DE102009026411A1 - Method for individualizing thin-film solar cells, involves degrading transparent conductive oxide layer along parting line in removal zone during removal step in base product with help of laser beam - Google Patents
Method for individualizing thin-film solar cells, involves degrading transparent conductive oxide layer along parting line in removal zone during removal step in base product with help of laser beam Download PDFInfo
- Publication number
- DE102009026411A1 DE102009026411A1 DE102009026411A DE102009026411A DE102009026411A1 DE 102009026411 A1 DE102009026411 A1 DE 102009026411A1 DE 102009026411 A DE102009026411 A DE 102009026411A DE 102009026411 A DE102009026411 A DE 102009026411A DE 102009026411 A1 DE102009026411 A1 DE 102009026411A1
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- Prior art keywords
- laser beam
- solar cells
- thin
- film solar
- parting line
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- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000010409 thin film Substances 0.000 title claims abstract description 12
- 230000000593 degrading effect Effects 0.000 title abstract 2
- 238000000926 separation method Methods 0.000 claims description 7
- 239000007858 starting material Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 22
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 239000011733 molybdenum Substances 0.000 description 4
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000011669 selenium Substances 0.000 description 2
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 1
- 229910004613 CdTe Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
Die Erfindung bezieht sich auf ein Verfahren zum Vereinzeln von Dünnschichtsolarzellen.The The invention relates to a method for separating thin-film solar cells.
Dünnschichtsolarzellen, beispielsweise sogenannte CIGS oder CIS-Solarzellen enthalten als photonenabsorbierende Halbleiterschicht einen auf der Basis von Kupfer Cu, und Indium In oder Gallium Ga und Schwefel S oder Selen Se bestehenden p-dotierten Halbleiter, auf den über eine Zwischenschicht aus Cadmiumsulfid CdS oder Zinkoxid ZnO eine als TCO-Schicht bezeichnete mit Aluminium Al n-dotierte Zinkoxidschicht aufgebracht ist, die zugleich als Vorderseitenkontakt dient. Diese Funktionsschichten sind in Dünnschicht-Technologie über eine als Rückseitenkontaktdienende dünne Molybdänschicht auf einem großflächigen folienartigen Träger, beispielsweise aus Metall, Glas oder aus einem Polymer aufgebracht. Durch entsprechende Verarbeitung dieser Funktionsschichten werden auf dem Träger eine Vielzahl von nebeneinander angeordneten Solarzellen erzeugt, die nachträglich voneinander getrennt, d. h. vereinzelt werden müssen. Hauptsächlich bei CIGS-Solarzellen, die auf etwa 50 μm dicken Stahlfolien aufgebracht sind, besteht das Problem, dass die beim Vereinzeln entstehenden Solarzellen durch den Trennvorgang kurzgeschlossen werden können. Dies ist sowohl dann der Fall, wenn das Trennen mit einem Laserschneidverfahren erfolgt, bei dem das Schmelzgut mit einem Gasstrahl ausgetrieben wird, als auch beim Abtragen mit einem von einem gütegeschalteten Laser erzeugten Laserstrahl. Selbst bei einem mechanischen Schneiden kann die oberste leitfähige TCO-Schicht mit dem metallischen Substrat oder der Molybdänschicht verschmieren und dadurch einen Kurzschluss herbeiführen.Thin film solar cells, For example, so-called CIGS or CIS solar cells contain as photon-absorbing Semiconductor layer one based on copper Cu, and indium In or gallium Ga and sulfur S or selenium Se existing p-doped semiconductor, on the over an intermediate layer of cadmium sulfide CdS or zinc oxide ZnO one referred to as TCO layer with aluminum Al n-doped zinc oxide layer is applied, which also serves as front side contact. These Functional layers are in thin-film technology over a as backside contact servant thin molybdenum layer on a large sheet-like Carrier, for example, made of metal, glass or applied from a polymer. By appropriate processing of these functional layers are on the carrier produces a multiplicity of solar cells arranged side by side, the later separated from each other, d. H. must be isolated. Mainly at CIGS solar cells, which are applied to 50 μm thick steel foils are the problem that arise when singulating Solar cells can be short-circuited by the separation process. This is both the case when cutting with a laser cutting process takes place, in which the melt expelled with a gas jet as well as when worn with one of a Q-switched Laser generated laser beam. Even with a mechanical cutting can the top conductive TCO layer with the metallic substrate or the molybdenum layer smear and cause a short circuit.
Der Erfindung liegt deshalb die Aufgabe zu Grunde, ein Verfahren zum Vereinzeln von Dünnschichtsolarzellen mit einer als Vorderseitenkontakt dienenden TCO-Schicht anzugeben, bei dem die vorstehend genannten Probleme beseitigt sind.Of the The invention is therefore based on the object, a method for Separation of thin-film solar cells indicate with a front-contact TCO layer, in which the above-mentioned problems are eliminated.
Die genannte Aufgabe wird gemäß der Erfindung gelöst mit einem Verfahren mit den Merkmalen des Patentanspruches 1. Bei diesem Verfahren wird in einem Abtragsschritt in ein die Dünnschichtsolarzellen enthaltendes Substrat mit einem ersten Laserstrahl die TCO-Schicht entlang einer Trennlinie in einer die Trennlinie beidseitig umgebenden Zone abgetragen und in einem Trennschnitt wird das Substrat mit einem zweiten Laserstrahl entlang der Trennlinie geschnitten, wobei eine dabei entstehende Schneidfuge innerhalb der beim Abtragen entstehenden Zone beabstandet von deren Rändern angeordnet ist. Mit anderen Worten: Die Breite der abgetragenen Zone ist größer als die Breite der Trennfuge, so dass sich die Trennfuge innerhalb der abgetragenen Zone befindet.The said object is according to the invention solved with a method having the features of claim 1. Bei This method is in a Abtragsschritt in a thin-film solar cells containing substrate with a first laser beam, the TCO layer along a dividing line in a line surrounding the dividing line on both sides Zone removed and in a separating cut the substrate with a second laser beam cut along the dividing line, wherein a resulting kerf within the resulting during ablation zone spaced from their edges is arranged. In other words, the width of the removed zone is bigger than the width of the parting line, so that the parting line within the removed zone is located.
