DE102011084882A1 - Method for manufacturing cooling body of semiconductor lamp, involves punching cooling body-original mold with multiple flags that are connected over bars, where flags are made from sheet metal part - Google Patents

Abstract

The method involves punching a cooling body-original mold with multiple flags that are connected over bars, where the flags are made from sheet metal part (101). Some of the flags are bent. Some of the flags are coated with an electrically insulated plastic so that an electrical contact face remains free. One of the bars is opened. An independent claim is included for a semiconductor lamp with a semiconductor light source.

Description

The invention relates to a method for producing a heat sink of a semiconductor lamp from a sheet metal part. The invention further relates to a semiconductor lamp with such a heat sink. The invention is particularly suitable for use with retrofit lamps.

WO 2011/029724 A1 discloses a lighting device with a heat sink for cooling at least one light source, wherein the heat sink may have a bent punched sheet metal part. The heat sink furthermore has a support region for supporting a carrier substrate for the at least one light source, bent-over segments departing from the support region. WO 2011/029724 A1 further discloses a method of making such a heat sink, comprising punching radially extending recesses at an edge of a sheet and bending up the segments left between the recesses at a central support area. The method may include a step of bending cooling fins on the remaining segments.

It is the object of the present invention to provide a simpler and cheaper production of a heat sink of a semiconductor lamp and also a semiconductor lamp with such a heat sink.

This object is achieved according to the features of the independent claims. Preferred embodiments are in particular the dependent claims.

The object is achieved by a method for producing a heat sink of a semiconductor lamp, wherein the method comprises at least the following steps: a) separating, in particular punching, a heat sink prototype with a plurality of web-related flags from a sheet metal part; b) bending at least some of the flags; c) overmolding at least some of the lugs with an electrically insulating plastic such that in each case at least one electrical contact field remains free; and d) opening at least one of the webs.

A semiconductor lamp may in particular be understood to mean a lamp which has at least one semiconductor light source as the light source.

Under a heatsink prototype can be understood in particular a separate, in particular punched, sheet metal piece, which is not yet formed, in particular bent, is, ie in particular is flat, and from which is produced by bending the heat sink. The heat sink prototype in particular has a front side and a rear side.

Under a flag can be understood in particular a region of the heatsink prototype, which is connected to other flags at least substantially only by webs.

A web may, in particular, be understood to mean a comparatively narrow connection area between flags. A bridge is easily separable due to its small size.

Bending can in principle be understood to mean any forming process, in particular bending in the narrower sense.

The fact that an electrical contact field remains free may mean in particular that this contact field is not covered with electrically insulating plastic.

The opening of the webs may in particular comprise a severing of the webs, e.g. by punching, laser cutting etc.

The method can be carried out in particular in this order.

The method has the advantage that the heat sink can be produced from a single metal part, in particular sheet metal part, which can be produced inexpensively, in particular by stamping. A separate manufacturing and subsequent joining several metal parts is eliminated. By encapsulating a mechanically stable sheath for the flags is advantageously generated, which fixes them in or on the electrically insulating plastic. This allows opening the webs without a mechanical weakening. The opening of the webs in turn allows an electrical separation of the flags connected by the webs and this e.g. applying different electrical potentials to different flags. Overall, an easily manufacturable heat sink is thus provided which is largely electrically insulated from the environment and which can be equipped with at least one light source via the electrical contact fields. As a result, it is possible to dispense with a printed circuit board for arranging the light sources (including its attachment), which makes possible a particularly inexpensive and (due to improved heat dissipation of the light sources) thermally advantageous lamp. The heat sink can therefore also assume the function of a printed circuit board for the semiconductor light source (s). The electrical insulation also allows a simpler structure of a driver, in particular a relative to the heat sink not additionally isolated driver for operating the at least one light source (if any).

The sheet metal part is in particular a metallic sheet metal part, in particular of copper or aluminum. This allows a break-free bending as well as a high electrical and thermal conductivity. The sheet metal part is preferably at least 1 mm, in particular at least 1.5 mm, thick.

The sheet metal part may be at least partially surface-coated, e.g. for the purpose of soldering and / or wire bonding. The surface coating can in particular be produced by means of a galvanic technique (electroplating), in particular by a so-called "selective plating", e.g. a silver plating. The surface coating may be provided in particular in the region of the electrical contact fields. The sheet metal part can be present in particular as a strip. The sheet metal part may additionally or alternatively be treated differently, e.g. be plasma cleaned.

