DD159371A2 - LABORATORY TEST DEVICE FOR TESTING SEMICONDUCTOR COMPONENTS - Google Patents

Abstract

In a laboratory test device according to DD-PS 149965 for testing semiconductor devices, in which static and dynamic parameters are measured by contacting by coarsely displaceable and rotatably mounted probes, the applicability should be made more universal and the reliability and the life of the material contacted for testing should be increased. Therefore, a probe suspension is to create, which allows an unrestricted in the freedom of movement of the probe system and for the contacting points destructive contacting and examination of the material to be examined. According to the invention, the individual probes are each attached via wedge-shaped spacers, which are screwed to the probes, in an angular position relative to the probe-disc on the underside thereof.

Description

Title of the invention:

Laboratory test device for testing semiconductor devices

Field of application of the invention;

The invention relates to a laboratory test device according to DD-PS 149 965 for testing semiconductor devices, in which static and dynamic parameters are measured by contacting by means of a probe support disc coarsely displaceable and angularly mounted probes, with a lying on a movable cross table Chiptableau for recording the semiconductor devices, with the above the Chiptableau for contacting lowered mounted and Meßbuchsen containing probe system as well as with a vertically adjustable on a stand above the probe system arranged microscopes

Characteristic of the known technical solutions; As the main invention DD-PS 149 965 a laboratives test apparatus for testing semiconductor devices is known in which a chip tray for receiving the material to be tested rests on an adjustable in x-, y-, z- and -Sichtung cross table. About the Chiptableau a lowerable for contacting the semiconductor devices probe system with measuring sockets is arranged. By means of a microscope, which is mounted above the probe system and vertically adjustable to ei-ηθΐη tripod, the semiconductor device is considered in the contacting. The probe system consists of a Sondenträgerseheibe on which a circular Meßbuchsenträger is screwed with distributed on the circumference Meßbuchsen. Beneath the probe carrier disc are a series of coarsely translatable and angularly rotatable probes in a circular

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Arrangement screwed, attached to the probe support disc. The manner of probe attachment, however, permits contact only to a limited extent with respect to the diversity of the semiconductors, in particular their geometric shape.

This limits the universal applicability of the test device. Under certain circumstances, depending on the object to be tested (predominantly in the case of flat chips), due to the lowering of the probe system, it is possible to place the soot body on the chip tray, whereby the manipulability in the movement of the probe tip is limited. Due to the predetermined angle and length of the probe tip and the resulting sliding path (due to resilient guidance of the probe tip), the contacting point is considerably mechanically stressed.

5 · weighs. Damage to the contacting surfaces influences the service life and reliability of the tested material.

Object of the invention:

The aim of the invention is a universal applicability of the T.estgerätes and increasing the life and reliability of contacted in the test material.

Presentation of the essence of the invention:

The invention is based on the object in the simplest possible way for the test device, a probe suspension. create one in the freedom of movement of the probe system

unrestricted contacting and testing of the material under investigation, which was less destructive for the contact points

According to the invention, this object is achieved in a laboratory test apparatus for testing semiconductor components, in which static and dynamic parameters are measured by contacting by means of coarse displaceable and rotatable probes on a probe support disc, with a chip tray located on a variable-displacement stage for receiving the semiconductor components ., with the above the chip tray for con-

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· Mounted and measuring bushes containing probe system and with a vertically adjustable on a tripod-arranged above the probe system microscope, achieved in that the individual probes are mounted by means of Distanzstük- 'ken each in a defined angular position to Sondentragerscheibe on the underside of the probe support disc »

It is advantageous if the spacers are wedge-shaped and each screwed to the probes " _o Thus, once the angular position is determined uniquely and on the other hand ensures a low-friction sliding of the probe during adjustment.

The probes are arranged at a certain vertical angle to the probe carrier disc. As a result, the Manlpulierbarkeit in the vertical range and the lateral adjustment of the probes is significantly increased.

