DE10084761T1 - Verfahren und Gerät zum gleichzeitigen Abscheiden und Beobachten von Materialien auf einem Target - Google Patents

Verfahren und Gerät zum gleichzeitigen Abscheiden und Beobachten von Materialien auf einem Target

Info

Publication number
DE10084761T1
DE10084761T1 DE10084761T DE10084761T DE10084761T1 DE 10084761 T1 DE10084761 T1 DE 10084761T1 DE 10084761 T DE10084761 T DE 10084761T DE 10084761 T DE10084761 T DE 10084761T DE 10084761 T1 DE10084761 T1 DE 10084761T1
Authority
DE
Germany
Prior art keywords
observation
target
materials
simultaneous deposition
simultaneous
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE10084761T
Other languages
German (de)
English (en)
Inventor
Michael Mauck
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Coincident Beams Licensing Corp Portland Oreg
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of DE10084761T1 publication Critical patent/DE10084761T1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • G—PHYSICS
    • G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
    • G21K1/00—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating
    • G21K1/08—Deviation, concentration or focusing of the beam by electric or magnetic means
    • G21K1/093—Deviation, concentration or focusing of the beam by electric or magnetic means by magnetic means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/147—Arrangements for directing or deflecting the discharge along a desired path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/3002—Details
    • H01J37/3005—Observing the objects or the point of impact on the object
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/3002—Details
    • H01J37/3007—Electron or ion-optical systems
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/84—Manufacture, treatment, or detection of nanostructure
    • Y10S977/849—Manufacture, treatment, or detection of nanostructure with scanning probe
    • Y10S977/86—Scanning probe structure
    • Y10S977/868—Scanning probe structure with optical means
    • Y10S977/869—Optical microscope
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/84—Manufacture, treatment, or detection of nanostructure
    • Y10S977/88—Manufacture, treatment, or detection of nanostructure with arrangement, process, or apparatus for testing
    • Y10S977/881—Microscopy or spectroscopy, e.g. sem, tem
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/84—Manufacture, treatment, or detection of nanostructure
    • Y10S977/887—Nanoimprint lithography, i.e. nanostamp
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/84—Manufacture, treatment, or detection of nanostructure
    • Y10S977/89—Deposition of materials, e.g. coating, cvd, or ald

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Electron Beam Exposure (AREA)
  • Physical Vapour Deposition (AREA)
  • Electron Sources, Ion Sources (AREA)
DE10084761T 1999-07-02 2000-06-30 Verfahren und Gerät zum gleichzeitigen Abscheiden und Beobachten von Materialien auf einem Target Withdrawn DE10084761T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14214799P 1999-07-02 1999-07-02
PCT/US2000/018074 WO2001003155A1 (en) 1999-07-02 2000-06-30 Method and apparatus for simultaneously depositing and observing materials on a target

Publications (1)

Publication Number Publication Date
DE10084761T1 true DE10084761T1 (de) 2002-07-11

Family

ID=22498723

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10084761T Withdrawn DE10084761T1 (de) 1999-07-02 2000-06-30 Verfahren und Gerät zum gleichzeitigen Abscheiden und Beobachten von Materialien auf einem Target

Country Status (5)