Preferably, the at least one semiconductor light source comprises at least one light-emitting diode. If several LEDs are present, they can be lit in the same color or in different colors. A color may be monochrome (e.g., red, green, blue, etc.) or multichrome (e.g., white). The light emitted by the at least one light-emitting diode can also be an infrared light (IR LED) or an ultraviolet light (UV LED). Several light emitting diodes can produce a mixed light; e.g. a white mixed light. The at least one light-emitting diode may contain at least one wavelength-converting phosphor (conversion LED). The phosphor can alternatively or additionally be arranged remotely from the light-emitting diode ("remote phosphor"). The at least one light-emitting diode can be in the form of at least one individually housed light-emitting diode or in the form of at least one LED chip. Several LED chips can be mounted on a common substrate ("submount"). The at least one light emitting diode may be equipped with at least one own and / or common optics for beam guidance, e.g. at least one Fresnel lens, collimator, and so on. Instead of or in addition to inorganic light emitting diodes, e.g. based on InGaN or AlInGaP, organic LEDs (OLEDs, for example polymer OLEDs) can generally also be used. Alternatively, the at least one semiconductor light source may be e.g. have at least one diode laser.

The electrically insulating plastic is in particular a thermoplastic. In particular, polybutylene terephthalate (abbreviated PBT), polyethylene terephthalate (abbreviation PET) or a mixture thereof have proven to be preferred. These plastics achieve at least in the visible spectrum a high reflectivity of about 93% to 94%. In addition, they can withstand high temperatures of about 250 ° C without damage, making them suitable for soldering in the neighborhood (e.g., LEDs on the electrical contact pads). In addition, a small thickness of about 300 to 500 microns can be achieved on metal, resulting in an effective electrical insulation with a high heat transmission (thermal conductivity about 0.25 W / (m · K)). The plastic extrusion thus hinders, with a typical heat sink area of about 40 square centimeters, due to a low thermal resistance of only about 0.5 K / W, a heat transfer from the heat sink to the environment not essential. Rather, the thermal performance of the heat sink is dominated by the sheet metal part.

It is an embodiment that the separation, in particular stamping, a separation of several identically shaped heatsink prototypes from the same sheet metal part includes and the heatsink prototypes are connected to a (punched) transport frame. This makes it possible to provide a low-cost, fully-automated production process for a large number of heat sinks. The heat sink prototypes can remain connected to the transport frame via dedicated, later removable transport flags, for example.

It is still an embodiment that the flags are designed to be elongated and in their longitudinal extent radially to a, in particular at least initially open, central area run. This star-shaped arrangement allows a circumferential arrangement of flags or flag areas as heat-emitting areas of the heat sink. The open central area prevents there a (basically possible) connection of the individual flags, which otherwise would later be opened with increased effort (punching or similar).

It is a further embodiment that adjacent flags are connected on opposite sides via at least one web. This allows a simple punching of the flags and thereby opening the webs.

It is yet another embodiment that at least some of the tabs to be bent are bent over their width at least at a respective tab area outside the tabs ("outboard tab area", with respect to the central area, i.e., distally thereto). As a result, the outer area of the flag area is bent toward the front side and / or the rear side, which provides a heat sink shape which is particularly suitable for lamps.

It is also an embodiment that the contact fields on another area (no outer flag area) of an associated Flag are arranged, which facilitates their placement with the semiconductor light sources. However, in principle, they can also be present on the bent-over outer area of the flags, which allows a laterally aligned arrangement of light sources and thus an increased omnidirectional radiation.

In principle, the outer flag area can be bent at an angle. However, for ease of machining, it is preferred that the outboard flag portion be bent perpendicular to its longitudinal extent.

It is also an embodiment that at least some outer flag areas are bent into a rear direction (selected here purely for convention) (backwards), and are molded together with the electrically insulating plastic. As a result, they form a covered with the plastic, back opening cup. The cup is therefore electrically isolated backwards and still good heat dissipation. This cup can be used in particular as a cover for a driver housing of a lamp. Due to the electrical insulation of the driver does not need to be separately electrically insulated against the heat sink. In addition, at least one electrical lead from the driver to the front can be routed through the central opening (if present). It is particularly advantageous if the electrical contact fields are located on a front side of the heat sink. At least two of the contact pads may be electrically connected to corresponding electrical outputs of the driver.

It is for a simple plugging of the cup e.g. On a driver housing, in particular advantageous that the outer flag areas are bent at least substantially at right angles, which facilitates a simple surface attachment to a housing, e.g. for producing a press fit and / or an adhesive contact surface.

