CS271569B3 - Method of electronic and electrotechnical devices encapsulation - Google Patents

Method of electronic and electrotechnical devices encapsulation

Info

Publication number
CS271569B3
CS271569B3 CS829487A CS829487A CS271569B3 CS 271569 B3 CS271569 B3 CS 271569B3 CS 829487 A CS829487 A CS 829487A CS 829487 A CS829487 A CS 829487A CS 271569 B3 CS271569 B3 CS 271569B3
Authority
CS
Czechoslovakia
Prior art keywords
electronic
poly
liquid
devices encapsulation
electrotechnical devices
Prior art date
Application number
CS829487A
Other languages
Czech (cs)
Other versions
CS829487A1 (en
Inventor
Martin Ing Csc Capka
Marie Ing Czakova
Jan Ing Makovicka
Bohumil Ing Kolman
Vladimir Ing Jirutka
Original Assignee
Capka Martin
Czakova Marie
Makovicka Jan
Kolman Bohumil
Jirutka Vladimir
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Capka Martin, Czakova Marie, Makovicka Jan, Kolman Bohumil, Jirutka Vladimir filed Critical Capka Martin
Priority to CS829487A priority Critical patent/CS271569B3/en
Publication of CS829487A1 publication Critical patent/CS829487A1/en
Publication of CS271569B3 publication Critical patent/CS271569B3/en

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

Method of the encasement of electronic and electric, mainly semiconductor, components improves the solution, according to the author's certificate number 268 940. Into the first coating material, composed of telechelic polysilicon containing a vinyl of the group and dimethyl-methyl (hydrogen)siloxane copolymer 0.1 to 70 weight % of liquid poly(dimethylsiloxane) or poly(methylphenylsiloxane) is added. This method is suitable for power semi-conductor components containing vulnerable points, microfissures and pores, because liquid polysiloxane is better in filling these defective places and in absorbing fast vibrations.
CS829487A 1987-11-18 1987-11-18 Method of electronic and electrotechnical devices encapsulation CS271569B3 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CS829487A CS271569B3 (en) 1987-11-18 1987-11-18 Method of electronic and electrotechnical devices encapsulation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CS829487A CS271569B3 (en) 1987-11-18 1987-11-18 Method of electronic and electrotechnical devices encapsulation

Publications (2)

Publication Number Publication Date
CS829487A1 CS829487A1 (en) 1990-02-12
CS271569B3 true CS271569B3 (en) 1990-10-12

Family

ID=5433306

Family Applications (1)

Application Number Title Priority Date Filing Date
CS829487A CS271569B3 (en) 1987-11-18 1987-11-18 Method of electronic and electrotechnical devices encapsulation

Country Status (1)

Country Link
CS (1) CS271569B3 (en)

Also Published As

Publication number Publication date
CS829487A1 (en) 1990-02-12

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