DE102005008482A1 - Cooling module for electronic components, has cooling unit e.g. thermocouple arranged at side of components, where cooling unit converts heat energy of chilled goods into current energy, so that waste heat of chilled goods is dissipated - Google Patents
Cooling module for electronic components, has cooling unit e.g. thermocouple arranged at side of components, where cooling unit converts heat energy of chilled goods into current energy, so that waste heat of chilled goods is dissipated Download PDFInfo
- Publication number
- DE102005008482A1 DE102005008482A1 DE200510008482 DE102005008482A DE102005008482A1 DE 102005008482 A1 DE102005008482 A1 DE 102005008482A1 DE 200510008482 DE200510008482 DE 200510008482 DE 102005008482 A DE102005008482 A DE 102005008482A DE 102005008482 A1 DE102005008482 A1 DE 102005008482A1
- Authority
- DE
- Germany
- Prior art keywords
- cooling
- cooling unit
- cooling module
- module according
- chilled goods
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/26—Power supply means, e.g. regulation thereof
- G06F1/32—Means for saving power
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0251—Removal of heat by a gas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
Description
Technisches Gebiettechnical area
Die Erfindung betrifft einen Kühlmodul, der einen Energieumwandler enthält, der ein Kühlelement und ein Kühlgut umfaßt, wobei das Kühlelement die Wärmeenergie des Kühlgutes in Stromenergie umwandeln kann, wodurch die Temperatur des Kühlgutes reduziert und ein Strom erzeugt wird.The Invention relates to a cooling module, which contains an energy converter, the one cooling element and a refrigerated goods comprises wherein the cooling element the Thermal energy of the chilled goods can convert into electricity energy, reducing the temperature of the chilled goods reduced and a current is generated.
Die Betriebswärme der elektronischen Bauelemente muß abgeführt werden, um eine Beschädigung der elektronischen Bauelemente durch diese Abwärme zu vermeiden. Dafür wird am häufigsten ein Kühlventilator verwendet. Nur mit dem Kühlventilator kann eine große Wärme jedoch nicht rechtzeitig abgeführt werden.The operating heat the electronic components must be dissipated to damage the electronic components to avoid this waste heat. This will be on most common cooling fan used. Only with the cooling fan can be a big one Heat however not removed in time become.
Aus
dem chinesischen Patent 260352 ist eine Kühlbaugruppe bekannt, die ein
Kühlelement, einen
Kühlkörper mit
Kühlrippen
und einen Kühlventilator
enthält,
wobei das Kühlelement
unter dem Kühlkörper und
der Kühlventilator
auf dem Kühlkörper angeordnet
ist. Der Kühlkörper weist
eine Aufnahmeausnehmung auf, in der eine Temperaturreglerschaltung
Bei
dieser Kühlbaugruppe
kontaktiert das Kühlelement
Die Zentraleinheit weist üblicherweise ein Keramikgehäuse und einen metallischen Oberdeckel auf, auf dem der Kühlkörper aufliegt, der die Wärme des metallischen Oberdeckels absorbiert und in die Umgebungsluft abgibt. Der Kühlventilator erzeugt einen Luftstrom, der die Heißluft um den Kühlkörper abführt. Dieser Kühlmodul hat die folgenden Nachteile:
- 1. Der Kühlventilator verbraucht Strom und erzeugt auch eine Wärme.
- 2. Durch den Kühlventilator, den metallischen Deckel und den Kühlkörper werden die Kosten der Metallmaterialien erhöht.
- 3. Mit der Leistungserhöhung der Zentraleinheit muß die Kühlwirkung auch erhöht werden.
- 1. The cooling fan consumes electricity and also generates heat.
- 2. By the cooling fan, the metallic lid and the heat sink, the cost of the metal materials is increased.
- 3. With the increase in power of the central unit, the cooling effect must also be increased.
Der Erfindung liegt die Aufgabe zugrunde, einen Kühlmodul zu schaffen, der einen Energieumwandler enthält, der ein Kühlelement (Peltierelement oder Thermoelement) und ein Kühlgut umfaßt, wobei das Kühlelement die Wärmeenergie des Kühlgutes in Stromenergie umwandeln kann, mit der ein externes Kühlgerät betrieben werden kann, so daß die Energiekosten reduziert werden.Of the Invention is the object of the invention to provide a cooling module, the one Contains energy converter, the one cooling element (Peltier element or thermocouple) and a refrigerated goods, wherein the cooling element the heat energy of the chilled goods can convert into electricity energy, with which operated an external cooling unit can be, so that the Energy costs are reduced.
Der Erfindung liegt eine weitere Aufgabe zugrunde, einen Kühlmodul zu schaffen, wobei das Kühlgut ohne Gehäuse mit dem Kühlelement in Kontakt steht, wodurch die Abwärme des Kühlgutes direkt auf das Kühlelement geleitet wird, so daß die Kühlwirkung erhöht wird.Of the Invention is based on a further object, a cooling module to create, with the refrigerated goods without housing with the cooling element is in contact, whereby the waste heat of the goods to be cooled directly on the cooling element is passed, so that the cooling effect elevated becomes.
