CN85108780A

CN85108780A - The automatic assembly equipment of ad hoc type circuit wafer on the substrate

Info

Publication number: CN85108780A
Application number: CN85108780.9A
Authority: CN
Inventors: 伊原庆一
Original assignee: TDK Corp
Current assignee: TDK Corp
Priority date: 1985-04-15
Filing date: 1985-12-05
Publication date: 1986-10-15
Also published as: CN1005959B

Abstract

Herein disclosed is the automatic assembly equipment of ad hoc type circuit wafer on a kind of substrate, this equipment can be assembled to circuit wafer on the substrate at high speed respectively and continuously.This equipment comprises: circuit wafer is fed into the feeding machinery that lamination machinery goes respectively and continuously, the circuit wafer lamination machinery contains a single installation head, and be applicable to the accurate set of the terminal pin of circuit wafer to substrate, this equipment comprises that also the lead-in wire of a circuit wafer vises machinery, be used for cutting and bending, so that circuit wafer is assembled on the substrate securely to the circuit wafer leg.

Description

The automatic assembly equipment of ad hoc type circuit wafer on the substrate

The present invention relates to a kind of automatic equipment that snugly is installed on the substrate with the ad hoc type circuit wafer, more particularly, relate to a kind of automatic installation apparatus, be used for for example intermediate frequency transformer (IET), biserial packaged integrated circuit (DipIC), the ad hoc type chip circuit element of semi-fixed resistance (Semifixed resistor) and so on is assemblied in as the operation on the substrate of printed substrate.

Traditionally, will be such as intermediate frequency transformer, the biserial packaged integrated circuit, the ad hoc type sheet circuit element of semi-fixed resistance and so on (hereinafter we are referred to as " ad hoc type circuit wafer " or " circuit wafer "), automatically be assembled to those as the operation on the substrate of printed substrate, typically finish as follows: a series of circuit wafers are in line, be contained in the storage casket, to store up casket with an X-Y workbench and be sent to the rigging position of circuit wafer on substrate, afterwards, receive from the circuit wafer of storage casket feeding with an installation head, and it is assembled on the substrate.

Although in the operation that only a kind of next circuit wafer in single storage casket is installed on the substrate, this traditional method does not cause any important trouble really, but, as desire when various types of circuit wafers in a plurality of storage caskets of the circuit wafer that differs from one another being housed respectively installing on the substrate, this traditional method has just been run into difficulty, this be because, this situation requirement, an X-Y workbench that each storage casket is sent to the installation site has the structure of high complexity, and it almost is impossible will finishing a high speed fitting operation.In addition, this circuit wafer feeding machinery is not suitable at a high speed to be installed, this be because, its requirement will store up the interior circuit wafer of casket and be separated one by one so that respectively and continuously circuit wafer is delivered to the position of installation head, this will take a lot of times.Simultaneously, this feeding machinery can not finish stablize constant, circuit wafer reach continuous feeding operation respectively.

Also have, numerous storage caskets of a series of ad hoc type circuit wafers wherein are housed, vertically be placed in the charging box, carry out fitting operation in period serially a segment length so that guarantee.This shows another advantage of saving installing space.Yet this structural requirement when sky is stored up casket and replaces the storage casket of filling circuit wafer, promptly sky to be stored up casket and is discharged from the charging box.In addition, do not influence installation in order to get rid of empty storage casket, then require to use a kind of structure, this structure can make empty storage casket before discharging, and arranges again in the charging box.

Also having traditional automatic installation apparatus is to constitute like this: the take operation of circuit wafer of installation head, be to finish by the chuck or the vacuum nozzle that are loaded on its lower end, and, fitting operation in the circuit on substrate is by the driving cylinder of mouth is installed, drive described chuck or vacuum nozzle, move both vertically and finish.Yet, unfortunately, the ad hoc type circuit wafer has a plurality of leg in its lower end, like this, traditional chuck or vacuum nozzle are not enough to snugly be installed to circuit wafer on the substrate to the clamping of ad hoc type circuit wafer, this be because, leg set is very difficult in corresponding substrate through-hole, and leg has hindered smooth installation.This just needs a centering machinery, is used to make leg that substrate is located exactly.

In addition, in the circuit wafer process is installed, the applying situation of the leg of ad hoc type circuit wafer in substrate, confirmed by using a sniffer, this sniffer generally constitutes as follows: the bending machine arm of a pair of cutting and bending circuit wafer leg is positioned at the relative upper end of sniffer, on this bending machine arm positive pole and anode connector is housed respectively; With a voltage jump on the circuit wafer between the bending machine arm; Like this, illustrate that if detector indication has voltage the circuit wafer leg fits in substrate, if the no-voltage indication, then explanation does not post.Yet the detection machinery of this structure needs to adjust applied voltage, and this is because applied voltage must be according to the electric capacity decision of circuit wafer.

Sign in aforementioned various shortcoming of the prior art, we have made the present invention.

In general, according to the present invention, the automatic assembly equipment of ad hoc type circuit wafer is equipped with on substrate, comprise circuit wafer feeding machinery, so that feed the ad hoc type circuit wafer respectively and continuously, this feeding machinery contains: a plurality of charging boxes that are positioned to delegation obliquely, have a plurality of storage caskets in each charging box, in each storage casket the ad hoc type circuit wafer is housed, also contains a block, be used for stoping: each ad hoc type circuit wafer from the storage casket that the charging box of each inclination is adorned.Glide continuously owing to action of gravity, in addition, be positioned at below the charging box of each inclination, one circuit wafer conveyer is installed so that receive in order obliquely because above-mentioned block of each ad hoc type circuit wafer that maintains, each circuit wafer conveyer vertically is offset and horizontal ground motion, so that press preset program, the ad hoc type circuit wafer is sent to preposition; Automatic assembly equipment of the present invention also comprises a circuit wafer lamination machinery, this lamination machinery comprises: the direction of motion of this installation head of single installation head and each circuit wafer conveyer is settled perpendicularly, and by an X-Y workbench, take the conveyer of the circuit wafer of each conveyer to, so that receive the ad hoc type circuit wafer, also comprise a push rod, when installation head moves downward, when circuit wafer was fitted and to be installed on the substrate, this push rod pushed by compulsion and is clamped in installation head and leads ad hoc type circuit wafer between the arm lower end; Automatic assembly equipment of the present invention comprises that also circuit wafer lead-in wire vises machinery, is used to cut and leg bending ad hoc type circuit wafer, that stretch out from substrate.

In an excellent embodiment of the present invention, each circuit wafer conveyer comprises; A conveying clamp is used for receiving and clamps from each storage casket and slides, and the typing circuit wafer that is stopped by a block; One first bracing frame, with charging box tiltably-mounted correspondingly, above-mentioned conveying clamp is contained on the bracing frame; A lobe plate by cam follower, is meshed with this bracing frame; A reciprocating type driving cylinder of linking on this lobe plate; One second bracing frame, lobe plate is adorned thereon slidably; Second bracing frame can be driven by a guide rod, moves on the identical direction of above-mentioned driving cylinder; Thus, start the driving cylinder, drive the lobe plate and second bracing frame forward together, make cam follower flatly be offset first bracing frame, thereby the ad hoc type circuit wafer that conveying clamp is held with a firm grip sequentially is sent to installation head.

In an excellent embodiment of the present invention, circuit wafer feeding machinery comprises: a skewed slot is placed in the outlet of each charging box, obliquely to receive by the ad hoc type circuit wafer that slides under the charging box on it; A clip is installed in the sidepiece of this skewed slot, push support except that minimum one and those circuit wafers; And, each circuit wafer conveyer, this device contains: a circuit wafer receiving member, the lower end synergy of this member and skewed slot is so that only receive a minimum circuit wafer, a scotch, often be contained in the front surface of circuit wafer receiving member, and the arm of holding with a firm grip, be placed in the sidepiece of receiving member releasedly, and support the ad hoc type circuit wafer; Described receiving member is displaced to horizontal level from obliquity, and moves forward to the holding fix of installation head.

In a preferred embodiment of the invention, circuit wafer feeding machinery comprises: a skewed slot, it has constituted the passage of the circuit wafer that is communicated with each charging box, and, each circuit wafer conveyer, this conveyer contains: a circuit wafer retainer that tilts to install, be used for receiving the ad hoc type circuit wafer from skewed slot, a circuit wafer clamp system is used for being clamped in the ad hoc type circuit wafer of retainer, and a brake mechanism, be used for leg location with the ad hoc type circuit wafer; Described circuit wafer clamp system and brake mechanism are placed on the circuit wafer retainer.Charging box and skewed slot can be inclined relative to horizontal about 45.