It is still a further embodiment that at least some, in particular all, outer flag areas are bent in a front-side direction. These outer flag regions can then serve as reflector regions for light sources arranged on the front or as a receptacle for a separate reflector, in particular a hollow reflector. These outer flag areas can be designed to be non-encapsulated and serve themselves as reflector surfaces. In particular, they may be e.g. polished or mirror-coated. Alternatively, the outer areas of the flags can be encapsulated with the plastic, the surface of which acts as a reflector surface. This has the advantage that the heat sink can also reflect in the gap areas between the flags, which increases a light output.

It is also an embodiment that at least some of the lugs on lobe areas within the ridges ("inboard lobe areas", with respect to the central area, i.e., proximal thereto) are bent across their width in a forward (forward) direction. The forwardly projecting tab areas may serve, in particular, to attach a top onto them, e.g. a cap, in particular a cap-shaped reflector. For this they are bent in particular perpendicular to the front.

The forwardly projecting flag areas may be overmoulded with plastic or may be exposed (not to be overmolded with plastic).

It is a further development that forwardly projecting, inner flag areas are located in front of or proximal to the contact fields, which facilitates assembly of the contact fields with light sources, which are then located in particular in a plane.

It is still a development that at least some forwardly projecting, inner flag areas have at least one contact field. This allows a spatial orientation of the light sources ("3D arrangement"). Additionally or alternatively, for the same purpose, at least some outer tab areas may have at least one electrical contact patch.

It may therefore be a particularly preferred embodiment for a 3D arrangement of the light sources that at least one contact field is located on a curved flag area.

It is also an embodiment that lateral areas are bent, in particular lateral areas of at least some to be bent (inner and / or outer) flag areas. The lateral areas are therefore not bent over the width of the (inner and / or outer) flag area, but in particular at least approximately in the longitudinal direction. The curved side areas thus form upstanding sidewalls.

It is a further development that the lateral areas of the flag areas to be bent are bent in a different direction to the flag areas. If, for example, a flag region is bent in a rearward direction or towards the rear, the associated at least one lateral region is bent forwards. This allows use of the lateral areas as in the finished state outboard fins or ribs for a Increase of a heat dissipation surface, in particular for increased convective cooling.

It is a further development that the lateral areas of the flag areas to be bent are bent in a direction identical to the flag areas. Thus, if a flag area is e.g. bent in a backward direction or to the rear, and the associated at least one lateral area is bent backwards. This allows use of at least one lateral region as an internal projection, in particular for thermal and / or electrical contacting, e.g. a driver. In particular, if a rear side of the heat sink is cup-shaped and serves as a cover of a driver housing, the driver can be contacted directly to produce a thermal and / or electrical connection by means of a lateral region (at least partially not overmolded) or at least one close electrical contact can be provided ,

It is still an embodiment that at least two of the flags have in the open central region protruding, remaining free noses. These lugs can serve as electrical contacts for a driver and can be contacted in particular via contact plugs. The lugs can be bent back for a simplified contacting, in particular if the heat sink serves as a cover for a driver housing.

It is still an embodiment that the plastic is a transparent plastic. Thus, light propagation is also allowed through the plastic, e.g. supports a wide-angle radiation.

The object is also achieved by a heat sink produced in this way.

The object is also achieved by a lamp which has a heat sink produced in this way.

The lamp is preferably a semiconductor lamp, that is, it has at least one semiconductor light source as the light source (s). The at least one semiconductor light source preferably comprises at least one light-emitting diode.

It is an embodiment that the semiconductor lamp has at least one semiconductor light source, which contacts two contact fields electrically directly. By eliminating a dedicated carrier (e.g., circuit board) for the at least one semiconductor light source, components can be saved and, further, thermal resistance between a semiconductor light source and the heat sink is significantly reduced, improving heat dissipation from the at least one semiconductor light source.

It is a development that the light-emitting diode is designed as a light-emitting diode housed. This can be advantageously connected by soldering with the appropriate contact fields. In particular, if the packaged light emitting diode is a bottom contactable LED, it may simply be placed on and attached to two adjacent contact pads of the heat sink contacting a respective bottom side contact of the housing. by soldering.

It is a development that the light-emitting diode as an LED chip, in particular LED nude chip or "bare die", is configured. Typically, a bottom side of the LED chip is a first electrical contact and the top side a second electrical contact. In particular in this case (but also for a top side and bottom side contacting housed light emitting diode), the LED chip can be placed on one of the electrical contact pads of the heat sink and fixed there and connected to another contact field, for. be connected via a bonding wire or other electrical connection.

It is also an embodiment that the semiconductor light source is formed as a sapphire chip. This can shine through its chip substrate, ie also shine backwards, which allows a broader light emission of the lamp, in particular in interaction with a translucent, in particular transparent, plastic encapsulation.

