DE10111028A1 - Smart card module - Google Patents

Smart card module

Info

Publication number
DE10111028A1
DE10111028A1 DE2001111028 DE10111028A DE10111028A1 DE 10111028 A1 DE10111028 A1 DE 10111028A1 DE 2001111028 DE2001111028 DE 2001111028 DE 10111028 A DE10111028 A DE 10111028A DE 10111028 A1 DE10111028 A1 DE 10111028A1
Authority
DE
Germany
Prior art keywords
chip
thickness
substrate
module
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE2001111028
Other languages
German (de)
Inventor
Harald Gundlach
Frank Pueschner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Priority to DE2001111028 priority Critical patent/DE10111028A1/en
Publication of DE10111028A1 publication Critical patent/DE10111028A1/en
Application status is Ceased legal-status Critical

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • G06K19/07747Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The invention relates to a chip card module with a semiconductor chip (1) on a substrate (2), which is characterized in that the thickness (3) of the semiconductor chip is smaller, preferably not more than half the thickness (4) of the substrate.

Description

Die vorliegende Erfindung betrifft ein Chipkartenmodul, das einen Halbleiterchip umfasst und zum Einsetzen in einen Kar tenkörper einer Chipkarte vorgesehen ist. The present invention relates to a smart card module comprising a semiconductor chip and is provided for insertion into a Kar tenkörper a chip card.

Die Halbleiterchips mit elektronischen Schaltungen, die für Chipkarten verwendet werden, werden üblicherweise als Modul hergestellt, das als Ganzes in den Körper einer Chipkarte eingesetzt wird. The semiconductor chip with electronic circuits, which are used for chip cards are usually prepared as a module which is inserted as a whole into the body of a chip card. Ein solches Modul umfasst außer dem Chip ei nen Chipträger, der insbesondere mit Anschlusskontakten für den elektrischen Anschluss versehen ist. Such a module comprising the chip except egg NEN chip carrier which is provided in particular with connection contacts for the electrical connection.

Substrate als Chipträger eines Chipmoduls besitzen eine Dicke von typisch etwa 165 µm, während die Dicke des darauf aufge brachten Halbleiterchips typisch etwa 185 µm beträgt. Substrates as a chip carrier of a chip module having a typical thickness of about 165 microns, while the thickness of the applied thereon semiconductor chip is typically about 185 microns. Zwi schen beiden Teilen kann eine Klebeschicht von typisch etwa 30 µm vorhanden sein. Zvi rule both parts may be provided an adhesive layer of typically about 30 microns.

Dabei tritt das Problem auf, dass die Chips, die in Modulen in Chipkarten eingebaut werden, bei einem Verbiegen der Chip karte leicht brechen können. In this case, the problem arises that the chips, which are incorporated in modules in smart cards, card at a bending of the chip can easily break. Um dieses Problem zu beseitigen, sind eine Reihe von Versteifungen des als Chipträger verwen deten Substrats vorgeschlagen worden. To eliminate this problem, a number of stiffeners of USAGE as a chip carrier substrate Deten have been proposed. Verschiedene Möglich keiten, das Brechen des Chips eines Chipkartenmoduls zu ver hindern, sind in WO 91/01533, US 5,147,982, US 6,068,191, JP 61-204788, DE 29 42 422, DE 32 35 650, DE 36 39 630, DE 43 02 387, DE 196 23 826, FR 2644630, EP 0 211 360, EP 0 599 194 und EP 0 628 997 angegeben. Various options available, the breaking of the chip of a smart card module to prevent ver, are described in WO 91/01533, US 5,147,982, US 6,068,191, JP 61-204788, DE 29 42 422, DE 32 35 650, DE 36 39 630, DE 43 02 387, DE 196 23 826, FR 2,644,630, EP 0211360, EP 0599194 and EP 0628997 indicated.