In a preferred embodiment of the invention, automatic assembly equipment also comprises: a device of replacing the storage casket automatically, this device contains: the first material stock mechanism, be used to receive the storage casket that circuit wafer is housed, the second material stock mechanism, be used to receive empty storage casket, first, the second material stock mechanism all forms in each charging box, and, one first pusher is used for that the sky storage casket that falls from the first material stock mechanism is carried out side direction and transmits one second pusher, be used for described empty storage casket vertically is sent to the second material stock mechanism, first, second pusher is placed in the below of charging box.By driving cylinder and cam follower, it is reciprocating to drive a sliding panel because and the engagement of sliding panel epirelief race, but first, second pusher passive movement.Simultaneously because that single driving cylinder drives sliding panel is reciprocating, first, second pusher along difform cam path, finish its predetermined operation.

In a preferred embodiment of the invention, the installation head of circuit wafer lamination machinery also comprises: a bracing frame; Each is led the arm upper end and is connected with a driving cylinder, is used for operating with opening and leads the arm lower end; This leads arm by a pin, pivotally is installed in above-mentioned bracing frame middle part; A push rod is contained in leads between the arm, can vertically move downward, so that with ad hoc type circuit wafer pressed towards substrate.Each is led the arm lower end and has the shape that is meshed with ad hoc type circuit wafer corner part, is clamped in middle securely so circuit wafer can lead the arm lower end in its relative corner.Leading arm Ke Hu Change ground installs.Another kind of alternative structure is: each is led on the medial surface of arm lower end and does that groove is arranged, and is used to receive the sidepiece of dressing ad hoc type circuit wafer, so this circuit wafer can insert and lead between the lower end of arm securely at its relative sidepiece.

In a preferred embodiment of the invention, the installation head of circuit wafer lamination machinery also comprises: be used for handling the driving cylinder of leading the arm lower end with opening; The push rod that can do to move both vertically is placed in and leads between the arm; Lead arm for one, has a bottom, has a groove on it at least, be used at least one from ad hoc type circuit wafer one side, the leg set of extending downwards in wherein, and another is led arm and has a bottom, have a groove on it at least, be used at least one from the relative opposite side of this circuit wafer, the leg set of extending downwards in wherein.

In a preferred embodiment of the invention, circuit wafer lead-in wire vises machinery and comprises: a pair of bending machine, relatively pivotally be installed on the supporting mechanism; One cam mechanism, this mechanism is squeezed between the bending machine lower end, so that the bending machine upper end is finished the bending operation to ad hoc type circuit wafer leg at least; One first binding post is contained on the cam mechanism, and as an electrode, one second binding post through an insulator, is contained in one lower end in this bending machine, as another electrode; A probing pin contacts with second binding post releasedly, and when cam mechanism during at extrusion position, probing pin is flexibly withstood on this cam mechanism by cam mechanism biasing ， And by insulator.

Therefore, an object of the present invention is, the automatic assembly equipment of ad hoc type circuit wafer on a kind of substrate is provided, this equipment can reach various types of circuit wafers continuously efficiently, respectively degree of adjustment and be installed on the substrate.

Another object of the present invention is, the automatic assembly equipment of ad hoc type circuit wafer on a kind of substrate is provided, and this equipment can be fitted the leg of circuit wafer in the substrate securely.

Further object of the present invention is, the automatic assembly equipment of ad hoc type circuit wafer on a kind of substrate is provided, and this equipment reaches discriminably and feeds circuit wafer continuously.

A further object of the invention is, the automatic assembly equipment of ad hoc type circuit wafer on a kind of substrate is provided, and this equipment can carry out accurate set with respect to substrate with the leg of circuit wafer, and is not subjected to the restriction of circuit wafer structure to be installed and size.

Another object of the present invention is, the automatic assembly equipment of ad hoc type circuit wafer on a kind of substrate is provided, and this equipment can accurately be fitted the circuit wafer leg in the substrate.

A further object of the invention is, proposes the automatic assembly equipment of ad hoc type circuit wafer on a kind of substrate, this equipment can be easily with circuit wafer with respect to the substrate location of fitting.

A further object of the invention is, the automatic assembly equipment of ad hoc type circuit wafer on a kind of substrate is provided, and this equipment is the applying situation of testing circuit sheet on substrate effectively.

The present invention also has some other purpose, can see from specification, and wherein a part will be very tangible, and it also will be open-and-shut also having some.

Why this shows, the present invention includes architectural characteristic, the combination of various members, and each arranging between; About these, hereinafter to illustrating in the statement of structure; About protection of the present invention field, will in claims, illustrate.

In order further to understand the present invention, the spy makes following further instruction in conjunction with the accompanying drawings, wherein:

Fig. 1 is the perspective view of a signal, and it provides several ad hoc type circuit wafers, and these circuit wafers will be disposed by a device that snugly installs on the substrate with the ad hoc type circuit wafer, automatically of the present invention.

Fig. 2 is a perspective view, and it provides an embodiment of the automatic assembly equipment of ad hoc type circuit wafer on of the present invention, the substrate on the whole;

Fig. 3 is an end view, and it illustrates the feeding machinery of circuit wafer in the automatic assembly equipment of Fig. 2;

Fig. 4 is a part section vertical view, and it illustrates a circuit wafer conveyer of the circuit wafer feeding machinery of Fig. 3.

Fig. 5, Fig. 6 are local vertical view and front view, and they illustrate the part of the circuit wafer conveyer of Fig. 4 respectively;

Fig. 7 is an end view, and it provides a kind of improved form of the circuit wafer feeding machinery of Fig. 3;

Fig. 8 is the front view that a circuit wafer that Fig. 7 is shown feeds machinery;

Fig. 9 one illustrates the front view that circuit wafer among Fig. 7 feeds the skewed slot of mechanical usefulness;

Figure 10 is the end view that is shown in skewed slot among Fig. 9;

Figure 11 is an end view, and its expression is contained in a upper push-rod of the arm of holding with a firm grip on the circuit wafer receiving member;

Figure 12 is the vertical view of foregoing circuit sheet receiving member;

Figure 13 is an end view, the position relation between the circuit wafer receiving member of the skewed slot of its presentation graphs 9 and Figure 12;

Figure 14 is a front view, and it represents circuit wafer receiving member and the relation of the position between the oscillating deck of Figure 12;

Figure 15 is an end view, and it provides another improved form of the circuit wafer feeding machinery that is shown among Fig. 7;

Figure 16 is a front view, and it represents the circuit wafer feeding machinery among Figure 15;

Figure 17 is the end view of the critical piece of expression foregoing circuit sheet feeding machinery to Figure 19;

Figure 20 is a partial cutaway front view, and it represents the automatic displacement apparatus of a charging box;

Figure 21 is the vertical view of the automatic displacement apparatus shown in Figure 20;

Figure 22 is the end view of the automatic displacement apparatus shown in Figure 20;

Figure 23 is an end view, and it represents the driving device of the automatic displacement apparatus of Figure 20;

Figure 24 is a partial sectional view, an installation head of the circuit wafer lamination machinery in the automatic assembly equipment of its presentation graphs 2;

Figure 25 is the front view of the installation head shown in Figure 24;

Figure 26 is the partial, partially-cross-sectioned side-elevation view of the installation head shown in Figure 24;

Figure 27 is a front longitudinal section, and its expression comprises the entire circuit sheet lamination machinery of the installation head of Figure 24;

Figure 28 is a diagrammatic top view, it provide Figure 27 the circuit wafer lamination machinery a kind of improved form lead arm;

Figure 29 is a diagrammatic top view, it provide Figure 27 the circuit wafer lamination machinery another kind of improved form lead arm;

The front view that Figure 30 dissects for a part, it represents a kind of improved form of the installation head of Figure 24;

Figure 31 is a perspective view, and its expression is suitable for the embodiment by a kind of ad hoc type circuit wafer of the circuit wafer lamination machinery disposal of Figure 30;

Figure 32 A and Figure 32 B are the end view of signal; They illustrate the lower inner surface structure of respectively leading arm of the circuit wafer lamination machinery of Figure 30;

Figure 33 is a front view, and its indication circuit sheet lead-in wire vises the critical piece of machinery, and this vises machinery has and be used for testing circuit strip terminal pin inserts situation to corresponding substrate mechanism;

Figure 34 is the end view that vises machinery that is shown among Figure 33;

Figure 35 is the general view of vising machinery that is shown among Figure 33;

Figure 36 is the vertical sectional view of vising machinery that is shown among Figure 35; And

Figure 37 is a vertical view, and it illustrates the machinery that vises of Figure 35, and this machinery has the circuit wafer switching mechanism.

Below, with reference to these accompanying drawings, the automatic assembly equipment of ad hoc type circuit wafer on the substrate of the present invention is illustrated.

