DD67756A1 - Method for producing and closing ceramic housings - Google Patents

Method for producing and closing ceramic housings

Info

Publication number
DD67756A1
DD67756A1 DD12972368A DD12972368A DD67756A1 DD 67756 A1 DD67756 A1 DD 67756A1 DD 12972368 A DD12972368 A DD 12972368A DD 12972368 A DD12972368 A DD 12972368A DD 67756 A1 DD67756 A1 DD 67756A1
Authority
DD
German Democratic Republic
Prior art keywords
producing
ceramic housings
closing ceramic
closing
housings
Prior art date
Application number
DD12972368A
Other languages
German (de)
Inventor
Gerhard Milde
Norbert Nitschke
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to DD12972368A priority Critical patent/DD67756A1/en
Publication of DD67756A1 publication Critical patent/DD67756A1/en

Links

DD12972368A 1968-01-22 1968-01-22 Method for producing and closing ceramic housings DD67756A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DD12972368A DD67756A1 (en) 1968-01-22 1968-01-22 Method for producing and closing ceramic housings

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DD12972368A DD67756A1 (en) 1968-01-22 1968-01-22 Method for producing and closing ceramic housings

Publications (1)

Publication Number Publication Date
DD67756A1 true DD67756A1 (en) 1969-07-05

Family

ID=40765759

Family Applications (1)

Application Number Title Priority Date Filing Date
DD12972368A DD67756A1 (en) 1968-01-22 1968-01-22 Method for producing and closing ceramic housings

Country Status (1)

Country Link
DD (1) DD67756A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10303103A1 (en) * 2003-01-28 2004-08-12 Ixys Semiconductor Gmbh Microelectronic component comprising chip between substrates, is completed by intervening cast mass which seals substrates without forming peripheral edge

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10303103A1 (en) * 2003-01-28 2004-08-12 Ixys Semiconductor Gmbh Microelectronic component comprising chip between substrates, is completed by intervening cast mass which seals substrates without forming peripheral edge
DE10303103B4 (en) * 2003-01-28 2009-07-09 Ixys Semiconductor Gmbh Semiconductor component, in particular power semiconductor component

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