DE102007062123A1 - Tool mold for creating a microstructure - Google Patents

Abstract

The invention relates to a tool mold for producing a microstructure, wherein the tool mold has a carrier foil and an embossing lacquer arranged on the carrier foil, wherein the surface of the embossing lacquer has an arrangement of elevations and depressions in the form of the desired microstructure, and wherein the arrangement formed by elevations and microstructures of the tool mold formed by microstructure elements having a pitch of 1 μm or more, and a pattern depth of between about 1 μm and 20 μm. The invention further relates to a master foil for producing a stamping mold, a stamping mold for producing a microstructure, a security element having a microstructure and corresponding methods for producing the tool mold, master foil, stamping mold and the security element.

Description

The The invention relates to a mold for producing a microstructure, a master foil for producing a stamping mold for producing a microstructure and a method for producing a tool mold for producing a microstructure and a method for manufacturing a master foil for producing a stamping mold.

The The invention further relates to a method for producing a stamping mold for producing a microstructure, one by such a method produced embossing mold and a security element with a Microstructure and a method for producing such a security element.

disk, such as securities and identity documents, or other valuables, such as branded goods, are often hedged with security features provided a check on the authenticity of the Permit data carriers and at the same time as protection against unauthorized Serve reproduction. The security elements can be found in, for example, Form of a security thread embedded in a banknote, one Tear-open for packaging, of an angry Security strip, a cover for a banknote with a through opening or a self-supporting Transfer element may be formed, such as a patch for a label that is applied to a document of value after its manufacture becomes.

A special role in the field of hedging play security elements with viewing-angle-dependent effects, since these themselves can not be reproduced with the latest copiers. The security elements are thereby among other things with microstructures equipped to the viewer under different viewing angles convey a different image impression and for example depending on viewing angle a different color or brightness impression and / or another graphic motif.

Optically variable security elements with microstructures are, for example, in the as yet unpublished application PCT / EP2007 / 008953 described.

In addition, moire magnification arrangements have recently been used as security elements with microstructures, as described, for example, in the as yet unpublished application PCT / EP2007 / 005200 are described.

The currently for the production of the above Security elements with microstructures used pressure or Embossing tools are very high resolution for the production Microstructures, however, still associated with disadvantages. Especially Tool molds for producing microstructures with line weights between about 1 micron and 4 microns are either not available or only with great effort and to provide costs. So it is, for example, with conventionally produced Printing cylinders for flexographic printing, laser-engraved gravure cylinders or gravure cylinders created by the THINK process, only possible with very great technical effort, Microstructures with structure distances (line widths) of about 3 microns to 4 microns to produce.

task The object of the present invention is to overcome the disadvantages of the prior art Technology to avoid, in particular a tool shape for generating indicate a microstructure with reasonable technical Effort can be produced and the production of microstructures with high resolution.

task It is also a master foil for producing a stamping mold, to specify a stamping die and a security element, the each with a microstructure with respect to the state of Have improved resolution technology and with justifiable technical effort can be produced.

After all Another object is to provide a method for producing a Tool mold, a master foil, a stamping mold and a Indicate security elements with which the respective products with reasonable technical effort and high resolution the microstructures can be generated.

The Asked task is by the tool shape with the features of the main claim. A master foil, a stamping mold, a security element and method for producing the tool shape, Master foil, embossing mold and the security element are specified in the independent claims. further developments The invention are the subject of the respective dependent claims.

According to the Invention is the mold for creating a microstructure characterized in that it comprises a carrier foil and a has embossing lacquer arranged on the carrier foil, wherein the surface of the embossing lacquer is an assembly of elevations and depressions in the shape of the desired Having microstructure, and by the arrangement of elevations and depressions microstructure formed by microstructure elements with a pitch of 1 μm or more and a texture depth are formed between about 1 micron and about 20 microns.

Under microstructures are in the sense of present invention understood structures having an array of protrusions and depressions to form microstructure elements, wherein the microstructure elements are characterized by a structure spacing of 1 micron or more. A pitch, also referred to as a feature size of 1 micron or more, z. As in security elements with such microstructures sure that these microstructures largely achromatic, so act without disturbing color splitting. Accordingly, microstructures in the sense of the following invention show no color splitting by wavelength-dependent diffraction effects, as they occur in diffractive or diffractive microstructures. In contrast to diffractive or diffractive microstructures, the structure spacing (structure size) is smaller than 1 micron and thus moves in the order of the visible and near infrared light, the microstructures described in the present application of the tool mold according to the invention, master foil, embossing mold and the invention Security elements on a structure distance (structure size) of 1 micron or more. As will be explained further below with reference to the figures, "structure spacing" means, for example, the distance between two adjacent lines (microstructure elements) of a microstructure of a tool mold according to the invention.

The Tool mold according to the invention reflects the surprising Recognizing that microstructures in one on a backing sheet arranged embossing lacquer with technically feasible effort and very large resolution can be made. So can for the embossing of the microstructures in the embossing lacquer of the mold known embossing techniques be used. Surprisingly, namely where appropriate, on the embossing Embossing tool existing bumps and irregularities, in particular welds, so-called recombination seams between several embossing tool areas as well as other defects on the surface of the embossing tool, during embossing into the embossing lacquer of the mold "steamed". In this context, the attenuation means bumps the embossing tool for embossing that the bumps are to a much lesser extent in the embossed Find paint as this on the stamping tool of the case is. For example, the height of one on the stamping tool existing weld during molding in the embossing lacquer reduce the tool shape according to the invention so much that the molded weld seam low height / depth no or only a minor impairment represents for the likewise molded microstructure.

It It should be mentioned at this point that the attenuation the unevenness of the embossing mold in the invention Tool form can be optimized by a suitable parameter selection can that microstructures with the desired resolution can be produced in the embossing lacquer and at the same time the transmission of bumps as far as possible prevented becomes. As adjusting parameters are according to the invention z. As the temperature of the embossing tool, the strength the precuring of the embossing lacquer and the residence time of the embossing tool on the embossing lacquer.

