DE102004024601A1 - Selenizing flexible strip-like CIS cells used in the production of thin layer solar cells comprises feeding a continuous strip through a condensation zone and passing the strip through an inert carrier gas - Google Patents
Selenizing flexible strip-like CIS cells used in the production of thin layer solar cells comprises feeding a continuous strip through a condensation zone and passing the strip through an inert carrier gas Download PDFInfo
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- DE102004024601A1 DE102004024601A1 DE102004024601A DE102004024601A DE102004024601A1 DE 102004024601 A1 DE102004024601 A1 DE 102004024601A1 DE 102004024601 A DE102004024601 A DE 102004024601A DE 102004024601 A DE102004024601 A DE 102004024601A DE 102004024601 A1 DE102004024601 A1 DE 102004024601A1
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- 238000009833 condensation Methods 0.000 title claims abstract description 11
- 230000005494 condensation Effects 0.000 title claims abstract description 11
- 239000012159 carrier gas Substances 0.000 title claims abstract description 5
- 238000004519 manufacturing process Methods 0.000 title description 4
- 229910052711 selenium Inorganic materials 0.000 claims abstract description 26
- 239000011669 selenium Substances 0.000 claims abstract description 26
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims abstract description 25
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052717 sulfur Inorganic materials 0.000 claims abstract description 15
- 239000011593 sulfur Substances 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- 239000010949 copper Substances 0.000 claims abstract description 8
- 229910052738 indium Inorganic materials 0.000 claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 7
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 7
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 3
- 230000001105 regulatory effect Effects 0.000 claims abstract 4
- 238000000034 method Methods 0.000 claims description 31
- 230000008021 deposition Effects 0.000 claims description 12
- 239000007789 gas Substances 0.000 claims description 9
- 229910052708 sodium Inorganic materials 0.000 claims description 8
- 239000011734 sodium Substances 0.000 claims description 8
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 6
- 238000009826 distribution Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 159000000000 sodium salts Chemical class 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 claims 1
- 230000008961 swelling Effects 0.000 claims 1
- 238000002834 transmittance Methods 0.000 claims 1
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 abstract description 2
- QNWMNMIVDYETIG-UHFFFAOYSA-N gallium(ii) selenide Chemical compound [Se]=[Ga] QNWMNMIVDYETIG-UHFFFAOYSA-N 0.000 abstract description 2
- 210000004027 cell Anatomy 0.000 description 24
- 238000000151 deposition Methods 0.000 description 12
- 239000010410 layer Substances 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000000137 annealing Methods 0.000 description 5
- 239000011261 inert gas Substances 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 description 2
- 238000005987 sulfurization reaction Methods 0.000 description 2
- 238000005496 tempering Methods 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- 239000004280 Sodium formate Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 210000000678 band cell Anatomy 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000750 constant-initial-state spectroscopy Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- OMZSGWSJDCOLKM-UHFFFAOYSA-N copper(II) sulfide Chemical compound [S-2].[Cu+2] OMZSGWSJDCOLKM-UHFFFAOYSA-N 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000006477 desulfuration reaction Methods 0.000 description 1
- 230000023556 desulfurization Effects 0.000 description 1
- ZZEMEJKDTZOXOI-UHFFFAOYSA-N digallium;selenium(2-) Chemical compound [Ga+3].[Ga+3].[Se-2].[Se-2].[Se-2] ZZEMEJKDTZOXOI-UHFFFAOYSA-N 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- AKUCEXGLFUSJCD-UHFFFAOYSA-N indium(3+);selenium(2-) Chemical compound [Se-2].[Se-2].[Se-2].[In+3].[In+3] AKUCEXGLFUSJCD-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- SPVXKVOXSXTJOY-UHFFFAOYSA-N selane Chemical compound [SeH2] SPVXKVOXSXTJOY-UHFFFAOYSA-N 0.000 description 1
- 229910000058 selane Inorganic materials 0.000 description 1
- IRPLSAGFWHCJIQ-UHFFFAOYSA-N selanylidenecopper Chemical compound [Se]=[Cu] IRPLSAGFWHCJIQ-UHFFFAOYSA-N 0.000 description 1
- 125000003748 selenium group Chemical group *[Se]* 0.000 description 1
- 150000003385 sodium Chemical class 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 235000013024 sodium fluoride Nutrition 0.000 description 1
- 239000011775 sodium fluoride Substances 0.000 description 1
- HLBBKKJFGFRGMU-UHFFFAOYSA-M sodium formate Chemical compound [Na+].[O-]C=O HLBBKKJFGFRGMU-UHFFFAOYSA-M 0.000 description 1
- 235000019254 sodium formate Nutrition 0.000 description 1
- ZNCPFRVNHGOPAG-UHFFFAOYSA-L sodium oxalate Chemical compound [Na+].[Na+].[O-]C(=O)C([O-])=O ZNCPFRVNHGOPAG-UHFFFAOYSA-L 0.000 description 1
- 229940039790 sodium oxalate Drugs 0.000 description 1
- HYHCSLBZRBJJCH-UHFFFAOYSA-N sodium polysulfide Chemical compound [Na+].S HYHCSLBZRBJJCH-UHFFFAOYSA-N 0.000 description 1
- VPQBLCVGUWPDHV-UHFFFAOYSA-N sodium selenide Chemical class [Na+].[Na+].[Se-2] VPQBLCVGUWPDHV-UHFFFAOYSA-N 0.000 description 1
- 229910052979 sodium sulfide Inorganic materials 0.000 description 1
- GRVFOGOEDUUMBP-UHFFFAOYSA-N sodium sulfide (anhydrous) Chemical compound [Na+].[Na+].[S-2] GRVFOGOEDUUMBP-UHFFFAOYSA-N 0.000 description 1
- 210000002023 somite Anatomy 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- -1 sulfur sulfur copper indium sulfide Chemical compound 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
- H01L31/0322—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 comprising only AIBIIICVI chalcopyrite compounds, e.g. Cu In Se2, Cu Ga Se2, Cu In Ga Se2
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/228—Gas flow assisted PVD deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
- H01L31/03926—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate comprising a flexible substrate
- H01L31/03928—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate comprising a flexible substrate including AIBIIICVI compound, e.g. CIS, CIGS deposited on metal or polymer foils
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
Description
Unter den bekannten Technologien zur Herstellung von Dünnschicht-Solarzellen nimmt die sogenannte CIS-Zelle (Kupfer-Indium/Gallium-Selen/Schwefel) insofern eine besondere Stellung ein, als derartige Zellen potentiell degradationsfrei, mit hohem Wirkungsgrad, mit günstigen Kosten und umweltfreundlich hergestellt werden können. Es sind sowohl Prozesse zur Aufbringung der sogenannten Precursor-Schichten (Kupfer, Indium/Gallium, Selen/Schwefel) im Hochvakuum durch Sputtern oder Aufdampfen wie auch Non-Vakuum-Verfahren bekannt geworden, z.B. die elektrochemische Deposition der genannten Elemente oder deren Legierungen (Kupferselenid, Indiumselenid, Galliumselenid) oder des Verbindungshalbleiters (Kupferindiumselenid = ternäre Abscheidung, Kupfer-Indium-Gallium-Selenid = quaternäre Abscheidung). Im Labormaßstab produziert wurden auch CIS-Zellen, deren Precursor-Schicht durch mechanischen Auftrag einer Dispersion von Nanopartikeln der genannten Substanzen auf das sogenannte Substrat (Trägermaterial plus Anpass-, Sperr- und Kontaktschicht) hergestellt wird.Under takes the known technologies for the production of thin-film solar cells the so-called CIS cell (copper indium / gallium selenium / sulfur) a special position insofar as such cells are potentially low-degradation, high efficiency, low cost and environmentally friendly can be produced. There are both processes for applying the so-called precursor layers (Copper, indium / gallium, selenium / sulfur) in a high vacuum by sputtering or vapor deposition as well as non-vacuum method has become known e.g. the electrochemical deposition of said elements or their alloys (copper selenide, indium selenide, gallium selenide) or the compound semiconductor (copper indium selenide = ternary deposition, Copper indium gallium selenide = quaternary deposition). Produced on a laboratory scale were also CIS cells whose precursor layer by mechanical Application of a dispersion of nanoparticles of said substances on the so-called substrate (substrate plus Fitting, barrier and contact layer) is produced.