It is a further embodiment that the at least one semiconductor source is potted with translucent potting compound. This protects the light-emitting diodes, in particular wire-bonded LED chips.

The potting compound, e.g. Silicone, can be transparent, which causes a high luminous efficacy. Alternatively, the potting compound can be translucent (opaque), which allows a more even light emission.

It is also an embodiment that the potting compound is a phosphor-containing potting compound, that has at least one phosphor. The at least one phosphor may at least partially convert light emitted by the at least one semiconductor light source into light of another, typically longer, wavelength (also referred to as "wavelength conversion"). The

Wavelength conversion is well known and need not be further elaborated here.

The semiconductor light sources are preferably connected electrically in series, for example, for a flexible arrangement of the contact fields. If the contact fields connected to the driver are arranged next to one another, in particular a one-stranded row of semiconductor light sources can be realized. If, in particular, the contact fields connected to the driver are arranged opposite one another, the semiconductor light sources can be realized, for example, as two lines of semiconductor light sources of the same length.

It is still an embodiment that the heat sink serves as a cover for a driver housing of the semiconductor lamp. This allows a particularly compact arrangement and easy electrical connection to the driver.

The lamp is also preferably a retrofit lamp, in particular incandescent retrofit lamp or halogen retrofit lamp. This means that the lamp must at least approximately comply with an outer contour of the conventional lamp to be simulated, which involves particular difficulties with regard to effective heat dissipation and a compact design.

The above-described characteristics, features, and advantages of this invention, as well as the manner in which they will be achieved, will become clearer and more clearly understood in connection with the following schematic description of exemplary embodiments which will be described in detail in conjunction with the drawings. In this case, the same or equivalent elements may be provided with the same reference numerals for clarity.

1 shows in plan view of an upper side of a sheet metal part for punching out a plurality of heat sink prototypes;

2 shows in plan view a series of punched out of the sheet metal part heatsink prototypes, which are interconnected via a mitausgestanzten transport frame;

3 shows in plan view enlarged a heat sink prototype with transport lugs connecting the heat sink prototype to the transport frame;

4 shows a plan view of the heatsink prototype with bent-out outer flag areas;

5 shows the heat sink prototype with the bent-out outer flag areas in side view;

6 the heatsink archetype with the bent outboard flag areas and an additional plastic encapsulation;

7 shows the overmolded object 6 in a side view;

8th shows in plan view the molded heat sink 6 with an additional assembly with light-emitting diodes;

9 shows in plan view the molded heat sink 6 with an additional assembly with LED chips;

10 shows a plan view of the light-emitting diodes, encapsulated finished heat sink with an additional encapsulation of the LEDs;

11 shows the finished heat sink 10 in a side view;

12 shows a side view of a vertically aligned incandescent retrofit lamp with the finished heat sink as the cover of a driver housing;

13 shows a top view of a stamped heatsink prototype of a heat sink according to a second embodiment;

14 shows one too 4 analogous design of the heat sink prototype of the heat sink according to the second embodiment;

15 shows one too 6 analogous embodiment of the heat sink according to the second embodiment;

16 shows one too 8th analogous embodiment of the heat sink according to the second embodiment;

17 shows in plan view the heat sink according to the second embodiment in a following embodiment;

18 the heat sink off 17 in side view with an additional aufzusetzenden cap;

19 shows in plan view a heat sink prototype according to a third embodiment;

20 shows in plan view of the heat sink according to the third embodiment with bent side portions;

21 shows in plan view of the heat sink according to the third embodiment with following curved outer flag areas;

22 shows in plan view internal (proximal) flag areas of flags 405 a heat sink according to a fourth embodiment;

23 shows a side view of the flag areas, which are bent obliquely along a bending line;

24 shows in plan view internal flag areas of flags of a heat sink according to a fifth embodiment.

25 shows the along a bending line obliquely upwardly curved inner flag areas of the heat sink according to the fifth embodiment.

26 shows in plan view still another heatsink prototype for a heat sink according to a sixth embodiment;

27 shows in plan view still another heatsink prototype for a heat sink according to a seventh embodiment;

28 shows in plan view still another heatsink prototype for a heat sink according to an eighth embodiment.

1 shows in plan view a front side V of a formed as an aluminum strip, stampable sheet metal part 101 for punching out several heat sink prototypes. The sheet metal part 101 may in particular have a thickness of at least 1 mm. The sheet metal part 101 can be present for a large-scale production in particular as an endless belt or quasi-endless belt. Alternatively, however, another suitable metal may be used, for example copper or an aluminum or copper alloy, etc.

