer 100 let in and with the carrier layer 100 be connected. The chip card module 200 can be on one side with the backing layer 100 finish flush. The chip card module 200 However, in a further embodiment, it can also be arranged in a blind hole of the carrier layer such that the bottom of the blind hole is flush with the carrier layer 100 concludes.

The 1a shows like a smart card module 200 with chip 210 the by means of bumps 201 is contacted in a carrier layer 100 is admitted. In one embodiment of the 1b has the carrier layer 100 and the chip card module 200 Advantageously, plastics such as PC, PVC or PET and can with the smart card module 200 be "welded" by means of ultrasound. The generated by an ultrasonic generator electronic vibrations are converted by an ultrasonic converter into mechanical vibrations. These are supplied to the plastic workpiece to be welded, for example, via a sonotrode manufactured for the corresponding purpose. In fractions of a second, the ultrasonic vibrations generate at the corresponding points of the workpieces a frictional heat, which causes the material to melt and interconnect.

The module 200 can also by means of a press fit in the carrier layer 100 be admitted. Alternatively, the smart card module can also be provided by means of an adhesive 400 , which is preferably non-conductive, with the carrier layer 100 be connected.

The 2a shows a carrier layer 100 with a chip card module 200 , By means of a so-called Seedlayers 500 , which may preferably be deposited in a recess in the carrier layer, provides a basis for the further growth of a conductive medium. The Seedlayer 500 connects in this embodiment, the electrical contacts of the smart card module 200 with the contact surfaces of the carrier layer 100 ,

2 B shows a seed layer 500 which is about the chip card module 200 and the carrier layer 100 extends and by additionally "grown" conductive material 600 , Such as copper, can be amplified and thus connects electrical contact surfaces of the smart card module with electrical contact surfaces of the carrier layer. This allows a particularly stable and firm connection between the carrier layer 100 and the smart card module 200 achieve.

The 3a and 3b show an alternative geometric shape of the smart card module 200 , In this case, the chip card module "wings" 700 on, making it easy to contact the contacts 500 . 600 of the chip card module 200 with the contact surfaces 500 . 600 the carrier layer 100 is possible. In particular, allow the wings 700 a reliable welding of the electrical contacts of the chip card module 200 to the electrical contact surfaces of the carrier layer 100 because the contact surfaces of the chip card module 200 easily accessible in this embodiment.

4a and 4b show in principle a chip card module 200 that in a carrier layer 100 is admitted. The chip card module 200 can in the carrier layer 100 Be "sunk". This reduces the overall height, especially in wire-contacted variants when sinking the wire 110 in a recess of the carrier layer. The chip card module 200 is here in particular laterally 110 very easy to contact, since a recess is embedded in the carrier layer such that the contacts of the chip card module are very easy to contact. Also a precise contact by means of the electrical contact surface 115 is feasible. The contact surfaces can in this case in horizontal or vertical orientation based on the thickness or width of the chip card module 200 be aligned. The 4a shows here, for example, a contact wire 110 running along one side of the smart card module 200 for contacting runs. 4b additionally shows a contact wire 115 , Which points in point contact the chip card module and additionally in the carrier layer 100 is admitted.

4c shows a cross-section with side plan view of a smart card module 200 that in a carrier layer 100 is admitted. The electrical contact surfaces 500 of the chip card module are in this embodiment within a thickness D of the carrier layer 100 arranged. This arrangement offers the advantage that the electrical contact between chip card module 200 and carrier layer 100 protected and at the same time robust. In this embodiment, the electrical contact surfaces 500 of the chip card module 200 by means of a wire 301 contacted.

The 5a to 5f show various embodiments of a smart card module 200 , The chip card module 200 here in each case has a chip 210 , a molding compound 205 the at least partially the spaces between chip 210 and the remaining smart card module fills components and contact elements 301 and 302 on. The embodiments are distinguished by differences in the geometric arrangement of the chip 210 , the molding compound 205 and the contact elements 301 . 302 , Depending on the intended application, the chip card modules are thus in particular in the recess of the carrier layer 100 easy to contact electrically.

The 5a to 5c show a chip card module 200 , wherein the chip card module by means of a wire 301 is contacted. Using the parameters pressure, temperature and / or ultrasound, the electrical contacts of the chip card module 200 in permanent contact with the wire 301 which the chip card module 200 with the electrical contact surfaces of the carrier layer 100 be brought together. Also, the use of an isotropic and / or anisotropic conductive adhesive for permanent contact of the chip card module 200 with the electrical contact surfaces of the carrier layer 100 is possible in a further embodiment (not shown here). The electrical contact can in the embodiments shown so far in double-sided contacting 301 of the chip card module 200 take place, wherein the carrier layer 100 Recesses for receiving the wire 301 can have. The contact surfaces of the carrier layer 100 can along the top and / or bottom of the carrier layer 100 be educated.

5f shows a lateral electrical contact of the chip card module 200 in a further embodiment. In this embodiment, the smart card module is 200 by means of a rectangular electrical conductor 302 contacted. This embodiment is in particular for a lateral contacting of the chip card module 200 advantageous. Also in this embodiment, the carrier layer 100 Wells that are suitable, an electrically conductive wire 301 . 302 take. The contact surfaces of the carrier layer 100 can be horizontal or vertical with respect to the smart card module 200 be arranged.

The 6a and 6b show the carrier layer 100 with a built-in chip card module 200 , The top view of 6a shows further electrical contacts 405 of the chip card module 200 , Furthermore, an electrical contact surface of the carrier layer, which as an antenna 410 is formed, shown. The antenna 410 may advantageously be an aluminum antenna and may advantageously be by means of an aluminum wire 401 with the electrical contacts 405 be connected to the smart card module. The contacting of the aluminum wire 401 with the aluminum antenna 410 can be prepared by direct application by suitably chosen parameters, pressure, time, temperature and ultrasound. By a suitable choice of said parameters, the aluminum wire breaks through 401 the oxide layer of the aluminum antenna 410 This creates a permanent and reliable connection between the aluminum antenna 410 and aluminum wire 401 , The aluminum wire 401 Can use an Alu Wedge Bonder, quickly and inexpensively with the contacts 405 the smart card module are connected, with a longitudinal orientation of the smart card module contacts 405 parallel to the wire direction 401 the simplicity of contacting optimized. An optional cover 420 of the aluminum wire 401 and / or chip card module with a thin layer (eg paint) 800 of the 6b can improve the mechanical and chemical resistance of the entire backing layer 100 with the chip card module 200 even better.

The 6b shows the carrier layer 100 with the chip card module embedded therein 200 , wherein on the carrier layer 100 more layers 800 . 900 on both sides of the carrier layer 100 are applied. The carrier layer 100 may comprise a monolayer layer with a typical layer thickness <200 μm, with a top layer layer typically around 300 μm and a bottom layer typically 300 μm.

Claims (21)

Carrier layer for a chip card with a chip card module, wherein the chip card module is embedded in the carrier layer and wherein at least one side of the chip card module is flush with at least one side of the carrier layer. Carrier layer according to claim 1, wherein the chip card module is embedded in a recess for receiving the chip card module in the carrier layer. Carrier layer according to claim 1 or 2, wherein the recess for receiving the chip card module forms a through hole through the carrier layer. Carrier layer according to one of the preceding claims, wherein the chip card module is directly connected to the carrier layer. Carrier layer according to claim 1, 2 or 3, wherein the chip card module is contacted by means of an adhesive with the side walls of the carrier layer and / or with a chip card module facing the longer side of the recess of the carrier layer. Carrier layer according to one of the preceding claims, wherein the carrier layer has at least one recess which is formed to provide an electrical contact surface for electrically contacting the chip card module. Carrier layer according to one of the preceding claims, wherein electrical contact surfaces of the chip card module are electrically contacted at least on one side wall. Carrier layer according to one of the preceding claims, wherein the electrical contact surface of the carrier layer is electrically connected by means of a conductive adhesive to the chip card module. Carrier layer according to one of the preceding claims, wherein the electrical contact surface of the carrier layer is electrically connected by means of soldering with the chip card module. Carrier layer according to one of claims 6 to 9, wherein the electrical contact surface of the carrier layer is electrically connected to the chip card module. Carrier layer according to one of claims 6 to 10, wherein the electrical contact surface of the carrier layer is formed as a conductor track and is connected to the electrical contact surfaces of the chip card module. Carrier layer according to claim 10, wherein the conductor track is formed as an antenna and connected to the electrical contacts of the chip card module by means of a wire. Carrier layer according to one of claims 10 to 12, wherein the conductor track is formed as an aluminum antenna and connected to the electrical contacts of the chip card module by means of an aluminum wire. Carrier layer according to one of the preceding claims, wherein a thickness D of a narrower side of the smart card module corresponds to a thickness of a narrower side of the carrier layer. A method for producing a carrier layer for a chip card comprising the following steps: providing a chip card module and embedding the chip card module in the carrier layer such that the chip card module is flush with at least one side of the carrier layer. A method for producing a carrier layer according to claim 15, wherein the method is provided with a recess for receiving the chip card module in the carrier layer. A method for producing a carrier layer according to claim 15 or 16, wherein the method chip card module is welded by heat input, preferably by ultrasound with the carrier layer. A method for producing a carrier layer according to claim 15 or 16, wherein the method chip card module is contacted by means of a non-conductive adhesive to the carrier layer. Method for producing a carrier layer according to one of the preceding claims, in which method a thickness D of the narrower side of the chip card module is connected to a thickness of the narrower side of the carrier layer. Chip card with a carrier layer according to one of claims 1 to 12. Chip card with a carrier layer according to claim 20, wherein the carrier layer has further applied layers.

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