CS183065B1 - Semiconducting element pushing and fixing equipment - Google Patents

Semiconducting element pushing and fixing equipment

Info

Publication number
CS183065B1
CS183065B1 CS7500001693A CS169375A CS183065B1 CS 183065 B1 CS183065 B1 CS 183065B1 CS 7500001693 A CS7500001693 A CS 7500001693A CS 169375 A CS169375 A CS 169375A CS 183065 B1 CS183065 B1 CS 183065B1
Authority
CS
Czechoslovakia
Prior art keywords
fixing equipment
semiconducting element
element pushing
pushing
semiconducting
Prior art date
Application number
CS7500001693A
Other languages
Czech (cs)
Inventor
Oldrich Pokorny
Jiri Kovar
Jindrich Kratina
Pavel Kafunek
Pavel Reichel
Jaroslav Zuna
Michal Pellant
Original Assignee
Oldrich Pokorny
Jiri Kovar
Jindrich Kratina
Pavel Kafunek
Pavel Reichel
Jaroslav Zuna
Michal Pellant
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oldrich Pokorny, Jiri Kovar, Jindrich Kratina, Pavel Kafunek, Pavel Reichel, Jaroslav Zuna, Michal Pellant filed Critical Oldrich Pokorny
Priority to CS7500001693A priority Critical patent/CS183065B1/en
Priority to DD191523A priority patent/DD123250A1/xx
Publication of CS183065B1 publication Critical patent/CS183065B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
CS7500001693A 1975-03-13 1975-03-13 Semiconducting element pushing and fixing equipment CS183065B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CS7500001693A CS183065B1 (en) 1975-03-13 1975-03-13 Semiconducting element pushing and fixing equipment
DD191523A DD123250A1 (en) 1975-03-13 1976-02-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CS7500001693A CS183065B1 (en) 1975-03-13 1975-03-13 Semiconducting element pushing and fixing equipment

Publications (1)

Publication Number Publication Date
CS183065B1 true CS183065B1 (en) 1978-05-31

Family

ID=5351942

Family Applications (1)

Application Number Title Priority Date Filing Date
CS7500001693A CS183065B1 (en) 1975-03-13 1975-03-13 Semiconducting element pushing and fixing equipment

Country Status (2)

Country Link
CS (1) CS183065B1 (en)
DD (1) DD123250A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4211426C1 (en) * 1992-04-01 1993-06-24 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt, De Clamping device securing gate-turn-off thyristor between opposing heat sinks - has threaded bolts between heat sinks and spring plate laminates activated in succession to exert pressure on pressure plate
DE102011004541B4 (en) * 2011-02-22 2014-07-17 Infineon Technologies Bipolar Gmbh & Co. Kg Improved power semiconductor module, assembly of module and heat sink and use of the module

Also Published As

Publication number Publication date
DD123250A1 (en) 1976-12-05

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