DE10139986A1 - Electronic component comprises a semiconductor chip having an active front side with semiconductor structures and a passive rear side without semiconductor structures - Google Patents

Abstract

Electronic component comprises a semiconductor chip (2) having an active front side with semiconductor structures and a passive rear side without semiconductor structures. The semiconductor structures are accessed via small microscopic conductor strips which lead to contact connection surfaces (4) on the active front side for contacting the semiconductor structures with bonding wires and/or for assembling in flip-chip technology. An Independent claim is also included for a process for the production of the electronic component.

Description

The invention relates to an electronic component with little least a semiconductor chip and a method for its manufacture position according to the independent claims.

To the functions of electronic circuits on semi-lead To test terchips, so-called emulation chips are used det. So for testing on the individual circuit components can be accessed, their connection ports be led outside. With the emulation chips, too this purpose additional rewiring in the form of additional Lichen polymer layers or in the form of another metal able to be provided, each in the manufacture of the Semiconductor wafers are applied. The different radio functionalities of the semiconductor chips can also be bonds are controlled. All of these measures are relatively complex and not very flexible. In addition to the manufacture other process steps necessary than in the production of the later series components.

The object of the invention is to provide a device which avoids the disadvantages in the prior art and made it possible light, with standard semiconductor chips their circuits too To make test and emulation purposes accessible.

This task is the subject of the independent An sayings solved. Features of advantageous developments of the Invention result from the dependent claims.

An electronic component has at least one half conductor chip on that has an active front with semiconductor structures and a passive back without semiconductor structure ren has. According to the invention, the semiconductor structure  ren about microscopic conductor tracks, which on the acti ven front to contact pads for contacting of the semiconductor structures with bond wires and / or for mounting lead in flip-chip technology.

This electronic component according to the invention has the advantage share on that one and the same component both as a product chip, d. H. as a standard sales product, as well as an emula tion chip, for example for testing individual modules or soft goods that can be used. Here are no complex and increase the cost of development and production additional process steps required for wafer production dig, since individual functionalities of the semiconductor chip varia can be switched on and off. It is also because of it possible the production chip both in flip-chip technology as well as further processed in wirebond technology (e.g. in Package or on a base substrate).

In one embodiment of the invention, the contacts are on end faces partially coverable, which combines the advantage is that by using so-called multifunk tion pads individual chip functions variably on and off can be switched. For the product chip, the Stan dard bond connections - here also as contact pads designated - used; the inside flip chip The connection areas are masked. For the emulation chip can be Contact pads either completely covered or as Mul ti-function connections are operated. In this case silicon area on the semiconductor chip can also be saved.

An embodiment of the invention provides that the Kon clock pads at least partially with a z. B. Poly are covered. This has the advantage of being a good one insulating coating, with which individually as needed ne contact pads can be covered.  

In one embodiment of the invention, the contacts are on End surfaces with contact bumps, which is the advantage connected by easily manufactured flip-chip connections is. The contact bumps are, for example, small portions from Lotpa which are connected to further contact surfaces by heating can be.

An embodiment of the invention provides that the Kon Clock pads for flip-chip assembly are provided. This has the advantage of an inexpensive connector connections, which also enables a very compact design union.

An embodiment according to the invention provides that Variation in the coverage of wire bonds a variety of Flip chip pads can be formed. This has the advantage that an electronic component without profound modifications tion in the manufacturing process both as a product chip and as Emulation chip can be used.

In one embodiment of the invention, the are not abge covered contact areas with contact bumps. This has the advantage that in this way very much compact flip-chip connections can be made.

An embodiment according to the invention provides that the uncovered contact pads via bond contacts electrically conductive with conductor tracks of a rewiring plate tend to be connected, which has the advantage that with this easy-to-use standard connection technology very inexpensive components can be produced.

An embodiment of the invention provides that the Umver wiring board made of an epoxy plastic. This Embodiment has the advantage of being very inexpensive Feasibility of the electronic component. In addition, um  Epoxy plastic wiring boards relatively flexible and stable and therefore mechanically highly resilient.

In one embodiment of the invention, the openings (areas not covered) galvanically reinforced (e.g. with Copper). This enables an optimized current flow (higher Current carrying capacity) and / or an impedance matching so like / or an optimized heat dissipation.

In one embodiment of the invention, the conversion exists wiring board made of a ceramic substrate. This execution form has the advantage that such a rewiring plate conducts heat well. In addition, in a ceramic substrate compact and thin conductor tracks can be realized, with which whole component can be made very compact.