2 shows in plan view a series of from the sheet metal part 101 punched, identically shaped heatsink prototypes 102 as preforms of a heat sink 100 , which also has a sheet metal part 101 punched out transport frame 103 connected to each other. And that keeps the transport frame 103 the heat sink prototypes 102 on both sides via respective transport areas, hereinafter referred to as transport flags 104 be designated and which are separated in a subsequent separation. However, the heat sink prototypes become 102 preferably still with the transport frame 103 connected to the heat sink 100 educated.

3 shows in plan view in more detail the stamped heat sink prototype 102 with their transport flags 104 , The heat sink archetype 102 has several subregions or flags (here by way of example twelve) 105 on. The flags 105 are elongated and run in their longitudinal extension L radial or star-shaped on an open central area 106 the heat sink archetype 102 to. The flags 105 have a rectangular basic shape with a front side (proximal to the open central area 106 directed) tapering end.

Opposite sides of adjacent flags 105 hang over narrow bars 107 together. The bridges 107 are at least approximately arranged on a circle. The transport flags 104 are with their thin tips with a respective bridge 107 connected. Two of the transport flags 105 . 105a . 105b point in the central area 106 protruding noses 108 on.

4 shows in plan view another preform of the heat sink 100 in which the flags 105 have been reshaped. And that are external (distal) flag areas 109 (please refer 3 ) in a rearward direction or rearwardly (ie, into the plane of the page). The outer flag areas 109 are in relation to the central area 106 distal to the bars 107 or in the radial direction behind the webs 107 , The outer flag areas 109 begin proximally at an (imaginary) transition to the rejuvenation of the flags 105 so that there is also the bending edge or fold B and the flags 105 or the outer flag areas 109 across the entire width of the flag 105 is bent at this transition. The outer flag areas 109 are here bent at right angles, ie by about 90 °, to the rear and thereby form in the rearward direction an upstanding, circular ring of outer flag areas 109 , as in 5 shown.

In the in 6 and 7 The following step is shown in the 4 shown curved heatsink archetype 102 with a thermoplastic, electrically insulating plastic, for example of PBT / PET, overmoulded. The plastic extrusion 110 covered, as in 7 shown the outer flag areas 109 with which they have a circumferential and bottom-side except for the central area 106 continuous cup forms, in common.

In the 6 shown front side is also from the plastic extrusion 110 covered, the plastic extrusion 110 However, it has free areas there, namely at the webs 107 as well as at the tips of the flags 105 , which there each have an electrical contact field 111 form. The plastic extrusion 110 also reduces the central area 106 , to the end of the noses 108 ,

In a following step, at least some of the webs 107 (here all the bridges 107 ) between the flags 105 as well as between the nose 108 the flag 105a and the rest of the flag 105 be opened by the corresponding recesses, as the flags 105 through the plastic extrusion 110 held or fixed. This will be the electrical contact fields 111 electrically decoupled.

The by the separation of the webs 107 produced holes can be closed, for example, by a casting, for example based on silicone, for example with titanium oxide as a white filler.

As in 8th shown, the contact fields 111 Now be equipped with light emitting diodes, here with housed light-emitting diodes which can be contacted on the underside 112 , Because the contact fields 111 are arranged here in a substantially annular row, the light emitting diodes 112 expediently to each adjacent contact fields 111 put on and soldered with these, for example. This results in an electrically connected in series strand of light emitting diodes 112 , with this electrical path at the noses 108 is open and therefore by one's noses 108 applied potential difference (eg with a voltage and / or a current as an electrical command variable) is operable.

9 shows an alternative placement of the contact fields 111 with LED chips 113 , which are contactable on the underside and upper side. The LED chips 113 be on a respective contact field 111 applied, for example by chip bonding. The tops of the LED chips 113 are with a neighboring contact field 111 through bonding wires 114 connected. This results in one of the housed light-emitting diodes 112 analog electrical arrangement.

Generally, the sheet metal part 101 , at least in the field of contact fields 111 , suitably coated to secure attachment of light emitting diodes 112 or LED chips 113 to allow, for example by a so-called. "Selective plating", for example by means of a silver plating.

As in 10 shown, the front side V of the heat sink 100 at least in the field of contact fields 111 and the central area 106 with a translucent potting compound 115 be covered to the exposed metal 111 . 108 , the light-emitting diodes 112 or LED chips 113 as well as the bonding wires 114 to protect. The potting compound 115 , For example, silicone, here has phosphor as filler on to the light-emitting diodes 112 or the LED chips 113 radiated primary light (eg blue light) at least partially wavelength-convert (eg yellow light), wherein the primary light and the wavelength-converted light can mix to a (eg white) mixed light.

