DD141039A1 - METHOD FOR PRODUCING HARD COATINGS WITH HIGH RESISTANCE TO HAZARDS - Google Patents

Abstract

Application on metallic and non-metallic substrates by means of ion plating and / or ion deposition. Hardness, Wear-resistant layers of high durability, Korroslons- and Climate effects; Improvement: Passivation active and passive Surfaces, use as self-contained elements, insulating properties, Resistance behavior, adaptability to intended use; optimal use of material, costs, technology to be used. Production of different layers and layer combinations in the same processes consisting of metal C, metal N, metal B, B-C and / or B-N compounds exist on substrates and / or of Layers with admixture of elements or compounds with uniform distribution and concentration gradients for optional Achieving a gradient of layer composition, layer structure, Layer properties. Etch the substrate using vacuum Ion beam, then gas and / or vapor of the materials ionized by electron impact, accelerated and noble gas ions mixed and treated in fields with admixture of a Ion beam of metal or metalloid. Application: Machine and Equipment construction, Feinwerk.technik, electronics. • G * S ·· «» • «J« · » nES «IM ·« C «tl · • p. 9

Description

200 43 1

O ^Tite3 · .

Process for producing hard layers of high adhesion. , ·

Field of application of the invention

The invention relates to a method for producing hard layers of high adhesion on metallic and non-metallic substrates by means of ion plating clay and / or ion deposition. Such layers increase the life, wear resistance and performance of substrates provided therewith. In addition, in most cases they additionally serve as corrosion and climate protection, furthermore for the passivation of active and passive substrate surfaces and / or for the targeted production or modification of insulating properties or the electrical resistance of the substrate.

The use of such layers as independent elements is possible.

200431

Characteristic of the known technical solutions

In various variants, methods in which the layer formation is assisted by ions originating from a plasma or a special ionization device and accelerating toward the substrate are known.

The good adhesion of the vacuum-deposited layers is believed to be due to ion etching immediately prior to coating (Varga, 3rd ed .; Bailey, WA, Solid State Technology, Dec. 1973, 79-86), with the adhesive strength of the different sputtering process is generally under the liability of the ion plating process and the deposition rate is very low when using the sputtering process. Hard layers, with the exception of carbon layers, are predominantly produced by reactive processes, using as reactants metals as well as nitrogen, oxygen and carbon including their compounds.

The best known vacuum methods for depositing hard, adherent layers are once the reactive ion plating, on the other hand, the activated reactive evaporation and the reactive atomization,

In the Mattox ion plating (DM Mattox, "Fundamentals of Ion-Plating", D. Vac.So., Technol., Vol. 10, No. 1, Oan / Feb., 1973), substances are vaporized in a noble gas or reactive gas glow discharge , wherein the substrate is at the same time cathode of the discharge. This method has the disadvantage that the energy width of the ions impinging on the substrate is too large and thus many physical. Properties of the layer to be obtained, which are highly dependent on the particular ion energy, are not specifically reachable.

React with the activated reactive evaporation (D. Vac Be Technol .; Vol 9, No. 6, Nov./Dec 1972 RF Bunshah and AC Raghuram;; "Activated Reactive Evaporation Process for High Rate Deposition of compounds."...) Metal vapors in the vapor phase with the reaction gas at a distance from the substrate, wherein deposited on the substrate, the corresponding compounds. The vapor phase reaction is activated by ionization of the reaction gas. However, it is often beneficial for achieving certain physical properties when the reaction occurs on the substrate surface itself. The relatively low microhardness values of approx. 2000 ... 2750 kHN for TiC are an indication of this.

Mah, Nordin, and Fuller use a triode sputtering arrangement to make TiC and TiN. Reactive sputtering processes have a very low growth rate for engineering applications (G.Mah.VV.Nordin and 0.F. Fuller, "Structure and Properties of Sputtered Titanium Carbide and Titanium Nitride Coatings", 0.Vac.So., Technol ; Vol 11, No. 1, Dan / Febr. 1974).

Aim of the invention

By the method, layers are to be produced which are hard and wear-resistant, whose lifetime, functional properties, corrosion and climate protection effect are much higher than the known layers, with which a better passivation of active and passive substrate surfaces is achieved, the better use as independent elements ensure a more targeted production or modification of insulating properties or electrical resistance,

200 431

whose production is adaptable to the purpose of transporting goods, which give the best possible use in terms of material, time and technology, thus increasing labor productivity, lowering costs and freeing up foreign exchange for imports »

Explanation of the essence of the invention

The object of the invention is to produce specifically different layers or layer combinations with the same process characteristics, mainly of metal-carbon, metal-nitrogen, metal-boron, boron-carbon and / or boron-nitrogen compounds on metallic and non-metallic Substrates, thereby allowing the production of layers with predetermined admixture of other elements or compounds with targeted uniform distribution or with a certain Konzentrationscjradienten, with the possibility of achieving a gradient of the Schichtzueammensetzung, the layer structure and the layer properties is to be included.