An inventive method for producing an elec tronic component with at least one semiconductor chip, the an active front with semiconductor structures and one has passive back without semiconductor structures, wherein the semiconductor structures via microscopic conductors contact on the active front end faces for contacting the semiconductor structures Lead wires and / or for assembly using flip-chip technology ren, has the following process steps. After ready start a semiconductor wafer with in rows and columns ordered semiconductor chips and saw provided between them contact areas are partially masked end surfaces with an insulating coating for bil formation of flip-chip contact areas. If necessary, can thereupon a galvanic reinforcement of the contact surfaces takes place Then the flip chip contact areas with contact hump coated. The semiconductor wafer is then closed Semiconductor chips isolated. Finally the assembly takes place of at least one semiconductor chip and the assembly too an electronic component.  

This method according to the invention has the advantage that a and the same semiconductor chip both as a product chip as well can be used as an emulation chip. In development and test stage can thus save considerable costs be compared to the series production of the semiconductor wafer only minimal modifications in the manufacturing process necessary are.

An embodiment of the method according to the invention provides that the insulating coating made of a poly material is formed. So the advantage of one is good insulating layer, which allows individual Switch chip functions on and off variably.

Another embodiment of the Ver fahrens provides that the contact bumps are made of solder balls be formed. This embodiment has the advantage of inexpensive to manufacture contacts that are mechanically form a stable and electrically conductive connection.

In a further embodiment of the invention The method is finally provided as a semiconductor chips logic modules are used, since the pre proposed methods especially for the production of logic building blocks, but less so for the production of food cherbausstein, high-frequency components or the like.

In summary, the following aspects of the Erfin result dung. The already existing relatively large elongated cones clock pads, the so-called wirebond pads on the Semiconductor chips are made by applying standard polymers can be converted into relatively small contact pads. These so-called flip chip pads are suitable for one Flip-chip assembly of the semiconductor chips. The conversion into the flip Chip pads are made by masking with polymers such as they usually he in the manufacture of semiconductor wafers follows. With some layouts of semiconductor chips, in particular  for those with rewiring plates made of ceramic substrates rewiring with bond connection is out of the question. Such layouts must be made using flip-chip technology be clocked. This is either completely different tetes chip layout necessary or the conversion of the standard Chips in a flip-chip layout, with a different type Avoid chip layout if possible for cost reasons is. In addition, such a procedure comes with little Number of pieces anyway hardly in question. The present invention offers the possibility of a reliable connection technology to deliver for emulation chips without their layout for the later series production must be changed significantly. This is made easier by the fact that no rewiring in Polymer layers is necessary. In addition, the invention Solution relatively inexpensive because there is no additional metal layer is required in wafer production. Neither will too additional silicon area required for connection connection.

By using multifunction pads according to the invention can variably switch chip functions on and off become. I.e. it is possible to use signals for software testing purposes or to tap for real-time measurements without having to bond bond are necessary. One and the same semiconductor chip can both as a product chip and as an emulation chip, d. H. to the Testing the software and individual circuits, who operated the. For the product chip, the existing rela large contact pads can be used. The in NEN flip-chip pads are removed from the mask covers. For the emulation chip, the conventional con clock pads are either completely covered or also are operated as multi-function pads, the latter in the If silicon area is also saved.

The invention will now be described with reference to embodiments explained in more detail on the accompanying figures.  

Fig. 1 shows a schematic diagram of a semiconductor chip with exposed contact connection surfaces for wire bonding.

FIG. 2 shows a schematic basic illustration of the semiconductor chip corresponding to FIG. 1 with partially covered contact connection areas.

Fig. 3 shows a schematic diagram of a semiconductor chip with exposed contact connection areas for wire bonding and a covered loading area.

FIG. 4 shows a schematic basic illustration of the semiconductor chip corresponding to FIG. 3 with partially covered contact connection areas for forming flip-chip contacts.

Fig. 1 shows a schematic diagram of a semiconductor chip 2 with exposed first contact connection surfaces for wire bonding. These elongated contact connection surfaces are referred to below for better differentiation as bond contact surfaces 4 , which are provided for connection to a bond wire. This illustration shows a standard product chip as it is used for various applications in conventional bond connection technology.

Fig. 2 shows a schematic diagram of the semiconductor chip corresponding to FIG. 1 with partially covered contact pads. The resulting relatively small so-called test contact surfaces 6 are no longer suitable for wire bonding due to their size, but only for the so-called flip-chip connection. The coated sections of the bond contact surfaces 4 are preferably provided with a poly mer cover 8 or the like, which ensures reliable electrical insulation of the covered areas. The test contact surfaces 6 of this emulation chip are used for electrical contacting of the simulation and test circuits, with which individual chip functionalities can be tested for their functionality.

