DD214636A1 - METHOD FOR FIXING SEMICONDUCTED WASHERS FOR SINGLE-SIDED SURFACE MACHINING - Google Patents

Abstract

The invention relates to a method for attaching semiconductor wafers, in particular silicon wafers, to workpiece carriers for single-sided surface processing of the wafers. The attachment of the semiconductor wafers on the Werkstuecktraegern is achieved by using phenolic resin as an adhesive. Phenol resin and especially resol are briefly exposed to a temperature treatment of about 100 degrees C. This raises the softening temperature of> 80 degrees C, while maintaining a good solubility in commercial solvents. By using this adhesive, a proper one-sided machining of silicon wafers and a simple release of the discs after processing is possible. In addition, an optimum between Abtragsgeschwindigkeit and good geometry is achieved.

Description

a) (Title of the invention

Method for fixing semiconductor disks for one-sided surface processing

b) Field of application of the invention

The invention relates to a method for fastening semiconductor wafers, in particular silicon wafers, to surface side processing on workpiece carriers; '".^{-Der'Scheiben:}·.'''''''.-.. · \ ^-; .. ^_;.. - '. ^"-_'-:' '; V. Λ

c) Characteristic of the known technical solutions

Pur the production of. Semiconductor wafers require semiconductor wafers with high perfection of the geometry and surface. For one-sided abrasive machining, such as polishing, grinding and lapping, the semiconductor wafers are mounted on a workpiece carrier individually or in a greater or lesser number for the duration of this processing. The type of attachment is of significant influence on the geometric properties such as thickness tolerance, Planparalleiität and flatness.

For the attachment of the discs on the workpiece carrier procedures are used with and without adhesive. As adhesives generally thermoplastic or melt-flow materials are used, which are distributed on the heated workpiece carrier by melting or the cold workpiece carrier by pouring a corresponding solution. The semiconductor

Disks are applied to the adhesive coated and heated workpiece carrier whose temperature is greater than the softening temperature of the bottle. by means of * ';..;:; / '/';' , '''...,''.'':;' / ry ^: :: -] \\ '': / ·. ' Due to the heat generated during processing, the temperature of the wrought disks and also of the adhesive layer increases.This temperature increase is desirable on the one hand because the rate of material removal during polishing thereby increases, but on the other hand the plastic becomes plastic, as a result of which the layer and for the deterioration of the geometrical parameters or, in the event of a fall, for the detachment of the disks, the workpiece carrier.

Dies0 This must be prevented by intensive cooling of the polishing tool and the workpiece carrier. In order to achieve an optimum between removal speed and good geometry, continuous careful monitoring of the machines by qualified operators is essential.

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'. \ o) '.' Goal of the invention. ^{'-:; :; :} '. ; " ^{'^': '".-L':} -'- '':>''':'

The object of the invention is to develop a method for fixing semiconductor wafers, in particular silicon wafers, by means of an adhesive, with which a perfect one-sided processing and a simple detachment after processing are possible, and wherein despite relatively low temperature when gluing the discs no plastic deformation of the adhesive layer due to increase in temperature during machining occurs on the workpiece carrier.

d) Presentation of the essence of the invention

The object of the invention is achieved by the use of phenolic resin.

Although phenolic resins or phenoplasts are the first synthetic resins of industrial significance,

is an application for a temporary, repositionable compound clay materials unknown. The phenolic resins are classified into two major groups, the lovolacke, which can be cured indirectly, that is, only by adding a curing agent, and the resoles, which are affected by the action of heat and pressure

'. ' Harden.-·.. ''; _^:; '':;''',..' \ -r ' ^: ,,. [ . Resol is used according to the invention The resole used (condensation product of phenol and! Formaldehyde) in the initial state has a softening temperature of about 40 ⁰ G, There is still a low molecular weight resin with a chain-like arrangement before , with approximately the following structural design:

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Depending on exposure time and temperature, the effect of heat and pressure results in chain extension, two-dimensional and three-dimensional crosslinking, which lead to a non-soluble, infusible product (see At> b. 1). According to the invention, the resole for curing 2 to 15 minutes, preferably 5 minutes, a temperature of 80 to 130 ⁰ G, preferably 100 to 110 ⁰ C exposed; This ensures that the softening temperature:> 80 ⁰ G and still obtain a good solubility in commercial solvents, remains.

Claims (3)

Brfindungsansprueh ! .Method for fixing iron half-conductor soils on a workpiece carrier by means of an adhesive for one-sided surface treatment, which indicates that phenolic resins are used as the adhesive. '' ^{I -;} \ :: --'- ^... ^';..:'.: - '' .. ''} ^y, '' V ^y. ' 2. A method for attaching semiconductor wheels on a workpiece carrier according to item 1, daduroh characterized in that is used as the adhesive resole. 3. A method for fixing semiconductor wafers on a workpiece carrier according to item 1 and 2, daduroh gekennzelehnet that the processing of the adhesive takes place at a temperature of 80 to 130 ⁰ G.