CS219014B1 - Nickel bath for the deposition of thick nickel layers - Google Patents
Nickel bath for the deposition of thick nickel layers Download PDFInfo
- Publication number
- CS219014B1 CS219014B1 CS244281A CS244281A CS219014B1 CS 219014 B1 CS219014 B1 CS 219014B1 CS 244281 A CS244281 A CS 244281A CS 244281 A CS244281 A CS 244281A CS 219014 B1 CS219014 B1 CS 219014B1
- Authority
- CS
- Czechoslovakia
- Prior art keywords
- nickel
- bath
- deposition
- layers
- thick
- Prior art date
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 81
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 41
- 230000008021 deposition Effects 0.000 title claims abstract description 12
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 claims abstract description 8
- 125000001153 fluoro group Chemical class F* 0.000 claims abstract description 4
- 235000013024 sodium fluoride Nutrition 0.000 claims abstract description 4
- 239000011775 sodium fluoride Substances 0.000 claims abstract description 4
- IIACRCGMVDHOTQ-UHFFFAOYSA-N sulfamic acid Chemical compound NS(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 2
- 238000007254 oxidation reaction Methods 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims 1
- 235000008733 Citrus aurantifolia Nutrition 0.000 claims 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims 1
- 235000011941 Tilia x europaea Nutrition 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 150000007513 acids Chemical class 0.000 claims 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims 1
- 239000004327 boric acid Substances 0.000 claims 1
- 238000004140 cleaning Methods 0.000 claims 1
- 239000013527 degreasing agent Substances 0.000 claims 1
- -1 di-ammonium sodium fluoride salts Chemical class 0.000 claims 1
- 238000004070 electrodeposition Methods 0.000 claims 1
- 238000005323 electroforming Methods 0.000 claims 1
- 239000004571 lime Substances 0.000 claims 1
- 230000007774 longterm Effects 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims 1
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- NROKBHXJSPEDAR-UHFFFAOYSA-M potassium fluoride Chemical compound [F-].[K+] NROKBHXJSPEDAR-UHFFFAOYSA-M 0.000 abstract description 6
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 abstract description 3
- 235000003270 potassium fluoride Nutrition 0.000 abstract description 3
- 239000011698 potassium fluoride Substances 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Vynález se týká niklové lázně, určené pro vylučování silných vrstev niklu ina již -dříve elektrochemicky vyloučené niklové vrstvy s dokonalou adhezí dvou niklových vírstev. Podstata vynálezu 'spočívá v tom, že niklová lázeň obsahuje na 1 litr 0,1 až 20 g solí fluoru, například fluoridu amonného, fluoridu sodného, nebo fluoridu draselného a lázeň je upravená kyselinou amidosulfo-novou na pH 3,5 až 4,5.BACKGROUND OF THE INVENTION The present invention relates to a nickel bath for the deposition of thick nickel layers in a previously electrochemically deposited nickel layer with perfect adhesion of two nickel layers. The nickel bath contains 0.1 to 20 g of fluorine salts, for example ammonium fluoride, sodium fluoride or potassium fluoride, per liter, and the bath is adjusted to pH 3.5 to 4.5 by amidosulfonic acid. .
Description
Vynález se týká niklové lázně, určené pro· vylučování silných vrstev niklu na již dříve elektrochemicky vyloučené niklové vrstvy s dokonalou adhezí dvou niklových Vrstev.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a nickel bath for the deposition of thick nickel layers on previously electrochemically deposited nickel layers with perfect adhesion of two nickel layers.
Podstata vynálezu spočívá v tom, že niklová lázeň obsahuje na 1 -litr 0,1 až 20 g solí fluoru, například fluoridu amonného, fluoridu sodného, nebo fluoridu draselnéhoa lázeň je upravená kyselinou amidosulfonovou na pH 3,5 až 4,5.The nickel bath contains 0.1 to 20 g of fluorine salts, for example ammonium fluoride, sodium fluoride or potassium fluoride, and the bath is adjusted to pH 3.5 to 4.5 by amidosulfonic acid.