Furthermore, FIG. 3 shows a schematic basic illustration of a semiconductor chip 2 with exposed contact connection areas for wire bonding - here referred to as bond contact areas 4 - and a covered area. The same parts as in FIGS. 1 and 2 are hen with the same reference numerals and are sometimes not explained several times. The right section of the semiconductor chip 2 is in turn provided with a polymer cover 8 , which ensures electrical insulation of the test contact surfaces 6 , which are partially exposed in FIG. 4. This standard product chip with the masked inner test contact surfaces 6 can be provided with a rewiring plate using known bond wire connection technology and can then be further processed into electronic components.

Finally, FIG. 4 shows a schematic illustration of the principle of the semiconductor chip 2 corresponding to FIG. 3 with partially covered contact connection areas for forming flip-chip contacts. These test contact surfaces 6 in the flip chip design, which are left free by the polymer cover 8, are in turn used for emulation purposes or the like, but can also be used in the product chip if, for example, an individual chip module is to be accessed.

As was already apparent from FIGS . 1 to 4, only minimal modifications are necessary in the manufacturing process of the semiconductor wafers in order to switch from an emulation chip with small test contact surfaces 6 in the flip chip design with its partially covered bond contact surfaces 4 for the production of standard product chips. Essentially, only the areas to be coated by the polymer cover 8 are to be changed.

LIST OF REFERENCE NUMBERS

2

Semiconductor chip

4

Bond contact surfaces (contact connection surfaces)

6

Test contact areas (contact connection areas)

8th

polymer cover

Claims (15)

1. Electronic component with at least one semiconductor chip ( 2 ), which has an active front side with semiconductor structures and a passive rear side without semiconductor structures, the semiconductor structures having microscopic conductor tracks which on the active front side to contact pads ( 4 , 6 ) lead to contacting the semiconductor structures with bond wires and / or mounting in flip-chip technology. 2. Electronic component according to claim 1, characterized in that the contact pads ( 4 , 6 ) are partially coverable. 3. Electronic component according to claim 1 or 2, characterized in that the contact connection surfaces ( 4 , 6 ) are at least partially provided with a polymer cover ( 8 ). 4. Electronic component according to one of the preceding claims, characterized in that the contact connection surfaces ( 4 , 6 ) are provided with contact bumps. 5. Electronic component according to one of the preceding claims, characterized in that the contact connection surfaces ( 4 , 6 ) are provided for flip-chip assembly. 6. Electronic component according to one of the preceding An claims, characterized in that  by partially covering wire bonds are formed by flip-chip pads. 7. Electronic component according to one of the preceding claims, characterized in that the uncovered contact pads ( 4 , 6 ) are each provided with contact bumps. 8. Electronic component according to one of claims 1 to 6, characterized in that the uncovered contact pads ( 4 , 6 ) are electrically conductively connected to interconnects of a rewiring plate via bond contacts. 9. Electronic component according to claim 8, characterized in that the rewiring plate made of an epoxy plastic stands. 10. Electronic component according to claim 8, characterized in that the rewiring plate from a ceramic substrate stands. 11. A method for producing an electronic component with at least one semiconductor chip ( 2 ), which has an active front side with semiconductor structures and a passive rear side without semiconductor structures, the semiconductor structures having microscopic conductor tracks that contact contact areas on the active front side ( 4 , 6 ) lead to the contacting of the semiconductor structures with bonding wires and / or to assembly using flip-chip technology, the method comprising the following method steps:

• - Providing a semiconductor wafer with semiconductor chips ( 2 ) arranged in rows and columns and saw track areas provided between them,
• - Partial masking of contact pads ( 4 , 6 ) with an insulating coating for forming flip-chip contact areas ( 6 ),
• - coating the flip-chip contact areas ( 6 ) with contact bumps,
• - Separating the semiconductor wafer into semiconductor chips ( 2 ),
• - Assembly of at least one semiconductor chip ( 2 ) and assembly to form an electronic component.

12. The method according to claim 11, characterized in that the insulating coating ( 8 ) is formed from a polymer material. 13. The method according to claim 11 or 12, characterized in that the contact bumps are formed from solder balls. 14. The method according to any one of claims 11 to 13, characterized in that logic chips are used as semiconductor chips ( 2 ). 15. The method according to any one of claims 11 to 14 position of an electronic component according to at least one of claims 1 to 10.