DE102004015230A1 - Intensifying pulsed magnetron discharge in a vacuum chamber comprises deflecting an additional electron stream from an additional electron source to a first electrode so that ions are formed in the region of the electrode - Google Patents

Intensifying pulsed magnetron discharge in a vacuum chamber comprises deflecting an additional electron stream from an additional electron source to a first electrode so that ions are formed in the region of the electrode Download PDF

Info

Publication number
DE102004015230A1
DE102004015230A1 DE200410015230 DE102004015230A DE102004015230A1 DE 102004015230 A1 DE102004015230 A1 DE 102004015230A1 DE 200410015230 DE200410015230 DE 200410015230 DE 102004015230 A DE102004015230 A DE 102004015230A DE 102004015230 A1 DE102004015230 A1 DE 102004015230A1
Authority
DE
Germany
Prior art keywords
electrode
additional electron
vacuum chamber
intensifying
ions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE200410015230
Other languages
German (de)
Other versions
DE102004015230B4 (en
Inventor
Fred Fietzke
Heidrun Klostermann
Klaus Goedicke
Volker Kirchhoff
Tilo Wuensche
Bernd-Georg Boecher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV filed Critical Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Priority to DE200410015230 priority Critical patent/DE102004015230B4/en
Publication of DE102004015230A1 publication Critical patent/DE102004015230A1/en
Application granted granted Critical
Publication of DE102004015230B4 publication Critical patent/DE102004015230B4/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/354—Introduction of auxiliary energy into the plasma
    • C23C14/355—Introduction of auxiliary energy into the plasma using electrons, e.g. triode sputtering

Abstract

Intensifying a pulsed magnetron discharge in a vacuum chamber (3) comprises deflecting an additional electron stream from an additional electron source (9) to a first electrode (1) for a part of each time period, in which the first electrode is operated non cathodically, so that ions are formed in the region of the first electrode. An independent claim is also included for a device for operating a pulsed magnetron discharge in a vacuum chamber. Preferred Features: The first electrode alternates as a cathode or anode. A hollow cathode is used as the additional electron source. A thin layer is formed on a substrate using magnetron sputtering.
DE200410015230 2004-03-29 2004-03-29 Method and apparatus for intensifying a pulsed magnetron discharge Expired - Fee Related DE102004015230B4 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE200410015230 DE102004015230B4 (en) 2004-03-29 2004-03-29 Method and apparatus for intensifying a pulsed magnetron discharge

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE200410015230 DE102004015230B4 (en) 2004-03-29 2004-03-29 Method and apparatus for intensifying a pulsed magnetron discharge

Publications (2)

Publication Number Publication Date
DE102004015230A1 true DE102004015230A1 (en) 2005-10-20
DE102004015230B4 DE102004015230B4 (en) 2007-07-05

Family

ID=35033936

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200410015230 Expired - Fee Related DE102004015230B4 (en) 2004-03-29 2004-03-29 Method and apparatus for intensifying a pulsed magnetron discharge

Country Status (1)

Country Link
DE (1) DE102004015230B4 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1849886A1 (en) * 2006-04-25 2007-10-31 VTD Vakuumtechnik Dresden GmbH Apparatus and method for plasma enhanced deposition of hard material layers
DE102008019202A1 (en) * 2008-04-17 2009-10-22 Kennametal Inc. Coating method, workpiece or tool and its use
DE102009015477A1 (en) * 2009-03-26 2010-09-30 Roth & Rau Ag Physical vapor deposition coating process for a substrate, comprises depositing two different coating materials on a substrate one after the other in a vacuum chamber by using two magnetrons
CZ305631B6 (en) * 2014-06-25 2016-01-13 Tesla Electrontubes S.R.O. Apparatus for coating internal cavities of small cross section and large longitudinal dimensions using magnetron-sputtering method
EP3012856A1 (en) 2014-10-24 2016-04-27 CemeCon AG Method and device for generating an electrical discharge

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4588490A (en) * 1985-05-22 1986-05-13 International Business Machines Corporation Hollow cathode enhanced magnetron sputter device
DE19651615C1 (en) * 1996-12-12 1997-07-10 Fraunhofer Ges Forschung Sputter coating to produce carbon layer for e.g. magnetic heads

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1849886A1 (en) * 2006-04-25 2007-10-31 VTD Vakuumtechnik Dresden GmbH Apparatus and method for plasma enhanced deposition of hard material layers
DE102008019202A1 (en) * 2008-04-17 2009-10-22 Kennametal Inc. Coating method, workpiece or tool and its use
DE102009015477A1 (en) * 2009-03-26 2010-09-30 Roth & Rau Ag Physical vapor deposition coating process for a substrate, comprises depositing two different coating materials on a substrate one after the other in a vacuum chamber by using two magnetrons
CZ305631B6 (en) * 2014-06-25 2016-01-13 Tesla Electrontubes S.R.O. Apparatus for coating internal cavities of small cross section and large longitudinal dimensions using magnetron-sputtering method
EP3012856A1 (en) 2014-10-24 2016-04-27 CemeCon AG Method and device for generating an electrical discharge
DE102014115492A1 (en) 2014-10-24 2016-04-28 Cemecon Ag Method and device for generating an electronic discharge
US9773650B2 (en) 2014-10-24 2017-09-26 Cemecon Ag Method and device for generating an electrical discharge

Also Published As

Publication number Publication date
DE102004015230B4 (en) 2007-07-05

Similar Documents

Publication Publication Date Title
US5777438A (en) Apparatus for implanting metal ions in metals and ceramics
US20050109607A1 (en) Combined coating process comprising magnetic field-assisted, high-power, pulsed cathode sputtering and an unbalanced magnetron
SE0302045D0 (en) Work piece processing by pulsed electric discharges in solid-gas plasmas
WO2007124032A3 (en) Dual plasma beam sources and method
WO2005103321A3 (en) Ionized physical vapor deposition (ipvd) process
US10418230B2 (en) Method and apparatus for manufacturing cleaned substrates or clean substrates which are further processed
JP2013535074A5 (en)
JP2007009310A (en) Method for forming amorphous carbon film
WO2007038368B1 (en) Reactive dual magnetron sputtering device with synchronised gas supply
WO2007124879A3 (en) Homogeneous pvd coating device and method
DE102004015230A1 (en) Intensifying pulsed magnetron discharge in a vacuum chamber comprises deflecting an additional electron stream from an additional electron source to a first electrode so that ions are formed in the region of the electrode
JP2006144115A (en) Deposition apparatus
JP6935897B2 (en) Reaction film forming apparatus and forming method by magnetron sputtering method
US8304744B2 (en) Closed drift ion source
WO2002061790A3 (en) Microcathode with integrated extractor
ATE479196T1 (en) HIGH FREQUENCY ELECTRON SOURCE, ESPECIALLY NEUTRALIZER
JP2018040057A (en) Method for depositing layer using magnetron sputtering device
WO2009025306A1 (en) Sputtering method
EP1780754A8 (en) Electron emission display
TW200739647A (en) Cathode and counter-cathode arrangement in an ion source
JP6832572B2 (en) Method of forming a decorative film by the magnetron sputtering method
JP2007510311A5 (en)
Ehiasarian et al. Industrial size high power impulse magnetron sputtering
WO2008004240A3 (en) Device and method for thin film deposition using a vacuum arc in an enclosed cathode-anode assembly
US9198274B2 (en) Ion control for a plasma source

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8364 No opposition during term of opposition
R084 Declaration of willingness to licence
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee