DE102010013348A1 - Method for manufacturing printing stencil with substrate side and squeegee side from stencil body using ablation laser, involves introducing recess into stencil body of substrate side, and representing print pattern by through hole - Google Patents

Abstract

The method involves inserting a stencil body (102) into a through hole by a printing stencil. A recess is introduced into the stencil body of the substrate side to manufacture a bridge for stabilizing the printing stencil in a region of the through hole that represents a print pattern. The through hole is located with a stencil material-handling part of the stencil body, and the printing stencil is made of metallic stencil metal sheet. The printing stencil is provided by wafers i.e. solar cell wafers, ceramic substrates, and/or glass substrates. Independent claims are also included for the following: (1) a device for manufacturing a printing stencil with a substrate side and a squeegee side from a stencil body, comprising a retention unit (2) a printing stencil comprising a bridge.

Description

The invention relates to the production of printing stencils for the precise printing of flat substrates with printing media. In particular, the invention relates to the production of printing stencils by means of laser ablation.

The substrates to be printed can be, for example, printed circuit boards or solar cells, or they can also be ceramic circuit carriers produced by hybrid printing. For printing, pasty printing media are often used, for example in the form of etching pastes, solder pastes or conductive pastes. For example, silver conductive pastes can be used for printing on solar cells. For printing, the pasty printing medium is pressed into and through openings of the printing stencil on the substrate. The openings of the template represent about the later line image. After applying the print medium, the stencil is removed, leaving the print medium on the substrate.

It is one of the general requirements of stencil printing to print the print medium precisely in position (position and shape) as well as in thickness on the substrate. When removing the template, it should be easy to separate from the print medium. At the same time, the costs for producing the template (s) should be low. The service life of the stencils should be as long as possible. The latter is an important aspect in particular with abrasive printing media, such as, for example, with metal-containing pastes. The increasing miniaturization of the structures to be printed is also a constant challenge to the development of improved stencil making processes.

An important requirement for stencil manufacturing processes is still design freedom, i. H. the method should allow the production of templates for any printed images. However, certain required printed images may cause the stencils to become inaccurate, have a shorter service life and / or be difficult to remove. For example, solar cells are often to be printed with long current paths, which requires corresponding structures in the printing stencil, namely elongated polylines. However, these tend to destabilize the template, i. H. The template warps and / or is no longer exactly plan (the edges of a line are not exactly at a height), whereby the precision of the printed image suffers. To prevent this, therefore, bridges are often provided over a polyline, which connect the opposite edges of the template together to stabilize them so. The paste is pressed under the bridges, so that in the printed image nevertheless a continuous polyline is created.

One known method of making printing stencils involves the etching of stencils. However, the achievable accuracy of etched stencils is relatively low. In electrochemical processes, structures are fabricated by a phototechnical process in conjunction with an electrochemical deposition process. Here, a higher accuracy and quality of the breakthroughs can be achieved, however, such methods are complex and therefore expensive. With laser cutting technology, it is possible to achieve a high accuracy in the pad (printing pattern) size of typically ± 3 μm (micrometers) and the pad position of typically ± 20 μm, and it is also possible to use very small openings with diameters d ≥ 30 microns can be achieved. However, laser cutting at each edge leaves a small burr that needs to be removed, and grooves on the walls of the apertures parallel to the laser beam inevitably form, degrading the firing behavior. Thus, a reworking of the stencils by means of brushing and / or electropolishing is required. Post-processing increases the overhead of stencil making and, in addition, adversely affects the quality of the stencils; Thus, there is a reduction in sheet thickness of 1-2 microns when brushing or a reduction in sheet thickness up to 10 microns and an undesirable increase in the pad area during electropolishing.

In the screen printing process, printing stencils are used in which a cover layer is applied to a usually homogeneous screen fabric, in which the printing pattern is represented. The presence of the mesh enhances stability and allows design freedom, i. H. Very long or fine structures or even islands can be formed in the printed image, which are completely surrounded by exposed areas. However, the production of such, often two-layer and made of different materials template is complex. For very small structures, a very fine mesh must be used; This leads usually, in addition to higher costs, in turn, a lower stability and accuracy of the template.