The attenuation of the unevenness and irregularities of the surface of the embossing tool used when using a tool mold according to the invention not only leads to improved reproducibility of the microstructures in the tool mold and thus in the microstructures of the security elements according to the invention, but also to a much more accurate transfer of the paint to those Cases in which the mold for producing a microstructure also or exclusively for the transmission of a colored or colorless paint is used. Such a micro-gravure printing process and a tool mold required for it are disclosed in the patent application PCT / EP2007 / 005200 described.

in the Related to that described in the above patent application Micro gravure printing has now been shown to be through use a tool mold according to the invention the transmission of the colored or colorless lacquer on the carrier of the trainee Security elements can be done much more accurate than previously possible was. The reason for the unsatisfactory transmission accuracy It can be seen in the prior art that the squeegee, the Paint outside the areas of the transfer known tools molds to strip the relatively sharp edges through the welds or the recombination seams between adjacent regions the tool shape can not be followed. The result Hollow areas formed under the squeegee guide The previously known tool forms therefore to the fact that the paint not completely scraped and thus dirty on the Target substrate is transferred. Furthermore lead pronounced weld and recombination seams in the known molds to the squeegee for a short time is removed from the mold and with relative great force is put back on the mold. The resulting vibrations lead to tool shapes The prior art to a messy scraping the excess Lacks, leaving only a micro gravure with unsatisfactory resolution could be generated.

The lifting of the doctor blade at the welding and recombination seams of the molds The prior art further leads to a strong mechanical stress of the doctor blade, with which further defects on the doctor blade and the surface of the mold are formed and worsen the result of the transmission of microstructures on.

The Mold according to the invention with a carrier film and an embossing lacquer disposed on the carrier foil with introduced into the surface of the embossing lacquer Elevations and depressions in the shape of the desired Microstructures leads to an improvement of the resolution the produced microstructures or removal of the above mentioned disadvantages in connection with the molds of the state of the technique. In addition to the already described damping of Unevenness of the embossing tool in the embossing lacquer the mold of the invention, can that for the micro-rotogravure method already described required colorless or colored paints on the invention Tool mold can be exactly scraped off, so that the transferred Microstructure can be manufactured with very high resolution can. In addition, in connection with known tool forms described problems by the mechanical Loading the mold and the doctor blade by the inventive Tool shape avoided.

Further be mentioned as an advantage of the present invention that in the embossing lacquer of the invention Tool mold introduced microstructure microstructure elements with a pitch of 1 μm or more and a texture depth between about 1 micron and 20 microns, which is a significant Improvement with regard to the structure spacing and the structure depth represents known tool shapes.

at according to the invention on the carrier film arranged embossing lacquer is preferably a by radiation, in particular by UV radiation or electron radiation, crosslinkable embossing lacquer.

With Another advantage is a thermoplastically deformable embossing lacquer be used. Both radiation-crosslinkable and thermoplastic deformable embossing lacquer can be with known Embossing techniques with elevations and depressions in shape provided the desired microstructures.

Of the Embossing lacquer advantageously has a layer with a thickness from about 1 μm to about 25 μm, preferably from 4 μm to 8 microns, so that the invention for the microstructures required structure depth between about 1 micron and about 20 microns can be realized easily.

The Microstructural elements of the microstructure of the tool mold point with advantage a structure depth of 1 μm to 10 μm, preferably from 2 microns to 6 microns, on. Microstructural elements the preferred order of magnitude put together with the invention required structure spacing of 1 micron or more sure that through the microstructure the tool shape generated microstructures of a security element largely achromatic, so act without splitting color.

The provided with the microstructure surface of the embossing lacquer is in accordance with a preferred embodiment hardened. The hardened surface protects so the microstructural elements of the tool mold from mechanical wear, especially abrasion. An abrasion protection is z. B. useful if the Tool shape as long as possible with a possible good reproducible microstructure for generating security elements, especially when producing very large quantities, should be used. A good abrasion protection, for example by a subsequently applied, in particular vapor-deposited Layer of TiN reached. Alternatively, it is also conceivable, a Abrasion protection by electrodeposition of a metal, in particular of chrome or a metallic compound. at Such a galvanic impression is first the Surface of the embossing lacquer by a thin Metal layer, in particular a nickel, copper, silver or chromium layer, made electrically conductive and in the following electroplating with a thin layer of z. B. chrome plated. The serving as actual abrasion protection chrome layer has while advantageously a layer thickness of 1 micron to 20 μm, more preferably from 2 μm to 4 μm, on.

additionally or alternatively, the surface of the embossing lacquer Furthermore, be provided with a non-stick coating. At a such a coating can advantageously be used a CrN coating become. The non-stick coating allows a light Remove the mold from that through the mold with a According to the invention provided microstructure carrier or substrate.

at the carrier foil of the tool mold is preferred to a plastic film, in particular a plastic film PET, PP, PE, PC, ABS, PVC. The carrier foils used preferably have a thickness of 5 microns to about 40 microns, especially preferably from 12 microns to 23 microns, on.

Particularly preferably, the carrier film is web-shaped. The tool shape provided by the web-shaped design of the carrier film has the advantage that it is rolled up, stored and, if necessary, removed, for example in the form of a roll rolls and can be used to produce security elements according to the invention with microstructure. With a particularly great advantage, such a web-shaped tool mold in the in the application PCT / EP2007 / 005200 described gravure printing method can be used.

Of course can the carrier foil of the mold (in suitable size) also be placed on a substantially cylindrical body, to form a stamping cylinder.

Alternatively, the carrier foil with the mold may be formed as a (cylindrical) sleeve for use with a tensioning cylinder. The basic operation of a clamping cylinder for clamping cylindrical embossing shapes (sleeves) is z. B. in the EP 1 442 883 A1 described, the disclosure of which is included in the present application in this respect.

Also on a cylindrical body, in particular clamping cylinder, arranged tool molds can advantageously in the in the PCT / EP2007 / 005200 micro-gravure printing method described are used.

• a) Bereitstellen einer Trägerfolie mit einer ersten und einer zweiten Seite,
• b) Aufbringen eines Prägelacks auf einer Seite der Trägerfolie,
• c) Erzeugen von Erhebungen und Vertiefungen in dem Prägelack zur Bildung einer Mikrostruktur, die Mikrostrukturelemente mit einem Strukturabstand von 1 μm oder mehr und eine Strukturtiefe zwischen etwa 1 μm und etwa 20 μm aufweist, und
• d) Härten des Prägelacks.

The invention further comprises a method for producing a tool mold for producing a microstructure, the method being characterized by the steps:

• a) providing a carrier foil with a first and a second side,
• b) applying an embossing lacquer on one side of the carrier foil,
• c) generating bumps and depressions in the embossing lacquer to form a microstructure comprising microstructure elements having a pitch of 1 μm or more and a texture depth of between about 1 μm and about 20 μm, and
• d) curing the embossing lacquer.

The inventive method for the preparation of Molds, has over known methods for Production of molds in particular the beginning of the inventive mold described advantages on.

The Application of the embossing lacquer on the carrier foil can by various per se known from the prior art Coating process done. In addition to some printing processes, eg. As gravure printing, flexographic printing, offset printing, come all the classic methods for film casting and coating process in question. So is the application with z. Roll coating methods, gap coating methods, Wire Squeegee Coating Method, Slot Die Coating, Dip Coating, Spray Coating, Curtain Coating and Airknife Coating possible.

