DE10111028A1 - Smart card module - Google Patents
Smart card moduleInfo
- Publication number
- DE10111028A1 DE10111028A1 DE2001111028 DE10111028A DE10111028A1 DE 10111028 A1 DE10111028 A1 DE 10111028A1 DE 2001111028 DE2001111028 DE 2001111028 DE 10111028 A DE10111028 A DE 10111028A DE 10111028 A1 DE10111028 A1 DE 10111028A1
- Authority
- DE
- Germany
- Prior art keywords
- chip
- thickness
- substrate
- module
- card module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
Die vorliegende Erfindung betrifft ein Chipkartenmodul, das einen Halbleiterchip umfasst und zum Einsetzen in einen Kar tenkörper einer Chipkarte vorgesehen ist.The present invention relates to a chip card module that comprises a semiconductor chip and for insertion into a card Tenkkörper a chip card is provided.
Die Halbleiterchips mit elektronischen Schaltungen, die für Chipkarten verwendet werden, werden üblicherweise als Modul hergestellt, das als Ganzes in den Körper einer Chipkarte eingesetzt wird. Ein solches Modul umfasst außer dem Chip ei nen Chipträger, der insbesondere mit Anschlusskontakten für den elektrischen Anschluss versehen ist.The semiconductor chips with electronic circuits that are used for Smart cards are usually used as a module manufactured that as a whole in the body of a smart card is used. In addition to the chip, such a module comprises egg NEN chip carrier, which in particular with connection contacts for the electrical connection is provided.
Substrate als Chipträger eines Chipmoduls besitzen eine Dicke von typisch etwa 165 µm, während die Dicke des darauf aufge brachten Halbleiterchips typisch etwa 185 µm beträgt. Zwi schen beiden Teilen kann eine Klebeschicht von typisch etwa 30 µm vorhanden sein.Substrates as chip carriers of a chip module have a thickness of typically about 165 microns, while the thickness of the on it brought semiconductor chips is typically about 185 microns. Zwi Both parts can have an adhesive layer of typically approximately 30 µm are present.
Dabei tritt das Problem auf, dass die Chips, die in Modulen in Chipkarten eingebaut werden, bei einem Verbiegen der Chip karte leicht brechen können. Um dieses Problem zu beseitigen, sind eine Reihe von Versteifungen des als Chipträger verwen deten Substrats vorgeschlagen worden. Verschiedene Möglich keiten, das Brechen des Chips eines Chipkartenmoduls zu ver hindern, sind in WO 91/01533, US 5,147,982, US 6,068,191, JP 61-204788, DE 29 42 422, DE 32 35 650, DE 36 39 630, DE 43 02 387, DE 196 23 826, FR 2644630, EP 0 211 360, EP 0 599 194 und EP 0 628 997 angegeben.The problem that arises is that the chips are in modules be installed in chip cards when the chip is bent can easily break card. To fix this problem are a series of stiffeners used as a chip carrier deten substrate have been proposed. Different possible to break the chip of a chip card module are prevented in WO 91/01533, US 5,147,982, US 6,068,191, JP 61-204788, DE 29 42 422, DE 32 35 650, DE 36 39 630, DE 43 02 387, DE 196 23 826, FR 2644630, EP 0 211 360, EP 0 599 194 and EP 0 628 997.
Aufgabe der vorliegenden Erfindung ist es, ein einfach her stellbares Chipmodul anzugeben, das eine ausreichende Sicher heit gegen Brechen des Chips bei einer Biegebelastung einer Chipkarte aufweist. The object of the present invention is a simple adjustable chip module to specify that sufficient security against breaking the chip when a bending load is applied Has chip card.
Diese Aufgabe wird mit dem Chipmodul mit den Merkmalen des Anspruches 1 gelöst. Ausgestaltungen ergeben sich aus dem ab hängigen Anspruch.This task is accomplished with the chip module with the characteristics of Claim 1 solved. Refinements result from the pending claim.