In the field of printed circuit board assembly, improvements of the reject rate in the production of printing stencils by a few percent are economically significant for the high numbers required here. At the same time, there is a high pressure to be able to print ever more precise microstructures due to the progressive miniaturization in printed circuit board manufacturing. The tolerances for template thickness and size of the apertures in The template is so small that in many manufacturing processes a costly rework to meet the tolerances is required. Limitations of design freedom result from the roughness of the walls of the apertures, with Pad base areas in relation to the surface of the walls must have a certain minimum size to ensure even more complete triggering.

In the field of metallization of solar cells, a high aspect ratio (height: width) is of particular importance, since the current-collecting structures are located on the side of the solar cell facing the light. By means of a high aspect ratio it can be achieved that the line cross-section is high, while at the same time minimizing the solar cell area covered by the contacts and thus shaded. In the case of selective doping, the surface of the solar cell is highly doped under the contacts and in the regions in which the sunlight falls on the contacts, the doping is chosen to be lower. The yield of the solar cell thereby improves, but finger structures with a particularly high lateral adjustment precision are required. This means that the stencils must be very precisely worked and must remain stable even with a variety of elongated lines with a small line width in the print pattern.

In the DE 10 2007 059 794 A1 a known method for the production of screen printing stencils is described in which a stencil body consists of a single, for example. Metallic carrier substrate. A carrier network consisting of recesses is worked out of the template body on the squeegee side. In a further operation, the structure to be printed on the substrate side is then worked out by depressions from the template body. At the locations where the fronts of the recesses of both sides meet in the template body, openings are created for a pasty screen material or printing medium.

With the described method islands can be realized in the layout, i. H. there is design freedom. The stability and integrity of the template is ensured by the net-like support structure. However, this method is expensive. Thus, in a first operation, the stencil body is processed from the doctor side, and is then processed in a second operation from the substrate side. The process must be controlled very precisely in order to achieve the breakthroughs in the printing template with the desired accuracy. Therefore, the method requires an elaborate machine with complex control and facilities that allow the stencil body to be machined from both sides. Stencil making with such a machine is a time consuming process.

An object of the invention is to provide techniques for the production of printing stencils, which allow the efficient and cost-effective production of printing stencils that allow a precise print image with the greatest possible freedom of design and at the same time have a long service life.

This object is achieved by a method for producing a printing stencil having a substrate side and a doctor side according to the appended claim 1. The method comprises the steps of inserting a depression in the template body from the substrate side to form a bridge, the bridge serving to stabilize the pressure template in the region of a passage opening through the pressure template; and inserting the through hole in the stencil body. Alternatively, the method includes the steps of inserting a through-hole through the stencil sheet into the stencil body; and inserting a depression in the template body from the substrate side to form a bridge for stabilizing the pressure stencil in the region of the passage opening. In this case, a print pattern is always represented by the passage opening.

The described approach allows numerous advantageous embodiments, which lead to a simpler, faster and / or more cost-effective production methods for printing stencils compared with the prior art. Some expedient embodiments are represented in the subclaims.

In this method, both the step of inserting the recess and the step of inserting the through hole can be performed by laser methods. In particular, a laser ablation method can be used both for the step of inserting the recess and for the step of inserting the through opening. As a result, the advantages of laser processing can be utilized, such as the high precision of the structures. In particular, laser ablation also permits post-processing to be minimized because, for example, no scoring occurs. In other embodiments of the method, however, a laser cutting can be used to insert the through holes. In a supplementary operation, a smoothing of the walls and / or edges of the through openings can be made approximately with a laser.

If a plurality of bridges and / or through holes are to be formed, one step may be required or several steps of inserting recesses are performed together with one or more steps of inserting the through holes in one operation. Here, about one or more steps of inserting recesses may be performed alternately with one or more steps of inserting the through holes. The inventive method is thus simpler than conventional methods which require several operations, for example the production of apertures on the one hand and of bridges on the other hand in different operations.

In certain embodiments of the method, the passage opening is inserted from the substrate side into the template body. Thus, a processing of the template body omitted from the doctor side.

The step of inserting the passage opening may comprise a material-removing machining of the template body, for example by laser ablation. The disadvantages of intersecting methods can thus be avoided. It is for the production of bridges such as breakthroughs only a material-processing process required.

The printing stencil can be produced from a single-layer and one-piece stencil body, in particular a metallic stencil sheet. A multi-layered or multi-component stencil body as in some screen printing methods is not required, yet a high stability of the stencil sheet can be achieved.