Fig. 2 illustrates an embodiment of automatic assembly equipment of the present invention on the whole.The device of illustrated embodiment is suitable for respectively and continuously with the ad hoc type circuit wafer with some connector pins shown in Figure 1, for example resemble intermediate frequency transformer, the biserial packaged integrated circuit, semi-fixed resistance etc., the substrate that snugly is installed to printed circuit board (PCB) gets on, this outfit of equipment is by circuit wafer feeding machinery (1), circuit wafer lamination machinery (3), and circuit wafer lead-in wire vises machinery (4) and forms, simultaneously, the automatic assembly equipment of illustrated embodiment also is suitable for during transmission base plate intermittently, utilize a conveyer (5) that substrate (P) along continuous straight runs is fed ， And discontinuously with circuit wafer installation in position snugly on substrate.

The circuit wafer feeding machinery (1) of automatic assembly equipment comprises the charging box (10) that several are arranged in rows, each charging box has several storage Xia ， And that ad hoc type circuit wafer wherein is housed again has several circuit wafer conveyers (2) (only generally expressing this device among Fig. 2) to be placed on the position corresponding to charging box (10).As shown in Figure 2, charging box (10) is contained on the inclined floor (11) with the about angle at 45 of automatic mounting machine body horizontal plane, so that the circuit wafer that makes ad hoc type is by gravity and a minimum opening adjoining land of the storage casket from be contained in each charging box (10) slides, thereby sequentially feed circuit wafer.Be shown in circuit wafer feeding machinery among Fig. 3 and Fig. 4 and also comprise the skewed slot (12) that is contained in obliquely below each charging box (10), so that circuit wafer glides along it, block (13) is contained in the lower end of each skewed slot (12) with the downslide of halt circuit sheet on skewed slot (12).Flashboard (14) is equipped with at the middle part of each skewed slot (12), and its effect is the ad hoc type circuit wafer after stopping time, thus down fold (12) feeding circuit wafer discriminably and continuously.

Each circuit wafer conveyer (2) all is suitable in the storage casket from corresponding charging box (10), by skewed slot (12), extracts the circuit wafer of a feeding out installation head (30) that ， And sends it to circuit wafer lamination machinery (3).Each circuit wafer conveyer (2) has a conveying clamp (20) corresponding to skewed slot (12) on the position, receives And clamping circuit wafer so that connect from baffle plate (13) respectively and continuously, schematically illustrating in Fig. 5 Fig. 6.This conveying clamp (20) receives pawl (20a) and an arm (20b) of holding with a firm grip by one and forms, the two is relatively vertically installed, by driving cylinder (21), vertically start the arm of holding with a firm grip (20b), promptly can be clamped in parts (20a) and (20b) between mode, hold a circuit wafer releasedly.Bluff piece (20a) and arm spare (20b) laterally stretch to skewed slot (12) from supporting bracket (22).Bracing frame (22) is contained in the following skewed slot (12) of each charging box (10) by the elastic mechanism compensation (not shown) of a helical coil spring-like obliquely so that bluff piece of conveying clamp 20 (20a) and arm spare (20b) are parallel to angledly.In addition, bracing frame (22) links together with a cam follower (23) that is contained on lobe plate (24) sidepiece.Lobe plate (24) has a cam path (24a), this cam path tilts in the opposite direction in the slope compensation side with bracing frame (22); And and be meshed with the cam follower (23) of bracing frame (22), and the rod end of reciprocating type driving cylinder (25) pivotally is supported on the lobe plate (24).Simultaneously, lobe plate (24) snugly is supported in the bracing frame, when starting driving cylinder (25), lobe plate (24) can head on the spring (27) that is stretched between lobe plate (24) and the body (26), in the predetermined distance of sliding.Bracing frame (28) can with lobe plate (24) along with starting cylinder (25) a reciprocating And and guide rod (29) this motion in order to guide support frame (28) is arranged, guide rod (29) snugly is fixed in the carriage (28a) that connects together with bracing frame (28).Guide rod (29) snugly is supported in the slider case 201 on the body (26), and braking ring (202) and (203) are housed at the two ends of guide rod (29), and their lean on slider case (201), to regulate the reciprocating motion amount of guide rod (29).

In each circuit wafer conveyer (2) of feeding machinery (1), conveying clamp (20) is with driving cylinder (25) in that parallel ground with direction that conveyer (5) feeds substrate (P) intermittently as shown in Figure 2 reciprocating, and the circuit wafer lamination machinery of sketching previously is installed in and the perpendicular position of conveying clamp (20) direction of motion.

Below, with reference to accompanying drawing 3-6 the mode of operation of the circuit wafer feeding machinery (1) of said structure is illustrated:

In circuit wafer feeding machinery (1), each conveying clamp (20) of conveyer (2) is used for extracting a circuit wafer ， And and taking them on horizontal direction preposition alternately, selectively by driving cylinder (25) from the storage casket of corresponding charging box (10).More particularly, arrive skewed slot (12), And are by block (13) when withstanding when a circuit wafer slides from the storage casket of the charging box (10) that requires, drive cylinder (21) and start, the circuit wafer that will be positioned at the bluff piece (20a) of handling conveying clamp (20) and grip member (20b) on the skewed slot (12) is clipped in the middle of them.Simultaneously, drive cylinder (25) and start, extend its guide rod forward, conveying clamp (20) is sent to the installation head of circuit wafer lamination machinery (3).At this proal initial period, lobe plate (24) in bracing frame (28) against the spring (27) of tensioning gradually to front slide, supporting bracket (22) is turned to horizontal level from obliquity, at this moment it is reduced gradually, so the conveying clamp (20) of clamping circuit wafer between its bluff piece (20a) and hand-to-arm grip (20b) is able to it is shifted out from skewed slot (12).At this moment, block (13) offsets downward so that separate with circuit wafer, and flashboard moves down to stop and slides under the next circuit wafer on the skewed slot (12).When conveying clamp (20) with circuit wafer from skewed slot (12) when removing, bracing frame (22) is horizontal substantially in bracing frame (28), lobe plate (24) moves forward to its next position in the sliding area of bracing frame (28).When lobe plate (24) has been finished motion forward in bracing frame (28), bracing frame (28) will travel forward with lobe plate (24), thereby conveying clamp (20) is moved on the holding fix of installation head (30), thereby the circuit wafer that also will be clamped between bluff piece (20a) and the hand-to-arm grip (20b) flatly pinch this place.When conveying clamp (20) arrives the holding fix of installation head (30), the braking ring (203) of guide rod (29) withstands slider case (201), started the arm of holding with a firm grip (20b) in vertical direction owing to drive the startup of cylinder (21) simultaneously, thereby circuit wafer is unclamped from conveying clamp (20), afterwards, circuit wafer is delivered to installation head (30) from conveying clamp (20).When circuit wafer is delivered to installation head (30), drive cylinder (25) starts at once, its guide rod of withdrawing, and make braking ring (202) withstand slider case (201) afterwards, by means of tension spring (27), lobe plate (24) moves in bracing frame (28) backward, one when block (204) leans on body (26), move and stop, at this moment, flashboard (14) moves up, so that next circuit wafer slides into skewed slot (12) downwards, before driving cylinder (25) was received an instruction, conveying clamp (20) remained on the skewed slot (20) always.

Fig. 7-Figure 14 illustrates modified model circuit wafer feeding machinery.

The circuit wafer feeding machinery of Fig. 7-Figure 14 reaches discriminably continuously to circuit wafer lamination machinery (3) feeding ad hoc type circuit wafer.

In the circuit wafer feeding machinery of Fig. 7-Figure 14, be contained in the skewed slot (12) on each charging box (10), tilt with the stagger angle that is substantially equal to charging box (10), as shown in Figure 7.Circuit wafer conveyer (2) is positioned at the low side of each skewed slot (12).Skewed slot (12) makes has U-shape section, and And is equipped with a plurality of circuit wafers that are in line therein, and these circuit wafers are to slide on the skewed slot (12) under charging box (10) continuously.As Fig. 9 and shown in Figure 10, a clip (51) is equipped with in skewed slot (12) side, in order to compress the circuit wafer except that being arranged in minimum one of skewed slot, by a pin (52), clip (51) pivotally is contained in skewed slot (12) sidewall ， And and is stretched in the groove (12) by an opening (53) in side wall upper part.Simultaneously, clip (51) in its bottom by a tension spring (54) biasing so that tip, clip top puts in skewed slot (12), withstand forcibly minimum in order one and circuit wafer.There is the cam (55) of a promotion clip bottom of clip (51), this cam drives the cylinder (not shown) by one and drives, the effect of actuating cam (55) is to withstand the bottom of clip (51) when it travels forward, thereby make clip (51) head on spring (54) around the pivot rollback.Be equipped with one above the skewed slot (12) and lead arm (56), its effect is to push the circuit wafer head downwards, thereby makes a series of circuit wafers sequentially slide into skewed slot (12) down.Lead arm (56) and install from support frame (57) with stretching out, the anterior ， And that this framework (57) is connected to substrate (11) can move both vertically.