Das erfindungsgemäße Chipmodul weist ein Substrat als Träger auf, das im Wesentlichen eine flächige Ausdehnung besitzt und dessen zu der flächigen Ausdehnung vertikal gemessene Dicke größer ist als die Dicke eines auf dem Substrat aufgebrachten Halbleiterchips mit integrierten Schaltungen. Die Dicke des Substrates ist typisch etwa 200 µm. Der Halbleiterchip selbst ist vorzugsweise gegenüber herkömmlichen Chips gedünnt, um die Gesamtdicke des Chipmoduls ausreichend gering zu halten.The chip module according to the invention has a substrate as a carrier which essentially has a planar extent and its thickness measured vertically to the areal extent is greater than the thickness of one deposited on the substrate Semiconductor chips with integrated circuits. The thickness of the Substrate is typically around 200 µm. The semiconductor chip itself is preferably thinned over conventional chips to keep the overall thickness of the chip module sufficiently low.
Zur Erläuterung des erfindungsgemäßen Chipmoduls ist eine Fi gur beigefügt, in der die Anordnung eines Chips auf dem Sub strat im Querschnitt im Schema dargestellt ist.To explain the chip module according to the invention is a Fi gur attached, in which the arrangement of a chip on the sub strat is shown in cross section in the diagram.
Die Figur zeigt einen Halbleiterchip 1, der auf einem Sub strat 2 als Träger angebracht ist. Die Einzelheiten des Chip moduls entsprechen den an sich bekannten Chipmodulen, wie sie bisher für Chipkartenanwendungen verwendet werden. Das We sentliche des erfindungsgemäßen Moduls besteht darin, dass die Dicke 3 des Halbleiterchips geringer ist als die Dicke 4 des Substrates. Der Halbleiterchip 1 kann die eingangs ange gebene übliche Dicke von etwa 185 µm besitzen. Damit die Ge samtdicke des Chipmoduls einen Einbau in Chipkarten gestat tet, wird der Halbleiterchip 1 vorzugsweise auf eine Dicke von typisch etwa 100 µm gedünnt. Damit ist der Chip deutlich dünner als das Substrat; der Quotient aus der Dicke 3 des Halbleiterchips 1 und der Dicke 4 des Substrates 2 ist klei ner als 1. Die Dicke des Substrates geht mit der dritten Po tenz in die Biegesteifigkeit des Chipmoduls ein. Durch die Verlagerung der Biegebelastung in das Substrat wird ohne zu sätzliche Bauteile eine bedeutende Versteifung des Chipmoduls bei gleichzeitiger Flexibilisierung des Chips erreicht; gleichzeitig ist die anwendungsspezifische Begrenzung der Ge samtdicke des Moduls gewährleistet.The figure shows a semiconductor chip 1 , which is attached to a sub strate 2 as a carrier. The details of the chip module correspond to the known chip modules as they have been used for chip card applications. The essence of the module according to the invention is that the thickness 3 of the semiconductor chip is less than the thickness 4 of the substrate. The semiconductor chip 1 may have the usual thickness of about 185 microns. So that the total thickness of the chip module allows installation in chip cards, the semiconductor chip 1 is preferably thinned to a thickness of typically about 100 μm. This makes the chip significantly thinner than the substrate; the quotient of the thickness 3 of the semiconductor chip 1 and the thickness 4 of the substrate 2 is smaller than 1. The thickness of the substrate goes into the bending stiffness of the chip module with the third po tence. By shifting the bending load into the substrate, a significant stiffening of the chip module with simultaneous flexibilization of the chip is achieved without additional components; At the same time, the application-specific limitation of the total thickness of the module is guaranteed.