The attachment part of the probe ensures due to the angular position of the unrestricted manipulability of the probe tip _s what in particular. short probe tips is relerant. Even when testing very flat semiconductor chips thus a seating of the probe attachment part is avoided on the Chiptableau.

Since the sonotrode of the probe is guided resiliently, arises depending on: the sonotrode angle inevitably a loading. 25 tuned path length of the sliding of the probe tip on the contact point. The inventive angular arrangement of the entire. Probe is this undesirable path length when sliding, the probe tip reduced., In this way, less damage to the bonding surface is achieved, resulting in an increase in the reliability and the life of the contact material,

Embodiment:

The additional invention will be explained in more detail with reference to an embodiment shown in the drawing. Reference should be made to the embodiment with drawing of the main invention.

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In the drawing show:

Pig. 1:. Probe suspension according to the invention of a probe of the probe system

Fig. 2, dependence of the Abgleitweges the probe tip on Fig. 3: the. Contact point from the angle of the probe tip

In FIG. 1, the probe arrangement according to the invention is demonstrated in the probe system at the attachment of one of the probes. To a probe 21 with a probe tip: e (sonotrode) 29 is screwed above a wedge-shaped spacer 30 by means of a countersunk screw 31. The spacer 30, which is screwed with its underside to the upper part of the probe 21, has at the top an internally threaded bore 32 for receiving a square screw 33 »With the guided in a long hole 20 of an annular probe disk 19 square screw 33 ₅ which a turned on Covenant 34 has, the spacer 30 is attached to the underside of the Sondentr.ägerscheibe 19. The probe support plate 19 and its arrangement on the test device is sufficiently described in the embodiment of the main invention, in particular by Fig, 2 and Fig. 3 of the drawing. With the square screw 33 in the elongated hole 20, the probe 21 can be moved over the fixed with the probe 21 spacer 30 along the elongated hole 20 and twisted within certain limits, are,

By the wedge-shaped spacer 30, the probe 21 is arranged in an angular position to the probe support disk 19. This angular position causes an increase in an angle * f. the probe tip 29 to the horizontal (Meßtischebene). The tip of the probe tip 29 is further determined by a predetermined angle v of the angled probe tip 29. The probe tip 29 is (in the drawing for clarity not shown) guided resiliently. B-eim lowering the. Probe system with the probe support plate 19 and the probe 21 for contacting the probe tip 29 slides on the contact point inevitably by a Abgleitweg & S (in the direction of the Meßtischebene). By steepening the

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Probe tip 29 (increasing the angle Y) reduces the length of the sliding path, ά $ (see Figures 2 and 3!). A reduction of the AbgleitwegesZl S brings a non-destructive contacting of the probe tip 21 on the non-illustrated in the drawing: with it.

Thus, the device under test in the required contact for testing less strong, damaged. As a consequence, the reliability and life of the tested (contactless) component increases. In addition, the angular position of the probe 21 results in improved manipulability, since the probe 21 is also suitable for testing very flat semiconductor materials. Lowering ^{] of} the probe system can not come to rest on the chip tray and is prevented in their, required for contacting mobility. ,

Claims (2)

*% f * f \ rs * "\ CUa W v »7 V / βν Invention claim: 1. Laboratory test device according to DD-PS 149 965 for testing of semiconductor devices, in which static and dynamic parameters are measured by contacting by means of a probe disc coarse and finely adjustable and angularly rotatable mounted probes with a lying on an adjustable XY table Chiptableau Recording the semiconductor devices, with the above the Chiptableau for 'contacting lowered mounted and Meßbuchsen containing probe system and with a vertically adjustable stand on a microscope arranged above the probe system, characterized in that the individual probes by means of spacers each in an angular position to Sondanträgerscheibe at the bottom the probe carrier disc are mounted. 2. Laboratory test device according to item 1, characterized in that the spacers are wedge-shaped and bolted to the probes « For this 1 page drawings Rbg / Wi WG /
17.11.1981 3708