The printing stencil can be provided for printing on wafers, in particular solar cell wafers, ceramic substrates, and / or glass substrates. Alternatively or additionally, the passage opening for the pressure of a long Linienzuges, in particular a conductor track, be provided. The method can thus be used for numerous applications requiring high precision and / or long service life.

In certain embodiments of the method, the depression to be introduced is suitable for pressing paste, in particular silver-conducting paste, into the through-opening and under the bridge so that a continuous printed image, in particular a printed conductor, is produced. The bridge may have a width of the passage opening corresponding or smaller bridge width. In particular, with a width of the passage opening of 100 micrometers to 150 micrometers, a bridge width of 60 micrometers to 100 micrometers may be present. The bridge may have a depth between 10 percent and 90 percent, preferably between 50 percent and 90 percent, of the thickness of the stencil.

The above object is further achieved by an apparatus for producing printing stencils by a method as described above. Such a device may include a holding device for holding the stencil body during its processing for producing the printing stencil; and a control device for controlling the machining operation. Particular embodiments of the device include in particular an ablation laser. This can be used both for the introduction of depressions in the substrate side of a template body as well as for inserting through holes in the template body during processing, which allows a device compared to known machines simplified.

The above object is further achieved by the use of an ablation laser for producing a stencil sheet having a substrate side and a squeegee side from a stencil body. In this case, the ablation laser is used to introduce a recess in the template body from the substrate side for the production of a bridge, wherein the bridge is used to stabilize the printing stencil in the region of a passage opening through the printing stencil. In particular, one and the same ablation laser can be used to insert the recess into the template body and to insert the passage opening into the template body, thus allowing for simplified template fabrication by utilizing the advantages of laser ablation processing.

The above object is also achieved by a printing stencil which is produced by one of the methods described above or by one of the devices described above. In particular, such a pressure stencil may have an area with at least one passage opening stabilized by at least one bridge, in particular for printing a long conductor track, wherein the pressure stencil is free of screen pattern at least in this area. Certain printing stencils according to the invention have properties that result from the fact that the at least one through-hole was inserted by laser ablation without post-processing.

The above object is achieved by a device for printing on substrates, in particular wafers or glass substrates, the device having a printing stencil as described above. Such a device may include a holding device for holding the substrate to be printed; a Curing means for curing the printed substrate; and a controller for controlling the printing operation.

The above object is finally achieved by a substrate product, in particular a solar cell, which has been printed by a printing stencil as described above.

The invention will be further explained by means of embodiments which will be described with reference to the accompanying drawings. Hereby shows:

1 in schematic form an apparatus for producing a printing stencil with an ablation laser,

2 one with the device off 1 produced printing template in plan view;

3 a section through the stencil printing 2 ;

4 a flowchart for illustrating an operation of the device from 1 ;

5 a section through a template body in a first state of processing by the device 1 ;

6 a section through the template body 2 in a second state of processing by the device 1 ;

7 in schematic form, a device for printing on solar cells using a device with the 1 produced printing template.

The following description is not to be understood that the invention would be limited to the described embodiments. Rather, these examples are merely non-limiting explanations of various aspects of the invention. However, the invention is not limited to the described embodiments and their useful details.

In the figures, the same and equivalent elements are given the same reference numerals.

1 shows an embodiment of a device 100 for producing a printing stencil from a (schematically indicated) stencil body 102 , The device 100 includes a basic structure 104 as well as a positioning device 106 for holding and possibly conveying the template body 102 , A holding arm 108 holds an ablation laser 110 for processing the template body 102 , The holding arm 108 can be movable. The device 100 also has a central control unit 112 for controlling the laser 110 , the positioning device 106 and possibly the holding arm 108 ,

The device 106 has schematically indicated means 114 around the template body 102 in the working area of the laser 110 to transport and there in a suitable position relative to the laser 110 to keep. The appropriate action of the laser 110 on the template body 102 Optionally, by actively controlling the movement of the laser 110 and / or facilities 114 through the control unit 112 be controlled, so for each processing step, the required mutual positioning of the laser 110 with the template body 102 sure. The control unit 112 continues to control an intensity and / or beam duration of the laser 110 and thus a corresponding processing action on the template body 102 , A feedback of the current processing status on the further processing can also by the control unit by sensors not shown 112 to be controlled.

