DE102011011849B8 - Anordnung zur Kühlung von Wärme erzeugenden Bauteilen auf einem Systemboard eines Computersystems, derartiges Systemboard sowie derartiges Computersystem - Google Patents

Anordnung zur Kühlung von Wärme erzeugenden Bauteilen auf einem Systemboard eines Computersystems, derartiges Systemboard sowie derartiges Computersystem Download PDF

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Publication number
DE102011011849B8
DE102011011849B8 DE102011011849A DE102011011849A DE102011011849B8 DE 102011011849 B8 DE102011011849 B8 DE 102011011849B8 DE 102011011849 A DE102011011849 A DE 102011011849A DE 102011011849 A DE102011011849 A DE 102011011849A DE 102011011849 B8 DE102011011849 B8 DE 102011011849B8
Authority
DE
Germany
Prior art keywords
computer system
board
arrangement
cooling heat
generating components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102011011849A
Other languages
English (en)
Other versions
DE102011011849B4 (de
DE102011011849A1 (de
Inventor
Roland Treffler
Werner Sausenthaler
Martin Schmutzer
Georg Ahn
Klaus Scharr
Michael Riebel
Philipp Rauw
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Client Computing Ltd
Original Assignee
Fujitsu Technology Solutions Intellectual Property GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Technology Solutions Intellectual Property GmbH filed Critical Fujitsu Technology Solutions Intellectual Property GmbH
Priority to DE102011011849A priority Critical patent/DE102011011849B8/de
Priority to PCT/EP2012/052792 priority patent/WO2012113730A1/de
Publication of DE102011011849A1 publication Critical patent/DE102011011849A1/de
Application granted granted Critical
Publication of DE102011011849B4 publication Critical patent/DE102011011849B4/de
Publication of DE102011011849B8 publication Critical patent/DE102011011849B8/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/40—Casings; Connections of working fluid
    • F04D29/52—Casings; Connections of working fluid for axial pumps
    • F04D29/54—Fluid-guiding means, e.g. diffusers
    • F04D29/541—Specially adapted for elastic fluid pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/582—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE102011011849A 2011-02-21 2011-02-21 Anordnung zur Kühlung von Wärme erzeugenden Bauteilen auf einem Systemboard eines Computersystems, derartiges Systemboard sowie derartiges Computersystem Active DE102011011849B8 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE102011011849A DE102011011849B8 (de) 2011-02-21 2011-02-21 Anordnung zur Kühlung von Wärme erzeugenden Bauteilen auf einem Systemboard eines Computersystems, derartiges Systemboard sowie derartiges Computersystem
PCT/EP2012/052792 WO2012113730A1 (de) 2011-02-21 2012-02-17 Anordnung zur kühlung von wärme erzeugenden bauteilen auf einem systemboard eines computersystems, derartiges systemboard sowie derartiges computersystem

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102011011849A DE102011011849B8 (de) 2011-02-21 2011-02-21 Anordnung zur Kühlung von Wärme erzeugenden Bauteilen auf einem Systemboard eines Computersystems, derartiges Systemboard sowie derartiges Computersystem

Publications (3)

Publication Number Publication Date
DE102011011849A1 DE102011011849A1 (de) 2012-08-23
DE102011011849B4 DE102011011849B4 (de) 2012-09-20
DE102011011849B8 true DE102011011849B8 (de) 2012-11-15

Family

ID=45688502

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102011011849A Active DE102011011849B8 (de) 2011-02-21 2011-02-21 Anordnung zur Kühlung von Wärme erzeugenden Bauteilen auf einem Systemboard eines Computersystems, derartiges Systemboard sowie derartiges Computersystem

Country Status (2)

Country Link
DE (1) DE102011011849B8 (de)
WO (1) WO2012113730A1 (de)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20309697U1 (de) * 2002-06-28 2003-10-02 Heidrich Matthias Kühleinrichtung für Computerkassen
DE19861388B4 (de) * 1997-03-03 2007-08-02 Inclose Design, Inc., Campbell Vorrichtung zum Kühlen einer elektronischen Einrichtung
DE202010012201U1 (de) * 2010-09-04 2010-11-25 Telemeter Electronic Gmbh Kühlkörper mit integriertem Lüfter

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7242172B2 (en) * 2004-03-08 2007-07-10 Intel Corporation Microprocessor die with integrated voltage regulation control circuit
US7766074B2 (en) * 2006-05-12 2010-08-03 Cpumate Inc. Heat-dissipating device having air-guiding structure
CN101255875B (zh) * 2007-02-27 2011-08-24 鸿富锦精密工业（深圳）有限公司 可摆动的风扇固定装置
US7874348B2 (en) * 2008-09-01 2011-01-25 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Fan holder

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19861388B4 (de) * 1997-03-03 2007-08-02 Inclose Design, Inc., Campbell Vorrichtung zum Kühlen einer elektronischen Einrichtung
DE20309697U1 (de) * 2002-06-28 2003-10-02 Heidrich Matthias Kühleinrichtung für Computerkassen
DE202010012201U1 (de) * 2010-09-04 2010-11-25 Telemeter Electronic Gmbh Kühlkörper mit integriertem Lüfter

Also Published As

Publication number Publication date
DE102011011849B4 (de) 2012-09-20
WO2012113730A1 (de) 2012-08-30
DE102011011849A1 (de) 2012-08-23

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R012 Request for examination validly filed
R084 Declaration of willingness to licence
R016 Response to examination communication
R018 Grant decision by examination section/examining division
R020 Patent grant now final

Effective date: 20121221

R081 Change of applicant/patentee

Owner name: FUJITSU CLIENT COMPUTING LIMITED, JP

Free format text: FORMER OWNER: FUJITSU TECHNOLOGY SOLUTIONS INTELLECTUAL PROPERTY GMBH, 80807 MUENCHEN, DE

Owner name: FUJITSU CLIENT COMPUTING LIMITED, KAWASAKI-SHI, JP

Free format text: FORMER OWNER: FUJITSU TECHNOLOGY SOLUTIONS INTELLECTUAL PROPERTY GMBH, 80807 MUENCHEN, DE

R082 Change of representative

Representative=s name: EPPING HERMANN FISCHER PATENTANWALTSGESELLSCHA, DE