Aufgabe der vorliegenden Erfindung ist es, ein einfach her stellbares Chipmodul anzugeben, das eine ausreichende Sicher heit gegen Brechen des Chips bei einer Biegebelastung einer Chipkarte aufweist. The object of the present invention is to provide a simple forth stellbares chip module having a sufficient safety-to breakage of the chip at a bending stress of a chip card.

Diese Aufgabe wird mit dem Chipmodul mit den Merkmalen des Anspruches 1 gelöst. This object is achieved with the chip module having the features of claim 1. Ausgestaltungen ergeben sich aus dem ab hängigen Anspruch. Embodiments result from the dependent from claim.

Das erfindungsgemäße Chipmodul weist ein Substrat als Träger auf, das im Wesentlichen eine flächige Ausdehnung besitzt und dessen zu der flächigen Ausdehnung vertikal gemessene Dicke größer ist als die Dicke eines auf dem Substrat aufgebrachten Halbleiterchips mit integrierten Schaltungen. The chip module according to the invention comprises a substrate as a carrier has a substantially planar extension and its flat extension to the vertically measured thickness is greater than the thickness of an applied on the substrate a semiconductor chip with integrated circuits. Die Dicke des Substrates ist typisch etwa 200 µm. The thickness of the substrate is typically about 200 microns. Der Halbleiterchip selbst ist vorzugsweise gegenüber herkömmlichen Chips gedünnt, um die Gesamtdicke des Chipmoduls ausreichend gering zu halten. The semiconductor chip itself is preferably thinned as compared with conventional chips in order to keep the overall thickness of the chip module sufficiently low.

Zur Erläuterung des erfindungsgemäßen Chipmoduls ist eine Fi gur beigefügt, in der die Anordnung eines Chips auf dem Sub strat im Querschnitt im Schema dargestellt ist. To explain the invention, a chip module is attached Fi gur, in which the arrangement of a chip on the sub strate in cross-section in the diagram is shown.

Die Figur zeigt einen Halbleiterchip 1 , der auf einem Sub strat 2 als Träger angebracht ist. The figure shows a semiconductor chip 1 is mounted on a sub strate 2 as a carrier. Die Einzelheiten des Chip moduls entsprechen den an sich bekannten Chipmodulen, wie sie bisher für Chipkartenanwendungen verwendet werden. The details of the chip module correspond to known chip modules, such as those previously used for smart card applications. Das We sentliche des erfindungsgemäßen Moduls besteht darin, dass die Dicke 3 des Halbleiterchips geringer ist als die Dicke 4 des Substrates. The We sentliche of the inventive module is that the thickness of the semiconductor chip 3 is smaller than the thickness of the substrate 4. Der Halbleiterchip 1 kann die eingangs ange gebene übliche Dicke von etwa 185 µm besitzen. The semiconductor chip 1 may be in the initially be added usual thickness of about 185 microns. Damit die Ge samtdicke des Chipmoduls einen Einbau in Chipkarten gestat tet, wird der Halbleiterchip 1 vorzugsweise auf eine Dicke von typisch etwa 100 µm gedünnt. Thus, the Ge samtdicke of the chip module to be installed in smart cards gestat tet, the semiconductor chip 1 is preferably thinned to a thickness of typically about 100 microns. Damit ist der Chip deutlich dünner als das Substrat; Thus, the chip is significantly thinner than the substrate; der Quotient aus der Dicke 3 des Halbleiterchips 1 und der Dicke 4 des Substrates 2 ist klei ner als 1. Die Dicke des Substrates geht mit der dritten Po tenz in die Biegesteifigkeit des Chipmoduls ein. the quotient of the thickness 3 of the semiconductor chip 1 and the thickness 4 of the substrate 2 is able to dress the thickness of the substrate is in the flexural rigidity of the chip module with the third Po competence ner than 1. a. Durch die Verlagerung der Biegebelastung in das Substrat wird ohne zu sätzliche Bauteile eine bedeutende Versteifung des Chipmoduls bei gleichzeitiger Flexibilisierung des Chips erreicht; By shifting the bending stress in the substrate a significant stiffening of the chip module is achieved, while flexibility of the chip without additional components; gleichzeitig ist die anwendungsspezifische Begrenzung der Ge samtdicke des Moduls gewährleistet. at the same time the application-specific limitation of Ge is ensured samtdicke of the module.