Before the invention essential aspects of the processing of the template body 102 through the device 100 be described in more detail, show the 2 and 3 a processing result, ie a section of a printing template 200 which is believed by the device 100 from the template body 102 was produced. Although the template 200 may have a variety of structures, these are omitted for clarity. To make clear advantages of the invention, it is sufficient to consider the introduction of a single, elongated trace, as may be required for printing solar cells, for example. In 2 is an elongated opening 202 shown for the pressure of such a long conductor track. The opening 202 consists of sections 204 . 206 and 208 , where edges 214 and 216 the opening 202 through bridges 210 and 212 are stabilized.

3 shows a section through the printing template 200 of the 2 along the section line AA marked there. The printing template 200 has a substrate side (bottom) 302 and a squeegee side (top side) 304 on. The bridges 210 and 212 span the breakthrough opening 202 with the sections 204 . 206 and 208 , The bridges 210 and 212 close the plan with the squeegee side 304 but have a depth 306 that is 10% (percent) to 90% of the thickness 308 the printing template 200 (or the template body 102 ) having. A thickness 308 the template 200 can be for example 100 microns. The bridge depth 306 can usually be between 50% to 90% of the template thickness 308 be; Thinner bridges are often mechanically unstable and do not sufficiently improve or even tear the instability of the stencil.

An operation of the device 100 out 1 for producing the printing template 200 from the template body 102 will now be described with reference to the flowchart of 4 described in more detail. It is assumed that the template body 102 is a single-layer and one-piece body, namely a metallic stencil sheet. For the production of the printing stencil 200 from the template body 102 becomes the only material-processing tool of the ablation laser 110 used.

In step 402 becomes the template body 102 in the working area of the ablation laser 110 positioned. In step 404 puts the control unit 112 determines whether the revision of the template body 102 is finished, that is the template body 200 was produced. If this is not the case, the next processing step is triggered, either in the preparation of a recess in step 406 or the preparation of an opening or passage opening in the step 408 consists.

For the production of in the 2 and 3 shown structure 202 For the sake of clarity, it is assumed by way of example (without this should be construed as a limitation) that initially two steps in the consolidation process 406 be carried out sequentially, and then three Durchbrechungsschritte 408 be carried out sequentially. These steps 406 and 408 be based on the 5 respectively. 6 each explained in more detail. Each of the steps 406 and 408 is generally repositioning of the laser 110 opposite the template body 102 without explicitly being discussed in the following.

The 5 shows the template body 102 in a section, which is the section line AA of the (later) printing template 200 out 2 equivalent. At the beginning of the processing of the template body 102 lies the structure 202 Of course not yet. For clarification, the squeegee side 304 and substrate side 302 the later printing template 200 in 5 indicated. In a first step 406 becomes the ablation laser 110 positioned and operated to a recess or depression 502 in the template body 102 from the substrate side 302 to bring in here. The remaining material 506 later forms the bridge 210 as will become more apparent below. After that, in a further step 406 in the same way another depression 504 in the template body 102 brought in. Again, the remaining material forms 508 later a bridge, namely the bridge 212 ,

Based on 6 become the steps 408 explained in more detail. 6 shows in schematic form the template body 102 in the same position as in 5 , You can see them in the steps 406 already made recesses 502 and 504 , In or three steps 408 becomes the ablation laser 110 (not shown here) positioned and operated to the openings or through holes 204 . 206 and 208 in the template body 102 insert. That's how it forms in the steps 406 let stand material 506 and 508 after forming the openings 204 . 206 and 208 the bridges 210 and 212 and it forms in the 2 shown structure 202 out.

Regarding the sequence of steps 406 and 408 is in 4 through arrows 410 . 412 . 414 clarifies that these individual steps through the ablation laser 110 can be performed in any order. In the 5 and 6 is shown a process in which the ablation laser 110 first in several consecutive steps 406 one or more recesses for the later bridges made (arrow 410 in 4 ), and then in one or more consecutive steps the openings 204 . 206 and 208 inserts (arrow 412 in 4 ).