11 shows a side view of the now finished heat sink 100 with removed transport flags 104 ,

12 shows a semiconductor lamp in the form of a filament retrofit lamp H with a base S, a driver housing open to the front T, serving as a cover or cover for the driver housing T heatsink 100 and a translucent (transparent or opaque) bulb K arranged on the front side, overlying the light-emitting diodes K. The heat sink 100 is placed with its electrically isolated, shaped as a cup C back to the driver housing T, so that in the driver housing T befindlicher, on the socket S fedable driver (o.Fig.) Not additionally against the heat sink 100 needs to be electrically isolated. Electrical outputs of the driver, for example, two voltage outputs, for example, via electrical lines with a respective nose 108 be electrically connected and the light-emitting diodes 112 or 113 operate.

13 shows a top view of a stamped heat sink prototype 202 a heat sink 200 according to a second embodiment with transport flags 104 , The heat sink archetype 202 differs from the heat sink archetype 102 in that the noses 208 no longer at the top of the flags 105a . 105b but on opposite sides. In addition, the jetties 107 further arranged radially outward (more distal).

14 shows one too 4 analogous design of a heat sink prototype 202 with bent-back outer flag areas 109 ,

15 shows one too 6 analogous design of the heat sink 200 with an applied plastic extrusion 210 and open jetties 207 , Unlike the heat sink 100 now also remain respective inner (proximal) flag areas 216 the flags 105 showing the tips of the flags 105 have, from the plastic extrusion 210 free. The contact fields 211 are further outward than the contact fields 111 ,

16 shows one too 8th analogous design of the heat sink 200 by way of example as a packaged light-emitting diodes 112 designed semiconductor light sources. The bridges 107 are already open.

17 shows the heat sink 200 after a subsequent processing step, in which now the internal flag areas 216 have been bent over their width in the direction of the front side V (out of the sheet plane) or to the front, so that they stand up vertically (as well as in 18 shown). The outer flag areas 109 and the inside flag areas 216 are thus bent opposite. The in front V upstanding inside flag areas 216 serve as a holder for the clamping attachment of a cap 217 on the front V.

This cap 217 can on its outside lateral surface 218 For example, provide a specular or diffuse reflector surface for broader light emission and / or phosphor as a "remote phosphor".

The cap 217 may alternatively or additionally one (in particular central, to the open central area 106 adjoining) air duct 219 provide such that an air exchange between a driver receiving driver cavity of the driver housing T and the environment for heat dissipation from this driver cavity can take place. The driver housing T can also be open at another location (eg near the base S), so that a draft through the driver cavity is made possible for a particularly effective heat dissipation.

The heat sink 200 can at least partially like the heat sink 100 be further treated, for example, without providing a potting compound, but with removal of the transport flags 104 for isolation.

19 shows yet another heat sink archetype 302 (similar to the heat sink archetype 102 ) for a heat sink 300 according to a third embodiment. The flags 305 this heatsink original form 302 except for the transport flags 104 neighboring flags 305 a triangular in plan view, towards the open central area 106 slimming basic form. The flags 305 thus have in comparison to the flags 105 additional lateral areas 320 on the outer flag areas 309 on.

20 shows the heat sink 300 with side areas bent at right angles (into the sheet plane) 320 , The associated bending lines B2 are parallel to the longitudinal extent L of the flags 305 ,

21 shows the heat sink 300 following with the following right angles bent outward flag areas 309 , The outer flag areas 309 surrounded with their front V also the area of the flags 305 , which is intended to be equipped with LEDs. Consequently, the front of the outer flag areas 309 be used as a reflector surface, or the outer flag areas 309 can be overmoulded with a reflective plastic coating. In this way, a simple hollow reflector, in particular concave mirror, is provided. The outer flag areas 309 serve as cooling fins or cooling fins for increased heat dissipation.

22 shows internal (proximal) flag areas 416 of flags 405 a heat sink 400 according to a fourth embodiment. The interior flag areas 416 borders on an open central area 406 and can be bent along its width along a bend line B3. 23 shows obliquely bent interior flag areas 416 which simultaneously serve as contact fields. The flag areas are for obtaining a by each two inner flag areas 416 formed side bent obliquely along a bending line B4. As a result, for example, also light-emitting diodes 112 be arranged on a respective page. Each of the resulting four sides faces in a different direction, thereby providing a simple three-dimensional orientation or 3D orientation of the LEDs 112 results.