Claims (3)
mit einem Halbleiterchip (1) auf einem Substrat (2) mit einer vorwiegend flächigen Ausdehnung,
dadurch gekennzeichnet, dass
eine senkrecht zu der flächigen Ausdehnung gemessene Dicke (3) des Halbleiterchips geringer ist als eine senkrecht zu der flächigen Ausdehnung gemessene Dicke (4) des Substrates.1. Chip module
with a semiconductor chip ( 1 ) on a substrate ( 2 ) with a predominantly planar extent,
characterized in that
a thickness ( 3 ) of the semiconductor chip measured perpendicular to the planar extent is less than a thickness ( 4 ) of the substrate measured perpendicular to the planar extent.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2001111028 DE10111028A1 (en) | 2001-03-07 | 2001-03-07 | Smart card module |
PCT/DE2002/000578 WO2002071326A1 (en) | 2001-03-07 | 2002-02-18 | Chip card module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2001111028 DE10111028A1 (en) | 2001-03-07 | 2001-03-07 | Smart card module |
Publications (1)
Publication Number | Publication Date |
---|---|
DE10111028A1 true DE10111028A1 (en) | 2002-09-19 |
Family
ID=7676651
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2001111028 Ceased DE10111028A1 (en) | 2001-03-07 | 2001-03-07 | Smart card module |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE10111028A1 (en) |
WO (1) | WO2002071326A1 (en) |
Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2942422A1 (en) * | 1978-10-19 | 1980-04-30 | Cii Honeywell Bull | CARRIER PLATE FOR INTEGRATED CIRCUITS |
DE3235650A1 (en) * | 1982-09-27 | 1984-03-29 | Philips Patentverwaltung Gmbh, 2000 Hamburg | INFORMATION CARD AND METHOD FOR THEIR PRODUCTION |
JPS61204788A (en) * | 1985-03-08 | 1986-09-10 | Dainippon Printing Co Ltd | Portable electronic device |
EP0211360A2 (en) * | 1985-07-27 | 1987-02-25 | Dai Nippon Insatsu Kabushiki Kaisha | IC card |
DE3639630A1 (en) * | 1986-11-20 | 1988-06-01 | Gao Ges Automation Org | DATA CARRIER WITH INTEGRATED CIRCUIT AND METHOD FOR PRODUCING THE SAME |
US4764803A (en) * | 1986-03-17 | 1988-08-16 | Mitsubishi Denki Kabushiki Kaisha | Thin semiconductor card |
FR2644630A1 (en) * | 1989-03-20 | 1990-09-21 | Sgs Thomson Microelectronics | Process for encarding micromodules and its application to the production of microchip cards |
WO1991001533A1 (en) * | 1989-07-24 | 1991-02-07 | Edgar Schneider | Substrate element with at least one integrated circuit, in particular a substrate element for inclusion in chip cards |
US5147982A (en) * | 1989-04-07 | 1992-09-15 | Sgs-Thomson Microelectronics S.A. | Encapsulation of electronic modules |
US5155068A (en) * | 1989-08-31 | 1992-10-13 | Sharp Kabushiki Kaisha | Method for manufacturing an IC module for an IC card whereby an IC device and surrounding encapsulant are thinned by material removal |
DE4302387A1 (en) * | 1992-01-30 | 1993-08-05 | Mitsubishi Electric Corp | |
EP0599194A1 (en) * | 1992-11-27 | 1994-06-01 | Esec Sempac S.A. | Flat-card-shaped electronic module |
EP0628997A2 (en) * | 1993-06-10 | 1994-12-14 | Texas Instruments Incorporated | Semiconductor device with small die pad and method of making same |
DE19623826A1 (en) * | 1996-06-14 | 1997-12-18 | Siemens Ag | Carrier for semiconductor chip mfr. esp. for construction of smart cards |
US6051877A (en) * | 1993-08-04 | 2000-04-18 | Hitachi, Ltd. | Semiconductor device and fabrication method |
US6068191A (en) * | 1996-08-01 | 2000-05-30 | Siemens Aktiengesellschaft | Smart card with card body and semiconductor chip on a leadframe |