In another embodiment, it would also be conceivable that the ablation laser structures in the template body 102 so incorporated, that the number and duration of the repositioning of ablation laser 110 and stencil body 102 is minimized relative to each other, so as to total the production time for the printing stencil 200 to minimize. This would then take steps in the general case 406 and 408 alternate (arrow 414 in 4 ). For the production of the structure 202 the template 200 out 2 would, for example, unlike in the 5 and 6 shown, for example, first the breakthrough opening 204 inserted, then the bridge 210 by making the recess 502 made, then the passage opening 206 inserted, followed by the removal of material for the production of the recess 504 , and finally the through hole 208 in the template body 102 inserted. Another order of the processing steps is also conceivable. Thus, according to the invention, a processing sequence can be determined flexibly and under consideration of other production or operating conditions.

While, as stated above, in principle, the order of processing steps is arbitrary, but all structures, whether recess for bridge or breakthrough, can be inserted in one operation. For this purpose, only a material-processing working instrument (ablation laser) is required. Also, all can Restrict processing steps to access the template body from the substrate side. This simplifies the structure of the 1 shown example device 100 on units for processing or structuring the squeegee side 304 can do without; about a second laser is not necessary. Nor is there any means for turning over the stencil body 102 necessary. Overall, the production of a printing stencil considerably simplifies or shortens compared to previous methods.

Referring again to 4 , puts the control unit 112 in step 404 fixed that the processing of the template body 102 is finished, ie the stencil 200 is made, this is in the step 416 from the device 100 output. In the basic process as in 4 shown further operations can be integrated. If necessary, z. As a post-processing of the introduced or inserted structures are performed, for example, a smoothing of the edges or walls of the openings and / or bridges. However, since an ablation laser is used for all working steps in the embodiment of the invention shown in the figures, reworking should generally be minimal or completely superfluous here. Thus, it is to be expected that in the case of laser ablation, the roughness of the walls due to scoring or ridge formation at the edges is low or does not occur at all; Therefore, a post-processing can be omitted and it is still possible, for example, a problem-free release of the printed on a substrate paste from the stencil.

In particular, it has been found that laser ablation, for example using picosecond lasers, enables pulses of high power and extremely short duration, so that the heat input into the workpiece is negligible. Due to the short pulse duration, energy is only introduced into the part of the surface of the workpiece which is hit by the laser beam. If, on the other hand, the energy supply within the pulse duration is correspondingly high, the heat fraction sublimates without further heat input and consequent damage to the surrounding or in-depth material. Laser ablation thus enables the removal of matter by sublimation, without heating up the remaining workpiece and thus damaging it. The removal depth per pulse usually moves in the range between 0.1 μm to 1.5 μm. Any shape can be achieved by repeated ablation. By correspondingly frequent driving over the desired contour with the laser beam material is removed until, for example, a complete breakthrough has occurred. Including machining times and other parameters, an ablation laser is an excellent tool for stencil production.

The laser ablation allows a high quality of the edges, d. H. it creates burr-free edges and smooth walls; In particular, the typical for laser cutting grooves pattern breakthrough walls can be avoided. An advantage of the method proposed here is that breakthroughs can be worked out exactly, for example, exclusively using an ablation laser (but also several ablation lasers) and the printing template on the doctor blade side can have identical, high qualities, as on the substrate side. Post-processing is not required in principle for this purpose. A production process without rework means a faster and less expensive stencil production with improved adherence to narrow tolerances (for example in the range of a few μm).

It should be noted that in certain embodiments of the invention, the insertion of through holes can also be wholly or partially from the doctor side. The method according to the invention can thus be used, for example, in printing stencil production devices which have two material-processing devices, for example two opposing ablation lasers. In some cases, it may be sufficient merely to reprogram conventional manufacturing devices for carrying out the method according to the invention.

While in the above embodiments, both the recesses under the bridges and the through holes are made by laser ablation, it is also conceivable that at least one of these steps is realized by another technique. Thus, for example, the insertion of passage openings can be implemented by a conventional laser cutting method. In principle, it is also conceivable to use one and the same laser for introducing the depressions under the bridges by means of laser ablation and for inserting the passage openings by means of laser cutting. If under certain circumstances the resulting increased roughness of the walls and increased burr formation is not important, u. U. accelerated stencil making be brought about.