24 shows in plan view internal flag areas 516 of flags 505 a heat sink 500 according to a fifth embodiment. The interior flag areas 516 borders on an open central area 506 and can be bent along its width along a bend line B3. The interior flag areas 516 at the same time serve as contact fields. 25 shows along the bending line B3 obliquely bent, inner flag areas 416 , Their tips, which are the contact pads, are again bent horizontally to allow easy access to LED chips 513 with bonding wires 114 to be able to equip. For easy electrical contact is only every second flag 505 with a LED chip 513 stocked. The LED chips 513 can be electrically connected in series or in parallel.

The LED chips 513 are here designed as sapphire chips, which can radiate light on all sides, in particular through their sapphire substrate. The sapphire LED chips 513 are of a, in particular phosphor-containing, potting compound 115 Surrounded by the sapphire LED chips 513 receives broadly emitted light and also broadly radiates, and also by lateral column 522 between the interior flag areas 516 through in a backward direction. This improves a broad-angle radiation, in particular if the plastic encapsulation uses a transparent plastic.

26 shows yet another heat sink archetype 602 (similar to the heat sink archetype 102 ) analogous to 4 for a heat sink 600 according to a sixth embodiment. The heat sink archetype 602 differs thereby from the heat sink archetype 102 that the flags 605a and 605b (which the flags 105a and 105b correspond and are provided for contacting a driver) on their noses 608 one in the open central area 106 protruding contact projection 623 exhibit. These can be bent backwards so that they protrude into the cup C. As a result, the contact projection are suitable 623 as contact pins for particularly simple electrical contacting of a driver.

27 shows yet another heat sink archetype 702 (similar to the heat sink archetype 102 ) analogous to 3 for a heat sink 700 according to a seventh embodiment. The heat sink archetype 702 differs from the heat sink archetype 102 in that two, here by way of example opposite, flags 705 similar to the flags 305 two lateral areas each 720 on their outer flag areas 709 exhibit. However, these side areas become 720 along their bending lines B2 now bent backwards, and thus in the same direction as the outer flag areas 309 , The side areas 720 are therefore converted into an analogue 7 projecting cup C protrude and can contact the driver there. Because the flags 705 after severing the bars 107 can no longer be electrically connected to any contact field or are electrically separated from them, they can in particular serve as heat sinks, which conduct a waste heat generated by the driver to the outside and consequently can cool the driver reinforced.

28 shows yet another heat sink archetype 802 similar to the heat sink archetype 702 , for a heat sink 800 according to an eighth embodiment. Here are the ones with the side areas 720 equipped flags 805 now contact fields 111 on. These flags 805 are therefore additionally or alternatively to the heat dissipation for electrical contacting of the contact fields 111 and thus the LEDs 112 or 113 , In the opposite arrangement shown the flags contacting the driver (eg a positive pole and a negative pole thereof) 805 and thus their contact fields 111 Two parallel series circuits or strings of light emitting diodes can be realized. In this embodiment, the open central area 106 to be closed by the plastic encapsulation.

Although the invention has been further illustrated and described in detail by the illustrated embodiments, the invention is not so limited and other variations can be derived therefrom by those skilled in the art without departing from the scope of the invention.

LIST OF REFERENCE NUMBERS

100

heatsink

101

sheet metal part

102

Heatsink Archetype

103

transport frame

104

transport flag

105

Banner, flag

105a

transport flag

105b

transport flag

106

open central area

107

web

108

nose

109

outboard flag area

110

plastic extrusion

111

electrical contact field

112

led

113

LED chip

114

bonding wire

115

potting compound

200

heatsink

202

Heatsink Archetype

207

web

208

nose

210

plastic extrusion

211

Contact field

216

inside banner area

217

cap

218

lateral surface

219

air duct

300

heatsink

302

Heatsink Archetype

305

Banner, flag

305a

Banner, flag

305b

Banner, flag

309

outboard flag area

320

lateral area

400

heatsink

405

Banner, flag

406

open central area

416

plume area

500

heatsink

505

Banner, flag

506

open central area

513

LED chip

516

plume area

522

gap

600

heatsink

602

Heatsink Archetype

605a

Banner, flag

605b

Banner, flag

608

nose

623

contact projection

700

heatsink

702

Heatsink Archetype

705

Banner, flag

709

outboard flag area

720

lateral area

800

heatsink

802

Heatsink Archetype

805

Banner, flag

B

fold

B2

elastic line

B3

elastic line

B4

elastic line

C

cups

H

Incandescent retrofit lamp

K

piston

L

longitudinal extension

S

base

T

drivers housing

V

front

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• WO 2011/029724 A1 [0002, 0002]