Each circuit wafer conveyer (2) all has a circuit wafer receiving member (58), this member (58) is positioned at the bottom of corresponding skewed slot (12), circuit wafer receiving member (58) makes and the roughly the same shape of skewed slot (12), i.e. U-shape is as shown in Figure 12 and Figure 14.The effect of circuit wafer receiving member is a minimum circuit wafer that slides into skewed slot (12) under this place receives.In the front portion of member (58) scotch (59) is housed, motion in order to the circuit wafer that receives in the stop member (58), scotch (59) is that pivot is contained on the receiving member (58) with pin (60), a torsionspring (not shown) that snugly is contained on the pin (60) is always upwards pushing away scotch (59), simultaneously, scotch (59) also can be setovered by a tension spring (not shown), when being sent to installation head (30) with convenient circuit wafer, scotch (59) is return downwards around pin (60), hereinafter will be illustrated in detail this.And, the arm of holding with a firm grip (61) (intention 14) also is housed on the sidewall of circuit wafer receiving member (58).Hold with a firm grip arm (61) with pin (62) be pivot be contained in the circuit wafer receiving member (58) Shang ， And and, by torsionspring volume (not shown) that is adjacent to pin (62), this arm of holding with a firm grip (61) can be setovered muchly and be withdrawn.In the arm of holding with a firm grip (61) rear end a upper push-rod (63) (seeing Figure 11) is housed.Drive the cylinder (not shown) by one and can drive push rod (63), and the lower arm part of push rod (63) can be withstood the rearward end of the arm of holding with a firm grip (61) in vertical direction around pin (64) swing.In addition, the upper arm parts of upper push-rod (63) is by tension spring (65) tension, in case stop to drive after the cylinder, the lower arm part of push rod (63) is also withstood the arm of holding with a firm grip (61).

Circuit wafer receiving member (58) can depart from oblique notch (12) in the horizontal direction, and for reaching this purpose, member (58) links to each other with oscillating deck (67) by a plate (66), as Figure 12 and shown in Figure 14.The oscillating deck (67) that links to each other with circuit wafer receiving member (58) is that pivot is contained on the vertical panel (68) prejudicially with pin (69), also links to each other with a driving cylinder (71) by axle (70).Driving cylinder (71) level installs, but reciprocating motion, so that circuit wafer receiving member (58) is moved on to the holding fix of installation head as described below, when starting when driving cylinder (71), oscillating deck (67) can be swung along cam path (72) (see figure 7) around pin (69).The upward swing dead point of oscillating deck (67) and lower swing dead point are by being positioned at the brake block (73a) on the vertical panel (68) and (73b) determining.

As shown in Figure 7, vertical panel (68) is installed on the base plate (74), and by means of a guide rod (75), this base plate (74) can move in the horizontal direction.The front-end and back-end of guide rod (75) are equipped with drag washer (76a) and (76b) respectively.Described packing ring is used to withstand the front end face and the rear end face of slider case (77), to regulate the stroke that drives cylinder (71).

Below, the mechanical operative configuration of the circuit wafer feeding said structure form, shown in Fig. 7-14 is illustrated.

Each skewed slot (12) receives the circuit wafer that slides owing to gravity from the storage casket of corresponding charging box (10), the receiving member (58) that is arranged in the circuit wafer conveyer (2) of respective slots lower end only admits the bottom circuit wafer And of skewed slot (12) by scotch (59) circuit wafer to be remained on wherein, afterwards, when the instruction of having taken out circuit wafer selectively when an expression receiving member (58) from skewed slot (12) is delivered to and is driven cylinder (71), cylinder (71) elongation, so that receiving member (58) travels forward, leave skewed slot (12).At this moment, clip (51) partly puts in the opening (53) of skewed slot (12) on top, so that clamp the circuit wafer of back in the skewed slot (12) jointly with leading arm (56), goes thereby keep them can not slide in the receiving member (58).In addition, scotch (59) clamps the circuit wafer of receiving in receiving member (58), upper push-rod (63) can drive by driving cylinder (not illustrating in the drawings) simultaneously, with pin (64) serves as that axle rotates, the arm of holding with a firm grip (61) is deflected, support the circuit wafer in the member (58) from the side.

Begin to start when driving cylinder (71), then oscillating deck (67) is along the cam path (72) of vertical panel (68), swing around pin (69), thereby circuit wafer receiving member (58) is moved to horizontal level from obliquity.When oscillating deck (67) withstood brake block (73a) on the vertical panel (68), the yaw motion of circuit wafer receiving member (58) stopped, so member (58) maintenance level.When oscillating deck (67) withstands brake block (73a), these members together forward, along with base plate (74) moves to circuit wafer lamination machinery (3).When the drag washer (76b) of guide rod (75) was withstood the rear end face of slider case (77), this motion stopped, and at this moment circuit wafer finishes the preparation by receiving member (58) feeding installation head (30).At this moment, the scotch (59) of circuit wafer receiving member (58) is withdrawal downwards by rotating, and the arm of holding with a firm grip (61) is removed the engagement with upper push-rod (63), so the circuit wafer in the receiving member (58) is able to from wherein discharging.

When finishing from receiving member (58) after the step of installation head (30) feeding circuit wafer, driving cylinder (71) starts, with motion backward, between this moving period, drag washer (76a) is withstood the front end face of slider case (77), to stop the horizontal movement of receiving member (58) and base plate (74).Drive cylinder (71) and further start backward or with withdrawing, so that oscillating deck (67) withstands the brake block (73b) of vertical panel (68).Because oscillating deck (67) leans brake block (73b), can make receiving member (58) be returned to original obliquity ， And and match with skewed slot (12).Then, in skewed slot (12), clip (51) and lead arm (56) instantaneous operation immediately, be contained in circuit wafer in the skewed slot (12) with release, thereby make the middle And of circuit wafer feeding receiving member (58) next minimum in the groove and utilize scotch (59), it is maintained, till next instruction inputs to driving cylinder (71).

Like this, we see that the circuit wafer feeding mechanical high-speed ground of Fig. 3-Figure 14 reaches the ad hoc type circuit wafer respectively and feeds the circuit wafer lamination machinery continuously.

Figure 15-Figure 19 illustrates another kind of improved circuit sheet feeding machinery.

The circuit wafer feeding machinery of Figure 15-Figure 19 can be finished the accurate location to the circuit wafer of various irregular structures and size, can also reach respectively simultaneously and continuously circuit wafer be fed installation head (30).

The circuit wafer of Figure 15-Figure 19 feeding machinery (1) comprises the charging box (10) that several are arranged in rows, and the circuit wafer connecting gear (2) that is positioned at each charging box (10) below, its mode and Fig. 3-and shown in Figure 14 identical.Each charging box (10) has several storage caskets (100), in each storage casket (100) the ad hoc type circuit wafer is housed all.Between each charging box (10) and the automatic assembly equipment body horizontal plane, also the mode with about 45 tilts to install.Each storage casket (100) makes the garden tubbiness with plastic materials, and charging box (10) in to be scheduled to the attitude mutual superposition.A flashboard (14) is housed on the front end face of each charging box (10), is used for opening or closing an opening that is positioned on charging (10) end.This circuit wafer feeding machinery also includes the skewed slot (12) that is positioned at each place, charging box (10) front end face bottom, each skewed slot (12) is fixedly fastened on the charging box, and (10) Shang ， And constitute one with 45 passage that tilt, that link to each other with corresponding charging box (10).The passage that forms in the above-mentioned skewed slot (12) is equipped with a scotch (79), scotch (79) is contained in regularly and can does on the slider (80) of horizontal slip charging box (10) front end face, a spring (81) is pushed down slider (80) frequently downwards, and the low side of slider (80) also is equipped with a roller (82).

Each conveyer (2) all has a circuit wafer retainer (83), and circuit wafer retainer (83) can connect the far-end of each skewed slot (12).Each circuit wafer conveyer constitutes in mode as described below.

Circuit wafer folder (83) is by pivot pin (85), pivotally be contained on the supporting bracket (84), they a circuit wafer recipient (86) totally is housed, when circuit wafer retainer (83) was linked skewed slot (12), recipient (86) can be close to the circuit wafer passage place of skewed slot (12).Be used to the to move push rod (87) of a location block (88) serve as spool to be contained in rotationally on the circuit wafer retainer (83) with pin (89).Position block (88) is installed in aggregates with it at the far-end of push rod (87), so that contact with the leg (90) of circuit wafer (E) on the circuit wafer receiver (86), thereby the position of regulating circuit sheet (E), in addition, be fixed with a bolt (91) in the rear end of push rod (87), when circuit wafer retainer (83) was linked skewed slot (12), bolt (91) can withstand the lower surface of skewed slot (12).Also have, circuit wafer conveyer (2) has one to be positioned at the miniature pneumatic cylinder (92) that circuit wafer presss from both sides (83) top, circuit wafer folder (93) be an axle with pin (94), is contained on the circuit wafer retainer (83) push rod (95) intersection mutually of And and pneumatic linear actuator (92) drive rotationally.Have again, circuit wafer conveyer (2) also has a clamping block (96) that is contained on the vertical support plate (84), its effect is, at circuit wafer retainer (83) from skewed slot (12) when leaving, can flatly hold and decide circuit wafer retainer (83), another pneumatic linear actuator (97) is contained in (not shown) on the base plate so that circuit wafer retainer (83) rotates around pin (85).