In an advantageous method variant is in step b) by a Radiation, preferably by UV radiation or electron radiation, crosslinkable embossing lacquer applied, and in step d) the Hardening of the embossing lacquer by exposure to radiation, preferably with UV radiation or electron radiation.

Further It may be beneficial if the embossing lacquer after step b) and before step c) by the application of radiation precured with UV radiation. The pre-hardening of the embossing lacquer has the advantage described above Opposing steam properties of the embossing lacquer Unevenness of the surface of the embossing tool to be able to adjust to a certain extent. In practice Pre-hardening has proven suitable in the between about 40% and 100% of the embossing varnish become.

alternative However, in step b) a thermoplastically deformable embossing lacquer be applied and in step d) curing of the embossing Cooling below the glass transition temperature (glass point) the embossing lacquer and / or by exposure to radiation, in particular UV radiation or ion radiation.

In A preferred variant of the method, the surveys and wells in step c) of the method according to the invention by an embossing tool, in particular by an embossing punch, a Embossing plate or an embossing cylinder produced.

there It is beneficial if the temperature of the stamping tool is adjustable. In particular, in the embossing of a thermoplastic Embossing lacquers can be over the temperature of the embossing tool the already mentioned damping characteristic of the Embossing lacquer for unevenness of the embossing tool be set within certain limits. In practice, it has turned out that the temperature range of approx. 100 ° C to 250 ° C, preferably 170 ° C to 190 ° C, for a Embossing tool is suitable to the desired To introduce microstructures in a thermoplastic embossing lacquer.

In In another preferred embodiment, the embossing lacquer is used in step b) of the method according to the invention with a layer thickness of about 1 μm to about 25 μm, preferably from 4 .mu.m to 8 .mu.m, on the carrier film applied and the microstructure elements in step c) with a Structure thickness of about 1 micron to 10 microns, preferably from 2 μm to 6 μm.

As already mentioned, the carrier film with advantage web-shaped and wound into a roll to provide a rollable, sheet-like tooling.

alternative But the carrier film can also be in a suitable size mounted on a substantially cylindrical body, glued and / or shrunk. It can the end portions of the carrier film on the substantially cylindrical body also arranged overlapping be without the tool shape its suitability for generating inventive Loses microstructures. However, the overlapping arranged end regions also by z. B. cutting away.

Around the overlapping arranged end portions of the carrier film or optionally by removing the overlapping ones End portions resulting impact area of the carrier film to smooth, according to a preferred Embodiment of a filling, in particular a Radiation-crosslinkable paint applied in the mentioned areas become.

The Carrier film can also be used as a (cylindrical) sleeve be formed to secure them on a clamping cylinder.

With Advantage can be with the surface of the embossing lacquer an abrasion protective layer are coated, for example by a coating with TiN, so-called DLC (Diamond Like Carbon) or metallic chrome.

Also it is conceivable the surface of the embossing lacquer with a non-stick coating, such as a CrN coating, to provide.

The Surface coating is carried out with advantage by means of a CVD (Chemical Vapor Deposition), PVD (Physical Vapor Deposition) or sputtering method and / or by means of a method for galvanic Deposition.

It is understood that a surface coating for the case that the carrier film is web-shaped and wound up into a roll, before rolling up. In the case of the arrangement of the carrier film on a substantially cylindrical body, the surface coating, however both before and after the assembly on the cylindrical body applied to the surface of the embossing lacquer become.

The The invention further comprises a master foil for producing a Embossing mold for producing a microstructure, wherein the master foil through a carrier foil and one on the carrier foil arranged embossing lacquer is characterized, wherein the surface the Prägelacks an array of elevations and depressions in the shape of the desired microstructure, and wherein the microstructure formed by the arrangement of elevations and depressions the master foil by microstructure elements with a structure spacing of 1 μm or more and a texture depth between about 1 micron and about 20 microns is formed.

The according to the invention therefore has the same master foil Features as the tool mold according to the invention on. In contrast to the tool shape, the master foil is used not directly to the creation of a microstructure, but first for producing a stamping mold, with which then a microstructure is produced.

Further technical details for the use of a master foil and the production of a question form by taking an impression can be made e.g. B. the EP 1 369 262 A2 It should be noted that the master foil described in the cited document is a metal foil and is referred to as a so-called "master shim" metal foil In the context of the present application, however, the "master foil" is always the combination of a carrier foil and an embossing lacquer disposed on the carrier foil and provided with microstructure elements, as set forth in the independent claim 28.

In addition, it should be noted that in the EP 1 369 262 A2 described relief structures for generating diffraction structures are formed, according to the nomenclature used in the present application thus have a pattern spacing of less than 1 micron.

to Avoid repetition with respect to the carrier film and its thickness, the embossing lacquer, the layer thickness of the embossing lacquer and the structural depths of the microstructure of the embossing lacquer the master foil on the corresponding executions for Tool mold according to the invention or their production directed.

Also can in the case of the master film according to the invention the same benefits can be achieved as related to the mold according to the invention already further described above.

To a preferred embodiment, the inventive Surfaces of the master foil an electrically conductive Coating, in particular a metallic coating, on. A to some extent electrically conductive coating is a prerequisite for a galvanic deposition of further Metal layers. The electrically conductive coating consists with advantage of nickel, silver, chromium, copper or Aluminum, most preferably chromium or nickel.

The optionally coated carrier film can in turn be advantageously web-shaped be or be present in such a size that it can be arranged in a hollow cylinder, in particular in a slotted hollow cylinder, without overlap. In the latter case, the master film for producing a (seamless) embossing mold after the z. B. in the EP 1 369 262 A2 described round galvanic process can be used.

• a) Bereitstellen einer Trägerfolie mit einer ersten und einer zweiten Seite,
• b) Aufbringen eines Prägelacks auf einer Seite der Trägerfolie,
• c) Erzeugen von Erhebungen und Vertiefungen in dem Prägelack zur Bildung einer Mikrostruktur, die Mikrostrukturelemente mit einem Strukturabstand von 1 μm oder mehr und eine Strukturtiefe zwischen etwa 1 μm und etwa 20 μm aufweist, und
• d) Harten des Prägelacks.

The invention further comprises a method for producing a master foil for producing a stamping mold, characterized by the following steps:

• a) providing a carrier foil with a first and a second side,
• b) applying an embossing lacquer on one side of the carrier foil,
• c) generating bumps and depressions in the embossing lacquer to form a microstructure comprising microstructure elements having a pitch of 1 μm or more and a texture depth of between about 1 μm and about 20 μm, and
• d) hardening of the embossing lacquer.