According to the method described here, it is proposed to form the bridges which may be necessary for stabilizing a printing stencil in a novel manner, namely by attaching a recess from below, that is to say from the substrate side, into the stencil body. This can be done before the insertion of openings, after, or parallel, as discussed above. The proposed method is suitable in principle for the production of any printing structures, even for exposed islands, which would be stabilized by bridges. An additional screen fabric on the squeegee side of the stencil would not be required. However, it is also possible to easily process stencil bodies provided with a screen cloth. Thus, the inventive method can be limited to accesses from the substrate side, so that the presence of a screen fabric on the doctor blade side is to be considered only for the insertion of openings, ie the duration or intensity of the ablating laser beam must be selected accordingly.

On the other hand, the method according to the invention can also be used to form a screen fabric on the squeegee side. This could be trained in an upstream (or downstream) operation.

The method according to the invention can simplify the control of the printing stencil production. In manufacturing processes that attack from the substrate and squeegee sides, the operations from both sides often need to work together to create the desired breakthroughs. This requires precise depth control. If a method according to the invention is restricted to access from the substrate side, only control of the bridge depth and the aperture is required. However, the bridge depth generally does not require as much precision as the positioning of the actual printing structures. And when inserting the through openings, a controller merely needs to ensure that a breakthrough in the depth of the template body is actually made.

7 shows a device 700 for printing on solar cells using the template 200 the previous figures. The device 700 includes a positioning device 702 for positioning a solar cell to be printed 704 , a paste feeder 706 and a curing device 708 , The printing of the solar cell 704 with a conductor pattern, which passes through the printing template 200 is represented by correct positioning of the solar cell 704 opposite the printing template 200 , This process is performed by the control unit 710 controlled. Through the paste feeder 706 Then a pasty printing medium such as silver conductive paste in the through holes and under the bridges of the template 200 pressed. After that, the template becomes 200 from the solar cell 704 solved and the applied print image is through the curing device 708 hardened. The latter device can be designed, for example, for UV curing and / or thermal curing of the printed image.

A printing stencil produced by a method according to the invention can be characterized by edges and walls of the openings with particularly low roughness, without the need for a corresponding post-processing would be required. This means that the precision of the structures is high without the printing stencil being pre-damaged by post-processing. Thus, for example, the on the solar cell 704 printed structures have a high aspect ratio, without causing difficulties in triggering. The undamaged printing template 200 can be longer in use than would be the case with previously damaged stencils, with the resulting advantages for the operation of the printing press 700 ,

The embodiments illustrated here represent only some expedient embodiments of the invention. In addition, within the scope of the invention, as indicated by the following claims, many other embodiments by skilled action conceivable.

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• DE 102007059794 A1 [0009]

Claims (24)

