DD67756A1 - Method for producing and closing ceramic housings - Google Patents
Method for producing and closing ceramic housingsInfo
- Publication number
- DD67756A1 DD67756A1 DD12972368A DD12972368A DD67756A1 DD 67756 A1 DD67756 A1 DD 67756A1 DD 12972368 A DD12972368 A DD 12972368A DD 12972368 A DD12972368 A DD 12972368A DD 67756 A1 DD67756 A1 DD 67756A1
- Authority
- DD
- German Democratic Republic
- Prior art keywords
- producing
- ceramic housings
- closing ceramic
- closing
- housings
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DD12972368A DD67756A1 (en) | 1968-01-22 | 1968-01-22 | Method for producing and closing ceramic housings |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DD12972368A DD67756A1 (en) | 1968-01-22 | 1968-01-22 | Method for producing and closing ceramic housings |
Publications (1)
Publication Number | Publication Date |
---|---|
DD67756A1 true DD67756A1 (en) | 1969-07-05 |
Family
ID=40765759
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DD12972368A DD67756A1 (en) | 1968-01-22 | 1968-01-22 | Method for producing and closing ceramic housings |
Country Status (1)
Country | Link |
---|---|
DD (1) | DD67756A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10303103A1 (en) * | 2003-01-28 | 2004-08-12 | Ixys Semiconductor Gmbh | Microelectronic component comprising chip between substrates, is completed by intervening cast mass which seals substrates without forming peripheral edge |
-
1968
- 1968-01-22 DD DD12972368A patent/DD67756A1/en unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10303103A1 (en) * | 2003-01-28 | 2004-08-12 | Ixys Semiconductor Gmbh | Microelectronic component comprising chip between substrates, is completed by intervening cast mass which seals substrates without forming peripheral edge |
DE10303103B4 (en) * | 2003-01-28 | 2009-07-09 | Ixys Semiconductor Gmbh | Semiconductor component, in particular power semiconductor component |
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