Below, the drive manner of circuit wafer feeding machinery that constitute as mentioned above, Figure 15-shown in Figure 19 is illustrated.

At first, suppose that pneumatic linear actuator (97) is positioned at the minimizing stroke state, so circuit wafer retainer (83) can with respect to the horizontal plane be linked skewed slot (12) into about 45 inclination ， And, as shown in Figure 7; Also supposition is contained in the roller (82) of slider (80) lower end, heads on the upper surface of circuit wafer retainer (83) and is upwards pushed.Like this, skewed slot block (79) is in the position of rising, the i.e. off-position of block.In addition, the bolt (91) that is contained in push rod (87) rear end withstands the lower surface of skewed slot (12), cause the state that position block (88) is positioned at the leg (90) of control ad hoc type circuit wafer (E), also have, miniature pneumatic cylinder (92) is in non-startup attitude, so the tip of circuit wafer folder (93) is in raised position, i.e. non-clamping position.

Under aforesaid state, when a flashboard is received an instruction and when opening, be contained under the effect of ad hoc type circuit wafer (E) by gravity in the corresponding storage casket (100) and slide into skewed slot (12), a And and a minimum circuit wafer (E) arrive the receiver (86) of circuit wafer retainer (83).At this moment, deliver to the leg (90) of the circuit wafer (E) of receiver (86) and withstand position block (88), so that circuit wafer (E) is gone up emplace at receiver (86).Afterwards, miniature pneumatic cylinder (92) starts, so that by push rod (95), circuit wafer folder (93) is rotated along the counter clockwise direction among Figure 16.This just makes the circuit wafer (E) on the receiver (86) be clamped by circuit wafer folder (93), as shown in Figure 18.

Subsequently, when pneumatic linear actuator (97) started and extends its pull bar, as shown in figure 19, circuit wafer retainer (83) rotated in the counterclockwise direction around pin (85), thereby leaves skewed slot (12), changes level over to.At this moment slider (80) is because spring action and to lower slider, and block (79) stops the circuit wafer motion of back in the skewed slot (12).In addition, the top of the bolt (91) of circuit wafer folder (83) separates with skewed slot (12), so push rod (87) can reduce its terminal direction rotation by a spring (not drawing among the figure) effect; Like this, circuit wafer can break away from the constraint of receiver (86).After this, owing to start pneumatic linear actuator (92), the circuit wafer that is maintained by clip (93) breaks away from it, so, by further starting pneumatic linear actuator (97), can make circuit wafer (E) on the receiver (86) of circuit wafer retainer (83) be sent to installation head (30) and locate.

When circuit wafer was sent to installation head (30), pneumatic linear actuator (97) started, and made its pull bar from this retraction, circuit wafer retainer (83) down fold (12) motion back, when its shown in figure (17) and when tilting, be connected with skewed slot (12), receive next circuit wafer afterwards.

Like this, we see, the accurate location that the circuit wafer feeding machinery of Figure 15-Figure 19 has been finished circuit wafer effectively, and respectively and continuously circuit wafer is fed into installation head (30) from the charging box.

Fig. 3-circuit wafer feeding machinery shown in Figure 19 also can comprise the device of automatic displacement storage casket, its constituted mode is, sky storage casket in each charging box (10) automatically has been filled the storage casket of circuit wafer and has replaced, so that at full speed feed circuit wafer respectively and continuously.This automatic displacement apparatus can constitute as Figure 20-mode shown in Figure 23.More particularly, this automatic displacement apparatus includes material stock chamber (101) and (102), and its formation is to be separated into two parts space by the inside with each charging box (10).Material stock chamber (101) is used for vertically to be stacked into the mode of delegation, receives a series of circuit wafer filling caskets (100), and material stock chamber (102) are used for sequentially receiving empty boxes (100 ').Each material stock chamber (101) and (102) all have notch at bottom end opening ， And and in its lower sidewall, so that move therein in pusher (103) and (104), pusher (103) and (104) are passed base plate (11) and protruded upward.When leading flank is observed, pusher (103) and (104) roughly are inverted L-shape, and they can be when the motion of storage casket carry out a predetermined actions in the passage of process.More particularly, the notch (105) that pusher (103) can extend laterally with respect to charging box (10), along base plate (11) last, do lateral movement, pusher (104) can move both vertically by the opening (106) on the base plate (11).Side direction pusher (103) has a cam follower (110), this follower (110) is by a vertical pin (108), be installed on the horizontal component (107), vertical pusher (104) has a cam follower (111), this follower (111) is by a side direction pin (112), be installed in down on the vertical component (109), cam follower (110) and (111) are assemblied in groove (114) (seeing Figure 21) and groove (115) (seeing Figure 22) with engaging, open respectively on the sliding panel (116) that is supported on slidably on the guiding frame (113) groove (114) and (115), sliding panel (116) is made of a level board (117) and a vertical panel (118), and the two common formation is roughly the shape of falling L-.The cam path (114) of cam follower (110) wherein is housed with engaging, open on level board (117), the cam path (115) of cam follower (111) is housed with engaging, open on vertical panel (118), cam path (114) and (115) roughly are as Figure 21 and broken line shape shown in Figure 22, by means of single driving cylinder (119),, can drive pusher (103) and (104) respectively with different modes by making sliding panel (116) with predetermined stroke movement.

Below, the drive manner of the automatic displacement apparatus of storage casket that constitutes as mentioned above is illustrated.

When making the storage casket become empty when removing entirely in the minimum storage casket (100) that circuit is adorned from material stock chamber (101), as response to an instruction shown in the detector of photoelectric tube and so on, driving cylinder (119) starts, to change its stroke, make pusher (103) and (104) carry out its predetermined operation therefrom.More particularly, when driving cylinder (119) expansion stroke, the motion of sliding panel (116) makes the cam path (115) on the vertical panel (118) go up effect at cam follower (111), and consequently the pusher (104) that upwards rises from from base plate (11) can move downward by the opening (106) on the base plate (11) and be lower than base plate.In contrast, pusher (103) leaves position, the transfixion of material stock chamber (101) notch in side direction, and it is irrelevant with the motion of sliding panel (116), this be because, cam follower (110) is positioned at that the level board (117) of sliding panel is gone up, the horizontal component of cam path (114), and irrelevant with the motion of sliding panel (116).Like this, just as shown in figure 20, empty storage casket (100 ') drops on the base plate (11).Then, when sliding panel continues motion, when making cam follower (110) along the motion of the sloping portion of cam path (114), pusher (103) is done lateral movement, thereby under the storage casket (100 ') of sky laterally is delivered to material stock chamber (102) along substrate (11).During this period, pusher (104) is static in base plate (11) below, this is because cam follower (111) is positioned at the horizontal component of cam path (115), be delivered to pusher (104) when top when pusher (103) stores up casket (100 ') with sky, drive cylinder (119) and begin to reduce its stroke.This just makes pusher (103) leave to be positioned at the sky storage casket at place, pusher (104) top, and (100 ') ， And returns its origin-location, and therebetween, pusher (104) the ， And that moves upward stores up casket (100 ') by its upper surface with sky and lifts.So just make empty storage casket (100 ') upwards insert material stock chamber (102), so that reclaim.Between this moving period of pusher (104), the storage casket that the next one is equipped with circuit wafer is supported on pusher (103) upper surface, therebetween, circuit wafer is removed thus, in case the circuit wafer in the storage casket all moves sky, then pusher (103) turns back to original position, so that open the following outlet in storage chamber (101), empty storage casket is fallen because of gravity.Previous empty storage casket both sides in the material stock chamber (102) by sheet spring (120) clamping.When employed storage casket is longitudinal extension substantially, can use vertically spaced two pairs and even how right side direction feeding pusher (103) and feeding pusher (104) ， And and with by driving cylinder (119) drive upwards.

Circuit wafer lamination machinery (3) comprises a single installation head (30), simply is shown in Fig. 3, is shown in detail in Figure 24-Figure 27.Circuit wafer lamination machinery (3) is by means of the X-Y workbench, can move between the movement position of aforementioned conveyer and the applying position on the circuit wafer substrate (P).For this purpose, as shown in Figure 2, circuit wafer lamination machinery (3) is installed on the X-Y workbench by bracing frame (17), in the guide rod (18) of X-Y direction installation, the motion that (19) are guiding bracing frame (17).Installation head (30) can move both vertically, so that from arbitrary circuit wafer conveyer receiving circuit Pian ， And it snugly is installed on the substrate (P).