The inventive method for producing the Master foil has those associated with the method of manufacture the mold or in connection with the master sheet described Advantages on why to avoid repetition on the corresponding text passages. Also the preferred ones Process variants according to the dependent Claims 40 to 50 were in connection with the inventive Master foil essentially already explained, which is why to avoid repetition on the corresponding versions is referenced.

To It is still complete that the surface coatings on the embossing lacquer of the master foil preferably by means of Method of electrodeposition can be applied.

• a) Bereitstellen einer Masterfolie, die nach wenigstens einem der Ansprüche 28 bis 38 ausgebildet bzw. nach wenigstens einem der Ansprüche 39 bis 50 hergestellt ist,
• b) Abformen der Mikrostruktur der Masterfolie durch einen galvanischen Prozess, und
• c) Lösen der Masterfolie von der durch galvanische Abformung gebildeten Prägeform.

The invention further comprises a method for producing a stamping mold for producing a microstructure, the method being characterized by the following steps:

• a) providing a master film, which is formed according to at least one of claims 28 to 38 or produced according to at least one of claims 39 to 50,
• b) molding the microstructure of the master foil by a galvanic process, and
• c) releasing the master foil from the embossing mold formed by galvanic molding.

at the process according to the invention for the preparation an embossing mold becomes an inventive Master foil used to go through the microstructure of the master foil to form a galvanic process into an embossing mold. The advantages described in connection with the master foil, in particular those in the master foil opposite the used Embossing tool muffled bumps in shape from Z. B. welding or recombination seams, apply due to the galvanic molding process also for the stamping mold or produced in the stamping mold Microstructures. That is, in the embossing form are unevenness and irregularities, as they are in embossing forms of the prior art, not or only to a much lesser extent Dimensions available. The stamping mold according to vorlie ing application has thus over stamping The prior art has the same advantages as the invention Tool shape over known tool shapes. While both the embossing mold according to the invention as well as the tool mold according to the invention for Creating a microstructure of a security element used the main difference between imprinting and and tool shape in that the stamping mold by a galvanic molding process was obtained from the master foil, whereas the tool mold according to the invention without the intermediate step over a master sheet used directly to create a microstructure becomes.

In A preferred variant of the method is the master sheet after step a) in a slotted hollow cylinder in the longitudinal axis direction introduced such that the surface with the microstructures for Hollow cylinder interior points, and that two colored side edges the master foil are adjacent to each other, and the width of the Slit of the hollow cylinder is reduced until the two side edges collide with the master foil.

Such a procedure basically corresponds to that in the EP 1 369 262 A2 Round galvanic process described in more detail, which is why reference is made to this document for further technical understanding.

About that In addition, it is advantageous if the step of providing the Master foil by cutting, in particular by laser cutting, the master foil from a larger, in particular web-shaped master sheet takes place.

With particular advantage, the embossing mold is designed as a self-supporting, seamless sleeve, in particular for use with a clamping cylinder. The self-supporting sleeve can thus basically with a example in the EP 1 442 883 A1 described clamping cylinder can be used.

Around the release of the master foil from the by galvanic impression To facilitate the obtained embossing mold, the surface can the master sheet before the step of molding with a release agent be provided.

advantageously, is the galvanic impression in step d) by depositing a Metal, in particular by the deposition of chromium, nickel or copper, carried out.

Especially preferred is a process variant in which a multilayer Separation of different metals, in particular a two-layered Depositing, being performed, being first preferably chromium in a thickness of 1 μm to 20 μm, preferably from 2 microns to 4 microns, and thereafter preferred Nickel in a thickness of 8 microns to 200 microns, preferably from 10 μm to 50 μm, deposited on the master foil become. The above-described two-layer deposition has the advantage that with the first layer for the galvanic Impression required conductivity of the embossing lacquer is provided while with the second coating sufficient stability and flexibility of the produced Stamping mold is ensured. Because the first layer after the detachment of the embossing mold from the master foil the outer layer of the microstructure of the embossing mold Furthermore, this can also serve as Abrasionsschutzschicht at the same time. The embossing forms obtained by the two-layer galvanic impression are therefore z. B. by a very high abrasion and scratch resistance and are at the same time sufficiently stable and bendable. Furthermore can be such a relatively thin Embossing form compared to a likewise conceivable, clearly thicker stamping mold are made faster (higher throughput in galvanic deposition). Also, a fixture, z. B. on a cylindrical body, even without welding the end portions of the stamping die by adhesive or magnetic Attachment possible.

In addition to the already described training a substantially cylindrical embossing mold after the z. B. from the EP 1 369 262 A2 known Rundgalvanik process, the embossing mold can be prepared in principle as a web-shaped, flat embossing mold with the inventive method. Advantageously, such a stamping mold can then be cut to such a size by a cutting method, in particular a laser beam cutting method, that it can be arranged on a substantially cylindrical body without overlapping areas.

The Embossing mold can be applied to the substantially cylindrical body, in particular by welding the joints two end portions of the stamping mold to be attached.

Of Furthermore, it is possible according to another variant of the method, that the stamping mold on the substantially cylindrical Body by gluing, clamping and / or by a magnetic Holder is attached.

In In any case, that puts on the essentially cylindrical body attached embossing mold is an embossing cylinder, for generating microstructures with very high resolution can be used.

The embossing molds produced according to the invention can be both web-shaped and in the form of an embossing cylinder described above for the in the application PCT / EP2007 / 005200 micro-gravure printing method described are used.

The The invention further relates to a stamping mold for producing a Microstructure according to the invention Process is made.

The The invention also encompasses a method for producing a security element having a microstructure, the method being characterized is that the microstructure with an inventive Tool mold or with an inventive Embossing mold is generated.

• a) die Werkzeugform oder Prägeform derart bereitgestellt wird, dass ihre Oberfläche eine Anordnung von Erhebungen und Vertiefungen in Gestalt der gewünschten Mikrostruktur aufweist,
• b) die Vertiefungen der Werkzeugform oder Prägeform mit einem hartbaren farbigen oder farblosen Lack befüllt werden,
• c) der Träger für eine gute Verankerung des farbigen oder farblosen Lacks vorbehandelt wird,
• d) die Oberfläche der Werkzeugform oder Prägeform mit dem Träger in Kontakt gebracht wird,
• e) der in Kontakt mit dem Träger stehende Lack in den Vertiefungen der Werkzeugform oder Prägeform gehärtet und dabei mit dem Träger verbunden wird, und
• f) die Oberfläche der Werkzeugform oder Prägeform wieder von dem Träger entfernt wird, so dass der mit dem Träger verbundene, gehärtete Lack aus den Vertiefungen der Werkzeugform oder Prägeform gezogen wird.