Claims (3)

1. Chipmodul 1. Chip Module
mit einem Halbleiterchip ( 1 ) auf einem Substrat ( 2 ) mit einer vorwiegend flächigen Ausdehnung, having a semiconductor chip (1) on a substrate (2) with a predominantly flat extension,
dadurch gekennzeichnet , dass characterized, in that
eine senkrecht zu der flächigen Ausdehnung gemessene Dicke ( 3 ) des Halbleiterchips geringer ist als eine senkrecht zu der flächigen Ausdehnung gemessene Dicke ( 4 ) des Substrates. a measured perpendicularly to the planar extension of thickness (3) of the semiconductor chip is less than a measured perpendicularly to the planar extension of thickness (4) of the substrate.
2. Chipmodul nach Anspruch 1, bei dem die Dicke ( 3 ) des Halbleiterchips ( 1 ) höchstens halb so groß ist wie die Dicke ( 4 ) des Substrates ( 2 ). 2. A chip module according to claim 1, wherein the thickness (3) of the semiconductor chip (1) is at most half as large as the thickness (4) of the substrate (2).
3. Chipmodul nach Anspruch 1 oder 2, bei dem die Dicke ( 4 ) des Substrates ( 2 ) mindestens 200 µm beträgt. 3. A chip module according to claim 1 or 2, wherein the thickness (4) of the substrate (2) is at least 200 microns.
DE2001111028 2001-03-07 2001-03-07 Smart card module Ceased DE10111028A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE2001111028 DE10111028A1 (en) 2001-03-07 2001-03-07 Smart card module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2001111028 DE10111028A1 (en) 2001-03-07 2001-03-07 Smart card module
PCT/DE2002/000578 WO2002071326A1 (en) 2001-03-07 2002-02-18 Chip card module

Publications (1)

Publication Number Publication Date
DE10111028A1 true DE10111028A1 (en) 2002-09-19

Family

ID=7676651

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2001111028 Ceased DE10111028A1 (en) 2001-03-07 2001-03-07 Smart card module

Country Status (2)

Country Link
DE (1) DE10111028A1 (en)
WO (1) WO2002071326A1 (en)

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2942422A1 (en) * 1978-10-19 1980-04-30 Cii Honeywell Bull Bearing plate for integrated circuits
DE3235650A1 (en) * 1982-09-27 1984-03-29 Philips Patentverwaltung Information card and process for their manufacture
JPS61204788A (en) * 1985-03-08 1986-09-10 Dainippon Printing Co Ltd Portable electronic device
EP0211360A2 (en) * 1985-07-27 1987-02-25 Dai Nippon Insatsu Kabushiki Kaisha IC card
DE3639630A1 (en) * 1986-11-20 1988-06-01 Gao Ges Automation Org the same data medium with an integrated circuit and methods for making
US4764803A (en) * 1986-03-17 1988-08-16 Mitsubishi Denki Kabushiki Kaisha Thin semiconductor card
FR2644630A1 (en) * 1989-03-20 1990-09-21 Sgs Thomson Microelectronics Process for encarding micromodules and its application to the production of microchip cards
WO1991001533A1 (en) * 1989-07-24 1991-02-07 Edgar Schneider Substrate element with at least one integrated circuit, in particular a substrate element for inclusion in chip cards
US5147982A (en) * 1989-04-07 1992-09-15 Sgs-Thomson Microelectronics S.A. Encapsulation of electronic modules
US5155068A (en) * 1989-08-31 1992-10-13 Sharp Kabushiki Kaisha Method for manufacturing an IC module for an IC card whereby an IC device and surrounding encapsulant are thinned by material removal
DE4302387A1 (en) * 1992-01-30 1993-08-05 Mitsubishi Electric Corp
EP0599194A1 (en) * 1992-11-27 1994-06-01 Esec Sempac S.A. Flat-card-shaped electronic module
EP0628997A2 (en) * 1993-06-10 1994-12-14 Texas Instruments Incorporated Semiconductor device with small die pad and method of making same
DE19623826A1 (en) * 1996-06-14 1997-12-18 Siemens Ag Carrier for semiconductor chip mfr. esp. for construction of smart cards
US6051877A (en) * 1993-08-04 2000-04-18 Hitachi, Ltd. Semiconductor device and fabrication method
US6068191A (en) * 1996-08-01 2000-05-30 Siemens Aktiengesellschaft Smart card with card body and semiconductor chip on a leadframe
US6140697A (en) * 1995-05-18 2000-10-31 Hitachi, Ltd. Semiconductor device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19828653A1 (en) * 1998-06-26 2000-01-05 Siemens Ag Chip module for incorporation into a chip card substrate, and methods for its preparation
DE19848821C1 (en) * 1998-10-22 2000-05-18 Fraunhofer Ges Forschung Transponder production e.g. for chip cards or electronic labels, involves producing carrier substrate with coil metallisation; mounting chip; laminating insulating foil onto surface; connecting respective connection ends
JP2000182016A (en) * 1998-12-17 2000-06-30 Denso Corp Ic card
FR2788882A1 (en) * 1999-01-27 2000-07-28 Schlumberger Systems & Service Integrated circuit module for smart card

