DD99397A2 - - Google Patents

Info

Publication number
DD99397A2
DD99397A2 DD16412072A DD16412072A DD99397A2 DD 99397 A2 DD99397 A2 DD 99397A2 DD 16412072 A DD16412072 A DD 16412072A DD 16412072 A DD16412072 A DD 16412072A DD 99397 A2 DD99397 A2 DD 99397A2
Authority
DD
German Democratic Republic
Application number
DD16412072A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to DD16412072A priority Critical patent/DD99397A2/xx
Priority to DE19722252690 priority patent/DE2252690A1/de
Publication of DD99397A2 publication Critical patent/DD99397A2/xx

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/146By vapour deposition
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0347Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physical Vapour Deposition (AREA)
DD16412072A 1972-07-03 1972-07-03 DD99397A2 (en:Method)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DD16412072A DD99397A2 (en:Method) 1972-07-03 1972-07-03
DE19722252690 DE2252690A1 (de) 1972-07-03 1972-10-27 Verfahren zur herstellung von strukturierten schichten

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DD16412072A DD99397A2 (en:Method) 1972-07-03 1972-07-03

Publications (1)

Publication Number Publication Date
DD99397A2 true DD99397A2 (en:Method) 1973-08-13

Family

ID=5487294

Family Applications (1)

Application Number Title Priority Date Filing Date
DD16412072A DD99397A2 (en:Method) 1972-07-03 1972-07-03

Country Status (2)

Country Link
DD (1) DD99397A2 (en:Method)
DE (1) DE2252690A1 (en:Method)

Also Published As

Publication number Publication date
DE2252690A1 (de) 1974-01-24

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