In a special process variant, which is suitable in particular for producing the security element with a colored or colorless microstructure on a support, it is provided that

• a) the tool mold or embossing mold is provided such that its surface has an arrangement of elevations and depressions in the form of the desired microstructure,
• b) the depressions of the mold or embossing mold are filled with a hardcible colored or colorless varnish,
• c) the backing is pretreated for good anchoring of the colored or colorless lacquer,
• d) the surface of the mold or embossing mold is brought into contact with the carrier,
• e) cured in contact with the carrier paint in the recesses of the mold or embossing mold, thereby being connected to the carrier, and
• f) the surface of the tool mold or embossing mold is removed again from the carrier so that the hardened lacquer associated with the carrier is drawn out of the depressions of the mold or embossing mold.

After all the invention also encompasses a security element with a microstructure, that produced by a method according to the invention is.

Further Embodiments and advantages of the invention will be explained below with reference to the figures. For better Clarity is indicated in the figures on a scale and proportionally true representation omitted.

It demonstrate:

1 a schematic representation of a mold according to the invention for producing a microstructure,

2 a cross section through the tool mold according to the invention in the region of 1 shown line II-II,

3 1 is a schematic view of a tool mold according to the invention, which is arranged on a cylindrical body to form an embossing tool,

4 a cross section through an embossing mold according to the invention, which was formed by electrodeposition on a master film according to the invention,

5 a slotted hollow cylinder with an inventive master foil arranged therein during the galvanizing process to form a stamping mold according to the invention,

6 a drawn on a clamping cylinder inventive seamless embossing mold, and

7 an embossing mold according to the invention arranged on a cylinder, in which the two end regions of the embossing mold adjoin one another in an abutment region.

The invention will now be explained in more detail using the example of a mold for producing a microstructure. 1 shows a tool shape 1 made of a web-shaped carrier film 2 and an embossing lacquer disposed on the carrier foil. In the example shown, it is a film of PET with a thickness of approx. 16 μm. The UV-curable embossing lacquer was applied by means of a suitable coating method in a thickness of about 4 microns to 8 microns on the carrier film.

By means of an embossing tool, not shown, in particular a stamping cylinder, were in the embossing lacquer 3 microstructures 4 generated, which consist of a plurality of elevations and depressions in the form of the desired microstructure. In order to adjust the damping properties during the transfer of the microstructures from the embossing tool used to the embossing lacquer, the embossing lacquer was precured prior to impressing the microstructures by exposure to radiation, preferably UV radiation, and fully cured after embossing.

One additional parameter for setting the damping properties represents the residence time of the embossing tool in the embossing lacquer A residence time of about 0.1 second to 2 seconds has generally proved to be suitable to the microstructures of the invention Tool shape with good damping of the bumps of the embossing tool too produce.

In 1 a dotted line is further drawn in the embossing lacquer, which is a weld or recombination seam, which is inserted into the embossing lacquer by the embossing tool, in particular embossing cylinder, used 3 the mold 1 was molded. It is understood that when using a seamless embossing tool no impression is made in the embossing lacquer. But even when using an embossing tool with welding or recombination seams, these are molded due to the damping properties of the mold according to the invention with, for example, much lower height or depth in the embossing lacquer, as is the case with molds of the prior art. In this respect, the dotted line is 5 for all irregularities or unevenness of the embossing tool, which by the invention ideally not or to a much lesser extent than previously possible in the prior art, are molded into the embossing lacquer of the mold according to the invention.

In 2 is now a cross section through a microstructure 4 of the embossing lacquer 3 the mold 1 shown along the line II-II. Out 2 it can be seen that the microstructure 4 is formed from an array of protrusions and depressions in the shape of the desired microstructure. In other words, the microstructure is formed by a plurality of microstructure elements, in the present example, the microstructure elements with the elevations 6 coincide by depressions 7 in the embossing lacquer 3 are separated from each other.

Out 2 can also be seen that the structure distance Sa, in the present example by the distance between two z. B. as lines trained microstructure elements 6 is defined. The structure spacing according to the invention is greater than 1 μm and in the present example is about 4 μm. The microstructure elements 6 and the depressions 7 The microstructure each have a width of about 2 microns.

In the 2 The microstructure shown further comprises microstructure elements 6 with a structure depth St of about 4 microns.

In the 1 web-shaped tool shape shown can now directly for generating a microstructure in a deformable substrate, for. B. a radiation crosslinkable embossing lacquer can be used. To the mechanical wear of the microstructure elements 6 the microstructure 4 the mold 1 It is also more than that it is possible to harden the surface of the embossing lacquer at least in the area of the microstructure. This can be done, for example, by a vapor-deposited layer, for example of TiN, with the vapor deposition preferably being particularly suitable by physical vapor deposition (PVD). Alternatively, however, the surface of the embossing lacquer can also be provided with an abrasion protection layer, which may be, for example, an electrodeposited chromium layer.

at the galvanic deposition is usually first a thin conductive layer on the surface of the embossing lacquer to form the for the galvanic Deposition to provide required conductivity. In practice, z. B. chrome layers as Abrasionsschutzschicht with a layer thickness of about 2 microns to 4 microns as sufficiently proven.

additionally Alternatively, the microstructure may also be provided with a Non-stick coating be provided, for example, the peeling the tool shape of one through the mold in an embossing lacquer to facilitate embossed microstructure.

The completely finished mold can basically immediately as a web-shaped tool mold for the production of microstructures be used. It is useful, to wind it up to a roll, to a rollable, web-like To provide tool shape. The present in the form of a roll Tool mold can then be stored until the time at the tool mold used for the production of microstructures shall be.

As already mentioned, a web-shaped tool shape can after 1 as a tool shape for that in the application PCT / EP2007 / 005200 Microprinting methods described can be used to produce colored or colorless microstructures.

The tool mold according to the invention can also be arranged according to an alternative embodiment on a body, in particular a substantially cylindrical body, as in 3 is shown. For arranging the mold 1 on the substantially cylindrical body 11 In particular, those areas of the web-shaped tool shape are provided, which between the dotted impressions 5 the unevenness of an embossing tool lie (see 1 ). For this purpose, the tool shape can be cut to the required size by means of a cutting method, in particular a laser cutting method, and then on the cylinder 11 to be ordered. The tool shape 1 can do this on the cylinder 11 be clamped, glued and / or shrunk, with all fastening measures are known in the art per se.