In aller Regel wird die Selenisierung, d.h. die Zuführung von Selen innerhalb vom vollständigen CIS-Zellen-Aufbau, dadurch bewerkstelligt, dass die unvollständige, d.h. Selen noch nicht enthaltende Zelle dem Temperprozess, der üblicherweise im Vakuum abläuft, unterworfen wird, wobei sich gleichzeitig im Temperofen eine auf 200°C bis 300°C erhitzte Selenquelle befindet.In In general, selenization, i. the delivery of selenium within the complete CIS cell construction, accomplished by the incomplete, i. Selenium not yet containing cell subjected to the annealing process, which usually takes place in a vacuum is at the same time in the annealing oven heated to 200 ° C to 300 ° C source of selenium located.
Bei der Band-Abscheidung von CIS enthält diese Vorgehensweise vier Nachteile
- (1) Temperprozess und Selenabscheidung sind „vernetzt", sodass die Steuerungsparameter der beiden Prozesse nicht einzeln zugreifbar und optimierbar sind
- (2) die Ein- und Ausschleusung des Bandes ins Vakuum stellt einen beherrschbaren, jedoch nicht geringfügigen apparativen Mehraufwand dar. Der Prozess-Schritt „Selenisierung" wird somit quasi doppelt mit Mehrkosten (gegenüber preiswerten non-Vakuum-Anlagen) belastet.
- (3) es entsteht eine „gemischt-rassige" Fertigungsanlage, d.h. eine Aufeinanderfolge von non-Vakuum-Schritten (galvanische Cu- und In-Abscheidung), der genannten, klassischen Selenisierung im Hochvakuum und nachfolgenden Normaldruck-Verfahren (CdS-CBD). Eine der derartige Anlagentechnik ist problematisch und sicherlich nicht als „low tech" einzustufen.
- (4) die Selenmenge, welche auf den Precursor gelangt, lässt sich nur schwer kontrollieren. In der Regel wird daher mit einem Selen-Überschuss gearbeitet, was einen nachfolgenden Ätzschritt (KCN, toxisch) erforderlich macht.
- (1) annealing process and selenium deposition are "networked", so that the control parameters of the two processes are not individually accessible and optimized
- (2) the feeding and discharging of the strip into the vacuum represents a manageable, but not negligible additional expenditure on equipment. The process step "selenization" is therefore burdened almost twice with additional costs (compared to inexpensive non-vacuum systems).
- (3) a "mixed-race" production plant is created, ie a succession of non-vacuum steps (galvanic Cu and In deposition), the mentioned classic selenization under high vacuum and subsequent normal pressure process (CdS-CBD). One of such systems engineering is problematic and certainly not classified as "low tech".
- (4) the amount of selenium which reaches the precursor is difficult to control. As a rule, a selenium excess is used, which requires a subsequent etching step (KCN, toxic).
Es ist auch versucht worden, Selen als sequentielle Schicht auf Kupfer und Indium durch elektrochemische Deposition abzuscheiden. Bei einem Halbleiter mit mehreren Modifikationen wie Selen ist dies erwartungsgemäss schwierig; die bisher bekannt gewordenen Abscheide-Ergebnisse waren als solche gut, jedoch konnten CIS-Zellen mit einem brauchbaren solaren Wirkungsgrad der Licht/Stromumwandlung hiermit nicht hergestellt werden. Dies legt die Vermutung nahe, dass ein galvanischer Selen-Abscheidungsprozess für CIS-Zellen wenig geeignet ist oder einer erheblichen Optimierungsarbeit bedarf.It Selenium has also been tried as a sequential layer on copper and to deposit indium by electrochemical deposition. For a semiconductor with several modifications like selenium this is expected to be difficult; the previously announced deposition results were as such well, however, could CIS cells with a useful solar efficiency the light / power conversion is not made hereby. This sets the suggestion that a galvanic selenium deposition process for CIS cells is poorly suited or requires considerable optimization work.
Ein weiteres, wenig vorteilhaftes Verfahren zur Selenisierung ausserhalb des Vakuums ist die Verwendung von Selenwasserstoff. Da H2S hochgradig toxisch ist, wird diese Vorgehensweise speziell für ein roll-to-roll-Verfahren, d.h. ein durchlaufendes Zellenband, nicht in Betracht gezogen.One Another, less advantageous method for selenization outside the vacuum is the use of hydrogen selenide. Because H2S is high grade is toxic, this approach is specific to a roll-to-roll process, i.e. a continuous cell belt, not considered.