Country Link
US (7) US6522056B1 (enExample)
JP (1) JP2003504803A (enExample)
AU (1) AU6062000A (enExample)
DE (1) DE10084761T1 (enExample)
WO (1) WO2001003155A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6522056B1 (en) * 1999-07-02 2003-02-18 Coincident Beams Licensing Corporation Method and apparatus for simultaneously depositing and observing materials on a target
DE10107910A1 (de) * 2001-02-20 2002-08-22 Leo Elektronenmikroskopie Gmbh Teilchenstrahlsystem mit einem Spiegelkorrektor
US7022987B2 (en) * 2001-02-20 2006-04-04 Carl Zeiss Nis Gmbh Particle-optical arrangements and particle-optical systems
US6822246B2 (en) * 2002-03-27 2004-11-23 Kla-Tencor Technologies Corporation Ribbon electron beam for inspection system
EP1388883B1 (en) * 2002-08-07 2013-06-05 Fei Company Coaxial FIB-SEM column
JP5250350B2 (ja) * 2008-09-12 2013-07-31 株式会社日立ハイテクノロジーズ 荷電粒子線応用装置
DE102009044989A1 (de) * 2009-09-24 2011-03-31 Funnemann, Dietmar, Dr. Bildgebender Energiefilter für elektrisch geladene Teilchen sowie Spektroskop mit einem solchen
EP2400506A1 (en) * 2010-06-23 2011-12-28 GSI Helmholtzzentrum für Schwerionenforschung GmbH Particle beam generating device
DE102010032823B4 (de) * 2010-07-30 2013-02-07 Ion-Tof Technologies Gmbh Verfahren sowie ein Massenspektrometer zum Nachweis von Ionen oder nachionisierten Neutralteilchen aus Proben
US8183526B1 (en) * 2011-02-11 2012-05-22 Electron Optica Mirror monochromator for charged particle beam apparatus
JP5493029B2 (ja) * 2013-04-12 2014-05-14 株式会社日立ハイテクノロジーズ 荷電粒子線応用装置
US9595417B2 (en) * 2014-12-22 2017-03-14 ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH High resolution charged particle beam device and method of operating the same
US12394587B2 (en) * 2022-08-08 2025-08-19 Fei Company Simple spherical aberration corrector for SEM

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB458015A (en) 1935-05-20 1936-12-10 British Thomson Houston Co Ltd Improvements in and relating to the control of electronic rays
FR2036373A5 (enExample) 1969-03-12 1970-12-24 Thomson Csf
GB1595203A (en) * 1977-07-06 1981-08-12 Steigerwald Strahltech Devices for compensating spurious magnetic fields in charged particle beam apparatus
NL8200559A (nl) * 1982-02-15 1983-09-01 Ir Jan Bart Le Poole Prof Dr Bestralingsinrichting met bundelsplitsing.
DE3532698A1 (de) 1985-09-13 1987-03-26 Zeiss Carl Fa Elektronenenergiefilter vom alpha-typ
JP2957669B2 (ja) 1990-09-28 1999-10-06 株式会社東芝 反射マスク及びこれを用いた荷電ビーム露光装置
DE4129403A1 (de) 1991-09-04 1993-03-11 Zeiss Carl Fa Abbildungssystem fuer strahlung geladener teilchen mit spiegelkorrektor
US5336891A (en) 1992-06-16 1994-08-09 Arch Development Corporation Aberration free lens system for electron microscope
DE4310559A1 (de) 1993-03-26 1994-09-29 Zeiss Carl Fa Abbildendes Elektronenenergiefilter
US5847401A (en) * 1996-11-01 1998-12-08 Atomic Energy Of Canada Limited Simultaneous double sided irradiation
US6522056B1 (en) * 1999-07-02 2003-02-18 Coincident Beams Licensing Corporation Method and apparatus for simultaneously depositing and observing materials on a target

Also Published As

Publication number Publication date
US6906453B2 (en) 2005-06-14
WO2001003155A1 (en) 2001-01-11
US20060289793A1 (en) 2006-12-28
US7078852B2 (en) 2006-07-18
US6611087B2 (en) 2003-08-26
US20080258073A1 (en) 2008-10-23
JP2003504803A (ja) 2003-02-04
US6522056B1 (en) 2003-02-18
US7381949B2 (en) 2008-06-03
US20020190218A1 (en) 2002-12-19
US20050161616A1 (en) 2005-07-28
US6815880B2 (en) 2004-11-09
US20040207308A1 (en) 2004-10-21
AU6062000A (en) 2001-01-22
US20030201397A1 (en) 2003-10-30

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Legal Events

Date Code Title Description
8127 New person/name/address of the applicant

Owner name: COINCIDENT BEAMS LICENSING CORP., PORTLAND, OREG.,

8110 Request for examination paragraph 44
8139 Disposal/non-payment of the annual fee