If the tool shape is not intended to be brought to the required size by a cutting method as described above, it is basically also conceivable to use the end regions of the carrier film on the cylinder 11 overlapping to arrange, which, however, in 3 not shown. As far as the overlap area is not too large, can by such a tool shape 1 and the cylinder 11 formed embossing cylinder 12 be used with a defined direction. The running direction must be chosen in the direction of the overlap so that a hooking of the substrate to be embossed or a doctor blade is not possible.

Around the rolling properties of such a tool mold with overlap area can improve in the overlap area (overlapping end areas the carrier film) also a filling, in particular a radiation-hardenable paint can be applied.

Alternatively, it is also possible, the overlapping end portions of the film in a suitable manner, for. B. by a Schneideerfahren to remove and the resulting impact areas 8th and 9 the mold 1 essentially seamlessly juxtaposed on the cylinder, as in 3 is shown in more detail. According to the embodiment shown there, between the in the areas 8th and 9 the mold 1 resulting impact area by a filling 10 , in the present case a UV-crosslinkable lacquer, smoothed.

The one by the mold 1 and the cylinder 11 formed embossing cylinder 12 can now be used as a printing tool for the production of microstructures, for example in embossable paint. In addition, it is also possible the embossing cylinder 12 as a tool shape in the in the application PCT / EP / 2007/005200 micro-gravure printing method described.

Unless the surface of the mold 1 of the embossing cylinder 12 not already before placement on the cylindrical body 11 was provided with a coating, it is conceivable, such a surface coating in accordance with 3 to apply arranged tool shape. Conceivable here is again the Abrasionsschutzschicht described above from z. As TiN and / or a non-stick layer of z. B. CrN.

Further aspects of the invention will now be described with reference to FIGS 4 to 7 described. 4 shows a master slide 21 , which consists essentially of a carrier film 22 and one on it ten embossing lacquers 23 is formed. The master sheet according to the invention 21 may have the same characteristics and characteristics as those with respect to 1 . 2 and 3 described tool shape. Because the master foil 21 but not directly to the generation of microstructures z. B. a security element is used, but as a semi-finished product for producing a stamping mold according to the invention for the production of such microstructures should always be maintained to avoid conceptual ambiguity in the present application, the distinction between mold and master foil. To avoid repetition, especially with regard to specific properties of the microstructure 24 (please refer 5 ), the carrier film 22 and the embossing lacquer 23 However, the master foil is based on the above explanations of the corresponding microstructure 4 , Carrier film 2 and embossing lacquer 3 the mold 1 directed.

How out 4 can be seen, has the master sheet 21 one on a carrier foil 22 arranged embossing lacquer 23 with a variety of surveys 26 and depressions 27 on which a microstructure 24 form. The microstructure elements have a pitch of about 6 .mu.m, this according to the explanations to the structure distance Sa in 2 also for the in 4 shown master foil 21 as the distance between two microstructure elements 26 , z. B. two line-shaped elements defined. The structure depth of the microstructure elements 26 is about 6 microns.

To start now from the in 4 shown master foil 21 To produce an embossing mold according to the invention for producing a microstructure, the microstructure 24 the master foil 21 molded by a galvanic process. The galvanic impression requires a conductive layer on the surface of the embossed lacquer 23 , As a conductive layer in particular metallic coatings of chromium, silver, copper or aluminum into consideration. Chromium is one of the reasons why it is preferable because of the microstructure 24 of the embossing lacquer 23 the master foil 21 deposited chromium layer can later serve as the top layer and thus as an abrasion protective layer of a stamping mold according to the invention.

In the in 4 embodiment shown was a chromium layer 32 applied in a thickness of about 3 microns. Over the chrome layer 32 was then another metal coating, in the present case, a nickel layer 33 , deposited by a galvanic process. The nickel layer 33 later acts as a carrier layer and therefore has a greater layer thickness of about 20 microns to 60 microns. It should be noted that in the master foil 21 existing wells 27 later than elevations of the mold 31 and the surveys 26 the master foil 21 in the stamping mold 31 be molded as wells. In that sense, unlike in 4 shown, the metallic coating, in particular the possibly thicker nickel layer 33 , the entire wells 27 fill in the master foil. The microstructure of the stamping mold 31 relates to the microstructure of the master foil 21 therefore like a positive structure to a negative structure. For a person skilled in the definition of the structure of the (positive) microstructure to be generated on a security element, even with the use of an intermediate form, such as the master film used here, is not a fundamental problem.

The electrodeposited embossing mold 31 can now from the master slide 21 be solved (not shown) and is available as a self-supporting metallic embossing mold. The galvanic impression can, as with reference to 4 described, starting from a web-shaped master sheet 21 take place to obtain a likewise web-shaped embossing mold.

An alternative production of the stamping mold is in 5 shown. In this case, the master film in a suitable size, optionally after cutting a web-shaped master film into a slotted hollow cylinder 40 placed so that the surface with the microstructures 24 the master foil 21 to the hollow cylinder interior, and that two remote side edges of the master foil are adjacent to each other. According to 5 the two side edges of the master foil hit in the joint area 25 together. The width of the slot 42 of the hollow cylinder 40 is now reduced until the two side edges of the master foil, as in 5 shown in the bumper area 25 flush against each other.

The according to 5 inside the hollow cylinder 40 arranged master foil 21 will now, as related to 4 described subjected to a galvanic molding process. This is in 5 through the power supply 50 symbolizes. The seamless questionnaire obtained by galvanic molding represents a self-supporting, seamless sleeve and can be used with a cylinder, in particular with a clamping cylinder.

The arrangement of such a seamless embossing mold 31 with microstructures 34 on a clamping cylinder 51 for forming a stamping cylinder 52 is in 6 shown. Further details on the production of a seamless cylindrical embossing mold (sleeve), starting from a master foil, and for arranging the embossing die produced on a cylinder to form a stamping cylinder of the application EP 1 369 262 A2 be removed.

Of course, a by galvani impression taken 31 also different than with respect to 5 and 6 be obtained described method. This is the embossing form 31 as related to 4 was generally described by the master foil 21 dissolved and in a suitable size, optionally after cutting, arranged on a substantially cylindrical body.

As in 7 This can be done without overlap on a cylinder 61 respectively. The end regions of the question form 31 boundaries in the joint area 35 directly to each other. The attachment of the question form can basically by welding, in particular by welding in the joint area 35 respectively. Alternatively, the embossing mold can be made on the cylindrical body by gluing, clamping and / or by a magnetic holder. For the in 7 The embodiment shown is the embossing mold 31 by a magnetic holder on the cylinder 61 attached, leaving a stamping cylinder 62 with a stamping mold 31 is formed without external welds. A magnetic holder is according to 7 especially possible because the embossing mold 31 is relatively thin and flexible.

