DE102005053643A1 - Cooling device for electronic unit, e.g. processor, has contact surface thermally connected with cooling fin by using wall, and ventilation unit provided in contact surface, where wall forms form-fit connection with printed circuit board - Google Patents

Cooling device for electronic unit, e.g. processor, has contact surface thermally connected with cooling fin by using wall, and ventilation unit provided in contact surface, where wall forms form-fit connection with printed circuit board Download PDF

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Publication number
DE102005053643A1
DE102005053643A1 DE102005053643A DE102005053643A DE102005053643A1 DE 102005053643 A1 DE102005053643 A1 DE 102005053643A1 DE 102005053643 A DE102005053643 A DE 102005053643A DE 102005053643 A DE102005053643 A DE 102005053643A DE 102005053643 A1 DE102005053643 A1 DE 102005053643A1
Authority
DE
Germany
Prior art keywords
contact surface
wall
processor
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE102005053643A
Other languages
German (de)
Inventor
Johann Scherer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Conti Temic Microelectronic GmbH
Original Assignee
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Priority to DE102005053643A priority Critical patent/DE102005053643A1/en
Publication of DE102005053643A1 publication Critical patent/DE102005053643A1/en
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The device has a contact surface (18) that is thermally connected with a cooling fin (12) and is bought in contact with an electronic unit (2) e.g. processor. A soldering paste is applied on the contact surface and stays contact with a heat sink of the electronic unit for providing a firmly-bonded connection between the contact surface and the heat sink. A ventilation unit having a number of ventilation ducts (26) is provided in the contact surface. The fin is connected with the surface by a wall (8) that forms a form-fit connection with a printed circuit board (4).
DE102005053643A 2005-11-10 2005-11-10 Cooling device for electronic unit, e.g. processor, has contact surface thermally connected with cooling fin by using wall, and ventilation unit provided in contact surface, where wall forms form-fit connection with printed circuit board Ceased DE102005053643A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE102005053643A DE102005053643A1 (en) 2005-11-10 2005-11-10 Cooling device for electronic unit, e.g. processor, has contact surface thermally connected with cooling fin by using wall, and ventilation unit provided in contact surface, where wall forms form-fit connection with printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005053643A DE102005053643A1 (en) 2005-11-10 2005-11-10 Cooling device for electronic unit, e.g. processor, has contact surface thermally connected with cooling fin by using wall, and ventilation unit provided in contact surface, where wall forms form-fit connection with printed circuit board

Publications (1)

Publication Number Publication Date
DE102005053643A1 true DE102005053643A1 (en) 2007-05-16

Family

ID=37982582

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102005053643A Ceased DE102005053643A1 (en) 2005-11-10 2005-11-10 Cooling device for electronic unit, e.g. processor, has contact surface thermally connected with cooling fin by using wall, and ventilation unit provided in contact surface, where wall forms form-fit connection with printed circuit board

Country Status (1)

Country Link
DE (1) DE102005053643A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0071748A2 (en) * 1981-08-10 1983-02-16 International Business Machines Corporation Thermal conduction element for semiconductor devices
DE3733072A1 (en) * 1987-09-30 1989-04-13 Siemens Ag Electrical plug-in assembly
DE3687489T2 (en) * 1985-07-15 1993-04-29 Unisys Corp DIRECTIONAL HEAT SINKS THAT CAUSE LOW VOLTAGE ONLY, WITH DOME FASTENING.
DE10210041A1 (en) * 2002-03-07 2003-10-02 Siemens Ag Heat dissipation device, for dissipating heat generated by an electrical component

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0071748A2 (en) * 1981-08-10 1983-02-16 International Business Machines Corporation Thermal conduction element for semiconductor devices
DE3687489T2 (en) * 1985-07-15 1993-04-29 Unisys Corp DIRECTIONAL HEAT SINKS THAT CAUSE LOW VOLTAGE ONLY, WITH DOME FASTENING.
DE3733072A1 (en) * 1987-09-30 1989-04-13 Siemens Ag Electrical plug-in assembly
DE10210041A1 (en) * 2002-03-07 2003-10-02 Siemens Ag Heat dissipation device, for dissipating heat generated by an electrical component

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Legal Events

Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
R012 Request for examination validly filed

Effective date: 20121107

R002 Refusal decision in examination/registration proceedings
R003 Refusal decision now final
R125 Request for further processing filed
R127 Request for further processing refused or deemed withdrawn
R008 Case pending at federal patent court
R003 Refusal decision now final