As Figure 24-shown in Figure 27, installation head (30) has a pair of arm (31), (32) of leading, and this is led arm and is installed in both sides, its underpart, and plug-in type ground is clamped in a circuit wafer (E) in the middle of two arms.Lead arm (31) and (32) and contain respectively and be similar to spatulate underarm (31a) and (32a), so that circuit wafer is clipped in therebetween; And upper arm (31b) and (32b).By means of screw (301) and (302), underarm (31a) and (32a) removably be supported on upper arm (31b) and bottom (32b) respectively.Like this, as long as change underarm (31a) and (32a), lead arm and just can be used for promptly handling all kinds of ad hoc type circuit wafers of different structure.By pin (303), (304), upper arm (31b) and (32b) pivotally be contained on the bracing frame (33) so that respectively around pin (303), (304) open and closed underarm (31a), (32a) lower end.Upper arm (31b), (32b) link on the small-sized driving cylinder (34) that is contained on the bracing frame (33), (35) by cylinder pull bar (305) and (306) respectively.Drive cylinder (34) and (35) and started, lead the lower end of arm (31) and (32) with closure, thereby circuit wafer (E) is clamped in therebetween.In addition, upper arm (31b) and (32b) have an adjusted bolt (307), (307 ') and regulate bolt (308), (308 ') down, is inserting between the bolt up and down pin (303), (304), and the effect of this bolt is to regulate to lead the opening and closing operations of arm (31) and (32).Regulate bolt Dai You Luo Wen And and be fixed on the plate supporting frame (309) and (310) that is contained on the bracing frame (33), its mode is the terminal insertion of bolt or withstands and lead arm (31) and (32).Adjusted bolt (307) and (307 ') are used for regulating the closing motion of leading arm (31) and (32).For this reason, compression spring (311) (only illustrating among Figure 24) is contained on bolt (307) and (307 '), is biased at closing direction with inhibition underarm (31a) with (32a).On the contrary, following adjusting bolt (308) and (308 ') can make its end withstand and lead arm (31) and (32), lead the make position of arm with adjusting.

As Figure 24 and shown in Figure 27, lead the movable push rod of a vertical direction (36) is housed between arm (31) and (32).Push rod (36) links to each other with installation head (30) body (37), leads arm (31), (32) are installed on the body (37) by bracing frame (33).Installation head body (37) has binocular structure, and by means of bolt (312), (313), bracing frame (33) installs on the installation head body (37) by packing (314).Push rod (36) is connected on the bar that can do to move both vertically (38), and by air flue (315) is applied air pressure, bar (38) can move downward, and by dress compression spring (316) thereon, bar (38) can move upward.Installation head body (37) also has a cylinder (317), and push rod (36) is loaded in it, so in the circuit wafer fitting operation, leading arm (31) and (32) can be independent of moving both vertically of push rod (36) by vertical ground motion.In addition, installation head body (37) links to each other with pulley (39) with the belt (not shown) by a pulse motor, makes therefrom to be clamped in the circuit wafer (E) of leading between arm (31) and (32) and to change direction on request.

The end of leading arm (31) (32) can make as scheming the shape shown in (28).More particularly, lead the underarm (31a) of arm (31) and (32) and the lower end inner surface of (32a) and have relative notch (16), the shape of this notch (16) can snugly be held the sidepiece of circuit wafer (E).During this structure of leading arm (31), (32) can make circuit wafer (E) be clamped in securely.The underarm (31a), (32a) that lead arm removably are contained on upper arm (31b), (32b) by screw (301) and (302) respectively.

Another kind of alternative scheme is, the underarm (31a) and the lower end (32a) of leading arm can be as shown in figure 29, as L-shape roughly, be meshed with the turning of circuit wafer (E) respectively by its right-angle bending part (16 '), insertable ground is clamped in circuit wafer (E) between its two underarms end.Underarm (31a) and (32a) preferably installation interchangeably.

Figure 30 illustrates a kind of modified version of foregoing circuit sheet lamination machinery (3).The circuit wafer lamination machinery that is shown in Figure 30 is suitable for installing counter-rotative type semi-fixed resistance (inverted-type semifixed variable resistor) E, and the one example simply is shown in Fig. 1, the more detailed Figure 31 that is shown in.Circuit wafer among Figure 31 (E) comprises a circuit wafer body (322), one first leg (321) that goes between or claim is extended under a side direction of circuit wafer body (322), and two second leg (323) that go between or claim are from extending under the relative side direction with it.The circuit wafer lamination machinery of Figure 30 has a pair of arm (31), (32) of leading, and it constitutes the structure corresponding to the sort circuit sheet.More particularly, lead arm (31) and (32) and include underarm (31a), (32a) respectively, and upper arm (31b), (32b).Shown in Figure 32 A, underarm (31a) lower end inner surface (324) is gone up and is done that a groove (325) is arranged, and is used for first lead-in wire (321) of circuit wafer (E) is held set in groove.Simultaneously, going up work on the surface (326) of the underarm (32a) relative with underarm (31a) surface (324) has two grooves (327), is used for second guide line (323) of circuit wafer (E) is held set in groove.Lead and adorning the push rod that to do to move both vertically (36) between arm (31) and (32), as shown in figure 30.There is a groove in the centre of push rod (36) lower end (330).(332), this groove has the shape corresponding to circuit wafer (E) body (322).The remainder of circuit wafer lamination machinery shown in Figure 30 constitutes to be approximately identical to Figure 24-mode shown in Figure 27.

In the circuit wafer lamination machinery shown in Figure 30,, lead arm (31) and (32) closure, so that circuit wafer or resistance (E) are clamped in therebetween by starting pneumatic cylinders (34) and (35).At this moment, lead-in wire (321) and (323) are received set respectively in the groove (327) of the groove (325) of underarm (31a) and underarm (32a).Then, lead arm (31) and (32) and move downward, in the hole of (321) and (323) insertion that will go between, shown in the dotted line among Figure 30 as the substrate (P) of printed substrate.Subsequently, push rod (36) descends, and to lower compression circuit wafer body (322), leads arm (31) and (32) simultaneously and decontrols.Afterwards, push rod (36) further descends, to finish the operation of lead-in wire (321), (323) being inserted substrate (P).

The automatic assembly equipment of the foregoing description comprises that also foregoing circuit wafer lead-in wire vises machinery (4), and it is positioned at the below of the substrate (P) on the conveyer (5) of circuit wafer lamination machinery (3).As shown in Figure 2, circuit wafer lead-in wire vises machinery (4) through the bracing frame (17) of circuit wafer lamination machinery, supported by the guide rod (40) that inserts, and And and driven by the X-Y workbench is moved to preposition along with the motion of circuit wafer lamination machinery (3).In addition, as Figure 33-shown in Figure 37, circuit wafer vises machinery (4) a pair of bending machine (41) and (42), and their apart distances are enough to hold betwixt the lead-in wire (e) that is contained in the circuit wafer (E) on the substrate (P) by installation head (30).Bending machine (41) and (42) can be used for lead-in wire (e) cut to predetermined length ， And and by make the bending machine upper end mutually near and along the press-bending that will go between of the lower surface of substrate (P).Bending machine (41) and (42) are passed through bolt (401), (402) respectively, pivotally are supported on the middle part ， And of bracing frame (43) and in the pivotal support subordinate side of bending machine (41) and (42) insulator (414) are housed to reach (415).One tension spring (403) is arranged, so that the top of bending machine keeps opening between insulator (414) and (415).The circuit wafer lead-in wire vises machinery and is contained in the cam mechanism (44) that vises on the basic machine (45) in addition, oneself clamp-ons the space that exists between bending machine (41) and (42) bottom so that finish it.Cam mechanism stretches out from the pull bar upper end side that lead-in wire cut and vised cylinder (404), because starting of cylinder (404) can make cam mechanism move both vertically.Lead-in wire cuts and vises cylinder (404) via a pull bar (406) (seeing Figure 35) that pivotally is contained on the support (405), links to drive on the cylinder (407), so, start cylinder (407) cylinder (404) is moved both vertically.

By support (43) being linked the cylinder cap (408) of cylinder (404), bending machine (41) and (42) are fixed to the lead-in wire cutting and vise the upper end side of cylinder (404).In addition, there is a pinion (409) in the outer garden of cylinder (404) on week, it is meshed with being contained in the tooth bar (411) that drives on cylinder (410) the pull bar end, when lead-in wire inserts certain position, drive cylinder (410) and start, can make bending machine (41) and (42) rotate 90 ° of angles.Cam mechanism (44) comprises an isolation part (412), so that remain unchanged at interval between bending machine (41) and (42) upper end; Cam mechanism (44) also comprises a press section (413), and it is shaped as, from the isolation part (412), and downward obliquely broadening.Press section (413) is used on the insulator (414) and (415) of the pivotal support part below that is used in bending machine (41) and (42), thereby make the bending machine upper end approaching mutually, so can make lead-in wire (e) bending of the upper end circuit wafer (E) of bending machine (41), (42).