The features of the invention are that the substrate to be coated in a vacuum of 1O "... 10 ** Torr is etched with a noble gas ion beam, which is generated in an ion source, and then in an ion source, optionally in time and / or locally continuously variable carbon, nitrogen and / or boron-containing ions from gases and / or from vaporized liquids at a pressure of 10 -10 Torr, accelerated to energies up to 30 KeV and the noble gas ions whose Fraction is optionally modifiable, added and possibly after optional additional passing through electrical and / or magnetic fields with an electrical FeIdstärke of 0 · .. 100 kVm and / or a magnetic

- 5 - 200 43t

Field strength of O ... 100 kAm be applied to the substrate surface and thus a hard layer is deposited on the substrate ·, optionally with a temporally and / or locally continuously variable metal or metal oxide or a metal or metalloid ion beam the existing ion beam is added.

When depositing very thick layers, the ions in an opposing field, which is applied directly to the substrate, are additionally braked.

J Am 'site of the substrate, the vector of the electric field strength is maintained at UuIl or away from the surface.

The substrate temperature is kept below 500 K during the coating.

The ions are deflected by additionally arranged electrical and / or magnetic fields around the corners and edges of the substrate, whereby a multi-sided coating of the substrate is ensured.

Benzene, tetralin, d " methyl-eaphthalene steam or methane is preferably used as the carbon support.

embodiment

The invention will be explained in more detail with reference to an embodiment:.

The substrate surface is exposed to Xe ions with an energy of 5 KeY over a period of 3 to 30 min at a substrate

-2

current density of 0.5 mAom etched. As a result of this ion etching, the Xe ion current and the ion acceleration voltage are continuously reduced to a certain value. The Xe ion beam is simultaneously exposed to a Cr vapor

200431

blended. During this Cr coating, carbon-containing ions are optionally added later to the Xe ion beam to form a Cr layer with Cr carbides embedded therein. Subsequently, the Cr - 'rate is continuously reduced until a pure ion deposition of a diatnant layer takes place.

In this way a gradient of the chemical and physical properties, in particular the hardness, is achieved.

The substrate temperature is kept at about 400 K during the coating. If the substrate is to be coated on several sides, it is advantageous if the ion beam passes through additional electrical and / or magnetic deflection fields.

If thick layers are to be deposited, it has a positive effect that the ion beam passes through additional braking fields.

The carbon carriers are preferably benzene, tetralin, o (. -, methyl naphthalene or methane.

During the process, the pressure is about

-3 10 Torr.

Claims (6)

-7- 200431 claims of invention 1 Process for the Preparation of Hard Coatings of High Hsii Strength on Metallic and Non-Metallic Substrates by Ion Plating and / or Ion Deposition
characterized, in that the substrate to be coated is etched in a vacuum of 10 to 10 torr with a noble gas ion beam generated in an ion source and subsequently in an ion source optionally temporally and / or locally continuously variably carbon, nitrogen and / or boron-containing Ions from gases and / or from vaporized liquids QO generated at a pressure of 10 "... 10" Torr, accelerated to energies up to 30 KeV and added to the noble gas ions, the proportion of which is optionally variable, and possibly after optional additional passing through electric and / or magnetic fields with an electric field strength of O ... 100 kVm "and / or a magnetic field strength of -1 O ··. 100 kAm be applied to the substrate surface and thus a hard layer is deposited on the substrate, optionally with a temporally and / or locally continuously variable metal or metalloid vapor or a metal or metalloid ion beam is added to the existing ion beam. 2. Method according to item 1,
characterized, that the ions are additionally slowed down during the deposition of very thick layers in an opposing field, which rests directly on the substrate. -s 2 00 3. The method according to item 1 and 2, characterized in that held at the location of the substrate, the vector of the electric field strength to zero or directed away from the surface · 4. The method according to item 1 to 3, characterized in that the substrate temperature during the coating is kept smaller than 600 K. 5 «method according to item 1 to 4, characterized in that the ions are deflected by additionally arranged electrical and / or magnetic fields around the corners and edges of the substrate, whereby a multi-sided coating of the substrate is ensured. 6. The method according to item 1 to 6, characterized in that is preferably used as carbon support benzene, tetralin, c ( methyl naphthalene steam or methane.