Also in the 4 . 6 and 7 shown embossing forms 31 can be used to produce microstructures, in particular after in the application PCT / EP2007 / 005200 described gravure printing method can be used.

The with the embossing forms of 4 . 6 and 7 or the tool shape of 1 . 2 and 3 produced microstructures may advantageously form a security element not shown in detail, which is characterized according to the inventive concept in particular by a very high resolution of the molded microstructure and thus allows increased protection against counterfeiting for the secured with the security items items.

QUOTES INCLUDE IN THE DESCRIPTION

This list The documents listed by the applicant have been automated generated and is solely for better information recorded by the reader. The list is not part of the German Patent or utility model application. The DPMA takes over no liability for any errors or omissions.

Cited patent literature

• - EP 2007/008953 [0005]
• - EP 2007/005200 [0006, 0016, 0028, 0031, 0073, 0098, 0103, 0115]
• EP 1442883 A1 [0030, 0065]
• - EP 1369262 A2 [0051, 0052, 0056, 0063, 0069, 0112]

Claims (64)

Mold for producing a microstructure, characterized by a carrier foil and a on the Carrier film arranged embossing lacquer, wherein the Surface of the Prägelacks an array of surveys and depressions in the form of the desired microstructure and wherein the through the arrangement of elevations and depressions formed microstructure of the mold through microstructure elements with a pitch of 1 μm or more and one Structure depth between about 1 micron and about 20 microns is formed. Tool mold according to claim 1, characterized that the embossing lacquer by a radiation, preferably by UV radiation or electron radiation, crosslinkable embossing lacquer is. Tool mold according to claim 1, characterized the embossing lacquer is a thermoplastically deformable embossing lacquer is. Mold according to one of claims 1 to 3, characterized in that the embossing lacquer has a layer thickness from about 1 μm to about 25 μm, preferably from 4 μm to 8 microns, has. Mold according to one of claims 1 to 4, characterized in that the microstructure elements a structure depth from 1 μm to 10 μm, preferably from 2 μm to 6 microns, have. Tool mold according to at least one of the claims 1 to 5, characterized in that the surface of the Is cured. Tool mold according to at least one of the claims 1 to 6, characterized in that the surface of the Embossing lacquer is provided with a non-stick coating. Tool mold according to at least one of the claims 1 to 7, characterized in that the carrier foil a Plastic film, in particular of PET, PP, PE, PC, ABS, PVC, is. Tool mold according to at least one of the claims 1 to 8, characterized in that the carrier foil a Thickness of about 5 microns to about 40 microns, preferably from 12 μm to 23 μm. Tool mold according to at least one of the claims 1 to 9, characterized in that the carrier film is web-shaped is trained. Tool mold according to at least one of the claims 1 to 9, characterized in that the carrier film on a substantially cylindrical body is arranged. Tool mold according to claim 11, characterized in that the carrier film is a sleeve for use represents with a clamping cylinder. Method for producing a tool mold for Creating a microstructure, characterized by the following steps: a) Providing a carrier film with a first and a second page, b) applying an embossing lacquer one side of the carrier film, c) generating elevations and depressions in the embossing lacquer to form a microstructure, the microstructure elements with a structure spacing of 1 micron or more and a texture depth between about 1 μm and about 20 microns, and d) hardening of the embossing lacquer. Method according to claim 13, characterized in that that in step b) by radiation, preferably by UV radiation or electron beam, crosslinkable embossing lacquer applied and in step d) hardening of the embossing lacquer by exposure to radiation, preferably with UV radiation or Electron radiation occurs. Method according to claim 14, characterized in that that the embossing lacquer after step b) and before step c) Exposure to radiation, preferably with UV radiation, precured becomes. Method according to claim 13, characterized in that in step b), a thermoplastically deformable embossing lacquer is applied and in step d) curing of the embossing lacquer by cooling below the glass transition temperature (Glass point) of the embossing lacquer and / or by applying with radiation, in particular UV or ion radiation, takes place. Method according to at least one of the claims 13 to 16, characterized in that the generation of the elevations and depressions in step c) by an embossing tool, in particular by an embossing stamp, a stamping plate or an embossing cylinder takes place. Method according to claim 17, characterized in that that the temperature of the embossing tool is adjustable. Method according to at least one of the claims 13 to 18, characterized in that the embossing lacquer in Step b) with a layer thickness of about 1 micron to about 25 microns, preferably from 4 microns to 8 microns applied and the microstructure elements in step c) with a texture depth from 1 μm to 10 μm, preferably from 2 μm up to 6 μm. Method according to at least one of Claims 13 to 19, characterized in that the carrier film is web-shaped and wound into a roll to provide a rollable, sheet-like tool shape. Method according to at least one of the claims 13 to 19, characterized in that the carrier film in a suitable size to a substantially cylindrical body clamped, glued and / or shrunk becomes. Method according to claim 21, characterized in that the carrier foil has end regions which rest on the essentially cylindrical body overlapping arranged and optionally removed by cutting. Method according to claim 22, characterized in that that is the area of the overlapping end regions of the carrier film or optionally by removing the overlapping ones End areas resulting impact area of the carrier film by applying a filling, in particular a radiation-crosslinkable Lacks, is smoothed. Method according to at least one of the claims 13 to 19, characterized in that the carrier film is formed as a sleeve to them on a clamping cylinder to fix. Method according to at least one of the claims 13 to 24, characterized in that the surface of the embossing lacquer is coated with an abrasion protective layer becomes. Method according to at least one of the claims 13 to 25, characterized in that the surface of the embossing lacquer coated with a non-stick coating becomes. Method according to claim 25 or 26, characterized that the surface coating by means of a CVD, PVD or sputtering method and / or by means of a method for galvanic Deposition takes place. Master foil for producing a stamping mold for Creating a microstructure, characterized by a carrier film and an embossing lacquer disposed on the carrier foil, wherein the surface of the embossing lacquer is an assembly of elevations and depressions in the shape of the desired Having microstructure, and being characterized by the arrangement of elevations and depressions formed microstructure of the master foil by microstructure elements with a pitch of 1 μm or more and a texture depth is formed between about 1 micron and about 20 microns. Master foil according to Claim 28, characterized that the embossing lacquer by a radiation, preferably by UV radiation or electron radiation, crosslinkable embossing lacquer is. Master foil according to Claim 28, characterized the embossing lacquer is a thermoplastically deformable embossing lacquer is. Master foil according to one of claims 28 to 30, characterized in that the embossing lacquer a Layer thickness of about 1 micron to about 25 microns, preferably from 4 μm to 8 μm. Master foil according to one of claims 28 to 31, characterized in that the microstructure elements a Structure depth of 1 .mu.m to 10 .mu.m, preferably from 2 microns to 6 microns, have. Master foil according to at least one of the claims 28 to 32, characterized in that the surface the embossing lacquer an electrically conductive coating, in