Claims (15)

Method for producing a heat sink ( 100 ; 200 ; 300 ; 400 ; 500 ; 600 ; 700 ; 800 ) of a semiconductor lamp, comprising at least the following steps: - stamping a heat sink prototype ( 102 ; 202 ; 302 ; 602 ; 702 ; 802 ) with several over bridges ( 107 ; 207 ) related flags ( 105 ; 305 ; 405 ; 505 ; 605 ; 705 ; 805 ) of a sheet metal part; Bending at least some of the flags ( 105 ; 305 ; 405 ; 505 ; 605 ; 705 ; 805 ); - Overmoulding at least some of the flags ( 105 ; 305 ; 405 ; 505 ; 605 ; 705 ; 805 ) with an electrically insulating plastic ( 110 ; 210 ) such that in each case at least one electrical contact field ( 111 ; 211 ) remains free; - opening at least one of the webs ( 107 ; 207 ). The method of claim 1, wherein - punching comprises punching a plurality of identically shaped heat sink prototypes ( 102 ; 202 ; 302 ; 602 ; 702 ; 802 ) from the same sheet metal part ( 101 ) and - the heat sink prototypes ( 102 ; 202 ; 302 ; 602 ; 702 ; 802 ) with a transport frame ( 103 ) are connected. Method according to one of the preceding claims, wherein - the flags ( 105 ; 305 ; 405 ; 505 ; 605 ; 705 ; 805 ) are elongated and in their longitudinal extent (L) radially to an open central region ( 106 ; 406 ; 506 ), - adjacent flags ( 105 ; 305 ; 405 ; 505 ; 605 ; 705 ; 805 ) on opposite sides via at least one web ( 107 ; 207 ) and - at least some of the flags to be bent ( 105 ; 305 . 605 ; 705 ; 805 ) at least at a respective outer flag area ( 109 . 309 . 709 ) outside the footbridges ( 107 ; 207 ) are bent over their width. Method according to claim 3, wherein at least some outer flag areas ( 109 ; 709 ) are bent in a rearward direction and with the electrically insulating plastic ( 110 ) are sprayed together. Method according to one of claims 3 or 4, wherein at least some outer flag areas ( 309 ) are bent in a front-side direction. Method according to one of claims 3 to 5, wherein at least some of the flags ( 105 . 405 . 505 ) on internal flag areas ( 216 ; 416 ; 516 ) within the bars ( 107 . 207 ) are bent over their width in a front-side direction. Method according to one of claims 3 to 6, wherein lateral areas ( 320 ; 720 ) at least some of the flag areas to be bent ( 309 ; 709 ) are bent. Method according to one of claims 3 to 7, wherein at least two of the flags ( 105 ; 305 ; 405 ; 505 ; 605 ; 705 ; 805 ) in the open central area ( 106 ; 406 ; 506 ) projecting, remaining noses ( 108 ; 208 ; 608 ; 623 ) exhibit. Method according to one of the preceding claims, in which the plastic ( 115 ) is a transparent plastic. Method according to one of the preceding claims, wherein at least one contact field on a curved flag area ( 416 ; 516 ) is located. Heatsink of a semiconductor lamp (H), wherein the heat sink ( 100 ; 200 ; 300 ; 400 ; 500 ; 600 ; 700 ; 800 ) has been prepared by a method according to any one of the preceding claims. Semiconductor lamp (H), in particular retrofit lamp, comprising at least one semiconductor light source ( 112 ; 113 ; 513 ) and a heat sink ( 100 ; 200 ; 300 ; 400 ; 500 ; 600 ; 700 ; 800 ) according to claim 11, wherein the at least one semiconductor light source ( 112 ; 113 ; 513 ) two contact fields ( 111 ; 211 ) contacted directly electrically. Semiconductor lamp (H) according to claim 12, in particular with a heat sink ( 100 ; 200 ; 300 ; 400 ; 500 ; 600 ; 700 ; 800 ) according to claim 4, wherein the heat sink ( 100 ; 200 ; 300 ; 400 ; 500 ; 600 ; 700 ; 800 ) serves as a cover (C) for a driver housing (T) of the semiconductor lamp (H). Semiconductor lamp (H) according to one of Claims 12 or 13 with a heat sink ( 500 ) according to claim 9, wherein the semiconductor light source ( 513 ) is formed as a sapphire chip. Semiconductor lamp (H) according to one of claims 12 to 14, wherein the at least one semiconductor source ( 112 ; 113 ; 513 ) with phosphorus-containing potting compound ( 115 ) is shed.

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