Ebenfalls
bekannt geworden ist ein Verfahren der Selenisierung bzw. Sulfurisierung,
indem Schutzgas über
eine erhitzte Schwefelquelle geführt wird
und Schwefeldampf mit der Oberfläche
der erhitzten CIS-Bandzelle in Reaktion gebracht wird. (
Der
entscheidende Unterschied zur vorliegenden. Erfindungsidee liegt
in dem Umstand, dass bei der in
In
der Praxis wirkt sich die in
Die Verwendung eines RTP-Temperofens („rapid thermal process") hat den Sinn, den Temperaturbereich zwischen 100°C und 300°C zu meiden bzw. möglichst rasch zu durchlaufen. In genau diesem Sinn wird erfindungsgemäss die CIS-Bandtemperatur unter 100°C gehalten, während die Kondensation von Selendampf auf der Bandzelle stattfindet. Das erfindungsgemässe Verfahren bezweckt also, analog zu galvanischen Depositionsverfahren, ausschliesslich den Transport/ die Deposition der Substanz Selen (bzw. Schwefel) auf die Zelle, ist also keine „Selenisierung" im üblichen Sinn. Eine derartige Vorgehensweise ist bisher bei der CIS-Zellen-Herstellung nicht bekannt geworden, während ansonsten die Gasphasen-Epitaxie, beispielsweise zur Abscheidung isolierender Oberflächen-Schichten auf kristallinen Silizium-Solarzellen, eine durchaus bekannte Technologie darstellt.The Using a RTP tempering furnace ("rapid thermal process") has the meaning, the Temperature range between 100 ° C and 300 ° C to avoid or as possible to go through quickly. In exactly this sense, according to the invention, the CIS belt temperature below 100 ° C kept while the condensation of selenium vapor takes place on the ribbon cell. The invention The purpose of the method is thus, analogously to galvanic deposition methods, exclusively the transport / deposition of the substance selenium (or sulfur) on the cell, so is not a "selenization" in the usual Sense. Such a procedure has hitherto been used in CIS cell production not known while otherwise the gas phase epitaxy, for example for deposition insulating surface layers on crystalline silicon solar cells, a well-known technology represents.
Der Vollständigkeit halber sei vermerkt, dass sich übliche PVD-Verfahren zur Deposition von Selen auch wegen den ihren eigentümlichen, geringen Abscheideraten für die Beschichtung rasch durchlaufender CIS-Zellenbänder weniger eignen: die benötigte Schichtdicke von Selen und/oder Schwefel liegt mit 0,5 bis 0,8 μm verhältnismässig hoch.Of the completeness half note that usual PVD process for the deposition of selenium also because of their peculiar, low deposition rates for the coating of rapidly passing CIS cell bands less suitable: the needed Layer thickness of selenium and / or sulfur is relatively high at 0.5 to 0.8 microns.
Bekannt ist, dass die Zufügung von 2-5 At% Natrium den Wirkungsgrad von CIS-Zellen verbessert, wobei dieses Natrium, sofern es nicht aus dem Glassubstrat in die CIS-Schicht eindiffundiert, in einem separaten Hochvakuumschritt durch Verdampfen von beispielsweise Natriumfluorid eingebracht wird. Erfindungsgemäss ist vorgesehen, dass in der Quellzone eine zweite, getrennt temperaturgeregelte Quelle mit einem Natriumsalz aufgestellt wird.Known is that the infliction from 2-5 at% sodium improves the efficiency of CIS cells, this sodium, unless it is from the glass substrate in the CIS layer diffused in, in a separate high vacuum step by evaporation of, for example Sodium fluoride is introduced. According to the invention, it is provided that in the source zone a second, separately temperature-controlled source with a sodium salt is placed.
Es erscheint zunächst naheliegend, hierfür Natriumselenid, Natriumsulfid oder Natriumpolysulfid zu verwenden, jedoch haben diese Substanzen Nachteile gezeigt. Letztere lassen sich vermeiden, wenn ein organisches Natriumsalz verwendet wird, das sich bei niedrigen Temperaturen aufspaltet unter Freisetzung flüchtiger Bestandteile (beispielsweise CO2), beispielsweise Natriumformiat, Natriumoxalat oder Natriumacetat.It appears first obvious, for this sodium selenide, To use sodium sulfide or sodium polysulfide, however these substances show disadvantages. The latter can be avoided if an organic sodium salt is used which is at low Temperatures split with release of volatile constituents (for example CO2), for example, sodium formate, sodium oxalate or sodium acetate.