particular a metallic coating. Master foil according to claim 33, characterized that the electrically conductive coating of nickel, Silver, chromium, copper or aluminum, more preferably of chromium or nickel. Master foil according to at least one of the claims 28 to 34, characterized in that the carrier film a plastic film, in particular of PET, PP, PE, PC, ABS, PVC, is. Master foil according to at least one of the claims 28 to 35, characterized in that the carrier film a thickness of about 5 microns to about 40 microns, preferably from 12 μm to 23 μm. Master foil according to at least one of the claims 28 to 36, characterized in that the carrier film is web-shaped. Master foil according to at least one of the claims 28 to 36, characterized in that the master foil in a Size is present in a hollow cylinder, especially in a slotted hollow cylinder, without overlap can be arranged. A process for producing a master foil for producing a stamping mold, characterized by the following steps: a) providing a carrier foil with a first and a second side, b) applying an embossing lacquer to one side of the carrier foil, c) producing elevations and depressions in the embossing lacquer Formation of a microstructure, the Having microstructure elements with a pitch of 1 micron or more and a texture depth between about 1 micron and about 20 microns, and d) curing the embossing lacquer. Method according to claim 39, characterized that in step b) by radiation, preferably by UV radiation or electron beam, crosslinkable embossing lacquer applied and in step d) hardening of the embossing lacquer by exposure to radiation, preferably with UV radiation or Electron radiation occurs. Method according to claim 40, characterized in that that the embossing lacquer after step b) and before step c) Exposure to radiation, preferably with UV radiation, precured becomes. Method according to claim 39, characterized in step b), a thermoplastically deformable embossing lacquer is applied and in step d) curing of the embossing lacquer by cooling below the glass transition temperature (Glass point) of the embossing lacquer and / or by applying with radiation, in particular UV or ion radiation, takes place. Method according to at least one of the claims 39 to 42, characterized in that the generation of the elevations and depressions in step c) by an embossing tool, in particular by an embossing stamp, a stamping plate or an embossing cylinder takes place. Method according to claim 43, characterized in that that the temperature of the embossing tool is adjustable. Method according to at least one of the claims 39 to 44, characterized in that the embossing lacquer in Step b) with a layer thickness of about 1 micron to about 25 microns, preferably from 4 microns to 8 microns applied and the microstructure elements in step c) with a texture depth from 1 μm to 10 μm, preferably from 2 μm up to 6 μm. Method according to at least one of the claims 39 to 45, characterized in that the surface of the embossing lacquer with an electrically conductive Coating, in particular a metallic coating, coated becomes. Method according to claim 46, characterized in that that the surface of the embossing lacquer with an electric conductive coating of nickel silver, chrome, copper or aluminum, more preferably chromium or nickel. Method according to claim 46 or 47, characterized that the surface coating by means of a method for galvanic deposition and / or by means of a CVD, PVD or Sputtering process takes place. Method according to at least one of the claims 39 to 48, characterized in that the carrier film web-shaped and wound into a roll Will be ready for a rollable, sheet-shaped master foil to deliver. Method according to at least one of the claims 39 to 49, characterized in that the master foil in a made to such a size that they are in one Hollow cylinder, especially in a slotted hollow cylinder, without overlap can be arranged. Process for producing a stamping mold for Creating a microstructure, characterized by the following steps: a) Providing a master foil according to at least one of the claims 28 to 38 formed or according to at least one of the claims 39 to 50 is made, b) molding the microstructure of the Master foil through a galvanic process, and c) Solve the master foil of the embossing mold formed by galvanic molding. Process according to claim 51, characterized in that that the master foil after step a) in a longitudinal axis direction Slotted hollow cylinder is introduced such that the surface with the microstructures facing the hollow cylinder interior and that two distant side edges of the master foil are adjacent to each other, and that the width of the slot of the hollow cylinder is reduced, until the two side edges of the master foil abut each other. Method according to claim 52, characterized in that that the step of providing the master sheet by cutting, in particular laser beam cutting, the master foil from a larger, in particular web-shaped master sheet takes place. A method according to claim 52 or 53, characterized that the embossing mold as a self-supporting, seamless sleeve, in particular for use with a clamping cylinder is formed. Method according to at least one of the claims 51 to 54, characterized in that the surface the master sheet before the step of molding with a release agent is provided. Method according to at least one of claims 51 to 55, characterized in that the galvanic molding in step b) by depositing a metal, in particular by depositing chromium, nickel, silver, aluminum or copper, takes place. Method according to at least one of the claims 51 to 56, characterized in that a multi-layer deposition different metals, in particular a two-layer deposition carried out is, preferably first chromium in a thickness of 1 μm to 20 μm, preferably 2 μm to 4 microns, and then preferably nickel in a thickness of 8 microns to 200 microns, preferably from 10 microns to 50 .mu.m, are deposited on the master foil. Method according to at least one of the claims 51 or 55 to 57, characterized in that the stamping mold with a cutting method, in particular by means of laser cutting, tailored to such a size that on a substantially cylindrical body without overlapping areas can be arranged. Method according to claim 58, characterized that the stamping mold on the substantially cylindrical Body, in particular special by welding two End areas of the question form (joints), is attached. Method according to claim 58, characterized that the stamping mold on the substantially cylindrical Body by gluing, clamping and / or by a magnetic Holder is attached. Embossing mold for producing a microstructure, characterized in that the stamping mold after at least one of claims 51 to 60 is produced. Method for producing a security element with a microstructure, characterized in that the microstructure with a mold according to at least one of the claims 1 to 12 or one according to at least one of the claims 13 to 27 produced tool shape or with a stamping mold according to claim 61 or one according to at least one of the claims 51 to 60 produced stamping mold is produced. Method for producing a security element according to claim 62, in particular a security element with a colored or colorless microstructure on a support, in which a) the mold or embossing mold such is provided that its surface an arrangement of elevations and depressions in the shape of the desired Having microstructure, b) the depressions of the mold or embossing mold with a hardenable colored or colorless lacquer be filled c) the carrier for a good anchoring of the colored or colorless paint pretreated becomes, d) the surface of the mold or embossing mold with is brought into contact with the wearer, e) the in contact lacquer in the recesses of the mold with the support or stamping die hardened while the carrier is connected, and f) the surface of the mold or question form is removed from the carrier again, so that associated with the carrier, hardened Paint from the recesses of the mold or embossing mold is pulled. Security element with a microstructure, thereby in that the security element according to claim 62 or 63 is made.