The circuit wafer lead-in wire vises machinery (4) and comprises a sniffer, is used to confirm whether circuit wafer snugly is installed in substrate.Sniffer can constitute as follows: adorn a binding post (416) on cam mechanism (44), it constitutes an electrode surveying circuit; Another binding post (417) is inserted the insulator (414) that withstands with cam mechanism (44), formed another electrode.Simultaneously, sniffer also comprises one and withstands the probing pin (418) of binding post (417) releasedly.By a compression spring (419), probing pin (418) stretches to cam mechanism (44) from insulator (414), so only when the leg (e) of circuit wafer (E) is put between bending machine (41) and (42), just can make probing pin (418) withstand binding post (417).Insulator (415) has an alignment pin (420) that inserts wherein, and this pin is inwardly stretched, and it can make bending machine (41) and (42) mutually synchronously with leg (e) bending of circuit wafer (E).

Below, with reference to accompanying drawing: 2-6,20-27, and 33-37 is illustrated the automatic assembly equipment of the said embodiment that constitutes in the above described manner.

In general, by storage casket a slice in the circuit wafer of feeding respectively and continuously, (20) Chou Chu And flatly pass to circuit wafer lamination machinery (3) by the conveying clamp of related circuit sheet conveyer (2), lamination machinery (3) is waited in this position by the forward location ， And that X-Y workbench (300) moves to circuit wafer conveyer (2) motion.Afterwards, the installation head (30) of circuit wafer lamination machinery (3) receives circuit wafer And and fits in the hole of substrate (P) by the lead-in wire with circuit wafer from the conveying clamp (20) of conveyer (2), and it is gone up the location at substrate (P), afterwards, circuit wafer lead-in wire vises the cutting and the bending operation of the lead-in wire that machinery (4) stretches out by substrate (P) when finishing.In this operation process, the circuit wafer that glides from charging box (10) continuously by skewed slot (12) is stopped by block (13).

When the conveying clamp (20) that is transmitted device (2) when circuit wafer is clamped And constantly level is removed, make the storage casket (100) that is contained in the charging box (10) become empty, automatically displacement apparatus makes storage casket that the next one is equipped with circuit wafer move to extreme lower position in the charging box (10), thereby circuit wafer is fed continuously.

As mentioned above, the conveying clamp (20) of each circuit wafer conveyer (2) is applicable to the storage casket from corresponding charging box (10), through skewed slot (12), extract the circuit wafer of feeding, and, be applicable to by driving cylinder (25) to drive, alternation ground, selectively move to precalculated position on the horizontal direction.More particularly, in the storage casket (100) of a circuit wafer, slide by a desired charging box (10), it is fixed that the last And of arrival skewed slot (12) is held by block (13), driving cylinder (21) starts, with the reception pawl (20a) and the arm of holding with a firm grip (20b) of manipulation conveying clamp (20), thereby the circuit wafer that will be arranged in skewed slot (12) is clipped between pawl (20a) and the arm (20b).Simultaneously, drive cylinder (25) and start, so that its pull bar drives conveying clamp (20), to installation head (30) motion of the circuit wafer lamination machinery previous dynasty (3).In this proal initial period, lobe plate (24) in bracing frame (28) against the direction of tension spring (27) gradually to front slide so that along with reducing supporting bracket (22) gradually, and it is turned to horizontal level from obliquity.So by means of conveying clamp (20), it receives pawl (20a) and the arm of holding with a firm grip (20b) is clamped in circuit wafer (E) therebetween, in this wise circuit wafer (E) is removed from skewed slot (12).At this moment, block (13) offsets downward to discharge circuit wafer, and And and flashboard (14) move downward, and slide under the next circuit wafer on the skewed slot (12) to stop.When conveying clamp (20) from skewed slot (12) when removing circuit wafer, supporting bracket (22) roughly becomes horizontal in bracing frame (28), lobe plate (24) is moved on the forward location of its sliding area in bracing frame (28).After lobe plate (24) travelling forward in bracing frame (28) finished, bracing frame (28) travels forward with lobe plate (24), so that make conveying clamp move to the holding fix of installation head (30), simultaneously circuit wafer flatly be clamped in it and receive between pawl (20a) and the arm of holding with a firm grip (20b).When conveying clamp (20) arrives the holding fix of installation head (30), the braking ring (203) of guide rod (29) withstands slider case (201), stop its motion, conveying clamp (20) is in the leading between arm (31) and (32) of opening with what circuit wafer was delivered to installation head (30), thereby circuit wafer is delivered to installation head (30).At this moment, drive cylinder (21), the arm of holding with a firm grip (20b) of conveying clamp (20) is vertically started, give installation head (30) thereby make circuit wafer break away from clamped condition ， And by starting.When circuit wafer is transformed into installation head (30), drive cylinder (25) and start at once, shrink its pull bar, make braking ring (202) withstand slider case (201).After this, because the effect of tension spring (27) makes lobe plate (24) motion backward in bracing frame (28), And and when block (204) withstands body (26) and stop.At this moment flashboard (14) moves upward, so that slide into skewed slot (12) under next circuit wafer, before driving cylinder (25) was received instruction, conveying clamp (20) remained on the skewed slot (12).When installation head (30) lead arm (31) and (32) with the circuit wafer clamping therebetween the time, the X-Y workbench is sent to substrate with installation head, and (cylinder (317) of P) Chu ， And and installation head (30) starts, and installation head (30) is moved downward move to substrate (P).This downward motion is withstood substrate (P) until the leg of circuit wafer, and subsequently, because an air pressure is applied in the air flue (315), push rod (36) descends with the bar that moves both vertically (38).The circuit wafer between arm (31) and (32) is led in push rod (36) pushing downwards, so that the leg of circuit wafer is inserted in the hole of substrate (P).After leg is inserted substrate (P), drive cylinder (34) and (35) and starts respectively, dwindle stroke, owing to the effect of compression spring (311), lead arm (31) and (32) unlatching between its lower end and make circuit wafer is clipped in.Afterwards, vise machinery (4) by the circuit wafer lead-in wire that is positioned at the substrate below, cut and vise the operation of its leg to snugly being contained in circuit wafer on the substrate (P), simultaneously, after air pressure bleeds off, because the effect of compression spring (316), push rod (36) moves upward, and, instruction in response to subsequent processing, towards the motion of a certain position, in this position, the conveying clamp (20) of circuit wafer conveyer (2) can be carried out motion forward to circuit wafer lamination machinery (3) immediately.

Vise in the machinery (4) at the circuit wafer lead-in wire, when the leg of circuit wafer (E) is inserted into substrate (P) by installation head (30), driving cylinder (407) starts synchronously, so that cylinder (404) moves upward, by pull bar (406), two cylinders (407) and (404) can be regarded an integral body as.Along with moving upward of cylinder (404), bending machine (41) and (42) also move upward, and receive, hold the circuit wafer leg of stretching out from substrate (P) downwards with the space that forms between the upper end of its unlatching.Simultaneously, lead-in wire cuts and vise cylinder (404) makes cam mechanism (44) originally between bending machine (41) and (42) compressional movement take place, thereby can make the upper end of bending machine (41) and (42) approaching mutually.The upper end that so just makes bending machine (41) and (42) with leg cut to desired length And along the lower surface of substrate (P) with the leg bending, during this period, a reaction force is added to bending machine (41) and (42) upper end by leg, cause to be headed on compression spring (419) by the probing pin (418) of cam mechanism (44) compressing and be offset, come in contact with binding post (417).When probing pin (418) and binding post (417) when contacting, the binding post (417) of cam mechanism (44) and the plug-in type between (416) are surveyed the circuit closure, have been inserted into substrate (P) with the leg (e) of confirming circuit wafer.On the contrary, do not insert under the situation of substrate (P) when the leg (e) of circuit wafer, can not produce reaction force, so open bending machine (41) and (42) unloadedly, compression spring (419) makes probing pin (418) remain on the state of stretching out.That is, probing pin (418) can not and binding post (417) contact, survey circuit and keep open circuit thereby make, Que Ren And does not insert.

Like this, can see, automatic assembly equipment of the present invention reaches all kinds of ad hoc type circuit wafers respectively to fit continuously with high efficiency at a high speed and is installed on the substrate of printed substrate, this is because according to preset program, to take out the holding fix that And is sent to the circuit wafer lamination machinery respectively and continuously from the circuit wafer of charging box feeding by the circuit wafer conveyer, and afterwards, take the installation head precalculated position, lamination machinery to by the X-Y workbench and accessed.In addition, in automatic assembly equipment of the present invention, push rod is circuit wafer pressed towards substrate by compulsion, so, can finish effectively the leg of circuit wafer is inserted operation in the substrate.