Zur Erhöhung der Zellenspannung und damit des Wirkungsgrades der CIS-Solarzelle wird ferner die Verwendung von Schwefel zusätzlich zu Selen empfohlen (sogenannte CISS-Zellen). Erfindungsgemäss erfolgt dies nicht durch sogenanntes Nachschwefeln des fertigen Absorbers, da hierfür ein weiterer Temperschritt (Nachtempern bei ca. 300°C) erforderlich wird, sondern indem zusätzlich Schwefel, vorzugsweise elementar, in der Quellzone der Selenisierungs-Einrichtung angeboten wird. Um den Schwefel-Partialdampfdruck getrennt zu einzustellen, wird eine separate Schwefelquelle mit eigener Temperatur-Regelung installiert.to increase the cell voltage and thus the efficiency of the CIS solar cell Furthermore, the use of sulfur in addition to selenium is recommended (so-called CISS cells). According to the invention this is not done by so-called desulfurization of the finished Absorbers, because of this a further annealing step (post-annealing at about 300 ° C) required is, but in addition Sulfur, preferably elemental, in the source zone of the selenization unit is offered. To the sulfur partial vapor pressure to adjust separately, with a separate source of sulfur own temperature control installed.
Die erfindungsgemässe Einrichtung zur Beschichtung von CIS-Bandzellen besteht demnach aus einem Aufbau aus Selenverträglichem und erwärmbaren Material mit 3 Zonen: der Quellenzone, in welcher zumindest die Selenquelle, vorzugsweise aber auch eine Schwefel- und/oder eine Natriumquelle einzeln beheizt./temperaturgeregelt und von dem inerten Schutzgas/Schleppgas (z.B. Argon oder Stickstoff) überströmt enthalten ist, der Transportzone, durch welche das Gas-Dampfgemisch zur Bandzelle geleitet wird und der Kondensationszone, durch welche das Zellenband, weiches bereits mit Kupfer und Indium beschichtet ist, temperaturgeregelt hindurchläuft.The invention Device for coating CIS-band cells is therefore made a structure made of selenium-compatible and heatable Material with 3 zones: the source zone, in which at least the Selenium source, but preferably also a sulfur and / or a Sodium source individually heated./temperaturgeregelt and of the inert Inert gas / entraining gas (e.g., argon or nitrogen) overflowed is, the transport zone through which the gas-vapor mixture to the belt cell and the condensation zone through which the cell belt, soft already coated with copper and indium, temperature controlled passes.
Es versteht sich, dass Vorkehrungen getroffen werden müssen, damit das Gas-Dampfgemisch das CIS-Band derart anströmt und derart auf dem Band kondensiert, dass eine homogene laterale Verteilung des Kondensates, d.h. eine sehr gleichmässige Dicke der Selenschicht gewährleistet ist. Hierzu können, ausser der bereits erwähnten, gleichmässigen Temperaturverteilung quer zur Bandlaufrichtung, die aus nasschemischen Abscheidungen bekannten Methoden angewendet werden, beispielsweise Lochblenden oder Anström-Düsen.It is understood that precautions must be taken so that the gas-vapor mixture the CIS band flows in such a way and condensed on the tape such that a homogeneous lateral Distribution of the condensate, i. a very uniform thickness the selenium layer ensured is. For this purpose, except the one already mentioned, uniform Temperature distribution transverse to the strip running direction, the wet-chemical Deposits known methods are applied, for example Aperture or stream nozzles.
Weiterhin versteht es sich, dass die Materialien, aus welchen die erfindungsgemässe Einrichtung zur Selenisierung aufgebaut ist, resistent gegen die agressive Einwirkung von Selen sein müssen. Ferner ist eine Beheizung ratsam, damit das Selen ausschliesslich auf dem CIS-Band und nicht an anderen Stellen der Quellen-, Transport- und Reaktionszone kondensiert. Hierfür bietet sich Quarzglas an, ggf. mit verminderter Transparenz, sodass die Beheizung der Begrenzungsflächen durch absorbierte Wärmestrahlung erfolgen kann.Farther it is understood that the materials from which the inventive device for Selenization is built up, resistant to the aggressive action must be from selenium. Furthermore, heating is advisable so that the selenium exclusively on the CIS volume and not elsewhere in the source, transport and and reaction zone condensed. For this purpose, quartz glass offers, possibly with reduced transparency, so that the heating of the boundary surfaces by absorbed heat radiation can be done.