A method of producing a printing stencil comprising a substrate side and a squeegee side from a stencil body, characterized by the following steps: - introducing ( 406 ) of a well ( 502 . 504 ) in the template body ( 102 ) from the substrate side ( 302 ) to make a bridge ( 210 . 212 ), the bridge ( 210 . 212 ) for stabilizing the printing stencil ( 200 ) in the region of a passage opening ( 202 . 204 . 206 . 208 ) through the printing template ( 200 ) serves; and - paste ( 408 ) of the passage opening ( 202 . 204 . 206 . 208 ) in the template body ( 102 ); or characterized by the following steps: - insert ( 408 ) a passage opening ( 202 . 204 . 206 . 208 ) through the printing template ( 200 ) in the template body ( 102 ); and - introducing ( 406 ) of a well ( 502 . 504 ) in the template body ( 102 ) from the substrate side ( 302 ) to make a bridge ( 210 . 212 ) for stabilizing the printing stencil ( 200 ) in the region of the passage opening; the passage opening ( 202 . 204 . 206 . 208 ) represents a print pattern. Method according to claim 1, characterized in that in the case of a plurality of bridges ( 210 . 212 ) and / or passage openings ( 202 . 204 . 206 . 208 ) one or more steps of introduction ( 406 ) of wells together with one or more steps of insertion ( 408 ) of the through holes are carried out in one operation. Method according to claim 2, characterized in that one or more steps of introducing ( 406 ) of wells alternately with one or more steps of insertion ( 408 ) of the through holes are performed. Method according to one of the preceding claims, characterized in that the step of inserting ( 408 ) of the passage opening ( 202 . 204 . 206 . 208 ) material-removing processing of the template body ( 102 ). Method according to one of the preceding claims, characterized in that the passage opening ( 202 . 204 . 206 . 208 ) from the substrate side ( 302 ) into the template body ( 102 ) is inserted. Method according to one of the preceding claims, characterized in that both the step of introducing ( 406 ) of the depression ( 502 . 504 ) as well as the step of inserting ( 408 ) of the passage opening ( 202 . 204 . 206 . 208 ) are carried out by laser. Method according to claim 6, characterized in that both for the step of introducing ( 406 ) of the depression ( 502 . 504 ) as well as for the step of inserting ( 408 ) of the passage opening ( 202 . 204 . 206 . 208 ) a laser ablation method is used. Method according to one of the preceding claims, characterized in that the printing template ( 200 ) from a single-layer and one-piece template body ( 102 ), in particular a metallic stencil sheet. Method according to one of the preceding claims, characterized in that the printing template ( 200 ) for printing on wafers, in particular solar cell wafers ( 704 ), ceramic substrates, and / or glass substrates. Method according to one of the preceding claims, characterized in that the passage opening ( 202 . 204 . 206 . 208 ) is provided for the printing of a long Linienzuges, in particular a conductor track. Method according to one of the preceding claims, characterized in that the recess to be introduced ( 502 . 504 ) is adapted to a pasty pressure medium in the passage opening ( 202 . 204 . 206 . 208 ) and under the bridge ( 210 . 212 ), so that a continuous printed image, in particular a conductor, arises. Method according to one of the preceding claims, characterized in that the bridge ( 210 . 212 ) one of the width of the passage opening ( 202 . 204 . 206 . 208 ) has corresponding or smaller bridge width, and in particular at a width of the passage opening ( 202 . 204 . 206 . 208 ) from 100 microns to 150 microns has a bridge width of 60 microns to 100 microns. Method according to one of the preceding claims, characterized in that the bridge ( 210 . 212 ) a depth between 10 percent and 90 percent, preferably between 50 percent and 90 percent, of the thickness ( 308 ) of the printing template ( 200 ) Has. Contraption ( 100 ) for producing printing templates ( 200 ) with a method according to any one of the preceding claims. Apparatus according to claim 14, comprising a holding device ( 104 . 108 ) for holding a template body ( 102 ) during its processing for the production of the printing template ( 200 ); and a control device ( 112 ) for controlling the machining operation. Device according to claim 14 or 15, characterized by an ablation laser ( 110 ) both for the introduction of depressions in the substrate side ( 302 ) of a template body ( 102 ) as well as for insertion of passage openings ( 202 . 204 . 206 . 208 ) in the template body ( 102 ) during the processing. Use of an ablation laser ( 110 ) for producing a printing template ( 200 ) with a substrate side ( 302 ) and a squeegee side ( 304 ) from a template body ( 102 ) to deepening ( 502 . 504 ) in the template body ( 102 ) from the substrate side ( 302 ) to make a bridge ( 210 . 212 ), whereby the bridge ( 210 . 212 ) for stabilizing the printing stencil ( 200 ) in the region of a passage opening ( 202 . 204 . 206 . 208 ) through the printing template ( 200 ) serves. Use of an ablation laser according to claim 17, wherein one and the same ablation laser ( 110 ) for inserting the recess ( 502 . 504 ) in the template body ( 102 ) and for inserting the passage opening ( 202 . 204 . 206 . 208 ) in the template body ( 102 ) is used. Printing template ( 200 ) prepared by a method according to any one of claims 1 to 13. Printing template ( 200 ), characterized by an area with at least one by at least one bridge ( 210 . 212 ) stabilized passage opening ( 202 ), in particular for printing a long printed circuit, wherein the printing template ( 200 ) is free of screen pattern at least in this area. Printing template ( 200 ) according to one of claims 19 or 20, characterized in that the at least one passage opening ( 202 . 204 . 206 . 208 ) was inserted by laser ablation without post processing. Contraption ( 700 ) for printing on substrates, in particular wafers ( 704 ) or glass substrates, with a printing template ( 200 ) according to any one of claims 19 to 21. Contraption ( 700 ) according to claim 22, comprising a holding device ( 702 ) for holding the substrate to be printed ( 704 ); a curing device ( 708 ) for curing a printing medium applied to the substrate; and a control device ( 710 ) for controlling the printing process. Substrate product ( 704 ), in particular solar cell, printed by a printing template ( 200 ) according to any one of claims 19 to 21.

Images