US6140697A (en) * | 1995-05-18 | 2000-10-31 | Hitachi, Ltd. | Semiconductor device |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19828653A1 (en) * | 1998-06-26 | 2000-01-05 | Siemens Ag | Chip module for installation in a chip card carrier and method for its production |
DE19848821C1 (en) * | 1998-10-22 | 2000-05-18 | Fraunhofer Ges Forschung | Transponder production e.g. for chip cards or electronic labels, involves producing carrier substrate with coil metallisation; mounting chip; laminating insulating foil onto surface; connecting respective connection ends |
JP2000182016A (en) * | 1998-12-17 | 2000-06-30 | Denso Corp | Ic card |
FR2788882A1 (en) * | 1999-01-27 | 2000-07-28 | Schlumberger Systems & Service | Integrated circuit module for smart card |
-
2001
- 2001-03-07 DE DE2001111028 patent/DE10111028A1/en not_active Ceased
-
2002
- 2002-02-18 WO PCT/DE2002/000578 patent/WO2002071326A1/en not_active Application Discontinuation
Patent Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2942422A1 (en) * | 1978-10-19 | 1980-04-30 | Cii Honeywell Bull | CARRIER PLATE FOR INTEGRATED CIRCUITS |
DE3235650A1 (en) * | 1982-09-27 | 1984-03-29 | Philips Patentverwaltung Gmbh, 2000 Hamburg | INFORMATION CARD AND METHOD FOR THEIR PRODUCTION |
JPS61204788A (en) * | 1985-03-08 | 1986-09-10 | Dainippon Printing Co Ltd | Portable electronic device |
EP0211360A2 (en) * | 1985-07-27 | 1987-02-25 | Dai Nippon Insatsu Kabushiki Kaisha | IC card |
US4764803A (en) * | 1986-03-17 | 1988-08-16 | Mitsubishi Denki Kabushiki Kaisha | Thin semiconductor card |
DE3639630A1 (en) * | 1986-11-20 | 1988-06-01 | Gao Ges Automation Org | DATA CARRIER WITH INTEGRATED CIRCUIT AND METHOD FOR PRODUCING THE SAME |
FR2644630A1 (en) * | 1989-03-20 | 1990-09-21 | Sgs Thomson Microelectronics | Process for encarding micromodules and its application to the production of microchip cards |
US5147982A (en) * | 1989-04-07 | 1992-09-15 | Sgs-Thomson Microelectronics S.A. | Encapsulation of electronic modules |
WO1991001533A1 (en) * | 1989-07-24 | 1991-02-07 | Edgar Schneider | Substrate element with at least one integrated circuit, in particular a substrate element for inclusion in chip cards |
US5155068A (en) * | 1989-08-31 | 1992-10-13 | Sharp Kabushiki Kaisha | Method for manufacturing an IC module for an IC card whereby an IC device and surrounding encapsulant are thinned by material removal |
DE4302387A1 (en) * | 1992-01-30 | 1993-08-05 | Mitsubishi Electric Corp | |
EP0599194A1 (en) * | 1992-11-27 | 1994-06-01 | Esec Sempac S.A. | Flat-card-shaped electronic module |
EP0628997A2 (en) * | 1993-06-10 | 1994-12-14 | Texas Instruments Incorporated | Semiconductor device with small die pad and method of making same |
US6051877A (en) * | 1993-08-04 | 2000-04-18 | Hitachi, Ltd. | Semiconductor device and fabrication method |
US6140697A (en) * | 1995-05-18 | 2000-10-31 | Hitachi, Ltd. | Semiconductor device |
DE19623826A1 (en) * | 1996-06-14 | 1997-12-18 | Siemens Ag | Carrier for semiconductor chip mfr. esp. for construction of smart cards |
US6068191A (en) * | 1996-08-01 | 2000-05-30 | Siemens Aktiengesellschaft | Smart card with card body and semiconductor chip on a leadframe |
Also Published As
Publication number | Publication date |
---|---|
WO2002071326A1 (en) | 2002-09-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
8131 | Rejection |