Die Strömungsgeschwindigkeit bzw. Durchflussmenge des Schleppgases ist regelbar, sodass das Verdünnungsverhältnis Dampf/Trägergas und somit die Abscheidegeschwindigkeit auf dem CIS-Band einstellbar ist; eine Erwärmung des Inertgases kann erforderlich sein.The flow rate or flow rate of the towing gas is adjustable, so that the dilution ratio steam / carrier gas and thus the deposition rate is adjustable on the CIS band; a warming the inert gas may be required.
Die Temperatur-Konstanz des durchlaufenden CIS-Bandes wird in bekannter Weise durchgeführt, beispielsweise könnte das Band in innigem Kontakt zu einer rückseitigen Kühlfläche stehen; es dürfte jedoch ausreichend sein, das Inertgas vor seiner Verwendung als Schleppgas zur Temperierung des Bandes zu verwenden, indem die Bandrückseite dem (unerwärmten) Gasstrom ausgesetzt wird.The Temperature constancy of the continuous CIS band is known in the art Way, for example the tape is in intimate contact with a backside cooling surface; it might however, be sufficient to use the inert gas before its use as To use towing gas for tempering the tape by the back of the band (Unheated) Gas stream is exposed.
Soweit das dampfbeladene Schleppgas nach Durchströmen der Kondensationszone noch Selen enthält, wird dieses mittels der bekannten Kühlfallen ausgefällt und recyclet, sodass der gesamte, vorgeschlagene Selenisierungsprozess ohne umweltbelastende Emissionen verläuft.As far as the steam-laden towing gas after flowing through the condensation zone yet Contains selenium, this is precipitated by means of the known cold traps and recycled, so that the entire proposed selenization process proceeds without polluting emissions.
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2144296A1 (en) * | 2008-06-20 | 2010-01-13 | Volker Probst | Method for manufacturing a semiconductive layer |
WO2010092471A2 (en) | 2009-02-16 | 2010-08-19 | Centrotherm Photovoltaics Ag | Method and device for coating planar substrates with chalcogens |
WO2010100560A1 (en) * | 2009-03-06 | 2010-09-10 | Centrotherm Photovoltaics Ag | Process and device for the thermal conversion of metallic precursor layers into semiconducting layers with chalcogen recovery |
DE102011103788A1 (en) * | 2011-06-01 | 2012-12-06 | Leybold Optics Gmbh | Device for surface treatment with a process steam |
US9284641B2 (en) | 2008-11-28 | 2016-03-15 | Volker Probst | Processing device for producing semiconductor layers and coated substrates treated with elemental selenium and/or sulphur |
-
2004
- 2004-05-13 DE DE102004024601A patent/DE102004024601A1/en not_active Withdrawn
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2144296A1 (en) * | 2008-06-20 | 2010-01-13 | Volker Probst | Method for manufacturing a semiconductive layer |
US8846442B2 (en) | 2008-06-20 | 2014-09-30 | Volker Probst | Method for producing semiconductor layers and coated substrates treated with elemental selenium and/or sulphur, in particular flat substrates |
US9082796B2 (en) | 2008-06-20 | 2015-07-14 | Volker Probst | Process device for processing in particular stacked processed goods |
US9284641B2 (en) | 2008-11-28 | 2016-03-15 | Volker Probst | Processing device for producing semiconductor layers and coated substrates treated with elemental selenium and/or sulphur |
WO2010092471A2 (en) | 2009-02-16 | 2010-08-19 | Centrotherm Photovoltaics Ag | Method and device for coating planar substrates with chalcogens |
DE102009009022A1 (en) | 2009-02-16 | 2010-08-26 | Centrotherm Photovoltaics Ag | Method and device for coating flat substrates with chalcogens |
WO2010100560A1 (en) * | 2009-03-06 | 2010-09-10 | Centrotherm Photovoltaics Ag | Process and device for the thermal conversion of metallic precursor layers into semiconducting layers with chalcogen recovery |
DE102009011496A1 (en) * | 2009-03-06 | 2010-09-16 | Centrotherm Photovoltaics Ag | Process and device for the thermal conversion of metallic precursor layers into semiconducting layers with chalcogen recovery |
DE102011103788A1 (en) * | 2011-06-01 | 2012-12-06 | Leybold Optics Gmbh | Device for surface treatment with a process steam |
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