Der Erfindung liegt eine nochmals weitere Aufgabe zugrunde, einen Kühlmodul zu schaffen, der durch den Energieumwandler die Temperatur des Kühlgutes reduziert.Of the Invention is a still further object, a cooling module to create, by the energy converter, the temperature of the chilled goods reduced.
Der Erfindung liegt eine nochmals weitere Aufgabe zugrunde, einen Kühlmodul zu schaffen, der einen Kurzschluß bei der herkömmlichen Lösung vermeiden kann, da das Kühlgut die Warmseite des Kühlelementes kontaktiert.Of the Invention is a still further object, a cooling module to create a short circuit in the conventional Avoid solution can, as the refrigerated goods the hot side of the cooling element contacted.
Im folgenden wird die Erfindung anhand der bevorzugten Ausführungsbeispiele in den Figuren näher erläutert.in the The following is the invention with reference to the preferred embodiments closer in the figures explained.
Kurze Beschreibung der ZeichnungenShort description the drawings
Wege zur Ausführung der ErfindungWays to execute the invention
Das
obengenannte Kühlelement
Das
erste Substrat
Nachfolgend werden die Vorteile der Erfindung zusammengestellt:
- 1. Die Abwärme
des Kühlgutes
12 wird direkt auf das Kühlelement11 geleitet (und teilweise in die Umgebungsluft abgegeben), weil das Kühlgut12 ohne Gehäuse mit dem Kühlelement in Kontakt steht. - 2. Der Wärmeumwandler
10 kann die Wärmeenergie in Stromenergie umwandeln, mit der ein anderes Kühlgerät betrieben werden kann, so daß die Energiekosten reduziert werden. - 3. Ein Kurzschluß kann
vermieden werden, weil das Kühlgut
die Warmseite des Kühlelementes
11 kontaktiert. - 4. Die Kaltseite des Kühlelementes
11 besitzt eine Kühlwirkung, wodurch ein kleinerer Kühlventilator20 und Kühlkörper30 verwendet werden können, so daß die Materialkosten reduziert werden. Zudem muß der Kühlventilator nicht in Volleistung betrieben werden, so daß die Lebensdauer des Kühlventilators verlängert wird. - 5. Das Kühlgut
12 ist unbeschränkt und kann ein beliebiger Kühlgut12 sein.
- 1. The waste heat of the chilled goods
12 gets directly onto the cooling element11 passed (and partially released into the ambient air), because the refrigerated goods12 without housing with the cooling element in contact. - 2. The heat converter
10 Can convert the heat energy into electricity energy, with the other cooling device can be operated, so that the energy costs are reduced. - 3. A short circuit can be avoided because the refrigerated goods the hot side of the cooling element
11 contacted. - 4. The cold side of the cooling element
11 has a cooling effect, creating a smaller cooling fan20 and heat sink30 can be used, so that the material costs are reduced. In addition, the cooling fan must not be operated at full capacity, so that the life of the cooling fan is extended. - 5. The refrigerated goods
12 is unlimited and can be any refrigerated goods12 be.
Die vorstehende Beschreibung stellt nur die bevorzugten Ausführungsbeispiele der Erfindung dar und soll nicht als Definition der Grenzen und des Bereiches der Erfindung dienen. Alle gleichwertige Änderungen und Modifikationen gehören zum Schutzbereich dieser Erfindung.The The above description represents only the preferred embodiments of the invention and should not be used as a definition of boundaries and serve the scope of the invention. All equivalent changes and modifications are included to the scope of this invention.
Claims (14)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200510008482 DE102005008482A1 (en) | 2005-02-24 | 2005-02-24 | Cooling module for electronic components, has cooling unit e.g. thermocouple arranged at side of components, where cooling unit converts heat energy of chilled goods into current energy, so that waste heat of chilled goods is dissipated |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200510008482 DE102005008482A1 (en) | 2005-02-24 | 2005-02-24 | Cooling module for electronic components, has cooling unit e.g. thermocouple arranged at side of components, where cooling unit converts heat energy of chilled goods into current energy, so that waste heat of chilled goods is dissipated |
Publications (1)
Publication Number | Publication Date |
---|---|
DE102005008482A1 true DE102005008482A1 (en) | 2006-08-31 |
Family
ID=36794101
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE200510008482 Ceased DE102005008482A1 (en) | 2005-02-24 | 2005-02-24 | Cooling module for electronic components, has cooling unit e.g. thermocouple arranged at side of components, where cooling unit converts heat energy of chilled goods into current energy, so that waste heat of chilled goods is dissipated |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE102005008482A1 (en) |
-
2005
- 2005-02-24 DE DE200510008482 patent/DE102005008482A1/en not_active Ceased
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8110 | Request for examination paragraph 44 | ||
8131 | Rejection | ||
R082 | Change of representative |
Representative=s name: ELBPATENT - MARSCHALL & PARTNER PARTGMBB, DE Representative=s name: MARSCHALL & PARTNER, DE |