Durch diese Maßnahme ist sichergestellt, dass unabhängig davon, in welcher Reihenfolge die beiden Laserbearbeitungsverfahren stattfinden, ein Kurzschluss der beim Vereinzeln entstehenden Solarzellen vermieden ist.By This measure is ensured that independent in which order the two laser processing methods take place, a short circuit of the resulting solar cells during separation is avoided.
Der Schneidprozess kann dabei sowohl mit einem kontinuierlichen Laserstrahl als auch vorzugsweise mit einem gepulsten Laserstrahl durchgeführt werden. Das Abtragen erfolgt vorzugsweise mit einem gepulsten Laserstrahl, wobei sich dessen Puls dauer vom Mikro-Sekundenbereich bis in den Femto-Sekundenbereich erstrecken kann.Of the Cutting process can be done both with a continuous laser beam and preferably with a pulsed laser beam. The removal preferably takes place with a pulsed laser beam, where its pulse duration from the micro-second range to the Femtosecond range can extend.
Zur weiteren Erläuterung der Erfindung wird auf das Ausführungsbeispiel der Zeichnung verwiesen. Es zeigen:to further explanation The invention is based on the embodiment referred to the drawing. Show it:
Gemäß
In
Das erfindungsgemäße Verfahren ist nicht auf CiGS- oder CIS-Solarzellen beschränkt, sondern auch für Dünnschichtsolarzellen geeignet, die aus anderen Halbleitermaterialen, beispielsweise Cadmiumtellurid CdTe oder amorphes Silizium Si aufgebaut sind und bei denen als Frontkontakt eine leitfähige TCO-Schicht aufgebracht ist.The inventive method is not on CiGS or CIS solar cells limited, for .... As well thin Film solar Cells suitable, from other semiconductor materials, such as cadmium telluride CdTe or amorphous silicon Si are constructed and where as Front contact applied a conductive TCO layer is.
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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DE102009026411A DE102009026411A1 (en) | 2009-05-20 | 2009-05-20 | Method for individualizing thin-film solar cells, involves degrading transparent conductive oxide layer along parting line in removal zone during removal step in base product with help of laser beam |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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DE102009026411A DE102009026411A1 (en) | 2009-05-20 | 2009-05-20 | Method for individualizing thin-film solar cells, involves degrading transparent conductive oxide layer along parting line in removal zone during removal step in base product with help of laser beam |
Publications (1)
Publication Number | Publication Date |
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DE102009026411A1 true DE102009026411A1 (en) | 2010-11-25 |
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Family Applications (1)
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DE102009026411A Withdrawn DE102009026411A1 (en) | 2009-05-20 | 2009-05-20 | Method for individualizing thin-film solar cells, involves degrading transparent conductive oxide layer along parting line in removal zone during removal step in base product with help of laser beam |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013164523A1 (en) * | 2012-05-03 | 2013-11-07 | Nexcis | Laser etching a stack of thin layers for a connection of a photovoltaic cell |
CN104051581A (en) * | 2013-03-13 | 2014-09-17 | 台积太阳能股份有限公司 | Solar Cell Laser Scribing Methods |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080314439A1 (en) * | 2007-06-20 | 2008-12-25 | Misra Mohan S | Array Of Monolithically Integrated Thin Film Photovoltaic Cells And Associated Methods |
DE102007060658A1 (en) * | 2007-12-15 | 2009-07-09 | Carl Baasel Lasertechnik Gmbh & Co. Kg | Component i.e. thin layer solar module, producing method, involves separating glass substrate at parting lines with laser beam that is produced by neodymium-doped yttrium aluminum garnet solid state laser in continuous wave operation |
-
2009
- 2009-05-20 DE DE102009026411A patent/DE102009026411A1/en not_active Withdrawn
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080314439A1 (en) * | 2007-06-20 | 2008-12-25 | Misra Mohan S | Array Of Monolithically Integrated Thin Film Photovoltaic Cells And Associated Methods |
DE102007060658A1 (en) * | 2007-12-15 | 2009-07-09 | Carl Baasel Lasertechnik Gmbh & Co. Kg | Component i.e. thin layer solar module, producing method, involves separating glass substrate at parting lines with laser beam that is produced by neodymium-doped yttrium aluminum garnet solid state laser in continuous wave operation |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013164523A1 (en) * | 2012-05-03 | 2013-11-07 | Nexcis | Laser etching a stack of thin layers for a connection of a photovoltaic cell |
US9112099B2 (en) | 2012-05-03 | 2015-08-18 | Nexcis | Laser etching a stack of thin layers for a connection of a photovoltaic cell |
CN104051581A (en) * | 2013-03-13 | 2014-09-17 | 台积太阳能股份有限公司 | Solar Cell Laser Scribing Methods |
DE102013105426A1 (en) * | 2013-03-13 | 2014-10-02 | Tsmc Solar Ltd. | Method for laser scribing a solar cell |
CN104051581B (en) * | 2013-03-13 | 2017-04-26 | 台湾积体电路制造股份有限公司 | Solar cell laser scribing methods |
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