Can also see, the purpose that the front proposed that becomes cheer and bright owing to the above explanation of doing has reached effectively, and, because do not deviating under the spirit and scope of the present invention situation, can make certain variation, so we think that all are included in as shown in drawings, the content in the above explanation, the meaning of the unqualified property of illustrative ， And will be understood that.

We also think, that following claim comprises is that all have illustrated at this, relevant concrete property of the present invention and development thereof are extended; And and, the narration of all relevant the field of the invention as a kind of language, can be regarded as merely from a part that wherein spills.

Claims

1, a kind of the ad hoc type circuit wafer snugly is assembled to equipment on the substrate automatically, it is characterized in that this equipment is by constituting as the lower part:

A circuit wafer feeding machinery (1), feed the ad hoc type circuit wafer respectively and continuously, this feeding machinery comprises: a plurality of charging boxes (10) that are arranged in delegation obliquely, each charging tape has a plurality of storage caskets (100), in each storage casket some ad hoc type circuit wafers are housed, a block (13) is used for stoping each ad hoc type circuit wafer to glide continuously from the above-mentioned storage casket that is contained in above-mentioned each inclination charging box (10) by gravity; An and circuit wafer conveyer (2), be contained in the lower end of above-mentioned each charging box, to receive each ad hoc type circuit wafer obliquely by above-mentioned block (13) clamping, above-mentioned each circuit wafer conveyer (2) vertically is offset, horizontal ground motion, so that according to preset program, the ad hoc type circuit wafer is sent to preposition;

A circuit wafer lamination machinery (3), comprise: a single installation head (30), the direction of motion of it and each circuit wafer conveyer (2) is vertically settled, and by an X-Y workbench (300), it is driven the above-mentioned delivering position of each circuit wafer conveyer (2), so that receive the ad hoc type circuit wafer, and, when installation head (30) moves downward and this circuit wafer fitted is installed to a substrate (p) when going up, a push rod (36) applies extruding force to this circuit wafer of leading in arm (31), (32) lower end that is clamped in installation head (30); And

Circuit wafer lead-in wire vises machinery (4), finishes the cutting and the bending operation of the leg that described circuit wafer is stretched out from substrate (p).

2, according to the equipment of claim 1 regulation, it is characterized in that each circuit wafer conveyer (2) comprising: a conveying clamp (20) is used for receiving also clamping and slides and ad hoc type circuit wafer that stopped by block (13), order from each storage casket; One first bracing frame (22) with charging box (10) tiltably-mounted correspondingly, and is installed with conveying clamp (20) on bracing frame (22); A lobe plate (24) by cam follower (23), is meshed with this bracing frame (22); Link this lobe plate (24) for one and go up reciprocating type driving cylinder (25); One second bracing frame (28), lobe plate (24) is adorned thereon slidably, and by a guide rod (29), the arrangement of second bracing frame (28) can make it in the identical direction motion of above-mentioned driving cylinder (25); Thus, start and drive cylinder (25), drive lobe plate (24) and second bracing frame (28) forward together, make cam follower (23) flatly be offset first bracing frame (22), thereby the ad hoc type circuit wafer of conveying clamp (20) clamping sequentially is sent to installation head (30).

According to the equipment of claim 1 regulation, it is characterized in that 3, said circuit wafer feeding machinery comprises: a skewed slot (12) is placed in the outlet of each charging box (10), obliquely to receive by the ad hoc type circuit wafer that slides under the charging box (10) on it; A clip (51) is installed in the sidepiece of skewed slot (12), push support except that minimum one and those circuit wafers; And

Said each circuit wafer conveyer comprises; A circuit wafer receiving member (58), this member (58) settle with the lower end of skewed slot (12) synergy so that only receive an above-mentioned minimum circuit wafer; Scotch (59) is contained in the front surface of circuit wafer receiving member (58) often; And the arm of holding with a firm grip (61) is placed in the sidepiece of receiving member (58) releasedly, and to support the stable type circuit wafer, described receiving member is deflected horizontal level from obliquity, and moves forward to the holding fix of installation head (30).

According to the equipment of claim 1 regulation, it is characterized in that 4, that described circuit wafer feeding machinery comprises: a skewed slot (12) is communicated with each charging box, the passage of circuit wafer to constitute; And

The conveyer of each circuit wafer, this device contains: a circuit wafer retainer (83) that tilts to install is used for accepting the ad hoc type circuit wafer from skewed slot (12); A circuit wafer clamp system (93) is used for being clamped in the ad hoc type circuit wafer of retainer (83); And a brake mechanism (88), be used for leg location with the ad hoc type circuit wafer; Described circuit wafer clamp system (93) and brake mechanism (88) are placed on the circuit wafer retainer (83).

5, according to the equipment of claim 4 regulation, it is characterized in that described charging box (10) and skewed slot (12) are inclined relative to horizontal about 45 ℃ of angles.

According to the equipment of claim 1 regulation, it is characterized in that 6, it also comprises a device of putting Change storage casket (100) automatically, this installs by forming as lower member:

The first material stock mechanism (101) receives the storage casket (100) that circuit wafer is housed, and the second material stock mechanism (102), receives empty storage casket, and first, second material stock mechanism is formed in each charging box (10); And

One first pusher (103), being used for that the sky storage casket that falls from the first material stock mechanism (101) is carried out side direction transmits, and second pusher (104), be used for described empty storage casket vertically is sent to the second material stock mechanism (102), first, second pusher is placed in the below of charging box (10).

7, the equipment of stipulating according to claim 6, it is characterized in that, cam follower (110), (111) can be passed through in described first, second pusher (103), (104), be meshed with the cam path (114), (115) that make on the sliding panel (116), drive cylinder (119) by one and drive, reciprocating.

8, the equipment of stipulating according to claim 6, it is characterized in that, by single driving cylinder (119), it is reciprocating to drive sliding panel (116), thereby make first, second pusher (103), (104) along difform cam path (114), (115), finish its predetermined operation.

9, according to the equipment of claim 1 regulation, it is characterized in that the installation head (30) of described circuit wafer lamination machinery (3) also comprises: a bracing frame (33); Said arm (31), (32) upper end of leading respectively is connected with one and drives cylinder (34), (35), leads arm (31), (32) lower end so that can operate with opening; By pin (303), (304), lead the middle part that arm (31), (32) pivotally are installed in above-mentioned bracing frame (33); Said push rod (36) is installed in leads between arm (31), (32), can move both vertically, so that with ad hoc type circuit wafer pressed towards substrate (p).

10, the equipment of stipulating according to claim 9, it is characterized in that, said each lower end of leading arm (31), (32) has the shape (16 ') that is meshed with ad hoc type circuit wafer corner part, so circuit wafer can be in its relative corner, is led in the middle of the arm lower end is clamped in securely.

11, according to the equipment of claim 10 regulation, it is characterized in that, saidly lead arm (31), (32) Ke Hu Change ground installation.

12, the equipment of stipulating according to claim 9, it is characterized in that, said each lead and make to have notch (16) on the lower end medial surface of arm (31), (32), this circuit wafer is used to receive the sidepiece of dressing ad hoc type circuit wafer, so can be inserted in the lower end of leading arm (31), (32) securely at its relative sidepiece.

13, according to the equipment of claim 12 regulation, it is characterized in that, saidly lead arm (31), (32) Ke Hu Change ground installation.

14, according to the equipment of claim 1 regulation, it is characterized in that the installation head of said circuit wafer lamination machinery (comprising): drive cylinder (34), (35), be used for to handle the lower end of leading arm (31), (32) with opening; Push rod (36) is placed in and leads between arm (31), (32), can move both vertically; Lead arm (31) for one, has a bottom (324), make to have at least one groove (325) on it, be used at least one leg (321) set of extending under ad hoc type circuit wafer one side direction in wherein, and another leads arm (32), have a bottom (326), doing on it has at least one groove (327), is used at least one leg (323) set of extending under the relative side direction of this circuit wafer in wherein.

According to the equipment of claim 1 regulation, it is characterized in that 15, said circuit wafer lead-in wire vises in the machinery to be formed as lower member: a pair of bending machine (41), (42) relatively pivotally are installed on the supporting mechanism (43); Cam mechanism (44) is finished the bending operation to ad hoc type circuit wafer leg at least in bending machine (41), (42) lower end; One first binding post (416) is contained on the cam mechanism (44), and as an electrode, one second binding post (417) through an insulator (414), is contained in one lower end in described bending machine (41), (42), as another electrode; A probing pin (418) contacts with second binding post (417) releasedly, and when cam mechanism (44) during at extrusion position, probing pin (418) is flexibly setovered by cam mechanism by insulator (414), and withstands on this cam mechanism.