Vynález se týká niklové lázně, určené pro vylučování -silných vrstev niklu na již dříve elektrochemicky vyloučené niklové -vrstvy s dokonalou adhezí dvou niklových vrstev. -The invention relates to a nickel bath intended for the deposition of thick nickel layers on previously electrochemically deposited nickel layers with perfect adhesion of two nickel layers. -
V současné -době není známa- metoda· vylučování niklové vrstvy, která by dokonale držela na- již- dříve elektrochemicky vyloučeném niklu. Jíž v -samotné niklovací lázni, dojde-li během elektrochemického procesu k přerušení faradayického proudu, vytvoří se -na -dosavadní vyloučené vrstvě -oxidační film, který způsobuje, -že po- obnovení elektrochemického- vylučování niklu dochází na předchozí vyloučeně vrstvě k odpadávání vrstev. Proto je nutné -na -vrstvě niklu -vyloučit určitou sílu měděné vrstvy a. -pak dále vylučovat nikl. Tím se -ovšem -mění fyzikální vlastnosti celé vyloučené vrstvy -a tozpravidla tak, že mechanická -pevnost vrstvy je nižší.At present, there is no known method for the deposition of a nickel layer, which would perfectly adhere to the previously electrochemically deposited nickel. Already in the nickel-plating bath itself, if the faradayic current is interrupted during the electrochemical process, an oxidation film is formed on the previous deposited layer which causes the layers to fall off on the previously deposited deposited layer . Therefore, it is necessary to eliminate a certain thickness of the copper layer on the nickel layer and then further deposit the nickel. In this way, however, the physical properties of the entire deposited layer are changed and, as a rule, the mechanical strength of the layer is lower.
V mnoha případěeh -při galv-anoplastick-é výrobě forem je nezbytné vyjmout během vylučování niklu model z niklovací lázně, proměřit tloušťku doposud vyloučené niklové vrstvy - -a -znovu zavěsit do -niklovací lázně. Doposud -to není možné bez měděné mezivrstvy.In many cases, in the case of galvanic anoplastic mold making, it is necessary to remove the model from the nickel bath during nickel deposition, to measure the thickness of the previously deposited nickel layer, and to re-suspend it in the nickel bath. Until now, this is not possible without a copper interlayer.
Uvedené- nedostatky -odstraňuje lázeň -pro· vylučování niklu podle -předmětného' vynálezu, určená pro vylučování niklových vrstev libovolné -tloušťky na již předem -elektrochemicky vyloučené vrstvy - -niklu - po jejich předchozím mechanickém -nebo chemickém očištění. Podstata vynálezu spočívá v tom, že niklová lázeň obsahuje na 1 litr 0,1 až 20 gramů solí -fluoru, například fluoridu -amonného, fluoridu -sodného, nebo fluoridu draselného je upravená kyselinou amidosulfonovou -na pH 3,5 až 4,5.These drawbacks are eliminated by the nickel deposition bath according to the present invention, which is intended for the deposition of nickel layers of any thickness onto previously electrochemically deposited nickel layers after their previous mechanical or chemical purification. The nickel bath contains 0.1 to 20 grams of fluorine salts, for example ammonium fluoride, sodium fluoride or potassium fluoride, adjusted to pH 3.5 to 4.5 by amidosulfonic acid per liter.
Hlavní výhoda -předmětného vynálezu spočívá v -tom, - že umožňuje vylučovat niklové vrstvy -na již -dříve elektrochemicky -vylou-The main advantage of the present invention is that it allows the deposition of nickel layers to previously electrochemically-eluted
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CS244281A CS219014B1 (en) | 1981-04-01 | 1981-04-01 | Nickel bath for the deposition of thick nickel layers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CS244281A CS219014B1 (en) | 1981-04-01 | 1981-04-01 | Nickel bath for the deposition of thick nickel layers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CS219014B1 true CS219014B1 (en) | 1983-02-25 |
Family
ID=5361582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CS244281A CS219014B1 (en) | 1981-04-01 | 1981-04-01 | Nickel bath for the deposition of thick nickel layers |
Country Status (1)
| Country | Link |
|---|---|
| CS (1) | CS219014B1 (en) |
-
1981
- 1981-04-01 CS CS244281A patent/CS219014B1/en unknown
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