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2942422A1 (en) * 1978-10-19 1980-04-30 Cii Honeywell Bull Bearing plate for integrated circuits
DE3235650A1 (en) * 1982-09-27 1984-03-29 Philips Patentverwaltung Information card and process for their manufacture
JPS61204788A (en) * 1985-03-08 1986-09-10 Dainippon Printing Co Ltd Portable electronic device
EP0211360A2 (en) * 1985-07-27 1987-02-25 Dai Nippon Insatsu Kabushiki Kaisha IC card
US4764803A (en) * 1986-03-17 1988-08-16 Mitsubishi Denki Kabushiki Kaisha Thin semiconductor card
DE3639630A1 (en) * 1986-11-20 1988-06-01 Gao Ges Automation Org the same data medium with an integrated circuit and methods for making
FR2644630A1 (en) * 1989-03-20 1990-09-21 Sgs Thomson Microelectronics Process for encarding micromodules and its application to the production of microchip cards
US5147982A (en) * 1989-04-07 1992-09-15 Sgs-Thomson Microelectronics S.A. Encapsulation of electronic modules
WO1991001533A1 (en) * 1989-07-24 1991-02-07 Edgar Schneider Substrate element with at least one integrated circuit, in particular a substrate element for inclusion in chip cards
US5155068A (en) * 1989-08-31 1992-10-13 Sharp Kabushiki Kaisha Method for manufacturing an IC module for an IC card whereby an IC device and surrounding encapsulant are thinned by material removal
DE4302387A1 (en) * 1992-01-30 1993-08-05 Mitsubishi Electric Corp
EP0599194A1 (en) * 1992-11-27 1994-06-01 Esec Sempac S.A. Flat-card-shaped electronic module
EP0628997A2 (en) * 1993-06-10 1994-12-14 Texas Instruments Incorporated Semiconductor device with small die pad and method of making same
US6051877A (en) * 1993-08-04 2000-04-18 Hitachi, Ltd. Semiconductor device and fabrication method
US6140697A (en) * 1995-05-18 2000-10-31 Hitachi, Ltd. Semiconductor device
DE19623826A1 (en) * 1996-06-14 1997-12-18 Siemens Ag Carrier for semiconductor chip mfr. esp. for construction of smart cards
US6068191A (en) * 1996-08-01 2000-05-30 Siemens Aktiengesellschaft Smart card with card body and semiconductor chip on a leadframe

Also Published As

Publication number Publication date
WO2002071326A1 (en) 2002-09-12

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8131 Rejection